WO2013031171A1 - Dispositif d'affichage et procédé de production pour celui-ci - Google Patents
Dispositif d'affichage et procédé de production pour celui-ci Download PDFInfo
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- WO2013031171A1 WO2013031171A1 PCT/JP2012/005361 JP2012005361W WO2013031171A1 WO 2013031171 A1 WO2013031171 A1 WO 2013031171A1 JP 2012005361 W JP2012005361 W JP 2012005361W WO 2013031171 A1 WO2013031171 A1 WO 2013031171A1
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/22—Absorbing filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/02—Materials and properties organic material
Definitions
- the present invention relates to a display device such as a liquid crystal display device and a manufacturing method thereof.
- a thin display device such as a liquid crystal display device includes an active matrix substrate and a counter substrate facing the active matrix substrate.
- the active matrix substrate includes, for example, a glass substrate, a TFT (Thin Film Transistor) formed on the glass substrate and provided for each pixel, and a pixel electrode.
- TFT Thin Film Transistor
- the counter substrate includes, for example, a glass substrate and a color filter formed on the glass substrate and having a plurality of colored layers.
- a red (R), green (G), or blue (B) colored layer is disposed.
- a light shielding layer called a black matrix is provided.
- the black matrix plays a major role in reducing the TFT's off-leakage current by clarifying the outline of each pixel and suppressing the color mixture of light emitted from each pixel and suppressing the incidence of unnecessary external light on the TFT. Fulfill.
- the black matrix can be formed by an organic material film colored black, for example.
- the organic material film has a lower light shielding property than the metal film, it is necessary to make the film thickness relatively large.
- it is difficult to form an organic material film with a large thickness in a highly accurate dimensional shape when the black matrix is formed of an organic material film, the intended purpose of clarifying the pixel outline is achieved. Is difficult.
- the black matrix is preferably formed of a metal film having a relatively high light shielding property even if the film thickness is thinner than the organic material film.
- the black matrix can be formed as a stacked structure in which, for example, a metal film and a metal oxide film that is an antireflection film are stacked. According to this configuration, since the reflectance of external light in the metal oxide film is lower than that in the metal film, it is possible to reduce the incidence of light on the TFT and to suppress the reduction in display contrast.
- Patent Document 1 discloses that a black matrix antireflection film is formed of amorphous silicon instead of a metal oxide film.
- a black matrix antireflection film is formed of amorphous silicon instead of a metal oxide film.
- the refractive index of amorphous silicon changes according to the wavelength of incident light, it is not possible to form an antireflection film having a certain antireflection performance with amorphous silicon. Have difficulty. Therefore, it is preferable to form a black matrix with a metal film and a metal oxide film.
- the metal oxide film has low adhesion to the glass substrate which is a transparent substrate, if the metal oxide film is directly formed on the glass substrate, the counter substrate on which the black matrix is formed may be structurally unstable. There is. Further, it is desired to further improve the light blocking property and antireflection property of the black matrix.
- the present invention has been made in view of such a point, and the main object of the present invention is to prevent the black matrix from having a light shielding property while avoiding a decrease in adhesion between the black matrix having a metal oxide film and the transparent substrate.
- the purpose is to improve the antireflection property.
- a method of manufacturing a display device includes a step of forming a metal film and a transparent film on a first transparent substrate so as to be laminated with each other, and reducing the transparent film.
- the metal film and the transparent film are formed on the entire surface of the first transparent substrate, and the black matrix is formed in the step of forming the black matrix.
- the black matrix is formed in the step of forming the black matrix by etching the dark color film, the metal oxide layer, and the metal layer formed from a transparent film, and forming the colored layer.
- the colored layer may be formed on the transparent substrate.
- a step of forming a transparent electrode so as to cover the black matrix and the colored layer may be provided.
- the transparent film made of a transparent conductive film is formed on the entire surface of one surface of the first transparent substrate, and the metal film is overlapped with a part of the transparent film.
- the dark film is formed in a region of the transparent film that is in contact with the metal film, while the region that is not in contact with the metal film is defined as a transparent electrode. You may make it do.
- the metal film and the transparent film may be formed on the surface of the colored layer formed on the first transparent substrate.
- the metal film is formed so as to overlap a part of the first transparent substrate, and then the step of forming the colored layer is performed so as to be adjacent to the metal film.
- a colored layer may be formed on the transparent film, and the transparent film made of a transparent conductive film may be formed so as to cover the colored layer and the metal film.
- the transparent film is preferably heat-treated when the transparent film is reduced.
- a display device includes a first transparent substrate on which a plurality of colored layers and a black matrix are formed, and a second transparent substrate on which the plurality of switching elements are formed so as to face the first transparent substrate.
- the black matrix includes a dark color film, a metal layer, and a metal oxide layer interposed between the metal layer and the dark color film.
- the first transparent substrate is provided with a transparent electrode formed in the same layer as the dark color film of the black matrix, and the dark color film is formed by reducing a transparent film made of the same material as the transparent electrode. May be.
- the dark color film and the metal oxide layer may be formed on at least one of the first transparent substrate side and the second transparent substrate side in the metal layer.
- the transparent film and the transparent film are stacked on each other and formed on the first transparent substrate, the transparent film is reduced, so that a dark color film in which the transparent film is darkened can be formed, and the metal film Among them, a dark oxide film side portion can form a metal oxide layer oxidized by oxygen ions supplied from a transparent film to be reduced. Further, the remaining part of the metal film where the metal oxide layer is not formed can be formed as a metal layer. As a result, a black matrix in which the metal oxide layer is disposed between the dark color film and the metal layer can be formed.
- the metal oxide layer is in contact with the dark color film and the metal layer, but is not in direct contact with the first transparent substrate, thereby avoiding the problem of reduced adhesion between the metal oxide film and the first transparent substrate. it can. Moreover, since not only the metal oxide layer and the metal layer but also the dark color film is provided, the antireflection property and the light shielding property of the black matrix can be further improved. Furthermore, since both the dark color film and the metal oxide layer can be formed simultaneously by the reducing action of the transparent film, an increase in the manufacturing process can be suppressed.
- FIG. 1 is an enlarged sectional view showing the structure of the liquid crystal display device according to the first embodiment.
- FIG. 2 is a cross-sectional view showing the first transparent substrate.
- FIG. 3 is a cross-sectional view showing a transparent film and a metal film laminated on the first transparent substrate.
- FIG. 4 is a cross-sectional view showing a dark color film, a metal oxide layer, and a metal layer.
- FIG. 5 is a cross-sectional view showing a metal oxide layer and a metal layer patterned into a predetermined shape.
- FIG. 6 is a cross-sectional view showing a patterned dark color film.
- FIG. 7 is a cross-sectional view showing a colored layer formed between black matrices.
- FIG. 1 is an enlarged sectional view showing the structure of the liquid crystal display device according to the first embodiment.
- FIG. 2 is a cross-sectional view showing the first transparent substrate.
- FIG. 3 is a cross-sectional view showing a transparent film and
- FIG. 8 is a cross-sectional view showing a common electrode covering the black matrix and the colored layer.
- FIG. 9 is a graph showing the relationship between the wavelength of incident light and the reflectance with respect to the black matrix.
- FIG. 10 is an enlarged cross-sectional view showing the structure of the liquid crystal display device according to the second embodiment.
- FIG. 11 is a cross-sectional view showing a colored layer formed on the first transparent substrate.
- FIG. 12 is a cross-sectional view showing a transparent film and a metal film laminated on the surface of the colored layer.
- FIG. 13 is a cross-sectional view showing a metal layer patterned into a predetermined shape on a transparent film.
- FIG. 14 is a cross-sectional view showing a transparent electrode, a dark color film, a metal oxide layer, and a metal layer.
- FIG. 15 is an enlarged sectional view showing the structure of the liquid crystal display device according to the third embodiment.
- FIG. 16 is a cross-sectional view showing a metal film formed on the first transparent substrate.
- FIG. 17 is a cross-sectional view showing a metal film patterned into a predetermined shape on the first transparent substrate.
- FIG. 18 is a cross-sectional view showing a colored layer formed on the first transparent substrate.
- FIG. 19 is a cross-sectional view showing a transparent film covering the colored layer and the metal film.
- FIG. 20 is a cross-sectional view showing a transparent electrode, a dark color film, a metal oxide layer, and a metal layer.
- FIG. 21 is an enlarged sectional view showing the structure of the liquid crystal display device according to the fourth embodiment.
- FIG. 22 is a cross-sectional view showing a transparent film and a metal film laminated on the first transparent substrate.
- FIG. 23 is a cross-sectional view showing a dark color film, a metal oxide layer, and a metal layer.
- FIG. 24 is a cross-sectional view showing a metal oxide layer and a metal layer patterned into a predetermined shape.
- FIG. 25 is a cross-sectional view showing a patterned dark color film.
- FIG. 26 is a cross-sectional view showing a colored layer formed between black matrices.
- FIG. 27 is a cross-sectional view showing a transparent film covering the colored layer and the metal film.
- FIG. 28 is a cross-sectional view showing the transparent electrode, the first and second dark color films, the first and second metal oxide layers, and the metal layer.
- FIG. 29 is a table showing the relationship between the refractive index of amorphous silicon and the wavelength of incident light.
- Embodiment 1 of the Invention 1 to 8 show Embodiment 1 of the present invention.
- FIG. 1 is an enlarged sectional view showing the structure of the liquid crystal display device 1 according to the first embodiment.
- FIG. 2 is a cross-sectional view showing the first transparent substrate 21.
- FIG. 3 is a cross-sectional view showing the transparent film 42 and the metal film 41 laminated on the first transparent substrate 21.
- FIG. 4 is a cross-sectional view showing the dark color film 31, the metal oxide layer 33, and the metal layer 32.
- FIG. 5 is a cross-sectional view showing the metal oxide layer 33 and the metal layer 32 patterned into a predetermined shape.
- FIG. 6 is a sectional view showing the patterned dark color film 31.
- FIG. 7 is a cross-sectional view showing the colored layer 15 formed between the black matrices 16.
- FIG. 8 is a cross-sectional view showing the common electrode 17 that covers the black matrix 16 and the colored layer 15.
- the liquid crystal display device 1 includes a TFT substrate 11 that is an active matrix substrate, and a counter substrate 12 that faces the TFT substrate 11.
- a liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12.
- a backlight unit 14 that is a lighting device is disposed on the opposite side of the TFT substrate 11 from the counter substrate 12.
- the liquid crystal display device 1 has a plurality of pixels 20 arranged in a matrix.
- the counter substrate 12 has a first transparent substrate 21 made of, for example, a glass substrate, and a plurality of colored layers 15 and a black matrix 16 formed on the first transparent substrate 21.
- the TFT substrate 11 has a second transparent substrate 22 made of, for example, a glass substrate, opposite to the first transparent substrate 21, and a TFT 24 and a pixel electrode 25 as switching elements formed on the second transparent substrate 22. is doing.
- the TFT 24 and the pixel electrode 25 are provided in each pixel 20 and connected to each other.
- the TFT substrate 11 includes a gate electrode 26 formed on the second transparent substrate 22, a gate insulating film 27 covering the gate electrode 26, and a semiconductor layer 28 formed on the surface of the gate insulating film. And an interlayer insulating film 29 covering the semiconductor layer 28.
- the gate electrode 26 and the semiconductor layer 28 constitute a TFT 24.
- the pixel electrode 25 is formed on the surface of the interlayer insulating film 29 and connected to the semiconductor layer 28 through a contact hole 30 penetratingly formed in the interlayer insulating film 29.
- the pixel electrode 25 is formed of a transparent conductive film such as ITO (Indium Tin Oxide).
- a black matrix 16 formed in a lattice shape when viewed from the normal direction of the surface of the first transparent substrate 21 is formed on the surface of the first transparent substrate 21.
- the region surrounded by the black matrix 16 is filled with a colored layer 15.
- the black matrix 16 is disposed between the colored layers 15 adjacent to each other.
- the colored layer 15 is made of a resin material containing, for example, three primary color dyes or pigments of red (R), green (G), and blue (B). Pixels 20 are formed in regions where the colored layers 15 are arranged.
- the thickness of the colored layer 15 is the same as the thickness of the black matrix 16.
- a common electrode 17 made of a transparent conductive film such as ITO is formed on the surface of the colored layer 15 and the black matrix 16 over substantially the entire first transparent substrate 21.
- the common electrode 17 is an electrode provided in common to the plurality of pixel electrodes 25 of the TFT substrate 11, and regulates the alignment state of the liquid crystal molecules of the liquid crystal layer 13 by controlling the potential difference between each pixel electrode 25. It is supposed to be.
- the black matrix 16 includes a dark color film 31, a metal layer 32, and a metal oxide layer 33 interposed between the metal layer 32 and the dark color film 31.
- the dark color film 31 is a film darkened by reduction of IGZO (In—Ga—Zn—O), which is an oxide semiconductor, and is formed on the surface of the first transparent substrate 21.
- a metal oxide layer 33 made of titanium oxide is formed on the opposite side of the dark color film 31 from the first transparent substrate 21 .
- a metal layer 32 made of titanium is formed on the opposite side of the metal oxide layer 33 from the dark color film 31, a metal layer 32 made of titanium is formed. That is, the metal oxide layer 33 is an oxide of the metal layer 32.
- the light incident on the black matrix 16 is shielded by the black matrix 16 and hardly reflected by the metal oxide layer 33 and the dark color film 31 of the black matrix 16.
- the liquid crystal display device 1 When the liquid crystal display device 1 is manufactured, first, the TFT substrate 11 and the counter substrate 12 are respectively formed, and then the TFT substrate and the counter substrate 12 are bonded together via a liquid crystal layer 13 and a sealant (not shown). Then, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 on the opposite side of the TFT substrate 11 from the counter substrate 12. In the following description, the manufacturing process of the counter substrate 12 will be described in detail.
- a first transparent substrate 21 made of, for example, a glass substrate is prepared.
- a metal film 41 and a transparent film 42 are formed on the first transparent substrate 21 so as to be laminated with each other.
- a transparent film 42 made of an oxide semiconductor layer such as IGZO is formed on the surface of the first transparent substrate 21.
- the transparent film 42 is formed on the entire surface of one surface of the first transparent substrate 21.
- the thickness of the transparent film 42 is about 50 nm, for example.
- the transparent film 42 can be formed of a transparent film such as ITO or IZO (IndiumInZinc Oxide) in addition to IGZO.
- a metal film 41 made of, for example, titanium (Ti) is formed on the surface of the transparent film 42. Similar to the transparent film 42, the metal film 41 is formed on the entire surface of one surface of the first transparent substrate 21. The thickness of the metal film 41 is about 100 nm, for example. Further, the metal film 41 includes a laminated structure (Mo / Ti, Ti / Al / Ti, etc.) of a plurality of films having titanium as a surface layer in addition to titanium (Ti), tungsten (W), tantalum (Ta), or chromium. It can be formed of a metal film such as (Cr).
- a step of forming a black matrix is performed.
- the transparent film 42 is reduced to darken (blacken) the transparent film 42, and the metal film 41 on the dark film 31 side (transparent film 42 side).
- a metal oxide layer 33 that is partially oxidized and a metal layer 32 that is a layer other than the metal oxide layer 33 in the metal film 41 are formed.
- the transparent film 42 is heat-treated at 220 ° C. for 1 hour (annealing process), for example. Thereby, the reduction treatment of the transparent film 42 made of IGZO can be promoted. At this time, it is preferable to introduce an N 2 atmosphere around the transparent film 42.
- the dark color film 31 is etched using the etched metal layer 32 and metal oxide layer 33 as a mask.
- oxalic acid is used as the etchant.
- the dark color film 31 is formed with the same width as the metal layer 32 and the metal oxide layer 33 used as a mask. In this way, the black matrix 16 having the metal layer 32, the metal oxide layer 33, and the dark color film 31 is formed in a lattice pattern when viewed from the normal direction of the surface of the first transparent substrate 21.
- the plurality of colored layers 15 are formed on the first transparent substrate 21. That is, as shown in FIG. 7, by applying a resin material containing a dye or a pigment to the first transparent substrate 21 on which the black matrix 16 is formed, and patterning the resin material by photolithography, a plurality of materials are obtained.
- the colored layer 15 is filled in the frame of the black matrix 16 and formed. It is also possible to form the colored layer 15 in a predetermined region by an ink jet method.
- the colored layer 15 is formed to the same thickness as the black matrix 16. Thus, a color filter having a plurality of colored layers 15 is formed.
- a common electrode 17 that is a transparent electrode is formed so as to cover the black matrix 16 and the colored layer 15. That is, as shown in FIG. 8, the common electrode 17 is formed by forming a transparent conductive film such as ITO on the entire surface of the black matrix 16 and the colored layer 15 to a thickness of about 100 nm.
- the common electrode 17 may be formed of, for example, IZO or a conductive film obtained by plasma-treating IGZO other than ITO.
- positioning a 1st transparent substrate facing a 2nd transparent substrate> the first transparent substrate 21 on which the colored layer 15 and the black matrix 16 are formed is disposed opposite to the second transparent substrate 22 on which the plurality of TFTs 24 are formed.
- the liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12. Further, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 so as to face the TFT substrate 11.
- the transparent film 42 is reduced, so that the transparent film 42 is darkened.
- the film 31 can be formed, and the metal oxide layer 33 in which the portion of the metal film 41 on the dark color film 31 side is oxidized by oxygen ions supplied from the transparent film 42 to be reduced can be formed. Further, the remaining portion of the metal film 41 where the metal oxide layer 33 is not formed can be formed as the metal layer 32. As a result, the black matrix 16 in which the metal oxide layer 33 is disposed between the dark color film 31 and the metal layer 32 can be formed.
- the metal oxide layer 33 is in contact with the dark color film 31 and the metal layer 32, but is not in direct contact with the first transparent substrate 21, so that the adhesion between the metal oxide layer 33 and the first transparent substrate 21 is reduced. The problem can be avoided.
- the antireflection property and light shielding property of the black matrix 16 can be further improved. Therefore, it is possible to reduce the thickness of the black matrix 16 while maintaining the antireflection property and the light shielding property.
- both the dark color film 31 and the metal oxide layer 33 can be formed simultaneously by the reducing action of the transparent film 42, an increase in the manufacturing process can be suppressed.
- FIG. 9 is a graph showing the results of actual measurement of the relationship between the wavelength of incident light and the reflectance with respect to the black matrix.
- FIG. 9 shows a change in reflectance with respect to the wavelength of incident light in a configuration in which a Ti film that is a metal layer is formed on a glass substrate.
- the graph shown by the solid line in FIG. 9 shows the change in reflectance with respect to the wavelength of incident light in a configuration in which an IGZO film as a dark color film 31 and a Ti film as a metal layer 32 are laminated in this order on a glass substrate. Yes.
- FIG. 9 it was found that the reflectance of incident light can be greatly reduced by laminating the IGZO film on the metal layer.
- Embodiment 2 of the Invention >> 10 to 14 show Embodiment 2 of the present invention.
- the same portions as those in FIGS. 1 to 9 are denoted by the same reference numerals, and detailed description thereof is omitted.
- FIG. 10 is an enlarged sectional view showing the structure of the liquid crystal display device 1 according to the second embodiment.
- FIG. 11 is a cross-sectional view showing the colored layer 15 formed on the first transparent substrate 21.
- FIG. 12 is a cross-sectional view showing the transparent film 42 and the metal film 41 laminated on the surface of the colored layer 15.
- FIG. 13 is a cross-sectional view showing the metal layer 32 patterned into a predetermined shape on the transparent film 42.
- FIG. 14 is a cross-sectional view showing the transparent electrode 17, the dark color film 31, the metal oxide layer 33, and the metal layer 32.
- the liquid crystal display device 1 includes a TFT substrate 11 that is an active matrix substrate and a counter substrate 12 that faces the TFT substrate 11.
- a liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12.
- a backlight unit 14 that is a lighting device is disposed on the opposite side of the TFT substrate 11 from the counter substrate 12.
- the liquid crystal display device 1 has a plurality of pixels 20 arranged in a matrix.
- the counter substrate 12 has a first transparent substrate 21 made of, for example, a glass substrate, and a plurality of colored layers 15 and a black matrix 16 formed on the first transparent substrate 21.
- the TFT substrate 11 has the same configuration as that in the first embodiment, and is formed on the second transparent substrate 22 and the second transparent substrate 22 which are opposed to the first transparent substrate 21 and are made of, for example, a glass substrate.
- the TFT 24 and the pixel electrode 25 are used as the switching elements.
- a plurality of colored layers 15 arranged in a matrix corresponding to the plurality of pixels 20 are formed on the counter substrate 12.
- the colored layer 15 is made of a resin material containing, for example, three primary color dyes or pigments of red (R), green (G), and blue (B).
- the colored layers 15 of the respective colors in the present embodiment are arranged adjacent to each other and are formed to have the same thickness.
- a grid-like black matrix 16 viewed from the normal direction of the surface of the first transparent substrate 21 and a transparent electrode 17 made of a transparent conductive film such as IZO are formed on the surface of the plurality of colored layers 15.
- a transparent electrode 17 made of a transparent conductive film such as IZO are formed on the surface of the plurality of colored layers 15.
- the black matrix 16 it is possible to clarify the outline of each pixel 20 and suppress the color mixture of light emitted from each pixel 20, and to suppress the incidence of unnecessary external light to the TFT 24, thereby reducing the off-leak current of the TFT 24. Can be reduced.
- the transparent electrode 17 is formed in a region surrounded by the black matrix 16.
- the black matrix 16 includes a dark color film 31, a metal layer 32, and a metal oxide layer 33 interposed between the metal layer 32 and the dark color film 31.
- the dark color film 31 is formed by reducing the transparent film 42 made of IZO, which is the same material as the transparent electrode 17. That is, the transparent electrode 17 is formed in the same layer as the dark color film 31 with the same thickness.
- the transparent electrode 17 regulates the alignment state of the liquid crystal molecules in the liquid crystal layer 13 by controlling the potential difference between the transparent electrode 17 and the pixel electrode 25 of the TFT substrate 11.
- a metal oxide layer 33 made of titanium oxide is formed on the opposite side of the dark color film 31 from the first transparent substrate 21 .
- a metal layer 32 made of titanium is formed on the opposite side of the metal oxide layer 33 from the dark color film 31 .
- the light incident on the black matrix 16 is shielded by the black matrix 16 and hardly reflected by the metal oxide layer 33 and the dark color film 31 of the black matrix 16.
- the liquid crystal display device 1 When the liquid crystal display device 1 is manufactured, first, the TFT substrate 11 and the counter substrate 12 are respectively formed, and then the TFT substrate and the counter substrate 12 are bonded together via a liquid crystal layer 13 and a sealant (not shown). Then, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 on the opposite side of the TFT substrate 11 from the counter substrate 12. In the following description, the manufacturing process of the counter substrate 12 will be described in detail.
- the plurality of colored layers 15 are formed on the first transparent substrate 21. That is, as shown in FIG. 11, a resin material containing a dye or a pigment is applied to the first transparent substrate 21 made of, for example, a glass substrate, and the resin material is patterned by photolithography, so that a plurality of colors are obtained. Layers 15 are formed in contact with each other and arranged in a matrix. It is also possible to form the plurality of colored layers 15 by an ink jet method. The colored layers 15 are formed to have the same thickness.
- a metal film 41 and a transparent film 42 are formed on the surface of the colored layer 15 so as to be laminated with each other.
- a transparent film 42 made of a transparent conductive film such as IZO is formed on the surface of the colored layer 15.
- the transparent film 42 is formed on the entire surface of one surface of the first transparent substrate 21.
- the thickness of the transparent film 42 is about 100 nm, for example.
- the transparent film 42 can be formed of a transparent film such as ITO or IGZO in addition to IZO.
- a metal film 41 made of, for example, titanium (Ti) is formed on the surface of the transparent film 42. Similar to the transparent film 42, the metal film 41 is formed on the entire surface of one surface of the first transparent substrate 21. The thickness of the metal film 41 is about 100 nm, for example. Further, the metal film 41 includes a laminated structure (Mo / Ti, Ti / Al / Ti, etc.) of a plurality of films having titanium as a surface layer in addition to titanium (Ti), tungsten (W), tantalum (Ta), or chromium. It can be formed of a metal film such as (Cr).
- the transparent film 42 made of a transparent conductive film is formed on the entire surface of the first transparent substrate 21 and the metal film 41 is formed so as to overlap a part of the transparent film 42.
- a step of forming a black matrix is performed. That is, as shown in FIG. 14, by reducing the transparent film 42, the dark film 31 in which the transparent film 42 is darkened (blackened) is formed in a region of the transparent film 42 that is in contact with the metal film 41. On the other hand, a region of the transparent film 42 that is not in contact with the metal film 41 is referred to as a transparent electrode 17. Furthermore, a metal oxide layer 33 in which the dark film 31 side (transparent film 42 side) portion of the metal film 41 is oxidized and a metal layer 32 that is a layer other than the metal oxide layer 33 in the metal film 41 are formed. To do.
- the transparent film 42 is heat-treated at 250 ° C. for 1 hour (annealing process), for example. Thereby, the reduction treatment of the transparent film 42 made of IZO can be promoted. At this time, it is preferable to introduce an N 2 atmosphere around the transparent film 42.
- the black matrix 16 having the metal layer 32, the metal oxide layer 33, and the dark color film 31 is formed in a lattice-like pattern when viewed from the normal direction of the surface of the first transparent substrate 21. Further, the transparent electrode 17 is formed simultaneously with the black matrix 16.
- positioning a 1st transparent substrate facing a 2nd transparent substrate> the first transparent substrate 21 on which the colored layer 15 and the black matrix 16 are formed is disposed opposite to the second transparent substrate 22 on which the plurality of TFTs 24 are formed.
- the liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12. Further, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 so as to face the TFT substrate 11.
- the metal film 41 and the transparent film 42 are stacked on each other and formed on the first transparent substrate 21, and then the transparent film 42 is reduced.
- the film 42 can form a dark color film 31 that is darkened, and a portion of the metal film 41 on the dark film 31 side forms a metal oxide layer 33 that is oxidized by oxygen ions supplied from the transparent film 42 to be reduced. Can do. Further, the remaining portion of the metal film 41 where the metal oxide layer 33 is not formed can be formed as the metal layer 32. As a result, the black matrix 16 in which the metal oxide layer 33 is disposed between the dark color film 31 and the metal layer 32 can be formed.
- the metal oxide layer 33 is not in direct contact with the first transparent substrate 21, the problem of reduced adhesion between the metal oxide layer 33 and the first transparent substrate 21 can be avoided. Moreover, since not only the metal oxide layer 33 and the metal layer 32 but also the dark color film 31 is provided, the antireflection property and the light shielding property of the black matrix 16 can be further improved.
- both the dark color film 31 and the metal oxide layer 33 can be formed simultaneously by the reducing action of the transparent film 42, an increase in the manufacturing process can be suppressed.
- the dark color film 31 can be simultaneously formed in the same layer as the transparent electrode 17, and the number of manufacturing steps is greatly reduced. be able to.
- Embodiment 3 of the Invention >> 15 to 20 show Embodiment 3 of the present invention.
- FIG. 15 is an enlarged sectional view showing the structure of the liquid crystal display device 1 according to the third embodiment.
- FIG. 16 is a cross-sectional view showing the metal film 41 formed on the first transparent substrate 21.
- FIG. 17 is a cross-sectional view showing the metal film 41 patterned in a predetermined shape on the first transparent substrate 21.
- FIG. 18 is a cross-sectional view showing the colored layer 15 formed on the first transparent substrate 21.
- FIG. 19 is a cross-sectional view showing a transparent film 42 that covers the colored layer 15 and the metal film 41.
- FIG. 20 is a cross-sectional view showing the transparent electrode 17, the dark color film 31, the metal oxide layer 33, and the metal layer 32.
- the liquid crystal display device 1 includes a TFT substrate 11 that is an active matrix substrate, and a counter substrate 12 that faces the TFT substrate 11.
- a liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12.
- a backlight unit 14 that is a lighting device is disposed on the opposite side of the TFT substrate 11 from the counter substrate 12.
- the liquid crystal display device 1 has a plurality of pixels 20 arranged in a matrix.
- the counter substrate 12 has a first transparent substrate 21 made of, for example, a glass substrate, and a plurality of colored layers 15 and a black matrix 16 formed on the first transparent substrate 21.
- the TFT substrate 11 has the same configuration as that in the first embodiment, and is formed on the second transparent substrate 22 and the second transparent substrate 22 which are opposed to the first transparent substrate 21 and are made of, for example, a glass substrate.
- the TFT 24 and the pixel electrode 25 are used as the switching elements.
- a black matrix 16 formed in a lattice shape when viewed from the normal direction of the surface of the first transparent substrate 21 is formed on the surface of the first transparent substrate 21.
- a region surrounded by the black matrix 16 is filled with a colored layer 15.
- the black matrix 16 is disposed between the colored layers 15 adjacent to each other.
- the colored layer 15 is made of a resin material containing, for example, three primary color dyes or pigments of red (R), green (G), and blue (B).
- Pixels 20 are formed in regions where the colored layers 15 are arranged.
- a transparent electrode 17 made of a transparent conductive film such as IZO is formed on the surface of each colored layer 15. The transparent electrode 17 is formed in a region surrounded by the black matrix 16.
- the black matrix 16 includes a dark color film 31, a metal layer 32, and a metal oxide layer 33 interposed between the metal layer 32 and the dark color film 31.
- the dark color film 31 is formed by reducing the transparent film 42 made of IZO, which is the same material as the transparent electrode 17. That is, the transparent electrode 17 is formed in the same layer as the dark color film 31 with the same thickness.
- the transparent electrode 17 regulates the alignment state of the liquid crystal molecules in the liquid crystal layer 13 by controlling the potential difference between the transparent electrode 17 and the pixel electrode 25 of the TFT substrate 11.
- a metal oxide layer 33 made of titanium oxide is formed on the dark film 31 on the first transparent substrate 21 side.
- a metal layer 32 made of titanium is formed on the first transparent substrate 21 side of the metal oxide layer 33.
- the light incident on the black matrix 16 is shielded by the black matrix 16 and hardly reflected by the metal oxide layer 33 and the dark color film 31 of the black matrix 16.
- the liquid crystal display device 1 When the liquid crystal display device 1 is manufactured, first, the TFT substrate 11 and the counter substrate 12 are respectively formed, and then the TFT substrate and the counter substrate 12 are bonded together via a liquid crystal layer 13 and a sealant (not shown). Then, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 on the opposite side of the TFT substrate 11 from the counter substrate 12. In the following description, the manufacturing process of the counter substrate 12 will be described in detail.
- the colored layer is formed in the step of forming the metal film and the transparent film.
- a metal film 41 made of, for example, titanium (Ti) is formed on the entire surface of one surface of the first transparent substrate 21 on the surface of the first transparent substrate 21 made of, for example, a glass substrate.
- the thickness of the metal film 41 is about 100 nm, for example.
- the metal film 41 includes a laminated structure (Mo / Ti, Ti / Al / Ti, etc.) of a plurality of films having titanium as a surface layer in addition to titanium (Ti), tungsten (W), tantalum (Ta), or chromium. It can be formed of a metal film such as (Cr).
- the metal film 41 is formed so as to overlap a part of the first transparent substrate 21.
- the colored layer 15 is formed, and a resin material containing a dye or a pigment is applied to the metal film 41 formed in the lattice pattern, and the resin material Is patterned by photolithography to fill the frame of the metal film 41 with the plurality of colored layers 15. It is also possible to form the colored layer 15 in a predetermined region by an ink jet method.
- the colored layer 15 is formed with the same thickness as the metal film 41. Thus, the colored layer 15 is formed so as to be adjacent to the metal film 41.
- a transparent film 42 made of a transparent conductive film such as IZO is formed so as to cover the colored layer 15 and the metal film 41.
- the transparent film 42 is formed on the entire surface of one surface of the first transparent substrate 21.
- the thickness of the transparent film 42 is about 100 nm, for example.
- the transparent film 42 can be formed of a transparent film such as ITO or IGZO in addition to IZO.
- a step of forming a black matrix is performed. That is, as shown in FIG. 20, by reducing the transparent film 42, the dark film 31 in which the transparent film 42 is darkened (blackened) is formed in a region of the transparent film 42 that is in contact with the metal film 41. On the other hand, a region of the transparent film 42 that is not in contact with the metal film 41 is referred to as a transparent electrode 17. Furthermore, a metal oxide layer 33 in which the dark film 31 side (transparent film 42 side) portion of the metal film 41 is oxidized and a metal layer 32 that is a layer other than the metal oxide layer 33 in the metal film 41 are formed. To do.
- the transparent film 42 is heat-treated at 250 ° C. for 1 hour (annealing process), for example. Thereby, the reduction treatment of the transparent film 42 made of IZO can be promoted. At this time, it is preferable to introduce an N 2 atmosphere around the transparent film 42.
- the black matrix 16 having the metal layer 32, the metal oxide layer 33, and the dark color film 31 is formed in a lattice-like pattern when viewed from the normal direction of the surface of the first transparent substrate 21. Further, the transparent electrode 17 is formed simultaneously with the black matrix 16.
- positioning a 1st transparent substrate facing a 2nd transparent substrate> the first transparent substrate 21 on which the colored layer 15 and the black matrix 16 are formed is disposed opposite to the second transparent substrate 22 on which the plurality of TFTs 24 are formed.
- the liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12. Further, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 so as to face the TFT substrate 11.
- the transparent film 42 is reduced.
- the film 42 can form a dark color film 31 that is darkened, and a portion of the metal film 41 on the dark film 31 side forms a metal oxide layer 33 that is oxidized by oxygen ions supplied from the transparent film 42 to be reduced. Can do. Further, the remaining portion of the metal film 41 where the metal oxide layer 33 is not formed can be formed as the metal layer 32. As a result, the black matrix 16 in which the metal oxide layer 33 is disposed between the dark color film 31 and the metal layer 32 can be formed.
- the metal oxide layer 33 is not in direct contact with the first transparent substrate 21, the problem of reduced adhesion between the metal oxide layer 33 and the first transparent substrate 21 can be avoided. Moreover, since not only the metal oxide layer 33 and the metal layer 32 but also the dark color film 31 is provided, the antireflection property and the light shielding property of the black matrix 16 can be further improved.
- both the dark color film 31 and the metal oxide layer 33 can be formed simultaneously by the reducing action of the transparent film 42, an increase in the manufacturing process can be suppressed.
- the dark color film 31 can be simultaneously formed in the same layer as the transparent electrode 17, and the number of manufacturing steps is greatly reduced. be able to.
- Embodiment 4 of the Invention >> 21 to 28 show Embodiment 4 of the present invention.
- FIG. 21 is an enlarged sectional view showing the structure of the liquid crystal display device 1 according to the fourth embodiment.
- FIG. 22 is a cross-sectional view showing the transparent film 42 and the metal film 41 laminated on the first transparent substrate 21.
- FIG. 23 is a cross-sectional view showing the dark color film 31, the metal oxide layer 33, and the metal layer 32.
- FIG. 24 is a cross-sectional view showing the metal oxide layer 33 and the metal layer 32 patterned into a predetermined shape.
- FIG. 25 is a cross-sectional view showing the patterned dark color film 31.
- FIG. 26 is a cross-sectional view showing the colored layer 15 formed between the black matrices 16.
- FIG. 27 is a cross-sectional view showing a transparent film 42 that covers the colored layer 15 and the metal layer 32.
- FIG. 28 is a cross-sectional view showing the transparent electrode 17, the first and second dark color films 31 a and 31 b, the first and second metal oxide layers 33 a and 33 b, and the metal layer 32.
- the liquid crystal display device 1 includes a TFT substrate 11 that is an active matrix substrate and a counter substrate 12 that faces the TFT substrate 11.
- a liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12.
- a backlight unit 14 that is a lighting device is disposed on the opposite side of the TFT substrate 11 from the counter substrate 12.
- the liquid crystal display device 1 has a plurality of pixels 20 arranged in a matrix.
- the counter substrate 12 has a first transparent substrate 21 made of, for example, a glass substrate, and a plurality of colored layers 15 and a black matrix 16 formed on the first transparent substrate 21.
- the TFT substrate 11 has the same configuration as that in the first embodiment, and is formed on the second transparent substrate 22 and the second transparent substrate 22 which are opposed to the first transparent substrate 21 and are made of, for example, a glass substrate.
- the TFT 24 and the pixel electrode 25 are used as the switching elements.
- a black matrix 16 formed in a lattice shape when viewed from the normal direction of the surface of the first transparent substrate 21 is formed on the surface of the first transparent substrate 21.
- a region surrounded by the black matrix 16 is filled with a colored layer 15.
- the black matrix 16 is disposed between the colored layers 15 adjacent to each other.
- the colored layer 15 is made of a resin material containing, for example, three primary color dyes or pigments of red (R), green (G), and blue (B).
- Pixels 20 are formed in regions where the colored layers 15 are arranged.
- a transparent electrode 17 made of a transparent conductive film such as IZO is formed on the surface of each colored layer 15. The transparent electrode 17 is formed in a region surrounded by the black matrix 16.
- the black matrix 16 includes a first dark color film 31a formed on the surface of the first transparent substrate 21, a first metal oxide layer 33a stacked on the first dark color film 31a, and a first oxidation film.
- the metal layer 32 is interposed between the first and second metal oxide layers 33a and 33b between the first and second dark color films 31a and 31b.
- the first dark color film 31a is formed by reducing a transparent film such as IGZO, for example.
- the second dark color film 31 b is formed by reducing a transparent film made of IZO, which is the same material as the transparent electrode 17.
- the transparent electrode 17 is formed in the same layer as the second dark color film 31b with the same thickness.
- the transparent electrode 17 regulates the alignment state of the liquid crystal molecules in the liquid crystal layer 13 by controlling the potential difference between the transparent electrode 17 and the pixel electrode 25 of the TFT substrate 11.
- the first and second metal oxide layers 33a and 33b are made of, for example, titanium oxide.
- the metal layer 32 is made of, for example, titanium. That is, the first and second metal oxide layers 33 a and 33 b are oxides of the metal layer 32.
- the light incident on the black matrix 16 is shielded by the black matrix 16 and hardly reflected by the metal oxide layer 33 and the dark color film 31 of the black matrix 16.
- the liquid crystal display device 1 When the liquid crystal display device 1 is manufactured, first, the TFT substrate 11 and the counter substrate 12 are respectively formed, and then the TFT substrate and the counter substrate 12 are bonded together via a liquid crystal layer 13 and a sealant (not shown). Then, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 on the opposite side of the TFT substrate 11 from the counter substrate 12. In the following description, the manufacturing process of the counter substrate 12 will be described in detail.
- a first transparent film 42a made of an oxide semiconductor layer such as IGZO is formed on the surface of the first transparent substrate 21 as shown in FIG.
- the first transparent film 42 a is formed on the entire surface of one surface of the first transparent substrate 21.
- the thickness of the first transparent film 42a is about 50 nm, for example.
- the first transparent film 42a can be formed of a transparent film such as ITO or IZO (Indium Zinc Oxide) in addition to IGZO.
- a metal film 41 made of, for example, titanium (Ti) is formed on the surface of the first transparent film 42a.
- the metal film 41 is formed on the entire surface of one surface of the first transparent substrate 21 in the same manner as the first transparent film 42a.
- the thickness of the metal film 41 is about 150 nm, for example.
- the metal film 41 includes a laminated structure (Mo / Ti, Ti / Al / Ti, etc.) of a plurality of films having titanium as a surface layer in addition to titanium (Ti), tungsten (W), tantalum (Ta), or chromium. It can be formed of a metal film such as (Cr).
- a step of forming a black matrix is performed.
- the first transparent film 42a is darkened (blackened) by reducing the first transparent film 42a.
- 31a a first metal oxide layer 33a in which a portion of the metal film 41 on the first dark color film 31a side (first transparent film 42a side) is oxidized, and a layer other than the first metal oxide layer 33a in the metal film 41
- the metal layer 32 is formed.
- the first transparent film 42a When the first transparent film 42a is reduced, the first transparent film 42a is heat-treated at 220 ° C. for 1 hour (annealing process), for example. Thereby, the reduction process of the first transparent film 42a made of IGZO can be promoted. At this time, it is preferable to introduce an N 2 atmosphere around the first transparent film 42a.
- the first dark color film 31a is etched using the etched metal layer 32 and first metal oxide layer 33a as a mask.
- oxalic acid is used as the etchant.
- the first dark color film 31a is formed to have the same width as the metal layer 32 and the first metal oxide layer 33a used as a mask.
- the first dark color film 31a, the first metal oxide layer 33a, and the metal layer 32 are formed in a lattice pattern as viewed from the normal direction of the surface of the first transparent substrate 21.
- Step of forming a colored layer in the step of forming the black matrix 16, the step of forming the colored layer 15 is performed. That is, as a second step, as shown in FIG. 26, a resin containing a dye or pigment or the like for the first transparent substrate 21 on which the first dark color film 31a, the first metal oxide layer 33a, and the metal layer 32 are formed.
- the plurality of colored layers 15 are filled in a lattice-shaped frame composed of the first dark color film 31a, the first metal oxide layer 33a, and the metal layer 32.
- the colored layer 15 is formed to have the same thickness as the stacked body 45 of the first dark color film 31a, the first metal oxide layer 33a, and the metal layer 32. It is also possible to form the colored layer 15 in a predetermined region by an ink jet method.
- a second transparent film 42b covering the metal layer 32 and the plurality of colored layers 15 is formed.
- the second transparent film 42b is formed of a transparent conductive film such as IZO.
- the second transparent film 42 b is formed on the entire surface of one surface of the first transparent substrate 21.
- the thickness of the second transparent film 42b is about 100 nm, for example.
- the second transparent film 42b can be formed of a transparent film such as ITO or IGZO in addition to IZO.
- the second transparent film 42b is brought into contact with the metal layer 32.
- the second transparent film 42b forms a darkened (blackened) second dark color film 31b, while a region of the first transparent film 42a that is not in contact with the metal film 41 is referred to as a transparent electrode 17.
- a second metal oxide layer 33b is formed in which the portion of the metal layer 32 on the second dark color film 31b side (second transparent film 42b side) is oxidized. At this time, the metal layer 32 remains with a predetermined thickness between the first metal oxide layer 33a and the second metal oxide layer 33b.
- the second transparent film 42b is heat-treated at 250 ° C. for 1 hour (annealing process), for example. Thereby, the reduction process of the second transparent film 42b made of IZO can be promoted. At this time, it is preferable to introduce an N 2 atmosphere around the second transparent film 42b.
- the black matrix 16 having the metal layer 32, the first and second metal oxide layers 33 a and 33 b, and the first and second dark color films 31 a and 31 b is a lattice as viewed from the normal direction of the surface of the first transparent substrate 21. It is formed into a pattern. Further, the transparent electrode 17 is formed simultaneously with the black matrix 16.
- positioning a 1st transparent substrate facing a 2nd transparent substrate> the first transparent substrate 21 on which the colored layer 15 and the black matrix 16 are formed is disposed opposite to the second transparent substrate 22 on which the plurality of TFTs 24 are formed.
- the liquid crystal layer 13 is sealed between the TFT substrate 11 and the counter substrate 12. Further, the liquid crystal display device 1 is manufactured by disposing the backlight unit 14 so as to face the TFT substrate 11.
- the fourth embodiment since the metal film 41 and the first transparent film 42a are stacked on each other and formed on the first transparent substrate 21, the first transparent film 42a is reduced. 31a can be formed, and the first metal oxide layer 33a in which a portion of the metal film 41 on the first dark color film 31a side is oxidized by oxygen ions supplied from the reduced first transparent film 42a can be formed. Further, since the second transparent film 42b is reduced after the second transparent film 42b is laminated on the metal layer 32, the second dark color film 31b can be formed, and the second dark color film 31b side of the metal layer 32 can be formed.
- This portion can form the second metal oxide layer 33b oxidized by oxygen ions supplied from the second transparent film 42b to be reduced. Further, the remaining portion of the metal film 41 where the first and second metal oxide layers 33 a and 33 b are not formed can be formed as the metal layer 32. As a result, the first metal oxide layer 33a is disposed between the first dark color film 31a and the metal layer 32, and the second metal oxide layer 33b is disposed between the second dark color film 31b and the metal layer 32. A black matrix 16 can be formed.
- first and second metal oxide layers 33a and 33b do not directly contact the first transparent substrate 21, respectively, the adhesion between the first and second metal oxide layers 33a and 33b and the first transparent substrate 21 is reduced. The problem can be avoided.
- first and second dark color films 31a and 31b are provided in addition to the first and second metal oxide layers 33a and 33b and the metal layer 32, the antireflection property and the light shielding property of the black matrix 16 are further improved. Can be increased.
- light incident on the black matrix 16 from the first transparent substrate 21 side and from the liquid crystal layer 13 side can be shielded by the entire black matrix 16 including the first and second dark color films 31a and 31b. Further, the light incident on the black matrix 16 from the first transparent substrate 21 side can be suitably suppressed from reflection by the first dark color film 31a and the first metal oxide layer 33a. On the other hand, the reflection of light incident on the black matrix 16 from the liquid crystal layer 13 side can be suitably suppressed by the second dark color film 31b and the second metal oxide layer 33b.
- both the first dark color film 31a and the first metal oxide layer 33a can be formed simultaneously by the reducing action of the first transparent film 42a, an increase in manufacturing steps can be suppressed.
- the second dark color film 31b and the second metal oxide layer 33b can be simultaneously formed by the reducing action of the second transparent film 42b.
- part of the second transparent film 42b made of IZO, which is the same material as the transparent electrode 17, is reduced, the second dark color film 31b can be simultaneously formed on the same layer as the transparent electrode 17, and the number of manufacturing steps can be reduced. It can be greatly reduced.
- the liquid crystal display device has been described as an example of the display device.
- the present invention is not limited to this, and can be similarly applied to other display devices such as an organic EL display device.
- the dark color film 31 and the metal oxide layer 33 may be formed on at least one of the metal layer 32 on the first transparent substrate 21 side and the second transparent substrate 22 side.
- the present invention is not limited to the above-described first to fourth embodiments, and the present invention includes a configuration in which these first to fourth embodiments are appropriately combined.
- the present invention is useful for a display device such as a liquid crystal display device and a method for manufacturing the same.
- Liquid crystal display device 15 Colored layer 16 Black matrix 17 Common electrode, transparent electrode 21 First transparent substrate 22 Second transparent substrate 24 TFT (switching element) 31 Dark film 31a First dark film 31b Second dark film 32 metal layers 33 Metal oxide layer 33a First metal oxide layer 33b Second metal oxide layer 41 Metal film 42 Transparent film 42a First transparent film 42b Second transparent film 45 Laminate
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Abstract
L'invention porte sur un procédé de production pour un dispositif d'affichage, lequel procédé comprend : une étape de mise en couches d'un film métallique et d'un film transparent l'un sur l'autre sur un premier substrat transparent ; une étape de formation d'un film sombre, d'une couche d'oxyde métallique et d'une couche métallique par réduction du film transparent, et de formation d'une matrice noire ayant au moins une partie de chacun du film sombre, de la couche d'oxyde métallique et de la couche métallique ; une étape de formation d'une pluralité de couches colorées sur le premier substrat transparent ; et une étape de disposition du premier substrat transparent, sur lequel ont été formées les couches colorées et la matrice noire, de telle sorte qu'il fait face à un second substrat transparent sur lequel une pluralité d'éléments de commutation ont été formés.
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Cited By (2)
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CN107466376A (zh) * | 2016-12-01 | 2017-12-12 | 昆山龙腾光电有限公司 | 视角可切换的液晶显示装置及视角切换方法 |
US20230017110A1 (en) * | 2021-07-14 | 2023-01-19 | Japan Display Inc. | Substrate with light-shielding film, manufacturing method of the substrate, and display device having the substrate |
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JPH043121A (ja) * | 1990-04-13 | 1992-01-08 | Internatl Business Mach Corp <Ibm> | 液晶表示装置およびその製造方法 |
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CN107466376A (zh) * | 2016-12-01 | 2017-12-12 | 昆山龙腾光电有限公司 | 视角可切换的液晶显示装置及视角切换方法 |
TWI627476B (zh) * | 2016-12-01 | 2018-06-21 | 視角可切換的液晶顯示裝置及視角切換方法 | |
US11269204B2 (en) | 2016-12-01 | 2022-03-08 | Infovision Optoelectronics (Kunshan) Co., Ltd. | Viewing angle switchable liquid crystal display device and viewing angle switching method |
US20230017110A1 (en) * | 2021-07-14 | 2023-01-19 | Japan Display Inc. | Substrate with light-shielding film, manufacturing method of the substrate, and display device having the substrate |
US12007641B2 (en) * | 2021-07-14 | 2024-06-11 | Japan Display Inc. | Substrate with light-shielding film, manufacturing method of the substrate, and display device having the substrate |
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