WO2014024339A1 - Lampe du type ampoule, dispositif d'éclairage et procédé pour fabriquer une lampe du type ampoule - Google Patents

Lampe du type ampoule, dispositif d'éclairage et procédé pour fabriquer une lampe du type ampoule Download PDF

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Publication number
WO2014024339A1
WO2014024339A1 PCT/JP2013/001171 JP2013001171W WO2014024339A1 WO 2014024339 A1 WO2014024339 A1 WO 2014024339A1 JP 2013001171 W JP2013001171 W JP 2013001171W WO 2014024339 A1 WO2014024339 A1 WO 2014024339A1
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WO
WIPO (PCT)
Prior art keywords
substrate
globe
led
shaped lamp
light bulb
Prior art date
Application number
PCT/JP2013/001171
Other languages
English (en)
Japanese (ja)
Inventor
洋介 藤巻
次弘 松田
康輔 菅原
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014024339A1 publication Critical patent/WO2014024339A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • the present invention relates to a light bulb shaped lamp, a lighting device, and a light bulb shaped lamp manufacturing method, and more particularly, to a light bulb shaped lamp using a semiconductor light emitting element, a lighting device using the same, and a light bulb shaped lamp manufacturing method.
  • LEDs Light Emitting Diodes
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • the conventional light bulb shaped LED lamp disclosed in Patent Document 1 includes a globe, a substrate disposed in the globe, and an LED mounted on the substrate.
  • a conventional light bulb shaped LED lamp realizes a wide light distribution angle like an incandescent light bulb using a filament coil.
  • the light distribution angle of the LED is limited to a certain range, so in order to realize a wide light distribution angle, the light irradiation direction of the LED should be adjusted to a desired direction. It is necessary to adjust the light distribution angle.
  • the conventional bulb-type LED lamp has a problem in that the light distribution angle of the LED cannot be easily adjusted because the LED is configured to be fixed at a constant angle in the globe.
  • the present invention has been made to solve such a problem, and an object thereof is to provide a light bulb shaped lamp, a lighting device, and a method for manufacturing the light bulb shaped lamp, in which the light distribution angle can be easily adjusted.
  • a light bulb shaped lamp according to the present invention is a light bulb shaped lamp comprising a globe and a semiconductor light emitting element arranged inside the globe, and is arranged inside the globe.
  • the bendable substrate is provided, and the substrate has a bent portion formed by being bent and a flat portion on which the semiconductor light emitting element is disposed.
  • a drive circuit for supplying power to the semiconductor light emitting element, and a lead wire for electrically connecting the semiconductor light emitting element and the drive circuit
  • the substrate may have a connection portion connected to the lead wire on a surface different from the plane including the flat portion.
  • the substrate further includes a support portion that extends in a direction intersecting with the planar portion and supports the semiconductor light emitting element disposed on the planar portion. May be.
  • the substrate may include a metal base layer and an insulating layer having the planar portion disposed on the base layer.
  • a plurality of the semiconductor light emitting elements may be provided, and the plurality of semiconductor light emitting elements may be arranged around the center position of the globe.
  • an aspect of the lighting device according to the present invention is a lighting device including any one of the above-described light bulb shaped lamps.
  • An aspect of the method for manufacturing a light bulb shaped lamp according to the present invention is a method for producing a light bulb shaped lamp comprising a globe and a semiconductor light emitting element disposed inside the globe, wherein the semiconductor light emitting device is provided on a flat surface.
  • the present invention it is possible to realize a light bulb shaped lamp, an illuminating device, and a method of manufacturing a light bulb shaped lamp whose light distribution angle can be easily adjusted.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a diagram showing one cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5 is a perspective view of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is a diagram showing a cross section of the LED in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a diagram showing one cross section of the configuration of the light bulb
  • FIG. 7 is a flowchart for explaining a method of manufacturing the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 8 is a diagram for explaining a method of manufacturing the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • FIG. 10 is a diagram showing a configuration of an LED module according to Modification 1 of the embodiment of the present invention.
  • FIG. 11 is a diagram showing a configuration of an LED module according to Modification 2 of the embodiment of the present invention.
  • FIG. 12 is a diagram showing a configuration of an LED module according to Modification 3 of the embodiment of the present invention.
  • FIG. 13 is a diagram showing a configuration of an LED module according to Modification 4 of the embodiment of the present invention.
  • FIG. 14 is a diagram showing a configuration of an LED module according to Modification 5 of the embodiment of the present invention.
  • FIG. 15 is a diagram showing a configuration of an LED module according to Modification 6 of the embodiment of the present invention.
  • FIG. 16 is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention.
  • FIG. 17A is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention.
  • FIG. 17B is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention.
  • FIG. 18 is a diagram showing a configuration of an LED module according to Modification 8 of the embodiment of the present invention.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp 1 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • a light bulb shaped lamp 1 is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent light or an incandescent light bulb, and includes a globe 10 and an LED that is a light source. Power is supplied to the module 20, the pedestal 40 on which the LED module 20 is placed, the housing 50 in which the drive circuit 70 is disposed, the metal member 60 disposed in the housing 50, and the LED module 20. A driving circuit 70 for receiving power and a base 80 for receiving power from the outside.
  • the bulb-type lamp 1 further includes lead wires 70a to 70d, a ring-shaped coupling member 30, and a screw 90.
  • an envelope is constituted by the globe 10, the housing 50 (outer housing portion 52), and the base 80. That is, the globe 10, the housing 50 (outer housing portion 52), and the base 80 are exposed to the outside, and each outer surface is exposed to the outside air. Further, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to, for example, a 40 W type.
  • the upper direction shown in these drawings is the upper direction, and the lower direction is the lower direction. That is, the globe 10 is disposed above the base 80.
  • the definition of the above direction is independent of the direction when the light bulb shaped lamp 1 is attached to the lighting fixture, and when the light bulb shaped lamp 1 is attached to the lighting fixture, any direction is upward or downward. It doesn't matter.
  • FIG. 3 is a view showing one section of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp 1 according to the embodiment of the present invention, and shows a cross sectional view when rotated about 90 ° from the state of FIG. 3 around the lamp axis. ing.
  • the lamp axis is an axis that becomes a rotation center when the bulb lamp 1 is attached to the socket of the lighting device, and coincides with the rotation axis of the base 80.
  • FIG.3 and FIG.4 the cross-sectional part of each component is shown except a circuit element. In FIG. 4, the circuit elements are omitted.
  • the globe 10 is a translucent cover that houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp.
  • the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
  • the globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.
  • the shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the opening 11 of the globe 10 is located between the pedestal 40 and the housing 50. More specifically, the opening 11 of the globe 10 is press-fitted into the groove of the coupling member 30 disposed between the pedestal 40 and the housing 50. Thereby, the globe 10 is fixed. Further, a silicone resin is applied between the opening 11 of the globe 10 and the end of the housing 50 on the globe side, but this silicone resin is not always necessary.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the shape of the globe 10 is not limited to the A shape, and may be a spheroid or an oblate sphere.
  • the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
  • the LED module 20 is a light emitting module having a semiconductor light emitting element, and emits predetermined light. As shown in FIGS. 3 and 4, the LED module 20 is disposed inside the globe 10 and includes a plurality of LEDs 22. The plurality of LEDs 22 are preferably arranged around a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Thus, by arranging the LED 22 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to an incandescent light bulb using a conventional filament coil.
  • the LED module 20 is mounted on the pedestal 40 and emits light by the power supplied via the lead wires 70a and 70b. Note that the bottom surface of the LED module 20 is bonded to the pedestal 40 with an adhesive or the like. The detailed configuration of the LED module 20 will be described later.
  • the coupling member 30 is a member that couples the globe 10, the pedestal 40, and the metal member 60. As shown in FIG. 2, the coupling member 30 is configured in a ring shape so as to surround the periphery of the pedestal 40 (small diameter portion 40a).
  • the coupling member 30 can be molded by curing a fluid insulating resin (for example, silicon) poured into the gap between the outer peripheral surface of the base 40 and the outer portion 52a of the outer casing 52.
  • the coupling member 30 is fitted into a vertical groove 30 a formed in an annular shape so that the opening 11 of the globe 10 is inserted, and a horizontal groove provided in the base 40.
  • four protrusions 30c protruding downward (on the base side) are provided. Note that the outer surface of the coupling member 30 is in contact with the inner surface of the outer housing portion 52 of the housing 50.
  • the base 40 is a member on which the LED module 20 is placed, and is made of metal.
  • the configuration of the pedestal 40 will be described in detail with reference to FIGS. 3 and 4.
  • the pedestal 40 is a member mainly surrounded by the casing 50 (outer casing section 52). As shown in FIGS. 3 and 4, the pedestal 40 is configured to close the opening 11 of the globe 10.
  • the pedestal 40 is made of a metal material, and is made of an aluminum alloy in the present embodiment. Thereby, the heat generated in the LED module 20 can be efficiently conducted to the base 40. Thereby, the fall of the luminous efficiency of LED22 by the temperature rise and the fall of a lifetime can be suppressed.
  • the pedestal 40 is a cap-shaped member having a stepped portion, and includes a small diameter portion 40a having a small diameter and a large diameter portion 40b having a large diameter.
  • a lateral groove portion is formed along the circumferential direction of the small diameter portion 40a.
  • the coupling member 30 is disposed on the step portion of the pedestal 40 (above the large diameter portion 40b), and the flange 30b of the coupling member 30 and the lateral groove portion of the pedestal 40 are fitted to each other so that the coupling member 30 becomes the pedestal. 40 is fixed.
  • the small diameter portion 40 a is a disk-shaped member configured to support the LED module 20 and close the opening 11 of the globe 10.
  • the LED module 20 is placed at the center of the small diameter portion 40a.
  • the outer peripheral surface of the small diameter portion 40a and the inner peripheral surface of the coupling member 30 are in surface contact.
  • the small diameter portion 40a is provided with two through holes 40a1 for inserting the lead wires 70a and 70b.
  • the large-diameter portion 40 b is configured in a substantially cylindrical shape, and the outer peripheral surface is in surface contact with the inner peripheral surface of the metal member 60. Thereby, the heat of the base 40 can be efficiently conducted to the metal member 60.
  • four concave portions 40b1 are formed as guide holes when caulking with the metal member 60.
  • the housing 50 is an insulating case having an insulating property in which the drive circuit 70 is disposed on the inner side, and includes an inner housing portion (first housing portion) 51 and an outer housing portion (second housing portion) 52. It is constituted by.
  • the housing 50 can be made of an insulating resin material, and can be resin-molded with, for example, polybutylene terephthalate (PBT).
  • the inner casing 51 is an internal member (circuit case) that is disposed so as to surround the drive circuit 70 and is not visible from the outside of the lamp.
  • the inner housing part 51 includes a circuit cap part 51 a disposed so as to cover the drive circuit 70 and a circuit holder part 51 b disposed so as to cover the periphery of the drive circuit 70.
  • the circuit cap part 51a and the circuit holder part 51b are separated, and the circuit cap part 51a and the circuit holder part 51b are arranged in a non-contact state.
  • the upper surface shape of the circuit cap portion 51a is configured to follow the inner surface shape of the base 40. As a result, the circuit cap portion 51 a is fitted into the pedestal 40 and is fastened and fixed to the pedestal 40 by the screws 90.
  • the circuit holder 51b is configured in a cylindrical shape.
  • the base-side end of the circuit holder 51b is connected to the outer casing 52, and in this embodiment, the circuit holder 51b and the outer casing 52 are integrally molded.
  • a stepped portion on which the circuit board 71 of the drive circuit 70 is placed is formed at the globe side end of the circuit holder portion 51b.
  • the outer casing 52 is at least a part of the lamp envelope, and is an external member arranged so as to be visible from the outside of the lamp. A region other than the portion covered with the base 80 on the outer peripheral surface of the outer casing 52 is exposed to the outside of the lamp.
  • the outer housing part 52 has an outer part 52a exposed to the outside of the lamp and a screwing part 52b screwed into the base 80.
  • the outer portion 52a is configured by a substantially cylindrical member having a diameter larger than that of the screwing portion 52b.
  • the outer portion 52a is configured such that the diameter gradually decreases toward the base 80 side. That is, the inner peripheral surface and the outer peripheral surface of the outer portion 52a are inclined with respect to the lamp axis. Since the outer surface of the outer portion 52a is exposed to the atmosphere, the heat conducted to the housing 50 is radiated mainly from the outer surface of the outer portion 52a.
  • the screwing portion 52b is configured by a substantially cylindrical member having a diameter smaller than that of the outer portion 52a.
  • a base 80 is screwed into the screwing portion 52b. That is, the outer peripheral surface of the screwing portion 52 b is configured to contact the inner peripheral surface of the base 80.
  • the outer casing 52 (outer section 52 a) configured in this way is configured to surround the inner casing 51, the metal member 60, the base 40, and the coupling member 30.
  • a predetermined gap is provided between the inner surface of the outer casing 52 (outer part 52a) and the outer surface of the inner casing 51 (circuit cap part 51a and circuit holder part 51b).
  • the outer casing 52 (outer section 52a) and the metal member 60 are not in contact with each other, and as shown in FIG. 4, the inner surface of the outer casing 52 (outer section 52a) A certain gap exists between the outer surface of the metal member 60.
  • the metal member 60 is configured in a skirt shape so as to surround the inner casing 51 in the casing 50, and is disposed between the inner casing 51 and the outer casing 52. Thereby, the metal member 60 can be in a non-contact state with the drive circuit 70, and the insulation of the drive circuit 70 can be ensured.
  • the metal member 60 is made of a metal material and functions as a heat sink. Thereby, the heat generated from the LED module 20 and the drive circuit 70 can be efficiently radiated using the metal member 60. Specifically, the heat of the LED module 20 and the drive circuit 70 is propagated to the outer casing 52 through the inner casing 51 and the metal member 60, and is radiated from the outer casing 52 to the outside of the lamp. Can do.
  • the metal material of the metal member 60 for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag can be considered. Since such a metal material has good thermal conductivity, the heat propagated to the metal member 60 can be efficiently propagated.
  • the metal member 60 is in contact with the pedestal 40.
  • the inner peripheral surface of the metal member 60 and the outer peripheral surface of the base 40 (large diameter portion 40b) are in surface contact. Since both the metal member 60 and the pedestal 40 are made of metal, the heat of the LED module 20 that has been conducted to the pedestal 40 is efficiently conducted to the metal member 60.
  • the metal member 60 in the present embodiment is not in contact with the outer casing portion 52 (outer portion 52a, screwing portion 52b) in the casing 50, and the inner casing portion 51 (circuit cap portion 51a, circuit). It is not in contact with the holder part 51b). That is, the metal member 60 is disposed in a non-contact state in both the inner housing part 51 and the outer housing part 52. Thereby, the insulation as the whole housing
  • the drive circuit (circuit unit) 70 is a lighting circuit (power supply circuit) for lighting (emitting) the LEDs 22 of the LED module 20, and supplies predetermined power to the LED module 20.
  • the drive circuit 70 converts AC power supplied from the base 80 via the pair of lead wires 70c and 70d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 70a and 70b. Supply.
  • the drive circuit 70 includes a circuit board 71 and a plurality of circuit elements (electronic components) 72 mounted on the circuit board 71.
  • the circuit board 71 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 72 mounted on the circuit board 71.
  • the circuit board 71 is arranged in a posture in which the main surface is orthogonal to the lamp axis. As shown in FIG. 4, the circuit board 71 is placed and clamped on the circuit holder part 51 b of the inner housing part 51.
  • the circuit element 72 is, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements.
  • the drive circuit 70 configured as described above is covered with the inner casing portion 51 of the casing 50, and thus is in a non-contact state with the metal member 60. Thereby, the insulation of the drive circuit 70 is ensured.
  • the drive circuit 70 is not limited to a smoothing circuit, and a dimmer circuit, a booster circuit, and the like can be appropriately selected and combined.
  • Each of the lead wires 70a to 70d is an alloy copper lead wire, and is composed of a core wire made of alloy copper and an insulating resin film covering the core wire.
  • the pair of lead wires 70 a and 70 b are electric wires for supplying DC power for lighting the LED module 20 from the drive circuit 70 to the LED module 20.
  • the drive circuit 70 and the LED module 20 are electrically connected by a pair of lead wires 70a and 70b.
  • one end portion (core wire) of each of the lead wires 70a and 70b is electrically connected to the power output portion (metal wiring) of the circuit board 71 by solder or the like, and the other end of each other.
  • the end portion (core wire) is electrically connected to the power input portion (electrode terminal) of the LED module 20 by solder or the like.
  • the pair of lead wires 70 c and 70 d are electric wires for supplying AC power from the base 80 to the drive circuit 70.
  • the drive circuit 70 and the base 80 are electrically connected by a pair of lead wires 70c and 70d.
  • one end portion (core wire) of each of the lead wires 70c and 70d is electrically connected to the base 80 (shell portion or eyelet portion), and each other end portion (core wire) is
  • the power input part (metal wiring) of the circuit board 71 is electrically connected by solder or the like.
  • the base 80 is a power receiving unit that receives power for causing the LEDs 22 of the LED module 20 to emit light from outside the lamp.
  • the base 80 is attached to a socket of a lighting fixture, for example, and when the light bulb shaped lamp 1 is turned on, the base 80 receives electric power from the socket of the lighting fixture.
  • the base 80 is supplied with AC power from a commercial power supply (AC 100 V).
  • the base 80 in the present embodiment receives AC power through two contact points, and the power received by the base 80 is input to the power input unit of the drive circuit 70 via a pair of lead wires 70c and 70b.
  • the base 80 has a metal bottomed cylindrical shape, and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion. Further, a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface of the base 80, and a screwing portion 52 b of the outer housing portion 52 is screwed on the inner peripheral surface of the base 80. A threaded portion for mating is formed.
  • the type of the base 80 is not particularly limited, but in this embodiment, a screw-type Edison type (E type) base is used.
  • E type screw-type Edison type
  • the base 80 an E26 type, an E17 type, an E16 type, or the like can be given.
  • FIG. 5 is a perspective view of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • the LED module 20 includes a substrate 21, an LED 22, and a connector 23.
  • the LED module 20 in the present embodiment is a light emitting module of a surface mount (SMD: Surface Mount Device) type. That is, the LED module 20 is an LED module configured by mounting a plurality of SMD type LED elements on a substrate.
  • SMD Surface Mount Device
  • the substrate 21 is an LED mounting substrate for mounting the LEDs 22.
  • the substrate 21 in the present embodiment is a foldable flat plate-like rectangular substrate disposed inside the globe 10.
  • the substrate 21 includes an LED arrangement portion 21a, a bent portion 21b, a support portion 21c, a bent portion 21d, and a connector arrangement portion 21e.
  • the LED placement portion 21a is a flat rectangular portion on which the LEDs 22 are provided. Three LEDs 22 are placed on the flat surface portion 21a1 on the front surface (upper surface), and the back surface (the surface opposite to the flat surface portion 21a1). The three LEDs 22 are arranged on the flat planar portion 21a2 of the lower surface.
  • the LED 22 can be mounted easily. Moreover, since LED22 is mounted in both the surfaces (front surface and back surface) of the board
  • the bent portion 21b and the bent portion 21d are bent portions formed by bending the substrate 21. That is, the bent portion 21b and the bent portion 21d are formed by bending the rectangular substrate 21 at the positions of the bent portions 21b and 21d.
  • the bent portion 21b and the bent portion 21d maintain the bent state. That is, the positions of the LED placement portion 21a and the connector placement portion 21e with respect to the support portion 21c are fixed by the bent portion 21b and the bent portion 21d.
  • the bent portion 21b and the bent portion 21d are bent at a right angle so that the LED arrangement portion 21a and the connector arrangement portion 21e face the same direction, but the bending direction and angle are not limited. Further, even if the substrate 21 is bent once to form the bent portion 21b and the bent portion 21d, it can be bent again.
  • the support portion 21c is a portion that supports the LEDs 22 arranged in the plane portions 21a1 and 21a2 extending in a direction intersecting with the plane portions 21a1 and 21a2.
  • the support portion 21c is a flat rectangular portion extending in a direction orthogonal to the LED placement portion 21a. That is, the support portion 21c is connected to the LED placement portion 21a via the bent portion 21b, and serves as a support column that supports the LED placement portion 21a on which the LED 22 is placed.
  • the connector arrangement portion 21e is a flat rectangular portion in which the connector 23 is arranged on the upper surface and the lower surface is joined to the pedestal 40.
  • the connector placement portion 21e is connected to the support portion 21c through the bent portion 21d and is a bottom plate of the LED module 20 that extends in a direction orthogonal to the support portion 21c.
  • the connector 23 is a connection portion connected to the lead wires 70a and 70b in order to supply power to the LED 22.
  • the connector 23 is arrange
  • positioning part 21e which is a surface different from the plane containing plane part 21a1 and 21a2. That is, the LED 22, the LED placement portion 21a, the bent portion 21b, the support portion 21c, the bent portion 21d, the connector placement portion 21e, and the connector 23 are electrically connected by the wiring. Power is received from 70b through the connector 23 and the like.
  • the substrate 21 is a metal base substrate, and the LED arrangement portion 21a, the bent portion 21b, the support portion 21c, the bent portion 21d, and the connector arrangement portion 21e of the substrate 21 are made of a metal base layer 24a. And insulating layers 24b and 24c disposed on the base material layer 24a. That is, the base material layer 24a is a heat dissipation path for transferring the heat generated by the LED 22 to the pedestal 40 and radiating it.
  • the plane portion 21a1 is a plane formed on the insulating layer 24b, and the plane portion 21a2 is a plane formed on the insulating layer 24c.
  • the base material layer 24a is, for example, an iron (Fe) or aluminum (Al) layer
  • the insulating layers 24b, 24c are, for example, resin layers.
  • substrate 21 is a board
  • a flat rectangular substrate is used, but the substrate 21 may have any shape as long as it can be bent.
  • FIG. 6 is a diagram showing a cross section of the LED 22 in the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • Each LED 22 is a so-called SMD type light emitting device in which an LED chip and a phosphor are packaged, and as shown in FIG. 6, a package (container) 22a and an LED chip 22b accommodated in the package 22a And a sealing member 22c for sealing the LED chip 22b.
  • the LED 22 in the present embodiment is a white LED element that emits white light.
  • the package 22a is molded of white resin or the like, and includes an inverted frustoconical recess (cavity).
  • the inner side surface of the recess is an inclined surface and is configured to reflect light from the LED chip 22b upward.
  • the package 22a may be molded of a transparent resin or the like, and the light from the LED chip 22b may be irradiated to the side.
  • the LED chip 22b is an example of a semiconductor light emitting element, and is mounted in a recess of the package 22a.
  • the LED chip 22b is a bare chip that emits monochromatic visible light, and is die-bonded to the bottom surface of the recess of the package 22a by a die attach material (die bond material).
  • a blue LED chip that emits blue light when energized can be used as the LED chip 22b.
  • the sealing member 22c is a phosphor-containing resin containing a phosphor that is a light wavelength converter, and converts the wavelength of light from the LED chip 22b to a predetermined wavelength (color conversion) and seals the LED chip 22b. Thus, the LED chip 22b is protected.
  • the sealing member 22c is filled in the recess of the package 22a, and is sealed up to the opening surface of the recess.
  • a phosphor-containing resin in which YAG (yttrium, aluminum, garnet) -based yellow phosphor particles are dispersed in a silicone resin in order to obtain white light. Can be used.
  • the sealing member 22c emits white light by the excited yellow light and the blue light of the blue LED chip. Is done.
  • the sealing member 22c may also contain a light diffusing material such as silica.
  • the LED 22 is configured. Although not shown, the LED 22 has two external connection terminals, a positive electrode and a negative electrode, and these external connection terminals and the wiring 22d are electrically connected. Moreover, in this Embodiment, although several LED22 on the board
  • the wiring 22d is a conductive thin film for electrically connecting the LEDs 22 to each other, and is patterned in a predetermined shape on the flat portions 21a1 and 21a2 of the substrate 21.
  • a metal wiring made of a metal such as copper or silver can be used as the wiring 22d.
  • the wiring 22d is intermittently formed along the longitudinal direction of the LED placement portion 21a in order to connect adjacent LEDs 22. Thereby, electric power is supplied to each LED 22 via the wiring 22d.
  • FIG. 7 is a flowchart for explaining a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 8 is a diagram for explaining a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • the bent portions 21b and 21d are formed by bending the foldable substrate 21 in which the LEDs 22 are arranged on the flat portions 21a1 and 21a2 at positions different from the flat portions 21a1 and 21a2. Is formed (S102). Specifically, as shown in FIG. 8A, the substrate 21 is bent along the dotted line. Then, as shown in FIG. 8B, bent portions 21b and 21d are formed.
  • the folded substrate 21 is placed inside the globe 10 (S104). Specifically, the substrate 21 is disposed inside the globe 10 so that the centers of the plurality of LEDs 22 are located at the center of the globe 10.
  • the light bulb shaped lamp 1 is configured.
  • the substrate 21 includes the foldable substrate 21 disposed inside the globe 10, and the substrate 21 is bent to form a bent portion 21 b formed by bending. 21d and plane portions 21a1 and 21a2 on which the LEDs 22 are arranged.
  • the light bulb shaped lamp 1 by bending the substrate 21 on which the LED 22 is mounted, the light irradiation direction of the LED 22 can be adjusted to a desired direction, so that the light distribution angle can be easily adjusted.
  • the substrate 21 has a connector 23 which is a connection portion connected to the lead wires 70a and 70b on a surface different from the plane including the plane portions 21a1 and 21a2.
  • the angle of the surface on which the LED 22 is mounted is adjusted by bending the substrate 21, the angle of the surface is shifted in the configuration in which the lead wires 70a and 70b are connected to the surface on which the LED 22 is mounted.
  • the connector 23 is connected to a plane different from the plane including the plane portions 21a1 and 21a2
  • the lead wires 70a and 70b can be easily connected to the connector 23 while suppressing the adjustment of the light distribution angle. Can be connected.
  • the substrate 21 also has a support portion 21c that supports the LEDs 22 arranged on the plane portions 21a1 and 21a2, extending in a direction intersecting with the plane portions 21a1 and 21a2.
  • substrate 21 can also serve as the support
  • the substrate 21 includes a metal base layer 24a and insulating layers 24b and 24c disposed on the base layer 24a. That is, the substrate 21 improves the thermal conductivity of the substrate by the base material layer 24a while maintaining the insulating state of the substrate surface by the insulating layers 24b and 24c. Thereby, since the board
  • the plurality of LEDs 22 are arranged around the center position of the globe 10. Thereby, in the light bulb shaped lamp 1, a filament feeling like a conventional incandescent light bulb can be reproduced with a simple configuration.
  • the bendable substrate 21 in which the LEDs 22 are arranged on the flat portions 21a1 and 21a2 is bent at a position different from the flat portions 21a1 and 21a2. 21b and 21d are formed, and the bent substrate 21 is disposed inside the globe 10.
  • the light irradiation direction of the LED 22 can be adjusted to a desired direction by bending the substrate 21 on which the LED 22 is mounted, so that the light distribution angle can be easily adjusted. Can do.
  • FIG. 9 is a schematic cross-sectional view of the illumination device 2 according to the embodiment of the present invention.
  • the lighting device 2 As shown in FIG. 9, the lighting device 2 according to the embodiment of the present invention is used, for example, mounted on an indoor ceiling, and includes the light bulb shaped lamp 1 according to the above embodiment and the lighting fixture 3. Prepare.
  • the lighting fixture 3 turns off and turns on the light bulb shaped lamp 1 and includes a fixture main body 4 attached to the ceiling and a lamp cover 5 that covers the light bulb shaped lamp 1.
  • the appliance body 4 has a socket 4a.
  • the base 80 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.
  • the substrate in the following modifications is formed by the above-described foldable flat plate-like substrate as in the above embodiment, and a bent portion is formed by bending, and an LED is formed on the flat portion. Is arranged.
  • the substrate is disposed inside the globe so that the centers of the plurality of LEDs are located at the center of the globe.
  • FIG. 10 is a diagram showing a configuration of the LED module 120 according to the first modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 120 viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 120 viewed from the front in FIG. .
  • the LED module 120 three LEDs 22 are arranged on the flat portion of the upper upper surface of the bent substrate 121, and three LEDs 22 are arranged on the flat portion of the upper lower surface of the bent substrate 122.
  • a connector 23 is disposed below the boards 121 and 122, and power is supplied to each LED 22.
  • FIG. 11 is a diagram showing a configuration of an LED module 220 according to the second modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 220 viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 220 viewed from the front in FIG. .
  • the LED module 220 As shown in the figure, in the LED module 220, four LEDs 22 are arranged on the flat part on the upper part of the folded substrate 221 and four LEDs 22 are arranged on the flat part on the upper part of the bent board 222. ing. Note that both ends of the substrate 221 and the substrate 222 are bent in opposite directions. In addition, a connector 23 is disposed below the boards 221 and 222, and power is supplied to the respective LEDs 22.
  • FIG. 12 is a diagram showing a configuration of an LED module 320 according to the third modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 320 as viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 320 as viewed from the front in FIG. .
  • the LED module 320 As shown in the figure, in the LED module 320, four LEDs 22 are arranged on the flat portion of the upper upper surface of the bent substrate 321 and four LEDs 22 are arranged on the flat portion of the upper lower surface of the substrate 321.
  • the substrate 321 is bent at both ends so that the bent portion serves as a support column and supports the LED 22.
  • a connector 23 is disposed below the substrate 321, and power is supplied to each LED 22.
  • FIG. 13 is a diagram showing a configuration of an LED module 420 according to Modification 4 of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 420 as viewed from the front in FIG. 4, and FIG. 4B is a view of the LED module 420 as viewed from the right side in FIG. .
  • the LED module 420 eight LEDs 22 are arranged on the plane portion of the upper right surface of the bent substrate 421, and eight LEDs 22 are arranged on the plane portion of the upper left surface of the substrate 421. Note that the lower end of the substrate 421 is bent toward the left side. In addition, a connector 23 is disposed below the substrate 421, and power is supplied to each LED 22.
  • FIG. 14 is a diagram showing a configuration of an LED module 520 according to Modification 5 of the embodiment of the present invention.
  • FIG. 4A is a view of the LED module 520 viewed from above in FIG. 4
  • FIG. 4B is a view of the LED module 520 viewed from the front in FIG. (C) of the same figure is the figure which looked at the LED module 520 from the right side in FIG.
  • the LED module 520 eight LEDs 22 are arranged on each of the upper, lower, left and right plane portions of the bent substrate 521.
  • the lower end of the substrate 521 is bent toward the right side, and the upper part is bent three times so that the cross section becomes a square shape.
  • a connector 23 is disposed below the substrate 521 and power is supplied to each LED 22.
  • FIG. 15 is a diagram showing a configuration of an LED module 620 according to Modification 6 of the embodiment of the present invention. Specifically, this figure is a perspective view of the LED module 620 as seen from the upper right direction in FIG.
  • the protruding flat plate portion of the upper part of the substrate 621 is bent toward the rear of the figure, and three LEDs 22 are arranged on each of the eight side surfaces.
  • substrate 621 is bent toward the front of the figure.
  • the connector 23 is disposed below the substrate 621 and power is supplied to each LED 22.
  • FIGS. 16, 17A, and 17B are diagrams showing configurations of LED modules 720 and 820 according to Modification 7 of the embodiment of the present invention.
  • FIG. 16 is a perspective view of the LED module 720 viewed from the upper right direction in FIG. 17A is a view of the LED module 720 as viewed from the right side in FIG. 4, and
  • FIG. 17B is a view showing an LED module 820 as another configuration example of the LED module 720.
  • the substrate 721 is bent downward, and four LEDs 22 are arranged on each of the two side surfaces. Further, lead wires 70a and 70b are connected to the lower surface of the substrate 721, and power is supplied to the respective LEDs 22 from the lead wires 70a and 70b. In this modification, the substrate 721 is supported in the globe by the lead wires 70a and 70b. However, a configuration in which a support column for supporting the substrate 721 is separately provided may be used.
  • the LED 22 is an LED element that can irradiate light in five directions other than the lower side.
  • the LED module 720 can irradiate light with a wide light distribution angle.
  • the LED module 720 may have a configuration in which the lead wires 70a and 70b are connected to the upper surface of the substrate 721.
  • lead wires 70a and 70b are formed on the upper surface of the substrate 821. May be connected.
  • FIG. 18 is a diagram showing a configuration of an LED module 920 according to Modification 8 of the embodiment of the present invention. Specifically, this figure is a view of the LED module 920 as seen from the front in FIG.
  • the substrate 921 is bent in a bellows shape, and the LEDs 22 are arranged on the respective side surfaces.
  • lead wires 70a and 70b are connected to both ends of the substrate 921, and power is supplied to the respective LEDs 22 from the lead wires 70a and 70b.
  • the substrate 921 is supported in the globe by the lead wires 70a and 70b.
  • a configuration in which a support column for supporting the substrate 921 is provided may be used.
  • the substrate 921 is bent in a bellows shape, but the substrate may be bent in a spiral shape.
  • the light bulb shaped lamp and the lighting device according to the present invention have been described based on the embodiments and the modifications thereof, but the present invention is not limited to these embodiments and modifications.
  • the LED module 20 is an SMD type LED module, but is not limited thereto.
  • a COB (Chip On Board) type LED module in which a bare chip is directly mounted on the substrate 21 may be used.
  • the LED module 20 is configured to emit white light by the blue LED and the yellow phosphor, but is not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
  • the LED 22 may be an LED that emits a color other than blue.
  • a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles.
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as an organic EL (Electro Luminescence), or an inorganic EL may be used.
  • the bulb-type LED lamp using the globe 10 having the same shape as the incandescent bulb is used.
  • the present invention is not limited to this. That is, in the present embodiment, the size of the globe 10 is larger than the size of the housing 50, but the present invention is also applicable to a light bulb shaped lamp in which the size of the globe 10 is smaller than the size of the housing 50. Can do.
  • the screwing part 52 b is a part of the outer casing part 52, but may be a part of the inner casing part 51. That is, the screwing part 52b may be regarded as a part of a circuit case that houses the drive circuit 70, and more specifically, the screwing part 52b may be a part of the circuit holder part 51b.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

L'invention porte sur une lampe du type ampoule (1), laquelle lampe comporte un globe (10) et des diodes électroluminescentes (22) disposées à l'intérieur du globe (10), et laquelle lampe du type ampoule (1) comporte un substrat pouvant être incurvé (21) disposé à l'intérieur du globe (10), et le substrat (21) ayant des parties incurvées (21b, 21d) formées par courbure, et des parties plates (21a1, 21a2) sur lesquelles sont disposées les diodes électroluminescentes (22).
PCT/JP2013/001171 2012-08-08 2013-02-27 Lampe du type ampoule, dispositif d'éclairage et procédé pour fabriquer une lampe du type ampoule WO2014024339A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012176421 2012-08-08
JP2012-176421 2012-08-08

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WO2014024339A1 true WO2014024339A1 (fr) 2014-02-13

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016165870A1 (fr) * 2015-04-15 2016-10-20 Osram Gmbh Moyen d'éclairage pourvu de led

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134249A (ja) * 2002-10-10 2004-04-30 Mitsubishi Electric Corp 照明装置
JP3169011U (ja) * 2011-04-27 2011-07-07 詮興開發科技股▲ふん▼有限公司 発光ダイオードランプ
JP2011134874A (ja) * 2009-12-24 2011-07-07 Nippon Mektron Ltd 照明装置及びその製造方法
JP2012038591A (ja) * 2010-08-06 2012-02-23 Sumitomo Bakelite Co Ltd 光源装置および照明器具
JP2012123982A (ja) * 2010-12-07 2012-06-28 Mitsubishi Electric Corp 照明装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134249A (ja) * 2002-10-10 2004-04-30 Mitsubishi Electric Corp 照明装置
JP2011134874A (ja) * 2009-12-24 2011-07-07 Nippon Mektron Ltd 照明装置及びその製造方法
JP2012038591A (ja) * 2010-08-06 2012-02-23 Sumitomo Bakelite Co Ltd 光源装置および照明器具
JP2012123982A (ja) * 2010-12-07 2012-06-28 Mitsubishi Electric Corp 照明装置
JP3169011U (ja) * 2011-04-27 2011-07-07 詮興開發科技股▲ふん▼有限公司 発光ダイオードランプ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016165870A1 (fr) * 2015-04-15 2016-10-20 Osram Gmbh Moyen d'éclairage pourvu de led
US10655791B2 (en) 2015-04-15 2020-05-19 Ledvance Gmbh Luminous means having LEDs

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