WO2015005211A1 - Cation-polymerizable composition - Google Patents
Cation-polymerizable composition Download PDFInfo
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- WO2015005211A1 WO2015005211A1 PCT/JP2014/067779 JP2014067779W WO2015005211A1 WO 2015005211 A1 WO2015005211 A1 WO 2015005211A1 JP 2014067779 W JP2014067779 W JP 2014067779W WO 2015005211 A1 WO2015005211 A1 WO 2015005211A1
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- epoxy compound
- polymerizable composition
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- cationically polymerizable
- composition according
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Definitions
- the present invention relates to a cationic polymerizable composition and a cured product obtained by irradiating the cationic polymerizable composition with active energy rays.
- the cationically polymerizable composition is particularly useful for adhesives.
- Cationic polymerizable compositions are used in the fields of inks, paints, various coating agents, adhesives, optical members and the like.
- Patent Documents 1 to 3 disclose various photocurable adhesives.
- An object of the present invention is to provide a cationically polymerizable composition having excellent curability, adhesion and water resistance.
- the present invention has been made on the basis of the above findings, and includes (1) an aromatic epoxy compound (1A) as a main component as a cationically polymerizable organic substance, and further an aliphatic epoxy compound (1B) or an alicyclic type.
- an aromatic epoxy compound (1A) as a main component as a cationically polymerizable organic substance
- an aliphatic epoxy compound (1B) or an alicyclic type By providing a cationically polymerizable composition characterized by comprising a cationically polymerizable organic substance mixture containing at least one of the epoxy compound (1C) and (2) an energy ray-sensitive cationic polymerization initiator. Is achieved.
- the present invention also provides an adhesive comprising the above cationic polymerizable composition.
- the cationically polymerizable composition of the present invention is particularly useful as an adhesive because it is excellent in curability, adhesiveness and water resistance.
- the cationic polymerizable organic substance constituting the mixture is polymerized or crosslinked by an energy ray sensitive cationic polymerization initiator activated by light irradiation.
- An epoxy compound is preferable.
- an aromatic epoxy compound (1A), an alicyclic epoxy compound (1C), an aliphatic epoxy compound (1B), or a high molecular weight compound (1D) having an epoxy group and having a weight average molecular weight of 1,000 to 1,000,000 is used. be able to.
- a vinyl ether compound or an oxetane compound (1E) is used as the cationically polymerizable organic substance.
- the aromatic epoxy compound (1A) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound include monovalent phenols having at least one aromatic ring such as phenol, cresol, and butylphenol.
- mono / polyglycidyl etherified products of the alkylene oxide adducts such as bisphenol A, bisphenol F, or glycidyl etherified products of compounds obtained by further adding alkylene oxide to these and epoxy novolac resins; two such as resorcinol, hydroquinone and catechol Glycidyl ethers of aromatic compounds having the above phenolic hydroxyl groups; mono / polyglycidic aromatic compounds having two or more alcoholic hydroxyl groups such as benzenedimethanol, benzenediethanol, and benzenedibutanol Ruetherified products: glycidyl esters of polybasic acid aromatic compounds having two or more carboxylic acids such as phthalic acid, terephthalic acid, trimellitic acid, gly
- glycidyl ethers of phenols glycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups
- glycidyl ethers of polyphenols glycidyl esters of benzoic acids
- glycidyl esters of polybasic acids glycidyl esters of polybasic acids
- styrene oxide or divinyl It is preferable to contain at least one selected from the group of epoxidized benzene from the viewpoint of reducing the viscosity of the composition.
- aromatic epoxy compound those having an epoxy equivalent of 80 to 500 are preferable because of excellent curability.
- the aromatic epoxy compound (1A) commercially available products can be used.
- the aromatic epoxy compound (1A) preferably contains at least one polyfunctional epoxy compound from the viewpoints of curability and adhesiveness.
- the cationically polymerizable composition of the present invention preferably contains 25 to 70 parts by mass of the polyfunctional aromatic epoxy compound (1A) with respect to 100 parts by mass of (1) the cationically polymerizable organic substance mixture, More preferably, 60 parts by mass is contained.
- the amount of (1A) includes the amount corresponding to (1D).
- alicyclic epoxy compound (1C) is obtained by epoxidizing a polyglycidyl etherified product of a polyhydric alcohol having at least one alicyclic ring or a cyclohexene or cyclopentene ring-containing compound with an oxidizing agent. And cyclopentene oxide-containing compounds.
- alicyclic epoxy compound (1C) Commercially available products can be used as the alicyclic epoxy compound (1C), and examples thereof include Celoxide 2021P, Celoxide 2081, Celoxide 2000, and Celoxide 3000 (manufactured by Daicel Corporation).
- the aliphatic epoxy compound (1B) refers to an epoxy compound that is not classified as the aromatic epoxy compound (1A) or the alicyclic epoxy compound (1C).
- Specific examples of the aliphatic epoxy compound include aliphatic alcohols.
- An epoxy compound is mentioned.
- Representative compounds include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C 1 2-13 mixed alkyl glycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, Triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, glycidyl ether of polyhydric alcohol such as diglycidyl ether of polypropylene glycol, In addition, one or two or more alkyl polyhydric alcohols such as propylene glycol, trimethylolpropane and glycerin are used.
- Polyglycidyl ethers of polyether polyols obtained by adding emission oxide include diglycidyl esters of aliphatic long-chain dibasic acids. Furthermore, monoglycidyl ethers of higher aliphatic alcohols, glycidyl esters of higher fatty acids, epoxidized soybean oil, octyl epoxy stearate, butyl epoxy stearate, epoxidized soybean oil, epoxidized polybutadiene and the like. As the aliphatic epoxy compound (1B), those having an epoxy equivalent of 80 to 500 are preferable.
- aliphatic epoxy compound (1B) commercially available products can be used.
- the cationically polymerizable composition of this invention contains at least 1 type of a polyfunctional epoxy compound as said aliphatic epoxy compound (1B) or alicyclic epoxy compound (1C).
- the cationically polymerizable composition of the present invention is (1) the sum of the polyfunctional aliphatic epoxy compound (1B) and the polyfunctional alicyclic epoxy compound (1C) with respect to 100 parts by mass of the cationically polymerizable organic substance mixture.
- the amount is preferably 10 to 65 parts by mass, particularly 20 to 50 parts by mass.
- the content of the polyfunctional aliphatic epoxy compound (1B) is preferably 10 to 45 parts by mass with respect to (1) 100 parts by mass of the cation polymerizable organic substance mixture, and the polyfunctional alicyclic epoxy compound
- the content of (1C) is preferably 0 to 10 parts by mass.
- the amounts of (1B) and (1C) are amounts including those corresponding to (1D).
- Examples of the high molecular weight polymer (1D) having a weight average molecular weight of 1,000 to 1,000,000 having an epoxy group include a polymer obtained by radical polymerization, and homopolymerizing one kind of ethylenically unsaturated monomer having a cationic polymerizable substituent. Preferred is a polymer copolymerized with an ethylenically unsaturated monomer that does not have a polymer or a cationically polymerizable substituent.
- the ethylenically unsaturated monomer constituting the high molecular weight product (1D) having a weight average molecular weight of 1,000 to 1,000,000 having the epoxy group is not particularly limited, and known ones can be used.
- an example of an ethylenically unsaturated monomer having no cationically polymerizable substituent includes a group represented by the following general formula (1), and an ethylenically unsaturated group having a cationically polymerizable substituent.
- the monomer one or more hydrogen atoms in the alkyl group, aryl group or alicyclic hydrocarbon group in the following general formula (1) are substituted with an epoxy group, an oxetane group or a vinyl ether group. Groups.
- R 11 , R 12 , R 13 and R 14 are each independently a hydrogen atom, a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, or 6 to 12 carbon atoms.
- An aryl group or an alicyclic hydrocarbon group having 6 to 10 carbon atoms, and a methylene group in these groups may be substituted with —CO—, —O— or —COO—)
- the high molecular weight body (1D) contains 10 to 10 ethylenically unsaturated monomers having a structure substituted with a cationic polymerizable substituent such as an epoxy group, an oxetane group or a vinyl ether group.
- methyl group, ethyl group or branched alkyl group having 3 to 7 carbon atoms, aryl group having 6 to 12 carbon atoms, 6 to 10 carbon atoms, which is not substituted with a cationic polymerizable substituent The content of the ethylenically unsaturated monomer substituted with an alicyclic hydrocarbon group is preferably 20 to 90% by mass, and the total together with other ethylenically unsaturated monomers is preferably 100% by mass.
- the high molecular weight product (1D) having a weight average molecular weight of 1,000 to 1,000,000 having an epoxy group preferably has a weight average molecular weight of 5,000 to 100,000, more preferably 7,000 to 70,000.
- Examples of the vinyl ether compound or oxetane compound (1E) include ethylene glycol divinyl ether, triethylene glycol divinyl ether, n-dodecyl vinyl ether, cyclohexyl vinyl ether, 2-ethylhexyl vinyl ether, 2-chloroethyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, triethylene.
- the vinyl ether compound preferably has a molecular weight of 58 to 500, more preferably 70 to 300.
- the oxetane compound preferably has a molecular weight of 100 to 1000, more preferably 110 to 500.
- the vinyl ether compound or oxetane compound (1E) may be monofunctional or polyfunctional, but has one or two vinyl ether groups or oxetane groups having one or two vinyl ether groups. It is preferable to use an oxetane compound.
- vinyl ether compound or oxetane compound (1E) commercially available products mainly composed of a cationic polymerizable monomer can be used.
- the molecular weight (1D), vinyl ether compound, or oxetane compound (1E) is used in an amount of (1) 25 to 70 parts by mass, especially 30 parts by mass of the aromatic epoxy compound (1A) with respect to 100 parts by mass of the cationic polymerizable organic substance mixture.
- the amounts of (1B) and (1C) are amounts excluding those corresponding to the above (1D), and the amount of (1A) is an amount including those corresponding to (1D).
- the main component means a mixture of several types of epoxy compounds and the largest total amount of the same type of epoxy compounds, and the cationically polymerizable organic substance mixture contains a cationically polymerizable organic substance other than the epoxy compound.
- the total amount of the several types of epoxy compounds having the largest total amount is greater than the total amount of the cationically polymerizable organic material other than the epoxy compound.
- the total amount of each type of epoxy compound includes those corresponding to (1D).
- the (2) energy ray-sensitive cationic polymerization initiator used in the present invention may be any compound that can release a substance that initiates cationic polymerization by irradiation with energy rays, but is preferably Is a double salt that is an onium salt that releases a Lewis acid upon irradiation with energy rays, or a derivative thereof.
- Representative examples of such compounds include the following general formula: Listed is a salt of a cation and an anion represented by [A] r + [B] r- (wherein A represents a cation species, B represents an anion species, and r represents a valence). be able to.
- the cation [A] r + is preferably onium, and the structure thereof is, for example, the following general formula: [(R 1 ) a Q] r + It can be expressed as
- R 1 is an organic group having 1 to 60 carbon atoms and any number of atoms other than carbon atoms.
- a is an integer of 1 to 5.
- the a R 1 s are independent and may be the same or different.
- at least one is preferably an organic group as described above having an aromatic ring.
- anion [B] r- is preferably a halide complex, and the structure thereof is, for example, the following general formula: [LX b ] r- It can be expressed as
- L is a metal or metalloid which is a central atom of a halide complex
- B P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co and the like.
- X is a halogen atom.
- b is an integer of 3 to 7.
- anion [LX b ] r- in the above general formula examples include tetrakis (pentafluorophenyl) borate, tetra (3,5-difluoro-4-methoxyphenyl) borate, tetrafluoroborate (BF 4 ) ⁇ , Examples include hexafluorophosphate (PF 6 ) ⁇ , hexafluoroantimonate (SbF 6 ) ⁇ , hexafluoroarsenate (AsF 6 ) ⁇ , hexachloroantimonate (SbCl 6 ) ⁇ and the like.
- the anion [B] r ⁇ is represented by the following general formula: [LX b-1 (OH)] r-
- L, X, and b are the same as described above.
- Other anions that can be used include perchlorate ion (ClO 4 ) ⁇ , trifluoromethyl sulfite ion (CF 3 SO 3 ) ⁇ , fluorosulfonate ion (FSO 3 ) ⁇ , and toluenesulfonate anion.
- Trinitrobenzenesulfonate anion camphor sulfonate, nonafluorobutane sulfonate, hexadecafluorooctane sulfonate, tetraarylborate, tetrakis (pentafluorophenyl) borate and the like.
- onium salts it is particularly effective to use the following aromatic onium salts (a) to (c).
- aromatic onium salts (a) to (c) one of them can be used alone, or two or more of them can be mixed and used.
- Aryl diazonium salts such as phenyldiazonium hexafluorophosphate, 4-methoxyphenyldiazonium hexafluoroantimonate, 4-methylphenyldiazonium hexafluorophosphate, etc.
- Diaryls such as diphenyliodonium hexafluoroantimonate, di (4-methylphenyl) iodonium hexafluorophosphate, di (4-tert-butylphenyl) iodonium hexafluorophosphate, and tricumyliodonium tetrakis (pentafluorophenyl) borate Iodonium salt
- preferable examples include ( ⁇ 5 -2,4-cyclopentadien-1-yl) [(1,2,3,4,5,6- ⁇ )-(1-methylethyl) benzene] -iron.
- -Iron-arene complexes such as hexafluorophosphate
- aluminum complexes such as tris (acetylacetonato) aluminum, tris (ethylacetonatoacetato) aluminum, tris (salicylaldehyde) aluminum, and silanols such as triphenylsilanol
- silanols such as triphenylsilanol
- aromatic iodonium salts aromatic sulfonium salts, and iron-arene complexes are preferably used from the viewpoints of practical use and photosensitivity.
- the use ratio of the (2) energy ray sensitive cationic polymerization initiator to the above (1) cationic polymerizable organic substance mixture is not particularly limited, and may be used at a generally normal use ratio within a range not impairing the object of the present invention.
- a silane coupling agent can be used as necessary.
- the silane coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, and ethyltrimethoxysilane.
- the amount of the silane coupling agent used is not particularly limited, but is usually in the range of 1 to 20 parts by mass with respect to 100 parts by mass of the total amount of solids in the cationic polymerizable composition.
- thermal polymerization initiator is a compound that generates a cationic species or Lewis acid by heating, such as a salt of sulfonium salt, thiophenium salt, thiolanium salt, benzylammonium, pyridinium salt, hydrazinium salt; diethylenetriamine, triethylenetriamine, tetraethylenepenta Polyalkylpolyamines such as min; alicyclic polyamines such as 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophoronediamine; m-xylylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone Aromatic polyamines such as; such polyamines; phenyl glycidyl ether, butyl glycid
- Mannich-modified products produced by reacting phenols having sex sites by a conventional method polyvalent carboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelain Acid, sebacic acid, Decanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylpentanedioic acid, 2-methyloctanedioic acid, 3,8-dimethyldecanedioic acid, 3,7-dimethyldecane Aliphatic dicarboxylic acids such as diacid, hydrogenated dimer acid and dimer acid; aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; trimellitic acid, Tri
- thermal polymerization initiator Commercially available products may be used as the thermal polymerization initiator.
- Adeka Opton® CP77 Adeka Opton CP66 (manufactured by ADEKA), CI-2539, CI-2624 (manufactured by Nippon Soda Co., Ltd.), Sun-Aid® SI-60L, Sun-Aid SI -80L, Sun Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.) and the like.
- the amount of the thermal polymerization initiator used is not particularly limited, but is usually in the range of 0.001 to 10 parts by mass with respect to 100 parts by mass of the total amount of solids in the cationic polymerizable composition.
- an initiator it is preferable to heat the cationically polymerizable composition of the present invention at 130 to 180 ° C. for 20 minutes to 1 hour.
- a cured product can be obtained by using a thermoplastic organic polymer (excluding a high molecular weight polymer (1D) having a weight average molecular weight of 1,000 to 1,000,000 having an epoxy group) as necessary. It is possible to improve the characteristics.
- a thermoplastic organic polymer excluding a high molecular weight polymer (1D) having a weight average molecular weight of 1,000 to 1,000,000 having an epoxy group
- thermoplastic organic polymer examples include polystyrene, polymethyl methacrylate, methyl methacrylate-ethyl acrylate copolymer, poly (meth) acrylic acid, styrene- (meth) acrylic acid copolymer, (meth) acrylic acid- Examples include methyl methacrylate copolymer, glycidyl (meth) acrylate-polymethyl (meth) acrylate copolymer, polyvinyl butyral, cellulose ester, polyacrylamide, and saturated polyester.
- the cationically polymerizable composition of the present invention is not particularly limited, and a solvent that can dissolve or disperse the components (1) and (2) that are usually used can be used.
- a solvent that can dissolve or disperse the components (1) and (2) that are usually used can be used.
- methyl ethyl ketone, methyl amyl ketone, Ketones such as diethyl ketone, acetone, methyl isopropyl ketone, methyl isobutyl ketone, cyclohexanone, 2-heptanone; ethyl ether, dioxane, tetrahydrofuran, 1,2-dimethoxyethane, 1,2-diethoxyethane, propylene glycol monomethyl ether, Ether solvents such as dipropylene glycol dimethyl ether; ester solvents such as methyl acetate, ethyl acetate, acetic acid-n-propyl, isopropyl acetate,
- BTX solvents aliphatic hydrocarbon solvents such as hexane, heptane, octane, cyclohexane; terpenes such as turpentine oil, D-limonene, and pinene Hydrocarbon oils; paraffinic solvents such as mineral spirits, Swazol # 310 (Cosmo Matsuyama Oil Co., Ltd.), Solvesso # 100 (Exxon Chemical Co., Ltd.); carbon tetrachloride, chloroform, trichloroethylene, methylene chloride, 1,2- Halogenated aliphatic hydrocarbon solvents such as dichloroethane; Halogenated aromatic hydrocarbon solvents such as chlorobenzene; Propylene carbonate, carbitol solvents, aniline, triethylamine, pyridine, acetic acid, acetonitrile, carbon disulfide, N, N- Examples thereof include dimethylformamide, N, N-dimethylacetamide, N-methylpyrrol
- the total amount of optional components other than (1) the cationic polymerizable organic substance mixture and (2) the energy ray sensitive cationic polymerization initiator depends on the use of the present invention, etc. From the viewpoint of further enhancing the effects of the present invention, (1) it is preferably 20 parts by mass or less, particularly 10 parts by mass or less with respect to 100 parts by mass of the cationically polymerizable organic substance mixture.
- the cationically polymerizable composition of the present invention has a water content of preferably 5% by mass or less, and more preferably 3% by mass or less from the viewpoints of curability, adhesiveness, and liquid storage stability. Too much moisture is not preferable because it may cause cloudiness or components may precipitate. The amount of water is measured by the method described in the examples described later.
- the cationic polymerizable composition of the present invention preferably has a viscosity of 200 mPa ⁇ s or less, more preferably 10 to 150 mPa ⁇ s, from the viewpoint of coating properties.
- This viscosity is a viscosity at 25 ° C., and is measured by the method described in Examples described later.
- the cationically polymerizable composition of the present invention is applied onto a supporting substrate by a known means such as a roll coater, a curtain coater, various types of printing, and immersion. Moreover, after once applying on support bases, such as a film, it can also transfer on another support base
- the material for the support substrate is not particularly limited and may be any commonly used material, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, butyryl cellulose, acetylpropionyl.
- inorganic materials such as glass
- Cellulose esters such as cellulose and nitrocellulose; polyamide; polyimide; polyurethane; epoxy resin; polycarbonate; polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxy Polyester such as ethane-4,4′-dicarboxylate, polybutylene terephthalate, etc .; polystyrene; polyethylene, polypropylene, polymethylpentene, etc.
- Polyolefins Vinyl compounds such as polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; Acrylic resins such as polymethyl methacrylate and polyacrylate; Polycarbonate; Polysulfone; Polyethersulfone; Polyetherketone; Polyetherimide; Polymer materials such as oxyethylene, norbornene resin, and cycloolefin polymer (COP) can be used.
- the support substrate may be subjected to surface activation treatment such as corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, laser treatment and the like.
- the cationic polymerizable composition of the present invention is cured by irradiation with active energy rays.
- active energy rays include ultraviolet rays, electron beams, X-rays, radiation, and high frequencies, and ultraviolet rays are the most economical.
- ultraviolet light source include an ultraviolet laser, a mercury lamp, a xenon laser, and a metal halide lamp.
- cationically polymerizable composition of the present invention include glasses, optical materials represented by imaging lenses, paints, coating agents, lining agents, inks, resists, liquid resists, adhesives, printing plates, and insulation. Varnish, insulating sheet, laminate, printed circuit board, sealing agent for molding of semiconductor devices, LED packages, liquid crystal inlets, organic EL, optical elements, electrical insulation, electronic components, separation membranes, etc. Materials, putty, glass fiber impregnating agent, sealant, semiconductor / solar cell passivation film, interlayer insulating film, protective film, prism lens sheet used for backlight of liquid crystal display, screen for projection TV, etc.
- the lens portion of a lens sheet such as a Fresnel lens sheet or a lenticular lens sheet, or a bag using such a sheet.
- a lens sheet such as a Fresnel lens sheet or a lenticular lens sheet, or a bag using such a sheet.
- Examples include light, optical lenses such as microlenses, optical elements, optical connectors, optical waveguides, optical molding casting agents, etc.
- substrates that can be used as coating agents include metals, wood, rubber, and plastics. , Glass, ceramic products and the like.
- cationic polymerizable composition of the present invention and the cured product obtained by curing the cationic polymerizable composition will be described in detail with reference to examples, evaluation examples, and comparative examples.
- “part” means “part by mass”
- “%” means “% by mass”.
- Examples 1-30, Comparative Examples 1-2 The components shown in [Table 1] to [Table 3] below were mixed thoroughly to obtain Example Compositions 1 to 30 and Comparative Compositions 1 and 2, respectively.
- Compound 1A-1 Resorcinol diglycidyl ether compound 1A-2: Diglycidyl o-phthalate compound 1A-3: Divinylbenzene oxide compound 1A-4: Phenyl glycidyl ether compound 1A-5: Styrene oxide compound 1A-6: EP-4100L ( Bisphenol A epoxy: manufactured by ADEKA) Compound 1A-7: Adeka Resin EP-4901L Compound 1A-8: Adeka Resin EP-4000L Compound 1A-9: TECHMORE VG-3101L Compound 1A-10: Adekaglycil ED-509S (manufactured by ADEKA) Compound 1A-11: Adekaglycilol ED-501 (manufactured by ADEKA) Compound 1A-12: Adekaglycil ED-529 (manufactured by ADEKA) Compound 1B-1: Neopentyl glycol diglycidyl ether compound 1B-2: Triglycid
- Example Compositions 1 to 30 and Comparative Compositions 1 to 2 were applied to a COP (cycloolefin polymer) film that had been subjected to corona discharge treatment, and then the film was laminated using a laminator.
- COP cycloolefin polymer
- a test piece was obtained by bonding to another COP (cycloolefin polymer) film that had been subjected to corona discharge treatment, and using an electrodeless ultraviolet lamp to irradiate with 1000 mJ / cm 2 of energy.
- a 90 degree peel test is performed on the obtained test piece.
- a specimen having a strength of 2.0 N / cm or more is indicated by ⁇ , a specimen having a strength of 1.0 to 2.0 N / cm is ⁇ , and a specimen having a strength of 1.0 N / cm or less.
- the results are shown in [Table 1] to [Table 5].
- (amount of water) The water content of each of the obtained practical compositions 1-30 and the comparative compositions 1-2 was measured according to the Karl Fischer method. The results are shown in the above [Table 1] to [Table 5].
Abstract
Description
中でも、フェノール類のグリシジルエーテル、アルコール性水酸基を2個以上有する芳香族化合物のグリシジルエーテル化物、多価フェノール類のグリシジルエーテル化物、安息香酸類のグリシジルエステル、多塩基酸類のグリシジルエステル、スチレンオキサイド又はジビニルベンゼンのエポキシ化物の群から選ばれる少なくとも一種含有することが組成物の低粘度化の観点から好ましい。
上記芳香族エポキシ化合物としては、エポキシ当量が80~500であるものが、硬化性に優れるため好ましい。 The aromatic epoxy compound (1A) refers to an epoxy compound containing an aromatic ring, and specific examples of the aromatic epoxy compound include monovalent phenols having at least one aromatic ring such as phenol, cresol, and butylphenol. Alternatively, mono / polyglycidyl etherified products of the alkylene oxide adducts such as bisphenol A, bisphenol F, or glycidyl etherified products of compounds obtained by further adding alkylene oxide to these and epoxy novolac resins; two such as resorcinol, hydroquinone and catechol Glycidyl ethers of aromatic compounds having the above phenolic hydroxyl groups; mono / polyglycidic aromatic compounds having two or more alcoholic hydroxyl groups such as benzenedimethanol, benzenediethanol, and benzenedibutanol Ruetherified products: glycidyl esters of polybasic acid aromatic compounds having two or more carboxylic acids such as phthalic acid, terephthalic acid, trimellitic acid, glycidyl esters of benzoic acids such as benzoic acid, toluic acid, naphthoic acid, styrene oxide Or the epoxidized substance of divinylbenzene etc. are mentioned.
Among them, glycidyl ethers of phenols, glycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups, glycidyl ethers of polyphenols, glycidyl esters of benzoic acids, glycidyl esters of polybasic acids, styrene oxide or divinyl It is preferable to contain at least one selected from the group of epoxidized benzene from the viewpoint of reducing the viscosity of the composition.
As the aromatic epoxy compound, those having an epoxy equivalent of 80 to 500 are preferable because of excellent curability.
ここで上記(1A)の量は(1D)に該当するものを含む量である。 The aromatic epoxy compound (1A) preferably contains at least one polyfunctional epoxy compound from the viewpoints of curability and adhesiveness. The cationically polymerizable composition of the present invention preferably contains 25 to 70 parts by mass of the polyfunctional aromatic epoxy compound (1A) with respect to 100 parts by mass of (1) the cationically polymerizable organic substance mixture, More preferably, 60 parts by mass is contained.
Here, the amount of (1A) includes the amount corresponding to (1D).
脂環式エポキシ化合物(1C)としては、エポキシ当量が80~500であるものが好ましい。 Specific examples of the alicyclic epoxy compound (1C) are obtained by epoxidizing a polyglycidyl etherified product of a polyhydric alcohol having at least one alicyclic ring or a cyclohexene or cyclopentene ring-containing compound with an oxidizing agent. And cyclopentene oxide-containing compounds. For example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexa Carboxylate, methylenebis (3,4-epoxycyclohexane), propane-2,2-diyl-bis (3,4-epoxycyclohexane), 2,2-bis (3,4-epoxycyclohexyl) propane, dicyclopentadiene diene Epoxide, ethylenebis (3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy -2-Epoxyethylcyclohexane, α-pinene oxide, limonene dioxide and the like.
As the alicyclic epoxy compound (1C), those having an epoxy equivalent of 80 to 500 are preferable.
脂肪族エポキシ化合物(1B)としては、エポキシ当量が80~500であるものが好ましい。 The aliphatic epoxy compound (1B) refers to an epoxy compound that is not classified as the aromatic epoxy compound (1A) or the alicyclic epoxy compound (1C). Specific examples of the aliphatic epoxy compound include aliphatic alcohols. Polyfunctional glycidyl ethers, monofunctional epoxy compounds such as glycidyl esters of alkyl carboxylic acids, polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof, polyfunctional glycidyl esters of aliphatic long-chain polybasic acids, etc. An epoxy compound is mentioned. Representative compounds include allyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, C 1 2-13 mixed alkyl glycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, Triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, hexaglycidyl ether of dipentaerythritol, diglycidyl ether of polyethylene glycol, glycidyl ether of polyhydric alcohol such as diglycidyl ether of polypropylene glycol, In addition, one or two or more alkyl polyhydric alcohols such as propylene glycol, trimethylolpropane and glycerin are used. Polyglycidyl ethers of polyether polyols obtained by adding emission oxide include diglycidyl esters of aliphatic long-chain dibasic acids. Furthermore, monoglycidyl ethers of higher aliphatic alcohols, glycidyl esters of higher fatty acids, epoxidized soybean oil, octyl epoxy stearate, butyl epoxy stearate, epoxidized soybean oil, epoxidized polybutadiene and the like.
As the aliphatic epoxy compound (1B), those having an epoxy equivalent of 80 to 500 are preferable.
ここで上記(1B)及び(1C)の量は(1D)に該当するものを含む量である。 Moreover, it is preferable that the cationically polymerizable composition of this invention contains at least 1 type of a polyfunctional epoxy compound as said aliphatic epoxy compound (1B) or alicyclic epoxy compound (1C). The cationically polymerizable composition of the present invention is (1) the sum of the polyfunctional aliphatic epoxy compound (1B) and the polyfunctional alicyclic epoxy compound (1C) with respect to 100 parts by mass of the cationically polymerizable organic substance mixture. The amount is preferably 10 to 65 parts by mass, particularly 20 to 50 parts by mass. The content of the polyfunctional aliphatic epoxy compound (1B) is preferably 10 to 45 parts by mass with respect to (1) 100 parts by mass of the cation polymerizable organic substance mixture, and the polyfunctional alicyclic epoxy compound The content of (1C) is preferably 0 to 10 parts by mass.
Here, the amounts of (1B) and (1C) are amounts including those corresponding to (1D).
ただし、ここで(1B)及び(1C)の量は上記(1D)に該当するものは除く量であり、(1A)の量は(1D)に該当するものを含む量である。
ここで、主成分とは、エポキシ化合物を数種類混ぜて、同じ種類のエポキシ化合物の合計量が一番多いものを言い、カチオン重合性有機物質混合物がエポキシ化合物以外のカチオン重合性有機物質を含む場合、数種類のエポキシ化合物のうち合計量が一番多い種類の該合計量は、エポキシ化合物以外のカチオン重合性有機物質の合計量よりも多いものとする。ここでいう各種類のエポキシ化合物の合計量には、(1D)に該当するものを含む。 (1) In the cationically polymerizable organic substance mixture, the aromatic epoxy compound (1A), the alicyclic epoxy compound (1C), the aliphatic epoxy compound (1B), a high weight average molecular weight of 1,000 to 1,000,000 having an epoxy group The molecular weight (1D), vinyl ether compound, or oxetane compound (1E) is used in an amount of (1) 25 to 70 parts by mass, especially 30 parts by mass of the aromatic epoxy compound (1A) with respect to 100 parts by mass of the cationic polymerizable organic substance mixture. ~ 60 parts by weight, alicyclic epoxy compound (1C) 0 to 45 parts by weight, especially 0 to 30 parts by weight, aliphatic epoxy compound (1B) 0 to 45 parts by weight, especially 10 to 40 parts by weight, having an epoxy group 0 to 50 parts by mass, particularly 0 to 15 parts by mass of a high molecular weight product (1D) having a weight average molecular weight of 1,000 to 1,000,000, vinyl ether compound Or 0 to 30 parts by mass, particularly 0 to 25 parts by mass of the oxetane compound (1E), and the sum of the alicyclic epoxy compound (1C) and the aliphatic epoxy compound (1B) is not 0, and the aromatic epoxy compound (1A ) Is preferably used as a main component.
Here, the amounts of (1B) and (1C) are amounts excluding those corresponding to the above (1D), and the amount of (1A) is an amount including those corresponding to (1D).
Here, the main component means a mixture of several types of epoxy compounds and the largest total amount of the same type of epoxy compounds, and the cationically polymerizable organic substance mixture contains a cationically polymerizable organic substance other than the epoxy compound. The total amount of the several types of epoxy compounds having the largest total amount is greater than the total amount of the cationically polymerizable organic material other than the epoxy compound. Here, the total amount of each type of epoxy compound includes those corresponding to (1D).
[A]r+[B]r-(式中、Aは陽イオン種を表し、Bは陰イオン種を表し、rは価数を表す。)で表される陽イオンと陰イオンの塩を挙げることができる。 The (2) energy ray-sensitive cationic polymerization initiator used in the present invention may be any compound that can release a substance that initiates cationic polymerization by irradiation with energy rays, but is preferably Is a double salt that is an onium salt that releases a Lewis acid upon irradiation with energy rays, or a derivative thereof. Representative examples of such compounds include the following general formula:
Listed is a salt of a cation and an anion represented by [A] r + [B] r- (wherein A represents a cation species, B represents an anion species, and r represents a valence). be able to.
[(R1)aQ]r+
で表すことができる。 Here, the cation [A] r + is preferably onium, and the structure thereof is, for example, the following general formula:
[(R 1 ) a Q] r +
It can be expressed as
[LXb]r-
で表すことができる。 Further, the anion [B] r- is preferably a halide complex, and the structure thereof is, for example, the following general formula:
[LX b ] r-
It can be expressed as
[LXb-1(OH)]r-
で表される構造のものも好ましく用いることができる。L,X,bは上記と同様である。また、その他用いることのできる陰イオンとしては、過塩素酸イオン(ClO4)-、トリフルオロメチル亜硫酸イオン(CF3SO3)-、フルオロスルホン酸イオン(FSO3)-、トルエンスルホン酸陰イオン、トリニトロベンゼンスルホン酸陰イオン、カンファースルフォネート、ノナフロロブタンスルフォネート、ヘキサデカフロロオクタンスルフォネート、テトラアリールボレート、テトラキス(ペンタフルオロフェニル)ボレート等を挙げることができる。 Further, the anion [B] r− is represented by the following general formula:
[LX b-1 (OH)] r-
The thing of the structure represented by can also be used preferably. L, X, and b are the same as described above. Other anions that can be used include perchlorate ion (ClO 4 ) − , trifluoromethyl sulfite ion (CF 3 SO 3 ) − , fluorosulfonate ion (FSO 3 ) − , and toluenesulfonate anion. , Trinitrobenzenesulfonate anion, camphor sulfonate, nonafluorobutane sulfonate, hexadecafluorooctane sulfonate, tetraarylborate, tetrakis (pentafluorophenyl) borate and the like.
シランカップリング剤としては、例えば、ジメチルジメトキシシラン、ジメチルジエトキシシラン、メチルエチルジメトキシシラン、メチルエチルジエトキシシラン、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリメトキシシランなどのアルキル官能性アルコキシシラン、ビニルトリクロロシラン、ビニルトリメトキシシラン、ビニルトリエトキシシラン、アリルトリメトキシシランなどのアルケニル官能性アルコキシシラン、3-メタクリロキシブロピルトリエトキシシラン、3-メタクリロキシブロピルトリメトキシシラン、3-メタクリロキシプロピルメチルジエトキシシラン、3-メタクリロキシプロピルメチルジメトキシシラン、2-メタクリロキシプロピルトリメトキシシラン、γ-グリシドキシプロピルトリメトキシシラン、γ-グリシドキシプロピルメチルジエトキシシラン、β-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン等のエポキシ官能性アルコキシシラン、N-β(アミノエチル)-γ-アミノプロピルトリメトキシシラン、γ-アミノプロピルトリエトキシシラン、N-フェニル-γ-アミノプロピルトリメトキシシラン等のアミノ官能性アルコキシシラン、γ-メルカプトプロピルトリメトキシシラン等のメルカプト官能性アルコキシシラン、チタンテトライソプロポキシド、チタンテトラノルマルブトキシドなどのチタンアルコキシド類、チタンジオクチロキシビス(オクチレングリコレート)、チタンジイソプロポキシビス(エチルアセトアセテート)などのチタンキレート類、ジルコウニウムテトラアセチルアセトネート、ジルコニウムトリブトキシモノアセチルアセトネートなどのジルコニウムキレート類、ジルコニウムトリブトキシモノステアレートなどのジルコニウムアシレート類、メチルトリイソシアネートシランなどのイソシアネートシラン類等を用いることができる。 In the cationically polymerizable composition of the present invention, a silane coupling agent can be used as necessary.
Examples of the silane coupling agent include dimethyldimethoxysilane, dimethyldiethoxysilane, methylethyldimethoxysilane, methylethyldiethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, and ethyltrimethoxysilane. Alkyl-functional alkoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, allyltrimethoxysilane and other alkenyl-functional alkoxysilanes, 3-methacryloxypropyltriethoxysilane, 3-methacryloxypropyltrimethoxy Silane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 2-methacryloxypropyltrimethoxysilane Epoxy-functional alkoxysilanes such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, N-β (aminoethyl) Aminofunctional alkoxysilanes such as γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, and mercaptofunctional alkoxysilanes such as γ-mercaptopropyltrimethoxysilane , Titanium alkoxides such as titanium tetraisopropoxide, titanium tetranormal butoxide, titanium chelates such as titanium dioctyloxybis (octylene glycolate), titanium diisopropoxybis (ethyl acetoacetate), di Kou tetra acetylacetonate, zirconium chelates such as zirconium tributoxy monoacetylacetonate, zirconium acylates such as zirconium tributoxy monostearate, an isocyanate silane such as methyl triisocyanate silane.
熱重合開始剤とは、加熱によりカチオン種又はルイス酸を発生する化合物として、スルホニウム塩、チオフェニウム塩、チオラニウム塩、ベンジルアンモニウム、ピリジニウム塩、ヒドラジニウム塩等の塩;ジエチレントリアミン、トリエチレントリアミン、テトラエチレンペンタミン等のポリアルキルポリアミン類;1,2-ジアミノシクロヘキサン、1,4-ジアミノ-3,6-ジエチルシクロヘキサン、イソホロンジアミン等の脂環式ポリアミン類;m-キシリレンジアミン、ジアミノジフェニルメタン、ジアミノジフェニルスルホン等の芳香族ポリアミン類;前記ポリアミン類と、フェニルグリシジルエーテル、ブチルグリシジルエーテル、ビスフェノールA-ジグリシジルエーテル、ビスフェノールF-ジグリシジルエーテル等のグリシジルエーテル類又はカルボン酸のグリシジルエステル類等の各種エポキシ樹脂とを常法によって反応させることによって製造されるポリエポキシ付加変性物;前記有機ポリアミン類と、フタル酸、イソフタル酸、ダイマー酸などのカルボン酸類とを常法によって反応させることによって製造されるアミド化変性物;前記ポリアミン類とホルムアルデヒド等のアルデヒド類及びフェノール、クレゾール、キシレノール、第三ブチルフェノール、レゾルシン等の核に少なくとも一個のアルデヒド化反応性場所を有するフェノール類とを常法によって反応させることによって製造されるマンニッヒ化変性物;多価カルボン酸(シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、ドデカン二酸、2-メチルコハク酸、2-メチルアジピン酸、3-メチルアジピン酸、3-メチルペンタン二酸、2-メチルオクタン二酸、3,8-ジメチルデカン二酸、3,7-ジメチルデカン二酸、水添ダイマー酸、ダイマー酸等の脂肪族ジカルボン酸類;フタル酸、テレフタル酸、イソフタル酸、ナフタレンジカルボン酸等の芳香族ジカルボン酸類;シクロヘキサンジカルボン酸等の脂環式ジカルボン酸類;トリメリト酸、トリメシン酸、ひまし油脂肪酸の三量体等のトリカルボン酸類;ピロメリット酸等のテトラカルボン酸類等)の酸無水物;ジシアンジアミド、イミダゾール類、カルボン酸エステル、スルホン酸エステル、アミンイミド等を挙げることができる。 In the cationic polymerizable composition of the present invention, a thermal polymerization initiator can be used as necessary.
Thermal polymerization initiator is a compound that generates a cationic species or Lewis acid by heating, such as a salt of sulfonium salt, thiophenium salt, thiolanium salt, benzylammonium, pyridinium salt, hydrazinium salt; diethylenetriamine, triethylenetriamine, tetraethylenepenta Polyalkylpolyamines such as min; alicyclic polyamines such as 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexane, isophoronediamine; m-xylylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone Aromatic polyamines such as; such polyamines; phenyl glycidyl ether, butyl glycidyl ether, bisphenol A-diglycidyl ether, bisphenol F-diglycidyl ether, etc. Polyepoxy addition-modified products produced by reacting various kinds of epoxy resins such as glycidyl ethers or glycidyl esters of carboxylic acids in a conventional manner; such organic polyamines as phthalic acid, isophthalic acid, dimer acid, etc. An amidation modified product produced by reacting carboxylic acids with a conventional method; at least one aldehyde reaction in the nucleus of polyamines and aldehydes such as formaldehyde and phenol, cresol, xylenol, tert-butylphenol, resorcin, etc. Mannich-modified products produced by reacting phenols having sex sites by a conventional method; polyvalent carboxylic acids (oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelain Acid, sebacic acid, Decanedioic acid, 2-methylsuccinic acid, 2-methyladipic acid, 3-methyladipic acid, 3-methylpentanedioic acid, 2-methyloctanedioic acid, 3,8-dimethyldecanedioic acid, 3,7-dimethyldecane Aliphatic dicarboxylic acids such as diacid, hydrogenated dimer acid and dimer acid; aromatic dicarboxylic acids such as phthalic acid, terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; trimellitic acid, Tricarboxylic acids such as trimesic acid and trimer of castor oil fatty acid; acid anhydrides of tetracarboxylic acids such as pyromellitic acid); dicyandiamide, imidazoles, carboxylic acid esters, sulfonic acid esters, amine imides and the like.
尚、上記支持基体に、コロナ放電処理、火炎処理、紫外線処理、高周波処理、グロー放電処理、活性プラズマ処理、レーザー処理等の表面活性化処理を行ってもよい。 The material for the support substrate is not particularly limited and may be any commonly used material, such as inorganic materials such as glass; diacetyl cellulose, triacetyl cellulose (TAC), propionyl cellulose, butyryl cellulose, acetylpropionyl. Cellulose esters such as cellulose and nitrocellulose; polyamide; polyimide; polyurethane; epoxy resin; polycarbonate; polyethylene terephthalate, polyethylene naphthalate, polybutylene terephthalate, poly-1,4-cyclohexanedimethylene terephthalate, polyethylene-1,2-diphenoxy Polyester such as ethane-4,4′-dicarboxylate, polybutylene terephthalate, etc .; polystyrene; polyethylene, polypropylene, polymethylpentene, etc. Polyolefins; Vinyl compounds such as polyvinyl acetate, polyvinyl chloride, and polyvinyl fluoride; Acrylic resins such as polymethyl methacrylate and polyacrylate; Polycarbonate; Polysulfone; Polyethersulfone; Polyetherketone; Polyetherimide; Polymer materials such as oxyethylene, norbornene resin, and cycloolefin polymer (COP) can be used.
Note that the support substrate may be subjected to surface activation treatment such as corona discharge treatment, flame treatment, ultraviolet treatment, high frequency treatment, glow discharge treatment, active plasma treatment, laser treatment and the like.
下記の[表1]~[表3]に示す配合で各成分を十分に混合して、各々実施組成物1~30、比較組成物1~2を得た。 [Examples 1-30, Comparative Examples 1-2]
The components shown in [Table 1] to [Table 3] below were mixed thoroughly to obtain Example Compositions 1 to 30 and Comparative Compositions 1 and 2, respectively.
化合物1A-1: レゾルシノールジグリシジルエーテル
化合物1A-2: ジグリシジルo-フタレート
化合物1A-3: ジビニルベンゼンオキサイド
化合物1A-4:フェニルグリシジルエーテル
化合物1A-5:スチレンオキサイド
化合物1A-6:EP-4100L(ビスフェノールAエポキシ:ADEKA社製)
化合物1A-7:アデカレジンEP-4901L
化合物1A-8:アデカレジンEP-4000L
化合物1A-9:TECHMORE VG-3101L
化合物1A-10:アデカグリシロールED-509S(ADEKA社製)
化合物1A-11:アデカグリシロールED-501(ADEKA社製)
化合物1A-12:アデカグリシロールED-529(ADEKA社製)
化合物1B-1:ネオペンチルグリコールジグリシジルエーテル
化合物1B-2:トリグリシジルトリス(2-ヒドロキシエチル)イソシアヌレート
化合物1B-3: 2-エチルヘキシルグリシジルエーテル
化合物1B-4:1,4-ブタンジオールジグリシジルエーテル
化合物1C-1:セロキサイド2021P(脂環式エポキシ;ダイセル社製)
化合物1C-2:メチル 3,4-エポキシシクロヘキサンカルボキシレート
化合物1C-3:セロキサイド3000(脂環式エポキシ;ダイセル社製)
化合物1D-1:GMA/MMA=3/7の共重合体(Mw:8000)
化合物1D-2:GMA/MMA=3/7の共重合体(Mw:15000)
化合物1E-1:アロンオキセタンOXT-101(東亞合成社製)
化合物1E-2:アロンオキセタンOXT-211(東亞合成社製)
化合物1E-3:ヒドロキシブチルビニルエーテル
化合物1E-4:1,4-ブタンジオールジビニルエーテル (1) As cationically polymerizable organic substances, the following compounds (1A-1) to (1A-12), (1B-1) to (1B-4), (1C-1) to (1C-3), ( 1D-1) to (1D-2) and (1E-1) to (1E-4) were used. These epoxy equivalents are shown together in [Table 1] to [Table 5].
Compound 1A-1: Resorcinol diglycidyl ether compound 1A-2: Diglycidyl o-phthalate compound 1A-3: Divinylbenzene oxide compound 1A-4: Phenyl glycidyl ether compound 1A-5: Styrene oxide compound 1A-6: EP-4100L ( Bisphenol A epoxy: manufactured by ADEKA)
Compound 1A-7: Adeka Resin EP-4901L
Compound 1A-8: Adeka Resin EP-4000L
Compound 1A-9: TECHMORE VG-3101L
Compound 1A-10: Adekaglycil ED-509S (manufactured by ADEKA)
Compound 1A-11: Adekaglycilol ED-501 (manufactured by ADEKA)
Compound 1A-12: Adekaglycil ED-529 (manufactured by ADEKA)
Compound 1B-1: Neopentyl glycol diglycidyl ether compound 1B-2: Triglycidyl tris (2-hydroxyethyl) isocyanurate compound 1B-3: 2-ethylhexyl glycidyl ether compound 1B-4: 1,4-butanediol diglycidyl Ether compound 1C-1: Celoxide 2021P (alicyclic epoxy; manufactured by Daicel)
Compound 1C-2: Methyl 3,4-epoxycyclohexanecarboxylate Compound 1C-3: Celoxide 3000 (alicyclic epoxy; manufactured by Daicel)
Compound 1D-1: Copolymer of GMA / MMA = 3/7 (Mw: 8000)
Compound 1D-2: Copolymer of GMA / MMA = 3/7 (Mw: 15000)
Compound 1E-1: Aron oxetane OXT-101 (manufactured by Toagosei Co., Ltd.)
Compound 1E-2: Aron oxetane OXT-211 (manufactured by Toagosei Co., Ltd.)
Compound 1E-3: Hydroxybutyl vinyl ether Compound 1E-4: 1,4-butanediol divinyl ether
化合物2-1:CPI-100P(サンアプロ社製) (2) The following compound (2-1) was used as the energy ray-sensitive cationic polymerization initiator.
Compound 2-1: CPI-100P (manufactured by San Apro)
上記実施例1~30で得られた実施組成物及び比較例1~2で得られた比較組成物について、下記評価を行った。結果を上記[表1]~[表5]に示す。
(粘度)
得られた実施組成物の1~30、比較組成物の1~2のそれぞれを25℃においてE型粘度計で粘度を測定した。結果を[表1]~[表5]に示す。
(硬化性)
得られた実施組成物1~30、比較組成物の1~2のそれぞれをPETフィルム上にバーコーターで3~6μmの厚さに塗布し、無電極紫外光ランプを用いて1000mJ/cm2のエネルギーを照射した。照射5分後に塗布面がタックフリーになっているものを◎、15分後にタックフリーになっているものを○、15分後でもタックが残っているものを×として評価した。結果を上記[表1]~[表5]に示す。
(耐温水試験)
得られた実施組成物1~30、比較組成物の1~2のそれぞれをTAC(トリアセチルセルロース)フィルムに塗布した後、ラミネーターを用いてCOP(シクロオレフィンポリマー)フィルムと貼り合わせ、COPフィルム側から無電極紫外光ランプを用いて1000mJ/cm2のエネルギーを照射して接着して試験片を得た。48時間後、2cm×4cmに試験片を切り出し、60℃の温水につけて経過を観察した。12、24時間後に試験片の状態を観察し、開始前と変化が見られないものを〇、端面にハガレが見られるものを△、フィルムの貼り合わせが剥がれて完全に脱落したものを×として評価した。結果を上記[表1]~[表5]に示す。
(接着性)
得られた実施組成物1~30、比較組成物の1~2のそれぞれを、一枚のコロナ放電処理を施したCOP(シクロオレフィンポリマー)フィルムに塗布した後、該フィルムを、ラミネーターを用いてコロナ放電処理を施したもう一枚のCOP(シクロオレフィンポリマー)フィルムと貼り合わせ、無電極紫外光ランプを用いて1000mJ/cm2のエネルギーを照射して接着して試験片を得た。得られた試験片の90度ピール試験を行い、強度が2.0N/cm以上あるものを◎、1.0~2.0N/cmであるものを〇、1.0N/cm以下であるものを×として評価した。結果を[表1]~[表5]に示す。
(水分量)
得られた実施組成物の1~30、比較組成物の1~2のそれぞれについて、カールフィッシャー法に従い水分量を測定した。結果を上記[表1]~[表5]に示す。 [Evaluation Examples 1-30, Comparative Evaluation Examples 1-2]
The following evaluations were performed on the working compositions obtained in Examples 1 to 30 and the comparative compositions obtained in Comparative Examples 1 and 2. The results are shown in the above [Table 1] to [Table 5].
(viscosity)
The viscosity of each of the obtained practical compositions 1-30 and the comparative compositions 1-2 was measured at 25 ° C. with an E-type viscometer. The results are shown in [Table 1] to [Table 5].
(Curable)
Each of the obtained Example Compositions 1 to 30 and Comparative Compositions 1 to 2 was applied onto a PET film with a bar coater to a thickness of 3 to 6 μm, and 1000 mJ / cm 2 using an electrodeless ultraviolet lamp. Irradiated with energy. Evaluation was made with ◎ indicating that the coated surface was tack-free after 5 minutes of irradiation, ◯ indicating that the surface was tack-free after 15 minutes, and × indicating that the tack remained after 15 minutes. The results are shown in the above [Table 1] to [Table 5].
(Hot water resistance test)
Each of the obtained working compositions 1 to 30 and the comparative compositions 1 to 2 was applied to a TAC (triacetylcellulose) film, and then bonded to a COP (cycloolefin polymer) film using a laminator, and the COP film side Then, an electrodeless ultraviolet light lamp was used to irradiate with an energy of 1000 mJ / cm 2 and adhere to obtain a test piece. After 48 hours, a test piece was cut out to 2 cm × 4 cm, and was put on 60 ° C. warm water and the progress was observed. Observe the condition of the test piece after 12 and 24 hours, ◯ if there is no change from before the start, △ if there is peeling on the end face, × if the film is peeled off and completely dropped evaluated. The results are shown in the above [Table 1] to [Table 5].
(Adhesiveness)
Each of the obtained Example Compositions 1 to 30 and Comparative Compositions 1 to 2 was applied to a COP (cycloolefin polymer) film that had been subjected to corona discharge treatment, and then the film was laminated using a laminator. A test piece was obtained by bonding to another COP (cycloolefin polymer) film that had been subjected to corona discharge treatment, and using an electrodeless ultraviolet lamp to irradiate with 1000 mJ / cm 2 of energy. A 90 degree peel test is performed on the obtained test piece. A specimen having a strength of 2.0 N / cm or more is indicated by ◎, a specimen having a strength of 1.0 to 2.0 N / cm is ○, and a specimen having a strength of 1.0 N / cm or less. Was evaluated as x. The results are shown in [Table 1] to [Table 5].
(amount of water)
The water content of each of the obtained practical compositions 1-30 and the comparative compositions 1-2 was measured according to the Karl Fischer method. The results are shown in the above [Table 1] to [Table 5].
From [Table 1] to [Table 5], it is clear that the cationically polymerizable composition of the present invention is excellent in curability, hot water resistance and adhesiveness.
Claims (9)
- (1)カチオン重合性有機物質として、芳香族エポキシ化合物(1A)を主成分として含有し、さらに脂肪族エポキシ化合物(1B)又は脂環式エポキシ化合物(1C)の少なくとも一方を含有するカチオン重合性有機物質混合物、及び(2)エネルギー線感受性カチオン重合開始剤を含有することを特徴とするカチオン重合性組成物。 (1) Cationic polymerizable organic substance containing an aromatic epoxy compound (1A) as a main component and further containing at least one of an aliphatic epoxy compound (1B) or an alicyclic epoxy compound (1C) A cationically polymerizable composition comprising an organic substance mixture and (2) an energy ray-sensitive cationic polymerization initiator.
- 上記脂肪族エポキシ化合物(1B)又は脂環式エポキシ化合物(1C)として、多官能エポキシ化合物を少なくとも一種含有することを特徴とする請求項1記載のカチオン重合性組成物。 The cationic polymerizable composition according to claim 1, wherein the aliphatic epoxy compound (1B) or the alicyclic epoxy compound (1C) contains at least one polyfunctional epoxy compound.
- 上記芳香族エポキシ化合物(1A)として、フェノール類のグリシジルエーテル、アルコール性水酸基を2 個以上有する芳香族化合物のグリシジルエーテル化物、多価フェノール類のグリシジルエーテル化物、安息香酸類のグリシジルエステル、多塩基酸類のグリシジルエステル、スチレンオキサイド又はジビニルベンゼンのエポキシ化物の群から選ばれる少なくとも一種含有することを特徴とする請求項1又は2に記載のカチオン重合性組成物。 Examples of the aromatic epoxy compound (1A) include glycidyl ethers of phenols, glycidyl ethers of aromatic compounds having two or more alcoholic hydroxyl groups, glycidyl ethers of polyhydric phenols, glycidyl esters of benzoic acids, polybasic acids The cationic polymerizable composition according to claim 1, comprising at least one selected from the group of epoxidized products of glycidyl ester, styrene oxide, or divinylbenzene.
- 上記芳香族エポキシ化合物(1A)として、多官能エポキシ化合物を少なくとも一種含有することを特徴とする請求項1~3のいずれか一項に記載のカチオン重合性組成物。 4. The cationically polymerizable composition according to claim 1, wherein the aromatic epoxy compound (1A) contains at least one polyfunctional epoxy compound.
- 上記芳香族エポキシ化合物(1A)のエポキシ当量が80~500であることを特徴とする請求項1~4のいずれか一項に記載のカチオン重合性組成物。 5. The cationically polymerizable composition according to claim 1, wherein the aromatic epoxy compound (1A) has an epoxy equivalent of 80 to 500.
- (1)カチオン重合性有機物質として、さらにエポキシ基を有する重量平均分子量1000~1000000の高分子量体(1D)、ビニルエーテル化合物又はオキセタン化合物(1E)の少なくとも一方を含む請求項1~5のいずれか一項に記載のカチオン重合性組成物。 (1) The cationically polymerizable organic substance further comprises at least one of a high molecular weight substance (1D) having an epoxy group and a weight average molecular weight of 1,000 to 1,000,000, a vinyl ether compound or an oxetane compound (1E). The cationically polymerizable composition according to one item.
- (2)エネルギー線感受性カチオン重合開始剤が、[A]r+[B]r-(式中、Aは陽イオン種を表し、Bは陰イオン種を表し、rは価数を表す。)で表される陽イオンと陰イオンの塩である請求項1~6のいずれか一項に記載のカチオン重合性組成物。 (2) The energy ray sensitive cationic polymerization initiator is [A] r + [B] r− (wherein A represents a cationic species, B represents an anionic species, and r represents a valence). The cationically polymerizable composition according to any one of claims 1 to 6, which is a cation and anion salt represented.
- 水分量が5質量%以下であることを特徴とする請求項1~7のいずれか一項に記載のカチオン重合性組成物。 The cationically polymerizable composition according to any one of claims 1 to 7, wherein the water content is 5% by mass or less.
- 請求項1~8のいずれか一項に記載のカチオン重合性組成物からなることを特徴とする接着剤。
An adhesive comprising the cationically polymerizable composition according to any one of claims 1 to 8.
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