WO2015059751A1 - 対基板作業装置 - Google Patents
対基板作業装置 Download PDFInfo
- Publication number
- WO2015059751A1 WO2015059751A1 PCT/JP2013/078475 JP2013078475W WO2015059751A1 WO 2015059751 A1 WO2015059751 A1 WO 2015059751A1 JP 2013078475 W JP2013078475 W JP 2013078475W WO 2015059751 A1 WO2015059751 A1 WO 2015059751A1
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- WIPO (PCT)
- Prior art keywords
- substrate
- work
- mounting
- head
- positioning
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
Definitions
- the present invention relates to a substrate transport apparatus that positions a substrate at a plurality of locations in a substrate working apparatus and a configuration of an apparatus that uses a plurality of heads such as a coating head, a high-speed head, a medium-speed head, and a low-speed head.
- Patent Document 1 discloses a substrate transfer device electronic component mounting device that positions a substrate at a plurality of locations in a substrate work apparatus.
- Patent Document 2 discloses an apparatus using a plurality of heads such as a coating head, a high-speed head, a medium-speed head, and a low-speed head.
- the present invention has been made in view of the related art problems, and includes a substrate transfer device that positions a substrate at a plurality of locations in the substrate working apparatus, and a plurality of coating heads, high-speed heads, medium-speed heads, low-speed heads, and the like.
- the conventional problem is solved by providing the configuration of the apparatus using the head.
- the structural feature of the invention according to claim 1 is that a substrate transport device that transports a substrate and positions the substrate at a plurality of locations in the substrate work device, and the substrate at a work position.
- a plurality of working devices for positioning and working on the substrate, and among the plurality of locations, the substrate is sequentially positioned from an upstream position with respect to a traveling direction of the substrate;
- a control device that performs the work by the second device by positioning the substrate in order from the downstream position in the advancing direction of the substrate among the plurality of locations.
- the top view which shows the outline of the electronic component mounting apparatus which concerns on embodiment.
- FIG. The figure which shows the mounting order 2 in each conveyor which concerns on Embodiment 1, Embodiment 2.
- FIG. The figure which shows the mounting order 5 in each conveyor which concerns on Embodiment 1.
- FIG. The figure which shows the mounting order 6 in each conveyor which concerns on Embodiment 1.
- FIG. The figure which shows the mounting order 3 in each conveyor which concerns on Embodiment 2.
- FIG. The figure which shows the mounting order 4 in each conveyor which concerns on Embodiment 2.
- FIG. The figure which shows the mounting order 5 in each conveyor which concerns on Embodiment 2.
- FIG. The figure which shows the positioning of the board
- the electronic component mounting apparatus 2 includes a substrate transfer device 4 that loads a substrate 3 into a loading position and positions the substrate 3 at a predetermined position, a component supply device 5, and a base 6 in a horizontal direction.
- a component transfer device 12 and a mark recognition camera 14 having a mounting head 10 provided on a movable table 8 supported so as to be movable in a certain X direction and Y direction, and a component recognition camera 16 fixed to the base 6.
- a control device 18 for controlling the mounting by the component transfer device 12.
- the substrate transfer device 4 is a so-called double conveyor type, and each conveyor is provided in parallel along a guide rail 20 extending in the X direction and is provided in parallel with a conveyor belt (in parallel) for carrying the substrate 3 to a positioned position. (Not shown), a support frame (not shown) for supporting each of the loaded substrates 3, and a lifting device (not shown) for raising the supported substrates 3 to a mounting position (predetermined position). And a clamping device (not shown) for clamping the substrate 3 at each position (mounting position).
- a support frame not shown
- a lifting device for raising the supported substrates 3 to a mounting position (predetermined position).
- a clamping device (not shown) for clamping the substrate 3 at each position (mounting position).
- the component supply device 5 is configured by arranging a plurality of cassette-type feeders 21 in parallel on the side portion (front side in FIG. 1) of the substrate transfer device 4.
- Each of the cassette type feeders 21 includes a case part detachably attached to the slot (not shown), a supply reel provided at the rear part of the case part, and a component take-out part provided at the tip of the case part.
- An elongated tape (not shown) in which electronic components are sealed at a predetermined pitch is wound and held on the supply reel, and this tape is pulled out at a predetermined pitch by a sprocket (not shown), and the electronic component is released from the sealed state. Sequentially sent to the parts take-out part.
- a code (identification code) is affixed to the cassette-type feeder 21, and data corresponding to this code and the ID, part number, number of enclosures, part weight, etc. of the electronic parts is managed by the control device 18 as a host computer that manages the entire line It is recorded in advance in the mounting program data transmitted from (not shown).
- a component tray 17 is disposed on a side portion (upper side in FIG. 1) of the substrate transport apparatus 4, and a large electronic component or the like is stored in the component tray 17. These are also a kind of component supply device 5. *
- An X-direction moving beam 22 is provided above the substrate transport device 4, and the X-direction moving beam 22 extends in the Y direction and extends in the X direction along the substrate transport device 4 ( It is provided so as to be movable along (not shown).
- the moving table 8 is provided on the X direction moving beam 22 so as to be movable on a Y direction rail (not shown) provided on the side surface of the X direction moving beam 22 via a slider (not shown). It has been.
- the moving table 8 holds a component transfer device 12 having a mounting head 10 and a mark recognition camera 14 so as to be movable together with the moving table 8.
- the X-direction moving beam 22 is driven by a servo motor via a ball screw mechanism (not shown), and the moving table 8 is driven by a servo motor (not shown) via a Y-direction moving ball screw mechanism (not shown). .
- the drive of these servo motors is controlled by the control device 18.
- the optical axis of the mark recognition camera 14 is parallel to the Z direction perpendicular to the X direction and the Y direction.
- a captured image captured by the mark recognition camera 14 is input to an unillustrated image recognition apparatus including an unillustrated A / D converter.
- the image recognition apparatus captures the captured image and reads information from the reference marks 106, 107, 108, and 109 (see FIG. 2). Then, the positional deviation of the reference mark 106 and the like is calculated by a calculation device (not shown) provided in the control device 18. Next, when the mark recognition camera 14 is moved, the position deviation is corrected and moved.
- the mounting head 10 as a work head is detachable from the component transfer device 12 and can be selected and mounted from a plurality of components having different configurations. That is, the component transfer device 12 can replace the work head with a different type.
- FIGS. 3 to 6 show one application head 1100 and three mounting heads 201a, 201b, and 201c shown in FIG. 3 as examples of work heads that can be mounted. If each is demonstrated easily, the mounting head 201a shown in FIG. 4 will be a working head of the type which equips with a plurality (eight) the mounting units 140 which generally form a shaft, and rotates them by index.
- the mounting unit 140 has a suction nozzle 142 as a component holding device for sucking and holding components at the lower end thereof.
- the mounting head 201 a With the mounting head 201 a positioned above the cassette type feeder 21, one of the mounting units 140 is lowered and the electrons supplied to the suction nozzle 142 of the mounting unit 140 at the component supply position of the cassette type feeder 21.
- the electronic component is taken out by holding the component.
- the mounting unit 140 is intermittently rotated, and each mounting unit 142 sequentially takes out the electronic components. With each mounting unit 140 holding an electronic component, the mounting head 201a is moved above the substrate fixedly held by the clamp device.
- the mounting head 201a is a working head that performs such an operation, and is a working head (high-speed head) suitable for high-speed mounting of relatively small electronic components.
- illustration is abbreviate
- a mounting head 201c shown in FIG. 6 is a working head equipped with one mounting unit 140.
- the mounting unit 140 is lowered above the cassette type feeder 21 and above the substrate, and the cassette type feeder 21 and the substrate are reciprocated once.
- one electronic component is mounted.
- the mounting head 201c has a relatively slow mounting speed, the mounting head 201c can also be equipped with a relatively large suction nozzle 142, and can mount a large electronic component or a special-shaped electronic component. (Low speed head).
- a mounting head 201b shown in FIG. 5 is a mounting head having two mounting units 140, and is a working head (medium speed head) having intermediate characteristics between the mounting head 201a and the mounting head 201c.
- the front mounting unit 140 has a plurality of suction nozzles 142 arranged radially around an axis perpendicular to the axis of the mounting unit 140.
- the nozzle to be used is selected by being rotated around its axis.
- the component transfer device 12 can mount one device arbitrarily selected from the above-described work heads according to the form of the mounting work.
- the component transfer apparatus 12 exchanges a work head suitably.
- the coating head 1100 includes an elevating member 1104 that is held on the head body so as to be elevable.
- the elevating member 1104 is raised and lowered by an elevating device (not shown) provided in the head body.
- An adhesive applicator 1106 is mounted on the elevating member 1104.
- the adhesive applicator 1106 is configured, for example, in the same manner as the adhesive applicator described in Japanese Patent No. 3242120, and includes an application nozzle 1108 and a syringe 1110 as an adhesive container.
- An adhesive 1112 which is a kind of highly viscous fluid, is accommodated in the syringe 1110. If compressed air is supplied from a compressed air supply source (not shown) into the syringe 1110, the adhesive passes through the discharge pipe 1114. It is discharged and applied to the substrate 30 by a predetermined amount. *
- a component recognition camera 16 is provided between the substrate transfer device 4 and the component supply device 5, and the electronic component sucked by the suction nozzle 142 is imaged by the component recognition camera 16 to be produced. It is determined whether the electronic component is of a type suitable for the type, whether the suction state is good, and whether there is a defective portion of the component itself.
- the electronic component mounting apparatus 2 is provided with an input device 42 such as a keyboard for inputting board data, component data, and the like.
- the input device 42 is provided with a display device 44, and on the screen of the display device 44, substrate data, component data, calculation data, an image captured by the mark recognition camera 14 and the like can be displayed.
- a coating head 1100 and mounting heads 201a, 201b, and 201c can be mounted on the exchange device 401.
- the component transfer device 12 mounts the mounting head 10 in an empty space in the replacement device 401 and mounts the work head to be mounted next from the replacement device 401.
- the component transfer apparatus 12 can mount all of the coating head 1100 and the mounting heads 201a, 201b, and 201c.
- FIG. 2 is a plan view of the substrate 3 produced in the embodiment.
- the substrate 3 includes an area 101, an area 102, and an area 103.
- the first mounting area refers to area 101 and area 102
- the second mounting area refers to area 102 and area 103.
- the substrate 3 is provided with reference marks 106 and 107 for the first mounting area and reference marks 108 and 109 for the second mounting area. *
- FIG. 7 shows the mounting order 1 in each conveyor according to the first embodiment.
- the substrate 3 is transferred by the substrate transfer device 4 and stopped by the stopper 140.
- the clamping devices 104 and 105 clamp the substrate 3.
- the length of the clamping devices 104 and 105 in the transport direction corresponds to the mountable range of the electronic component mounting device 2.
- the electronic component mounting apparatus 2 recognizes the reference marks 106 and 107 for the first mounting area by the mark recognition camera 14 and calculates the positional deviation of the reference mark 106 and the like by an arithmetic unit (not shown) provided in the control device 18. To do. The calculation result is used for correction when the electronic component is mounted.
- the component transfer apparatus 12 is mounted with the mounting head 201a as a work head.
- the electronic component mounting device 2 sucks the electronic components 122 and 125 from the component supply device 5 by the mounting head 201a and mounts the electronic components 122 and 125 on a predetermined position of the substrate 3. *
- FIG. 8 shows the mounting order 2 in each conveyor according to the first embodiment.
- the substrate 3 is transferred by the substrate transfer device 4 and stops at a predetermined stop position.
- the stopper 140 is retracted by a cylinder (not shown) so as not to hinder the conveyance of the substrate 3.
- the clamping devices 104 and 105 clamp the substrate 3.
- the electronic component mounting apparatus 2 recognizes the reference marks 108 and 109 for the second mounting area by the mark recognition camera 14, and calculates the positional deviation of the reference mark 108 and the like by an arithmetic device (not shown) provided in the control device 18. To do.
- the calculation result is used for correction when the electronic component is mounted.
- the component transfer apparatus 12 is mounted with the mounting head 201a as a work head.
- the electronic component mounting device 2 sucks the electronic components 128 and 131 from the component supply device 5 by the mounting head 201a and mounts the electronic components 128 and 131 on a predetermined position of the substrate 3. *
- FIG. 9 shows the mounting order 3 in each conveyor according to the first embodiment.
- the substrate 3 remains clamped by the clamping devices 104 and 105. Since the electronic component mounting apparatus 2 recognizes the reference marks 108 and 109 for the second mounting area in the state shown in FIG. Then, the component transfer apparatus 12 mounts the mounting head 201b as a work head by the replacement apparatus 401. Next, the electronic component mounting device 2 sucks the electronic components 127 and 130 from the component supply device 5 by the mounting head 201b and mounts the electronic components 127 and 130 on a predetermined position of the substrate 3. *
- FIG. 10 shows the mounting order 4 in each conveyor according to the first embodiment.
- the substrate 3 is transported by the substrate transport device 4 in the direction opposite to the previous traveling direction, and stops at a predetermined stop position.
- the substrate transport apparatus 4 may transport more substrates than a predetermined stop position, further transport the substrates in the original traveling direction, and stop the substrate 3 by the stopper 140.
- the clamping devices 104 and 105 clamp the substrate 3.
- the electronic component mounting apparatus 2 recognizes the reference marks 106 and 107 for the first mounting area by the mark recognition camera 14 and calculates the positional deviation of the reference mark 106 and the like by an arithmetic unit (not shown) provided in the control device 18. To do.
- the component transfer apparatus 12 is mounted with the mounting head 201b as a work head.
- the electronic component mounting apparatus 2 sucks the electronic components 121 and 124 from the component supply apparatus 5 by the mounting head 201b and mounts the electronic components 121 and 124 at predetermined positions on the substrate 3.
- FIG. 11 shows the mounting order 5 in each conveyor according to the first embodiment.
- the substrate 3 remains clamped by the clamping devices 104 and 105. Since the electronic component mounting apparatus 2 recognizes the reference marks 106 and 107 for the first mounting area in the state shown in FIG. Then, the component transfer apparatus 12 mounts the mounting head 201 c as a work head by the replacement apparatus 401. Next, the electronic component mounting device 2 sucks the electronic components 120 and 123 from the component supply device 5 by the mounting head 201c and mounts the electronic components 120 and 123 on a predetermined position of the substrate 3. *
- FIG. 12 shows the mounting order 6 in each conveyor according to the first embodiment.
- the substrate 3 is transferred by the substrate transfer device 4 and stops at a predetermined stop position.
- the stopper 140 is retracted by a cylinder (not shown) so as not to hinder the conveyance of the substrate 3.
- the clamping devices 104 and 105 clamp the substrate 3.
- the electronic component mounting apparatus 2 recognizes the reference marks 108 and 109 for the second mounting area by the mark recognition camera 14, and calculates the positional deviation of the reference mark 108 and the like by an arithmetic device (not shown) provided in the control device 18. To do.
- the calculation result is used for correction when the electronic component is mounted.
- the component transfer apparatus 12 is mounted with the mounting head 201c as a work head.
- the electronic component mounting device 2 sucks the electronic components 126 and 129 from the component supply device 5 by the mounting head 201c and mounts the electronic components 126 and 129 on a predetermined position of the substrate 3. *
- a mounting order 3 to a mounting order 5 will be described with reference to FIGS.
- the second embodiment shows a case where there is no electronic component to be mounted by the mounting head 201b in the first mounting area from the first embodiment. That is, the mounting order 4 of FIG. 10 is omitted from Embodiment 1, and the mounting order 5 (FIG. 11) and the mounting order 6 (FIG. 12) are switched. *
- FIG. 13 shows the mounting order 3 in each conveyor according to the second embodiment.
- the substrate 3 remains clamped by the clamping devices 104 and 105. Since the electronic component mounting apparatus 2 recognizes the reference marks 108 and 109 for the second mounting area in the state shown in FIG. Then, the component transfer apparatus 12 mounts the mounting head 201b as a work head by the replacement apparatus 401. Next, the electronic component mounting device 2 sucks the electronic components 127 and 130 from the component supply device 5 by the mounting head 201b and mounts the electronic components 127 and 130 on a predetermined position of the substrate 3. *
- FIG. 14 shows the mounting order 4 in each conveyor according to the second embodiment.
- the substrate 3 remains clamped by the clamping devices 104 and 105. Since the electronic component mounting apparatus 2 recognizes the reference marks 108 and 109 for the second mounting area in the state shown in FIG. Then, the component transfer apparatus 12 mounts the mounting head 201 c as a work head by the replacement apparatus 401. Next, the electronic component mounting device 2 sucks the electronic components 126 and 129 from the component supply device 5 by the mounting head 201c and mounts the electronic components 126 and 129 on a predetermined position of the substrate 3. *
- FIG. 15 shows a mounting order 5 in each conveyor according to the second embodiment.
- the substrate 3 is transported by the substrate transport device 4 in the direction opposite to the previous traveling direction, and stops at a predetermined stop position.
- the substrate transport apparatus 4 may transport more substrates than a predetermined stop position, further transport the substrates in the original traveling direction, and stop the substrate 3 by the stopper 140.
- the clamping devices 104 and 105 clamp the substrate 3.
- the electronic component mounting apparatus 2 recognizes the reference marks 106 and 107 for the first mounting area by the mark recognition camera 14 and calculates the positional deviation of the reference mark 106 and the like by an arithmetic unit (not shown) provided in the control device 18. To do.
- the component transfer apparatus 12 is mounted with the mounting head 201c as a work head.
- the electronic component mounting device 2 sucks the electronic components 120 and 123 from the component supply device 5 by the mounting head 201c and mounts the electronic components 120 and 123 on a predetermined position of the substrate 3.
- performing the work on the substrate in the order of the coating head, the high-speed head, the medium-speed head, and the low-speed head leads to optimization because the work is performed in the order of the short distance between the substrate and the head. Further, for example, the recognition of the reference mark can be reduced as in the case where the mounting order is changed from FIG. 8 to FIG. Although the embodiment has been described with a high-speed head, a medium-speed head, and a low-speed head, a coating head can be used in the same manner. *
- the stopper when the substrate is carried in from the previous process such as other electronic component mounting device, the stopper is used, and when it is transported in the device, the substrate is positioned by the mark recognition camera. It is possible to reduce the number of mechanical mechanisms such as stoppers, while handling from the outside.
- the positioning of the substrate 3 is performed by recognizing the reference mark and the edge of the substrate while the substrate transporting device 4 transports the substrate 3 back and forth as shown in FIGS. Can be retried.
- the double conveyor was illustrated about the board
- the mounting area is not limited to the portion corresponding to the rail, but also includes a predetermined range in the substrate transfer apparatus.
- the clamping device only needs to be able to clamp the substrate, and includes a method of clamping from the side and a method of clamping from the vertical direction. In the vertical clamp, the upper member may operate, the lower member may operate, or both.
- the inside of the substrate working apparatus means a state in which the work can be performed in the substrate working apparatus, and includes a case where the end of the substrate protrudes from the apparatus. Further, the substrate work is a concept including application, mounting, and inspection.
- a back-up pin may be provided in the substrate work apparatus.
- the backup pin may be arranged at a common position in the first mounting area and the second mounting area. desirable.
- any of the coating head, the high-speed head, the medium-speed head, and the low-speed head share the function. Further, the exchange device may exchange two or more heads.
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Abstract
Description
装置2には、基板データ、部品データ等を入力するためのキーボード等の入力装置42が設けられている。入力装置42には表示装置44が併設され、表示装置44の画面には基板データ、部品データ、演算データやマーク認識用カメラ14等で撮像した画像が表示できるようになっている。
Claims (7)
- 基板を搬送して対基板作業装置内の複数の箇所に位置決めする基板搬送装置と、前記基板を作業位置に位置決めして前記基板に対して作業を行う複数の作業装置と、前記複数の箇所の内、前記基板が基板の進行方向について上流側の位置から順に位置決めして、前記複数の作業装置のうちの第1の装置により作業を行い、前記複数の箇所の内、前記基板が基板の進行方向について前記第1の装置による作業中最も下流側の位置の作業が完了したら、前記複数の作業装置のうちの第2の装置により作業を始め、前記第2の装置による作業は、前記複数の箇所の内、前記基板が基板の進行方向について下流側の位置から順に位置決めして行う制御装置、とを備えていることを特徴とする対基板作業装置。
- 請求項1に記載の対基板作業装置は、前記複数の作業装置のうちの第3の装置による作業は、前記複数の作業装置のうちの第2の装置による作業が完了したら、前記複数の箇所の内、前記基板が基板の進行方向について上流側の位置から順に位置決めして行う制御装置、を備えていることを特徴とする対基板作業装置。
- 請求項2に記載の対基板作業装置は、前記複数の作業装置の選択の順番を、塗布ヘッド、高速ヘッド、中速ヘッド、低速ヘッドの順を遵守して行う選択装置、を備えていることを特徴とする対基板作業装置。
- 請求項3に記載の対基板作業装置は、前記塗布ヘッド、前記高速ヘッド、前記中速ヘッド、前記低速ヘッドを交換する交換装置、を備えていることを特徴とする対基板作業装置。
- 請求項1乃至請求項4に記載の対基板作業装置は、前記基板が対基板作業装置内の作業可能領域を超えることを特徴とする対基板作業装置。
- 請求項1乃至請求項5に記載の対基板作業装置は、前記複数の箇所の内、前記基板が基板の進行方向について最も上流側の位置における位置決めは、前記基板搬送装置が備える位置決め装置により行い、前記対基板作業装置は、前記複数の作業装置の移動を行う移動装置を備え、前記複数の箇所の内、前記基板が基板の進行方向について最も上流側の位置以外の位置決めは、前記移動装置が備える対基板位置検出装置により行う、位置決め制御装置を備えていることを特徴とする対基板作業装置。
- 請求項6に記載の対基板作業装置は、最も上流側の位置以外の位置決めについて異常が検出された場合に、前記基板に付された被検出対象又は前記基板の端を前記基板位置検出装置により行うことを特徴とする対基板作業装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2015543589A JP6401708B2 (ja) | 2013-10-21 | 2013-10-21 | 対基板作業装置 |
US15/030,776 US10278317B2 (en) | 2013-10-21 | 2013-10-21 | Board working device |
EP13895996.0A EP3062339B1 (en) | 2013-10-21 | 2013-10-21 | Substrate working apparatus |
CN201380080308.5A CN105684137B (zh) | 2013-10-21 | 2013-10-21 | 对基板作业装置 |
PCT/JP2013/078475 WO2015059751A1 (ja) | 2013-10-21 | 2013-10-21 | 対基板作業装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/JP2013/078475 WO2015059751A1 (ja) | 2013-10-21 | 2013-10-21 | 対基板作業装置 |
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WO2015059751A1 true WO2015059751A1 (ja) | 2015-04-30 |
WO2015059751A9 WO2015059751A9 (ja) | 2016-02-18 |
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PCT/JP2013/078475 WO2015059751A1 (ja) | 2013-10-21 | 2013-10-21 | 対基板作業装置 |
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US (1) | US10278317B2 (ja) |
EP (1) | EP3062339B1 (ja) |
JP (1) | JP6401708B2 (ja) |
CN (1) | CN105684137B (ja) |
WO (1) | WO2015059751A1 (ja) |
Cited By (1)
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JP7399243B2 (ja) | 2021-11-17 | 2023-12-15 | サムス カンパニー リミテッド | ダイボンディング設備 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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US10919711B2 (en) * | 2017-01-31 | 2021-02-16 | Fuji Corporation | Component mounting device |
JP6878117B2 (ja) | 2017-04-25 | 2021-05-26 | 川崎重工業株式会社 | シート搬送装置及びシート搬送方法 |
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US20160286699A1 (en) | 2016-09-29 |
CN105684137A (zh) | 2016-06-15 |
JP6401708B2 (ja) | 2018-10-10 |
EP3062339A1 (en) | 2016-08-31 |
WO2015059751A9 (ja) | 2016-02-18 |
EP3062339B1 (en) | 2019-08-28 |
US10278317B2 (en) | 2019-04-30 |
CN105684137B (zh) | 2019-02-01 |
EP3062339A4 (en) | 2017-06-07 |
JPWO2015059751A1 (ja) | 2017-03-09 |
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