WO2013031048A1 - 液剤塗布装置及び液剤塗布方法 - Google Patents
液剤塗布装置及び液剤塗布方法 Download PDFInfo
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- WO2013031048A1 WO2013031048A1 PCT/JP2012/001711 JP2012001711W WO2013031048A1 WO 2013031048 A1 WO2013031048 A1 WO 2013031048A1 JP 2012001711 W JP2012001711 W JP 2012001711W WO 2013031048 A1 WO2013031048 A1 WO 2013031048A1
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- substrate
- magazine
- liquid agent
- supply
- liquid
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Definitions
- the present invention relates to a liquid agent applying apparatus and a liquid agent applying method for applying a liquid agent such as a resin to a substrate.
- a liquid application device known as an apparatus for applying a liquid agent such as a resin to a substrate or a component on the substrate takes out the substrate before the liquid agent is applied from a magazine for supplying a substrate, transfers it to a work position, and works. After applying the liquid agent to the substrate at the position, the substrate is transferred from the working position and stored in the magazine for collecting the substrate.
- the substrate supply unit in which the magazine for substrate supply is installed and the substrate recovery unit in which the magazine for substrate recovery is installed are provided at positions facing each other across the operation position where the liquid agent is applied to the substrate, The substrate taken out from the substrate supply magazine is applied in the working position and then transferred in the same direction as when transferred from the substrate supply magazine to the operation position, and is stored in the substrate recovery unit magazine.
- Patent Document 1 for example, Patent Document 1
- an object of the present invention is to provide a liquid agent coating apparatus and a liquid agent coating method capable of reducing the size and improving the area productivity.
- the liquid agent coating apparatus of the present invention is taken out from a substrate supply unit in which a magazine for supplying a substrate containing a substrate before the liquid agent is applied is installed, and the magazine for supplying a substrate installed in the substrate supply unit.
- An application head for applying the liquid agent to the substrate transferred to the work position, and a substrate recovery unit provided with a substrate recovery magazine for storing the substrate on which the liquid agent has been applied by the application head.
- the substrate supply unit and the substrate recovery unit are positioned side by side in the vertical direction.
- the substrate supply magazine of the substrate supply unit and the substrate recovery magazine of the substrate recovery unit are positioned side by side in a state where one is placed on the other.
- the substrate supply magazine and the substrate recovery magazine are simultaneously lifted and lowered by the magazine lifting means to take out the substrate, the substrate supply magazine is positioned in the vertical direction and the substrate is recovered.
- the substrate collecting magazine is positioned in the vertical direction.
- the substrate supply magazine emptied in the substrate supply unit is moved to the substrate recovery unit and used as the substrate recovery magazine.
- the liquid agent coating apparatus of the present invention has the two work positions, and transfers the substrate taken out from the substrate supply magazine to the work position and the substrate coated with the liquid agent at the work position.
- the substrate transfer means for transferring to the substrate recovery magazine is the substrate taken out from the substrate supply magazine while the liquid agent is being applied to the substrate transferred to one working position. Is transferred to the other work position, or the substrate on which the liquid agent has been applied at the other work position is transferred to the magazine for substrate recovery.
- the liquid agent application method of the present invention includes a step of taking out a substrate before applying a liquid agent from a substrate supply magazine installed in a substrate supply unit and transferring the substrate to a working position, and the substrate transferred to the working position to the substrate.
- the substrate supply magazine of the substrate supply unit and the substrate recovery magazine of the substrate recovery unit are positioned side by side in a state where one is placed on the other.
- the substrate supply magazine and the substrate collection magazine are simultaneously moved up and down to position the substrate supply magazine when the substrate is taken out, and to collect the substrate when collecting the substrate. Position the magazine in the vertical direction.
- the substrate supply magazine emptied in the substrate supply unit is moved to the substrate recovery unit and used as the substrate recovery magazine.
- the substrate taken out from the substrate supply magazine is provided while the liquid agent is applied to the substrate transferred to one of the two operation positions.
- the substrate is transferred to the other work position, or the substrate on which the liquid agent has been applied at the other work position is transferred to the magazine for substrate recovery.
- a substrate supply unit in which a magazine for substrate supply that accommodates a substrate before the liquid agent is applied is installed, and a substrate recovery unit in which a magazine for substrate recovery that accommodates the substrate to which the liquid agent is applied is installed.
- a substrate supply unit in which a magazine for substrate supply that accommodates a substrate before the liquid agent is applied is installed
- a substrate recovery unit in which a magazine for substrate recovery that accommodates the substrate to which the liquid agent is applied is installed.
- the perspective view of the liquid agent coating device in one embodiment of this invention The perspective view of the main-body part of the liquid agent coating device in one embodiment of this invention.
- substrate supply collection part of the liquid agent coating device in one embodiment of this invention The front view of the board
- substrate (A), (b) The front view of a part of the magazine moving mechanism with which the board
- the substrate supply / recovery unit 3 supplies the supplied substrate 4 (or a component (not shown) provided on the substrate 4) with a liquid agent such as resin, and the substrate supply / recovery unit 3 is the main body of the substrate 4 before the liquid agent is applied. 2 and the recovery of the substrate 4 after the liquid agent is applied in the main body 2.
- the substrate supply / recovery unit 3 supplies the substrate 4 to the main body unit 2 and collects the substrate 4 from the main body unit 2 through a magazine 5 that houses a plurality of substrates 4 arranged in the vertical direction.
- the direction in which the main body 2 and the substrate supply / recovery unit 3 are arranged is the X-axis direction
- the direction in the horizontal plane orthogonal to the X-axis direction is the Y-axis direction
- the vertical direction is the Z-axis direction.
- the left side (side on which the substrate supply and recovery unit 3 is provided) viewed from the operator OP is defined as the left side
- the right side viewed from the operator OP is defined as the right side.
- the front side as viewed from the operator OP is defined as the front
- the back side as viewed from the operator OP is defined as the rear.
- the main body 2 includes a base 11 having a flat work plane 11a and a cover 12 provided to cover the space above the work plane 11a of the base 11.
- a pair of Y-axis tables 13a extending in the Y-axis direction and facing the X-axis direction (left-right direction) on the work plane 11a of the base 11 and extending in the X-axis direction and supported at both ends by the pair of Y-axis tables 13a
- a coating head moving mechanism 13 is provided that includes the X-axis table 13b and the moving stage 13c that is movably provided in the X-axis direction along the X-axis table 13b.
- a coating head 14 is attached.
- the coating head moving mechanism 13 moves the coating head 14 in the horizontal plane by combining the movement of the X axis table 13b in the Y axis direction with respect to the pair of Y axis tables 13a and the movement of the moving stage 13c in the X axis direction with respect to the X axis table 13b. Move to.
- the coating head 14 contains a liquid agent Q such as a resin therein, and discharges the stored liquid agent Q downward from the tip of the coating nozzle 14a extending downward.
- a receiving conveyor 15 for receiving the substrate 4 sent from the substrate supply / recovery unit 3 is provided in the left area of the work plane 11a, and two positioning conveyors are provided at the center of the work plane 11a of the base unit 11. 16 (a rear positioning conveyor 16a positioned rearward and a front positioning conveyor 16b positioned forward) are provided side by side in the Y-axis direction (front-rear direction).
- the receiving conveyor 15 and the two positioning conveyors 16 are each attached in a posture to convey the substrate 4 in the X-axis direction.
- the receiving conveyor 15 is moved in the Y-axis direction by a receiving conveyor moving mechanism 17 provided on the work plane 11a of the base 11 and is selectively faced with one of the two positioning conveyors 16 in the X-axis direction. .
- a substrate passage opening 12h for allowing the substrate 4 to pass through to and from the substrate supply / recovery unit 3 is provided on the left side surface of the cover unit 12, and the receiving conveyor 15 is installed in the substrate supply / recovery unit 3.
- the substrate 4 supplied through the substrate passage opening 12h is received from the substrate supply magazine 5 (the magazine 5 in which the substrate 4 before the liquid Q is applied) is received, and the rear positioning conveyor 16a or the front positioning conveyor 16b is received.
- the rear positioning conveyor 16a positions the substrate 4 received from the receiving conveyor 15 at a work position (referred to as a rear working position) set on the rear positioning conveyor 16a, and the front positioning conveyor 16b is moved from the receiving conveyor 15.
- the received substrate 4 is positioned at a work position (referred to as a front work position) set on the front positioning conveyor 16b. Further, the rear positioning conveyor 16a receives the substrate 4 on which the application of the liquid Q by the application head 14 has been completed and transfers it to the conveyor 15. The front positioning conveyor 16b receives the substrate 4 on which the application of the liquid Q by the application head 14 has been completed. Transfer to the receiving conveyor 15. The receiving conveyor 15 receives the substrate 4 received from the rear positioning conveyor 16a or the front positioning conveyor 16b in the substrate collecting magazine 5 installed in the substrate supply / recovery unit 3 (the substrate 4 after the liquid Q is applied is accommodated). To the magazine 5).
- the liquid application device 1 in the present embodiment has two work positions, and the receiving conveyor 15 and the two positioning conveyors 16 (the rear positioning conveyor 16a and the front positioning conveyor 16b) are the magazine 5 for supplying substrates.
- the substrate 4 taken out from the substrate 4 is transferred to the working position and the substrate 4 coated with the liquid Q at the working position is transferred to the substrate collecting magazine 5.
- the coating head 14 is taken out from the substrate supplying magazine 5.
- the liquid Q is applied to the substrate 4 transferred (positioned) to the rear working position by the rear positioning conveyor 16a or the front working position by the front positioning conveyor 16b.
- the substrate supply / recovery unit 3 includes a magazine moving mechanism 21 that moves the magazine 5 and a cover member 22 that is attached to the left side surface of the main body 2 and opens rightward to cover the entire magazine moving mechanism 21. It has.
- each magazine 5 moved by the magazine moving mechanism 21 has an outer portion 5 a having a shape penetrating in the left-right direction (X-axis direction) while being installed in the substrate supply / recovery unit 3,
- a plurality of shelves 5b are provided in the outer shell 5a so as to be arranged in the vertical direction.
- the substrate 4 is placed and stored in each shelf portion 5b, and the substrate 4 is moved from the rear opening 5c on the left side to the front opening 5d on the right side in a state where the magazine 5 is installed in the substrate supply / recovery unit 3.
- the substrate 4 can be supplied to the main body 2 side from the front opening 5d by being pressed by a substrate pushing / pulling mechanism 35 of the magazine moving mechanism 21 described later, and the substrate 4 positioned on the front opening 5d side is pushed and pulled.
- substrate 4 can be accommodated on the shelf part 5b by drawing from the back surface opening 5c side by the mechanism 35.
- the magazine moving mechanism 21 includes a magazine carry-in conveyor 31, a magazine guide 32, a magazine delivery mechanism 33, a magazine elevator 34, a substrate push-pull mechanism 35, an upper clamper 36, a lower clamper 37, and a magazine carry-out conveyor 38. It consists of
- the magazine carry-in conveyor 31 conveys the substrate supply magazine 5 containing the substrate 4 before applying the liquid agent from the front to the rear (toward the upper portion of the magazine guide 32).
- a magazine insertion port 22a is provided in the upper part of the front surface of the cover member 22, and the front end portion of the magazine carry-in conveyor 31 is located close to the magazine insertion port 22a.
- a conveyor (magazine carrying conveyor 31) is used to convey the substrate supply magazine 5 containing the substrate 4 before applying the liquid agent from the front to the rear.
- This is a push-in operation using a cylinder. It may be a mechanism or the like.
- the magazine guide 32 includes four guide members 32a extending in the Z-axis direction, and supports the four corners of the magazine 5 to guide the movement of the magazine 5 in the vertical direction.
- the magazine delivery mechanism 33 supports the magazine 5 that has been conveyed by the magazine carry-in conveyor 31 to a position near the upper portion of the magazine guide 32 (the rear end portion of the magazine carry-in conveyor 31) from below and moves backward.
- the magazine 5 is transferred into the magazine guide 32.
- the magazine elevator 34 includes an elevating mechanism part 34a provided in the up and down direction behind the magazine guide 32 and an elevating part 34b moved up and down by the elevating mechanism part 34a.
- the elevating part 34b has a plurality of columnar magazine support parts 34c that protrude and extend forward, and the elevating part 34b is in a state where the plurality of magazine support parts 34c are in contact with the magazine 5 in the magazine guide 32 or below.
- one area of the magazine 5 positioned at the same height as the magazine 5 conveyed from the front to the rear by the magazine carry-in conveyor 31 is a magazine.
- the first magazine holding area S1 in which the magazine 5 carried in by the carry-in conveyor 31 is held is the first magazine holding area.
- the area of one magazine 5 immediately below the first magazine holding area S1 is the first magazine holding area.
- the magazine 5 held in S1 is a second magazine holding area S2 that is temporarily held thereafter.
- the area occupied by the upper magazine 5 among the two magazines 5 that are vertically moved up and down by the magazine elevator 34 is a substrate supply unit R ⁇ b> 1 in which the magazine 5 for supplying substrates is installed.
- the area occupied by the lower magazine 5 of the two magazines 5 stacked one above the other that is moved up and down by the magazine elevator 34 is a substrate recovery portion R2 in which the magazine 5 for substrate recovery is installed.
- the substrate supply unit R1 in which the substrate supply magazine 5 is installed and the substrate recovery unit R2 in which the substrate recovery magazine 5 is installed are positioned side by side in the vertical direction.
- Positioning in the vertical direction and positioning in the vertical direction of the magazine 5 for collecting the substrate when collecting the substrate 4 are performed.
- the substrate pushing / pulling mechanism 35 is provided at the left position of the middle portion of the magazine guide 32 in the vertical direction.
- the substrate push-pull mechanism 35 is configured so that one of the plurality of shelves 5b included in the substrate supply magazine 5 that is moved up and down by the magazine elevator 34 coincides with the substrate passage opening 12h on the main body 2 side.
- Substrate supply operation of pushing out the substrate 4 in 5b (the substrate 4 before applying the liquid agent) from the rear opening 5c side to the front opening 5d side and feeding the substrate 4 to the receiving conveyor 15 of the main body 2 (FIG. 6A ⁇ FIG.
- the substrate push-pull mechanism 35 recovers the substrate 4 on the receiving conveyor 15
- the substrate 4 on the receiving conveyor 15 is pushed into the magazine 5 for collecting the substrate by the substrate pushing mechanism provided in the lower part of the receiving conveyor 15 or the like. Also good.
- the upper clamper 36 includes a pair of members facing in the left-right direction (X-axis direction) across the first magazine holding region S ⁇ b> 1 in the magazine guide 32.
- the magazine 5 delivered to the first magazine holding area S1 in 32 is clamped and held in the X-axis direction.
- the lower clamper 37 is composed of a pair of members facing in the left-right direction (X-axis direction) across the second magazine holding region S2 in the magazine guide 32.
- the magazine 5 lowered from the magazine holding area S1 and positioned in the second magazine holding area S2 is clamped and held in the X-axis direction.
- the magazine carry-out conveyor 38 conveys the substrate collection magazine 5 containing the substrate 4 after applying the liquid agent in the horizontal direction from the lower part of the magazine guide 32 toward the front.
- a magazine take-out port 22b is provided in the lower part of the front surface of the cover member 22, and the front end portion of the magazine carry-out conveyor 38 is located close to the magazine take-out port 22b.
- a conveyor (magazine carry-out conveyor 38) is used to convey the substrate supply magazine 5 containing the substrate 4 after application of the liquid agent from the lower part of the magazine guide 32 to the front.
- the movement operation is controlled by the control device 40 provided in the liquid application device 1 (FIG. 4).
- the control device 40 also controls the clamping operation of the magazine 5 located in the second magazine holding region S2 by the lower clamper 37 and the releasing operation thereof, and the carrying operation of the substrate collecting magazine 5 by the magazine carry-out conveyor 38. (FIG. 4).
- the empty magazine 5 When the leading empty magazine 5 is positioned at the rear end of the magazine carry-in conveyor 31, the empty magazine 5 is positioned in the first magazine holding area S1 in the magazine guide 32 by the magazine delivery mechanism 33 (The empty magazine 5 is clamped by the upper clamper 36 (arrow A1) shown in FIG. 9A (FIG. 9A).
- the control device 40 raises the raising / lowering part 34b of the magazine elevator 34 (arrow B1 shown in FIG. 9B), and the magazine holding area.
- the magazine 5 held in S1 is supported by the elevating part 34b (FIG. 9B).
- the elevating part 34b of the magazine elevator 34 is lowered (arrow B2 shown in FIG. 9C), and the empty magazine 5 is moved to the second magazine.
- the magazine carrying conveyor 31 is operated after being placed in the holding region S2 (or below the holding area S2), and the magazine 5 for substrate supply located at the rear end of the magazine carrying conveyor 31 is placed in the magazine guide 32. It is positioned in the first magazine holding area S1 (arrow A2 shown in FIG. 9C).
- the upper clamper 36 is operated to clamp the substrate supply magazine 5 located in the first magazine holding region S1 (FIG. 9C).
- the control device 40 raises the empty magazine 5 by the magazine elevator 34 (shown in FIG. 9D). Arrow B3), the empty magazine 5 is brought into contact with the substrate supply magazine 5 located in the first magazine holding area S1 from below, and then the clamp of the substrate supply magazine 5 by the upper clamper 36 is released (see FIG. FIG. 9 (d)). As a result, the substrate supply magazine 5 is positioned in the substrate supply unit R1, and the substrate recovery magazine 5 is positioned in the substrate recovery unit R2.
- the magazine elevator 34 moves the substrate supply magazine 5 of the substrate supply unit R1 and the substrate recovery magazine 5 of the substrate recovery unit R2 by the magazine elevator 34.
- the substrate 4 is moved up and down (arrow B4 shown in FIGS. 10A and 10B) to supply the substrate 4 to the main body 2 (substrate supply operation by the substrate push-pull mechanism 35) and the main body While collecting the substrate 4 from the unit 2 (substrate accommodation operation by the substrate push-pull mechanism 35), the liquid Q is applied to the substrate 4 in the main unit 2 in the procedure described later.
- the substrates 4 are accommodated in order from the shelf 5 b located above the substrate collecting magazine 5. In this way, even if dust or the like falls from the substrate 4 or the magazine 5 when the substrate 4 is drawn to the substrate collecting magazine 5, the dust or the like is dropped to another substrate in the substrate collecting magazine 5. 4 can be prevented.
- the control device 40 receives the substrate 4 pushed out from the substrate supply magazine 5 of the substrate supply unit R 1 by the receiving conveyor 15 and takes out the substrate 4 ( 12 (a), substrate removal step), the received substrate 4 is transferred to the rear positioning conveyor 16a (arrow C1 shown in FIG. 12 (b)), and then the rear substrate positioning conveyor 16a is operated to move the substrate 4 backward. It is transferred (positioned) to the work position (FIG. 12 (b), work position transfer step).
- control device 40 controls the movement operation of the coating head 14 by the coating head moving mechanism 13 and controls the discharge operation of the liquid Q by the coating head 14 to the rear working position.
- a liquid application operation is performed on the positioned substrate 4 (FIG. 12B).
- the control device 40 receives the substrate 4 newly pushed out from the substrate supply magazine 5 of the substrate supply section R1 by the receiving conveyor 15 after starting the liquid agent application operation by the application head 14 with respect to the substrate 4 positioned at the rear operation position. Then, the substrate 4 is taken out (substrate taking step). Then, the receiving conveyor 15 is moved forward by the receiving conveyor moving mechanism 17 (arrow D1 shown in FIG. 12C), and the substrate 4 is delivered to the front positioning conveyor 16b (shown in FIG. 12C). Arrow C2), the front positioning conveyor 16b is actuated to transfer (position) the substrate 4 to the front work position and place the substrate 4 in a standby state (FIG. 12 (c), work position transfer step).
- the control device 40 moves the coating head 14 and waits at the front work position when the liquid agent application work on the substrate 4 positioned at the rear work position is completed.
- a liquid coating operation is performed on the substrate 4 (liquid coating process).
- the receiving conveyor 15 is moved rearward during the liquid application operation (arrow D2 shown in FIG. 12 (d)), and the substrate 4 positioned at the rear operating position is supplied and recovered via the receiving conveyor 15.
- the substrate 4 after application of the liquid agent is accommodated in the magazine 5 for substrate recovery in the substrate recovery unit R2 (FIG. 12D). Substrate accommodation step).
- the control device 40 receives the substrate 4 newly pushed out from the substrate supply magazine 5 of the substrate supply section R1 when the substrate 4 that has been subjected to the liquid application operation at the rear operation position is stored in the substrate recovery magazine 5. After receiving by the conveyor 15 and taking out the substrate 4 (substrate taking-out process), after passing to the rear positioning conveyor 16a via the receiving conveyor 15 (arrow C4 shown in FIG. 13A), the rear substrate positioning conveyor 16a is operated. Then, the substrate 4 is transferred to the rear working position, and the substrate 4 is set in a standby state (FIG. 13A).
- the control device 40 moves the coating head 14 and waits at the rear working position when the liquid coating operation by the coating head 14 on the substrate 4 positioned at the front working position is completed.
- the liquid agent coating operation is performed on the substrate 4 that has been set to (liquid agent application step).
- the receiving conveyor 15 is moved forward and backward during the liquid application operation (arrow D3 shown in FIG. 13B), and the substrate 4 positioned at the front operating position is transferred to the substrate via the receiving conveyor 15.
- the substrate 4 after being applied with the liquid agent is accommodated in the magazine 5 for substrate collection in the substrate collection unit R2 (FIG. 13B). ) Substrate accommodation step).
- the control device 40 receives the substrate 4 newly pushed out from the substrate supply magazine 5 of the substrate supply section R1 when the substrate 4 that has been subjected to the liquid application operation at the front operation position is accommodated in the substrate recovery magazine 5.
- the receiving conveyor 15 is moved forward (arrow D4 shown in FIG. 13C), and the substrate 4 is delivered to the front positioning conveyor 16b ( Arrow C6) shown in FIG.
- the front substrate positioning conveyor 16b is operated to transfer the substrate 4 to the front work position, and put the substrate 4 in a standby state (FIG. 13 (c), work position transfer step).
- the control device 40 moves the application head 14 to the standby position at the front work position when the liquid agent application work on the substrate 4 positioned at the rear work position is completed.
- the liquid agent coating operation is performed on the substrate 4 (liquid agent application step).
- the receiving conveyor 15 is moved rearward during the liquid application operation (arrow D5 shown in FIG. 13D), and the substrate 4 positioned at the rear working position is supplied and recovered via the receiving conveyor 15.
- the substrate 4 after being applied with the liquid agent is accommodated in the magazine 5 for substrate recovery in the substrate recovery unit R2 (FIG. 13D). Substrate accommodation step). Thereafter, the steps of FIG. 13 (a) ⁇ FIG. 13 (b) ⁇ FIG. 13 (c) ⁇ FIG. 13 (d) ⁇ FIG. 13 (a) ⁇ .
- the control device 40 lifts and lowers the substrate supply magazine 5 of the substrate supply unit R1 and the substrate recovery magazine 5 of the substrate recovery unit R2 simultaneously (in an integrated state) to the main body unit 2. While supplying the substrate 4 and recovering the substrate 4 from the main body 2, the liquid Q is applied to the substrate 4 in the main body 2.
- the magazine carry-in conveyor 31 and the magazine delivery mechanism 33 are operated. Then, the substrate supply magazine 5 positioned at the head of the magazine carry-in conveyor 31 is positioned in the first magazine holding region S1 in the magazine guide 32 (arrow A3 shown in FIG. 10B). Then, the upper clamper 36 is operated to clamp the substrate supply magazine 5 positioned in the first magazine holding region S1 (FIG. 10B).
- the control device 40 clamps the substrate supply magazine 5 located in the magazine holding area S1 by the upper clamper 36, and then the liquid application operation for the substrate 4 proceeds and the substrate supply magazine 5 installed in the substrate supply unit R1. Is emptied by the magazine elevator 34, the substrate supply magazine 5 of the emptied substrate supply unit R1 and the substrate recovery magazine 5 of the substrate recovery unit R2 in which the substrate 4 after applying the liquid agent are accommodated simultaneously. It was lifted (in an integrated state) (arrow B5 shown in FIG. 10 (c)), and the empty substrate supply magazine 5 was positioned in the second magazine holding area S2 and then empty. The magazine 5 for substrate supply is clamped by the lower clamper 37 (FIG. 10C).
- control device 40 lowers only the substrate collection magazine 5 of the substrate collection unit R2 by the magazine elevator 34 (arrow B6 shown in FIG. 10 (d)), and the substrate collection magazine 5 is moved to the magazine carry-out conveyor.
- the magazine 5 for substrate collection is conveyed forward by the magazine carry-out conveyor 38 (FIG. 11A, arrow E shown in the figure).
- the control device 40 raises the lifting / lowering part 34b of the magazine elevator 34 (arrow B7 shown in FIG. 11B), and the magazine holding area S2
- the magazine 5 held in the position is supported by the elevating part 34b (FIG. 11B).
- the holding of the empty magazine 5 by the lower clamper 37 is released and the raising / lowering part 34b of the magazine elevator 34 is raised (arrow B8 shown in FIG. 11C), and the upper surface of the empty magazine 5 is set to the first magazine.
- the clamp of the substrate supply magazine 5 positioned in the first magazine holding area S1 by the upper clamper 36 is released (FIG. 11). (C)).
- FIG. 10 (b) ⁇ FIG. 10 (c) ⁇ FIG. 10 (d) ⁇ FIG. 11 (a) ⁇ FIG. 11 (b) ⁇ FIG. 11 (c) ⁇ FIG. 11 (d) ⁇ FIG. ) ⁇ Repeat the process.
- the operator OP inputs the magazine 5 for substrate supply from the magazine insertion port 22a to the magazine carry-in conveyor 31 and collects the substrate carried out to the magazine take-out port 22b by the magazine carry-out conveyor 38.
- the magazine 5 is taken out as appropriate.
- the liquid agent application device 1 is installed in the substrate supply unit R1 and the substrate supply unit R1 in which the substrate supply magazine 5 that accommodates the substrate 4 before the liquid agent Q is applied is installed.
- the substrate supply unit R1 and the substrate recovery unit R2 are arranged side by side in the vertical direction.
- the liquid agent application method by this liquid agent application apparatus 1 is a step of taking out the substrate before the liquid agent Q is applied from the substrate magazine 5 installed in the substrate supply part R1 and transferring it to the working position (the above-mentioned substrate removal) Process, work position transfer process), the process of applying the liquid Q transferred to the work position (the above-mentioned liquid agent application process), and the substrate 4 coated with the liquid Q from the work position to the substrate supply part R1 in the vertical direction. And a step of storing the substrate in the substrate recovery magazine 5 installed in the substrate recovery unit R2 located side by side (the above-described substrate storage step).
- the substrate Q is applied to the substrate supply unit R1 in which the substrate supply magazine 5 that houses the substrate 4 before the liquid Q is applied is installed. Since the substrate recovery unit R2 in which the substrate recovery magazine 5 that accommodates the subsequent substrate 4 is installed is positioned side by side in the vertical direction, the substrate supply unit R1 (for substrate supply) in a plan view of the liquid application device 1 Magazine 5) and the substrate collection unit R2 (substrate collection magazine 5) only need to have an installation space, and accordingly, the overall size of the liquid application device 1 can be reduced and the area productivity can be reduced. Can be improved.
- the substrate supply magazine 5 of the substrate supply unit R1 and the substrate recovery magazine 5 of the substrate recovery unit R2 are positioned side by side in a state where one is placed on the other, and these substrate supply units
- the magazine 5 and the substrate collecting magazine 5 are simultaneously moved up and down by a magazine elevator 34 which is a magazine lifting means, and the substrate supply magazine 5 is positioned in the vertical direction when the substrate 4 is taken out and the substrate 4 is recovered. Since the recovery magazine 5 is positioned in the vertical direction, the substrate supply unit R1 (substrate supply magazine 5) and the substrate recovery unit R2 (substrate recovery magazine) in plan view of the liquid application device 1 are used. 5), it is sufficient if there is an installation space for one of them, and accordingly, the overall size of the liquid application device 1 can be reduced.
- the substrate supply magazine 5 emptied in the substrate supply unit R1 is moved to the substrate recovery unit R2 to be used as the substrate recovery magazine 5, and is installed in the substrate supply unit R1 until then. Since the magazine 5 for substrate supply that has been used is used as the magazine 5 for substrate recovery, the magazine 5 for substrate supply installed in the substrate supply section R1 is carried out of the liquid application device 1. There is no need to carry the work and a new substrate collecting magazine 5 into the liquid material applicator 1. For this reason, the number of man-hours for setting an empty magazine required for the conventional loader / unloader type can be reduced, and the manufacturing cost can be reduced accordingly.
- the substrate transfer means having two work positions and the receiving conveyor 15 and the two positioning conveyors 16 applies the liquid Q to the substrate 4 transferred to one of the work positions. While the coating is being performed, the substrate 4 taken out from the substrate supply magazine 5 is transferred to the other working position, or the substrate 4 on which the liquid agent Q has been applied at the other working position is used for substrate recovery. Therefore, it is possible to minimize the time loss due to the stop of the coating process due to the waiting for conveyance.
- the substrate supply magazine 5 of the substrate supply unit R1 is placed on the substrate recovery magazine 5 of the substrate recovery unit R2 and arranged side by side in the vertical direction.
- the substrate collection magazine 5 of the substrate collection unit R2 is arranged in the vertical direction with being placed on the substrate supply magazine 5 of the substrate supply unit R1.
- the substrate supply magazine 5 of the substrate supply unit R1 and the substrate recovery magazine 5 of the substrate recovery unit R2 may be positioned side by side in a state where one is placed on the other. That's fine.
- the substrate 4 in the substrate supply magazine 5 (the substrate 4 before applying the liquid agent) is not necessarily used. ) Is empty.
- liquid application device Provided with a liquid application device and a liquid application method capable of reducing the size and improving the area productivity.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Warehouses Or Storage Devices (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
4 基板
5 マガジン
14 塗布ヘッド
15 受け取りコンベア(基板移送手段)
16 位置決めコンベア(基板移送手段)
34 マガジン昇降機(マガジン昇降手段)
R1 基板供給部
R2 基板回収部
Q 液剤
Claims (8)
- 液剤が塗布される前の基板を収容した基板供給用のマガジンが設置される基板供給部と、
前記基板供給部に設置された前記基板供給用のマガジンから取り出されて作業位置に移送された前記基板に前記液剤を塗布する塗布ヘッドと、
前記塗布ヘッドにより前記液剤が塗布された前記基板を収容する基板回収用のマガジンが設置された基板回収部とを備えた液剤塗布装置であって、
前記基板供給部と前記基板回収部とは上下方向に並んで位置していることを特徴とする液剤塗布装置。 - 前記基板供給部の前記基板供給用のマガジン及び前記基板回収部の前記基板回収用のマガジンは一方が他方の上に載った状態で上下方向に並んで位置しており、これら前記基板供給用のマガジン及び前記基板回収用のマガジンをマガジン昇降手段によって同時に昇降させて前記基板を取り出す際の前記基板供給用のマガジンの上下方向の位置決め及び前記基板を回収する際の前記基板回収用のマガジンの上下方向の位置決めを行うことを特徴とする請求項1に記載の液剤塗布装置。
- 前記基板供給部において空になった前記基板供給用のマガジンが前記基板回収部に移動されて前記基板回収用のマガジンとして用いられることを特徴とする請求項1又は2に記載の液剤塗布装置。
- 前記作業位置を2つ有し、前記基板供給用のマガジンから取り出された前記基板の前記作業位置への移送及び前記作業位置において前記液剤が塗布された前記基板の前記基板回収用のマガジンへの移送を行う基板移送手段は、一方の作業位置に移送した前記基板に対する前記液剤の塗布が行われている間に、前記基板供給用のマガジンから取り出された前記基板を他方の作業位置に移送し、或いは前記他方の作業位置において前記液剤の塗布が行われた前記基板を前記基板回収用のマガジンに移送することを特徴とする請求項1乃至3の何れかに記載の液剤塗布装置。
- 基板供給部に設置された基板供給用のマガジンから液剤が塗布される前の基板を取り出して作業位置に移送する工程と、
前記作業位置に移送した前記基板に前記液剤を塗布する工程と、
前記液剤を塗布した前記基板を前記作業位置から移送して前記基板供給部と上下方向に並んで位置する基板回収部に設置された基板回収用のマガジンに収容する工程とを含むことを特徴とする液剤塗布方法。 - 前記基板供給部の前記基板供給用のマガジン及び前記基板回収部の前記基板回収用のマガジンは一方が他方の上に載った状態で上下方向に並んで位置しており、これら前記基板供給用のマガジン及び前記基板回収用のマガジンを同時に昇降させて前記基板を取り出す際の前記基板供給用のマガジンの上下方向の位置決め及び前記基板を回収する際の前記基板回収用のマガジンの上下方向の位置決めを行うことを特徴とする請求項5に記載の液剤塗布方法。
- 前記基板供給部において空になった前記基板供給用のマガジンを前記基板回収部に移動させて前記基板回収用のマガジンとして用いることを特徴とする請求項5又は6に記載の液剤塗布方法。
- 前記作業位置を2つ有し、一方の作業位置に移送した前記基板に対する前記液剤の塗布を行っている間に、前記基板供給用のマガジンから取り出した前記基板を他方の作業位置に移送し、或いは前記他方の作業位置において前記液剤の塗布を行った前記基板を前記基板回収用のマガジンに移送することを特徴とする請求項5乃至7の何れかに記載の液剤塗布方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN2012800107224A CN103391819A (zh) | 2011-08-30 | 2012-03-13 | 液体涂覆装置和液体涂覆方法 |
US14/000,737 US20130330479A1 (en) | 2011-08-30 | 2012-03-13 | Liquid-application device and liquid-application method |
DE112012003604.2T DE112012003604T5 (de) | 2011-08-30 | 2012-03-13 | Flüssigkeitsauftragsvorrichtung und Flüssigkeitsauftragsverfahren |
KR1020137021508A KR20140063505A (ko) | 2011-08-30 | 2012-03-13 | 액제 도포 장치 및 액제 도포 방법 |
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JP2011187210A JP2013049001A (ja) | 2011-08-30 | 2011-08-30 | 液剤塗布装置及び液剤塗布方法 |
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US11660632B2 (en) * | 2018-03-28 | 2023-05-30 | Ecosys S.R.L. | Device for coating, in particular painting, the main surfaces of rigid panels with liquid products |
CN108482955A (zh) * | 2018-05-17 | 2018-09-04 | 中源智人科技(深圳)股份有限公司 | 一种智能双层托盘车 |
Citations (5)
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JPS61144640U (ja) * | 1985-02-28 | 1986-09-06 | ||
JPH05186014A (ja) * | 1992-01-14 | 1993-07-27 | Sharp Corp | 基板搬送装置および基板搬送方法 |
JPH0684972A (ja) * | 1992-08-28 | 1994-03-25 | Fujitsu Miyagi Electron:Kk | ローダ・アンローダ |
JPH07153720A (ja) * | 1993-11-26 | 1995-06-16 | Seiko Seiki Co Ltd | ダイシング装置のウェハ自給装置 |
WO2007066808A1 (ja) * | 2005-12-06 | 2007-06-14 | Musashi Engineering, Inc. | 加工装置および加工方法 |
-
2011
- 2011-08-30 JP JP2011187210A patent/JP2013049001A/ja not_active Withdrawn
-
2012
- 2012-03-13 CN CN2012800107224A patent/CN103391819A/zh active Pending
- 2012-03-13 US US14/000,737 patent/US20130330479A1/en not_active Abandoned
- 2012-03-13 WO PCT/JP2012/001711 patent/WO2013031048A1/ja active Application Filing
- 2012-03-13 KR KR1020137021508A patent/KR20140063505A/ko not_active Application Discontinuation
- 2012-03-13 DE DE112012003604.2T patent/DE112012003604T5/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61144640U (ja) * | 1985-02-28 | 1986-09-06 | ||
JPH05186014A (ja) * | 1992-01-14 | 1993-07-27 | Sharp Corp | 基板搬送装置および基板搬送方法 |
JPH0684972A (ja) * | 1992-08-28 | 1994-03-25 | Fujitsu Miyagi Electron:Kk | ローダ・アンローダ |
JPH07153720A (ja) * | 1993-11-26 | 1995-06-16 | Seiko Seiki Co Ltd | ダイシング装置のウェハ自給装置 |
WO2007066808A1 (ja) * | 2005-12-06 | 2007-06-14 | Musashi Engineering, Inc. | 加工装置および加工方法 |
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CN103391819A (zh) | 2013-11-13 |
DE112012003604T5 (de) | 2014-06-26 |
JP2013049001A (ja) | 2013-03-14 |
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