WO2014024275A1 - Système de travail pour un substrat - Google Patents

Système de travail pour un substrat Download PDF

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Publication number
WO2014024275A1
WO2014024275A1 PCT/JP2012/070213 JP2012070213W WO2014024275A1 WO 2014024275 A1 WO2014024275 A1 WO 2014024275A1 JP 2012070213 W JP2012070213 W JP 2012070213W WO 2014024275 A1 WO2014024275 A1 WO 2014024275A1
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WO
WIPO (PCT)
Prior art keywords
inspection
work
circuit board
board
machines
Prior art date
Application number
PCT/JP2012/070213
Other languages
English (en)
Japanese (ja)
Inventor
光孝 稲垣
博史 大池
和美 星川
Original Assignee
富士機械製造株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士機械製造株式会社 filed Critical 富士機械製造株式会社
Priority to JP2014529194A priority Critical patent/JP6148674B2/ja
Priority to PCT/JP2012/070213 priority patent/WO2014024275A1/fr
Publication of WO2014024275A1 publication Critical patent/WO2014024275A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/083—Quality monitoring using results from monitoring devices, e.g. feedback loops

Definitions

  • the present invention relates to an on-board work system in which work is sequentially performed on a circuit board to be transported.
  • the board-to-board work system usually includes a plurality of work machines arranged. And a circuit board is conveyed over what was arrange
  • the plurality of working machines include a working machine for applying cream solder or the like onto the circuit board, a working machine for mounting electronic components on the circuit board, and the like.
  • An inspection machine is also included for inspecting the work results. In such a system, it is desired to reliably inspect the work result in order to minimize the occurrence of defective products. On the other hand, it is not desirable that inspection takes a long time, and shortening of the inspection time is also desired.
  • a plurality of inspection machines are provided, and a circuit board is sequentially inspected by a plurality of inspection machines, thereby ensuring reliable inspection work and inspection. Achieving compatibility with shortening of time.
  • the circuit board is sequentially inspected by a plurality of inspection machines, thereby making it possible to achieve both a reliable inspection operation and a reduction in inspection time.
  • further shortening of the inspection time and more reliable inspection work are desired, and there is a lot of room for improvement in the on-board work system.
  • the present invention has been made in view of such circumstances, and provides an on-board working system capable of further shortening the inspection time and performing more reliable inspection work.
  • a substrate work system includes a plurality of work machines arranged, and a circuit board is arranged downstream from the work machine disposed upstream of the work machines.
  • the plurality of work machines have a plurality of inspection devices for inspecting work on the circuit board, and the plurality of inspection devices perform different inspections.
  • the downstream inspection device of the plurality of inspection devices has a poor inspection result by the upstream inspection device. In some cases, the inspection is performed in more detail than the inspection by the upstream inspection device.
  • the plurality of inspection devices at least two-dimensionally inspect the circuit board in a plane.
  • An apparatus and a three-dimensional inspection apparatus that three-dimensionally inspects a circuit board are configured.
  • the plurality of working machines perform a circuit that performs an operation different from the inspection operation.
  • a working device for a substrate is provided, and the substrate working system includes a computing unit that calculates the number of the plurality of inspection devices according to a tact time of the working device.
  • an on-board work system including a plurality of work machines arranged, and transporting a circuit board from one arranged upstream of the plurality of work machines to one arranged downstream.
  • the work by each of the plurality of work machines is sequentially performed on the circuit board, and the work system for the circuit board performs work on the circuit board.
  • Two or more devices each have an inspection device for inspecting work on the circuit board, and the plurality of inspection devices perform different inspections.
  • an on-board work system including a plurality of work machines arranged, and transporting a circuit board from one arranged upstream of the plurality of work machines to one arranged downstream.
  • the work by each of the plurality of work machines is sequentially performed on the circuit board, and the work system for the circuit board performs work on the circuit board.
  • the on-board working system includes a plurality of inspection apparatuses, and the plurality of inspection apparatuses perform different inspections.
  • the circuit board is imaged and the like, and the imaged data and the like are processed to obtain information on the work result for the circuit board.
  • the image data is processed, if the data becomes complicated, the processing time becomes long, and it becomes difficult to shorten the inspection work.
  • a plurality of inspection apparatuses perform different inspections, so that inspection work in each inspection apparatus can be unified. That is, for example, one of the plurality of inspection apparatuses can determine the mounting position of the electronic component, and the other can determine the contamination of the foreign matter.
  • the same kind of processing is performed in each inspection apparatus, and the processing time can be shortened.
  • the data is complex, the number of misjudgments increases. If the data is simple, the misjudgments also decrease. Therefore, according to the substrate work system of the first aspect, it is possible to further shorten the inspection time and perform more reliable inspection work.
  • “different inspection” means inspections of different types, inspections having different analysis capabilities, and the like. Specifically, the inspection of the position of the electronic component, the inspection of the presence / absence of the electronic component, the inspection of the direction (polarity) of the electronic component, the inspection of mixing of foreign matters, and the like are different types of inspection. Further, the three-dimensional inspection and the two-dimensional inspection are inspections having different analysis capabilities.
  • the downstream inspection device of the plurality of inspection devices is more detailed than the upstream inspection device when the inspection result by the upstream inspection device is not good. Perform an inspection. If a detailed inspection is performed, it is possible to reduce the incidence of erroneous determination. On the other hand, when performing a detailed inspection, processing data becomes complicated and processing time becomes long. In view of this, in this system, a detailed inspection is performed on a circuit board that is determined to be not normal by a simple inspection. As a result, only the circuit boards that are likely to be abnormal are inspected in detail, thereby reducing the time required for the inspection work and reducing the incidence of erroneous determination.
  • the inspection work is performed by the two-dimensional inspection apparatus and the three-dimensional inspection apparatus.
  • the circuit board can be inspected two-dimensionally and three-dimensionally, and the inspection operation can be performed more reliably.
  • the number of inspection machines is calculated according to the tact time. That is, when a relatively short tact time is set, a large number of units are calculated in order to increase the inspection efficiency of the inspection machine. Thereby, it becomes possible to arrange the number of inspection machines according to the tact time, and it is possible to achieve the inspection speed according to the tact time.
  • two or more of the plurality of work machines each have an inspection device. That is, one work machine has one inspection device. For this reason, it becomes possible to provide an inspection apparatus in the appropriate position in the arranged working machine.
  • one work machine has a plurality of inspection devices. For this reason, according to this system, it becomes possible to perform an inspection work intensively.
  • FIG. 1 shows a substrate working system 10.
  • a system 10 shown in FIG. 1 is a system for mounting electronic components on a circuit board.
  • the on-board working system 10 includes four electronic component mounting apparatuses (hereinafter, may be abbreviated as “mounting apparatuses”) 12 and one inspection apparatus 14.
  • the four mounting devices 12 are arranged in a row in an adjacent state.
  • the inspection device 14 is disposed on the downstream side of the four mounting devices 12 disposed on the most downstream side.
  • a direction in which the mounting device 12 and the inspection device 14 are arranged is referred to as an X-axis direction
  • a horizontal direction perpendicular to the direction is referred to as a Y-axis direction.
  • the four mounting devices 12 have substantially the same configuration. Therefore, one of the four mounting devices 12 will be described as a representative. As shown in FIGS. 2 and 3, the mounting device 12 has one system base 16 and two mounting machines 18 adjacent to the system base 16. 2 is a perspective view of the mounting device 12, and FIG. 3 is a plan view showing the mounting device 12 with a cover and the like removed from a viewpoint from above.
  • Each mounting machine 18 mainly includes a mounting machine body 20, a transport device 22, a mounting head 24, a mounting head moving device (hereinafter sometimes abbreviated as “moving device”) 26, and a supplying device 28.
  • the mounting machine main body 20 includes a frame portion 30 and a beam portion 32 that is overlaid on the frame portion 30.
  • the transport device 22 includes two conveyor devices 40 and 42.
  • the two conveyor devices 40 and 42 are disposed in the frame portion 30 so as to be parallel to each other and extend in the X-axis direction.
  • Each of the two conveyor devices 40 and 42 conveys a circuit board supported by each conveyor device 40 and 42 in the X-axis direction by an electromagnetic motor (see FIG. 5) 46.
  • the circuit board is fixedly held by a board holding device (see FIG. 5) 48 at a predetermined position.
  • the moving device 26 is an XY robot type moving device.
  • the moving device 26 includes an electromagnetic motor (see FIG. 5) 52 that slides the slider 50 in the X-axis direction and an electromagnetic motor (see FIG. 5) 54 that slides in the Y-axis direction.
  • the mounting head 24 is attached to the slider 50, and the mounting head 24 is moved to an arbitrary position on the frame unit 30 by the operation of the two electromagnetic motors 52 and 54.
  • the supply device 28 is a feeder-type supply device, and is disposed at the front end of the frame portion 30.
  • the supply device 28 has a tape feeder 70.
  • the tape feeder 70 accommodates the taped component in a wound state.
  • the taped component is a taped electronic component.
  • the tape feeder 70 sends out the taped parts by a delivery device (see FIG. 5) 76.
  • the feeder type supply device 28 supplies the electronic component at the supply position by feeding the taped component.
  • the mounting head 24 mounts electronic components on the circuit board.
  • the mounting head 24 has a suction nozzle 78 provided on the lower end surface.
  • the suction nozzle 78 communicates with a positive / negative pressure supply device (see FIG. 5) 80 via negative pressure air and positive pressure air passages.
  • the suction nozzle 78 sucks and holds the electronic component with a negative pressure, and releases the held electronic component with a positive pressure.
  • the mounting head 24 has a nozzle lifting / lowering device (see FIG. 5) 82 that lifts and lowers the suction nozzle 78.
  • the mounting head 24 changes the vertical position of the electronic component to be held by the nozzle lifting device 82.
  • the inspection apparatus 14 includes the system base 16 and two inspection machines 86 and 88.
  • Each of the inspection machines 86 and 88 has substantially the same structure as that of the mounting machine 18 and is arranged on the system base 16 in an adjacent state.
  • the inspection machine 86 disposed on the downstream side of the mounting machine 18 of the mounting apparatus 12 is referred to as a first inspection machine 86, and the first inspection machine 86.
  • the inspection machine 88 disposed on the downstream side is referred to as a second inspection machine 88.
  • the inspection machines 86 and 88 have substantially the same structure as the mounting machine 18 except for the mounting head 24 and the supply device 28. Specifically, in each of the inspection machines 86 and 88, the mounting head 24 is detached from the slider 50, and the inspection heads 90 and 92 are attached to the slider 50 instead of the mounting head 24 as shown in FIG. Further, in the inspection machines 86 and 88, the supply device 28 is removed from the frame unit 30, and image processing devices 96 and 98 are attached instead of the supply device 28. That is, the first inspection machine 86 is configured by the transport device 22, the moving device 26, the inspection head 90, and the image processing device 96, and the second inspection device 88 is configured by the transport device 22, the moving device 26, the inspection head 92, The image processing apparatus 98 is configured.
  • the mounting head 24 of the mounting machine 18 is replaced with the inspection heads 90 and 92, and the supply device 28 is replaced with the image processing devices 96 and 98, whereby the mounting machine 18 is transformed into the inspection machines 86 and 88. It is possible. As a result, the mounting machine 18 and the inspection machines 86 and 88 that constitute the substrate work system 10 can be deformed at any time, and the line configuration of the system can be freely rearranged. Furthermore, as will be described in detail later, it is possible to easily cope with a change in the number of inspection machines in order to execute an inspection speed corresponding to the tact time.
  • the inspection head 90 provided in the first inspection machine 86 has a first inspection camera (see FIG. 5) 100.
  • the first inspection camera 100 is attached to the lower surface of the inspection head 90 so as to face downward.
  • the circuit board is imaged from a viewpoint from above.
  • the image data of the first inspection camera 100 is processed by the image processing device 96, whereby planar information on the circuit board is acquired. Specifically, information such as the position of the electronic component mounted on the circuit board, the presence / absence of the electronic component, the mounting direction (polarity) of the electronic component, the presence / absence of foreign matter, and the like is acquired.
  • the inspection head 92 provided in the second inspection machine 88 includes a first inspection camera (see FIG. 5) 102 and a second inspection camera (see FIG. 5) 104. Similar to the first inspection camera 100 of the inspection head 90, the first inspection camera 102 is attached to the lower surface of the inspection head 92 so as to face downward. For this reason, the imaging data of the first inspection camera 102 is processed by the image processing device 98, whereby planar information on the circuit board is acquired. On the other hand, the second inspection camera 104 is attached to the lower surface of the inspection head 92 in a state of facing sideways. With this second inspection camera 104, the circuit board is imaged from a side viewpoint.
  • the imaging data of the second inspection camera 104 is processed by the image processing device 98, whereby information in the vertical direction of the circuit board is acquired. Then, three-dimensional information of the circuit board is acquired based on the planar information on the circuit board and the information in the vertical direction of the circuit board. Specifically, information such as the floating of electronic components mounted on the circuit board and the presence or absence of foreign matter is acquired.
  • the substrate-to-board working system 10 includes a plurality of control devices 110, 112, and 114 provided according to the mounting machine 18, the first inspection machine 86, and the second inspection machine 88.
  • the control device 110 provided corresponding to the mounting machine 18 includes a controller 120 and a plurality of drive circuits 122.
  • the plurality of drive circuits 122 are connected to the electromagnetic motors 46, 52, 54, the substrate holding device 48, the delivery device 76, the positive / negative pressure supply device 80, and the nozzle lifting / lowering device 82.
  • the controller 120 includes a CPU, a ROM, a RAM, and the like, is mainly a computer, and is connected to a plurality of drive circuits 122. As a result, the operations of the transport device 22, the moving device 26, and the like are controlled by the controller 120.
  • the control device 112 provided corresponding to the first inspection machine 86 includes a controller 124 and a plurality of drive circuits 126.
  • the plurality of drive circuits 126 are connected to the electromagnetic motors 46, 52, 54 and the substrate holding device 48.
  • the controller 124 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 126. Thereby, the operation of the transport device 22 and the moving device 26 is controlled by the controller 124.
  • An image processing device 96 is connected to the controller 124. Thereby, planar information of the circuit board is acquired by the controller 124.
  • the control device 114 provided corresponding to the second inspection machine 88 includes a controller 128 and a plurality of drive circuits 130.
  • the plurality of drive circuits 130 are connected to the electromagnetic motors 46, 52, 54 and the substrate holding device 48.
  • the controller 128 includes a CPU, a ROM, a RAM, and the like, mainly a computer, and is connected to a plurality of drive circuits 130. Thereby, the operation of the transport device 22 and the moving device 26 is controlled by the controller 128.
  • An image processing device 98 is connected to the controller 128. Thereby, the three-dimensional information of the circuit board is acquired by the controller 128.
  • the circuit board is transported from the mounting machine 18 arranged on the most upstream side to the second inspection machine 88 arranged on the most downstream side.
  • the mounting operation by the mounting machines 18 is sequentially performed on the circuit board to be transported.
  • the first inspection machine 86 inspects whether or not the electronic component is properly mounted on the circuit board, and the circuit board having a poor inspection result is re-inspected by the second inspection machine 88.
  • each mounting machine 18 the circuit board is transported to the work position by a command from the controller 120 of the control device 110, and the circuit board is fixedly held at that position. Further, the supply device 28 supplies electronic components at the supply position of the tape feeder 70. Then, the controller 120 moves the mounting head 24 above the supply position, and sucks and holds the electronic component by the suction nozzle 78. Subsequently, the mounting head 24 is moved onto the circuit board, and an electronic component is mounted on the circuit board. Next, the circuit board on which the electronic component is mounted is conveyed toward the mounting machine 18 on the downstream side.
  • the circuit board on which a plurality of electronic components are mounted is carried into the first inspection machine 86 by sequentially performing the above mounting operations in the plurality of mounting machines 18.
  • the circuit board is transported to the work position in accordance with a command from the controller 124 of the control device 112, and is fixedly held at that position.
  • the controller 124 moves the inspection head 90 above the circuit board, and images the circuit board with the first inspection camera 100 from a viewpoint from above.
  • the controller 124 acquires planar information of the circuit board by processing the captured data in the image processing device 96. Based on this information, the controller 124 determines whether or not the electronic component is mounted at an appropriate position on the circuit board.
  • the coordinates in the X-axis and Y-axis directions of the electronic component mounted on the circuit board are acquired, and it is determined whether or not the coordinates are deviated from the preset coordinates. If the deviation of each coordinate is a predetermined value or more, it is determined that the electronic component is not mounted at an appropriate position on the circuit board. If the deviation of each coordinate is less than the predetermined value, the electronic component is It is determined that it is mounted at an appropriate position on the circuit board.
  • the second inspection machine 88 performs re-inspection. Specifically, a circuit board with a poor inspection result in the first inspection machine 86 is transported to the work position by the transport device 22 according to a command from the controller 128 of the control device 114, and is fixedly held at that position. Subsequently, the controller 128 moves the inspection head 92 above the circuit board. Specifically, the first inspection machine 86 on the circuit board moves above the portion determined to have a poor inspection result. Then, the first inspection camera 102 and the second inspection camera 104 image the circuit board from the upper and side viewpoints. The controller 128 acquires the three-dimensional information of the circuit board by processing the imaging data in the image processing device 98.
  • the controller 128 performs a more detailed inspection than the inspection performed by the controller 124 of the first inspection machine 86 based on the information. Specifically, the coordinates in the X-axis, Y-axis, and Z-axis directions of the electronic component mounted on the circuit board are acquired, and it is determined whether the coordinates are deviated from the preset coordinates.
  • the Z-axis direction is a direction perpendicular to the X-axis and the Y-axis, that is, the vertical direction.
  • the second inspection machine 88 not only the electronic component is inspected planarly, but also the position of the electronic component in the Z-axis direction is inspected.
  • Whether or not the electronic component is properly mounted in the Z-axis direction is determined by the three-dimensional inspection of the electronic component. That is, the floating of the electronic component is inspected. As a result, the mounting state of the electronic component can be inspected in detail, and an abnormal circuit board can be reliably detected.
  • a circuit board having a good inspection result by the first inspection machine 86 is conveyed by the conveyance device 22 according to a command from the controller 128, passes through the second inspection machine 88, and is unloaded from the second inspection machine 88. . That is, a circuit board having a good inspection result by the first inspection machine 86 is carried out from the on-board working system 10 as a normal circuit board on which electronic components are appropriately mounted.
  • the second inspection machine 88 since the electronic components are inspected in three dimensions, the processing time of the imaging data tends to be long, but the inspection result in the first inspection machine 86 is not good for a part of the circuit board. Inspection work is being carried out. That is, only a part of the circuit board that is likely to be abnormal is inspected three-dimensionally. As a result, the time required for the inspection work can be shortened.
  • the on-board work system 10 it is possible to add inspection machines according to the time required for mounting work by the mounting machine 18, so-called tact time. That is, when a relatively short tact time is set, the number of inspection machines corresponding to the length of the tact time can be increased in order to increase the inspection efficiency of the inspection machine. Thereby, it becomes possible to achieve the inspection speed according to the tact time.
  • the controller 124 of the control device 112 of the first inspection machine 86 includes a first inspection unit 150 as shown in FIG.
  • the first inspection unit 150 is a functional unit for performing a simple planar inspection of electronic components.
  • the controller 128 of the control device 114 of the second inspection machine 88 includes a second inspection unit 152 and a required number calculation unit 154.
  • the second inspection unit 152 is a functional unit for performing an inspection different from the first inspection unit 150, specifically, a three-dimensional detailed inspection of an electronic component.
  • the required number calculation unit 154 is a functional unit for calculating the number of necessary inspection machines according to the tact time. By arranging the number of inspection machines calculated by the necessary number calculation unit 154 in the system, an appropriate inspection speed is realized.
  • the circuit board transported by one of the pair of conveyor devices 40 and 42 is inspected by the first inspection machine 86 and the second inspection machine 88.
  • the circuit boards conveyed by each of the conveyor devices 40 and 42 can be inspected by the first inspection machine 86 and the second inspection machine 88.
  • the inspection head 90 of the first inspection machine 86 is moved above the conveyor device 42
  • the inspection head 92 of the second inspection machine 88 is moved above the conveyor device 40.
  • the circuit board conveyed by the conveyor device 42 is imaged by the inspection head 90
  • the circuit board conveyed by the conveyor device 40 is imaged by the inspection head 92.
  • the circuit board conveyed by each conveyor apparatus 40 and 42 is test
  • the substrate work system 10 can cope with inspection work in two production lines.
  • an inspection device having a structure different from that of the inspection device 14 can be provided instead of the inspection device 14.
  • An inspection device 160 having a structure different from that of the inspection device 14 is shown in FIGS. 7 and 8 and will be described.
  • the inspection device 160 includes many devices having the same configuration as the inspection device 14. For this reason, about the apparatus of the same structure as the said inspection apparatus 14, description shall be abbreviate
  • symbol. 7 is a perspective view of the inspection apparatus 160
  • FIG. 8 is a plan view showing the inspection apparatus 160 with the cover 161 and the like removed from a viewpoint from above.
  • the inspection device 160 includes a transport device 162 as shown in FIG.
  • the conveying device 162 includes two conveyor devices 164 and 166.
  • the two conveyor devices 164 and 166 are disposed on the base 167 so as to be parallel to each other and extend in the X-axis direction.
  • Each of the conveyor devices 164 and 166 conveys the circuit board in the X-axis direction, similarly to the conveyor devices 40 and 42 described above.
  • the conveyor device 164 is connected to the conveyor device 40 of the mounting machine 18, and the conveyor device 166 is connected to the conveyor device 42 of the mounting machine 18.
  • the inspection device 160 further includes a pair of moving devices 168 and 170.
  • the pair of moving devices 168 and 170 are arranged side by side in the X-axis direction.
  • Each of the moving devices 168 and 170 has a pair of Y-axis direction guide rails 172 extending in the Y-axis direction and a pair of X-axis direction guide rails 174 extending in the X-axis direction.
  • the pair of X-axis direction guide rails 174 is overlaid on the pair of Y-axis direction guide rails 172.
  • the X-axis direction guide rail 174 moves to an arbitrary position in the Y-axis direction by driving an electromagnetic motor (not shown).
  • Each X-axis direction guide rail 174 holds a slider 176 so as to be movable along its own axis.
  • the slider 176 moves to an arbitrary position in the X-axis direction by driving an electromagnetic motor (not shown). With such a structure, the slider 176 moves to an arbitrary position on the base 167.
  • an inspection head 90 is attached to each of the two sliders 176 of the moving device 168 located on the upstream side.
  • Each of the two inspection heads 90 is moved by the moving device 168 above the circuit board conveyed by the conveyor device 164 and the circuit board conveyed by the conveyor device 166.
  • each inspection head 90 images one or both of the circuit board conveyed by the conveyor device 164 and the circuit board conveyed by the conveyor device 166.
  • the inspection head 90 is also attached to each of the two sliders 176 of the moving device 170 located on the downstream side.
  • Each of the two inspection heads 90 is moved by the moving device 170 above the circuit board conveyed by the conveyor device 164 and the circuit board conveyed by the conveyor device 166.
  • each inspection head 90 images one or both of the circuit board conveyed by the conveyor device 164 and the circuit board conveyed by the conveyor device 166.
  • four supply devices 28 are provided on both sides of the base 167 in the Y-axis direction so as to correspond to the four inspection heads 90.
  • the circuit board conveyed by each conveyor device 164, 166 is imaged by the two inspection heads 90, and the inspection work is performed based on the imaging data by the two inspection heads 90. Is done.
  • this inspection work there is a method performed by one inspection head 90 attached to the moving device 168 and one inspection head 90 attached to the moving device 170, and one of the moving device 168 and the moving device 170.
  • one inspection head 90 attached to the moving device 168 and one inspection head 90 attached to the moving device 170 for example, from the conveyor device 40 of the mounting machine 18 into the inspection device 160.
  • the conveyor device 164 conveys the carried circuit board.
  • the circuit board is fixed at a predetermined work position corresponding to the moving device 168.
  • the inspection head 90 provided on the moving device 168 images the circuit board.
  • a control device (not shown) of the inspection device 160 processes the imaging data by the image processing device 96 and acquires planar information of the circuit board. Based on the information, it is determined whether or not the position of the electronic component mounted on the circuit board is appropriate.
  • the conveyor device 164 conveys the circuit board and fixes the circuit board at a predetermined work position corresponding to the moving device 170. At that position, the inspection head 90 provided on the moving device 170 images the circuit board.
  • the control device processes the imaging data by the image processing device 96 and acquires planar information of the circuit board. Based on the information, it is determined whether or not the direction (polarity) of the electronic component mounted on the circuit board is appropriate.
  • the conveyor device 164 conveys the circuit board and discharges the circuit board from the inspection device 160.
  • a circuit board is carried into the inspection device 160 from the conveyor device 40 of the mounting machine 18. Then, the conveyor device 164 conveys the circuit board that has been loaded. The circuit board is fixed at a predetermined work position corresponding to the moving device 168. At that position, one of the two inspection heads 90 provided on the moving device 168 images the circuit board.
  • a control device (not shown) of the inspection device 160 processes the imaging data by the image processing device 96 and acquires planar information of the circuit board. Based on the information, it is determined whether or not the position of the electronic component mounted on the circuit board is appropriate.
  • the other of the two inspection heads 90 provided in the moving device 168 images the circuit board.
  • the control device processes the imaging data by the image processing device 96 and acquires planar information of the circuit board. Based on the information, it is determined whether or not the direction (polarity) of the electronic component mounted on the circuit board is appropriate.
  • the conveyor device 164 conveys the circuit board and discharges the circuit board from the inspection device 160. Note that this inspection work can be performed by the two inspection heads 90 provided on the moving device 170 instead of the two inspection heads 90 provided on the moving device 168.
  • the circuit board on which the electronic component is mounted is inspected by the two inspection heads 90, and the two inspection heads 90 perform different inspections. For this reason, when processing the imaging data of each inspection head 90, the same processing is repeatedly performed, so that the processing speed can be increased. As a result, the speed of the inspection work can be increased, and the time required for the inspection work can be shortened.
  • the inspection work includes various inspection work, and these various inspection work can be performed by the inspection head 90. Specifically, an inspection operation for determining the presence / absence of an electronic component, an inspection operation for determining the presence / absence of foreign matter (dust, other electronic components, etc.), and the like can be given. Further, by attaching the inspection head 92 to each of the two sliders 176 of the moving device 170 located on the downstream side, the simple inspection and the detailed inspection can be performed as in the case of the inspection device 14.
  • the board-to-board working system 10 is an example of the board-to-board working system.
  • the mounting machine 18, the first inspection machine 86, and the second inspection machine 88 are examples of work machines.
  • the inspection heads 90 and 92 are an example of an inspection apparatus.
  • the inspection head 90 is an example of an upstream inspection device and a two-dimensional inspection device.
  • the inspection head 92 is an example of a downstream inspection device and a three-dimensional inspection device.
  • the mounting head 24 is an example of a working device.
  • the required number calculation unit 154 is an example of a calculator.
  • the inspection apparatus 160 is an example of a working machine.
  • the inspection head 90 is an example of an inspection device.
  • On-board work system 18 Mounting machine (working machine) 24: Mounting head (working machine) 86: First inspection machine (working machine) 88: Second inspection machine (working machine) 90: Inspection head (inspection machine) (Upstream side inspection device) (2D inspection device) 92: Inspection head (inspection device) (Downstream side inspection device) (3D inspection device) 154: Necessary number calculation unit (arithmetic unit) 160: Inspection device (work machine)

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

La présente invention se rapporte à un système de travail pour des substrats, ledit système de travail comprenant une pluralité de machines de travail (18, 86, 88) agencées de façon séquentielle, des cartes de circuit imprimé étant transportées depuis la machine de travail agencée sur le côté amont de la pluralité de machines de travail vers la machine de travail agencée sur le côté aval de cette pluralité de machines de travail ; la pluralité de machines de travail comprenant une pluralité de têtes d'inspection (90, 92) destinées à inspecter le travail par rapport aux cartes de circuit imprimé ; et la pluralité de têtes d'inspection effectuant des inspections qui sont différentes les unes des autres. De cette manière, un travail d'inspection peut être réparti entre les têtes d'inspection et le temps nécessaire pour traiter les données, etc. peut être écourté. De même, par répartition des données entre les têtes d'inspection, le taux d'incidence des erreurs de détermination est réduit. Ainsi, le temps d'inspection peut être écourté et un travail d'inspection fiable peut être effectué.
PCT/JP2012/070213 2012-08-08 2012-08-08 Système de travail pour un substrat WO2014024275A1 (fr)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017064774A1 (ja) * 2015-10-14 2018-05-10 ヤマハ発動機株式会社 基板作業システムおよび部品実装装置
WO2019207730A1 (fr) * 2018-04-26 2019-10-31 ヤマハ発動機株式会社 Dispositif de montage de composant et procédé d'inspection

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111300A (ja) * 1999-08-04 2001-04-20 Sony Corp 部品実装機ライン
JP2005286309A (ja) * 2004-03-01 2005-10-13 Omron Corp 部品実装基板用の検査方法および検査システム、部品実装基板の製造方法
JP2007042785A (ja) * 2005-08-02 2007-02-15 Yamatake Corp 表面実装装置及び表面実装方法
JP2008066541A (ja) * 2006-09-07 2008-03-21 Toshiba Corp 検査装置システム
JP2009130134A (ja) * 2007-11-22 2009-06-11 Panasonic Corp 基板の検査方法及び基板の検査装置
JP2012124348A (ja) * 2010-12-09 2012-06-28 Panasonic Corp 電子部品実装システムおよび電子部品実装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111300A (ja) * 1999-08-04 2001-04-20 Sony Corp 部品実装機ライン
JP2005286309A (ja) * 2004-03-01 2005-10-13 Omron Corp 部品実装基板用の検査方法および検査システム、部品実装基板の製造方法
JP2007042785A (ja) * 2005-08-02 2007-02-15 Yamatake Corp 表面実装装置及び表面実装方法
JP2008066541A (ja) * 2006-09-07 2008-03-21 Toshiba Corp 検査装置システム
JP2009130134A (ja) * 2007-11-22 2009-06-11 Panasonic Corp 基板の検査方法及び基板の検査装置
JP2012124348A (ja) * 2010-12-09 2012-06-28 Panasonic Corp 電子部品実装システムおよび電子部品実装方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2017064774A1 (ja) * 2015-10-14 2018-05-10 ヤマハ発動機株式会社 基板作業システムおよび部品実装装置
US10888041B2 (en) 2015-10-14 2021-01-05 Yamaha Hatsudoki Kabushiki Kaisha Substrate working system and component mounter
WO2019207730A1 (fr) * 2018-04-26 2019-10-31 ヤマハ発動機株式会社 Dispositif de montage de composant et procédé d'inspection
JPWO2019207730A1 (ja) * 2018-04-26 2021-01-14 ヤマハ発動機株式会社 部品実装装置および検査方法

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