WO2014041721A1 - Source de lumière pour éclairage et dispositif d'éclairage - Google Patents

Source de lumière pour éclairage et dispositif d'éclairage Download PDF

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Publication number
WO2014041721A1
WO2014041721A1 PCT/JP2013/003062 JP2013003062W WO2014041721A1 WO 2014041721 A1 WO2014041721 A1 WO 2014041721A1 JP 2013003062 W JP2013003062 W JP 2013003062W WO 2014041721 A1 WO2014041721 A1 WO 2014041721A1
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WO
WIPO (PCT)
Prior art keywords
base material
base
metal body
led
light
Prior art date
Application number
PCT/JP2013/003062
Other languages
English (en)
Japanese (ja)
Inventor
次弘 松田
倉地　敏明
功幸 長浜
直紀 田上
健太 渡邉
考志 大村
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014041721A1 publication Critical patent/WO2014041721A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements

Definitions

  • the present invention relates to an illumination light source and an illumination device, for example, an LED lamp and an illumination device using a light emitting element such as an LED (Light Emitting Diode).
  • a light emitting element such as an LED (Light Emitting Diode).
  • LEDs Since LEDs have high efficiency and long life, they are expected as new light sources such as lamps, and research and development of LED lamps using LEDs as light sources are being promoted.
  • a bulb-type LED lamp (bulb-shaped LED lamp) that replaces a bulb-type fluorescent lamp or an incandescent bulb, or a straight-tube LED lamp (straight-tube LED lamp) that replaces a straight-tube fluorescent lamp Etc.
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • Patent Document 2 discloses a conventional straight tube LED lamp.
  • an LED lamp for example, an LED module in which a plurality of LEDs are mounted on a substrate is used as a light source.
  • the present invention has been made to solve the above-described problems, and an object thereof is to provide an illumination light source and an illumination device that can improve heat dissipation of a light emitting element.
  • one aspect of a light source for illumination according to the present invention is mounted on one surface of a globe, a base disposed in the globe and having a metal body therein, and the base.
  • the metal body may be in contact with the support member.
  • the base includes a first base and a second base, and the first light emitting element is a surface of the base.
  • the first substrate is mounted on one surface
  • the second light emitting element is mounted on one surface of the second substrate, which is the other surface of the base
  • the metal body is It is good also as arrange
  • the metal body is in surface contact with the other surface of the first base material and the other surface of the second base material. Also good.
  • the support member is provided so as to extend inward of the globe, and the metal body is attached to one end of the support member. It is good also as being.
  • one end of the support member may be fitted in a through hole provided in the second base material.
  • the first base is a plate-like first substrate
  • the second base is a plate-like second substrate
  • the metal body may be a planar member
  • the metal body may be thicker than any of the first base material and the second base material.
  • the light source further includes a lead wire for supplying power to the first light emitting element and the second light emitting element, and the first substrate, the metal body, and the Each of the second substrates has an insertion hole for inserting the lead wire, and an opening area of the insertion hole of the metal body is an opening area of the insertion hole of the first substrate and the second substrate. It may be larger than.
  • the metal body may have a thermal conductivity higher than that of the first base material and the second base material.
  • the support member may be made of metal.
  • the metal body and the support member may be integrally formed.
  • each of the first light emitting element and the second light emitting element is mounted in a row, and the plurality of the first light emitting elements are arranged.
  • the first light-emitting element that converts the wavelength of light emitted from the first light-emitting element and the plurality of second light-emitting elements are collectively sealed, and the second light-emitting element includes: It is good also as having the 2nd wavelength conversion member which converts the wavelength of the emitted light.
  • an aspect of the illumination device according to the present invention is characterized by including any one of the illumination light sources described above.
  • the heat dissipation of the light emitting element can be improved.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing a configuration around the LED module in the light bulb shaped lamp according to the embodiment of the present invention, wherein (a) is a top view, and (b), (c) and (d) are sectional views. .
  • FIG. 5 is an exploded perspective view of the LED module and the column in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is an enlarged cross-sectional view of the LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 7 is an enlarged sectional view around the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 8 is an enlarged sectional view around the LED module in the light bulb shaped lamp according to the first modification of the embodiment of the present invention.
  • FIG. 9 is an enlarged cross-sectional view around the LED module in the light bulb shaped lamp according to the second modification of the embodiment of the present invention.
  • FIG. 10 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • a light bulb shaped lamp will be described as an example of an illumination light source.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.
  • the upper side of the paper is the front of the light bulb shaped lamp 1
  • the lower side of the paper is the rear of the light bulb shaped lamp 1
  • the left and right sides of the paper are the sides of the light bulb shaped lamp 1.
  • “rear” means the direction of the base with respect to the LED module 20
  • “front” means the direction of the side opposite to the base with respect to the LED module 20.
  • “side” means a direction parallel to the main surface of the base 21 of the LED module 20.
  • the alternate long and short dash line drawn along the vertical direction of the drawing indicates the lamp axis J (center axis) of the bulb-type lamp 1.
  • the lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.
  • the light bulb shaped lamp 1 is a light bulb shaped LED lamp (LED light bulb) that is an alternative to a light bulb shaped fluorescent light or an incandescent light bulb. As shown in FIGS. 1 to 3, a light-transmitting globe 10 and a light source are used. A certain LED module 20, a base 30 that receives electric power from the outside of the lamp, a support column 40, a support base 50, a resin case 60, a lead wire 70, and a lighting circuit 80 are provided.
  • LED light bulb LED lamp
  • FIGS. 1 to 3 a light-transmitting globe 10 and a light source are used.
  • a certain LED module 20, a base 30 that receives electric power from the outside of the lamp, a support column 40, a support base 50, a resin case 60, a lead wire 70, and a lighting circuit 80 are provided.
  • the bulb-shaped lamp 1 includes an envelope formed by the globe 10, the resin case 60 (first case portion 61), and the base 30. Further, the light bulb shaped lamp 1 in the present embodiment is a high output type, and the LED module 20 is configured to have a brightness equivalent to the 60 W type.
  • the globe 10 is a light-transmitting cover that houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp.
  • the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
  • the globe 10 in the present embodiment is made of a material that is transparent to the light from the LED module 20.
  • a glass valve made of silica glass that is transparent to visible light can be used.
  • the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.
  • the globe 10 has a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
  • the LED module 20 is a light emitting module (light emitting device) that has an LED (LED chip) and emits light when electric power is supplied to the LED via the lead wire 70. As shown in FIG. 3, the LED module 20 is held hollow in the globe 10 by a support column 40. A base 21 in the LED module 20 is disposed in the globe 10. As will be described later, LEDs are mounted on each of the front side surface and the rear side surface of the base 21.
  • the LED module 20 is preferably arranged at the center position of the spherical portion of the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large).
  • the light distribution characteristic of the light bulb shaped lamp 1 is made to be a light distribution characteristic approximate to that of a general incandescent light bulb using a conventional filament coil. it can.
  • the base 30 is a power receiving unit that receives power for causing the LEDs of the LED module 20 to emit light from the outside of the light bulb shaped lamp 1.
  • the base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire.
  • AC power is supplied to the base 30 from a commercial power supply (AC 100 V).
  • the base 30 is attached to a socket of a lighting fixture (lighting device) and receives AC power from the socket. Thereby, the light bulb shaped lamp 1 (LED module 20) is turned on.
  • the base 30 has a metal bottomed cylindrical shape (cap shape), and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion.
  • a screwing portion for screwing with the socket of the lighting device is formed on the outer peripheral surface of the base 30, and a screwing portion for screwing with the resin case 60 is formed on the inner peripheral surface of the base 30.
  • the base 30 is made of metal, and the heat conducted to the base 30 is radiated to the lighting fixture. Note that the heat conducted to the resin case 60 and the heat generated from the lighting circuit 80 are conducted to the base 30.
  • the type of the base 30 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used.
  • E type screwed-type Edison type
  • a plug-type base may be used as the base 30.
  • the support column 40 is a support member (holding member) that supports the base 21 of the LED module 20. Thereby, the LED module 20 is held at a predetermined position in the globe 10.
  • the support column 40 is provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10.
  • the column 40 is a metal stem (metal column). One end of the support column 40 is connected to the LED module 20, and the other end is connected to the support base 50.
  • the support column 40 also functions as a heat radiating member for radiating heat generated in the LED module 20 to the base 30 side. Therefore, it is preferable that the support column 40 be made of a metal material having high thermal conductivity mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like. Thereby, the heat generated in the LED module 20 can be efficiently conducted to the support base 50 via the support column 40, and the decrease in the light emission efficiency and the lifetime of the LED due to the temperature increase can be effectively suppressed. .
  • the support column 40 is made of an aluminum alloy.
  • pillar 40 is not comprised only with a metal, You may comprise the support
  • the support column 40 is a long member, and for example, a columnar member can be used. One end of the column 40 in the longitudinal direction is connected to the LED module 20, and the other end is connected to the support base 50.
  • the support 40 and the LED module 20 can be fixed using an adhesive such as a silicone resin.
  • pillar 40 and the support stand 50 can be performed using an adhesive agent or a screw
  • the support base (support plate) 50 is a support member that supports the support column 40 and is fixed to the resin case 60. As shown in FIG. 3, the support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10. Specifically, the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level
  • the support base 50 is made of a metal material having a high thermal conductivity such as aluminum, like the support column 40. Thereby, the heat of the LED module 20 can be efficiently conducted.
  • the heat conducted to the support base 50 is conducted to the resin case 60 and radiated to the outside of the lamp.
  • pillar 40 may be integrally shape
  • the resin case 60 is an insulating case (circuit holder) for insulating the support column 40 and the base 30 and accommodating the lighting circuit 80. As shown in FIGS. 2 and 3, the first case having a large diameter cylindrical shape is used. The portion 61 and the second case portion 62 having a small diameter cylindrical shape are configured.
  • the resin case 60 is made of, for example, polybutylene terephthalate (PBT).
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.
  • the two lead wires 70 are a pair of lead wires for supplying power for lighting the LED module 20 from the lighting circuit 80 to the LED module 20, and can be composed of a wire-like metal wire such as a copper wire. it can.
  • Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminal of the LED module 20, and the other end is electrically connected to the lighting circuit 80.
  • the two lead wires 70 are connected from the lighting circuit 80 to the LED module 20 through insertion holes provided in the support base 50.
  • the lead wire 70 may be connected to the LED module 20 through a cavity provided in the support column 40 together with the insertion hole of the support base 50.
  • the two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin covering the core wire.
  • the lead wire 70 and the LED module 20 are electrically connected via the exposed core wire.
  • the lighting circuit 80 is a drive circuit (circuit unit) for lighting the LEDs of the LED module 20 and is covered with a resin case 60.
  • the lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED module 20 via the two lead wires 70.
  • the lighting circuit 80 includes, for example, a circuit board and a plurality of circuit elements (electronic components) mounted on the circuit board.
  • the circuit board is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements mounted on the circuit board.
  • the circuit board is disposed in a posture in which the main surface is orthogonal to the lamp axis J.
  • the circuit elements are, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements, and the lighting circuit 80 is a circuit element among these circuit elements. It is configured by selecting as appropriate.
  • the light bulb shaped lamp 1 is not necessarily provided with the lighting circuit 80.
  • the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.
  • FIG. 4 is a diagram showing a configuration around the LED module in the light bulb shaped lamp 1 according to the present embodiment.
  • FIG. 5 is an exploded perspective view of the LED module 20 and the column 40 in the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 4A is a plan view when the LED module 20 is viewed from above
  • FIG. 4B is a cross-sectional view of the LED module 20 taken along line XX ′
  • FIG. 4C is a cross-sectional view of the LED module 20 taken along the line YY ′ of FIG. 4A
  • FIG. 4D is the same LED taken along the line ZZ ′ of FIG. 2 is a cross-sectional view of a module 20.
  • the LED module 20 is a light emitting module (light emitting device) that mainly emits light forward and backward.
  • a COB Chip On Board
  • a bare chip is directly mounted on the surface of the base 21. It is a structure.
  • the LED module 20 includes a base 21 having a metal body 28 therein, and an LED mounted on one surface (front surface) of the base 21. (First light emitting element) 22a and an LED (second light emitting element) 22b mounted on the other surface (rear surface) of the base 21. Further, the LED module 20 includes a sealing member 23a for sealing the LED 22a, a sealing member 23b for sealing the LED 22b, metal wirings 24a and 24b, wires 25a and 25b, terminals 26a and 26b, Adhesive members 27a and 27b.
  • the base 21 is comprised by the 1st base material 21a arrange
  • the metal body 28 is arrange
  • the LED module 20 includes a first LED module (first light emitting module) 20a including a first base 21a and a second base 21b including a second base 21b.
  • the first LED module 20a is a main light emitting module that mainly emits light toward the front and sides, and includes a first base material 21a, a plurality of LEDs 22a, a sealing member 23a, and a metal wiring 24a. , A wire 25a, a terminal 26a, and a conductive adhesive member 27a.
  • the second LED module 20b is a sub-light emitting module that emits light mainly toward the rear and side, and includes a second base material 21b, a plurality of LEDs 22b, a sealing member 23b, and a metal wiring 24b. , A wire 25b, a terminal 26b, and a conductive adhesive member 27b.
  • the metal body 28 is sandwiched between the first base member 21a of the first LED module 20a and the second base member 21b of the second LED module.
  • the 1st base material 21a is an insulating base material located in the front side (glove side) among a plurality of base materials in base 21.
  • the second base material 21 b is a base material located on the rear side (the base side) among the plurality of base materials in the base 21. Therefore, the front surface (one surface of the base) of the base 21 is a surface (one surface of the first base material) that is the front surface of the first base material 21a.
  • a surface on the rear side of 21 (the other surface of the base) is a surface (one surface of the first base material) which is a surface on the rear side of the second base material 21b.
  • the back surface (other surface of the first base material) which is the rear surface of the first base material 21a and the back surface (other surface of the second base material) which is the front surface of the second base material 21b. Is facing the surface.
  • the first base material 21a and the second base material 21b are plate-like substrates, and a light-transmitting substrate or a non-light-transmitting substrate can be used.
  • the first base material 21a and the second base material 21b are, for example, a ceramic substrate such as aluminum oxide (alumina) or aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, or a resin-coated metal substrate (metal base substrate). Etc.
  • the first base material 21a and the second base material 21b are rectangular mounting boards (LED mounting boards) for mounting LEDs.
  • the metal body 28 is a member having rigidity such as a metal plate
  • the first base material 21a and the second base material 21b may be formed of a resin film or the like.
  • a substrate having a low light transmittance with respect to light emitted from the first LED 22a and the second LED 22b for example, white alumina having a total transmittance of 10% or less.
  • a white substrate such as a substrate or a metal substrate can be used.
  • a substrate having a light reflectance of 50% or more with respect to light emitted from the first LED 22a and the second LED 22b for example, Al 2 O 3 (alumina ),
  • a ceramic substrate mainly composed of any of MgO, SiO, and TiO 2 can also be used.
  • a light-transmitting substrate having a high light transmittance can be used as the first base material 21a and the second base material 21b.
  • a substrate having a total transmittance of 80% or more for visible light, or transparent to visible light, that is, the transmittance is extremely high and the other side can be seen through.
  • a state substrate can be used.
  • a translucent substrate a translucent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a quartz substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin material made of transparent resin material A resin substrate or the like can be used.
  • two insertion holes 21 a ⁇ / b> X for inserting the lead wires 70 are provided at both ends (short sides) of the first base material 21 a in the longitudinal direction. ing.
  • the insertion hole 21aX is provided so as to penetrate the first base material 21a.
  • the insertion hole 21aX may be a through hole having a circular shape in plan view.
  • the insertion hole 21aX constitutes a terminal 26a for electrically connecting the power supply lead wire 70 and the LED module 20.
  • two insertion holes 21bX for inserting the lead wire 70 are provided at both ends (short side) in the longitudinal direction of the second base material 21b.
  • the insertion hole 21bX is provided so as to penetrate the second base material 21b, and can be a through hole having a circular shape in plan view, for example, similarly to the insertion hole 21aX.
  • the insertion hole 21bX constitutes a terminal 26b for electrically connecting the power supply lead wire 70 and the LED module 20.
  • the size (diameter) of the insertion hole 21bX can be made the same as the size (diameter) of the insertion hole 21aX.
  • one through hole 21bY penetrating the second base material 21b is provided at the center of the second base material 21b.
  • the front end portion of the support column 40 on the LED module side is fitted into the through hole 21bY.
  • the LED module 20 is fixed to the support column 40 by fitting the support column 40 into the through hole 21bY.
  • the first base material 21a and the second base material 21b have the same shape, the long side length is L1, the short side length is L2, and the thickness is t.
  • the first base material 21a and the second base material 21b may have different shapes. For example, you may comprise so that the area of one base material of the 1st base material 21a and the 2nd base material 21b may become large.
  • the LEDs 22a and 22b are examples of light emitting elements, and are semiconductor light emitting elements that emit light with a predetermined power. In the present embodiment, the same LED 22a and 22b are used, for example, blue LED chips that emit blue light when energized. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a central wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.
  • the LEDs 22a form a plurality of rows along the long side direction of the first base member 21a on the front side surface of the first base member 21a. A plurality of them are implemented.
  • the plurality of LEDs 22a are configured as six element rows in parallel.
  • the plurality of LEDs 22a in each element row are linearly arranged at the same pitch, and are connected in series.
  • column is connected in parallel.
  • a plurality of LEDs 22b are mounted on the rear surface of the second base material 21b so as to form a plurality of rows along the long side direction of the second base material 21b.
  • the plurality of LEDs 22b are configured as six element rows in parallel, like the LEDs 22a.
  • the plurality of LEDs 22b in each element row are connected in series and arranged in a straight line at the same pitch.
  • column is connected in parallel.
  • the six element rows by the LED 22a and the six element rows by the LED 22b are mounted so as to face each other with the base 21 interposed therebetween.
  • FIG. 6 is an enlarged cross-sectional view around the LED (LED chip) in the LED module 20 of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • the periphery of the LED 22a is shown, but the same applies to the LED 22b.
  • the LED 22 a includes a sapphire substrate 122 a and a plurality of nitride semiconductor layers 122 b that are stacked on the sapphire substrate 122 a and have different compositions.
  • a cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b.
  • a wire bond portion 122e is provided on the cathode electrode 122c, and a wire bond portion 122f is provided on the anode electrode 122d.
  • the cathode electrode 122c of one LED 22a and the anode electrode 122d of the other LED 22a are connected by a wire 25a through wire bond portions 122e and 122f.
  • the LED 22a is fixed on the first base material 21a with a translucent chip bonding material 122g so that the surface on the sapphire substrate 122a side faces the front surface or the back surface of the first base material 21a.
  • a translucent material for the chip bonding material 122g loss of light emitted from the side surface of the LED 22a can be reduced, and generation of shadows by the chip bonding material 122g can be suppressed.
  • the sealing member 23a collectively seals each element row composed of the plurality of LEDs 22a and seals the metal wiring 24a. . That is, six sealing members 23a are formed in parallel. Each of the six sealing members 23a is linearly provided on the front surface of the first base member 21a along the arrangement direction (column direction) of the plurality of LEDs 22a.
  • the sealing member 23b collectively seals each element row composed of the plurality of LEDs 22b and seals the metal wiring 24b. That is, six sealing members 23b are also formed in parallel. Each of the six sealing members 23b is linearly provided on the rear surface of the second base member 21b along the arrangement direction (column direction) of the plurality of LEDs 22b. The six sealing members 23a and the six sealing members 23b are mounted so as to face each other with the base 21 interposed therebetween.
  • the sealing members 23a and 23b are wavelength conversion members that convert the wavelength (color) of light emitted from the LED.
  • the sealing member 23a is a first wavelength conversion member that converts the wavelength of light emitted from the LED 22a
  • the sealing member 23b is a second wavelength conversion member that converts the wavelength of light emitted from the LED 22b.
  • the sealing members 23a and 23b are insulating resin materials containing phosphor particles as a wavelength conversion material.
  • the phosphor particles in the sealing members 23a and 23b are excited by the light emitted from the LEDs 22a and 22b to emit light of a desired color (wavelength).
  • the sealing member 23a and the sealing member 23b all have the same configuration, and both are configured by the same phosphor particles and the same sealing resin material.
  • the phosphor particles when the LEDs 22a and 22b are blue LEDs that emit blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used to emit white light from the sealing members 23a and 23b. It is done.
  • YAG (yttrium / aluminum / garnet) yellow phosphor particles can be used as the phosphor particles.
  • a part of blue light emitted from the LEDs 22a and 22b is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing members 23a and 23b. That is, the yellow phosphor particles emit fluorescent light using blue light as excitation light.
  • the blue light that is not absorbed by the yellow phosphor particles (not wavelength-converted) and the yellow light that is wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing members 23a and 23b.
  • the white light is emitted from each of the sealing members 23a and 23b.
  • phosphor particles that emit fluorescence other than yellow such as red phosphor particles, may be included as necessary.
  • each sealing member 23a and 23b a transparent resin material such as silicone resin or an organic material such as fluorine resin can be used.
  • the sealing members 23a and 23b are made of a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin, and can be applied and formed on the surface of the base 21 by a dispenser.
  • the shapes of the sealing members 23a and 23b in the cross section perpendicular to the longitudinal direction are substantially semicircular.
  • an inorganic material such as a low-melting glass or a sol-gel glass can be used in addition to the resin.
  • a light diffusing material such as silica particles may be dispersed in each sealing member 23a and 23b.
  • the metal wirings 24a and 24b are formed to connect a plurality of LEDs in each LED element row in series.
  • the metal wirings 24a and 24b are formed in an island shape between adjacent LEDs.
  • the metal wirings 24a and 24b are formed to connect the element rows in parallel.
  • the metal wirings 24a and 24b can be formed, for example, by patterning or printing a metal film made of a metal material.
  • a metal material of the metal wirings 24a and 24b for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used. Note that the surface of the metal wirings 24a and 24b may be plated with nickel (Ni) / gold (Au) or the like.
  • the metal wirings 24a and 24b exposed from the sealing members 23a and 23b are covered with a glass film (glass coat film) made of a glass material or a resin film (resin coat film) made of a resin material, except for the terminals 26a and 26b. It is preferable to do. Thereby, the insulation in the LED module 20 can be improved, or the reflectance of the surface of the base 21 can be improved.
  • the wires 25a and 25b are electric wires such as gold wires. As shown in FIG. 4D, the wire 25a connects the LED 22a and the metal wiring 24a, and the wire 25b connects the LED 22b and the metal wiring 24b. As described with reference to FIG. 5, the wire 25a (25b) allows the wire bonding portions 122e and 122f provided on the upper surface of the LED 22a (22b) and the metal wiring 24a (adjacent to both sides of the LED 22a (22b)) to be formed. 24b) is wire-bonded.
  • the wires 25a and 25b may be entirely embedded in the sealing members 23a and 23b so as not to be exposed from the sealing members 23a and 23b.
  • the terminals 26 a and 26 b are external connection electrodes (connection lands) that are soldered to the lead wires 70. As shown in FIG. 4B, the terminal 26a is formed in a predetermined shape on the surface of the first base member 21a so as to surround the insertion hole 21aX. Similarly, the terminal 26b is formed in a predetermined shape on the surface of the second base material 21b so as to surround the insertion hole 21bX. The terminals 26a and 26b are electrically connected to the metal wirings 24a and 24b, and are formed integrally and continuously with the metal wirings 24a and 24b. The terminals 26a and 26b are patterned simultaneously with the metal wires 24a and 24b using the same metal material as the metal wires 24a and 24b.
  • the terminals 26a and 26b are power supply units of the LED module 20, and receive power for causing the LEDs 22a and 22b to emit light from the outside of the LED module 20.
  • the received electric power is supplied to each of the LEDs 22a and 22b via the metal wirings 24a and 24b and the wires 25a and 25b.
  • the conductive adhesive members 27a and 27b are, for example, conductive adhesives such as solder or silver paste. As shown in FIG. 4B, the conductive adhesive member 27a electrically connects the terminal 26a and the lead wire 70, and the conductive adhesive member 27b electrically connects the terminal 26b and the lead wire 70. Connect. Thus, the LED module 20 and the lead wire 70 are electrically and physically connected by the conductive adhesive members 27a and 27b.
  • the conductive adhesive member 27a is formed on the surface of the terminal 26a so as to cover the side surface at the tip of the lead wire 70 with respect to the lead wire 70 through which the insertion holes 21aX and 21bX are inserted. . Further, the conductive adhesive member 27a is provided so as to block the opening on the front side of the first base member 21a in the insertion hole 21aX.
  • the conductive adhesive member 27b is formed on the surface of the terminal 26b so as to cover the base side surface of the lead wire 70 with respect to the lead wire 70 inserted through the insertion holes 21aX and 21bX.
  • the conductive adhesive member 27b is provided so as to block the opening on the rear side of the second base material 21b in the insertion hole 21bX.
  • the tip of the lead wire 70 is provided so as to be exposed from the surface of the conductive adhesive member 27a.
  • the tip of the lead wire 70 may be completely covered.
  • the metal body 28 is a metal heat transfer member provided inside the base 21, and functions as a heat sink that dissipates heat generated by the LEDs 22 a and 22 b mounted on the base 21.
  • the metal body 28 is attached to the support column 40. Specifically, as shown in FIGS. 4B and 4C and FIG. 5, the metal body 28 is attached to the distal end portion of the support column 40 through the through hole 21bY provided in the second base material 21b. It is attached. As a result, the heat of the LEDs 22 a and 22 b conducted to the base 21 can be conducted to the support column 40 via the metal body 28.
  • the metal body 28 is sandwiched between the first base material 21a and the second base material 21b. That is, the metal body 28 is disposed between the rear surface of the first base material 21a and the front surface of the second base material 21b.
  • the metal body 28 is provided with two insertion holes 28 ⁇ / b> X for inserting the lead wires 70.
  • the insertion hole 28X is formed so as to correspond to the insertion hole 21aX of the first base material 21a and the insertion hole 21bX of the second base material 21b.
  • the insertion hole 28X can be, for example, a through hole having a circular shape in plan view.
  • the opening area (diameter) of the insertion hole 28X of the metal body 28 is preferably larger than the opening area (diameter) of the insertion hole 21aX of the first base material 21a and the insertion hole 21bX of the second base material 21b. .
  • the lead wire 70 between the insertion hole 21aX (first base material 21a) and the insertion hole 21bX (second base material 21b) has an exposed metal core wire through which current flows. This is because it is preferable to ensure a certain insulation distance between the metal body 28.
  • the metal body 28 is a planar member made of a metal such as aluminum, and can be a metal plate or a metal layer, for example.
  • the metal body 28 is in surface contact with the rear surface of the plate-like first base material (substrate) 21a and the front surface of the plate-like base material (substrate) 21b.
  • the planar view shape of the metal body 28 is the same as the planar view shapes of the first base material 21a and the second base material 21b, and is substantially rectangular. That is, the metal body 28 is in contact with the entire rear surface of the first base material 21a and the entire front surface of the second base material except for the insertion hole 28X.
  • the metal body 28 in the present embodiment is in contact with the support column 40.
  • the metal body 28 is in surface contact with the upper end surface of the support column 40, and the upper end surface of the support column 40 is in contact with the rear surface of the metal body 28.
  • the metal body 28 may be connected to the column 40 without contacting the column 40.
  • an adhesive may be applied between the metal body 28 and the support column 40 in order to fix the metal body 28 and the support column 40.
  • the metal body 28 is attached to the support column 40, it is thermally coupled to the support column 40. Further, the metal body 28 is thermally coupled to the first base material 21a and the second base material 21b by being sandwiched between the first base material 21a and the second base material 21b.
  • pillar 40 and the metal body 28 is the center part of the 1st base material 21a and the 2nd base material 21b. This is because the heat of the LEDs 22a and 22b is more likely to be trapped in the central part of the first base material 21a and the second base material 21b than in the peripheral part.
  • the metal body 28 is configured to be one rectangular plate-shaped planar member, but is not limited thereto.
  • the metal body 28 may be configured to be partially embedded in the first base material 21a and the second base material 21b, or may be configured by a plurality of metal patterns.
  • the metal body 28 has a plurality of metal patterns, it can be formed in a plurality of lines or formed in a plurality of rings. In these cases, at least one of the metal patterns may be connected to the support column 40. Further, a plurality of metal patterns may be formed so as to extend radially from the support column 40 toward the periphery so that all the metal patterns are connected to the support column 40.
  • FIG. 7 is an enlarged cross-sectional view around the LED module in the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • the metal body 28 is sandwiched between the first base material 21 a and the second base material 21 b, and the metal body 28 is connected to the support column 40.
  • the heat generated in each LED 22a mounted on the first base material 21a is conducted to the metal body 28 through the first base material 21a, and further conducted from the metal body 28 to the support column 40.
  • heat generated in each LED 22b mounted on the second base material 21b is conducted to the metal body 28 via the second base material 21b, and further conducted from the metal body 28 to the support column 40.
  • the heat conducted to the column 40 is radiated from the resin case 60 or the base 30 to the outside of the lamp via the support base 50.
  • the heat of the LEDs 22a and 22b can be radiated through the metal body 28 and the support column 40.
  • the thermal conductivity of the metal body 28 is larger than the thermal conductivity of the first base material 21a and the second base material 21b. Therefore, the heat of the first base material 21 a and the second base material 21 b can be efficiently conducted to the metal body 28.
  • the metal body 28 is sandwiched between the first base material 21a and the second base material 21b. That is, the reflective metal body 28 exists immediately below the LED 22a (rear side) and immediately below the LED 22b (front side). Therefore, as shown in FIG. 7, the light La transmitted through the first base material 21 a is reflected by the metal body 28, is transmitted through the first base material 21 a again, and is on the front side of the first base material 21 a. Emits from the surface. Similarly, the light Lb that has passed through the second base material 21b is reflected by the metal body 28, passes through the second base material 21b again, and is emitted from the rear surface of the second base material 21b.
  • the light extraction efficiency as the 2nd LED module 20b can be improved. This is particularly effective when the first LED module 20a and the second LED module 20b are turned on (driven) independently.
  • the first base material 21a and the second base material 21b are substrates with low transmittance, part of the light of the LED mounted on the front surface may pass through the inside of the substrate and leak from the back surface. .
  • the metal body 28 contained in the base 21 is connected to the support column 40, the heat dissipation of the LEDs 22a and 22b mounted on the base 21 is improved. Can be improved.
  • FIG. 8 is an enlarged sectional view around the LED module in the light bulb shaped lamp according to the first modification of the embodiment of the present invention.
  • the thickness of the metal body 28 that is a planar member is configured to be thinner than the thickness of the first base material 21 a and the second base material 21 b.
  • the thickness of the metal body 28 ⁇ / b> A is configured to be thicker than any of the first base material 21 a and the second base material 21 b. That is, when the thickness of the first base material 21a is t1, the thickness of the second base material 21b is t2, and the thickness of the metal body 28A is t3, t3> t1 and t3> t2. ing.
  • the metal body 28 is sandwiched between the first base material 21a and the second base material 21b as in the embodiment shown in FIG.
  • the metal body 28 is connected to the support column 40.
  • the thickness of the metal body 28A is made thicker than the thickness of the first base material 21a and the second base material 21b. Therefore, since the metal body 28A can make an envelope volume larger than the metal body 28 shown by FIG. 7, the heat dissipation of LED22a and 22b can be improved further.
  • FIG. 9 is an enlarged cross-sectional view around the LED module in the light bulb shaped lamp according to the second modification of the embodiment of the present invention.
  • the metal body 28 and the support column 40 are configured as separate members, but in this modification, the metal body 28 and the support column 40 in FIG. 7 are integrally formed.
  • the support column 40A in this modification corresponds to an integrally molded metal body 28 and support column 40, and includes a flat plate portion 41 that is a flat plate portion and a main shaft portion 42 that is a columnar portion.
  • the cross-sectional shape is substantially T-shaped.
  • the flat plate portion 41 corresponds to the metal body 28 of the above embodiment
  • the main shaft portion 42 corresponds to the support column 40 of the above embodiment.
  • the entire support column 40A is made of the same material as that of the support column 40 described above.
  • the flat plate portion 41 which is a part of the support column 40A is sandwiched between the first base material 21a and the second base material 21b.
  • the flat plate portion 41 (metal body 28) and the main shaft portion 42 (support 40) are integrally formed. Accordingly, in the configuration shown in FIG. 7, the metal body 28 and the support column 40 are configured by separate members, and thermal resistance exists between the metal body 28 and the support column 40, but in this modification, There is no thermal resistance between the flat plate portion 41 and the main shaft portion 42. Therefore, compared with the structure shown in FIG. 7, the heat dissipation of LED22a and 22b can be improved further.
  • the first base material 21a and the second base material 21b are plate-shaped substrates, but are not limited thereto.
  • the first base material 21a and the second base material 21b may be insulating layers, and the insulating layers may be formed on both surfaces of a metal body 28 made of a metal plate. That is, as the base 21, a metal base substrate in which an insulating layer (first base material 21a and second base material 21b) is coated on both surfaces of a metal plate (metal body 28) can be used.
  • the LED module is configured to emit white light by the blue LED and the yellow phosphor, but is not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
  • the LED may be an LED that emits a color other than blue.
  • a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles.
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser
  • an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, or other solid state light emitting element. May be used.
  • the LED module has a COB type configuration in which the LED chip is directly mounted on the substrate, but is not limited thereto.
  • a metal wiring is formed on the LED element using a package-type LED element in which an LED chip is mounted in a recess (cavity) of a resin container and a phosphor-containing resin is sealed in the recess.
  • a surface mount type (SMD) LED module configured by mounting a plurality of elements on a substrate may be used. That is, instead of the LED chip (bare chip), the package type LED element may be used as the light emitting element.
  • the light bulb-type lamp is described as an example of the illumination light source.
  • an illumination light source such as a straight tube lamp or a round lamp may be used.
  • substrate which mounts LED according to the shape of each lamp
  • the LED module 20 according to the present invention can also be applied to light sources of other devices other than lamps.
  • the present invention can also be realized as an illumination device including the above-described light bulb shaped lamp.
  • the lighting device 100 is configured as a lighting device including the light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached.
  • the lighting device 200 is for turning off and lighting the light bulb shaped lamp 1 and includes, for example, a device main body 210 attached to the ceiling and a lamp cover 220 covering the light bulb shaped lamp 1.
  • the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1.
  • a translucent plate may be provided in the opening of the lamp cover 220.
  • the present invention is useful as an illumination light source having a light emitting element such as an LED, particularly as a light bulb shaped lamp that replaces a conventional incandescent bulb and the like, and can be widely used as a light source for various devices such as illumination devices. .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne une lampe de type ampoule d'éclairage (1) comprenant un globe (10), une base (21) disposée à l'intérieur du globe (10, un corps métallique (28), une DEL (22a) montée sur une surface de la base (21), une DEL (22b) montée sur l'autre surface de la base (21), et une colonne de support (40) pour supporter la base (21). Le corps métallique (28) est fixé à la colonne de support (40).
PCT/JP2013/003062 2012-09-11 2013-05-13 Source de lumière pour éclairage et dispositif d'éclairage WO2014041721A1 (fr)

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Application Number Priority Date Filing Date Title
JP2012-199509 2012-09-11
JP2012199509 2012-09-11

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11543081B2 (en) * 2013-06-27 2023-01-03 Epistar Corporation LED assembly with omnidirectional light field

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ｌｅｄランプおよび電球形ｌｅｄランプ
WO2012095931A1 (fr) * 2011-01-14 2012-07-19 パナソニック株式会社 Lampe et dispositif d'éclairage
JP2012156036A (ja) * 2011-01-27 2012-08-16 Iwasaki Electric Co Ltd Ｌｅｄランプ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010157459A (ja) * 2008-12-31 2010-07-15 Keiji Iimura Ｌｅｄランプおよび電球形ｌｅｄランプ
WO2012095931A1 (fr) * 2011-01-14 2012-07-19 パナソニック株式会社 Lampe et dispositif d'éclairage
JP2012156036A (ja) * 2011-01-27 2012-08-16 Iwasaki Electric Co Ltd Ｌｅｄランプ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11543081B2 (en) * 2013-06-27 2023-01-03 Epistar Corporation LED assembly with omnidirectional light field

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