WO2011145455A1 - セラミック体およびその製造方法 - Google Patents
セラミック体およびその製造方法 Download PDFInfo
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- WO2011145455A1 WO2011145455A1 PCT/JP2011/060511 JP2011060511W WO2011145455A1 WO 2011145455 A1 WO2011145455 A1 WO 2011145455A1 JP 2011060511 W JP2011060511 W JP 2011060511W WO 2011145455 A1 WO2011145455 A1 WO 2011145455A1
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- Prior art keywords
- ceramic
- ceramic body
- electrode layer
- conductor
- monomer
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- 239000000919 ceramic Substances 0.000 title claims abstract description 156
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 239000004020 conductor Substances 0.000 claims abstract description 42
- 239000000178 monomer Substances 0.000 claims abstract description 30
- 239000012530 fluid Substances 0.000 claims abstract description 26
- 229920000642 polymer Polymers 0.000 claims abstract description 17
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 52
- 229910002092 carbon dioxide Inorganic materials 0.000 claims description 26
- 239000001569 carbon dioxide Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 20
- 230000000379 polymerizing effect Effects 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 238000007747 plating Methods 0.000 description 22
- 239000003985 ceramic capacitor Substances 0.000 description 21
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 18
- 230000007547 defect Effects 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 229910052809 inorganic oxide Inorganic materials 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920005575 poly(amic acid) Polymers 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000011148 porous material Substances 0.000 description 3
- 239000005871 repellent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 231100000956 nontoxicity Toxicity 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/008—Thermistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
Definitions
- the present invention generally relates to a ceramic body and a method for manufacturing the same, and more particularly to a chip-type ceramic electronic component such as a multilayer ceramic capacitor and a method for manufacturing the same.
- a multilayer ceramic capacitor which is an example of a ceramic body is manufactured as follows.
- a slurry containing ceramic raw material powder is prepared. This slurry is formed into a sheet to produce a ceramic green sheet. On the surface of the ceramic green sheet, a conductive paste which is a raw material of the internal electrode layer is applied according to a predetermined pattern. This conductive paste is composed of a metal powder, a solvent, and a varnish.
- a plurality of ceramic green sheets coated with a conductive paste are laminated and thermocompression bonded to produce an integrated raw laminate.
- a ceramic laminate is produced.
- a plurality of internal electrode layers are formed inside the ceramic laminate. A part of the end face of the internal electrode layer is exposed on the external surface of the ceramic laminate.
- a conductive paste which is a raw material for the external electrode layer, is applied onto the outer surface of the ceramic laminate from which part of the end face of the internal electrode layer is exposed, and then baked.
- This conductive paste is composed of metal powder, glass frit, solvent and varnish. Thereby, an external electrode layer is formed on the outer surface of the ceramic laminate so as to be electrically connected to the specific internal electrode layer.
- a plating layer is formed on the surface of the external electrode layer as necessary.
- Patent Document 1 Japanese Patent Laid-Open No. 2001-102247 (hereinafter referred to as Patent Document 1), a configuration of a chip-type electronic component for solving the above problem is proposed.
- the chip-type electronic component proposed in Patent Document 1 is a chip-type electronic component in which external terminal electrodes composed of a thick film base conductor layer and a surface plating layer are formed on both ends of a rectangular ceramic base. Further, a member having water repellency is impregnated. In this way, even when the chip-type electronic component is left in a place with high humidity, moisture can be prevented from entering the porous portion of the external terminal electrode. As a result, moisture is prevented from passing through the surface plating layer and the thick film underlying conductor layer and reaching the electronic component body.
- Patent Document 2 Japanese Patent Laid-Open No. 2-301113 proposes a configuration of a multilayer ceramic electronic component and a method for manufacturing the same to solve the above-described problem.
- the multilayer ceramic electronic component proposed in Patent Document 2 defects such as gaps, pores, and pinholes in the ceramic laminate or in the external electrode are filled with an inorganic oxide.
- an external electrode is formed on a ceramic laminate or a ceramic laminate, and then immersed in an organic metal solution such as a metal alkoxide to immerse the ceramic laminate in the ceramic laminate.
- the organic metal is impregnated into an inorganic oxide by heating after impregnating the organic metal into a gap, a pore, a pinhole or the like in the external electrode. By doing so, moisture is prevented from entering the gaps and pores.
- Patent Document 2 the ceramic laminate is immersed in an organic metal solution such as a metal alkoxide to embed an inorganic oxide in a defect such as a gap in the ceramic laminate or the external electrode.
- organic metal solution such as a metal alkoxide
- the inorganic oxide cannot be filled into the fine gaps at the nano level, the effect of suppressing moisture from entering the gaps is insufficient.
- an object of the present invention is to provide a ceramic body capable of more effectively preventing moisture from entering into the gap between the conductor and the ceramic body, and a method for manufacturing the same. It is to be.
- the ceramic body according to the present invention is a ceramic body including a conductor therein, and a polymer is filled in a gap between the conductor and the ceramic body.
- Such a configuration makes it possible to more effectively prevent moisture from entering the gap between the conductor and the ceramic body in the ceramic body including the conductor inside.
- the method for manufacturing a ceramic body according to the present invention is a method for manufacturing a ceramic body including a conductor therein, and includes the following steps.
- (A) A step of allowing a supercritical fluid containing a monomer to enter the gap between the conductor and the ceramic body.
- the supercritical fluid used in the method for producing a ceramic body of the present invention has a high dissolving power like a liquid, the monomer can be dissolved in the supercritical fluid.
- the supercritical fluid has a high diffusion coefficient like gas and is excellent in permeability, the supercritical fluid in which the monomer is dissolved can be infiltrated into nano-scale fine voids.
- the supercritical fluid in which the monomer is dissolved is allowed to pass through the nano-level fine particles existing between the conductor and the ceramic body. It is possible to penetrate into the gap. Then, by polymerizing the monomer, in the step of filling the polymer in the gap between the conductor and the ceramic body, the polymer is filled into the nano-level fine gap existing between the conductor and the ceramic body. Can do.
- the supercritical fluid is preferably carbon dioxide in a supercritical state.
- Carbon dioxide has a critical temperature of 31.1 ° C. and a critical pressure of 7.38 Mpa. Above this critical temperature and above the critical pressure, it becomes supercritical. For this reason, carbon dioxide can be brought into a supercritical state under relatively mild conditions. In addition, carbon dioxide in a supercritical state has no toxicity and is chemically inert, so that high-purity carbon dioxide can be obtained at a low cost and is therefore easy to use. Furthermore, the carbon dioxide in a supercritical state becomes carbon dioxide in a state contained in the atmosphere by setting it to normal temperature and pressure. For this reason, the supercritical carbon dioxide that has entered the gap between the conductor and the ceramic body can be easily removed by releasing it into the atmosphere at normal temperature and pressure.
- the ceramic body is preferably a ceramic laminate including a plurality of laminated ceramic layers and a conductor layer interposed between the plurality of ceramic layers.
- the manufacturing method of the present invention can be applied to a method for manufacturing a ceramic electronic component made of a ceramic laminate.
- the manufacturing method of the present invention when the manufacturing method of the present invention is applied, in an electronic component including a ceramic laminate, before forming the external electrode layer, the polymer is made into a nano-level fine void existing between the conductor and the ceramic body. By filling, it becomes possible to more effectively prevent moisture from entering the gap between the conductor and the ceramic body. Therefore, a substance that inhibits plating deposition does not remain on the surface of the external electrode layer.
- plating deposition defects do not occur on the surface of the external terminal electrode, and defects occur when chip-type electronic components are mounted on a substrate or the like by soldering.
- soldering No.
- the polymer obtained by polymerizing the monomer is preferably polyimide.
- the present invention it is possible to more effectively prevent moisture from entering the gap between the conductor and the ceramic body in the ceramic body including the conductor inside. Accordingly, for example, by applying the present invention to a method for manufacturing a multilayer ceramic electronic component such as a chip-type multilayer ceramic capacitor, a decrease in insulation resistance can be prevented, and the reliability of the multilayer ceramic electronic component is improved. be able to.
- FIG. 1 is a schematic cross-sectional view showing a first manufacturing process of a multilayer ceramic capacitor which is an example of a ceramic body, as an embodiment of the present invention.
- FIG. 6 is a schematic cross-sectional view showing a second manufacturing process of a multilayer ceramic capacitor which is an example of a ceramic body, as one embodiment of the present invention.
- 1 and 2 are cross-sectional views showing a general manufacturing process of a multilayer ceramic capacitor.
- a slurry containing ceramic raw material powder is prepared. This slurry is formed into a sheet to produce a ceramic green sheet. On the surface of the ceramic green sheet, a conductive paste which is a raw material of the internal electrode layer is applied according to a predetermined pattern. This conductive paste is composed of a metal powder, a solvent, and a varnish.
- a plurality of ceramic green sheets coated with a conductive paste are laminated and thermocompression bonded to produce an integrated raw laminate.
- a ceramic laminate 10 as a ceramic body is produced.
- a plurality of internal electrode layers 11 are formed as internal conductors. A part of the end face of the internal electrode layer 11 is exposed on the external surface of the ceramic laminate 10.
- a conductive resin is deposited on the outer surface of the ceramic laminate 10 where a part of the end face of the internal electrode layer 11 is exposed.
- the external electrode layer 12 is formed on the outer surface of the ceramic laminate 10 so as to be electrically connected to the specific internal electrode layer 11.
- the first and second plating layers 13 and 14 are formed on the surface of the external electrode layer 12 as necessary.
- the multilayer ceramic capacitor 1 manufactured in this way includes, for example, a rectangular parallelepiped ceramic multilayer body 10 containing a BaTiO 3 -based compound.
- the ceramic laminated body 10 includes a plurality of (six as an example in the figure) laminated ceramic layers 10a, 10b, 10c, 10d, 10e, 10f and a plurality of ceramic layers 10a, 10b, 10c, 10d, 10e, 10f. And a plurality of internal electrode layers 11 (five as an example in the figure) formed along the interface.
- the internal electrode layer 11 is formed so as to reach the outer surface of the ceramic laminate 10.
- the internal electrode layer 11 drawn to one end face of the ceramic laminate 10 and the internal electrode layer 11 drawn to the other end face have a capacitance within the ceramic laminate 10 via the dielectric ceramic layer. They are arranged alternately so that they can be acquired.
- the conductive material of the internal electrode layer 11 is preferably nickel or a nickel alloy from the viewpoint of cost reduction.
- the external electrode layer is formed on the outer surface of the ceramic laminate 10 and is electrically connected to any one of the internal electrode layers 11 on the end surface. 12 is formed.
- the conductive material contained in the external electrode layer 12 the same conductive material as in the case of the internal electrode layer 11 can be used, and silver, palladium, a silver-palladium alloy, and the like can also be used.
- the external electrode layer 12 is formed from a conductive resin. In the above description, an example of an electrode layer made of a conductive resin is shown as the external electrode layer 12.
- the external electrode layer 12 is not limited to an electrode layer made of a conductive resin, and is a thin film external formed by sputtering. It may be an electrode, an electrode formed by plating, or an electrode formed by another method.
- a first plating layer 13 made of nickel, copper or the like is formed on the external electrode layer 12 as necessary, and a second plating layer 14 made of solder, tin or the like is further formed thereon. It is formed.
- the method for manufacturing a ceramic body of the present invention is applied during the manufacturing process of the multilayer ceramic capacitor shown in FIGS.
- the method for producing a ceramic body according to the present invention includes a supercritical fluid containing a monomer in a gap between an internal electrode layer 11 as a conductor and a ceramic laminate 10 as a ceramic body.
- a supercritical fluid containing a monomer in a gap between an internal electrode layer 11 as a conductor and a ceramic laminate 10 as a ceramic body.
- carbon dioxide in a supercritical state is infiltrated.
- the above manufacturing process is performed inside a predetermined heat and pressure resistant container or the like capable of holding a supercritical fluid.
- the polymer is filled in the space between the internal electrode layer 11 and the ceramic laminate 10 by polymerizing the monomer.
- the supercritical fluid used above has a high dissolving power like a liquid, the monomer can be dissolved in the supercritical fluid.
- the supercritical fluid has a high diffusion coefficient like gas and is excellent in permeability, the supercritical fluid in which the monomer is dissolved can be infiltrated into nano-scale fine voids.
- the supercritical fluid in which the monomer is dissolved is transferred between the internal electrode layer 11 and the ceramic laminate 10. It is possible to infiltrate even nano-level fine voids existing in the. Then, by polymerizing the monomer, in the step of filling the gap between the internal electrode layer 11 and the ceramic laminate 10 with the polymer, the polymer is added to the nano-level existing between the internal electrode layer 11 and the ceramic laminate 10. Even fine voids can be filled.
- the supercritical fluid in which the monomer is dissolved can enter the fine voids, but the polymer produced by polymerizing the monomer does not dissolve in the supercritical fluid and closes the voids.
- the supercritical fluid may be removed after the monomer is polymerized.
- a monomer precursor may be used in place of the monomer.
- a supercritical fluid in which a polymerization initiator or a catalyst is dissolved is allowed to enter the gap, so that after introducing the polymerization initiator or the catalyst in the gap in advance, the supercritical fluid containing the monomer may be allowed to enter the gap.
- a co-solvent may be used to increase the solubility of the monomer in the supercritical fluid.
- examples of the ceramic body including a conductor therein are not limited to the multilayer ceramic capacitor, and examples thereof include a multilayer chip inductor, a multilayer piezoelectric element, a multilayer ceramic substrate, and a multilayer chip thermistor.
- the supercritical fluid is preferably carbon dioxide in a supercritical state.
- Carbon dioxide has a critical temperature of 31.1 ° C. and a critical pressure of 7.38 Mpa. Above this critical temperature and above the critical pressure, it becomes supercritical. For this reason, carbon dioxide can be brought into a supercritical state under relatively mild conditions. In addition, carbon dioxide in a supercritical state has no toxicity and is chemically inert, so that high-purity carbon dioxide can be obtained at a low cost and is therefore easy to use. Furthermore, the carbon dioxide in a supercritical state becomes carbon dioxide in a state contained in the atmosphere by setting it to normal temperature and pressure. For this reason, the carbon dioxide in the supercritical state that has entered the gap between the internal electrode layer 11 and the ceramic laminate 10 can be easily removed by releasing it into the atmosphere at normal temperature and pressure.
- the ceramic body includes a plurality of laminated ceramic layers 10a, 10b, 10c, 10d, 10e, and 10f, and the plurality of ceramic layers 10a, 10b,
- a ceramic laminate 10 including a plurality of internal electrode layers 11 as a conductor layer interposed between 10c, 10d, 10e, and 10f is preferable.
- the manufacturing method of the present invention can be applied to a method of manufacturing a ceramic electronic component including the ceramic laminate 10, for example, a multilayer ceramic capacitor 1.
- a ceramic electronic component including the ceramic laminate 10 for example, a multilayer ceramic capacitor 1.
- the manufacturing method of the present invention is applied, before the external electrode layer 12 is formed in the multilayer ceramic capacitor 1 as an electronic component including the ceramic multilayer body 10, the polymer is added to the internal electrode layer 11 and the ceramic multilayer body 10. It is possible to more effectively prevent moisture from entering into the gap between the internal electrode layer 11 and the ceramic laminate 10 by filling the gap between the nano-level fine gaps existing between them. Therefore, a substance that inhibits plating deposition does not remain on the surface of the external electrode layer 12.
- the present invention when the interface between the internal electrode layer 11 as the conductor layer and the ceramic layers 10a, 10b, 10c, 10d, 10e, and 10f is exposed, the present invention. By applying this manufacturing method, it becomes possible to more effectively prevent moisture from entering the gap between the internal electrode layer 11 and the ceramic laminate 10.
- the polymer obtained by polymerizing the monomer is preferably excellent in heat resistance, insulation reliability in a high temperature / high humidity environment, and is preferably polyimide.
- the fired ceramic laminated body 10 (size 1.0 mm ⁇ 0.5 mm ⁇ 0.5 mm) for the multilayer ceramic capacitor 1 in which internal electrode layers 11 made of nickel are alternately exposed on both end faces. 100 pieces were produced. These ceramic laminates 10 were sealed in a heat and pressure resistant container having an internal volume of 50 ml. Carbon dioxide gas was introduced into the heat and pressure resistant container, and the temperature and pressure in the heat and pressure resistant container were increased to bring the carbon dioxide into a supercritical state, and the temperature in the heat and pressure resistant container was maintained at 120 ° C. and the pressure at 20 MPa.
- the PMDA DMF solution and the ODA DMF solution were each flowed at a flow rate of 5 g / min with a flow rate of 0.5 mL / min while maintaining the temperature in the heat and pressure resistant container at 120 ° C. and the pressure at 20 MPa. Along with carbon dioxide adjusted to, it was introduced into a heat and pressure resistant container.
- PMDA and ODA dissolved in carbon dioxide in a supercritical state are fine defects in the ceramic body, that is, the gap between the internal electrode layer 11 and the ceramic laminate 10, that is, the internal electrode layer 11.
- the ceramic layers 10a, 10b, 10c, 10d, 10e, and 10f it reaches the fine voids that exist at the interface, and is polymerized at the defect portion to generate polyamic acid (PAA).
- PAA polyamic acid
- PAA polyamic acid
- PI polyimide
- the outer surface of the ceramic laminate 10 where a part of the end face of the internal electrode layer 11 is exposed is exposed.
- a conductive resin as a raw material for the external electrode layer 12 was adhered on the surface.
- the external electrode layer 12 was formed on the outer surface of the ceramic laminate 10 so as to be electrically connected to the specific internal electrode layer 11.
- the surface of the external electrode layer 12 is plated with nickel (Ni) as the first plating layer 13 and tin (Sn) as the second plating layer 14 by electroplating. Layers were formed sequentially. In this way, a multilayer ceramic capacitor 1 was produced.
- the fine defect portion of the ceramic body is closed by the polyimide, and the intrusion of moisture can be blocked.
- the life characteristics are improved, that is, the reliability of the multilayer ceramic capacitor 1 is improved.
- a decrease in insulation resistance can be prevented, and the reliability of the multilayer ceramic electronic component can be improved.
- 1 multilayer ceramic capacitor, 10: ceramic laminate, 10a, 10b, 10c, 10d, 10e, 10f: ceramic layer, 11: internal electrode layer, 12: external electrode layer, 13: first plating layer, 14: first 2 plating layers.
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Abstract
Description
Claims (6)
- 内部に導電体を含むセラミック体であって、
導電体とセラミック体の間の空隙にポリマーが充填されている、セラミック体。 - 内部に導電体を含むセラミック体の製造方法であって、
導電体とセラミック体の間の空隙に、モノマーを含む超臨界流体を浸入させるステップと、
前記モノマーを重合させることにより、前記導電体と前記セラミック体の間の空隙にポリマーを充填するステップとを備えた、セラミック体の製造方法。 - 前記超臨界流体は、超臨界状態の二酸化炭素である、請求項2に記載のセラミック体の製造方法。
- 前記セラミック体は、積層された複数のセラミック層と、この複数のセラミック層の間に介在した導電体層とを含むセラミック積層体である、請求項2または請求項3に記載のセラミック体の製造方法。
- 前記セラミック積層体において、前記導電体層と前記セラミック層の間の界面が露出している、請求項4に記載のセラミック体の製造方法。
- 前記モノマーを重合させることにより得られたポリマーが、ポリイミドである、請求項2から請求項5までのいずれか1項に記載のセラミック体の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2012515811A JP5565462B2 (ja) | 2010-05-21 | 2011-05-02 | セラミック体およびその製造方法 |
CN201180024697.0A CN102893349B (zh) | 2010-05-21 | 2011-05-02 | 陶瓷体及其制造方法 |
US13/678,683 US20130076203A1 (en) | 2010-05-21 | 2012-11-16 | Ceramic body and method for producing the same |
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US13/678,683 Continuation US20130076203A1 (en) | 2010-05-21 | 2012-11-16 | Ceramic body and method for producing the same |
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WO2011145455A1 true WO2011145455A1 (ja) | 2011-11-24 |
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PCT/JP2011/060511 WO2011145455A1 (ja) | 2010-05-21 | 2011-05-02 | セラミック体およびその製造方法 |
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US (1) | US20130076203A1 (ja) |
JP (1) | JP5565462B2 (ja) |
CN (1) | CN102893349B (ja) |
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Cited By (1)
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KR20210023440A (ko) * | 2019-08-23 | 2021-03-04 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
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US10622542B2 (en) * | 2014-08-29 | 2020-04-14 | Wisol Co., Ltd. | Stacked piezoelectric ceramic element |
KR101580411B1 (ko) * | 2014-09-22 | 2015-12-23 | 삼성전기주식회사 | 칩 전자부품 및 칩 전자부품의 실장 기판 |
US10903762B2 (en) * | 2015-09-02 | 2021-01-26 | Koninklijke Philips N.V. | Actuator device based on an electroactive or photoactive polymer |
US10770230B2 (en) | 2017-07-04 | 2020-09-08 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method of manufacturing the same |
JP7426771B2 (ja) * | 2018-04-11 | 2024-02-02 | 太陽誘電株式会社 | 積層セラミックコンデンサの製造方法 |
KR102560377B1 (ko) * | 2018-04-25 | 2023-07-27 | 삼성전기주식회사 | 인덕터 |
KR102603410B1 (ko) * | 2019-06-28 | 2023-11-17 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층형 전자부품 및 적층형 전자부품의 제조 방법 |
KR20220098620A (ko) * | 2021-01-04 | 2022-07-12 | 삼성전기주식회사 | 적층형 전자 부품 |
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KR20210023440A (ko) * | 2019-08-23 | 2021-03-04 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
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US11387044B2 (en) | 2019-08-23 | 2022-07-12 | Samsung Electro-Mechanics Co., Ltd. | Multi-layered ceramic capacitor and method of manufacturing the same |
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Also Published As
Publication number | Publication date |
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JPWO2011145455A1 (ja) | 2013-07-22 |
CN102893349B (zh) | 2016-01-20 |
JP5565462B2 (ja) | 2014-08-06 |
US20130076203A1 (en) | 2013-03-28 |
CN102893349A (zh) | 2013-01-23 |
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