WO2014112819A1 - Apparatus and method for continuous plating - Google Patents

Apparatus and method for continuous plating Download PDF

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Publication number
WO2014112819A1
WO2014112819A1 PCT/KR2014/000496 KR2014000496W WO2014112819A1 WO 2014112819 A1 WO2014112819 A1 WO 2014112819A1 KR 2014000496 W KR2014000496 W KR 2014000496W WO 2014112819 A1 WO2014112819 A1 WO 2014112819A1
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WO
WIPO (PCT)
Prior art keywords
plating
cathode roller
cathode
plating liquid
plated material
Prior art date
Application number
PCT/KR2014/000496
Other languages
French (fr)
Korean (ko)
Inventor
정광춘
온웅구
한영구
윤광백
Original Assignee
주식회사 잉크테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 주식회사 잉크테크 filed Critical 주식회사 잉크테크
Priority to CN201480016290.7A priority Critical patent/CN105143522B/en
Publication of WO2014112819A1 publication Critical patent/WO2014112819A1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B17/00—Exercising apparatus combining several parts such as ladders, rods, beams, slides
    • A63B17/02—Exercising apparatus combining several parts such as ladders, rods, beams, slides rigidly combined
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B21/00—Exercising apparatus for developing or strengthening the muscles or joints of the body by working against a counterforce, with or without measuring devices
    • A63B21/02—Exercising apparatus for developing or strengthening the muscles or joints of the body by working against a counterforce, with or without measuring devices using resilient force-resisters
    • A63B21/04—Exercising apparatus for developing or strengthening the muscles or joints of the body by working against a counterforce, with or without measuring devices using resilient force-resisters attached to static foundation, e.g. a user
    • A63B21/0442—Anchored at one end only, the other end being manipulated by the user
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63B—APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT
    • A63B23/00—Exercising apparatus specially adapted for particular parts of the body
    • A63B23/035—Exercising apparatus specially adapted for particular parts of the body for limbs, i.e. upper or lower limbs, e.g. simultaneously
    • A63B23/0355—A single apparatus used for either upper or lower limbs, i.e. with a set of support elements driven either by the upper or the lower limb or limbs
    • A63B23/03558—Compound apparatus having multiple stations allowing an user to exercise different limbs
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Definitions

  • the present invention relates to a continuous plating apparatus and a continuous plating method, and more particularly, to a continuous plating apparatus and a continuous plating method capable of high-speed plating and maximize the efficiency.
  • a horizontal plating method for continuously plating the plated material as disclosed in Patent Document 1.
  • Such a conventional plating method includes a plating bath in which a plating solution is stored and a plating material is input and discharged, an insoluble anode, a transfer roller for transferring the plating material horizontally through the plating bath, and positioned in front of the plating bath. It is made by a plating apparatus including a cathode roller for charging the plating material by the cathode electric, the inlet and outlet of the plating bath is provided with a guide roller to guide the plated body to be smoothly transferred.
  • Such a conventional continuous plating method may cause scratches such as scratches on the surface of the plated material when the cathode roller is contaminated by the plating liquid, thereby providing a cause of product defects.
  • the plating takes a long time, there is a problem that the plating efficiency is lowered.
  • an object according to an aspect of the present invention is to form a plating layer at a time as large as possible on the plated material, and to perform plating in a faster time to maximize the plating efficiency. It is to provide a continuous plating apparatus and a continuous plating method.
  • At least the outer surface is electrically conductive, the outer surface, the cathode roller provided to contact with the plated material, and electrically connected to the outer surface of the cathode roller to apply cathode electricity to the outer surface
  • a first power source an injection unit spaced apart from the cathode roller, and injecting a plating liquid containing anode ions in the direction of the plating material, and a first storage tank connected to the injection unit and providing the plating liquid to the injection unit.
  • a continuous plating apparatus comprising a.
  • the injection unit may be located at least opposed to the surface in contact with the cathode roller of the plated material.
  • the injection unit may be provided in plurality.
  • the cathode roller and the injection unit further comprises a process chamber accommodated, the process chamber is filled with a plating liquid containing the positive ion to the plated material may be deposited in the filled plating liquid have.
  • it may further include an anode plate located in the process chamber, and a second power source electrically connected to the anode plate to apply positive electricity to the anode plate.
  • the cathode roller may be arranged to extend in a direction perpendicular to the ground.
  • the cathode roller may be arranged to extend in a direction horizontal to the ground.
  • the process chamber includes a first gate and a second gate, the plated material is disposed to pass through the first gate and the second gate, the plating liquid drained outside the process chamber
  • the second reservoir to be stored may be located.
  • it may further comprise a positive ion generating unit provided in the first reservoir.
  • the step of applying the cathode electricity to the cathode roller having at least the outer surface is electrically conductive, and providing a plated material to the cathode roller in continuous contact with the outer surface of the cathode roller,
  • a continuous plating method comprising the step of spraying a plating liquid containing anode ions in the direction of the plated material by an injection unit positioned to be spaced apart from the cathode roller.
  • the plating liquid can be sprayed on at least a surface of the plating material in contact with the cathode roller.
  • a plurality of spray units may be provided to simultaneously spray a plating liquid onto the surface of the plated material to be continuously processed.
  • the step of injecting the plating liquid, the cathode roller and the injection unit may be performed in a state in which the plating liquid containing the positive ion.
  • the cathode roller and the injection unit may further include providing a positive ion to the plating liquid deposited.
  • the cathode roller may be arranged to extend in a direction perpendicular to the ground.
  • the cathode roller may be arranged to extend in a direction horizontal to the ground.
  • the plating area By spraying a plating liquid with a large area on a portion of the plated material in contact with the cathode roller by the injection unit, the plating area may be increased, and the plating time may be reduced to maximize efficiency.
  • the spraying of the plating liquid by the spraying unit may circulate the plating liquid in the direction of the plated material to prevent a decrease in the concentration of the positive ion in a portion in contact with the cathode roller of the plated material, thereby forming a uniform plating layer.
  • the anode plate disposed in the process chamber can supplement the anode with the plating liquid.
  • FIG. 1 is a plan view schematically showing a continuous plating apparatus according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing an example of a plated material.
  • 3A and 3B are diagrams showing plating regions of Comparative Examples and Examples.
  • FIG. 4 is a plan view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
  • FIG. 5 is a plan view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
  • FIG. 6 is a plan view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
  • FIG. 7 is a side view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
  • FIG. 1 is a plan view schematically showing a continuous plating apparatus according to an embodiment of the present invention.
  • the continuous plating apparatus includes a cathode roller 1 and an injection unit 2.
  • the cathode roller 1 and the injection unit 2 may be provided in plural numbers, but are not necessarily limited thereto, and may be provided with at least one.
  • the plated material 3 including the plated pattern passes between the plurality of cathode rollers 1.
  • the plated material 3 may include a base member 31 in the form of a film and a plurality of pads 32 formed on a surface thereof.
  • a plating layer may be formed at a contact point between the pad 32 and the cathode roller 1.
  • the pattern of the pad 32 is a plated pattern.
  • the pads 32 may be formed on both sides of the base member 31 as shown in FIG. 2, which may vary depending on the arrangement of the cathode roller 1. That is, since plating is performed at the contact with the cathode roller 1, the pads 32 may be formed on the surface contacting the cathode roller 1.
  • the plated material 3 may be transported through the cathode rollers 1 in a roll-to-roll manner.
  • the cathode roller 1 is formed so that at least an outer surface thereof is electrically conductive, and the outer surface having electrical conductivity contacts the pads 32 of the plated material 3 so that the pads 32 of the plated material 3 ) A plating layer can be formed.
  • the cathode rollers 1 may be arranged such that their axis of rotation is perpendicular to the ground, so that the plated material 3 passing between the cathode rollers 1 is also perpendicular to the ground. To be transported.
  • the cathode rollers 1 may be disposed to be inclined to the ground in a state in which the plated surface of the plated material 3 is perpendicular to the ground.
  • the present invention is not necessarily limited thereto, and the cathode rollers 1 may be disposed in a direction horizontal to the ground so that the surface on which the plated material 3 is plated may be horizontal to the ground.
  • the first power source 11 is electrically connected to at least an outer surface of the cathode roller 1.
  • the first power source 11 applies cathode electricity to at least an outer surface of the cathode roller 1.
  • the first power source 11 is preferably located outside the continuous plating apparatus.
  • the injection unit 2 is positioned to be spaced apart from the cathode roller 1 and injects a plating liquid containing anode ions in the direction of the plated material 3.
  • the injection unit 2 may be positioned at least opposite to a surface of the plated material 3 which is in contact with the cathode roller, and as shown in FIG. 1, the cathode roller 1 may be formed of a plated material ( In the case of the structure in contact with both sides of 3), the injection unit (2) may also be positioned to face the plated both sides of the plated material (3).
  • the injection unit 2 is formed to inject the plating liquid in the direction of the plated material, and each of the injection units 2 includes a nozzle provided to spray the plating liquid.
  • the injection units 2 may be connected to the first reservoir 21, and a pressure pump 22 may be interposed between the first reservoir 21 and the injection units 2.
  • FIG. 1 shows that all the injection units 2 are connected to one first reservoir 21 and one pressure pump 22, the present invention is not limited thereto, and the injection units 2 may be divided into sections. It can be grouped to connect to separate pumps and / or reservoirs.
  • the first reservoir 21 stores a plating liquid containing the positive ion, and the plating liquid is pressurized through the pressure pump 22 to be supplied to the injection units 2.
  • the first reservoir 21 may further include a cathode ion generator 23 to generate cathode ions so that the cathode ions may be sufficiently provided in the plating solution.
  • the positive ion generating unit 23 may be a metal for replenishing the consumed positive ion generating metal, thereby maintaining a uniform concentration of the positive ion in the first reservoir 21.
  • the injection unit 2 by injecting the plating liquid to a large area for the portion in contact with the cathode roller 1 of the material to be plated (3) by the injection unit 2 not only widens the plating area The plating time can be reduced to maximize the efficiency.
  • FIG. 3A shows the plating area 33a according to another continuous plating apparatus filed by the applicant, 10 ?? 2012 ?? 0049803, and FIG. 3B shows the plating area 33b according to an embodiment of the present invention. It is shown.
  • a plating method according to another continuous plating apparatus which is filed by the applicant, according to 10 ?? 2012 ?? 0049803, uses a cathode knife to process a plating liquid containing an anode ion using a water knife method.
  • a cathode knife By spraying only on the part where (1) and the to-be-plated material 3 contact, plating is locally performed only to a part of the to-be-plated material 3. Therefore, the plating area 33a is formed very small.
  • the plurality of cathode rollers (1) is avoided because the injection unit (2) injects the plating liquid over a very large surface of the plated material (3)
  • the plating area 33b can be formed over a very large area by making contact with the plating material 3. Accordingly, the plating efficiency can also be increased.
  • Figure 4 is a plan sectional view showing a continuous plating apparatus according to another embodiment of the present invention.
  • One embodiment of the continuous plating apparatus according to FIG. 4 further includes a process chamber 51.
  • the process chamber 51 is filled with the plating liquid 24 containing anode ions, and the plating material 3 is in a state in which the plating liquid 24 is deposited.
  • the cathode rollers 1 and the injection units 2 are also located in the process chamber 51 and are deposited in the plating liquid 24.
  • the process chamber 51 is provided with a first gate 51a and a second gate 51b at both ends, and the plated material 3 passes through the first gate 51a and the second gate 51b. It is arranged in the process chamber 51 so as to.
  • the plating is performed at the contact point of the plated material 3 and the cathode roller 1 by the plating liquid 24 filled in the process chamber 51, in which case the injection unit ( 2), the plating liquid containing the positive ion is injected in the direction of the plated material 3 to further increase the plating efficiency.
  • the injection of the plating liquid by the injection units 2 functions not only to circulate the plating liquid in the direction of the plating material 3 but also to supplement the positive electrode ions with respect to the plating liquid 24 filled in the process chamber 51. You can do it. Since the continuous plating process may be performed at a very high speed, the positive electrode ions of the plating solution 24 filled in the process chamber 51 may be consumed very quickly. Therefore, it is possible to smoothly maintain the plating efficiency by supplementing the anode ions consumed in the plating liquid 24 by the injection of the plating liquid by the spraying units 2.
  • anode plates 4 may be disposed in the process chamber 51, and the anode plates 4 may be electrically connected to a second power source 41 located outside the process chamber 51.
  • the second power supply 41 may apply anode electricity to the anode plates 4, thereby supplementing anode ions consumed in the plating solution 24.
  • FIG. 5 is a plan sectional view showing a continuous plating apparatus according to another embodiment of the present invention.
  • One embodiment of the continuous plating apparatus according to FIG. 5 may include a frame 50 constituting the outer body of the entire apparatus.
  • the frame 50 has a shape of a casing having a substantially rectangular cross section, in which the first partition 61 and the second partition 62 are installed to face each other in a vertical direction when viewed in FIG. 5.
  • a third partition 63 is installed between the first partition 61 and the second partition 62 in a horizontal direction as shown in FIG. 5.
  • the interior of the frame 50 may be partitioned into a plurality of compartments by the first partition wall 61, the second partition wall 62, and the third partition wall 63.
  • the process chamber 51 and the moving chamber 52 are partitioned between the first partition wall 61 and the second partition wall 62 by the third partition wall 63 horizontally disposed in the horizontal direction as seen in FIG. 5.
  • a first storage room 53 is partitioned and a second storage room 54 is partitioned on a left side of the second partition wall 62.
  • the driving roller 71 is located in the first storage chamber 53, and the driven roller 72 is located in the second storage chamber 54.
  • the driving roller 71 is a roller that is wound around the plated material 3 extending in one direction while having a constant width and is rotated by receiving power by a rotating means.
  • the driving roller 71 performs a function of transferring the plated material 3 so that the plating layer can be continuously formed on the plated material 3.
  • the driving roller 71 may be disposed perpendicular to the ground.
  • the driven roller 72 is disposed perpendicular to the ground and is spaced apart from the driving roller 71 by a predetermined distance.
  • the plated material 3 is wound around the outer circumferential surface of the driven roller 72. As the drive roller 71 rotates, the driven roller 72 rotates together so that the plated material 3 has a constant path. Allow it to move.
  • the moving chamber 52 may be provided with a plurality of tension applying rollers 73 so that a certain amount of tension is applied to the plated material 3 to be transferred.
  • Process chamber 51 is the same as the structure of the embodiment shown in Figure 4, so a detailed description thereof will be omitted.
  • the first reservoir 21 and the pressure pump 22 described above may be located outside the frame 50.
  • a first power source electrically connected to the cathode rollers 1 and a second power source electrically connected to the anode plates 4 are omitted, which may be applicable to the embodiment according to FIG. 4.
  • a first drain pipe 25a may be connected to the first storage chamber 53, and a second drain pipe 25b may be connected to the second storage chamber 54.
  • the first drain pipe 25a and the second drain pipe 25b are connected to a second storage tank 25 provided outside the frame 50.
  • the plating liquid 24 accommodated in the process chamber 51 may partially flow out through the first gate 51a and the second gate 51b during the plating process.
  • the plating liquid 24 leaked out of the process chamber 51 may be drained through the first drain pipe 25a and the second drain pipe 25b and stored in the second storage tank 25.
  • the plating solution stored in the second storage tank 25 can be used again in the plating process after adjusting the concentration of the positive ion.
  • the present invention is not necessarily limited thereto, and as shown in FIG. 6 without using the second reservoir 25, the first drain pipe 25a and the second drain pipe 25b may be disposed in the first reservoir 21. Can be connected directly. In this case, the drained plating solution may be replenished with anode ions through the anode ion generator 23, after which the plating solution may be circulated into the process chamber 51.
  • the roll which consists of the to-be-plated material 3 of the example as shown in FIG. 2 is prepared. And it arrange
  • FIG. 5 the roll of this to-be-plated material 3 may pass through the drive roller 71, the tension provision rolls 73, the driven roller 72, and the some cathode roller 1.
  • the plating solution 24 including the positive ion is filled in the process chamber 51, and then the driving roller 71 is turned to perform the plating process.
  • cathode electricity is applied to the cathode rollers 1 and anode electricity is applied to the anode plates 4.
  • the pressure pump 22 is operated to inject the plating liquid 3 containing the positive ions into the plated material 3 through the injection units 2.
  • the plating liquid flowing out of the process chamber 51 through the first gate 51a and the second gate 51b is drained to the second storage tank 25 through the first drain pipe 25a and the second drain pipe 25b. Stored.
  • rollers including the cathode rollers 1 are erected in a direction perpendicular to the ground, and are horizontally transferred while the plated material 3 is erected in a direction perpendicular to the ground, and the plating is performed.
  • the rollers including the cathode rollers 1 are disposed in a direction horizontal to the ground, and the plated material 3 is placed on the ground. The plate may be transferred horizontally while being laid in the horizontal term direction.
  • the plated material 3 is introduced into the plating bath 55 and then drawn out.
  • rollers 74 for tensioning and changing direction are provided. Can be installed.
  • the plating liquid 24 is filled, and a plurality of cathode rollers 1 are disposed in the plating liquid 24, and a plurality of cathode rollers 1 are disposed above and / or below the cathode rollers 1.
  • Injection units 2 are arranged.
  • the anode plates 4 may be further disposed in the plating bath 55.
  • the present invention is not necessarily limited thereto, the gates are formed at both ends of the plating tank 55 adjacent to the cathode roller 1 so that the plating material 3 is formed in a substantially straight shape. 55).
  • Such a horizontal continuous plating apparatus can also exhibit all the effects of the present invention described above.

Abstract

The present invention relates to an apparatus and a method for continuous plating, the apparatus comprising: cathode rollers each having at least the outer surface thereof which is electrically conductive, and disposed so as to come into contact with an object to be plated; a first power source electrically connected to the outer surface of the cathode rollers so as to apply negative electricity thereto; spray units, positioned at a distance from the cathode rollers, for spraying a plating solution containing positive ions in the direction of the object to be plated; and a first storage tank, connected to the spray units, for supplying the plating solution to the spray units.

Description

연속 도금 장치 및 연속 도금 방법Continuous Plating Apparatus and Continuous Plating Method
본 발명은 연속 도금 장치 및 연속 도금 방법에 관한 것으로, 더욱 상세하게는 고속 도금이 가능하고 효율을 극대화할 수 있는 연속 도금 장치 및 연속 도금 방법에 관한 것이다.The present invention relates to a continuous plating apparatus and a continuous plating method, and more particularly, to a continuous plating apparatus and a continuous plating method capable of high-speed plating and maximize the efficiency.
일반적으로 PCB기판과 같은 박판형상의 제품을 도금하는 경우에는 특허문헌1에 개시된 바와 같이 피도금재를 연속적으로 도금시키는 수평식 도금방식을 사용하였다. 이러한 종래의 도금 방법은 도금액이 저장되며 피도금재가 투입, 배출되는 도금조와, 불용성 애노드와, 피도금재가 상기 도금조를 통과해 수평방향으로 이송되도록 하는 이송롤러와, 도금조의 전방으로 위치되어 피도금재를 음극 전기로 대전시키는 캐소드 롤러를 포함하는 도금장치에 의해 이루어지며, 상기 도금조의 투입구와 배출구에는 피도금체가 원활하게 이송되도록 가이드하는 가이드롤러가 구비된다. In general, in the case of plating a thin plate-like product such as a PCB substrate was used a horizontal plating method for continuously plating the plated material as disclosed in Patent Document 1. Such a conventional plating method includes a plating bath in which a plating solution is stored and a plating material is input and discharged, an insoluble anode, a transfer roller for transferring the plating material horizontally through the plating bath, and positioned in front of the plating bath. It is made by a plating apparatus including a cathode roller for charging the plating material by the cathode electric, the inlet and outlet of the plating bath is provided with a guide roller to guide the plated body to be smoothly transferred.
이러한 종래의 연속 도금 방법은 캐소드 롤러가 도금액에 의해 오염될 경우 피도금재의 표면에 스크래치 등의 흠을 일으켜 제품 불량의 원인을 제공할 수 있다. 또한 도금 시간이 오래 걸리기 때문에 도금 효율이 떨어지는 문제가 있었다.Such a conventional continuous plating method may cause scratches such as scratches on the surface of the plated material when the cathode roller is contaminated by the plating liquid, thereby providing a cause of product defects. In addition, since the plating takes a long time, there is a problem that the plating efficiency is lowered.
종래의 연속 도금 방법으로 대한민국 공개특허 제10-2006-0115536호에 개시된 방법이 있다.There is a method disclosed in the Republic of Korea Patent Publication No. 10-2006-0115536 as a conventional continuous plating method.
종래기술의 문제 및/또는 한계를 극복하기 위한 것으로, 본 발명의 일 측면에 따른 목적은 피도금재에 가능한 넓은 면적으로 도금층을 일시에 형성하고, 보다 빠른 시간에 도금을 수행해 도금 효율을 극대화시킬 수 있는 연속 도금 장치 및 연속 도금 방법을 제공하기 위한 것이다.In order to overcome the problems and / or limitations of the prior art, an object according to an aspect of the present invention is to form a plating layer at a time as large as possible on the plated material, and to perform plating in a faster time to maximize the plating efficiency. It is to provide a continuous plating apparatus and a continuous plating method.
본 발명의 일 측면에 따르면, 적어도 외면이 전기 전도성을 갖고, 상기 외면이, 피도금재와 접하도록 구비된 캐소드 롤러와, 상기 캐소드 롤러의 상기 외면과 전기적으로 연결되어 상기 외면에 음극 전기를 인가하는 제1전원과, 상기 캐소드 롤러와 이격되게 위치하고 양극 이온을 포함하는 도금액을 상기 피도금재의 방향으로 분사하는 분사 유닛과, 상기 분사 유닛에 연결되고 상기 도금액을 상기 분사 유닛에 제공하는 제1저장조를 포함하는 연속 도금 장치가 제공된다.According to an aspect of the present invention, at least the outer surface is electrically conductive, the outer surface, the cathode roller provided to contact with the plated material, and electrically connected to the outer surface of the cathode roller to apply cathode electricity to the outer surface A first power source, an injection unit spaced apart from the cathode roller, and injecting a plating liquid containing anode ions in the direction of the plating material, and a first storage tank connected to the injection unit and providing the plating liquid to the injection unit. Provided is a continuous plating apparatus comprising a.
본 발명의 다른 특징에 의하면, 상기 분사 유닛은 적어도 상기 피도금재의 상기 캐소드 롤러와 접하는 면에 대향되게 위치할 수 있다.According to another feature of the invention, the injection unit may be located at least opposed to the surface in contact with the cathode roller of the plated material.
본 발명의 또 다른 특징에 의하면, 상기 분사 유닛은 복수 개가 구비될 수 있다.According to another feature of the invention, the injection unit may be provided in plurality.
본 발명의 또 다른 특징에 의하면, 상기 캐소드 롤러 및 분사 유닛이 수용된 공정실을 더 포함하고, 상기 공정실에 상기 양극 이온을 포함하는 도금액이 충진되어 상기 피도금재가 상기 충진된 도금액에 침적될 수 있다.According to another feature of the invention, the cathode roller and the injection unit further comprises a process chamber accommodated, the process chamber is filled with a plating liquid containing the positive ion to the plated material may be deposited in the filled plating liquid have.
본 발명의 또 다른 특징에 의하면, 상기 공정실에 위치한 애노드 플레이트와, 상기 애노드 플레이트와 전기적으로 연결되어 상기 애노드 플레이트에 양극 전기를 인가하는 제2전원을 더 포함할 수 있다.According to another feature of the invention, it may further include an anode plate located in the process chamber, and a second power source electrically connected to the anode plate to apply positive electricity to the anode plate.
본 발명의 또 다른 특징에 의하면, 상기 캐소드 롤러는 지면에 수직한 방향으로 연장되도록 배치될 수 있다.According to another feature of the invention, the cathode roller may be arranged to extend in a direction perpendicular to the ground.
본 발명의 또 다른 특징에 의하면, 상기 캐소드 롤러는 지면에 수평한 방향으로 연장되도록 배치될 수 있다.According to another feature of the invention, the cathode roller may be arranged to extend in a direction horizontal to the ground.
본 발명의 또 다른 특징에 의하면, 상기 공정실은 제1게이트 및 제2게이트를 포함하고, 상기 피도금재는 상기 제1게이트 및 제2게이트를 관통하도록 배치되며, 상기 공정실 외측에 배수된 상기 도금액이 저장되는 제2저장조가 위치할 수 있다.According to another feature of the invention, the process chamber includes a first gate and a second gate, the plated material is disposed to pass through the first gate and the second gate, the plating liquid drained outside the process chamber The second reservoir to be stored may be located.
본 발명의 또 다른 특징에 의하면, 상기 제1저장조에 구비된 양극 이온 생성부를 더 포함할 수 있다.According to another feature of the invention, it may further comprise a positive ion generating unit provided in the first reservoir.
본 발명의 다른 일 측면에 따르면, 적어도 외면이 전기 전도성을 갖는 캐소드 롤러에 음극 전기를 인가하는 단계와, 피도금재를 상기 캐소드 롤러의 외면에 접하도록 연속적으로 상기 캐소드 롤러에 제공하는 단계와, 상기 캐소드 롤러와 이격되게 위치한 분사 유닛에 의해 양극 이온을 포함하는 도금액을 상기 피도금재의 방향으로 분사하는 단계를 포함하는 연속 도금 방법이 제공된다.According to another aspect of the invention, the step of applying the cathode electricity to the cathode roller having at least the outer surface is electrically conductive, and providing a plated material to the cathode roller in continuous contact with the outer surface of the cathode roller, There is provided a continuous plating method comprising the step of spraying a plating liquid containing anode ions in the direction of the plated material by an injection unit positioned to be spaced apart from the cathode roller.
본 발명의 다른 특징에 의하면, 상기 도금액은 적어도 상기 피도금재의 상기 캐소드 롤러와 접하는 면에 대하여 분사할 수 있다.According to another feature of the present invention, the plating liquid can be sprayed on at least a surface of the plating material in contact with the cathode roller.
본 발명의 또 다른 특징에 의하면, 상기 분사 유닛은 복수 개가 구비되어 연속적으로 진행하는 피도금재의 표면에 동시에 도금액을 분사할 수 있다.According to still another feature of the present invention, a plurality of spray units may be provided to simultaneously spray a plating liquid onto the surface of the plated material to be continuously processed.
본 발명의 또 다른 특징에 의하면, 상기 도금액을 분사하는 단계는, 상기 캐소드 롤러 및 분사 유닛은 상기 양극 이온을 포함하는 도금액이 침적된 상태에서 행해질 수 있다.According to another feature of the invention, the step of injecting the plating liquid, the cathode roller and the injection unit may be performed in a state in which the plating liquid containing the positive ion.
본 발명의 또 다른 특징에 의하면, 상기 캐소드 롤러 및 분사 유닛이 침적된 도금액에 양극 이온을 제공하는 단계를 더 포함할 수 있다.According to another feature of the present invention, the cathode roller and the injection unit may further include providing a positive ion to the plating liquid deposited.
본 발명의 또 다른 특징에 의하면, 상기 캐소드 롤러는 지면에 수직한 방향으로 연장되도록 배치될 수 있다.According to another feature of the invention, the cathode roller may be arranged to extend in a direction perpendicular to the ground.
본 발명의 또 다른 특징에 의하면, 상기 캐소드 롤러는 지면에 수평한 방향으로 연장되도록 배치될 수 있다.According to another feature of the invention, the cathode roller may be arranged to extend in a direction horizontal to the ground.
분사 유닛에 의해 피도금재의 상기 캐소드 롤러와 접하는 부분에 대해 넓은 면적으로 도금액을 분사함으로써 도금 면적을 넓힐 뿐 아니라 도금 시간을 줄여 효율을 극대화할 수 있다.By spraying a plating liquid with a large area on a portion of the plated material in contact with the cathode roller by the injection unit, the plating area may be increased, and the plating time may be reduced to maximize efficiency.
상기 분사 유닛에 의한 도금액의 분사는 도금액을 피도금재의 방향으로 순환시켜 피도금재의 상기 캐소드 롤러와 접하는 부분에서 양극 이온의 농도가 줄어드는 것을 방지해 균일한 도금층을 형성할 수 있다.The spraying of the plating liquid by the spraying unit may circulate the plating liquid in the direction of the plated material to prevent a decrease in the concentration of the positive ion in a portion in contact with the cathode roller of the plated material, thereby forming a uniform plating layer.
고속 도금 시에도 공정실 내에 채워져 있는 도금액에 대하여 소모된 양극 이온을 보충해 줄 수 있다.Even during high-speed plating, it is possible to replenish the consumed anode ions with respect to the plating liquid filled in the process chamber.
공정실 내에 배치된 애노드 플레이트에 의해 도금액에 양극 이온을 보충해 줄 수 있다.The anode plate disposed in the process chamber can supplement the anode with the plating liquid.
공정실 외측으로 유출된 도금액의 원활한 배수가 가능하며, 및/또는 배수된 도금액이 순환 구조가 가능하다.Smooth drainage of the plating liquid flowing out of the process chamber is possible, and / or the drained plating liquid may have a circulation structure.
도 1은 본 발명의 일 실시예에 따른 연속 도금 장치를 개략적으로 도시한 평면 구성도이다.1 is a plan view schematically showing a continuous plating apparatus according to an embodiment of the present invention.
도 2는 피도금재의 일 예를 도시한 단면도이다.2 is a cross-sectional view showing an example of a plated material.
도 3a 및 도 3b는 비교예 및 실시예의 도금 영역을 도시한 도면이다.3A and 3B are diagrams showing plating regions of Comparative Examples and Examples.
도 4는 본 발명의 다른 일 실시예에 따른 연속 도금 장치를 개략적으로 도시한 평면 구성도이다.4 is a plan view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
도 5는 본 발명의 또 다른 일 실시예에 따른 연속 도금 장치를 개략적으로 도시한 평면 구성도이다.5 is a plan view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
도 6은 본 발명의 또 다른 일 실시예에 따른 연속 도금 장치를 개략적으로 도시한 평면 구성도이다.6 is a plan view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
도 7은 본 발명의 또 다른 일 실시예에 따른 연속 도금 장치를 개략적으로 도시한 측면 구성도이다.7 is a side view schematically showing a continuous plating apparatus according to another embodiment of the present invention.
이하, 첨부된 도면을 참조로 본 발명의 실시예들에 대하여 보다 상세히 설명한다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일 실시예에 따른 연속 도금 장치를 개략적으로 도시한 평면 구성도이다.1 is a plan view schematically showing a continuous plating apparatus according to an embodiment of the present invention.
도 1을 참조하면, 상기 연속 도금 장치는 캐소드 롤러(1)와 분사 유닛(2)을 포함한다.Referring to FIG. 1, the continuous plating apparatus includes a cathode roller 1 and an injection unit 2.
도 1에서 볼 수 있듯이, 상기 캐소드 롤러(1)와 분사 유닛(2)은 복수 개 구비될 수 있는 데, 반드시 이에 한정되는 것은 아니고, 적어도 하나 이상 구비될 수 있다.As shown in FIG. 1, the cathode roller 1 and the injection unit 2 may be provided in plural numbers, but are not necessarily limited thereto, and may be provided with at least one.
상기 복수의 캐소드 롤러(1)의 사이로 피도금 패턴을 포함하는 피도금재(3)가 지나가도록 배치된다.The plated material 3 including the plated pattern passes between the plurality of cathode rollers 1.
상기 피도금재(3)는 도 2에서 볼 수 있듯이, 필름 형태의 베이스 부재(31)와, 그 표면에 형성된 복수의 패드(32)를 포함할 수 있다. 이 패드(32)와 상기 캐소드 롤러(1)와의 접점에 도금층이 형성될 수 있다. 따라서 상기 패드(32)의 패턴이 피도금 패턴이 된다. 상기 패드(32)들은 도 2에서 볼 수 있듯이 상기 베이스 부재(31)의 양면에 형성될 수 있는 데, 이는 캐소드 롤러(1)의 배치 상태에 따라 달라질 수 있다. 즉, 캐소드 롤러(1)와의 접점에서 도금이 이뤄지므로 캐소드 롤러(1)와 접하는 면에는 상기 패드(32)들이 형성되도록 함이 바람직하다. 상기 피도금재(3)는 롤??투??롤 방식으로 상기 캐소드 롤러(1)들을 통과하여 이송되도록 할 수 있다.As shown in FIG. 2, the plated material 3 may include a base member 31 in the form of a film and a plurality of pads 32 formed on a surface thereof. A plating layer may be formed at a contact point between the pad 32 and the cathode roller 1. Accordingly, the pattern of the pad 32 is a plated pattern. The pads 32 may be formed on both sides of the base member 31 as shown in FIG. 2, which may vary depending on the arrangement of the cathode roller 1. That is, since plating is performed at the contact with the cathode roller 1, the pads 32 may be formed on the surface contacting the cathode roller 1. The plated material 3 may be transported through the cathode rollers 1 in a roll-to-roll manner.
상기 캐소드 롤러(1)는 적어도 외면이 전기 전도성을 갖도록 형성된 것으로, 전기 전도성을 갖는 상기 외면이 상기 피도금재(3)의 패드(32)들과 접함으로써 피도금재(3)의 패드(32) 상에 도금층을 형성할 수 있다.The cathode roller 1 is formed so that at least an outer surface thereof is electrically conductive, and the outer surface having electrical conductivity contacts the pads 32 of the plated material 3 so that the pads 32 of the plated material 3 ) A plating layer can be formed.
상기 캐소드 롤러(1)들은 그 회전축이 지면에 수직한 방향이 되도록 배치될 수 있는 데, 이에 따라 캐소드 롤러(1)들의 사이를 통과하는 피도금재(3)도 도금되는 면이 지면에 수직이 되도록 하여 이송될 수 있다. 이 때 상기 캐소드 롤러(1)들은 피도금재(3)의 도금되는 면이 지면에 수직이 되도록 한 상태에서 지면에 경사지도록 배치될 수 있다. 그러나 본 발명은 반드시 이에 한정되는 것은 아니고 상기 캐소드 롤러(1)들은 지면에 수평인 방향으로 배치되어 피도금재(3)가 도금되는 면이 지면에 수평이 되도록 하여 이송될 수 있다.The cathode rollers 1 may be arranged such that their axis of rotation is perpendicular to the ground, so that the plated material 3 passing between the cathode rollers 1 is also perpendicular to the ground. To be transported. In this case, the cathode rollers 1 may be disposed to be inclined to the ground in a state in which the plated surface of the plated material 3 is perpendicular to the ground. However, the present invention is not necessarily limited thereto, and the cathode rollers 1 may be disposed in a direction horizontal to the ground so that the surface on which the plated material 3 is plated may be horizontal to the ground.
한편, 제1전원(11)이 상기 캐소드 롤러(1)의 적어도 외면과 전기적으로 연결되어 있다. 상기 제1전원(11)은 상기 캐소드 롤러(1)의 적어도 외면에 음극 전기를 인가한다. 상기 제1전원(11)은 상기 연속 도금 장치의 외측에 위치하는 것이 바람직하다. On the other hand, the first power source 11 is electrically connected to at least an outer surface of the cathode roller 1. The first power source 11 applies cathode electricity to at least an outer surface of the cathode roller 1. The first power source 11 is preferably located outside the continuous plating apparatus.
상기 분사 유닛(2)은 상기 캐소드 롤러(1)와 이격되게 위치하고, 양극 이온을 포함하는 도금액을 상기 피도금재(3)의 방향으로 분사한다.The injection unit 2 is positioned to be spaced apart from the cathode roller 1 and injects a plating liquid containing anode ions in the direction of the plated material 3.
상기 분사 유닛(2)은 적어도 상기 피도금재(3)의 상기 캐소드 롤러와 접하는 면에 대향되게 위치할 수 있는 데, 이에 따라 도 1에서 볼 수 있듯이, 캐소드 롤러(1)가 피도금재(3)의 양면에 접하는 구조일 경우에는 상기 분사 유닛(2)들도 상기 피도금재(3)의 도금되는 양면에 대향되도록 위치할 수 있다.The injection unit 2 may be positioned at least opposite to a surface of the plated material 3 which is in contact with the cathode roller, and as shown in FIG. 1, the cathode roller 1 may be formed of a plated material ( In the case of the structure in contact with both sides of 3), the injection unit (2) may also be positioned to face the plated both sides of the plated material (3).
상기 분사 유닛(2)은 상기 도금액을 상기 피도금재의 방향으로 분사하도록 형성된 것으로, 각 분사 유닛(2)들은 도금액이 분무되도록 구비된 노즐을 구비한다.The injection unit 2 is formed to inject the plating liquid in the direction of the plated material, and each of the injection units 2 includes a nozzle provided to spray the plating liquid.
상기 분사 유닛(2)들은 제1저장조(21)에 연결되고 제1저장조(21)와 분사 유닛(2)들의 사이에는 가압 펌프(22)가 개재될 수 있다. 도 1에는 하나의 제1저장조(21)와 하나의 가압 펌프(22)에 모든 분사 유닛(2)들이 연결된 것을 나타내었으나, 본 발명은 반드시 이에 한정되는 것은 아니고, 분사 유닛(2)들을 구획별로 그룹을 지어 별도의 펌프 및/또는 저장조에 연결되도록 할 수 있다. The injection units 2 may be connected to the first reservoir 21, and a pressure pump 22 may be interposed between the first reservoir 21 and the injection units 2. Although FIG. 1 shows that all the injection units 2 are connected to one first reservoir 21 and one pressure pump 22, the present invention is not limited thereto, and the injection units 2 may be divided into sections. It can be grouped to connect to separate pumps and / or reservoirs.
상기 제1저장조(21)는 상기 양극 이온을 포함하는 도금액이 저장되며, 이 도금액이 가압 펌프(22)를 통해 가압되어 분사 유닛(2)들로 제공된다. 상기 제1저장조(21)에는 양극 이온을 생성하여 도금액 내에 양극 이온이 충분하게 구비될 수 있도록 양극 이온 생성부(23)가 더 포함될 수 있다. 상기 양극 이온 생성부(23)는 소모된 양극 이온 생성용 메탈을 보충하기 위한 메탈이 될 수 있는 데, 이에 따라 상기 제1저장조(21) 내의 양극 이온의 농도가 균일하게 유지되도록 할 수 있다.The first reservoir 21 stores a plating liquid containing the positive ion, and the plating liquid is pressurized through the pressure pump 22 to be supplied to the injection units 2. The first reservoir 21 may further include a cathode ion generator 23 to generate cathode ions so that the cathode ions may be sufficiently provided in the plating solution. The positive ion generating unit 23 may be a metal for replenishing the consumed positive ion generating metal, thereby maintaining a uniform concentration of the positive ion in the first reservoir 21.
상기와 같은 본 발명의 일 실시예에 따르면, 분사 유닛(2)에 의해 피도금재(3)의 상기 캐소드 롤러(1)와 접하는 부분에 대해 넓은 면적으로 도금액을 분사함으로써 도금 면적을 넓힐 뿐 아니라 도금 시간을 줄여 효율을 극대화할 수 있다.According to one embodiment of the present invention as described above, by injecting the plating liquid to a large area for the portion in contact with the cathode roller 1 of the material to be plated (3) by the injection unit 2 not only widens the plating area The plating time can be reduced to maximize the efficiency.
도 3a는 본 출원인에 의해 출원된 또 다른 연속 도금 장치인 10??2012??0049803호에 따른 도금 면적(33a)을 나타낸 것이고 도 3b는 본 발명의 일 실시예에 따른 도금 면적(33b)을 나타낸 것이다.FIG. 3A shows the plating area 33a according to another continuous plating apparatus filed by the applicant, 10 ?? 2012 ?? 0049803, and FIG. 3B shows the plating area 33b according to an embodiment of the present invention. It is shown.
도 3a에 도시된 바와 같이 본 출원인에 의해 출원된 또 다른 연속 도금 장치인 10??2012??0049803호에 따른 도금 방법은, 양극 이온을 포함하는 도금액을 워터 나이프(Water knife) 방식으로 캐소드 롤러(1)와 피도금재(3)가 접하는 부위에만 분사함으로써 피도금재(3)의 일부 영역에만 국부적으로 도금이 이뤄지도록 한 것이다. 따라서 그 도금 면적(33a)이 매우 작게 형성된다.As shown in FIG. 3A, a plating method according to another continuous plating apparatus, which is filed by the applicant, according to 10 ?? 2012 ?? 0049803, uses a cathode knife to process a plating liquid containing an anode ion using a water knife method. By spraying only on the part where (1) and the to-be-plated material 3 contact, plating is locally performed only to a part of the to-be-plated material 3. Therefore, the plating area 33a is formed very small.
반면 본 발명의 일 실시예에 따른 도금 장치에 의한 도금 방법에 따르면, 분사 유닛(2)들이 피도금재(3)의 매우 넓은 표면에 걸쳐 도금액을 분사하기 때문에 복수의 캐소드 롤러(1)들이 피도금재(3)와 접점을 이뤄 매우 넓은 면적에 걸쳐 도금 면적(33b)이 형성될 수 있다. 이에 따라 도금 효율도 높일 수 있게 된다.On the other hand, according to the plating method by the plating apparatus according to an embodiment of the present invention, the plurality of cathode rollers (1) is avoided because the injection unit (2) injects the plating liquid over a very large surface of the plated material (3) The plating area 33b can be formed over a very large area by making contact with the plating material 3. Accordingly, the plating efficiency can also be increased.
도 4는 본 발명의 다른 일 실시예에 따른 연속 도금 장치를 도시한 평단면도이다.Figure 4 is a plan sectional view showing a continuous plating apparatus according to another embodiment of the present invention.
도 4에 따른 연속 도금 장치의 일 실시예는, 공정실(51)을 더 포함한다. 상기 공정실(51)에는 양극 이온을 포함하는 상기 도금액(24)이 채워져 있고, 상기 피도금재(3)가 상기 도금액(24)에 침적된 상태이다. 그리고, 상기 캐소드 롤러(1)들 및 상기 분사 유닛(2)들도 상기 공정실(51)에 위치하며, 상기 도금액(24)에 침적되어 있다. 상기 공정실(51)에는 양단에 제1게이트(51a) 및 제2게이트(51b)가 구비되며, 상기 피도금재(3)는 상기 제1게이트(51a) 및 제2게이트(51b)를 관통하도록 상기 공정실(51) 내에 배치된다.One embodiment of the continuous plating apparatus according to FIG. 4 further includes a process chamber 51. The process chamber 51 is filled with the plating liquid 24 containing anode ions, and the plating material 3 is in a state in which the plating liquid 24 is deposited. The cathode rollers 1 and the injection units 2 are also located in the process chamber 51 and are deposited in the plating liquid 24. The process chamber 51 is provided with a first gate 51a and a second gate 51b at both ends, and the plated material 3 passes through the first gate 51a and the second gate 51b. It is arranged in the process chamber 51 so as to.
도 1과 동일한 도면 부호는 동일한 부재를 나타낸 것으로, 반복되는 설명은 생략한다.The same reference numerals as in FIG. 1 denote the same members, and repeated descriptions thereof will be omitted.
이 상태에서 도금이 수행될 경우, 상기 공정실(51) 내에 충진된 도금액(24)에 의해 피도금재(3)와 캐소드 롤러(1)의 접점에서 도금이 이뤄지는 데, 이 때, 분사 유닛(2)들에 의해 양극 이온을 포함하는 도금액이 상기 피도금재(3)의 방향으로 분사됨으로써 도금 효율을 더욱 증대시킬 수 있는 것이다.When plating is performed in this state, the plating is performed at the contact point of the plated material 3 and the cathode roller 1 by the plating liquid 24 filled in the process chamber 51, in which case the injection unit ( 2), the plating liquid containing the positive ion is injected in the direction of the plated material 3 to further increase the plating efficiency.
상기 분사 유닛(2)들에 의한 도금액의 분사는 도금액을 피도금재(3)의 방향으로 순환시키는 기능을 할 뿐 아니라, 공정실(51) 내에 채워져 있는 도금액(24)에 대하여 양극 이온을 보충해 주는 기능을 할 수 있다. 상기 연속 도금 공정은 매우 고속으로 이뤄질 수 있기 때문에, 공정실(51)에 충진된 도금액(24)의 양극 이온은 매우 빠르게 소모될 수 있다. 따라서 분사 유닛(2)들에 의한 도금액의 분사에 의해 도금액(24) 내에서 소모된 양극 이온은 보충해 줌으로써 도금 효율이 원활하게 유지될 수 있도록 할 수 있다.The injection of the plating liquid by the injection units 2 functions not only to circulate the plating liquid in the direction of the plating material 3 but also to supplement the positive electrode ions with respect to the plating liquid 24 filled in the process chamber 51. You can do it. Since the continuous plating process may be performed at a very high speed, the positive electrode ions of the plating solution 24 filled in the process chamber 51 may be consumed very quickly. Therefore, it is possible to smoothly maintain the plating efficiency by supplementing the anode ions consumed in the plating liquid 24 by the injection of the plating liquid by the spraying units 2.
한편, 상기 공정실(51) 내에는 애노드 플레이트(4)들이 배치될 수 있고, 상기 애노드 플레이트(4)들은 공정실(51) 밖에 위치한 제2전원(41)에 전기적으로 연결될 수 있다. 상기 제2전원(41)은 상기 애노드 플레이트(4)들에 양극 전기를 인가하며, 이에 따라 상기 도금액(24) 내에서 소모되는 양극 이온을 보충해줄 수 있다. Meanwhile, anode plates 4 may be disposed in the process chamber 51, and the anode plates 4 may be electrically connected to a second power source 41 located outside the process chamber 51. The second power supply 41 may apply anode electricity to the anode plates 4, thereby supplementing anode ions consumed in the plating solution 24.
도 5는 본 발명의 또 다른 일 실시예에 따른 연속 도금 장치를 도시한 평단면도이다.5 is a plan sectional view showing a continuous plating apparatus according to another embodiment of the present invention.
도 5에 따른 연속 도금 장치의 일 실시예는, 장치 전체의 외곽 몸체를 구성하는 프레임(50)을 포함할 수 있다. 상기 프레임(50)은 대략 직사각형 단면을 갖는 케이싱의 형태를 갖는 데, 내부에는 도 5에서 봤을 때 수직한 방향으로 제1격벽(61) 및 제2격벽(62)이 서로 대향되게 설치되고, 상기 제1격벽(61)과 제2격벽(62)의 사이에는 도 5에서 봤을 때 수평한 방향으로 제3격벽(63)이 설치된다. 이러한 제1격벽(61), 제2격벽(62) 및 제3격벽(63)에 의해 상기 프레임(50)의 내부는 복수의 격실들로 구획될 수 있다. 즉, 제1격벽(61)과 제2격벽(62)의 사이에서 도 5에서 봤을 때 수평 방향으로 가로 놓인 제3격벽(63)에 의해 공정실(51)과 이동실(52)이 구획되고, 제1격벽(61) 오른쪽에는 제1보관실(53), 제2격벽(62) 왼쪽에는 제2보관실(54)이 구획된다.One embodiment of the continuous plating apparatus according to FIG. 5 may include a frame 50 constituting the outer body of the entire apparatus. The frame 50 has a shape of a casing having a substantially rectangular cross section, in which the first partition 61 and the second partition 62 are installed to face each other in a vertical direction when viewed in FIG. 5. A third partition 63 is installed between the first partition 61 and the second partition 62 in a horizontal direction as shown in FIG. 5. The interior of the frame 50 may be partitioned into a plurality of compartments by the first partition wall 61, the second partition wall 62, and the third partition wall 63. That is, the process chamber 51 and the moving chamber 52 are partitioned between the first partition wall 61 and the second partition wall 62 by the third partition wall 63 horizontally disposed in the horizontal direction as seen in FIG. 5. On the right side of the first partition wall 61, a first storage room 53 is partitioned and a second storage room 54 is partitioned on a left side of the second partition wall 62.
상기 제1보관실(53)에는 구동 롤러(71)가 위치하고, 상기 제2보관실(54)에는 종동 롤러(72)가 위치한다. 상기 프레임(50)의 내부에는 상기 구동 롤러(71)에 회전력을 제공하기 위한 회전수단(미도시) 및 상기 회전수단에 의한 회전력을 상기 구동롤러(71)에 전달하는 동력전달수단(미도시)이 포함된다.The driving roller 71 is located in the first storage chamber 53, and the driven roller 72 is located in the second storage chamber 54. Rotating means (not shown) for providing rotational force to the drive roller 71 and power transmission means (not shown) for transmitting the rotational force by the rotating means to the drive roller 71 inside the frame 50. This includes.
상기 구동 롤러(71)는, 일정한 폭을 가지면서 일방향으로 연장되는 피도금재(3)를 감아 걸고 있으며 회전수단에 의하여 동력을 전달받아 회전하는 롤러이다. 이러한 구동 롤러(71)는 피도금재(3)에 연속적으로 도금층이 형성될 수 있도록 피도금재(3)를 이송시키는 기능을 수행한다. 상기 구동 롤러(71)는 지면에 대하여 수직으로 세워져 배치될 수 있다.The driving roller 71 is a roller that is wound around the plated material 3 extending in one direction while having a constant width and is rotated by receiving power by a rotating means. The driving roller 71 performs a function of transferring the plated material 3 so that the plating layer can be continuously formed on the plated material 3. The driving roller 71 may be disposed perpendicular to the ground.
상기 종동 롤러(72)는, 지면에 수직으로 세워져 배치되며 상기 구동 롤러(71)와 일정간격 이격되어 배치되는 것이다. 상기 종동 롤러(72)의 외주면에는 피도금재(3)가 감아 걸리며 상기 구동 롤러(71)가 회전함에 따라서 상기 종동 롤러(72)가 함께 회전하여 피도금재(3)가 일정한 경로를 가지면서 이동할 수 있도록 한다.The driven roller 72 is disposed perpendicular to the ground and is spaced apart from the driving roller 71 by a predetermined distance. The plated material 3 is wound around the outer circumferential surface of the driven roller 72. As the drive roller 71 rotates, the driven roller 72 rotates together so that the plated material 3 has a constant path. Allow it to move.
상기 이동실(52)에는 장력 부여 롤러(73)들이 복수 개 구비되어 이송되는 피도금재(3)에 일정 정도의 텐션이 가해지도록 할 수 있다.The moving chamber 52 may be provided with a plurality of tension applying rollers 73 so that a certain amount of tension is applied to the plated material 3 to be transferred.
공정실(51)은 도 4에 도시된 실시예의 구조와 동일하므로 상세한 설명은 생략한다. 전술한 제1저장조(21) 및 가압 펌프(22)는 프레임(50)의 외측에 위치할 수 있다. 도 5에는 캐소드 롤러들(1)에 전기적으로 연결된 제1전원 및 애노드 플레이트(4)들에 전기적으로 연결된 제2전원은 생략했으며, 이는 도 4에 따른 실시예와 동일하게 적용 가능할 것이다. Process chamber 51 is the same as the structure of the embodiment shown in Figure 4, so a detailed description thereof will be omitted. The first reservoir 21 and the pressure pump 22 described above may be located outside the frame 50. In FIG. 5, a first power source electrically connected to the cathode rollers 1 and a second power source electrically connected to the anode plates 4 are omitted, which may be applicable to the embodiment according to FIG. 4.
한편, 상기 제1보관실(53)에는 제1배수관(25a)이 연결되고, 상기 제2보관실(54)에는 제2배수관(25b)이 연결될 수 있다. 그리고 상기 제1배수관(25a) 및 제2배수관(25b)은 프레임(50) 외측에 구비된 제2저장조(25)에 연결된다. Meanwhile, a first drain pipe 25a may be connected to the first storage chamber 53, and a second drain pipe 25b may be connected to the second storage chamber 54. The first drain pipe 25a and the second drain pipe 25b are connected to a second storage tank 25 provided outside the frame 50.
상기 공정실(51) 내에 수용된 도금액(24)은 도금 공정이 진행되는 동안 상기 제1게이트(51a) 및 제2게이트(51b)를 통해 일부 유출될 수 있다. 이렇게 공정실(51) 외측으로 유출된 도금액(24)은 제1배수관(25a) 및 제2배수관(25b)을 통해 배수되어 제2저장조(25)에 저장될 수 있다. 제2저장조(25)에 저장된 도금액은 양극 이온의 농도를 맞춘 후 도금 공정에 다시 사용 가능하다.The plating liquid 24 accommodated in the process chamber 51 may partially flow out through the first gate 51a and the second gate 51b during the plating process. The plating liquid 24 leaked out of the process chamber 51 may be drained through the first drain pipe 25a and the second drain pipe 25b and stored in the second storage tank 25. The plating solution stored in the second storage tank 25 can be used again in the plating process after adjusting the concentration of the positive ion.
그러나 본 발명은 반드시 이에 한정되는 것은 아니고, 상기 제2저장조(25)를 사용하지 않고 도 6에서 볼 수 있듯이 상기 제1배수관(25a) 및 제2배수관(25b)이 제1저장조(21)에 직접 연결될 수 있다. 이 경우 배수된 도금액이 양극 이온 생성부(23)를 통해 양극 이온을 보충받을 수 있으며, 이 후 도금액은 다시 공정실(51)로 투입되는 순환 구조가 가능해진다.However, the present invention is not necessarily limited thereto, and as shown in FIG. 6 without using the second reservoir 25, the first drain pipe 25a and the second drain pipe 25b may be disposed in the first reservoir 21. Can be connected directly. In this case, the drained plating solution may be replenished with anode ions through the anode ion generator 23, after which the plating solution may be circulated into the process chamber 51.
다음으로 본 발명의 실시예에 따른 연속 도금 방법을 설명한다. 본 발명의 실시예에 따른 연속 도금 방법은 편의상 도 5에 따른 실시예를 중심으로 설명토록 한다.Next, a continuous plating method according to an embodiment of the present invention will be described. Continuous plating method according to an embodiment of the present invention will be described with reference to the embodiment according to FIG. 5 for convenience.
먼저 도 2에 도시된 바와 같은 예의 피도금재(3)로 구성된 롤을 준비한다. 그리고 이 피도금재(3)의 롤이 구동 롤러(71), 장력 부여 롤들(73), 종동 롤러(72) 및 복수의 캐소드 롤러들(1)을 거치도록 도 5와 같이 배치한다. First, the roll which consists of the to-be-plated material 3 of the example as shown in FIG. 2 is prepared. And it arrange | positions as FIG. 5 so that the roll of this to-be-plated material 3 may pass through the drive roller 71, the tension provision rolls 73, the driven roller 72, and the some cathode roller 1. FIG.
이 후 공정실(51)에 양극 이온이 포함된 도금액(24)을 채운 다음, 구동 롤러(71)를 돌려 도금 공정을 수행한다.After that, the plating solution 24 including the positive ion is filled in the process chamber 51, and then the driving roller 71 is turned to perform the plating process.
이 때, 캐소드 롤러들(1)에 음극 전기를 인가시키고 애노드 플레이트들(4)에는 양극 전기를 인가시킨다. 또 가압 펌프(22)를 작동시켜 분사 유닛들(2)을 통해 양극 이온을 포함하는 도금액을 피도금재(3)에 분사시킨다.At this time, cathode electricity is applied to the cathode rollers 1 and anode electricity is applied to the anode plates 4. In addition, the pressure pump 22 is operated to inject the plating liquid 3 containing the positive ions into the plated material 3 through the injection units 2.
제1게이트(51a) 및 제2게이트(51b)를 통해 공정실(51) 외측으로 흘러 나온 도금액은 제1배수관(25a) 및 제2배수관(25b)을 통해 제2저장조(25)로 배수 및 저장된다.The plating liquid flowing out of the process chamber 51 through the first gate 51a and the second gate 51b is drained to the second storage tank 25 through the first drain pipe 25a and the second drain pipe 25b. Stored.
이상 설명한 실시예들은 캐소드 롤러들(1)을 포함한 각 롤러들이 지면에 수직한 방향으로 세워져 배치되고, 피도금재(3)가 지면에 수직한 방향으로 세워진 상태에서 수평하게 이송되며 도금이 행해지는 것을 나타내었는 데, 본 발명은 반드시 이에 한정되는 것은 아니고, 도 7에서 볼 수 있듯이, 캐소드 롤러들(1)을 포함한 롤러들이 지면에 수평한 방향으로 배치되고, 피도금재(3)가 지면에 수평항 방향으로 놓인 상태에서 수평하게 이송되며 도금이 행해지도록 할 수도 있다.The above-described embodiments are arranged such that the rollers including the cathode rollers 1 are erected in a direction perpendicular to the ground, and are horizontally transferred while the plated material 3 is erected in a direction perpendicular to the ground, and the plating is performed. Although the present invention is not necessarily limited thereto, as shown in FIG. 7, the rollers including the cathode rollers 1 are disposed in a direction horizontal to the ground, and the plated material 3 is placed on the ground. The plate may be transferred horizontally while being laid in the horizontal term direction.
도 7에 도시된 실시예에서 도금조(55) 내로 피도금재(3)가 투입되었다가 인출되는 데, 도금조(55)의 입구 및 출구 측에는 장력 부여 및 방향 전환용 롤러들(74)이 설치될 수 있다. 그리고 도금조(55) 내에는 도금액(24)이 채워져 있는 데, 도금액(24) 내에는 복수의 캐소드 롤러들(1)이 배치되어 있고, 캐소드 롤러들(1)의 상부 및/또는 하부에 복수의 분사 유닛들(2)이 배치되어 있다. 그리고 도금조(55) 내에는 애노드 플레이트들(4)도 더 배치될 수 있다. In the embodiment shown in FIG. 7, the plated material 3 is introduced into the plating bath 55 and then drawn out. At the inlet and the exit side of the plating bath 55, rollers 74 for tensioning and changing direction are provided. Can be installed. In the plating bath 55, the plating liquid 24 is filled, and a plurality of cathode rollers 1 are disposed in the plating liquid 24, and a plurality of cathode rollers 1 are disposed above and / or below the cathode rollers 1. Injection units 2 are arranged. In addition, the anode plates 4 may be further disposed in the plating bath 55.
도 7에는 피도금재(3)가 롤러들(74)에 의해 방향이 전환되어 도금조(55)의 상부로부터 도금조(55)에 투입된 후 다시 도금조(55)의 상부를 통해 인출되는 것을 나타내었으나, 본 발명은 반드시 이에 한정되는 것은 아니고, 상기 도금조(55)의 상기 캐소드 롤러(1)와 인접한 위치의 양단에 게이트들이 형성되어 피도금재(3)가 대략 직선 형태로 도금조(55)를 관통하도록 할 수 있다.7 shows that the plated material 3 is changed in direction by the rollers 74 and introduced into the plating bath 55 from the top of the plating bath 55 and then drawn out again through the top of the plating bath 55. Although the present invention is not necessarily limited thereto, the gates are formed at both ends of the plating tank 55 adjacent to the cathode roller 1 so that the plating material 3 is formed in a substantially straight shape. 55).
이러한 수평식 연속 도금 장치도 전술한 본 발명의 모든 작용 효과를 그대로 나타낼 수 있다.Such a horizontal continuous plating apparatus can also exhibit all the effects of the present invention described above.
본 발명은 첨부된 도면에 도시된 일 실시예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 당해 기술분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 수 있을 것이다. 따라서 본 발명의 진정한 보호 범위는 첨부된 청구 범위에 의해서만 정해져야 할 것이다.Although the present invention has been described with reference to one embodiment shown in the accompanying drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Could be. Therefore, the true scope of protection of the present invention should be defined only by the appended claims.
인쇄회로기판의 제조에 적용될 수 있다.It can be applied to the manufacture of printed circuit boards.

Claims (16)

  1. 적어도 외면이 전기 전도성을 갖고, 상기 외면이, 피도금재와 접하도록 구비된 캐소드 롤러; A cathode roller having at least an outer surface having electrical conductivity and provided with the outer surface in contact with the plated material;
    상기 캐소드 롤러의 상기 외면과 전기적으로 연결되어 상기 외면에 음극 전기를 인가하는 제1전원; A first power source electrically connected to the outer surface of the cathode roller to apply cathode electricity to the outer surface;
    상기 캐소드 롤러와 이격되게 위치하고 양극 이온을 포함하는 도금액을 상기 피도금재의 방향으로 분사하는 분사 유닛; 및An injection unit which is spaced apart from the cathode roller and injects a plating liquid containing anode ions in the direction of the plated material; And
    상기 분사 유닛에 연결되고 상기 도금액을 상기 분사 유닛에 제공하는 제1저장조;를 포함하는 연속 도금 장치.And a first reservoir connected to the spray unit and providing the plating liquid to the spray unit.
  2. 제1항에 있어서,The method of claim 1,
    상기 분사 유닛은 적어도 상기 피도금재의 상기 캐소드 롤러와 접하는 면에 대향되게 위치하는 연속 도금 장치.And the spray unit is located at least opposite to a surface in contact with the cathode roller of the plated material.
  3. 제1항에 있어서,The method of claim 1,
    상기 분사 유닛은 복수 개가 구비된 연속 도금 장치.The plating unit is provided with a plurality of injection units.
  4. 제1항에 있어서,The method of claim 1,
    상기 캐소드 롤러 및 분사 유닛이 수용된 공정실을 더 포함하고, 상기 공정실에 상기 양극 이온을 포함하는 도금액이 충진되어 상기 피도금재가 상기 충진된 도금액에 침적된 연속 도금 장치.And a process chamber accommodating the cathode roller and the injection unit, wherein the plating liquid containing the anode ions is filled in the process chamber, and the plating material is deposited on the filled plating liquid.
  5. 제4항에 있어서,The method of claim 4, wherein
    상기 공정실에 위치한 애노드 플레이트; 및 An anode plate located in the process chamber; And
    상기 애노드 플레이트와 전기적으로 연결되어 상기 애노드 플레이트에 양극 전기를 인가하는 제2전원;을 더 포함하는 연속 도금 장치.And a second power supply electrically connected to the anode plate to apply anode electricity to the anode plate.
  6. 제1항 내지 제5항 중 어느 한 항에 있어서,The method according to any one of claims 1 to 5,
    상기 캐소드 롤러는 지면에 수직한 방향으로 연장되도록 배치된 연속 도금 장치.And the cathode roller is arranged to extend in a direction perpendicular to the ground.
  7. 제1항 내지 제5항 중 어느 한 항에 있어서,The method according to any one of claims 1 to 5,
    상기 캐소드 롤러는 지면에 수평한 방향으로 연장되도록 배치된 연속 도금 장치.And the cathode roller is arranged to extend in a direction horizontal to the ground.
  8. 제4항에 있어서,The method of claim 4, wherein
    상기 공정실은 제1게이트 및 제2게이트를 포함하고,The process chamber includes a first gate and a second gate,
    상기 피도금재는 상기 제1게이트 및 제2게이트를 관통하도록 배치되며,The plated material is disposed to pass through the first gate and the second gate,
    상기 공정실 외측에 배수된 상기 도금액이 저장되는 제2저장조가 위치한 연속 도금 장치.And a second storage tank in which the plating liquid drained out of the process chamber is stored.
  9. 제1항 내지 제5항 중 어느 한 항에 있어서,The method according to any one of claims 1 to 5,
    상기 제1저장조에 구비된 양극 이온 생성부를 더 포함하는 연속 도금 장치.Continuous plating apparatus further comprises a positive ion generating unit provided in the first reservoir.
  10. 적어도 외면이 전기 전도성을 갖는 캐소드 롤러에 음극 전기를 인가하는 단계;Applying cathode electricity to a cathode roller having at least an outer surface electrically conductive;
    피도금재를 상기 캐소드 롤러의 외면에 접하도록 연속적으로 상기 캐소드 롤러에 제공하는 단계; 및Continuously providing a plated material to the cathode roller to be in contact with an outer surface of the cathode roller; And
    상기 캐소드 롤러와 이격되게 위치한 분사 유닛에 의해 양극 이온을 포함하는 도금액을 상기 피도금재의 방향으로 분사하는 단계;를 포함하는 연속 도금 방법.And spraying a plating liquid containing anode ions in the direction of the plated material by an injection unit positioned to be spaced apart from the cathode roller.
  11. 제10항에 있어서,The method of claim 10,
    상기 도금액은 적어도 상기 피도금재의 상기 캐소드 롤러와 접하는 면에 대하여 분사하는 연속 도금 방법.And the plating liquid is sprayed onto at least a surface of the plated material in contact with the cathode roller.
  12. 제10항에 있어서,The method of claim 10,
    상기 분사 유닛은 복수 개가 구비되어 연속적으로 진행하는 피도금재의 표면에 동시에 도금액을 분사하는 연속 도금 방법.The injection unit is provided with a plurality of continuous plating method for injecting the plating liquid on the surface of the plated material to be carried out continuously.
  13. 제10항에 있어서,The method of claim 10,
    상기 도금액을 분사하는 단계는, 상기 캐소드 롤러 및 분사 유닛은 상기 양극 이온을 포함하는 도금액이 침적된 상태에서 행해지는 연속 도금 방법.In the spraying of the plating liquid, the cathode roller and the spraying unit are performed in a state in which a plating liquid containing the anode ions is deposited.
  14. 제13항에 있어서,The method of claim 13,
    상기 캐소드 롤러 및 분사 유닛이 침적된 도금액에 양극 이온을 제공하는 단계를 더 포함하는 연속 도금 방법.And providing cathode ions to the plating liquid in which the cathode roller and the injection unit are deposited.
  15. 제10항 내지 제14항 중 어느 한 항에 있어서,The method according to any one of claims 10 to 14,
    상기 캐소드 롤러는 지면에 수직한 방향으로 연장되도록 배치된 연속 도금 방법.And the cathode roller is arranged to extend in a direction perpendicular to the ground.
  16. 제10항 내지 제14항 중 어느 한 항에 있어서,The method according to any one of claims 10 to 14,
    상기 캐소드 롤러는 지면에 수평한 방향으로 연장되도록 배치된 연속 도금 방법.And the cathode roller is arranged to extend in a direction horizontal to the ground.
PCT/KR2014/000496 2013-01-16 2014-01-16 Apparatus and method for continuous plating WO2014112819A1 (en)

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CN104928738A (en) * 2015-05-21 2015-09-23 中国科学院山西煤炭化学研究所 Continuous metal electroplating method and device for carbon fiber tows

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