WO2013150841A1 - Système de transport - Google Patents

Système de transport Download PDF

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Publication number
WO2013150841A1
WO2013150841A1 PCT/JP2013/055156 JP2013055156W WO2013150841A1 WO 2013150841 A1 WO2013150841 A1 WO 2013150841A1 JP 2013055156 W JP2013055156 W JP 2013055156W WO 2013150841 A1 WO2013150841 A1 WO 2013150841A1
Authority
WO
WIPO (PCT)
Prior art keywords
conveyed
stacker crane
semiconductor manufacturing
transported
storage shelf
Prior art date
Application number
PCT/JP2013/055156
Other languages
English (en)
Japanese (ja)
Inventor
山本　眞
Original Assignee
村田機械株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 村田機械株式会社 filed Critical 村田機械株式会社
Publication of WO2013150841A1 publication Critical patent/WO2013150841A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers

Definitions

  • the present invention relates to a transport system.
  • the transport system described in Patent Document 1 includes a warehouse having a plurality of circulation-type shelves for storing articles, and a ceiling transport vehicle and an automatic guided vehicle for transporting articles outside the warehouse.
  • the loading / unloading entrances provided at the top and bottom of the warehouse are used for transfer with the overhead transport vehicle and the automatic guided vehicle.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a transport system that can secure a storage space for a transported object and can improve the transport efficiency of the transported object.
  • a transport system is provided above a loader port, a stacker crane that loads a transported object into a load port of a semiconductor manufacturing apparatus and unloads the transported object from the load port. And a stacker crane that is provided in the vicinity of the semiconductor manufacturing apparatus and that travels along the trajectory and moves the gripper that grips the object to be conveyed to convey the object to be conveyed.
  • a storage shelf in which the object can be taken in and out, and the object can be carried in and out by a stacker crane and an overhead carriage at the load port.
  • a storage shelf for storing the object to be transported is provided in the vicinity of the semiconductor manufacturing apparatus.
  • the space which accommodates a to-be-conveyed object is securable.
  • the storage shelf is disposed in the vicinity of the semiconductor manufacturing apparatus, the transfer of the object to be transported between the storage shelf and the load port can be performed quickly.
  • At least a part of the storage shelf is provided so that an object to be transported can be taken in and out by a gripper of a ceiling transport vehicle.
  • the storage shelf can function as a port for exchanging the object to be transported between the stacker crane and the overhead transport vehicle. Thereby, conveyance of a to-be-conveyed object can be implemented more efficiently.
  • the semiconductor manufacturing apparatuses are arranged to face each other at a predetermined interval, and the stacker crane is movable between the opposing semiconductor manufacturing apparatuses in a direction substantially orthogonal to the facing direction.
  • the object to be conveyed is carried into and out of each load port of each semiconductor manufacturing apparatus.
  • the present invention it is possible to secure a storage space for the object to be conveyed and improve the efficiency of conveying the object to be conveyed.
  • FIG. 1 is a figure which looked at the conveyance system concerning one embodiment from the top.
  • FIG. 2 is a perspective view showing the transport system shown in FIG.
  • FIG. 1 is a top view of a transport system according to an embodiment.
  • FIG. 2 is a perspective view showing the transport system shown in FIG.
  • the transport system 100 shown in FIGS. 1 and 2 is provided in a clean room for manufacturing semiconductor devices.
  • the transport system 100 includes a storage shelf 20 that stores the object to be transported 10, a stacker crane 30, and a vehicle (ceiling transport vehicle) 40.
  • Semiconductor manufacturing apparatuses 50 and 52 are arranged in the clean room.
  • the semiconductor manufacturing apparatuses 50 and 52 are provided with load ports 54 and 56 for carrying the object 10 into and out of the semiconductor manufacturing apparatuses 50 and 52, respectively.
  • the transport system 100 is made of MCS (Material Control system).
  • the MCS is provided between the controller that controls the stacker crane 30 and the vehicle 40 and the MES (Manufacturing Execution System), and transmits various instructions from the MES to the controller in a timely manner, and reports from the controller are collectively transmitted to the MES. It has the function to do.
  • the MES is an integrated production information system that manages and manages various types of information at the factory site, and manages information on the MCS and the semiconductor manufacturing apparatuses 50 and 52.
  • the transported object 10 is a container (so-called FOUP (Front Opening Unified Pod)) containing a plurality of semiconductor wafers.
  • a flange portion 10b that is held by a gripper 44 of a vehicle 40 to be described later is provided on the upper surface 10a of the conveyed object 10.
  • a detachable lid (not shown) for taking in and out the semiconductor wafer is attached to the side surface (rear surface) 10c of the transferred object 10.
  • the storage shelf 20 is a shelf for temporarily storing the object to be transported 10.
  • the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52.
  • the storage shelf 20 is disposed with the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52 interposed therebetween.
  • the storage shelf 20 is provided with a plurality of rows (in this case, three rows) of placement portions 22 on which the object 10 is placed in the height direction.
  • the mounting portion 22 is provided with a pin 24 that protrudes upward from the upper surface thereof.
  • the pin 24 engages with a positioning hole (not shown) provided on the bottom surface of the conveyed object 10.
  • the conveyed object 10 is positioned in the storage shelf 20 by the pin 24.
  • a clearance for inserting a transfer arm 39c (described later) of the stacker crane 30 is provided in the mounting portion 22 below the bottom surface of the conveyed object 10.
  • the upper part of the storage shelf 20 is open. That is, at least a part of the storage shelf 20 can be loaded and unloaded with the gripper 44 of the vehicle 40.
  • the conveyed object 10 is placed so that the front surface (the surface opposite to the side surface 10 c to which the lid is attached) faces the stacker crane 30 side.
  • the number of installations and installation positions of the storage shelves 20 are appropriately set according to the installation positions and number of semiconductor manufacturing apparatuses 50 and 52 and the structure of the clean room.
  • the storage shelf 20 may be suspended from the ceiling, or may be fixed to the floor with a support member or the like interposed.
  • the stacker crane 30 is provided so as to be movable in the vertical direction with respect to the strut device 34, a traveling carriage 32 that moves along the rail R ⁇ b> 1 in the clean room, two strut devices 34 erected on the traveling carriage 32, and the strut device 34.
  • the lift table 36 and the transfer device 38 installed on the lift table 36 are configured.
  • the stacker crane 30 includes a turntable installed on the lifting platform 36, a controller that controls the operation of the stacker crane 30, and the like.
  • the stacker crane 30 moves linearly along the rail R1 laid in the clean room.
  • the rail R1 is laid along a direction orthogonal to the facing direction between the semiconductor manufacturing apparatuses 50 and 52 disposed facing each other. That is, the stacker crane 30 is provided so as to be movable along a direction substantially orthogonal to the facing direction of the semiconductor manufacturing apparatuses 50 and 52. Note that the term “opposite” as used herein does not require the semiconductor manufacturing apparatuses 50 and 52 to completely face each other, as long as they are arranged at a predetermined interval.
  • the transfer device 38 has a scalar arm 39.
  • the scalar arm 39 includes a proximal end arm 39a, a distal end arm 39b, and a transfer arm 39c.
  • the upper surface of the transfer arm 39c constitutes a placement surface on which the article to be transported 10 is placed.
  • the scalar arm 39 linearly moves in the direction (the direction in which the article to be conveyed 10 is taken in and out) perpendicular to the moving direction of the traveling carriage 32 by the transfer arm 39c.
  • the stacker crane 30 operates as follows. That is, the stacker crane 30 stops in front of the predetermined storage rack 20 and takes out the predetermined object 10 stored in the storage rack 20 by the transfer arm 39c. Subsequently, the stacker crane 30 is moved along the rail R ⁇ b> 1 by the traveling carriage 32, and the transferred object 10 is transferred to the load port 54 of the semiconductor manufacturing apparatus 50, for example. Further, the stacker crane 30 is stopped before the load port 56 of the semiconductor manufacturing apparatus 52, for example, and the transferred object 10 placed on the load port 56 is carried out by the transfer arm 39c. Subsequently, the stacker crane 30 moves along the rail R ⁇ b> 1 by the traveling carriage 32 to the conveyance destination (for example, the storage shelf 20), and transfers the object to be conveyed 10.
  • the conveyance destination for example, the storage shelf 20
  • the stacker crane 30 is provided so as to be rotatable by a turntable. Therefore, the stacker crane 30 moves the scalar arm 39 toward one of the semiconductor manufacturing apparatus 50 side and the semiconductor manufacturing apparatus 52 side by appropriately changing the direction with the turntable. As a result, the stacker crane 30 loads and unloads the transferred object 10 with respect to each of the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52 arranged to face each other.
  • one stacker crane 30 may be installed on the rail R1, or a plurality of stacker cranes 30 may be installed.
  • Vehicle 40 is OHT (Overhead Hoist Transport), which transports the transported object 10 along a traveling rail (track) R2.
  • the traveling rail R ⁇ b> 2 is installed on the ceiling of the clean room, and is disposed above the load ports 54 and 56 of the semiconductor manufacturing apparatuses 50 and 52.
  • the vehicle 40 has a gripper 44.
  • the gripper 44 holds the conveyed object 10 by gripping the flange portion 10b.
  • the gripper 44 is lowered from a predetermined position by a plurality of belts 46 being synchronously fed by an elevating unit (not shown). Further, the gripper 44 is moved up to a predetermined position by the plurality of belts 46 being synchronously wound by the elevating part.
  • the vehicle 40 operates as follows. That is, the vehicle 40 transports the transported object 10 from a transport source (for example, a stocker of the transported object), stops, for example, above the load port 54 of the semiconductor manufacturing apparatus 50, and lowers the transported object 10 that has been transported. And place it on the load port 54. Further, the vehicle 40 transports the transported object 10 from the transport source, stops above the predetermined storage shelf 20, lowers the transported transported object 10, and transports the transported object 10 to a predetermined position on the storage shelf 20. The object 10 is placed.
  • a transport source for example, a stocker of the transported object
  • the vehicle 40 stops, for example, above the load port 56 of the semiconductor manufacturing apparatus 52, grips the object to be transported 10 placed on the load port 56 with the gripper 44, and lifts it while holding it.
  • the conveyed product 10 is conveyed to a predetermined conveyance destination. Further, the vehicle 40 stops, for example, above the storage shelf 20, holds the object to be conveyed 10 stored in the storage shelf 20 with the gripper 44, and raises the object to be conveyed 10 in a predetermined state. Transport to destination.
  • the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52.
  • the storage shelf 20 can secure a space for storing the transported object 10. Further, since the storage shelf 20 is disposed in the vicinity of the semiconductor manufacturing apparatuses 50 and 52, the transfer of the transported object 10 between the storage shelf 20 and the load ports 54 and 56 can be performed quickly.
  • the vehicle 40 directly carries in and out the article 10 to / from the load ports 54 and 56.
  • the transported object 10 is transported and placed on a predetermined port by a vehicle 40, and then the stacker crane 30 is placed.
  • the object to be conveyed 10 was carried into a predetermined load port. For this reason, it takes time to transport the object to be transported 10.
  • the object to be conveyed 10 can be directly carried into and out of the load ports 54 and 56 by the vehicle 40 without using the stacker crane 30, the time for temporarily storing the object to be conveyed 10 The transfer time by the stacker crane 30 is shortened. Therefore, the conveyance time of the conveyed product 10 can be shortened, and the conveyed product 10 can be conveyed quickly. In addition, it is possible to improve the degree of freedom in transporting the transported object 10. As described above, in this embodiment, it is possible to improve the conveyance efficiency of the object to be conveyed 10.
  • the upper part of the storage shelf 20 is opened. Thereby, the vehicle 40 can take in and out the article to be transported 10 in the storage shelf 20. Therefore, the storage shelf 20 can function as a port for exchanging the conveyed object 10 between the stacker crane 30 and the vehicle 40. Thereby, conveyance of the to-be-conveyed object 10 can be implemented more efficiently.
  • the stacker crane 30 is disposed between the semiconductor manufacturing apparatuses 50 and 52 disposed to face each other, and is movable between the semiconductor manufacturing apparatuses 50 and 52.
  • the stacker crane 30 can access both the load ports 54 and 56, the transfer time of the conveyed object 10 can be shortened.
  • the present invention is not limited to the above embodiment.
  • the configuration in which the two semiconductor manufacturing apparatuses 50 and 52 are arranged has been described as an example.
  • the number of semiconductor manufacturing apparatuses to be installed may be appropriately set according to the design of the semiconductor manufacturing factory. Good.
  • an interbay stocker for temporarily storing the object to be transported 10 may be provided.
  • the stacker crane 30 and the vehicle 40 are accessible to the interbay stocker.
  • SYMBOLS 100 ... Conveyance system, 10 ... Conveyed object, 20 ... Storage shelf, 30 ... Stacker crane, 40 ... Vehicle (ceiling conveyance vehicle), 44 ... Gripper, 50, 52 ... Semiconductor manufacturing apparatus, 54, 56 ... Load port.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

L'invention fournit un système de transport permettant de garantir un espace de stockage pour des articles à transporter, et améliorant l'efficacité de transport de ces articles à transporter. Le système de l'invention est équipé : d'un pont roulant gerbeur (30) à l'aide duquel les articles à transporter (10) sont chargés et déchargés de ports de chargement (54, 56) de dispositifs de fabrication de semi-conducteurs (50, 52) ; d'un véhicule (40) qui progresse suivant un rail (R2) agencé au-dessus des ports de chargement (54, 56), et qui transporte les articles à transporter (10) par hissage d'une pince (44) exerçant une préhension des articles à transporter (10) ; et d'une étagère de stockage (20) qui est agencée à proximité des dispositifs de fabrication de semi-conducteurs (50, 52), et qui permet le stockage des articles à transporter (10) et l'évacuation de ces derniers à l'aide du pont roulant gerbeur (30). À l'aide du pont roulant gerbeur (30) et du véhicule (40), les articles à transporter (10) peuvent être chargés et déchargés des ports de chargement (54, 56).
PCT/JP2013/055156 2012-04-05 2013-02-27 Système de transport WO2013150841A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-086412 2012-04-05
JP2012086412A JP2015117073A (ja) 2012-04-05 2012-04-05 搬送システム

Publications (1)

Publication Number Publication Date
WO2013150841A1 true WO2013150841A1 (fr) 2013-10-10

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Application Number Title Priority Date Filing Date
PCT/JP2013/055156 WO2013150841A1 (fr) 2012-04-05 2013-02-27 Système de transport

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JP (1) JP2015117073A (fr)
TW (1) TW201348100A (fr)
WO (1) WO2013150841A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160035607A1 (en) * 2014-07-30 2016-02-04 Samsung Electronics Co., Ltd. Semiconductor wafer stocker apparatus and wafer transferring methods using the same
WO2019181241A1 (fr) * 2018-03-22 2019-09-26 村田機械株式会社 Système de stockage
TWI722208B (zh) * 2016-06-27 2021-03-21 日商村田機械股份有限公司 搬送系統
CN112693912A (zh) * 2021-03-24 2021-04-23 大捷智能科技(广东)有限公司 一种装配组合结构

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107555168A (zh) * 2017-09-05 2018-01-09 上海福赛特机器人有限公司 一种零件输送***

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Publication number Priority date Publication date Assignee Title
JPH09315521A (ja) * 1996-06-03 1997-12-09 Shinko Electric Co Ltd ストッカへの搬送システム
JPH10261685A (ja) * 1997-03-17 1998-09-29 Dainippon Screen Mfg Co Ltd 基板処理システムおよび基板処理装置
JP2001127134A (ja) * 1999-10-27 2001-05-11 Matsushita Electronics Industry Corp キャリア搬送システム
JP2001213588A (ja) * 1998-12-02 2001-08-07 Shinko Electric Co Ltd 天井走行搬送装置
JP2004327575A (ja) * 2003-04-23 2004-11-18 Renesas Technology Corp 半導体製造設備の稼働制御方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09315521A (ja) * 1996-06-03 1997-12-09 Shinko Electric Co Ltd ストッカへの搬送システム
JPH10261685A (ja) * 1997-03-17 1998-09-29 Dainippon Screen Mfg Co Ltd 基板処理システムおよび基板処理装置
JP2001213588A (ja) * 1998-12-02 2001-08-07 Shinko Electric Co Ltd 天井走行搬送装置
JP2001127134A (ja) * 1999-10-27 2001-05-11 Matsushita Electronics Industry Corp キャリア搬送システム
JP2004327575A (ja) * 2003-04-23 2004-11-18 Renesas Technology Corp 半導体製造設備の稼働制御方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160035607A1 (en) * 2014-07-30 2016-02-04 Samsung Electronics Co., Ltd. Semiconductor wafer stocker apparatus and wafer transferring methods using the same
KR20160015092A (ko) * 2014-07-30 2016-02-12 삼성전자주식회사 반도체 제조 라인의 스토커 및 상기 스토커를 이용하여 웨이퍼를 이송하는 방법
US9543178B2 (en) * 2014-07-30 2017-01-10 Samsung Electronics Co., Ltd. Semiconductor wafer stocker apparatus and wafer transferring methods using the same
KR102174332B1 (ko) * 2014-07-30 2020-11-04 삼성전자주식회사 반도체 제조 라인의 스토커 및 상기 스토커를 이용하여 웨이퍼를 이송하는 방법
TWI722208B (zh) * 2016-06-27 2021-03-21 日商村田機械股份有限公司 搬送系統
WO2019181241A1 (fr) * 2018-03-22 2019-09-26 村田機械株式会社 Système de stockage
JPWO2019181241A1 (ja) * 2018-03-22 2021-05-13 村田機械株式会社 ストッカシステム
EP3770082A4 (fr) * 2018-03-22 2021-12-15 Murata Machinery, Ltd. Système de stockage
US11239102B2 (en) 2018-03-22 2022-02-01 Murata Machinery, Ltd. Stocker system
CN112693912A (zh) * 2021-03-24 2021-04-23 大捷智能科技(广东)有限公司 一种装配组合结构

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TW201348100A (zh) 2013-12-01
JP2015117073A (ja) 2015-06-25

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