WO2015072131A1 - 光通信モジュールの封止構造およびその封止方法 - Google Patents
光通信モジュールの封止構造およびその封止方法 Download PDFInfo
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- WO2015072131A1 WO2015072131A1 PCT/JP2014/005643 JP2014005643W WO2015072131A1 WO 2015072131 A1 WO2015072131 A1 WO 2015072131A1 JP 2014005643 W JP2014005643 W JP 2014005643W WO 2015072131 A1 WO2015072131 A1 WO 2015072131A1
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- WIPO (PCT)
- Prior art keywords
- flange
- communication module
- sealing
- optical communication
- wettability
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
- G02B6/4262—Details of housings characterised by the shape of the housing
- G02B6/4265—Details of housings characterised by the shape of the housing of the Butterfly or dual inline package [DIP] type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
Definitions
- the present invention relates to a sealing structure of an optical communication module and a sealing method thereof, and more particularly to a sealing structure of an optical communication module using solder sealing and a sealing method thereof.
- Optical communication modules are required to increase speed and size as the system speed and capacity increase.
- a light receiving module for optical communication is composed of the following parts.
- Optical fiber for transmitting optical signals PD (Photo Diode) for opto-electrical conversion of optical signals sent from the transmission line, TIA (Trans Impedance) that converts the current signal into impedance, amplifies it, and outputs it as a voltage signal Amplifier) and the like.
- PD Photo Diode
- TIA Trans Impedance
- the inner peripheral surface of the cylindrical member (introducing pipe) provided in the optical communication package is partially plated. More specifically, the exposed portion of the inner peripheral surface of the introduction pipe is plated in a state where the plating unnecessary portion of the inner peripheral surface of the introduction pipe is masked. According to this method, when the molten fiber is used to fix the optical fiber to the introduction pipe portion, the molten solder does not flow into the package. As a result, the amount of solder in the sealed portion of the introduction pipe is reduced, so that it is possible to prevent the sealing performance from being lowered and the reliability from being lowered by the solder flowing into the package.
- the optical fiber assembly and the sleeve used therein described in Patent Document 2 are an optical fiber assembly for connecting an optical fiber to an optical communication module, and a sleeve attached to an optical fiber core wire.
- An insertion hole is provided in a housing corresponding to an optical communication package, an optical fiber assembly is inserted, and the housing and the sleeve are fixed with solder.
- Patent Document 3 proposes joining an insulating substrate and a base substrate with solder.
- the plating method for the inner peripheral surface of the cylindrical member described in Patent Document 1 has the following problems. Since this method provides a structure for preventing inflow at the inner peripheral portion of the cylindrical portion, manufacturing and processing of the package including the cylindrical portion becomes complicated. And it is set as the structure which fixes the cap which penetrated the optical fiber to a cylindrical part with solder. For this reason, the optical fiber is also directly fixed with solder, and stress is applied to the optical fiber, which may cause deterioration of the polarization characteristics of the optical fiber. In particular, in the polarization maintaining optical fiber, the influence of the polarization characteristics is remarkable.
- the optical fiber assembly described in Patent Document 2 and the sleeve used therein have a structure in which the optical fiber is buried in the sleeve and is not directly fixed by solder.
- this structure has the following problems.
- the place where the sleeve attached to the optical fiber is fixed to the insertion hole provided in a part of the housing with solder is limited to a part of the housing surface provided with the insertion hole. That is, the length of solder adhesion (corresponding to a leak path) was short. Therefore, it has been difficult to ensure long-term airtightness.
- Patent Document 1 and Patent Document 2 do not affect the characteristics of the optical fiber and ensure airtightness. It was difficult to secure a long leak path. In general, there was a problem that it was difficult to ensure reliability.
- An object of the present invention is to solve the above-described problem that it is difficult to ensure reliability without affecting the characteristics of an optical fiber in a sealing structure of an optical communication module using a sealing material.
- An object of the present invention is to provide a sealing structure and a sealing method for an optical communication module.
- the sealing structure of the optical communication module of the present invention includes a cylindrical lens barrel portion fixed to a package, a columnar flange that is disposed inside the lens barrel portion and through which an optical fiber passes, and the lens barrel. And a sealing material disposed between the flange and the flange.
- the flange includes a plurality of regions having different surface states on the surface, and the sealing material is disposed only at one location of the region.
- the method for sealing an optical communication module includes providing a cylindrical barrel portion in a package, inserting a columnar flange through which an optical fiber penetrates, into the barrel portion, and connecting the barrel portion and the flange.
- the molten sealing material is filled in between, and the molten sealing material is disposed only in one of a plurality of regions having different surface states on the outer peripheral surface of the flange, and is cured in that state.
- the reliability can be improved without affecting the characteristics of the optical fiber.
- (A) is a top view of the optical communication module according to the first embodiment of the present invention
- (b) is a side view of the optical communication module according to the first embodiment of the present invention.
- (A) is sectional drawing which shows the structure of the sealing structure of the optical communication module concerning the 1st Embodiment of this invention, (b) and (c) are for demonstrating the optical fiber array used for this It is a side view.
- (A) is sectional drawing which shows the structure of the sealing structure of the optical communication module concerning the 2nd Embodiment of this invention
- (b) is a side view of the optical fiber array used for this.
- FIG. 6 is a cross-sectional view showing a configuration of a sealing structure of an optical communication module using a related flange.
- FIG. 1A and 1B are diagrams showing an overall configuration of an optical communication module according to a first embodiment of the present invention.
- FIG. 1A is a top view and
- FIG. 1B is a side view. It consists of the following parts group.
- the optical communication module of the present embodiment includes an optical fiber array 1 for allowing signal light and local light to enter the package, and a lens 2-1 for collimating the incident light. Furthermore, the optical communication module of the present embodiment includes a PBS (polarization beam splitter) 3 for branching the TE (Transverse / Electric / Wave) polarization component and TM (Transverse / Magnetic / Wave) polarization component of the signal light. Furthermore, the optical communication module of the present embodiment includes a PLC (Planar Lightwave Circuit) 4 having a coherent mixer function, a lens 2-2 for condensing collimated light onto the PLC 4, and a metal carrier 11.
- PBS polarization beam splitter
- TM Transverse / Magnetic / Wave
- the optical communication module of the present embodiment includes a PD (photodiode: Photo Diode) 5 that performs optical-electrical conversion of an interference signal, a TIA 6 that impedance-converts, amplifies, and outputs a current signal of the PD 5 as a voltage signal including.
- the optical communication module of the present embodiment includes a wiring board 7, a substrate carrier 8, a lens 2-3 for collimating the interference light emitted from the PLC 4, and a prism with a lens for changing the optical path and coupling the interference light to the PD 5. 9 and so on.
- the optical communication module of this embodiment includes a ceramic package 10 that houses these elements. These components constitute an optical communication module 100 that functions as a digital coherent receiver module.
- the optical communication module 100 is a light receiving module and performs the following operation.
- the TE component and TM component of the received signal light are branched at the front stage of the optical interferometer in the coherent mixer. Then, delay interference with the local oscillation light is performed to obtain outputs of 8 ports of 2 pairs ⁇ 4, and signal demodulation is performed.
- the optical input unit uses an optical fiber array 1 in which optical fibers are aligned in order to perform optical input for two ports of signal light and local light while reducing the size of the package.
- the cylindrical lens barrel 20 (see FIG. 2A) fixed to the ceramic package 10 has no sealing window.
- a sealing environment in which the solder 23 (see FIG. 2A) is uniformly filled without relying on visual confirmation by the sealing window and the sealing flange 21 and the mirror over the optical fiber array 1 are used.
- This is realized in the inner peripheral portion of the cylindrical portion 20.
- metal is used for the sealing flange 21, for example.
- a part of the optical fiber array 1 is provided with a metal coating (gold plating).
- the sealing flange 21 and the inner surface of the lens barrel 20 are gold-plated so that the molten solder 23 flows on the gold-plated surface with wettability. Then, the solder 23 is uniformly filled in the entire gap between the sealing flange 21 and the lens barrel 20 by optimizing the melting time such as the amount of solder, the temperature of local heating, and the time.
- a predetermined structure for stopping the flow of solder is provided on the surface of the flange 21. This has the effect of preventing the solder from flowing to the core portion of the optical fiber. In addition, the solder 23 stays in the gap between the sealing flange 21 and the lens barrel portion 20, and there is an effect that the solder 23 can be surely sealed. Next, a specific structure for stopping the flow of solder will be specifically described.
- FIG. 2A is a cross-sectional view of the lens barrel portion 20 as a sealing structure of the optical communication module according to the present embodiment.
- FIGS. 2B and 2C show an optical fiber array used for this. It is a side view for demonstrating.
- the surface of the sealing flange 21 that covers the optical fiber array 1 is provided with a solder flow blocking structure 22a of partial groove processing as shown in FIGS. 2 (a) and 2 (c).
- the optical fiber array 1 including the solder flow stop structure 22a shown in FIG. 2C can be prepared as follows, for example. First, an optical fiber array 1 with a sealing flange 21 as shown in FIG. 2B is prepared. Here, the entire surface of the sealing flange 21 in FIG. 2B is gold-plated. Next, partial groove processing is performed in the middle of the sealing flange 21 to form the optical fiber array 1 including the solder flow preventing structure 22a as shown in FIG.
- the gold plating layer does not exist on the surface portion of the sealing flange 21 subjected to the partial groove processing. Therefore, discontinuity occurs in the wettability of the solder on the surface of the sealing flange 21.
- the melted and uncured solder 23 does not flow into the solder flow preventing structure 22 a for partial groove processing of the sealing flange 21.
- the solder 23 since the solder 23 stays in front of the groove portion without gold plating, the solder 23 can be efficiently filled in the gap between the sealing flange 21 and the lens barrel portion 20. This has the effect of preventing the solder from reaching the core portion of the optical fiber. In addition, the solder 23 stays in the gap between the sealing flange 21 and the lens barrel portion 20, and there is an effect that the solder 23 can be surely sealed.
- FIG. 6 shows a related optical communication module sealing structure in which an optical fiber is provided with a cylindrical flange whose entire surface is gold-plated, and the surface of the sealing flange and the inner peripheral surface of the package barrel are joined by solder. .
- the window structure is not provided in the lens barrel (when the optical fiber array is mounted inside the package, etc.), the inside of the package barrel cannot be visually confirmed. In this case, it cannot be determined whether the inside of the lens barrel is uniformly filled with the sealing material or whether the sealing material is securely sealed. If so, if the amount of solder is large, the solder may flow into the metal fiber surface 1a, leading to deterioration of characteristics. On the other hand, if the amount of solder is small, the solder may not sufficiently flow between the sealing flange and the package, and a gap may be generated to cause a defect (leak generation).
- the sealing structure of the optical communication module according to the present embodiment as described above, even if the window structure is not provided in the lens barrel portion, an appropriate amount is provided between the sealing flange and the ceramic package lens barrel. Solder can be uniformly filled. Thus, reliability can be improved without affecting the characteristics of the optical fiber.
- FIG. 3A is a cross-sectional view showing a configuration of a sealing structure of an optical communication module according to a second embodiment of the present invention
- FIG. 3B is a side view of an optical fiber array used for this.
- the difference between the configuration shown in FIG. 3A and the configuration shown in FIG. 2A is the difference in the region to be grooved. Other configurations are the same.
- solder flow prevention structure 22b of one-side groove processing as shown in FIGS. 3 (a) and 3 (b) on the surface of the sealing flange 21 that covers the optical fiber array 1.
- FIG. 3B The optical fiber array 1 having the solder flow stop structure 22b shown in FIG. 3B has a partial groove on the entire surface of one side of the sealing flange 21 that covers the optical fiber array 1 as shown in FIG. Formed by processing.
- the optical fiber array 1 including the solder flow stop structure 22b shown in FIG. 3B can be prepared as follows, for example. First, an optical fiber array 1 covered with a sealing flange 21 as shown in FIG. 2B of the first embodiment is prepared. Here, the entire surface of the sealing flange 21 in FIG. 2B is gold-plated. Next, groove processing is performed on the entire surface of one side of the sealing flange 21 to form the optical fiber array 1 including the solder flow preventing structure 22b as shown in FIG.
- the one side of the sealing flange 21 of the present embodiment refers to the side of the distal end portion of the sealing flange 21 that is inserted into the lens barrel portion 20.
- the gold plating layer does not exist on the surface portion of the sealing flange 21 in which the entire surface on one side is grooved. Therefore, discontinuity occurs in the wettability of the solder on the surface of the sealing flange 21.
- the melted and uncured solder 23 does not flow into the solder flow preventing structure 22b of the one-side groove processing of the sealing flange 21.
- the solder 23 stays in front of the entire groove on one side without gold plating, so that the solder 23 can be efficiently filled in the gap between the sealing flange 21 and the lens barrel portion 20. This has the effect of preventing the solder from flowing to the core portion of the optical fiber. In addition, the solder 23 stays in the gap between the sealing flange 21 and the lens barrel portion 20, and there is an effect that the solder 23 can be surely sealed. Thus, reliability can be improved without affecting the characteristics of the optical fiber.
- FIG. 4A and FIG. 5A are diagrams showing the configuration of the sealing structure of the optical communication module according to the third embodiment of the present invention, and FIG. 4B and FIG. It is a side view of the optical fiber array used for this.
- the difference between the configuration shown in FIGS. 4A and 5A and the configuration shown in FIG. 2A is whether or not only the surface plating layer is removed. Other configurations are the same.
- a surface plating layer is partially formed on the surface of the sealing flange 21 that covers the optical fiber array 1.
- the solder flow preventing structure 22c is provided.
- the entire surface of one side is surface plated on the surface of the sealing flange 21 that covers the optical fiber array 1.
- a solder flow prevention structure 22d having no layer is provided.
- the optical fiber array 1 including the solder flow stop structure 22c shown in FIG. 4B can be prepared as follows, for example. First, an optical fiber array 1 covered with a sealing flange 21 as shown in FIG. 2B of the first embodiment is prepared. Here, the entire surface of the sealing flange 21 in FIG. 2B is gold-plated. Next, the gold plating layer in the middle of the sealing flange 21 is removed, and the optical fiber array 1 including the solder flow preventing structure 22c as shown in FIG. 4B is formed.
- the optical fiber array 1 including the solder flow stop structure 22d shown in FIG. 5B can be prepared as follows, for example. First, an optical fiber array 1 covered with a sealing flange 21 as shown in FIG. 2B of the first embodiment is prepared. Here, the entire surface of the sealing flange 21 in FIG. 2B is gold-plated. Next, the gold plating layer on one surface of the sealing flange 21 is removed, and the optical fiber array 1 including the solder flow prevention structure 22d as shown in FIG. 5B is formed.
- the sealing structure of the optical communication module according to the present embodiment includes the solder flow prevention structure 22c in which the surface plating layer does not partially exist and the solder flow prevention structure 22d in which the surface plating layer does not exist on the entire surface of one side. That is, the gold plating layer does not exist on the surface portions of the solder flow prevention structure 22c without partial surface plating and the solder flow prevention structure 22d without single-side surface plating. Therefore, discontinuity occurs in the wettability of the solder on the surface of the sealing flange 21.
- the melted and uncured solder 23 has a solder flow prevention structure 22c without partial surface plating and a solder flow prevention structure 22d without one surface plating on the sealing flange 21. Does not flow.
- the solder 23 stays in front of a portion where there is no gold plating on the entire surface of one side, so that the solder 23 can be efficiently filled in the gap between the sealing flange 21 and the lens barrel portion 20. This has the effect of preventing the solder from reaching the core portion of the optical fiber. In addition, the solder 23 stays in the gap between the sealing flange 21 and the lens barrel portion 20, and there is an effect that the solder 23 can be surely sealed. Thus, reliability can be improved without affecting the characteristics of the optical fiber.
- the member to be sealed is not limited to solder. A resin or the like may be used. Moreover, the gold plating process of the fiber core part is not essential. This is because solder does not flow into this portion in the structure of the present invention. Moreover, the optical fiber can be applied to a multi-core optical fiber array in addition to a two-core optical fiber array.
- the wettability of the flange surface is different is a relative one and does not indicate an absolute one.
- a cylindrical barrel is provided in the package, Insert a cylindrical flange through which the optical fiber penetrates into the lens barrel, Filled with a molten sealing material between the lens barrel and the flange, The molten sealing material is disposed only in one of a plurality of regions having different surface states on the outer peripheral surface of the flange, A method of sealing an optical communication module, wherein the optical communication module is cured in that state.
- the said flange by which the groove part was formed in the outer peripheral surface was prepared, the said flange was inserted in the said lens-barrel part, The method of sealing an optical communication module according to appendix 15, wherein the sealing material is cured.
- (Supplementary Note 17) Prepare the flange having the groove portion formed on the outer peripheral surface of the intermediate portion excluding both ends, and insert the flange into the lens barrel portion. The method of sealing an optical communication module according to appendix 16, wherein the sealing material is cured. (Supplementary Note 18) Prepare the flange in which the groove portion is formed on the outer peripheral surface of one side of the flange, and insert the flange into the lens barrel portion. The method of sealing an optical communication module according to appendix 16, wherein the sealing material is cured. (Supplementary Note 19) Prepare the flange with the outer peripheral surface plated except for an intermediate portion, and insert the flange into the lens barrel.
- Optical fiber array 1a Metal fiber surface 2-1 2-2 2-3 Lens 3 PBS 4 PLC 5 PD 6 TIA 7 Wiring board 8 Substrate carrier 9 Prism 10 Ceramic package 11 Metal carrier 20 Lens barrel part 21 Sealing flange 22a Partial groove processing solder flow prevention structure 22b Single side groove processing solder flow prevention structure 22c Solder flow prevention structure without partial surface plating 22d Solder flow preventing structure without surface plating on one side 23 Solder 100 Optical communication module
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Abstract
Description
図1は、本発明の第1の実施形態にかかる光通信モジュールの全体の構成を示す図であり、図1(a)は上面図、図1(b)は側面図である。次に挙げるような部品群から構成される。
図3(a)は本発明の第2の実施形態にかかる光通信モジュールの封止構造の構成を示す断面図であり、図3(b)はこれに用いられる光ファイバアレイの側面図である。図3(a)に示す構成と図2(a)に示す構成との差異は、溝加工する領域の相違にある。その他の構成は同一である。
図4(a)および図5(a)は、本発明の第3の実施形態にかかる光通信モジュールの封止構造の構成を示す図であり、図4(b)および図5(b)はこれに用いられる光ファイバアレイの側面図である。図4(a)および図5(a)に示す構成と図2(a)に示す構成との差異は、表面メッキ層のみを除去するか否かにある。その他の構成は同一である。
(付記1)パッケージに固設された円筒形の鏡筒部と、
前記鏡筒部の内部に配置し、光ファイバが貫通する円柱状のフランジと、
前記鏡筒部と前記フランジとの間に配置した封止材と、
を含み、
前記フランジは、前記フランジの表面に表面状態が異なる複数の領域を備え、前記封止材は前記領域の一箇所にのみ配置している
ことを特徴とする光通信モジュールの封止構造。
(付記2)前記表面状態は、未硬化状態の前記封止材に対して濡れ性が異なる
ことを特徴とする付記1に記載の光通信モジュールの封止構造。
(付記3)前記濡れ性が異なる領域は、前記フランジの半径が異なる外周面にそれぞれ配置し、
前記半径が小さい溝部の濡れ性は悪く、該溝部以外のフランジ表面の濡れ性は良好である
ことを特徴とする付記2に記載の光通信モジュールの封止構造。
(付記4)前記濡れ性が異なる領域は、前記フランジの一の片側全部に設けた段差であり、
該段差部の濡れ性は悪く、該段差部以外のフランジ表面の濡れ性は良好である
ことを特徴とする付記2に記載の光通信モジュールの封止構造。
(付記5)前記濡れ性が異なる領域の一方は、メッキ処理された表面を有し、他方はメッキ処理されていない表面を有し、
該メッキ処理されていない表面の濡れ性は悪く、該メッキ処理された表面の濡れ性は良好である
ことを特徴とする付記2に記載の光通信モジュールの封止構造。
(付記6)前記濡れ性が異なる領域は、メッキ処理された前記フランジの一の片側全部に設けた非メッキ部分であり、
該非メッキ部の濡れ性は悪く、該メッキ処理された表面の濡れ性は良好である
ことを特徴とする付記2に記載の光通信モジュールの封止構造。
(付記7)前記フランジの外周面に溝部が形成されており、
前記溝部の濡れ性は、前記溝部以外のフランジ表面の濡れ性より低い
ことを特徴とする付記2に記載の光通信モジュールの封止構造。
(付記8)前記フランジの前記溝部は、フランジの両端部を除く中間部分に設けられている
ことを特徴とする付記7に記載の光通信モジュールの封止構造。
(付記9)前記フランジの前記溝部は、フランジの一の片側全部に設けられている
ことを特徴とする付記7に記載の光通信モジュールの封止構造。
(付記10)前記濡れ性が異なる領域の一方は、メッキ処理された表面を有し、他方はメッキ処理されていない表面を有し、
該メッキ処理されていない表面の濡れ性は、該メッキ処理された表面の濡れ性より低い
ことを特徴とする付記2に記載の光通信モジュールの封止構造。
(付記11)前記濡れ性が異なる領域の一方は、メッキ処理された表面を有し、他方は前記フランジの一の片側全部に設けられた非メッキ部であり、
該非メッキ部の濡れ性は該メッキ処理された表面の濡れ性より低い
ことを特徴とする付記2に記載の光通信モジュールの封止構造。
(付記12)前記封止材は半田である
ことを特徴とする付記1乃至11のいずれか一つに記載の光通信モジュールの封止構造。
(付記13)前記光ファイバは金属被覆が施されている
ことを特徴とする付記1乃至12のいずれか一つに記載の光通信モジュールの封止構造。
(付記14)前記光ファイバはアレイ状である
ことを特徴とする付記1乃至13のいずれか一つに記載の光通信モジュールの封止構造。
(付記15)パッケージに円筒形の鏡筒部を設け、
光ファイバが貫通する円柱状のフランジを前記鏡筒部に挿入し、
前記鏡筒部と前記フランジとの間に溶融した封止材を充填し、
前記フランジの外周面のうち表面状態が異なる複数の領域の一にのみ、前記溶融した封止材を配置し、
その状態で硬化させる
ことを特徴とする光通信モジュールの封止方法。
(付記16)外周面に溝部が形成された前記フランジを用意して、前記フランジを前記鏡筒部に挿入し、
前記封止材を硬化させる
ことを特徴とする付記15に記載の光通信モジュールの封止方法。
(付記17)両端部を除く中間部分の、前記外周面に前記溝部が形成された前記フランジを用意して、前記フランジを前記鏡筒部に挿入し、
前記封止材を硬化させる
ことを特徴とする付記16に記載の光通信モジュールの封止方法。
(付記18)前記フランジの一の片側全部の、前記外周面に前記溝部が形成された前記フランジを用意して、前記フランジを前記鏡筒部に挿入し、
前記封止材を硬化させる
ことを特徴とする付記16に記載の光通信モジュールの封止方法。
(付記19)中間部分を除いて前記外周面がメッキ処理された前記フランジを用意して、前記フランジを前記鏡筒部に挿入し、
前記封止材を硬化させる
ことを特徴とする付記15に記載の光通信モジュールの封止方法。
(付記20)一の片側全部を除いて前記外周面がメッキ処理された前記フランジを用意して、前記フランジを前記鏡筒部に挿入し、
前記封止材を硬化させる
ことを特徴とする付記15に記載の光通信モジュールの封止方法。
1a メタルファイバ表面
2-1、2-2、2-3 レンズ
3 PBS
4 PLC
5 PD
6 TIA
7 配線基板
8 基板キャリア
9 プリズム
10 セラミックパッケージ
11 金属キャリア
20 鏡筒部
21 封止用フランジ
22a 部分溝加工の半田流れ止め構造
22b 片側溝加工半田流れ止め構造
22c 部分表面メッキ無しの半田流れ止め構造
22d 片側表面メッキ無しの半田流れ止め構造
23 半田
100 光通信モジュール
Claims (10)
- パッケージに固設された円筒形の鏡筒部と、
前記鏡筒部の内部に配置し、光ファイバが貫通する円柱状のフランジと、
前記鏡筒部と前記フランジとの間に配置した封止材と、
を含み、
前記フランジは、前記フランジの表面に表面状態が異なる複数の領域を備え、前記封止材は前記領域の一箇所にのみ配置している
ことを特徴とする光通信モジュールの封止構造。 - 前記表面状態は、未硬化状態の前記封止材に対して濡れ性が異なる
ことを特徴とする請求項1に記載の光通信モジュールの封止構造。 - 前記濡れ性が異なる領域は、前記フランジの半径が異なる外周面にそれぞれ配置し、
前記半径が小さい溝部の濡れ性は悪く、該溝部以外のフランジ表面の濡れ性は良好である
ことを特徴とする請求項2に記載の光通信モジュールの封止構造。 - 前記濡れ性が異なる領域は、前記フランジの一の片側全部に設けた段差であり、
該段差部の濡れ性は悪く、該段差部以外のフランジ表面の濡れ性は良好である
ことを特徴とする請求項2に記載の光通信モジュールの封止構造。 - 前記濡れ性が異なる領域の一方は、メッキ処理された表面を有し、他方はメッキ処理されていない表面を有し、
該メッキ処理されていない表面の濡れ性は悪く、該メッキ処理された表面の濡れ性は良好である
ことを特徴とする請求項2に記載の光通信モジュールの封止構造。 - 前記濡れ性が異なる領域は、メッキ処理された前記フランジの一の片側全部に設けた非メッキ部分であり、
該非メッキ部の濡れ性は悪く、該メッキ処理された表面の濡れ性は良好である
ことを特徴とする請求項2に記載の光通信モジュールの封止構造。 - 前記封止材は半田である
ことを特徴とする請求項1乃至6のいずれか一項に記載の光通信モジュールの封止構造。 - 前記光ファイバは金属被覆が施されている
ことを特徴とする請求項1乃至7のいずれか一項に記載の光通信モジュールの封止構造。 - 前記光ファイバはアレイ状である
ことを特徴とする請求項1乃至8のいずれか一項に記載の光通信モジュールの封止構造。 - パッケージに円筒形の鏡筒部を設け、
光ファイバが貫通する円柱状のフランジを前記鏡筒部に挿入し、
前記鏡筒部と前記フランジとの間に溶融した封止材を充填し、
前記フランジの外周面のうち表面状態が異なる複数の領域の一にのみ、前記溶融した封止材を配置し、
その状態で硬化させる
ことを特徴とする光通信モジュールの封止方法。
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CN201480062315.7A CN105723264A (zh) | 2013-11-15 | 2014-11-10 | 光学通信模块的密封方法和密封结构 |
JP2015547635A JPWO2015072131A1 (ja) | 2013-11-15 | 2014-11-10 | 光通信モジュールの封止構造およびその封止方法 |
US15/036,670 US9606310B2 (en) | 2013-11-15 | 2014-11-10 | Sealing structure of optical communication module and sealing method of the same |
EP14862030.5A EP3070503A4 (en) | 2013-11-15 | 2014-11-10 | Sealing method and sealing structure of optical communication module |
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Cited By (2)
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JP2017097091A (ja) * | 2015-11-20 | 2017-06-01 | 日本電気株式会社 | 光通信モジュールおよび該光通信モジュールの製造方法 |
JP2019191260A (ja) * | 2018-04-19 | 2019-10-31 | 住友電気工業株式会社 | コヒーレント光受信モジュール |
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US20160282574A1 (en) | 2016-09-29 |
CN105723264A (zh) | 2016-06-29 |
EP3070503A1 (en) | 2016-09-21 |
JPWO2015072131A1 (ja) | 2017-03-16 |
US9606310B2 (en) | 2017-03-28 |
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