CN103898498B - The making method of melanism liquid medicine and transparent printed circuit board (PCB) - Google Patents
The making method of melanism liquid medicine and transparent printed circuit board (PCB) Download PDFInfo
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- CN103898498B CN103898498B CN201210582410.2A CN201210582410A CN103898498B CN 103898498 B CN103898498 B CN 103898498B CN 201210582410 A CN201210582410 A CN 201210582410A CN 103898498 B CN103898498 B CN 103898498B
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Abstract
A kind of melanism liquid medicine, its comprise the sodium hydroxide of 3%-5%, the sodium hypophosphite of 10%-15%, 10%-15% sodium-chlor, be the benzotriazole of 2%-4% and the water (mass percentage) of 70%-75%. A making method for transparent printed circuit board (PCB), comprises step: provide copper-clad base plate, and described copper-clad base plate comprises transparent dielectric base layer and the copper foil layer of one side melanism, and described first blackening layer is arranged at described stratum basale surface; Described copper foil layer is made and forms conductive circuit pattern, form circuit substrate; The copper foil layer of the non-melanism of described conductive circuit pattern surface and side are placed in above-mentioned melanism liquid medicine and carry out Darkening process, so that the copper foil layer surface of the non-melanism of described conductive circuit pattern and side form the 2nd blackening layer of black; And form transparent mulch film described 2nd blackening layer surface and the surface of stratum basale exposed from described conductive circuit pattern, form transparent printed circuit board (PCB).
Description
Technical field
The present invention relates to circuit board making technology, particularly relate to the making method of a kind of melanism liquid medicine and transparent printed circuit board (PCB).
Background technology
Printed circuit board (PCB) is widely used because having assembling density advantages of higher. Application about circuit card refers to document Takahashi, A.Ooki, N.Nagai, A.Akahoshi, H.Mukoh, A.Wajima, M.Res.Lab, HighdensitymultilayerprintedcircuitboardforHITACM-880, IEEETrans.onComponents, Packaging, andManufacturingTechnology, 1992,15 (4): 1418-1425.
Owing to electronic product is to individualized development, the requirement for the printed circuit board (PCB) being applied to electronic product is also more and more diversified. There is a kind of transparent printed circuit board (PCB) at present; it is for carrying and protect the insulated substrate of conductive circuit pattern, welding resisting layer etc. for transparent material; circuit in its conductive circuit pattern is generally slender type; and the material of its conductive circuit pattern is the copper through two-sided Darkening process, the black of the transparent and conductive circuit pattern of insulating material makes described printed circuit board (PCB) visually have transparent feel. The making method of described printed circuit board (PCB) is generally as follows: first, it is provided that a copper-clad base plate, it copper foil layer comprising a transparent insulation stratum basale and being arranged at described stratum basale surface, and described copper foil layer is because being black through two-sided Darkening process; Secondly, paste dry film on described copper foil layer surface, and through exposure, development, etching and stripping technique, form conductive circuit pattern on described stratum basale surface; Finally on described conductive circuit pattern surface and from the stratum basale surface pressing transparent mulch film that described conductive circuit pattern is exposed, form transparent printed circuit board (PCB).
Wherein, tradition Darkening process liquid medicine used is generally the melanism liquid medicine containing hypochlorite, form the zone of oxidation containing cupric oxide and Red copper oxide of a black on copper foil layer surface after Darkening process, this zone of oxidation and blackening layer, the blackening layer of traditional melanism liquid medicine is fine hair shape (referring to Fig. 1), the blackening layer of fine hair shape easily comes off and the region of polluting around circuit, affects the transparency of wiring board. And, it is only the surface of copper foil layer is processed due to Darkening process, therefore, after an etching step, in copper foil layer with removed adjacent side, region by etching and can appear the reddish-brown of fine copper because exposing the internal layer of copper foil layer, the final printed circuit board (PCB) formed can due to the reddish-brown of described conductive circuit pattern side thus transparent feel is poor.
Summary of the invention
, it is necessary to provide the making method of a kind of melanism liquid medicine and transparent printed circuit board (PCB), in view of this to improve the transparent feel of transparent printed circuit board (PCB).
A kind of melanism liquid medicine, sodium-chlor that it comprises sodium hydroxide that mass percentage is 3%-5%, mass percentage is 10%-15% sodium hypophosphite, mass percentage are 10%-15%, mass percentage are the benzotriazole of 2%-4% and mass percentage is the water of 70%-75%.
The making method of a kind of transparent printed circuit board (PCB), comprise step: provide copper-clad base plate, described copper-clad base plate comprises transparent dielectric base layer and is arranged at the copper foil layer of the one side melanism on described dielectric base layer surface, described copper foil layer comprises copper body layer and the first blackening layer, described copper body layer comprises four surface relative with the 3rd surface, the 3rd surface and connects the side on the 3rd surface and the 4th surface, described first blackening layer is formed at described 3rd surface, and described first blackening layer is between copper body layer and described stratum basale. Described copper foil layer is made and forms conductive circuit pattern, the described stratum basale of part is exposed from described conductive circuit pattern, thus described copper-clad base plate is made circuit substrate. The 4th surface and side that make the copper body layer forming conductive circuit pattern are placed in above-mentioned melanism liquid medicine carry out Darkening process, so that the described 4th all forms the 2nd blackening layer of black on the surface with on side. Described 2nd blackening layer surface at least partly and the surface of stratum basale exposed from described conductive circuit pattern form transparent mulch film, thus makes transparent printed circuit board (PCB).
Adopt the 4th surface making the copper body layer forming conductive circuit pattern of the transparent printed circuit board (PCB) that the melanism liquid medicine of this case and making method formed and side all by melanism, such that it is able to the transparent feel of wiring board that the reddish-brown preventing fine copper causes is not good, the transparent feel of transparent printed circuit board (PCB) is strengthened; In addition, this case use melanism liquid medicine compared to traditional melanism liquid medicine, the blackening layer of fine hair shape can not be produced, thus avoid fine hair come off and fine hair pollute wiring board other regions, also make the transparent feel of transparent printed circuit board (PCB) better.
Accompanying drawing explanation
Fig. 1 is the scanning electron microscopic picture of the blackening layer that tradition melanism liquid medicine process copper foil layer is formed.
Fig. 2 is the diagrammatic cross-section of the copper-clad base plate that the embodiment of the present invention provides.
Fig. 3 is the diagrammatic cross-section of the wiring board formed after laminating dry film, exposure, development, etching, stripping on the layers of copper surface of the copper-clad base plate of Fig. 2.
Fig. 4 is the diagrammatic cross-section after the surface of the layers of copper by the wiring board of Fig. 3 and side melanism.
Fig. 5 is the scanning electron microscopic picture after the surface of the layers of copper by the wiring board in Fig. 3 and side melanism.
Fig. 6 will form transparent mulch film on the wiring board in Fig. 4 and exposes the diagrammatic cross-section of electric connection pad from transparent mulch film.
Fig. 7 is the diagrammatic cross-section of the transparent printed circuit board (PCB) formed after forming surface-treated layer on the electric connection pad of wiring board in figure 6.
Main element nomenclature
| Copper-clad base plate | 10 |
| Dielectric base layer | 11 |
| Copper foil layer | 12 |
| First adhesive-layer | 13 |
| First surface | 111 |
| 2nd surface | 112 |
| Copper body layer | 121 |
| First blackening layer | 122 |
| 3rd surface | 123 |
| 4th surface | 124 |
| Conductive circuit pattern | 15 |
| Circuit substrate | 20 |
| Side | 125 |
| Conductive circuit pattern | 16 |
| 2nd blackening layer | 126 |
| Transparent mulch film | 18 |
| Rete | 181 |
| 2nd adhesive-layer | 182 |
| Electric connection pad | 17 |
| Through hole | 183 |
| Surface-treated layer | 19 |
| Transparent printed circuit board (PCB) | 30 |
Following embodiment will illustrate the present invention further in conjunction with above-mentioned accompanying drawing.
Embodiment
The transparent printed circuit board (PCB) and the making method thereof that the technical program are provided below in conjunction with drawings and Examples are described in further detail.
Referring to Fig. 1 to Fig. 5, the making method of the transparent printed circuit board (PCB) that the technical program embodiment provides comprises the following steps:
Step 1: refer to Fig. 2, it is provided that copper-clad base plate 10, described copper-clad base plate 10 comprises dielectric base layer 11, copper foil layer 12 and the first adhesive-layer 13 between dielectric base layer 11 and copper foil layer 12.
Described dielectric base layer 11 can be transparent flexible resin material or hard resin material. Described flexible resin material can be the conventional flexible materials of flexible circuit board, such as polyimide (Polyimide, PI), polyethylene terephthalate glycol (PolyethyleneTerephthalate, or poly-(ethylene naphthalate) (PolyethyleneNaphthalate PET), PEN) etc., it is preferable to the good polyimide of thermotolerance. Described hard resin material can be transparent rigid epoxy resin etc. In the present embodiment, described dielectric base layer 11 is transparent flexible resin material. Described dielectric base layer 11 comprises the first surface 111 and the 2nd surface 112.
Described copper foil layer 12 is the copper foil layer of one side melanism, it the first blackening layer 122 comprising copper body layer 121 and being formed at copper body layer 121 side, described copper body layer 121 comprises the 3rd relative surface 123 and the 4th surface 124, and described first blackening layer 122 is formed at the 3rd surface 123 of described copper body layer 121. Described first blackening layer 122 is wherein formed after carrying out Darkening process on a surface without the copper foil layer of Darkening process one, is not formed described copper body layer 121 by the part of Darkening process.
Described first adhesive-layer 13 is a transparent bonding sheet, and its material can be transparent epoxy resin, acryl resin or its mixture. Certainly described first adhesive-layer 13 can also be the matrix material that other is transparent, is not limited with the present embodiment. Relative two surfaces of described first adhesive-layer 13 are bonding with the first surface 111 of described dielectric base layer 11 and the first blackening layer 122 of described copper foil layer 12 respectively, for described copper foil layer 12 is bonded in the first surface 111 of described dielectric base layer 11. It can be appreciated that copper foil layer 12 can also directly be made in the first surface 111 of dielectric base layer 11, now then without the need to arranging the first adhesive-layer 13.
Step 2: refer to Fig. 3, adopts image transfer technique and etch process to be made by described copper foil layer 12 and forms conductive circuit pattern 15, form circuit substrate 20.
In the present embodiment, by laminating dry film, exposure, development, etching and stripping technique, described copper foil layer 12 is made formation conductive circuit pattern 15, specific as follows: first, described copper foil layer 12 surface is carried out microetch process; Secondly, pressing one dry film on described copper foil layer 12; Then, the dry film on described copper foil layer 12 is carried out selectivity exposure; Again, to dry film through exposure part develop, formed patterning photopolymer layer so that copper foil layer 12 need etching remove part do not covered by dry film, and copper foil layer 12 need formed circuit part still covered by dry film; Afterwards, copper etchant solution is utilized to etch, to remove copper foil layer 12 i.e. copper body layer 121 and the first blackening layer 122 exposing dry film, so that the part that the dry film that copper foil layer 12 is patterned covers forms conductive circuit pattern 15; Finally, utilize stripping technique dry film stripping remaining for copper foil layer 12 surface to be removed, form circuit substrate 20. Described circuit substrate 20 comprises dielectric base layer 11, conductive circuit pattern 15 and by the first bonding to described stratum basale and described conductive circuit pattern 15 adhesive-layer 13, wherein, described conductive circuit pattern 15 comprises copper body layer 121 and is formed at the 3rd surface 123 of described copper body layer 121 and first blackening layer 122 bonding with described first adhesive-layer 13. Described copper body layer 121 also comprises the side 125 between the 3rd surface 123 and the 4th surface 124, owing to described copper foil layer 12 has only carried out one side Darkening process, and copper foil layer 12 have passed through etch processes, come out in the side 125 of copper body layer 121, therefore, the 4th surface 124 of described copper body layer 121 and side 125 all show the reddish-brown of fine copper.
Certainly, it is also possible to by wet film technique described copper foil layer 12 made and form conductive circuit pattern 15. In addition, before described copper foil layer 12 is made formation conductive circuit pattern 15, it is also possible to comprise punching technology, to form multiple instrument holes (not shown), the through dielectric base layer 11 in described instrument hole and copper foil layer 12. Described instrument hole is used in subsequent step to be positioned by wiring board.
Step 3: refer to Fig. 4-5, forms the 2nd blackening layer 126 in the 4th surperficial 124 and side 125 of the copper body layer 121 of described conductive circuit pattern 15, makes the 4th surface 124 of described copper body layer 121 and side 125 all show black. After Darkening process, described conductive circuit pattern 15 is transformed into conductive circuit pattern 16, and described conductive circuit pattern 16 comprises copper body layer 121 and by the first coated for described copper body layer 121 blackening layer 122 and the 2nd blackening layer 126.
In the present embodiment, form the 2nd blackening layer 126 in the 4th surperficial 124 and side 125 of the copper body layer 121 of described conductive circuit pattern 15 and comprise the steps:
First, the 4th surface 124 of described copper body layer 121 and the surface of side 125 are carried out microetch process, makes the 4th surface 124 and side 125 coarseization. Described micro-etching solution can be comprise Sodium Persulfate (SPS) that concentration is 80 to 100g/L and weight hundred score concentration is 2% sulfuric acid (H2SO4) mixing solutions. Temperature of reaction can be 30 �� 5 DEG C, and the reaction times can be 30 to 60s.
Then, circuit substrate 20 is placed in melanism liquid medicine, to carry out blackening reaction on the described in the copper body layer 121 of conductive circuit pattern 15 the 4th surface 124 and side 125, thus form the 2nd blackening layer 126 on the 4th surface 124 of copper body layer 121 and side 125, make described 4th surface 124 and side 125 present black. Wherein, described melanism liquid medicine comprises: the benzotriazole of sodium hypophosphite that sodium hydroxide that mass percentage is 3%-5%, mass percentage are 10%-15%, mass percentage to be the sodium-chlor of 10%-15%, mass percentage be 2%-4% and mass percentage are the mixed solution of the water of 70%-75%; Described reaction can carry out under the situation of room temperature or heating, and the reaction times is relevant with the temperature of reaction, temperature low then must the reaction times longer, then the reaction times can shorten temperature height; Range of reaction temperature can be 50 DEG C to 80 DEG C, and in described range of reaction temperature, the reaction times can be 5 to 20 minutes (min). When temperature of reaction is 50 DEG C, the reaction times can be 20 minutes. When temperature of reaction is 70 DEG C, the reaction times can be 10 minutes. When temperature of reaction is 80 DEG C, the reaction times can be 5 minutes. In this melanism step, the copper body layer 121 of the 4th surface 124 and side 125 is reacted with blackening reaction liquid, generates the 2nd blackening layer 126 that main raw is cupric oxide, thus makes the 4th surface 124 and side 125 present black.
Finally, wash thus the working liquid of the residual on circuit substrate 20 surface after melanism is cleaned, to remove circuit substrate 20 drying of residual solution afterwards, namely obtain being formed on the 4th surface 124 of copper body layer 121 and side 125 circuit substrate 20 of the 2nd blackening layer 126.
Comparison diagram 1 and Fig. 5 this it appears that: the blackening layer of traditional melanism liquid medicine is fine hair shape, thus the blackening layer of fine hair shape easily comes off and the region of polluting around circuit, affects the transparency of wiring board; And the blackening layer that the melanism liquid medicine of this case is formed is finer and close, and there is no the generation of the blackening layer of fine hair shape, such that it is able to the region preventing villus shedding and polluting around circuit, thus the transparency of the wiring board formed is better.
Step 4: refer to Fig. 6, in the surface portion region of described conductive circuit pattern 16 and from the first adhesive-layer 13 surface formation transparent mulch film 18 that described conductive circuit pattern 16 is exposed, the position not covered by transparent mulch film 18 in described conductive circuit pattern 16 is made to form electric connection pad 17.
In the present embodiment, described transparent mulch film 18 comprises the rete 181 fitted and the 2nd adhesive-layer 182, the material of described rete 181 can be transparent PET, PEN or PI, and described 2nd adhesive-layer 182 is transparent epoxy resin, acryl resin or its mixture. Certainly described 2nd adhesive-layer 182 can also be the matrix material that other is transparent, is not limited with the present embodiment.
Described transparent mulch film 18 is formed at conductive circuit pattern 16 surface of described wiring board by the method for pressing, wherein, the surface portion region of described 2nd adhesive-layer 182 and described conductive circuit pattern 16 and the first adhesive-layer 13 of exposing from described conductive circuit pattern 16 are directly affixed. The formation mode of described electric connection pad 17 can be: before transparent mulch film described in pressing 18, the method of stamp etc. is utilized to form the through hole 183 running through transparent mulch film 18 at transparent mulch film 18, or after transparent mulch film described in pressing 18, the method of laser ablation is utilized to form the opening running through transparent mulch film 18 at transparent mulch film 18, partially conductive line pattern 16 is exposed from described through hole 183, thus forms electric connection pad 17. In the present embodiment, the quantity of electric connection pad 17 is one, and certainly, the quantity of electric connection pad 17 can also be multiple.
Step 5: refer to Fig. 7, forms the surface-treated layer 19 of conduction on described electric connection pad 17, forms transparent printed circuit board (PCB) 30.
Before forming surface-treated layer 19, first utilize cupric oxide etching solution that the 2nd blackening layer 126 on electric connection pad 17 surface is etched removal, expose the copper body layer 121 of internal layer. In the present embodiment, the mode forming described surface-treated layer 19 is electrogilding. Described surface-treated layer 19 conducts with electric connection pad 17. It can be appreciated that the method forming described surface-treated layer 19 can also be substituted by plating nickel gold, change nickel leaching is golden, nickel plating palladium is golden, zinc-plated, it is not limited with the present embodiment. Described acting as of electric connection pad 17 is electrically connected with electronic devices and components, it is appreciated that, according to actual needs, described electric connection pad 17 can also omit, at this moment, all surfaces that described transparent mulch film 18 covers conductive circuit pattern 16 and the surface of the first adhesive-layer 13 exposed from described conductive circuit pattern 16.
In the present embodiment, described transparent printed circuit board (PCB) 30 is single-clad board, namely only comprises one layer of conductive circuit pattern 16. It is appreciated that, the method being similar to the present embodiment can also be adopted to adopt Layer increasing method to make and to form multi-layer transparent printed circuit board (PCB) 30, namely described dielectric base layer 11 can be multilager base plate, comprising alternately arranged multi-layer transparent resin layer and the conductive circuit pattern of multilayer side and relative two equal melanism in surface, described multilayer conductive circuit figure can adopt Layer increasing method to make by the method being similar to the present embodiment and be formed. In addition, the making method of described transparent printed circuit board (PCB) 30 can also be applied to rigid-flex combined board.
The side of the conductive circuit pattern 16 of the transparent printed circuit board (PCB) 30 that employing the present embodiment melanism liquid medicine and making method are formed and two apparent surfaces are all by melanism, such that it is able to the transparent feel of wiring board that the reddish-brown preventing fine copper causes is not good, the transparent feel of transparent printed circuit board (PCB) 30 is strengthened; In addition, this case use melanism liquid medicine compared to traditional melanism liquid medicine, the blackening layer of fine hair shape can not be produced, thus avoid fine hair come off and fine hair pollute wiring board other regions, also make the transparent feel of transparent printed circuit board (PCB) 30 better.
It should be appreciated that for the person of ordinary skill of the art, it is possible to make other various corresponding change and distortion according to the technical conceive of the present invention, and all these change the protection domain that all should belong to the claims in the present invention with distortion.
Claims (10)
1. a melanism liquid medicine, sodium-chlor that it comprises sodium hydroxide that mass percentage is 3%-5%, mass percentage is 10%-15% sodium hypophosphite, mass percentage are 10%-15%, mass percentage are the benzotriazole of 2%-4% and mass percentage is the water of 70%-75%.
2. a making method for transparent printed circuit board (PCB), comprises step:
Copper-clad base plate is provided, described copper-clad base plate comprises transparent dielectric base layer and is arranged at the copper foil layer of the one side melanism on described dielectric base layer surface, described copper foil layer comprises copper body layer and the first blackening layer, described copper body layer comprises four surface relative with the 3rd surface, the 3rd surface and connects the side on the 3rd surface and the 4th surface, described first blackening layer is formed at described 3rd surface, and described first blackening layer is between copper body layer and described stratum basale;
Described copper foil layer is made and forms conductive circuit pattern, the described stratum basale of part is exposed from described conductive circuit pattern, thus described copper-clad base plate is made circuit substrate;
The 4th surface and side that make the copper body layer forming conductive circuit pattern are placed in melanism liquid medicine according to claim 1 carry out Darkening process, so that the described 4th all forms the 2nd blackening layer of black on the surface with on side; And
Described 2nd blackening layer surface at least partly and the surface of stratum basale exposed from described conductive circuit pattern form transparent mulch film, thus makes transparent printed circuit board (PCB).
3. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, it is 50 DEG C to 80 DEG C that the 4th surface and side that make the copper body layer forming conductive circuit pattern are placed in the temperature that described melanism liquid medicine carries out Darkening process, and the time is 5 to 20 minutes.
4. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, before the 4th surface and side that make the copper body layer forming conductive circuit pattern being placed in described melanism liquid medicine and carries out Darkening process, the 4th surface of described copper body layer and the surface of side are carried out microetch process.
5. the making method of transparent printed circuit board (PCB) as claimed in claim 4, it is characterised in that, it is comprise Sodium Persulfate that concentration is 80 to 100g/L and weight hundred score concentration is the mixing solutions of 2% sulfuric acid that microetch processes micro-etching solution used.
6. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, after the 4th surface and side that make the copper body layer forming conductive circuit pattern being placed in described melanism liquid medicine and carry out Darkening process, washing and dry described circuit substrate successively.
7. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, described copper-clad base plate comprises the transparent adhesive-layer being arranged between described stratum basale and described copper foil layer further, and described transparent adhesive-layer is for adhering to described stratum basale and described copper foil layer.
8. the making method of transparent printed circuit board (PCB) as claimed in claim 2, it is characterized in that, described transparent mulch film covers the surface of described 2nd blackening layer, described transparent mulch film has through described transparent mulch film through hole, and the conductive circuit pattern exposed from the through hole of described transparent mulch film forms electric connection pad.
9. the making method of transparent printed circuit board (PCB) as claimed in claim 8, it is characterised in that, the making method of described printed circuit board (PCB) comprises step further: remove the 2nd blackening layer etching on described electric connection pad surface to expose copper body layer; And form surface-treated layer in the copper body layer exposed.
10. the making method of transparent printed circuit board (PCB) as claimed in claim 9, it is characterised in that, the method forming described surface-treated layer is electrogilding, plating nickel gold, change nickel leaching gold, nickel plating palladium gold or zinc-plated.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582410.2A CN103898498B (en) | 2012-12-28 | 2012-12-28 | The making method of melanism liquid medicine and transparent printed circuit board (PCB) |
| TW102103533A TWI457466B (en) | 2012-12-28 | 2013-01-30 | Blacken reagent and method for manufacturing transparent printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210582410.2A CN103898498B (en) | 2012-12-28 | 2012-12-28 | The making method of melanism liquid medicine and transparent printed circuit board (PCB) |
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| CN103898498A CN103898498A (en) | 2014-07-02 |
| CN103898498B true CN103898498B (en) | 2016-06-01 |
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| CN201210582410.2A Active CN103898498B (en) | 2012-12-28 | 2012-12-28 | The making method of melanism liquid medicine and transparent printed circuit board (PCB) |
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| CN (1) | CN103898498B (en) |
| TW (1) | TWI457466B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108156763B (en) * | 2016-12-05 | 2020-08-07 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and manufacturing method thereof |
| CN109576696B (en) * | 2017-09-29 | 2021-02-26 | 蓝思科技（长沙）有限公司 | Blackening liquid medicine for metal grid, blackening method of blackening liquid medicine, metal grid and touch screen |
| CN113660788A (en) * | 2020-05-12 | 2021-11-16 | 鹏鼎控股(深圳)股份有限公司 | Transparent circuit board and manufacturing method thereof |
| CN115433930B (en) * | 2022-07-06 | 2023-11-28 | 南通群安电子材料有限公司 | Non-phosphorus blackening liquid for copper metal grid conductive film and preparation and use methods thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054061A (en) * | 1997-12-11 | 2000-04-25 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
| US6528409B1 (en) * | 2002-04-29 | 2003-03-04 | Advanced Micro Devices, Inc. | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
| CN101467501A (en) * | 2007-02-06 | 2009-06-24 | 揖斐电株式会社 | Printed wiring board and method for manufacturing the same |
| CN102286739A (en) * | 2011-08-31 | 2011-12-21 | 上海应用技术学院 | Blackening agent for inner layer of multilayer board of printed circuit board and preparation method and application thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5869130A (en) * | 1997-06-12 | 1999-02-09 | Mac Dermid, Incorporated | Process for improving the adhesion of polymeric materials to metal surfaces |
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2012
- 2012-12-28 CN CN201210582410.2A patent/CN103898498B/en active Active
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- 2013-01-30 TW TW102103533A patent/TWI457466B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054061A (en) * | 1997-12-11 | 2000-04-25 | Shipley Company, L.L.C. | Composition for circuit board manufacture |
| US6528409B1 (en) * | 2002-04-29 | 2003-03-04 | Advanced Micro Devices, Inc. | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
| CN101467501A (en) * | 2007-02-06 | 2009-06-24 | 揖斐电株式会社 | Printed wiring board and method for manufacturing the same |
| CN102286739A (en) * | 2011-08-31 | 2011-12-21 | 上海应用技术学院 | Blackening agent for inner layer of multilayer board of printed circuit board and preparation method and application thereof |
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| Publication number | Publication date |
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| TW201425644A (en) | 2014-07-01 |
| TWI457466B (en) | 2014-10-21 |
| CN103898498A (en) | 2014-07-02 |
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Effective date of registration: 20170317 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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