CN206164979U - Composite circuit board - Google Patents
Composite circuit board Download PDFInfo
- Publication number
- CN206164979U CN206164979U CN201620988927.5U CN201620988927U CN206164979U CN 206164979 U CN206164979 U CN 206164979U CN 201620988927 U CN201620988927 U CN 201620988927U CN 206164979 U CN206164979 U CN 206164979U
- Authority
- CN
- China
- Prior art keywords
- substrate layer
- polyimide film
- circuit board
- layer
- benzoxazoles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a composite circuit board, including base plate layer A, base plate layer A's surface is provided with circuit region and inverter circuit district, and inverter circuit district surface covering has a ceramic tectorial membrane, the surface covering of circuit region has one deck ether ketone type heat to mould polyimide film, and the ether ketone type heat fixed surface that moulds polyimide film installs the conductive metal layer, the top on conductive metal layer covers there is one deck benzoxazoles polyimide film, and benzoxazoles polyimide film's fixed mounting all around has the shielding net. This composite circuit board has combined two kinds of polyimide's advantage, and adhesion properties has been guaranteed in the introduction of ether ketone key, and flexibility has improved processing property, and high temperature resistance has been guaranteed in benzoxazoles's introduction, dimensional stability, and low hygroscopicity, two kinds of polyimide have very low dielectric loss and a dielectric constant simultaneously, and adhesion properties 0 ten minutes is good.
Description
Technical field
The utility model is related to circuit board technology field, specially a kind of composite circuit board.
Background technology
According to the difference of flexible copper-clad plate structure, two classes are broadly divided into, there is three layers of FCCL (3L-FCCL) and two layers of FCCL
(3L-FCCL).Three ply board is made up of three parts, respectively Copper Foil, adhesive, polyimide layer.Adhesive is mainly used
Epoxy resin and crylic acid resin.Two laminates are made up of two parts, only include Copper Foil and polyimide layer.The system of three ply board
Make technological development morning, and be widely used, but due to the presence of adhesive layer so as to using being greatly limited.Mainly
Including：The heat resistance of adhesive is not high so as to it is difficult to apply in the big dense circuit of caloric value；In the process of FPCB
Need to carry out the series of processes such as soldering, punching, and the dimensional stability of adhesive is bad, this undoubtedly causes the increasing of percent defective
It is many；The presence of adhesive increased the thickness of flexible copper-clad plate, and folding resistance, the space utilization of base material are reduced in various degree
Deng.
Utility model content
For problem above, the utility model provides a kind of composite circuit board, combines the advantage of two kinds of polyimides,
The introducing of ether ketone key ensure that adhesive property, and resistance to bend(ing) improves processing characteristics, and dielectric properties are very excellent, can be effective
In solving the problems, such as background technology.
For achieving the above object, the utility model provides following technical scheme：A kind of composite circuit board, including substrate layer A,
The surface of the substrate layer A is provided with circuit region and inverter circuit area, and inverter circuit area surface is coated with ceramic overlay film, the circuit
The surface in area is coated with a floor ether ketone type thermoplastic polyimide film, and the surface of ether ketone type thermoplastic polyimide film is installed with
Conductive metal layer, is coated with one layer of benzoxazoles polyimide film above the conductive metal layer, and benzoxazoles polyamides is sub-
The surrounding of amine film is installed with gauze screen, and the substrate layer A is connected with substrate layer B by adhesive.
Used as a kind of preferred technical scheme of the utility model, the conductive metal layer adopts copper foil material.
As a kind of preferred technical scheme of the utility model, carried out by guide hole between the substrate layer A and substrate layer B
Electrical connection.
Used as a kind of preferred technical scheme of the utility model, the substrate layer A and substrate layer B adopts rectangular configuration, and
Tetra- jiaos of substrate layer A and substrate layer B are provided with installing hole.
Compared with prior art, the beneficial effects of the utility model are：The composite circuit board, combines two kinds of polyimides
Advantage, the introducing of ether ketone key ensure that adhesive property, and resistance to bend(ing) improves processing characteristics, and the introducing of benzoxazoles ensures
Heat-resisting quantity, dimensional stability, agent of low hygroscopicity, while two kinds of polyimides have very low dielectric loss and dielectric constant,
Dielectric properties are very excellent, and the composite circuit board have can prolongation structure, be adapted to multiple-plate circuit, the scope of application
Extensively, it is with low cost, and screen layer is carried, circuit work is more stable, with higher market prospects.
Description of the drawings
Fig. 1 is the utility model structural representation.
In figure：1- substrate layer A；2- circuit regions；3- inverter circuits area；4- ceramics overlay films；5- ether ketone type thermoplastic polyimide films；
6- conductive metal layers；7- benzoxazoles polyimide films；8- gauze screens；9- substrate layer B；10- guide holes；11- installing holes.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of the utility model protection.
Embodiment：
Fig. 1 is referred to, the utility model provides a kind of technical scheme：A kind of composite circuit board, including substrate layer A1, it is described
The surface of substrate layer A1 is provided with circuit region 2 and inverter circuit area 3, and the surface of inverter circuit area 3 is coated with ceramic overlay film 4, the electricity
The surface in road area 2 is coated with a floor ether ketone type thermoplastic polyimide film 5, and the surface of ether ketone type thermoplastic polyimide film 5 is fixed
Conductive metal layer 6 is installed, the top of the conductive metal layer 6 is coated with one layer of benzoxazoles polyimide film 7, and benzo is disliked
The surrounding of azoles polyimide film 7 is installed with gauze screen 8, and the substrate layer A1 is connected with substrate layer B9, institute by adhesive
State conductive metal layer 6 and adopt copper foil material, be electrically connected by guide hole 10 between the substrate layer A1 and substrate layer B9, institute
State substrate layer A1 and substrate layer B9 and adopt rectangular configuration, and tetra- jiaos of substrate layer A1 and substrate layer B9 are provided with installing hole 11.
Operation principle of the present utility model：The composite circuit board, using ether ketone type thermoplastic polyimide film 5 and benzoxazoles
Polyimide film 7, using the excellent ether ketone type thermoplastic polyimide of pliability and adhesive property and mechanical performance, heat resistance,
The low benzoxazoles polyimides composite membrane-forming of excellent size stability and water absorption rate, ether ketone type thermoplastic polyimide film 5 is under
Layer is bonding with conductive metal layer 6, and as top layer for etching, the introducing of ether ketone key ensure that viscous benzoxazoles polyimide film 7
Performance is connect, resistance to bend(ing) improves processing characteristics, and the introducing of benzoxazoles ensure that heat-resisting quantity, dimensional stability, low moisture absorption
Property, while two kinds of polyimides have very low dielectric loss and dielectric constant, dielectric properties are very excellent, and the compound circuit
Plate have can prolongation structure, be adapted to multiple-plate circuit.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
Any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (4)
1. a kind of composite circuit board, including substrate layer A (1), the surface of the substrate layer A (1) is provided with circuit region (2) and non-electrical
Road area (3), and inverter circuit area (3) surface is coated with ceramic overlay film (4), it is characterised in that：The surface of the circuit region (2) covers
There is one layer of ether ketone type thermoplastic polyimide film (5), and the surface of ether ketone type thermoplastic polyimide film (5) is installed with conductive gold
Category layer (6), is coated with one layer of benzoxazoles polyimide film (7), and benzoxazoles polyamides above the conductive metal layer (6)
The surrounding of imines film (7) is installed with gauze screen (8), and the substrate layer A (1) is connected with substrate layer B (9) by adhesive.
2. a kind of composite circuit board according to claim 1, it is characterised in that：The conductive metal layer (6) adopts Copper Foil
Material.
3. a kind of composite circuit board according to claim 1, it is characterised in that：The substrate layer A (1) and substrate layer B (9)
Between be electrically connected by guide hole (10).
4. a kind of composite circuit board according to claim 1, it is characterised in that：The substrate layer A (1) and substrate layer B (9)
Using rectangular configuration, and substrate layer A (1) and substrate layer B (9) corner are provided with installing hole (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620988927.5U CN206164979U (en) | 2016-08-30 | 2016-08-30 | Composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620988927.5U CN206164979U (en) | 2016-08-30 | 2016-08-30 | Composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206164979U true CN206164979U (en) | 2017-05-10 |
Family
ID=58649738
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620988927.5U Expired - Fee Related CN206164979U (en) | 2016-08-30 | 2016-08-30 | Composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206164979U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110426866A (en) * | 2019-07-18 | 2019-11-08 | 深圳先进技术研究院 | Terahertz light control modulator, preparation method and terahertz imaging system |
-
2016
- 2016-08-30 CN CN201620988927.5U patent/CN206164979U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110426866A (en) * | 2019-07-18 | 2019-11-08 | 深圳先进技术研究院 | Terahertz light control modulator, preparation method and terahertz imaging system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170510 Termination date: 20180830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |