WO2012063804A1 - 異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 - Google Patents
異方性導電フィルム、異方性導電フィルムの製造方法、電子部材間の接続方法及び接続構造体 Download PDFInfo
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- WO2012063804A1 WO2012063804A1 PCT/JP2011/075688 JP2011075688W WO2012063804A1 WO 2012063804 A1 WO2012063804 A1 WO 2012063804A1 JP 2011075688 W JP2011075688 W JP 2011075688W WO 2012063804 A1 WO2012063804 A1 WO 2012063804A1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
Definitions
- the present invention relates to an anisotropic conductive film for use in conductive connection between electronic members, such as a liquid crystal display panel and a flexible printed wiring board or a semiconductor element, a method for manufacturing an anisotropic conductive film,
- the present invention relates to a connection method and a connection structure between electronic members using an anisotropic conductive film.
- the anisotropic conductive film is obtained by forming a conductive particle-containing layer in which conductive particles are dispersed in an insulating resin on a release film. These are electrically connected by interposing a conductive particle-containing layer between the liquid crystal display panel and the circuit board and between the circuit boards.
- An example of the anisotropic conductive film is an anisotropic conductive film 20 as shown in FIG.
- the anisotropic conductive film 20 is obtained by forming a conductive particle-containing layer 22 on a long release film 21.
- Such an anisotropic conductive film 20 has a liquid crystal display panel 23 side facing the liquid crystal display panel 23 when, for example, an IC chip as a liquid crystal driving circuit is mounted on the peripheral portion of the liquid crystal display panel 23.
- the conductive particle-containing layer 22 is transferred to the liquid crystal display panel 23 by being heat-pressed to the peripheral edge of the display panel 23.
- the conductive particle-containing layer 22 is bonded to the liquid crystal display panel 23 by peeling the release film 21 from the conductive particle-containing layer 22.
- the liquid crystal display panel 23 and an IC chip (not shown) can be connected and conducted.
- Such an anisotropic conductive film 20 is formed by narrowing the width in accordance with the place to be bonded, for example, when the width of the bonded portion of the liquid crystal display panel 23 is narrow.
- the anisotropic conductive film 20 is aligned and pasted in parallel to the part to be pasted. Therefore, the sticking condition is likely to vary depending on the tension of the anisotropic conductive film 20 and the accuracy of the mounting position.
- the anisotropic conductive film has a width of several millimeters and a length of, for example, 50 m and is wound around a reel, although not shown. When using it, feed it out from the reel, cut it out, and use it.
- the mounting area of the anisotropic conductive film tends to be increased as the panel becomes larger.
- the connection part which has various mounting areas exists, the usage-amount of an anisotropic conductive film is increasing.
- Patent Document 1 proposes an adhesive tape that can increase the amount of adhesive that adheres to the circuit board without increasing the number of windings on the reel.
- the amount of the adhesive is determined by separating the adhesive applied to the entire surface of one side of the substrate with a width W into a plurality of strips in the width W direction, and bonding the separated strips to the periphery of the circuit board. It is described to increase.
- the length of the adhesive bonded to the circuit board is limited to the width W of the base material.
- the reel of the adhesive tape must be replaced every time the size of the portion of the circuit board to which the adhesive is bonded changes.
- the size of the part to be bonded varies, and the width of the adhesive tape must be changed in accordance with these sizes to be newly manufactured. Therefore, with the adhesive tape proposed in Patent Document 1, it is difficult to significantly reduce the number of times the reels are attached and detached, and furthermore, adhesive tapes with various widths must be manufactured, which increases costs.
- the present invention has been proposed in view of such a conventional situation, and forms a conductive particle-containing layer in accordance with the size of a portion to be bonded to an electronic member without increasing the width of the substrate.
- An anisotropic conductive film that can be manufactured has no sticking variation, and has improved production efficiency, a method for manufacturing an anisotropic conductive film, a method for connecting electronic members and a connection structure using the anisotropic conductive film The purpose is to provide.
- the anisotropic conductive film according to the present invention that achieves the above-described object is an anisotropic conductive film that electrically connects electronic members with a conductive particle-containing layer, and at least conductive particles are present on the substrate.
- a conductive particle-containing layer dispersed in a binder is formed, and an angle b is formed in the long side direction of the substrate, and slit lines that divide the conductive particle-containing layer are formed in at least the conductive particle-containing layer
- the angle b satisfies 180 degrees> b> 0 degrees (excluding 90 degrees).
- the method for producing an anisotropic conductive film according to the present invention is a method for producing an anisotropic conductive film in which electronic members are electrically connected by a conductive particle-containing layer.
- An angle of satisfying the following relationship with respect to the long-side direction of the base material is formed by applying a binder in which conductive particles are dispersed on the surface of the base material and drying to form a conductive particle-containing layer on the base material.
- a slit line dividing the conductive particle-containing layer is formed in at least the conductive particle-containing layer, and the angle b satisfies 180 degrees> b> 0 degrees (except 90 degrees). .
- connection method between the electronic members according to the present invention is a connection method between the electronic members that connects and connects the electronic members through the conductive particle-containing layer.
- the conductive particle-containing layer is formed, and has an angle b with respect to the long side direction of the substrate, and the slit lines dividing the conductive particle-containing layer are at least in the conductive particle-containing layer.
- An anisotropic conductive film that is formed and satisfies an angle b of 180 degrees> b> 0 degrees (excluding 90 degrees) is used, and the conductive particle-containing layer is a first electron on the terminal of the first electronic member.
- An anisotropic conductive film is disposed so as to be on the terminal side of the member, the anisotropic conductive film is heated and pressurized against the first electronic member, the substrate is peeled from the conductive particle-containing layer, and the first A conductive particle-containing layer is temporarily pressure-bonded onto the terminal of the electronic member, and the second electronic member
- the second electronic member is disposed on the first electronic member so that the child is on the conductive particle-containing layer, and the second electronic member is heated and pressurized with respect to the first electronic member.
- the terminal of the electronic member and the terminal of the second electronic member are connected by a conductive particle-containing layer and are made conductive.
- connection structure according to the present invention that achieves the above-described object is a connection structure manufactured by the connection method between the electronic members.
- the conductive particle-containing layer of the anisotropic conductive film has an angle b satisfying 180 degrees> b> 0 degrees (except 90 degrees) with respect to the long side direction, and the conductive particle-containing layer Is formed, and one conductive particle-containing layer divided and separated by the slit line is bonded to the electronic member. Therefore, in this invention, the width
- the angle b of a slit line is adjusted and a slit line is formed.
- the size of the conductive particle-containing layer to be bonded can be formed in accordance with the bonded portion without changing the size of the substrate.
- the conductive particle-containing layer divided and separated by the slit line is bonded, so there is no need to reduce the width of the base material, thus improving the bonding accuracy to the electronic member. be able to.
- FIG. 1 is an anisotropic conductive film to which the present invention is applied
- FIG. 1A is a perspective view of the anisotropic conductive film
- FIG. 1B is a plan view of the anisotropic conductive film.
- FIG. 2 is a plan view of an anisotropic conductive film in which the angles of the slit lines to which the present invention is applied are different.
- FIG. 3 is a perspective view of a connection structure in which a liquid crystal display panel and a flexible printed board are connected by the anisotropic conductive film.
- FIG. 4 is a cross-sectional view of a connection portion of the connection structure.
- FIG. 5 is a perspective view showing a state in which a conductive particle-containing layer is bonded to the liquid crystal display panel.
- FIG. 6 is a perspective view illustrating a method for adhering a conductive particle-containing layer to a liquid crystal display panel.
- FIG. 7 is a perspective view illustrating another method for adhering the conductive particle-containing layer to the liquid crystal display panel.
- FIG. 8 is a diagram for explaining a method of attaching the conductive particle-containing layer of the anisotropic conductive film of Example to glass.
- FIG. 9 is a diagram for explaining a method of attaching the conductive particle-containing layer of the anisotropic conductive film of the comparative example to glass.
- FIG. 10 is a perspective view for explaining a conventional method of bonding an anisotropic conductive film.
- an anisotropic conductive film to which the present invention is applied a method for manufacturing an anisotropic conductive film, a method for connecting electronic members, and a connection structure will be described in detail with reference to the drawings.
- the anisotropic conductive film 1 is usually one in which a conductive particle-containing layer 3 is formed on a release film 2 that is a base material.
- the anisotropic conductive film 1 has a liquid crystal display panel 10 and a flexible structure by interposing a conductive particle-containing layer 3 between a liquid crystal display panel 11 and a flexible printed circuit board 12 as an electronic member. It is used to connect the printed circuit board 11 and make it conductive.
- a substrate such as a polyethylene terephthalate film generally used in anisotropic conductive film (ACF) can be used.
- the width of the release film 2 is preferably 5 mm or more.
- the conductive particle-containing layer 3 is formed by dispersing conductive particles in a binder.
- the binder contains a thermosetting resin, a film-forming resin, a latent curing agent, a silane coupling agent, and the like, and is the same as the binder used for a normal anisotropic conductive film.
- the film forming resin is preferably a resin having an average molecular weight of about 10,000 to 80,000.
- the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin.
- phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.
- thermosetting resin is not particularly limited as long as it has fluidity at room temperature, and commercially available epoxy resins and acrylic resins can be mentioned.
- the epoxy resin is not particularly limited and may be appropriately selected depending on the purpose.
- naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, Phenolmethane type epoxy resin, phenol aralkyl type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like can be mentioned. These may be used alone or in combination of two or more.
- an acrylic resin there is no restriction
- thermosetting resin it is preferable to use this epoxy resin or acrylic resin as the thermosetting resin.
- Examples of the latent curing agent include various curing agents such as a heat curing type and a UV curing type.
- the latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction.
- the activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method of dissolving and dissolving and starting a curing reaction, a method of starting a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, an elution and curing method using microcapsules, and the like.
- Thermally active latent curing agents include imidazole series, hydrazide series, boron trifluoride-amine complex, sulfonium salt, amine imide, polyamine salt, dicyandiamide, and modified products thereof.
- the above mixture may be sufficient.
- a microcapsule type imidazole-based latent curing agent is preferable.
- silane coupling agents include epoxy, amino, mercapto sulfide, ureido and the like. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.
- Examples of the conductive particles include any known conductive particles used in anisotropic conductive films.
- Examples of conductive particles include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold, metal oxides, carbon, graphite, glass, ceramics, and plastics. The surface of the particles such as those coated with a metal, or the surface of these particles further coated with an insulating thin film.
- examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.
- the anisotropic conductive film 1 is formed in, for example, a strip shape, has an angle b with respect to the long side direction L of the release film 2, and divides the conductive particle-containing layer 3.
- a plurality of wires 4 are formed on the conductive particle-containing layer 3.
- the slit line 4 is formed linearly from one long side 5 to the other long side 6.
- the plurality of slit lines 4 are parallel and are formed at a predetermined interval in accordance with the width to which the conductive particle-containing layer 3 is bonded.
- the angle b is an angle formed by intersecting the long side direction L of the anisotropic conductive film 1 and one long side 5 and the slit line 4 in FIG. Specifically, as shown in FIG. 1B, in the angle formed by the slit line 4 and one long side 5 intersecting, the angle on one short side 7 side is b, and the other short side 8 side is on the side.
- the angle is (180-b).
- the angle b is 180 degrees> b> 0 degrees (excluding 90 degrees), preferably 140 degrees ⁇ b ⁇ 40 degrees, and more preferably 130 degrees ⁇ b ⁇ 50 degrees.
- the angle b of the slit line 4 is adjusted according to the size of the region where the conductive particle-containing layer 3 is bonded to the electronic member such as the liquid crystal display panel 10. Or as shown in FIG. 2, the length of the one electroconductive particle content layer 3a divided
- the width of the anisotropic conductive film 1 is one kind of the determined size, by adjusting the angle b of the slit line 4, it can be adjusted to the width and length of the attachment part of the electronic member.
- the affixing width and length of the conductive particle-containing layer 3a can be arbitrarily set.
- the slit line 4 as shown in FIG. 1 when the slit line 4 as shown in FIG. 1 is formed, it can be applied when the width of the pasting portion of the electronic member is narrow and long, and the slit line 4 as shown in FIG. 2 is formed.
- the present invention can be applied to a case where the width of the attachment part of the electronic member is slightly wide and short.
- the slit 4 wire can be slit manually by a slitting device, but is not limited to these methods.
- the anisotropic conductive film 1 forms the slit line 4 which has the angle b with respect to the long side direction L, so that one conductive particle divided
- the length of the content layer 3a that is, the length c of the conductive particle-containing layer 3a to be bonded to the electronic member is larger than the width W of the release film 2, and the conductive particle-containing layer 3a to be bonded to the electronic member.
- the affixing width a is smaller than the width W of the release film 2.
- the anisotropic conductive film 1 is attached in a range of 1 mm to 50 mm, for example.
- the width a can be adjusted within a range of 0.4 mm to 10 mm, for example.
- the slit wire 4 may be included only in the conductive particle-containing layer 3, and may be included not only in the conductive particle-containing layer 3 but also in the release film 2.
- the anisotropic conductive film 1 is not limited to being formed in a strip shape, but may be formed in a long shape and wound around a reel for use.
- the anisotropic conductive film 1 may be formed by laminating an insulating adhesive layer (NCF (Non-Conductive Film) layer) made of only a binder, for example, between the conductive particle-containing layer 3 and the release film 2. .
- the release film may be provided on both surfaces of the conductive particle-containing layer 3 (when the NCF is laminated, both surfaces of the conductive particle-containing layer 3 and the NCF layer).
- the anisotropic conductive film 1 having the above-described configuration can be manufactured, for example, by the following method.
- an adhesive composition in which conductive particles are dispersed in a binder is applied to the entire area of one surface of a strip-shaped or long-shaped release film 2, dried, and the conductive particles on the release film 2.
- the containing layer 3 is formed.
- a slit line having an angle b with respect to the long side direction L of the anisotropic conductive film 2 is a slit device or Formed manually. Note that the present invention is not limited to these methods.
- the anisotropic conductive film 1 in which the slit lines 4 are formed at least in the conductive particle-containing layer 3 can be manufactured.
- the manufacturing method of the general anisotropic conductive film other than the formation method of the slit line 4 is applicable.
- connection structure 10 includes, for example, a liquid crystal display panel 11 serving as a first electronic member and a flexible printed circuit board 12 in the conductive particle-containing layer of the anisotropic conductive film 1 described above. 3 is connected and made conductive.
- a liquid crystal layer (not shown) is sandwiched between a pair of transparent substrates 13a and 13b made of glass or the like, and a sealing material 14 is provided around the liquid crystal layer to seal the liquid crystal layer.
- Polarizing plates 34 are disposed on the lower surface of the transparent substrate 13a and the upper surface of the transparent substrate 13b, respectively.
- the transparent substrate 13a is provided with a terminal 16 provided with a plurality of electrodes in a portion where the transparent substrate 13b, the liquid crystal layer, and the sealing material are not laminated.
- the end 16 is formed in a rectangular shape, for example, and specifically, as shown in FIG.
- the conductive particle-containing layer 3 of the anisotropic conductive film 1 described above is bonded onto the terminal 16 of the liquid crystal display panel 11.
- connection structure 10 the terminals 17 of the flexible printed circuit board 12 are connected to the conductive particle-containing layer 3 bonded to the terminals 16 of the liquid crystal display panel 11, and the liquid crystal display panel 11 is connected via the conductive particle-containing layer 3. And the flexible printed circuit board 12 are electrically connected.
- the manufacturing method of the connection structure 10 is divided on the terminals 16 of the liquid crystal display panel 11 by the slit lines 4 in the conductive particle-containing layer 3 of the anisotropic conductive film 1 described above. Then, the separated one conductive particle-containing layer 3a is temporarily pressure-bonded.
- the anisotropic conductive film 1 to be used has a predetermined angle b on the conductive particle-containing layer 3 in accordance with the width and length of the portion where the terminal 16 of the liquid crystal display panel 11 and the terminal 17 of the flexible printed circuit board 12 are bonded.
- a slit line 4 is formed.
- the method of temporarily press-bonding the conductive particle-containing layer 3 a is an anisotropic conductive film on the terminal 16 of the liquid crystal display panel 11 so that the conductive particle-containing layer 3 a is on the terminal 16 side. 1 is placed.
- the direction of the sticking length c of one conductive particle-containing layer 3 a divided by the slit line 4 is parallel to the terminal 16 of the liquid crystal front panel 11 as shown in FIG.
- Conductive film 1 is fed onto terminal 16 of liquid crystal display panel 11. That is, the anisotropic conductive film 1 is sent obliquely with respect to the terminals 16 of the liquid crystal display panel 11.
- one electroconductive particle content layer 3a is heated and pressurized with a heating bonder from the peeling film 2 side, for example, and a heating bonder is separated from the peeling film 2.
- a heating bonder is separated from the peeling film 2.
- Temporary pressure bonding is performed by heating the upper surface of the release film 2 while pressing the upper surface of the release film 2 toward the terminal 16 with a slight pressure (for example, about 0.1 MPa to 2 MPa).
- the heating temperature is set to a temperature that does not cure the thermosetting resin such as an epoxy resin or an acrylic resin in the anisotropic conductive film 2 (for example, about 70 to 100 ° C.).
- the flexible printed circuit board 12 is disposed so that the terminals 16 of the liquid crystal display panel 11 and the terminals 17 of the flexible printed circuit board 12 face each other with the conductive particle-containing layer 3a interposed therebetween.
- the upper surface of the flexible printed circuit board 12 is heated at a temperature equal to or higher than the curing temperature of the thermosetting resin in the conductive particle-containing layer 3a while being pressurized with a heating bonder at a predetermined pressure.
- the terminal 16 of the liquid crystal display panel 11 and the terminal 17 of the flexible printed circuit board 12 are pressure-bonded via the conductive particle-containing layer 3a.
- connection structure in which the terminals 16 of the liquid crystal display panel 11 and the terminals 17 of the flexible printed circuit board 12 are connected via the conductive particle-containing layer 3a to achieve conduction.
- the body 10 can be manufactured.
- slit lines 4 are formed in the conductive particle-containing layer 3 of the anisotropic conductive film 1, and the slit lines 4 are the sizes of the terminals 16 and 17 of the liquid crystal display panel 11 and the flexible printed circuit board 12. That is, the anisotropic conductive film 1 in which the angle b is adjusted according to the size of the portion where the conductive particle-containing layer 3 is bonded is used. Thereby, in this manufacturing method, even if the width
- the slit wire 4 of the anisotropic conductive film 1 is formed only in the conductive particle-containing layer 3, and one conductive particle-containing layer is formed by peeling the release film 2 after provisional pressure bonding.
- 3a was separated, not limited to this, as shown in FIG. 7, the slit wire 4 is formed in the conductive particle-containing layer 3 and the release film 2, and is separated by the slit wire 4 together with the release film 2, Then, you may make it peel a peeling film from the electroconductive particle content layer 3a on the terminal 16.
- the conductive particle-containing layer 3 or the conductive particle-containing layer 3 and the release film 2 are separated by the slit 4, the conductive particle-containing layer 3 is heated and transferred onto the terminals 16 of the liquid crystal display panel 11. At this time, the edge portion of the liquid crystal display panel 11 may be used for separation.
- the alignment state of the conductive particle-containing layer 3 is confirmed. If a problem such as misalignment occurs, the anisotropic conductive film is peeled off and again You may make it perform the repair process which arrange
- the electronic member to which the conductive particle-containing layer 3 is attached is not limited to the liquid crystal display panel 11 and may be any insulating substrate provided with terminals.
- a glass substrate, a plastic substrate, a glass reinforced epoxy substrate, etc. can be mentioned.
- an electronic member to be bonded to the liquid crystal display panel 11 or the like in addition to the flexible printed base 12 plate, for example, a semiconductor chip such as an LSI (Large Scale Integration) chip or an IC chip, a semiconductor element such as a chip capacitor, or a liquid crystal drive Semiconductor mounting material COF (Chip On Film) and the like.
- a semiconductor chip such as an LSI (Large Scale Integration) chip or an IC chip
- a semiconductor element such as a chip capacitor
- COF Chip On Film
- Example 1 In Example 1, an anisotropic conductive film (CP6920F3, manufactured by Sony Chemical & Information Device Co., Ltd.) having a release film in which the surface of a PET film having a thickness of 50 ⁇ m is subjected to a release treatment with silicone and having an epoxy resin as a binder was wound around a plastic reel to form a reel shape having a width (W) of 1.5 mm. Then, before pasting, slitting the conductive particle-containing layer with a half-cut knife so that the pasting width (a) and pasting length (c), angle b is as shown in Table 1, Slit lines were formed.
- CP6920F3 manufactured by Sony Chemical & Information Device Co., Ltd.
- Example 2 to Example 20 In Examples 2 to 21, slit lines were formed so that the affixing width (a) and affixing length (c) of the conductive particle-containing layer and the angle b were as shown in Tables 1 and 2. Except that, the same procedure as in Example 1 was performed.
- Example 21 In Example 21, an anisotropic conductive film (product name: CP6920F3 (manufactured by Sony Chemical & Information Device Co., Ltd.)) using an acrylic resin as a binder (product name: CP6920F3, product)
- CP1720ISV manufactured by Sony Chemical & Information Device Co., Ltd.
- Comparative Examples 1 to 5 In Comparative Examples 1 to 5, the width (W) of the release film is as shown in Table 3, and the affixing width (a) of the conductive particle-containing layer is the same as the width (W) of the release film.
- the affixing length (c) is a length necessary for pasting and can be arbitrarily varied. Except for these, an anisotropic conductive film was produced in the same manner as in Example 1 to form a reel. In Comparative Examples 1 to 5, since no slit line is formed, the angle b is 0 degree or 180 degrees.
- Comparative Examples 6 to 10 the width (W) of the release film is as shown in Table 3, the angle b of the slit line is 90 degrees, that is, the angle intersecting the long side direction of the anisotropic conductive film is 90 °.
- the affixation length (c) of one conductive particle-containing layer is the same as the width (W) of the release film, and the affixation width (a) formed slit lines as shown in Table 1. Except for this, an anisotropic conductive film was produced in the same manner as in Example 1 to obtain a reel shape.
- the anisotropic conductive films produced in Examples 1 to 21 and Comparative Examples 1 to 10 were evaluated for evaluation of reel shape, transferability to glass, and control in the length direction. The evaluation results are shown in Tables 1 to 3.
- the reel shape was evaluated by observing the state in which the anisotropic conductive films of Examples 1 to 21 and Comparative Examples 1 to 10 were wound on a reel by 50 m, 100 m, and 200 m. ⁇ if there is no step, no gap, etc., in a uniform and good winding state, ⁇ , if there is a step, gap in part of the winding state, but can be implemented and has no problems in use
- the winding state was extremely inferior due to the presence of gaps, etc., which could not be carried out and had problems in use, was evaluated as x.
- the transferability to glass was evaluated as to whether transfer of the conductive particle-containing layer to glass was performed as follows.
- the anisotropic conductive films 31 of Examples 1 to 21 and Comparative Examples 6 to 10 are formed on a glass 30 as shown in FIG.
- the conductive particle containing layer 32 is fed so as to be on the glass 30 side, and the conductive particle containing layer 32 is heated and pressurized at a temperature of 80 ° C. and a pressure of 10 MPa by a heating bonder 34 from the release film 33 side. 32 was transferred to the glass 30.
- the anisotropic conductive film 35 formed in a strip shape on the glass 30 is arranged so that the conductive particle-containing layer is on the glass 30 side, and the release film 37 side is arranged. Then, the conductive particle-containing layer 36 was heated and pressurized at a temperature of 80 ° C. and a pressure of 10 MPa with a heating bonder 34 to transfer the conductive particle-containing layer 36 to the glass 30.
- the attachment width (a) of the conductive particle-containing layer is determined by the width (W) of the release film and cannot be adjusted.
- the affixing length (c) is determined by the length of the anisotropic conductive film, it cannot be adjusted according to the size of the affixing portion, that is, the length direction cannot be controlled.
- the slit lines are formed so that the angle b is 180 degrees> b> 0 degrees (excluding 90 degrees) with respect to the long-side direction of the release film.
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Abstract
Description
実施例1では、厚さ50μmのPETフィルムの表面がシリコーンにより剥離処理されてなる剥離フィルムを備え、エポキシ系樹脂をバインダとする異方性導電フィルム(CP6920F3、ソニーケミカル&インフォメーションデバイス株式会社製)をスリットし、プラスチック製のリールに巻回して幅(W)1.5mm幅のリール形状とした。続けて、貼り付け前に、貼り付け幅(a)及び貼り付け長さ(c)、角度bが表1に示すようになるようにハーフカット用ナイフにより導電性粒子含有層にスリット加工し、スリット線を形成した。
実施例2~実施例21は、導電性粒子含有層の貼り付け幅(a)及び貼り付け長さ(c)、角度bが表1、表2に示すようになるようにスリット線を形成したこと以外は、実施例1と同様に行った。
実施例21では、実施例1のエポキシ系樹脂をバインダとする異方性導電フィルム(製品名CP6920F3(ソニーケミカル&インフォメーションデバイス株式会社製)をアクリル系樹脂をバインダとする異方性導電フィルム(製品名CP1720ISV(ソニーケミカル&インフォメーションデバイス株式会社製)に換えた以外は実施例1と同様に行った。
比較例1~比較例5では、剥離フィルムの幅(W)を表3に示すようにし、導電性粒子含有層の貼り付け幅(a)は剥離フィルムの幅(W)と同じであり、貼り付け長さ(c)は貼り付ける際に必要な長さであり、任意可変でき、これらのこと以外は、実施例1と同様に異方性導電フィルムを製造し、リール形状とした。比較例1~比較例5は、スリット線が形成されていないため、角度bは、0度又は180度である。
比較例6~比較例10では、剥離フィルムの幅(W)を表3に示すようにし、スリット線の角度bを90度、即ち異方性導電フィルムの長辺方向との交差する角度が90度であり、1つ導電性粒子含有層の貼り付け長さ(c)は剥離フィルムの幅(W)と同じであり、貼り付け幅(a)は表1に示すようにスリット線を形成したこと以外は実施例1と同様に異方性導電フィルムを製造し、リール形状とした。
Claims (16)
- 電子部材間を導電性粒子含有層により導通接続する異方性導電フィルムにおいて、
基材上に、少なくとも導電性粒子がバインダに分散されてなる上記導電性粒子含有層が形成され、
上記基材の長辺方向に対して、角度bを有し、上記導電性粒子含有層を分割するスリット線が少なくとも上記導電性粒子含有層に形成され、
上記角度bは、180度>b>0度(90度を除く)を満たすことを特徴とする異方性導電フィルム。 - 上記スリット線は、上記基材の長辺方向に向かって平行に複数形成されていることを特徴とする請求項1記載の異方性導電フィルム。
- 上記電子部材に貼り付ける上記導電性粒子含有層の貼り付け長さc、上記導電性粒子含有層の貼り付け幅a、上記基材の幅Wが、W<c、且つW>aの関係を満たすことを特徴とする請求項1又は請求項2記載の異方性導電フィルム。
- 上記角度bが、140度≧b≧40度を満たすことを特徴とする請求項1記載の異方性導電フィルム。
- 上記バインダが、エポキシ系樹脂又はアクリル系樹脂であることを特徴とする請求項1記載の異方性導電フィルム。
- 電子部材間を導電性粒子含有層により導通接続する異方性導電フィルムの製造方法において、
基材の一方の面上に、導電性粒子が分散されてなるバインダを塗布し、乾燥して上記基材上に上記導電性粒子含有層を形成し、
上記基材の長辺方向に対して下記の関係を満たす角度bを有し、上記導電性粒子含有層を分割するスリット線を少なくとも上記導電性粒子含有層に形成し、
上記角度bが、180度>b>0度(90度を除く)を満たすことを特徴とする異方性導電フィルムの製造方法。 - 上記スリット線は、上記基材の長辺方向に向かって平行に複数形成することを特徴とする請求項6記載の異方性導電フィルムの製造方法。
- 上記電子部材に貼り付ける上記導電性粒子含有層の貼り付け長さc、上記導電性粒子含有層の貼り付け幅a、上記基材の幅Wが、W<c、且つW>aの関係を満たすことを特徴とする請求項6又は請求項7記載の異方性導電フィルムの製造方法。
- 上記角度bが、140度≧b≧40度を満たすことを特徴とする請求項6記載の異方性導電フィルムの製造方法。
- 上記バインダが、エポキシ樹脂又はアクリル樹脂であることを特徴とする請求項6記載の異方性導電フィルムの製造方法。
- 導電性粒子含有層を介して電子部材間を導通接続させる電子部材間の接続方法において、
基材上に、導電性粒子がバインダに分散されてなる上記導電性粒子含有層が形成され、上記基材の長辺方向に対して、角度bを有し、上記導電性粒子含有層を分割するスリット線が少なくとも上記導電性粒子含有層に形成され、上記角度bが、180度>b>0度(90度を除く)を満たす異方性導電フィルムを用い、
第1の電子部材の端子上に、上記導電性粒子含有層が上記第1の電子部材の端子側となるように上記異方性導電フィルムを配置し、上記異方性導電フィルムを上記第1の電子部材に対して加熱加圧し、上記基材を上記導電性粒子含有層から剥離し、上記第1の電子部材の端子上に上記導電性粒子含有層を仮圧着し、
第2の電子部材の端子が上記導電性粒子含有層上となるように、上記第1の電子部材上に上記第2の電子部材を配置し、
上記第2の電子部材を上記第1の電子部材に対して加熱加圧し、上記第1の電子部材の端子と上記第2の電子部材の端子とを上記導電性粒子含有層で接続し、導通させることを特徴とする電子部材間の接続方法。 - 上記異方性導電フィルムの上記スリット線は、上記基材の長辺方向に向かって平行に複数形成されていることを特徴とする請求項11記載の電子部材間の接続方法。
- 上記第1の電子部材及び第2の電子部材に貼り付ける上記導電性粒子含有層の貼り付け長さc、上記導電性粒子含有層の貼り付け幅a、上記基材の幅Wが、W<c、且つW>aを満たすことを特徴とする請求項11又は請求項12記載の電子部材間の接続方法。
- 上記角度bが、140度≧b≧40度を満たすことを特徴とする請求項11記載の電子部材間の接続方法。
- 上記バインダが、エポキシ樹脂又はアクリル樹脂であることを特徴とする請求項11記載の電子部材間の接続方法。
- 請求項11乃至請求項15のいずれか1項に記載の電子部材間の接続方法により製造した接続構造体。
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JPS55128206A (en) * | 1979-03-27 | 1980-10-03 | Toray Industries | Method of fabricating anisotropic conductive rubber sheet |
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JP2004211018A (ja) * | 2003-01-08 | 2004-07-29 | Hitachi Chem Co Ltd | 接着剤テープ、接着剤テープの製造方法及び接着剤テープの圧着方法 |
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