WO2013157219A1 - 冷凍装置 - Google Patents
冷凍装置 Download PDFInfo
- Publication number
- WO2013157219A1 WO2013157219A1 PCT/JP2013/002401 JP2013002401W WO2013157219A1 WO 2013157219 A1 WO2013157219 A1 WO 2013157219A1 JP 2013002401 W JP2013002401 W JP 2013002401W WO 2013157219 A1 WO2013157219 A1 WO 2013157219A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- refrigerant
- power
- jacket
- wiring board
- printed wiring
- Prior art date
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 29
- 239000003507 refrigerant Substances 0.000 claims abstract description 177
- 238000001816 cooling Methods 0.000 claims abstract description 80
- 238000001514 detection method Methods 0.000 claims description 34
- 239000007788 liquid Substances 0.000 claims description 23
- 239000012530 fluid Substances 0.000 abstract description 2
- 238000003825 pressing Methods 0.000 description 21
- 239000003990 capacitor Substances 0.000 description 13
- 239000002826 coolant Substances 0.000 description 13
- 230000001276 controlling effect Effects 0.000 description 7
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 230000036544 posture Effects 0.000 description 6
- 238000004378 air conditioning Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 238000005192 partition Methods 0.000 description 5
- 238000011144 upstream manufacturing Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010687 lubricating oil Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- WABPQHHGFIMREM-VENIDDJXSA-N lead-201 Chemical compound [201Pb] WABPQHHGFIMREM-VENIDDJXSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001219 R-phase Inorganic materials 0.000 description 1
- 230000018199 S phase Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/22—Arrangement or mounting thereof
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/003—General constructional features for cooling refrigerating machinery
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/08—Fastening; Joining by clamping or clipping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- an air conditioner as a refrigeration apparatus having a refrigerant jacket for cooling a power device is known (for example, Patent Document 1).
- an electrical component having a printed circuit board (front side circuit board) held on the front side of the holding member and a printed circuit board (back side circuit board) held on the back side of the holding member.
- a refrigerant jacket and a refrigerant pipe are arranged in front of the electrical component module in order to cool the power device in the electrical component module.
- the main surface of the printed wiring board is a region in the lower part of the printed wiring board, in which the high-power component group is disposed, and a region located above the high-power region and in the low-power component group And a weak electric region in which is disposed.
- the refrigerant jacket is in contact with the power device disposed in the high power region.
- the refrigerant pipe extends upward toward the refrigerant jacket, and the cooling portion is in contact with the refrigerant jacket.
- FIG. 10 is an exploded view of FIG. 9. It is a perspective view which shows the said refrigerant
- the air conditioner 1 includes an outdoor unit 2 installed outside and an indoor unit 3 installed indoors.
- the outdoor unit 2 and the indoor unit 3 are connected to each other by a communication pipe.
- the air conditioner 1 includes a refrigerant circuit 4 that performs a vapor compression refrigeration cycle.
- the refrigerant circuit 4 is mainly provided with an indoor heat exchanger 11, a compressor 12, an oil separator 13, an outdoor heat exchanger 14, an expansion valve 15, which is an expansion mechanism, an accumulator 16, and a four-way switching valve 17. These are connected by a refrigerant pipe 10 through which the refrigerant of the refrigerant circuit 4 flows.
- the refrigerant pipe 10 includes a liquid pipe 10L and a gas pipe 10G.
- the indoor heat exchanger 11 is a heat exchanger for exchanging heat between the refrigerant and room air, and is provided in the indoor unit 3.
- the indoor heat exchanger 11 for example, a cross fin type fin-and-tube heat exchanger or the like can be adopted.
- An indoor fan (not shown) for blowing indoor air to the indoor heat exchanger 11 is provided in the vicinity of the indoor heat exchanger 11.
- the compressor 12, the oil separator 13, the outdoor heat exchanger 14, the expansion valve 15, the accumulator 16 and the four-way switching valve 17 are provided in the outdoor unit 2. These are all housed in the casing 5 (see FIG. 2).
- the four-way switching valve 17 is provided with first to fourth four ports.
- the four-way switching valve 17 includes a first state (state indicated by a solid line in FIG. 1) in which the first port and the third port are simultaneously communicated, and a first port and a fourth port. Can be switched to a second state (state indicated by a broken line in FIG. 1) in which the second port and the third port are simultaneously communicated.
- the first port is connected to the discharge port of the compressor 12 via the oil separator 13
- the second port is connected to the suction port of the compressor 12 via the accumulator 16
- the third port is connected to the outdoor It is connected to the heat exchanger 14 and the fourth port is connected to the indoor heat exchanger 11 via a communication pipe.
- the machine room 5B occupies a part of the space in the casing 5 (in the case of the embodiment shown in FIG. 2, the right part when the casing 5 is viewed from the front).
- the electrical component module 100 is disposed on the opening side (front side in the present embodiment) that appears when a part of the casing 5 covering the machine room 5B is removed.
- a part of the front surface of the casing 5 is opened by removing a part of the front side plate of the casing 5 (the right side portion of the front side plate is removed in FIG. 2).
- the electrical component module 100 is arrange
- the electrical component module 100 is disposed in the middle in the height direction in the machine room 5B, but is not limited thereto.
- the upper part and the lower part of the electrical component module may be spaces, and other parts may be arranged.
- the electrical component module 100 is supported (fixed) on, for example, the partition plate 9 or the side plate of the casing 5.
- the electrical component module 100 includes a printed circuit board 91, a refrigerant jacket 40, and a temperature detection unit T.
- the electrical component module 100 further includes a support member 93 that is provided on the back side of the printed circuit board 91 and supports the printed circuit board 91, and a pressing plate 70.
- the printed circuit board 91 includes various electronic components and a printed wiring board 90 on which these electronic components are mounted.
- the printed wiring board 90 has a main surface (front surface) 90a facing the opening that appears when a part of the casing 5 (a part of the front side plate in the present embodiment) is removed.
- the printed wiring board 90 is supported by the support member 93 in an upright posture.
- the printed wiring board 90 is arranged in the vertical direction. In the present embodiment, the printed wiring board 90 is arranged in a posture parallel to the vertical direction, but is not limited to this.
- the state in which the printed wiring board 90 is arranged in the vertical direction is not only in the case where the printed wiring board 90 is arranged in a posture parallel to the vertical direction, but in a posture slightly inclined with respect to the vertical direction. It is also included.
- the electronic component includes a high-power component group and a low-power component group.
- the setting switch 98 is arranged at the edge (upper edge) of the printed wiring board 90, the workability at the time of service is excellent. Further, since the setting switch 101 is disposed at the edge (side edge) of the printed wiring board 90, the workability at the time of service is excellent.
- the wiring pattern 202 of the current detection signal is provided so as not to intersect (or straddle) with the wiring pattern 201 of the power system. Inclusion can be suppressed.
- both the wiring pattern 201 and the wiring pattern 202 are formed on the main surface 90a of the printed wiring board 90, and these wiring patterns 201 and 202 overlap each other.
- the wiring pattern 201 is formed on the main surface 90a of the printed wiring board 90, for example, and the wiring pattern 202 is opposite to the main surface 90a of the printed wiring board 90.
- the printed circuit board 91 is formed on the side surface (the other main surface) and the printed circuit board 91 is viewed from the front (when viewed in the direction shown in FIG. 3), the wiring patterns 201 and 202 do not overlap each other. I mean.
- the gate signal which is an inverter driving signal, has a higher voltage than the current detection signal and is not easily affected by the strong current. Therefore, the wiring pattern (not shown) of the gate signal may intersect with the wiring pattern 201.
- the second terminal P2 and the capacitor 94 are disposed on one side of the power device 20 (left side of the power device 20 in FIG. 3), and the other side (right side of the power device 20 in FIG. 3).
- Adopting a layout in which the first terminal P1 to which the output from the converter 23 is input is employed (the power device 20 and the refrigerant jacket 40 are interposed between the first terminal P1 and the second terminal P2).
- the first terminal P1, the reactor 102, and the second terminal P2 are to be connected on the printed wiring board 90, the wiring pattern tends to be complicated. Therefore, the structure in which the reactor 102 is connected to the converters 23 and 24 and the capacitors 94 and 94 by the harnesses 105 and 106 is particularly effective.
- the arrangement of the power device 20 is limited to some extent, so that the layout design becomes difficult, and it becomes difficult to separate high and low electricity. Therefore, in the present embodiment, by adopting the layout as described above on the main surface 90a of the printed wiring board 90, it is possible to arrange various devices in the casing while ensuring the cooling performance by the refrigerant jacket 40. An increase in space constraints can be suppressed.
- the first inverter 21 includes a device main body 200, a first lead portion 201, and a second lead portion 202.
- the device main body 200 includes a signal unit 20S located on the first lead unit 201 side and a high-power unit 20P located on the second lead unit 202 side and more likely to generate heat than the signal unit 20S.
- a first lead portion 201 is connected to the signal portion 20S, and a second lead portion 202 is connected to the high voltage portion 20P.
- An approximate boundary between the signal unit 20S and the high power unit 20P is indicated by a broken line in FIG.
- the upstream part extends upward toward the refrigerant jacket 40
- the printed circuit board 91 extends downward from the power device 20 (the downstream portion extends downward from the refrigerant jacket 40).
- the cooling unit 10 ⁇ / b> A extends upward along the refrigerant jacket 40.
- the lower end portion of the refrigerant jacket 40 is provided at a position along the lower end portion of the printed wiring board 90.
- the lower end portion of the refrigerant jacket 40 is preferably located at a position facing the lower end portion of the printed wiring board 90.
- the refrigerant jacket 40 extends upward from the lower end of the refrigerant jacket 40.
- the refrigerant jacket 40 includes a jacket main body 50 interposed between the cooling unit 10 ⁇ / b> A of the refrigerant pipe 10 and the power device 20, and support legs 60 a for attaching the jacket main body 50 to the printed wiring board 90. , 60b.
- the jacket body 50 is in contact with both the cooling unit 10 ⁇ / b> A and the power device 20.
- the contact portion 520 includes a plurality of screw holes 85 and 88 for fixing the power device 20 to the contact portion 520 and a screw hole 87 for fixing the temperature detection portion T to the contact portion 520. And the screw holes 86 and 86 for fixing the support legs 60a and 60b to the jacket main body 50 are formed.
- the contact portion 520 is provided in a region including the center line C passing through the center of the jacket body 50 in the width direction.
- the first recess 521 is provided on one side in the short direction with respect to the contact portion 520, and the second recess 522 is provided on the other side in the short direction with respect to the contact portion 520. Yes.
- Each mounting part 62 is set to a dimension that can secure a space for arranging the power device 20 between the surface of the printed wiring board 90 and the contact part 520.
- the tip of each mounting portion 62 is fixed to the printed wiring board 90 (see FIG. 9).
- each engaging portion 64 has an insertion hole 64 a into which an engaging portion 75 ⁇ / b> L of a pressing plate 70 described later is inserted.
- Each engaging portion 65 has an insertion hole 65a into which an engaging portion 75R of a pressing plate 70 described later is inserted.
- the temperature detection unit T is for detecting the temperature of the power device 20.
- the temperature detection unit T is a thermistor (fin thermistor), but may be anything that can detect the temperature of the power device 20, and is not limited to the thermistor.
- the temperature detection part T includes a screwing part T1 having a screw hole T3 through which the first screw 81 is inserted, and an extension part T2 extending from the screwing part T1 along the facing surface 52.
- the temperature detection unit T has a long shape in the direction along the facing surface 52, and is disposed so as to extend along the contact unit 520.
- the temperature detection unit T is fixed to the jacket body 50 by a first screw 81 that is screwed into a screw hole 87 formed in the contact portion 520 of the jacket body 50.
- the temperature detection unit T is connected to an elongated wiring W for sending a detected signal to the printed circuit board 91.
- the end of the wiring W of the temperature detection unit T is connected to the printed circuit board 91 of the electrical component module 100.
- the input line portion 96 of the power supply is disposed on one side of the power device 20, and the output line portion 97 of the inverters 21 and 22 is disposed on the other side of the power device 20.
- the position where the input line portion 96 is provided is separated from the position where the output line portion 97 is provided. Can be separated.
- the refrigeration apparatus relates to a refrigeration apparatus having a refrigerant circuit.
- the refrigeration apparatus includes a high-power component group including a power device, a low-power component group, a printed wiring board in which the high-power component group and the low-power component group are mounted on one main surface, and arranged in a vertical direction, and the refrigerant A refrigerant pipe through which a refrigerant of the circuit flows, and a refrigerant jacket that cools the power device by a refrigerant flowing through a cooling unit that is a part of a liquid pipe of the refrigerant pipe.
- both the high power component group and the low power component group are mounted on one main surface of the pair of main surfaces of the printed wiring board, the size in the thickness direction of the printed wiring board is increased. Can be suppressed.
- both the high electric component group and the weak electric component group are mounted on one main surface, it is only necessary to mount the electronic component on one surface (main surface 90a). Therefore, there is an advantage from the viewpoint of manufacturing cost as compared with the case where electronic components are mounted on both sides.
- the high-power component group further includes an input line portion of a power source and an output line portion of an inverter, the input line portion is disposed on one side of the power device, and the output line portion is It is preferable to arrange on the other side of the power device.
- the position where the input line portion is provided can be separated from the position where the output line portion is provided (separation). it can).
- the length (pipe length) for extending the refrigerant pipe to the position of the refrigerant jacket in contact with the power device in the high power region is increased. Can be further suppressed.
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- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
図1に示すように、空気調和装置1は、室外に設置される室外機2と、室内に設置される室内機3とを備えている。室外機2と室内機3とは、連絡配管によって互いに接続されている。空気調和装置1は、蒸気圧縮式冷凍サイクルを行う冷媒回路4を備えている。冷媒回路4には、主として、室内熱交換器11、圧縮機12、油分離器13、室外熱交換器14、膨張機構である膨張弁15、アキュムレータ16、四方切換弁17が設けられており、これらが冷媒回路4の冷媒が流れる冷媒配管10によって接続されている。冷媒配管10は、液配管10Lとガス配管10Gとを含む。
図2に示すように、室外機2は、ケーシング5を備えている。ケーシング5内には、上述した圧縮機12、油分離器13、室外熱交換器14、膨張弁15、アキュムレータ16、四方切換弁17などが収容されている。
次に、パワーデバイス20の冷却構造について説明する。本実施形態における冷却構造では、冷却器30がプリント回路板91のパワーデバイス20を冷却する。冷却器30は、冷媒ジャケット40と、冷媒配管10の一部である冷却部10Aとを含む。本実施形態では、冷却器30は、冷媒ジャケット40に取り付けられる押さえ板70をさらに含む。冷却器30については後述する。
まず、プリント回路板91の構成について説明する。図2及び図3に示すように、プリント回路板91は、種々の電子部品と、これらの電子部品を実装するプリント配線板90とを含む。プリント配線板90は、ケーシング5の一部(本実施形態では、前面側板の一部)を取り外すことにより現れる開口側に向いた主面(前面)90aを有する。プリント配線板90は、起立した姿勢で支持部材93に支持されている。プリント配線板90は、上下方向に配置されている。本実施形態では、プリント配線板90は、上下方向に平行な姿勢で配置されているが、これに限定されない。プリント配線板90が上下方向に配置されているという状態には、プリント配線板90が上下方向に平行な姿勢で配置されている場合だけでなく、上下方向に対して多少傾斜した姿勢で配置されている場合も含まれる。前記電子部品は、強電部品群と、弱電部品群とを含む。
次に、冷却器30について説明する。上述したように、本実施形態の冷却器30は、冷媒ジャケット40と、冷媒配管10の冷却部10Aと、冷媒ジャケット40に取り付けられる押さえ板70とを含む。
なお、本発明は、前記実施形態に限られるものではなく、その趣旨を逸脱しない範囲で種々変更、改良等が可能である。
2 室外機
3 室内機
4 冷媒回路
10 冷媒配管
10A 冷媒配管の冷却部
10L 液配管
10G ガス配管
20 パワーデバイス
21 第1インバータ
22 第2インバータ
23 第1コンバータ
24 第2コンバータ
30 冷却器
40 冷媒ジャケット
70 押さえ板
90 プリント配線板
91 プリント回路板
96 入力線部
97 出力線部
100 電装品モジュール
R1 強電領域
R2 弱電領域
Claims (5)
- 冷媒回路を有する冷凍装置であって、
パワーデバイスを含む強電部品群と、
弱電部品群と、
一方の主面に前記強電部品群及び前記弱電部品群が実装され、上下方向に配置されたプリント配線板と、
前記冷媒回路の冷媒が流れる冷媒配管と、
前記冷媒配管の液配管の一部である冷却部を流れる冷媒によって前記パワーデバイスを冷却する冷媒ジャケットと、を備え、
前記プリント配線板の前記主面は、
前記プリント配線板の下部の領域であって前記強電部品群が配置された強電領域と、
前記強電領域よりも上部に位置する領域であって前記弱電部品群が配置された弱電領域と、を有し、
前記冷媒ジャケットは、前記強電領域に配置された前記パワーデバイスに接しており、
前記冷媒配管の前記液配管は、前記冷媒ジャケットに向かって上方に延びる部分を含み、前記冷却部が前記冷媒ジャケットに接している、冷凍装置。 - 前記パワーデバイスは、インバータを含み、
前記強電部品群は、
電源の入力線部と、
前記インバータの出力線部と、をさらに含み、
前記入力線部は、前記パワーデバイスの一方のサイドに配置され、
前記出力線部は、前記パワーデバイスの他方のサイドに配置されている、請求項1に記載の冷凍装置。 - 前記冷媒ジャケットは、前記プリント配線板の下端部に対向する位置から上方に延びる形状を有し、
前記冷媒配管の前記冷却部は、前記冷媒ジャケットに沿って上方に延びている、請求項1又は2に記載の冷凍装置。 - 前記強電領域において、電流検出信号の配線パターンは、動力系の配線パターンと交差しないように設けられている、請求項1~3のいずれか1項に記載の冷凍装置。
- 前記一方の主面は、ケーシングの一部を取り外すことにより現れる開口側に向いている、請求項1~4のいずれか1項に記載の冷凍装置。
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CN201380020786.7A CN104272031B (zh) | 2012-04-20 | 2013-04-08 | 制冷装置 |
EP13778167.0A EP2860463B1 (en) | 2012-04-20 | 2013-04-08 | Refrigeration device |
US14/395,425 US9523529B2 (en) | 2012-04-20 | 2013-04-08 | Refrigeration apparatus |
AU2013250680A AU2013250680B2 (en) | 2012-04-20 | 2013-04-08 | Refrigeration Apparatus |
KR1020147032308A KR101677826B1 (ko) | 2012-04-20 | 2013-04-08 | 냉동 장치 |
BR112014025793-0A BR112014025793B1 (pt) | 2012-04-20 | 2013-04-08 | Aparelho de refrigeração |
ES13778167.0T ES2665525T3 (es) | 2012-04-20 | 2013-04-08 | Dispositivo de refrigeración |
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EP (1) | EP2860463B1 (ja) |
JP (1) | JP5472364B2 (ja) |
KR (1) | KR101677826B1 (ja) |
CN (1) | CN104272031B (ja) |
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EP2860463B1 (en) | 2018-03-21 |
EP2860463A4 (en) | 2016-05-18 |
CN104272031B (zh) | 2017-06-13 |
BR112014025793B1 (pt) | 2022-04-26 |
AU2013250680B2 (en) | 2015-10-29 |
KR101677826B1 (ko) | 2016-11-18 |
US9523529B2 (en) | 2016-12-20 |
CN104272031A (zh) | 2015-01-07 |
US20150128631A1 (en) | 2015-05-14 |
JP5472364B2 (ja) | 2014-04-16 |
EP2860463A1 (en) | 2015-04-15 |
AU2013250680A1 (en) | 2014-11-13 |
ES2665525T3 (es) | 2018-04-26 |
JP2013224785A (ja) | 2013-10-31 |
BR112014025793A2 (ja) | 2017-06-20 |
KR20150010745A (ko) | 2015-01-28 |
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