WO2013121479A1 - Dispositif de source d'éclairage - Google Patents

Dispositif de source d'éclairage Download PDF

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Publication number
WO2013121479A1
WO2013121479A1 PCT/JP2012/006830 JP2012006830W WO2013121479A1 WO 2013121479 A1 WO2013121479 A1 WO 2013121479A1 JP 2012006830 W JP2012006830 W JP 2012006830W WO 2013121479 A1 WO2013121479 A1 WO 2013121479A1
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WO
WIPO (PCT)
Prior art keywords
wiring board
light source
source device
wiring
light emitting
Prior art date
Application number
PCT/JP2012/006830
Other languages
English (en)
Japanese (ja)
Inventor
和繁 杉田
伊藤　和彦
藤田　寛
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013508062A priority Critical patent/JP5555371B2/ja
Priority to CN201290001172.5U priority patent/CN204127690U/zh
Publication of WO2013121479A1 publication Critical patent/WO2013121479A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a light source device for illumination provided with a light emitting element such as an LED (light emitting diode).
  • a light emitting element such as an LED (light emitting diode).
  • light source devices using light emitting elements such as LEDs (light emitting diodes) as light sources such as light bulb-shaped LED lamps have come to be adopted as devices for various illuminations.
  • a light emitting module in which a light emitting element is mounted on a substrate, a circuit unit for supplying power to the light emitting module, and the light emitting module and the circuit unit are accommodated. It has an outer case and is equipped with a glove or the like that covers the light emitting module.
  • the light emitting elements are integrated and arranged at high density to increase the luminance.
  • Patent Document 1 In the device shown, a metal substrate is used as the substrate of the light emitting module.
  • the illumination light source device in which the light emitting module and the circuit unit are housed in the outer case, it is desirable to suppress the heat transfer between the light emitting module and the circuit unit to suppress the temperature rise of the electronic component Be
  • an insulating plate is generally inserted between the substrate of the light emitting module and the substrate of the circuit unit, the use of an insulating member or the like can be reduced in the illumination light source device to provide a simple device configuration. It is desired.
  • the present invention has been made under such background, and in a light source device for illumination in which a light emitting module and a circuit unit are housed in an outer case, the heat insulation between the light emitting module and the circuit unit and both substrates It is an object of the present invention to simplify the apparatus configuration by suppressing the use of the insulating member while securing the insulation therebetween.
  • a light emitting module formed by mounting a light emitting element on one main surface of a first wiring board and electrons constituting a lighting circuit of the light emitting element It has a circuit unit in which components are mounted on a second wiring board, and an outer case housing the light emitting module and the circuit unit, and the first wiring board is formed on an insulating substrate and one main surface side of the insulating substrate And the wiring layer is not formed on the other main surface side, with the other main surface facing the second wiring substrate, with the space between the second wiring substrate and the second wiring substrate. It was decided to arrange oppositely.
  • the first wiring substrate includes the insulating substrate, and the wiring layer is not formed on the other main surface side, and the other main surface is opposed to the second wiring substrate.
  • the second wiring board and the second wiring board are disposed opposite to each other with a space therebetween. That is, since the insulating substrate is exposed on the surface of the first wiring substrate opposed to the second wiring substrate, it is possible to ensure that no separate insulating member is inserted between the first wiring substrate and the second wiring substrate. The insulation between the wiring layer of the light emitting module and the second wiring substrate can be achieved.
  • the heat insulating function is exerted and heat from the light emitting element is transmitted to the electronic component. It is suppressed.
  • an insulation member can be suppressed and it can be set as a simple apparatus structure, ensuring the insulation between the light emitting module and a circuit unit, and insulation between board
  • FIG. 1 is a cross-sectional view of an illumination light source device according to a first embodiment.
  • FIG. 2 is an exploded view of the illumination light source device 1; It is the figure which saw the state which removed the globe 40 in the light source device 1 for illumination from the front.
  • FIG. 8 is a cross-sectional view showing the main parts of a light source device for illumination according to a second embodiment.
  • FIG. 10 is a cross-sectional view showing the main parts of a light source device for illumination according to a third embodiment.
  • a light emitting module in which a light emitting element is mounted on one main surface of a first wiring board, and an electronic component constituting a lighting circuit of the light emitting element are used as a second wiring board.
  • the first circuit board includes the circuit unit mounted and the outer case housing the light emitting module and the circuit unit, and the first wiring substrate includes the insulating substrate and the wiring layer formed on one of the main surfaces of the insulating substrate.
  • the wiring layer is not formed on the other main surface side, and the other wiring surface is opposed to the second wiring substrate with the space gap interposed therebetween in a state where the other main surface faces the second wiring substrate.
  • the light source device for illumination of the above aspect may be as follows.
  • the first wiring board and the second wiring board are held relative to each other by holding members bridged across the two boards, and one of the first wiring board and the second wiring board is supported by the outer case.
  • the holding member also serves as a wire for supplying power from the second wiring board to the light emitting module.
  • each of the first wiring board and the second wiring board is brought into contact with the outer case with a heat transfer material.
  • the second wiring board is smaller in size than the first wiring board.
  • each of the first wiring substrate and the second wiring substrate is supported by the outer case.
  • a gap is provided between the outer periphery of the first wiring substrate and the inner peripheral surface of the outer shell case, and a glove having an opening aligned with the opening of the outer shell, with the opening edge of the glove inserted in the gap, Fix to the outer case.
  • a reflective layer that enhances the reflectance to light from the light emitting element is formed in an area other than the area where the light emitting element is mounted.
  • the reflective layer is a resin film in which a reflective material is dispersed.
  • an intermediate layer made of a thermally conductive material is provided on the insulating substrate along the wiring layer formed on the one main surface side.
  • the insulating layer of the first wiring board is formed of a material selected from glass epoxy material, paper phenol material, glass composite, and heat resistant resin.
  • a thermally conductive filler is filled between the electronic components in the circuit unit and the inner surface of the outer case.
  • FIG. 1 is a longitudinal sectional view of the illumination light source device 1 according to the first embodiment, and FIG. 2 is an exploded view thereof.
  • the illumination light source device 1 (referred to as the “light source device 1”) is a bulb-shaped (A-shaped) lamp which approximates the shape of an incandescent lamp.
  • the light source device 1 is, for example, a "40 W equivalent” used in place of a 40 W type incandescent lamp.
  • the direction in which light is emitted from the device is taken as the front.
  • the light source device 1 is configured such that the light emitting module 10 and the circuit unit 20 are housed in the outer case 30.
  • the light emitting module 10 has a plurality of light emitting elements 12 mounted on a first wiring board 11.
  • the circuit unit 20 has a plurality of electronic components 22 to 26 constituting a circuit for lighting the light emitting element 12 mounted on the second wiring board 21.
  • the outer case 30 has a tubular shape and has an opening 31 on the front end side.
  • the light emitting module 10 is disposed such that the first wiring board 11 closes the opening 31 of the outer case 30, and emits light from the light emitting element 12 forward.
  • the shape of the outer shell case 30 is cylindrical as shown in FIGS. 2 and 3 and the opening 31 is also circular, but it may be implemented similarly even if it has a rectangular cylindrical shape.
  • a pair of lead wires 15 is bridged across the first wiring board 11 and the second wiring board 21 between the light emitting module 10 and the circuit unit 20.
  • the pair of lead wires 15 is a feed path from the first wiring board 11 to the light emitting module 10 in the circuit unit 20, and holds the first wiring board 11 and the second wiring board 21 mutually.
  • Each lead wire 15 extends in the front-rear direction, and its front end 15 a is joined to the first wiring board 11 and its rear end 15 b is joined to the second wiring board 21.
  • FIG. 3 is a front view of the light source device 1 with the globe 40 removed.
  • the light emitting module 10 is configured by mounting the plurality of light emitting elements 12 on the front surface of the first wiring substrate 11.
  • the first wiring substrate 11 has a disk shape slightly smaller in diameter than the opening 31.
  • the first wiring substrate 11 is composed of a substrate body 110 formed of a nonmetallic insulating material and a wiring layer 111 formed on the front side, and no wiring layer is formed on the back surface 11 a side.
  • FIG. 4 is a schematic view in which the light emitting module 10 and the circuit unit 20 shown in FIG. 1 are partially enlarged.
  • the substrate body 110 is a plate-like member formed entirely of an insulating material, and the insulating material is exposed on the entire back surface 11 a.
  • a resin having heat resistance for example, Teflon (TM)
  • Teflon (TM) Teflon
  • the wiring layer 111 is made of patterned copper foil, and the light emitting elements 12 are mounted on the wiring layer 111.
  • the light emitting element 12 is an element using a semiconductor as a light emitting source, and may be an element such as a light emitting diode (LED), an organic EL, or a semiconductor laser.
  • LED light emitting diode
  • OLED organic EL
  • semiconductor laser a semiconductor laser
  • As an LED element a SMD (Surface Mount Device, surface mounting components) type LED element can be used.
  • the element may be sealed with a sealing layer using a COB (chip on board) type LED element.
  • a high-intensity SMD (Surface Mount Device, surface mounting component) type LED element which emits white light by a blue LED chip and a yellow phosphor can be mentioned.
  • Each light emitting element 12 is connected to the lead wire 15 through the wiring layer 111.
  • a conductive land 111a connecting the light emitting element 12 and a conductive land 111b serving as a terminal connecting the front end 15a of the lead wire 15 are formed.
  • the lead 120 of each light emitting element 12 is soldered to the conductive land 111a. Further, the front end portion 15a of the lead wire 15 is bent in an L shape and is soldered (solder portion 16) to the conductive land 111b.
  • a reflective film 13 is formed in a pattern in an area other than the area where the light emitting element 12 is disposed.
  • the reflective film 13 is formed on the entire region outside the broken line A shown in FIG.
  • the reflective film 13 may be formed between the rows of the light emitting elements 12.
  • the reflective film 13 is not formed on the conductive lands 111 a and the conductive lands 111 b.
  • the reflective film 13 may be formed on the resist film 112 and formed over the wiring layer 111.
  • the reflective film 13 is preferably formed of an insulating material.
  • the reflective film 13 As a specific example of the reflective film 13, a resin film in which a reflective pigment is dispersed is preferable.
  • the pigment can be appropriately selected and used from white pigments such as aluminum oxide, titanium oxide and calcium carbonate, and luster pigments such as mica.
  • white pigments such as aluminum oxide, titanium oxide and calcium carbonate
  • luster pigments such as mica.
  • Urethane resin, an acrylic resin, etc. can be used for resin.
  • Such a reflective film 13 can be formed, for example, by silk printing a paste obtained by mixing a pigment, a dispersant, a resin, and a solvent.
  • Circuit unit 20 The circuit unit 20 is provided with a lighting circuit for lighting the light emitting element 12 using commercial power supplied through the base member 50.
  • the lighting circuit is, for example, for converting an AC voltage of 100 V into a DC low voltage, and is constituted of a plurality of electronic components 22 to 26 mounted on the second wiring board 21.
  • the electronic components 22a to 22e are relatively large components constituting a rectification and smoothing circuit in a lighting circuit and a DC / DC converter, and are, for example, an electrolytic capacitor, a choke coil, a noise filter, a resistor, and an IC chip.
  • the second wiring board 21 is a printed wiring board, and has a disk shape slightly smaller than the opening 31.
  • the printed wiring board is a substrate made of a heat-resistant insulating material such as glass epoxy material, paper phenol material, glass composite, or ceramic, and a wiring layer is formed. It may be in either. Also, a single layer wiring structure may be employed, or a multilayer wiring structure may be employed.
  • the main electronic components 22a to 22e in the circuit unit 20 are soldered by dipping. That is, the second wiring board 21 is provided with the wiring layer 211 and the resist film 212 on the front side, and the electronic components 22a to 22e are mounted on the back side. The leads of the electronic components 22 a to 22 e penetrate the second wiring board 21 and are soldered to the wiring layer 211 on the front side of the second wiring board 21.
  • solder portions 23 protruding forward are scattered.
  • a small chip component or the like may be surface-mounted on the front surface of the second wiring board 21.
  • the main electronic components 22a to 22e are mounted by the dip method, but the main electronic components constituting the circuit unit 20 are surface mounted on the front surface or the back surface of the second wiring board 21. It is also good.
  • the rear end portion 15 b of the lead wire 15 is fixed to the second wiring board 21 by the solder portions 23 a and 23 b and penetrates the second wiring board 21, and is connected to the wiring layer 211.
  • connection lines 51 and 52 are connected to the second wiring board 21.
  • the connection lines 51 and 52 supply power from the base member 50 to the circuit unit 20.
  • the shell case 30 is a cylindrical member having a substantially circular cross section, has an opening 31 at its front end, and its diameter gradually decreases from the front end to the rear end. It has become.
  • a screw thread for screwing the mouthpiece member 50 is formed on the outer peripheral surface thereof, and the tip end of the rear end portion 33 is open.
  • a step portion 32 for supporting the outer peripheral portion of the second wiring board 21 is formed in an annular shape along the edge of the opening 31. .
  • the outer shell 30 is preferably made of an insulating material because insulation with the second wiring board 21 can be easily secured. If a synthetic resin having heat resistance and electrical insulation is used as the insulating material, the shell case 30 can be manufactured at low cost by insert molding.
  • Preferred synthetic resins include, for example, PBT (polybutylene terephthalate), PET (polyethylene terephthalate), PES (polyether sulfone), PC (polycarbonate), PPS (polyether sulfone), PA (polyamide).
  • ceramic or glass can be used other than resin.
  • the outer case 30 may be formed of a metal material such as Al, Ni, or an Al alloy. Since the metal has a good heat conductivity, the heat dissipation from the inside to the outside of the outer case 30 can be enhanced.
  • the adhesive layer 24 can be formed of an adhesive having good thermal conductivity, for example, an adhesive made of a synthetic resin such as a silicone resin, an epoxy resin, or a urethane resin.
  • the first light emitting module 10 since the first wiring board 11 and the second wiring board 21 are held by the pair of lead wires 15 with the space G open, the first light emitting module 10
  • the wiring board 11 is disposed in front of the second wiring board 21 so as to be spaced apart by a space G via the second wiring board 21 and the pair of lead wires 15.
  • the first wiring board 11 is It is disposed at a position closing the opening 31.
  • the first wiring board 11 Since the first wiring board 11 has a diameter slightly smaller than that of the opening 31, an annular gap is formed between the outer circumference of the first wiring board 11 and the inner circumferential surface of the outer case 30 as shown in FIG. 3. 34 are formed.
  • the lead wire 15 since the lead wire 15 has a role of supporting the first wiring board 11, it is preferable to use a thick and rigid material of the lead wire in order to support the first wiring board 11 firmly. It is also preferable to provide a spacer around the lead wire 15 between the first wiring substrate 11 and the second wiring substrate 21 in order to secure the space gap G between the substrates.
  • the outer peripheral portion of the second wiring board 21 is joined to the outer case 30, the first wiring board 11 and the second wiring board 21 are joined as described above, and the outer circumference of the first wiring board 11 is The part may be joined to the shell case 30. In this case, the second wiring board 21 is supported behind the first wiring board 11 via the lead wires 15.
  • the globe 40 has a dome shape having a smooth curved surface, and has an opening equivalent to the opening 31 of the shell case 30.
  • the glove 40 is formed of a milky white material having transparency or light diffusion.
  • the material is, for example, a synthetic resin such as glass or polycarbonate.
  • the glove 40 is mounted on the front of the shell case 30 with the opening edge 41 thereof inserted into the gap 34 and bonded with the adhesive layer 42. Since the adhesive layer 42 bonds the opening edge 41 and the outer case 30 to each other, the gap 34 is sealed by the opening edge 41 and the adhesive layer 42.
  • the adhesive layer 42 can also be formed of, for example, a heat-resistant silicone resin having good thermal conductivity and electrical insulation, or a synthetic resin such as an epoxy resin or a urethane resin.
  • the base member 50 is an Edison-type base.
  • the base member 50 has an eyelet portion 53 and a shell portion 54, and the shell portion 54 is screwed to the rear end portion 33 of the outer case 30.
  • connection wires 51 and 52 shown in FIG.
  • the rear end of the connection line 51 is connected to the eyelet portion 53, and the rear end of the connection line 52 is connected to the shell portion 54.
  • the light emitting module 10 and the circuit unit 20 are manufactured, and both are coupled to each other by the pair of lead wires 15 as follows.
  • the rear end portion 15 b of the lead wire 15 before being bent in an L shape is joined to the second wiring board 21.
  • the rear end portion 15b is inserted into the hole of the second wiring board 21 and penetrated and soldered.
  • the pair of lead wires 15 is fixed to the second wiring board 21 by the solder portions 23a and 23b.
  • the front end portion 15a of the lead wire 15 is penetrated through the hole of the first wiring board 11, and the second wiring board 21 and the first wiring board 11 are maintained at a distance equivalent to the space gap G.
  • Align This alignment may be performed, for example, by overlapping the two substrates with a plate-like tool having a thickness corresponding to the space G between the second wiring substrate 21 and the first wiring substrate 11. it can.
  • the front end portion 15a of the lead wire 15 is bent in an L shape and soldered to the wiring layer 111 (solder portion 16), whereby the light emitting module 10 and the circuit unit 20 are coupled.
  • This mounting can be easily performed by applying an adhesive to the step portion 32 and pressing the outer peripheral portion of the second wiring board 21 in the circuit unit 20 onto the step portion 32 of the outer case 30.
  • the adhesive layer 24 is formed, and the outer peripheral portion of the outer case 30 is fixed to the step portion 32.
  • This mounting can be easily performed by filling the gap 34 between the first wiring substrate 11 and the outer case 30 with an adhesive and inserting the opening edge 41 of the glove 40 into the gap 34.
  • an adhesive layer 42 is formed, and the glove 40 is fixed to the front of the shell case 30.
  • the heat generated from the light emitting element 12 at the time of driving is transmitted to the outer case 30 mainly through the wiring layer 111 of the first wiring substrate 11, and from the outer case 30 to the outside air Released.
  • the heat generated by the electronic components 22e to 26e is transmitted to the outer case 30 mainly through the wiring layer of the second wiring board 21 or by radiation, and is released from the outer case 30 to the outside air.
  • the wiring layer is not formed on the back surface 11a, and the back surface 11a is formed of an insulating material. Then, in a state where the back surface 11 a faces the second wiring board 21, the second wiring board 21 and the second wiring board 21 are disposed opposite to each other with the space G interposed therebetween, so that the space between the first wiring board 11 and the second wiring board 21.
  • the wiring layer 111 and the second wiring substrate 21 can be reliably insulated without inserting an additional insulating member.
  • Such a light source device 1 is particularly suitable for a small-sized base-attached light source device, and is useful for realizing a small and bright light source device.
  • the first wiring board 11 and the second wiring board 21 are held in a state of being separated by a pair of lead wires 15 also serving as a feeding path, and the second wiring board 21 is supported by the outer case 30 Therefore, the first wiring board 11 is supported in front of the second wiring board 21 through the lead wires 15.
  • first wiring board 11 and the second wiring board 21 are combined, and the outer peripheral portion of the first wiring board 11 is joined to the outer case 30, it can be assembled easily as well.
  • the outer case 30 is formed in a cylindrical shape having the opening 31, the first wiring board 11 is disposed so as to close the opening 31, and the second wiring board 21 is provided in the outer case 30. Since it is disposed inward, the internal space of the outer case 30 can be used as a space for housing the electronic components 22a to 22e of the circuit unit 20. Further, since the second wiring board 21 is disposed to face the first wiring board 11, the second wiring board 21 can be efficiently stored in the outer case 30, which is suitable for downsizing of the device.
  • the first wiring board 11 Since the second wiring board 21 is smaller than the first wiring board 11, the first wiring board 11 functions as a lid covering the entire second wiring board 21. Further, since the first wiring board 11 closes the opening 31 of the outer case 30, the first wiring board 11 also plays a role of sealing the circuit unit 20 in the outer case 30.
  • a gap 34 is formed between the outer periphery of the first wiring board 11 and the inner peripheral surface of the outer case 30, and the glove 40 is easily inserted It can be fixed firmly.
  • the reflective film 13 is formed on the front surface of the first wiring board 11, the reflectance of reflecting the light directed to the front surface of the first wiring board 11 in the light from the light emitting element 12 is improved. Therefore, the efficiency of extracting light from the device can be improved, and the temperature rise of the first wiring board 11 can be reduced.
  • the area where the reflective film 13 is formed on the front surface of the first wiring substrate 11 is preferably wide, and the reflective film 13 is preferably formed over the entire front surface of the first wiring substrate 11.
  • the substrate body 110 of the first wiring substrate 11 is formed of a glass epoxy material, a paper phenol material, a glass composite, or a heat resistant resin, an insulating substrate for a general printed wiring substrate can be used, which is inexpensive It is available.
  • the heat insulation effect increases as the space gap G is set larger. In that respect, it is preferable to secure 0.5 mm or more of the shortest distance between the back surface 11a of the first wiring substrate 11 and the second wiring substrate 12 (in FIG. 4, the distance W1 between the back surface 11a and the top of the solder portion 23). .
  • the thickness W2 of the substrate body 110 is preferably set to 1 mm or more.
  • the thickness W2 of the substrate body 110 since increasing the thickness W2 of the substrate body 110 leads to an increase in the size of the device, it is preferable to limit the thickness W2 to, for example, 5 mm.
  • FIG. 5 is a cross-sectional view showing the main part of the light source device 2 according to the second embodiment. In the figure, the same parts as those in FIG.
  • the light source device 2 basically has the same configuration as the light source device 1 described in the first embodiment, and the first wiring board 11 and the second wiring board 21 are separated by the outer case 30 with the space G therebetween. The same applies to the point of opposing arrangement.
  • the outer peripheral portion of the second wiring board 21 is fixed to the outer case 30, and the first wiring board 11 secures a space gap with the second wiring board 21 by the lead wires 15.
  • both the outer peripheral portion of the first wiring board 11 and the outer peripheral portion of the second wiring board 21 are fixed to and supported by the outer case 30 in the light source device 2.
  • the outer peripheral portion of the second wiring substrate 21 is bonded to the step portion 32 of the outer case 30 by the adhesive layer 24 as in the light source device 1.
  • the outer peripheral portion of the first wiring substrate 11 is also bonded to the step portion 35 provided on the inner peripheral surface of the outer case 30 by the adhesive layer 42.
  • the lead wire 15 does not need to have a function of holding the substrates together. .
  • the wiring layer is not formed on the back surface 11a of the first wiring substrate 11, the insulating material of the substrate body 110 is exposed over the entire back surface 11a, and the back surface 11a faces the second wiring substrate 21. Since the second wiring board 21 and the second wiring board 21 are disposed opposite to each other with the space G in between, the main effects are obtained as in the light source device 1.
  • FIG. 6 is a cross-sectional view showing the main part of the light source device 3 according to the third embodiment, partially showing the light emitting module 10 and the circuit unit 20. As shown in FIG.
  • This light source device 3 also basically has the same configuration as that of the light source device 1, but in the light source device 1, the first wiring board 11 and the second wiring board 21 maintain the space G by the lead wires 15. While the light source device 3 is held, the space G is mutually opened by the holding member 17 bridged across the first wiring board 11 and the second wiring board 21 separately from the lead wire 15. Hold in the state.
  • the holding member 17 shown in FIG. 6 includes a spacer 17a interposed between the first wiring substrate 11 and the second wiring substrate 21 and a screw 17b penetrating the first wiring substrate 11, the spacer 17a and the second wiring substrate. , And a nut 17c screwed to the end of the screw 17b.
  • the first wiring board 11 and the second wiring board 21 are firmly held to each other by the holding member 17 in a state where the space G is secured therebetween.
  • the holding member 17 is not limited to the method used for the screw 17 b and the nut 17 c.
  • the first wiring substrate 11 and the second wiring substrate 21 may be bonded to both substrates with a spacer defining a space G between them.
  • the intermediate layer 113 is provided in parallel to the wiring layer 111 in the substrate main body 110 of the first wiring substrate 11.
  • the intermediate layer 113 is a layer made of a heat conductive material, for example, a copper layer, and is provided along the wiring layer 111 at a distance from the wiring layer 111.
  • the region for providing the intermediate layer 113 is preferably provided over the entire region of the substrate body 110 except for the region in the vicinity where the lead wire 15 penetrates.
  • the first wiring board 11 having the intermediate layer 113 can be manufactured using a technology for manufacturing a multilayer wiring board.
  • the first wiring board 11 has a structure in which the wiring layer is not formed on the back surface 11a, and the insulating material of the substrate body 110 is exposed over the entire back surface 11a. Since the second wiring board 21 and the second wiring board 21 are disposed opposite to each other with the space G interposed therebetween in the state of facing the substrate 21, the main operational effects are the same as those of the light source device 1.
  • the intermediate layer 113 provided on the first wiring board 11 also has a function of diffusing the heat from the light emitting element 12 toward the outer peripheral portion of the first wiring board 11. Compared to the light source device 1 of the first embodiment, the heat radiation effect from the light emitting element 12 to the outside of the device can be enhanced.
  • the first wiring substrate 11 and the second wiring substrate 21 are disposed in parallel to each other, but both substrates may be disposed at an angle to each other. That is, the second wiring board 21 may be arranged to be inclined with respect to the first wiring board 11.
  • the base member 50 is an Edison-type base, but the type of the base is not limited to a specific base.
  • the base may be a G-type base having a pair of pin-shaped terminals.
  • the base may have an L-shaped terminal used for hook sealing.
  • the light source devices 1 to 3 have a bulb shape (type A) similar to the shape of an incandescent lamp, but, for example, the shape of the light source device can be changed by changing the shape of the globe 40 to B type, G type, etc. You can change it.
  • a diffusion plate may be attached or a globeless lamp with a cap can be configured.
  • a heat conductive filler for example, a silicone resin may be filled between the electronic components 22a to 22e in the circuit unit 20 and the inner surface of the outer case 30.
  • a heat conductive filler for example, a silicone resin may be filled between the electronic components 22a to 22e in the circuit unit 20 and the inner surface of the outer case 30.
  • the light source devices 1 to 3 can be similarly implemented in a light emitting device of a method in which the circuit unit 20 supplies direct current power to the light emitting module 10 and in which alternating current power is supplied to the light emitting module 10.
  • the light source devices 1 to 3 have one or more light source devices mounted on the fixture body, and are used for down-ceiling, ceiling-suspended or wall-mounted, and ceiling-embedded downlights, etc. It can also be applied as
  • illumination light source device 10 light emitting module 11 first wiring substrate 11a back surface of first wiring substrate 12 light emitting element 13 reflective film 15 lead wire 17 holding member 20 circuit unit 21 second wiring substrate 22a to 22e electronic component 24 adhesive layer Reference Signs List 30 outer case 31 opening portion 32 step portion 34 gap 35 step portion 40 globe 41 opening edge portion 50 base member 110 substrate body 111 wiring layer 112 resist film 113 intermediate layer 212 resist film G space gap

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

Une paire de fils conducteurs (15) est suspendue entre un premier substrat de câblage (11) et un second substrat de câblage (21) entre un module électroluminescent (10) et une unité de circuit (20). Cette paire de fils conducteurs (15) sert de circuit d'alimentation électrique depuis le premier substrat de câblage (11) dans l'unité de circuit (20) jusqu'au module électroluminescent (10), et contient à la fois le premier substrat de câblage (11) et le second substrat de câblage (21). L'unité de circuit (20) est placée derrière le module électroluminescent (10), le premier substrat de câblage (11) et le second substrat de câblage (21) sont placés face à face, tandis que le premier substrat de câblage (11) et le second substrat de câblage (21) sont maintenus à distance par un espace vide (G).
PCT/JP2012/006830 2012-02-17 2012-10-25 Dispositif de source d'éclairage WO2013121479A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013508062A JP5555371B2 (ja) 2012-02-17 2012-10-25 照明用光源装置
CN201290001172.5U CN204127690U (zh) 2012-02-17 2012-10-25 照明用光源装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012-032699 2012-02-17
JP2012032699 2012-02-17

Publications (1)

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WO2013121479A1 true WO2013121479A1 (fr) 2013-08-22

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JP (1) JP5555371B2 (fr)
CN (1) CN204127690U (fr)
WO (1) WO2013121479A1 (fr)

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WO2015144469A1 (fr) * 2014-03-27 2015-10-01 Koninklijke Philips N.V. Connexion de carte à carte efficace
JP6317831B1 (ja) * 2017-01-27 2018-04-25 廣東正飛移動照明有限公司 光源体アセンブリ
JP2018181785A (ja) * 2017-04-21 2018-11-15 スタンレー電気株式会社 車両用灯具用光源モジュール及びその製造方法、並びに車両用灯具

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US9310031B2 (en) * 2013-06-06 2016-04-12 Interlight Optotech Corporation Light emitting diode bulb
JP6290518B1 (ja) * 2015-02-05 2018-03-07 フィリップス ライティング ホールディング ビー ヴィ Ｌｅｄモジュール及び封着方法
JPWO2021131820A1 (fr) * 2019-12-25 2021-07-01
US11655968B2 (en) * 2020-09-24 2023-05-23 Koito Manufacturing Co., Ltd. Light-emitting module

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WO2010102911A2 (fr) * 2009-03-09 2010-09-16 Ledon Lighting Jennersdorf Gmbh Module à diodes pour lampes transformées et lampe à diodes transformée
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WO2015144469A1 (fr) * 2014-03-27 2015-10-01 Koninklijke Philips N.V. Connexion de carte à carte efficace
CN105917159A (zh) * 2014-03-27 2016-08-31 飞利浦照明控股有限公司 高效板至板连接
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JP6317831B1 (ja) * 2017-01-27 2018-04-25 廣東正飛移動照明有限公司 光源体アセンブリ
JP2018120821A (ja) * 2017-01-27 2018-08-02 廣東正飛移動照明有限公司 光源体アセンブリ
JP2018181785A (ja) * 2017-04-21 2018-11-15 スタンレー電気株式会社 車両用灯具用光源モジュール及びその製造方法、並びに車両用灯具
JP6993097B2 (ja) 2017-04-21 2022-02-04 スタンレー電気株式会社 車両用灯具用光源モジュール及びその製造方法、並びに車両用灯具

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CN204127690U (zh) 2015-01-28
JPWO2013121479A1 (ja) 2015-05-11
JP5555371B2 (ja) 2014-07-23

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