WO2011108341A1 - 無線通信デバイス及び無線通信端末 - Google Patents
無線通信デバイス及び無線通信端末 Download PDFInfo
- Publication number
- WO2011108341A1 WO2011108341A1 PCT/JP2011/052596 JP2011052596W WO2011108341A1 WO 2011108341 A1 WO2011108341 A1 WO 2011108341A1 JP 2011052596 W JP2011052596 W JP 2011052596W WO 2011108341 A1 WO2011108341 A1 WO 2011108341A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- antenna pattern
- circuit board
- communication device
- wireless communication
- pattern
- Prior art date
Links
- 238000004891 communication Methods 0.000 title claims abstract description 71
- 239000010410 layer Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 5
- 239000011229 interlayer Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract description 21
- 238000010168 coupling process Methods 0.000 abstract description 21
- 238000005859 coupling reaction Methods 0.000 abstract description 21
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 16
- 230000004048 modification Effects 0.000 description 13
- 238000012986 modification Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 239000003566 sealing material Substances 0.000 description 9
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012762 magnetic filler Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/79—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for data transfer in combination with power transfer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/29—Combinations of different interacting antenna units for giving a desired directional characteristic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Definitions
- the present invention relates to a wireless communication device and a wireless communication terminal, and more particularly to a wireless communication device and a wireless communication terminal used in an RFID (Radio Frequency Identification) system.
- RFID Radio Frequency Identification
- the RFID tag includes a wireless IC that stores predetermined information and processes predetermined wireless signals, and an antenna that transmits and receives high-frequency signals.
- Patent Document 1 describes a wireless IC device used in an RFID system.
- This wireless IC device has a power supply circuit board on which a wireless IC chip is mounted, and this power supply circuit board is mainly magnetically coupled to a radiation plate (antenna pattern).
- the frequency of the transmission / reception signal is determined by the power supply circuit built in the power supply circuit board, the operating frequency is stable without depending on the size of the antenna pattern, the material of the holding member of the device, etc. Frequency characteristics.
- Patent Document 1 discloses, as an example, a wireless IC device in which a power supply circuit board on which a wireless IC chip is mounted is arranged on the surface of a resin film on which an antenna pattern is arranged.
- the antenna pattern has a loop pattern in a part thereof, and the feeder circuit board is disposed at the center of the loop pattern. That is, the antenna pattern and the inductor pattern built in the power supply circuit board are coupled via a magnetic field.
- the magnetic body forms a magnetic field. May be hindered, and the communication distance may be shortened or communication may be poor.
- the mounting position of the power supply circuit board is deviated from the center of the loop pattern, the frequency characteristics may vary.
- an object of the present invention is to provide a wireless communication device and a wireless communication terminal capable of transmitting signals efficiently with a reliable coupling between a loop electrode included in a power supply circuit board and an antenna pattern.
- the wireless communication device is: A wireless IC for processing wireless signals; A power supply circuit board including a loop electrode coupled to the wireless IC and having a coil pattern wound with a predetermined width; An antenna pattern magnetically coupled to the loop electrode; With The feeder circuit board is arranged so that the first region of the loop electrode in which the coil pattern extends in the first direction overlaps the antenna pattern when viewed in plan from the coil axis direction, A second region of the loop electrode in which the coil pattern extends in a second direction opposite to the first direction is arranged so as not to overlap the antenna pattern; The first direction and the line length direction of the antenna pattern match or substantially match, It is characterized by.
- a wireless communication terminal includes the wireless communication device.
- the wireless communication device since the first region of the loop electrode in which the coil pattern extends in the first direction is arranged so as to overlap the antenna pattern, even if another metal body comes close The magnetic field coupling between the loop electrode and the antenna pattern is maintained in the overlapping portion, and there is no problem in coupling the two. In addition, since the first direction and the line length direction of the antenna pattern match or substantially match, the signal is transmitted efficiently.
- the loop electrode included in the feeder circuit board and the antenna pattern are reliably coupled, and the signal can be transmitted efficiently.
- FIG. 1 is a diagram for explaining the principle of the present invention, in which (A) is a comparative example, (B) is a first arrangement example of the present invention, (C) is a second arrangement example of the present invention, and (D) is a first arrangement example of the present invention.
- This is an example of three arrangements.
- 1 shows a wireless communication device according to a first embodiment, wherein (A) is a perspective view, (B) is a cross-sectional view, and (C) is an enlarged cross-sectional view of a main part.
- the antenna pattern which comprises 1st Example is shown, (A) is a front view, (B) is a back view.
- FIG. 2 shows a power supply circuit board as a second example, where (A) is a cross-sectional view and (B) is a cross-sectional view showing a wireless communication device on which the power supply circuit board is mounted. It is sectional drawing which shows the radio
- wireless communication device shown in FIG. 14 is shown, (A) is a front view, (B) is a back view. It is an equivalent circuit diagram of the antenna pattern which is the 2nd example.
- FIG. 1A shows a coupling state as a comparative example.
- a wireless communication device is roughly coupled to a wireless IC chip 10 for processing a wireless signal and the wireless IC chip 10, and coil patterns 21a to 21d have a predetermined width W1.
- an antenna pattern 35 that is magnetically coupled to the loop electrode 20 (including electromagnetic coupling, the same applies hereinafter). The specific shapes of the loop electrode 20 and the antenna pattern 35 will be described in detail in the first embodiment below.
- the loop electrode 20 is arranged so as not to overlap the antenna pattern 35 in plan view. Accordingly, the magnetic field ⁇ 1 due to the antenna pattern 35 is formed as indicated by a dotted line, and the magnetic field ⁇ 2 due to the loop electrode 20 is formed as indicated by a dashed line and is magnetically coupled to each other.
- a metal body is close to the lower side of the antenna pattern 35, a position where communication cannot be performed due to disturbance of the magnetic field, that is, a null point may be formed, and the communication distance may be shortened or communication may be poor.
- the first arrangement example in the wireless communication device according to the present invention is as shown in FIG. 1B when the feeder circuit board 15 is viewed in plan view from the axial direction of the loop electrode 20.
- the width W1 of the first region X extending in the first direction (see FIG. 5) indicated by the arrow x of the coil patterns 21a to 21d is arranged so as to completely overlap the width W2 of the antenna pattern 35.
- the loop electrode 20 and the antenna pattern 35 are coupled by a magnetic field ⁇ 3 indicated by a dotted line, and even if a metal body approaches the antenna pattern 35 below, at least the magnetic fields ⁇ 3a and ⁇ 3b may be disturbed. There is no problem in the coupling between the two. Further, since the first direction and the line length direction of the antenna pattern 35 coincide with each other, the signal is efficiently transmitted.
- the width W1 of the first region X of the loop electrode 20 is arranged so as to be substantially half of the width W2 of the antenna pattern 35.
- This second arrangement example also has the same effect as the first arrangement example.
- the feeder circuit board 15 has openings (inner diameter opening width W3) of the coil patterns 21a to 21d when viewed in plan from the coil axis direction of the loop electrode 20 (coil patterns 21a to 21d). Are arranged so as not to overlap the antenna pattern 35. Therefore, the magnetic flux generated in the coil patterns 21a to 21d is less likely to be blocked by the antenna pattern 35. As a result, it is possible to solve the problem that the inductance value of the coil patterns 21a to 21d fluctuates or the communication distance is shortened due to energy loss due to the decrease in the degree of coupling.
- the width W2 of the antenna pattern 35 is formed wider than the width W1 of the first region X of the loop electrode 20, and the first region X is the antenna pattern. It is arranged so as to be completely included in the 35 width W2.
- This third arrangement example also has the same effect as the first arrangement example.
- the width W2 of the antenna pattern 35 wider than the first region X in this way, even if a slight misalignment occurs when the feeder circuit board 15 is arranged, the first region X is used as the antenna.
- the pattern 35 can be completely included in the width W2.
- the loop-shaped electrode 20 it is necessary to arrange the loop-shaped electrode 20 so that the loop-shaped line of at least one turn, preferably a plurality of turns, fits within the width W2 of the line constituting the antenna pattern 35. Further, when viewed in plan, the antenna pattern 35 may be arranged so that the width W1 of the loop electrode 20 composed of a loop-shaped line of a plurality of turns is all within the width W2 of the line constituting the antenna pattern 35. In this configuration, the degree of coupling between and the loop electrode 20 can be maximized.
- the entire width W1 of the first region X is arranged so as not to straddle each turn of the antenna pattern 35 when viewed in plan from the coil axis direction. If the first region X is arranged across the two turns of the antenna pattern 35, the coil patterns 21a to 21d have portions where currents partially flow in the opposite directions and cancel out the currents. May decrease and the communication distance may decrease. By disposing the first region X so as not to straddle each turn of the antenna pattern 35, these problems can be solved.
- the wireless communication device 1 As shown in FIG. 2, the wireless communication device 1 according to the first embodiment is used in the 13.56 MHz band, and is electrically connected to the wireless IC chip 10 that processes wireless signals and the wireless IC chip 10. And a feeding circuit board 15 including a loop electrode 20 formed by winding coil patterns 21a to 21d with a predetermined width W1 (see FIG. 5), and an antenna pattern 35 magnetically coupled to the loop electrode 20. ing.
- the wireless IC chip 10 includes a clock circuit, a logic circuit, a memory circuit, and the like, and necessary information is stored in the memory. In the wireless IC chip 10, input terminal electrodes and output terminal electrodes provided on the back surface thereof are electrically connected to both ends of the loop electrode 20.
- the antenna pattern 35 is formed by winding three turns in the shape of a coil on the front and back surfaces of a flexible base substrate 36 made of PET or the like, and both ends are opened.
- FIG. The antenna pattern 35 on the side is shown, and FIG. 3B shows the antenna pattern 35 on the back side as seen through from the front side.
- the antenna patterns 35 on the front and back sides have the same line width W2, are overlapped in a plan view and are capacitively coupled via the base substrate 36, and currents flow in the same direction.
- the antenna pattern 35 is formed of a metal material mainly composed of Ag, Cu or the like, and may be formed by patterning a metal film by a photolithography method or an etching method, or may be formed by screen printing a conductive paste. May be.
- the power supply circuit board 15 is a multilayer board, and has a cavity 16 in the center as shown in FIG. 4.
- the wireless IC chip 10 is accommodated in the cavity 16 and filled with a sealing material 17.
- the power supply circuit board 15 has a built-in loop electrode 20 in which a plurality of coil patterns 21a to 21d are laminated in multiple layers. Specifically, as shown in FIG. 5, a plurality of base material layers 18a to 18d are laminated, pressure-bonded, and fired as necessary.
- the base material layers 18a to 18d may be an insulator (dielectric material, magnetic material), a thermoplastic resin such as a liquid crystal polymer, or a thermosetting resin such as an epoxy polymer.
- an opening 25 is formed at the center, and a coil pattern 21a having pads 21a-1 and 21a-2 at both ends is formed.
- an opening 25 is formed at the center, and a coil pattern 21b and pads 22 having pads 21b-1 and 21b-2 are formed at both ends.
- an opening 25 is formed at the center, and a coil pattern 21c and pads 22 having pads 21c-1 and 21c-2 are formed at both ends.
- a coil pattern 21d and a land 23b having a land 23a at one end and a pad 21d-1 at the other end are formed on the lowermost base material layer 18d.
- These coil patterns, pads, and lands are formed of a metal material mainly composed of Ag, Cu, etc., and may be formed by patterning a metal film by a photolithography method or an etching method, or a conductive paste may be screened. It may be formed by printing.
- the pad 21d-1 is connected to the pad 21c-1 of the third layer coil pattern 21c via the interlayer conductor.
- the other end pad 21c-2 of 21c is connected to the pad 21b-1 of the second layer coil pattern 21b through an interlayer conductor.
- the other end pad 21b-2 of the coil pattern 21b is connected to the pad 21a-1 of the uppermost coil pattern 21a through an interlayer conductor.
- the other end pad 21 a-2 of the uppermost coil pattern 21 a is connected to a land 23 b provided on the lowermost layer via an interlayer conductor or pad 22.
- the opening 25 forms a cavity 16, and the wireless IC chip 10 accommodated in the cavity 16 has an input terminal electrode on the land 23b, an output terminal electrode on the land 23a, a solder bump 29 (see FIG. 4), etc. Connected with.
- the rectangular loop electrode 20 is formed in a plan view.
- the predetermined width W1 around which the coil patterns 21a to 21d are wound is a width from the inner peripheral pattern to the outer peripheral pattern.
- the current flows through the coil patterns 21a to 21d in the first direction indicated by the arrow x and in the second direction indicated by the arrow y opposite to the first direction. That is, each of the coil patterns 21a to 21d is wound so that a current flows in the same direction in a portion adjacent to the stacking direction.
- a region extending in the first direction x is referred to as a first region X
- a region extending in the second direction y is a second region Y. Called.
- the feeder circuit board 15 is disposed to face the inner corner portion of the antenna pattern 35 on the front surface (see FIG. 3A), and is attached with an insulating adhesive 19 (see FIG. 3). 6 (A)).
- the arrangement relationship of the loop electrodes 20 in the vertical direction with respect to the antenna pattern 35 is as shown in FIG. 6A.
- the first region X is arranged so as to overlap the antenna pattern 35, and the second region Y is arranged on the antenna pattern 35. Arranged so as not to overlap.
- the first direction x (the line length direction of the coil patterns 21a to 21d) and the line length direction of the antenna pattern 35 coincide with each other.
- the first region X of the loop electrode 20 is magnetically coupled to the antenna pattern 35. Therefore, the high frequency signal radiated from the reader / writer of the RFID system and received by the antenna pattern 35 is supplied to the wireless IC chip 10 via the loop electrode 20, and the wireless IC chip 10 operates. On the other hand, a response signal from the wireless IC chip 10 is transmitted to the antenna pattern 35 via the loop electrode 20 and radiated to the reader / writer.
- the loop electrode 20 forms a resonance circuit having a predetermined frequency by the inductance component and the capacitance component between the lines of the coil patterns 21a to 21d, and serves as an impedance matching circuit between the wireless IC chip 10 and the antenna pattern 35. Also works.
- the loop electrode 20 has its resonance frequency and impedance adjusted by adjusting its electrical length and pattern width.
- the first region X extending in the first direction x of the loop electrode 20 is disposed so as to overlap the antenna pattern 35 and is magnetically coupled. Even if the body is close, the magnetic field coupling between the loop electrode 20 and the antenna pattern 35 is maintained in the overlapping portion, and there is no problem in coupling the two.
- the value of the stray capacitance formed between the loop electrode 20 and the antenna pattern 35 is substantially equal. Therefore, fluctuations in the frequency characteristics can be minimized.
- the first direction x (the line length direction of the coil patterns 21a to 21d) and the line length direction of the antenna pattern 35 coincide with each other, the current flows through the coil patterns 21a to 21d when transmitting a high-frequency signal.
- the induced current is guided to the antenna pattern 35 as an induced current in the line length direction, and high frequency power is efficiently transmitted.
- the line length directions of the coil patterns 21a to 21d and the antenna pattern 35 are not necessarily completely coincident with each other in the magnetic field coupling portion, and may be substantially coincident with each other. In other words, the line length directions of both need not be orthogonal.
- the third direction is a direction orthogonal to the first direction of the loop electrode 20.
- the third region Z extending in () also overlaps with the antenna pattern 35, and the third direction z and the line length direction of the antenna pattern 35 coincide with each other. Thereby, in the two regions of the first region X and the third region Z, the loop electrode 20 and the antenna pattern 35 are magnetically coupled, and the degree of coupling between the two is increased.
- the power supply circuit board 15 can communicate with the reader / writer at a short distance by mounting the wireless IC chip 10 without being combined with the antenna pattern 35.
- the loop electrode 20 functions as a radiating element.
- the height of the wireless communication module 5 is reduced.
- the depth of the cavity 16 is preferably half or more of the thickness of the substrate 15.
- the sealing material 17 occupies most of the inner peripheral portion of the loop electrode 20 (the rigidity of the rigid region 15a is increased), and the stress generated when the flexible region 15b is bent or bent is determined by the cavity 16. Therefore, almost no stress is applied to the bottom surface of the cavity 16, that is, the joint portion with the loop electrode 20 of the wireless IC chip 10.
- the sealing material 17 preferably contains a magnetic filler such as ferrite powder.
- a magnetic filler such as ferrite powder.
- the wireless IC chip 10 for the power supply circuit board 15 adopts various mounting forms other than being housed in a cavity 16 provided on the surface of the board 15 and sealed with a sealing material 17. Can do.
- various modifications of the feeder circuit board will be described.
- the feeder circuit board 15 has a flat plate shape without a cavity, and the wireless IC chip 10 is mounted on a flat surface of the feeder circuit board 15. Although the height is increased by the thickness of the wireless IC chip 10, the step of forming a cavity in the substrate 15 can be omitted. In addition, there is an advantage that the number of turns of the loop electrode 20 is increased by forming a coil pattern in the portion where the cavity is formed.
- the wireless IC chip 10 is accommodated by forming the cavity 16 on the back surface of the feeder circuit board 15 and sealed with the sealing material 17. Note that sealing with the sealing material 17 is not always necessary. This is because the wireless IC chip 10 accommodated in the cavity 16 is protected by sticking the back surface of the power supply circuit board 15 to the base film 36.
- the coil patterns 21e and 21f are provided on the front and back surfaces of the feeder circuit board 15 to form the loop electrode 20, and the wireless IC chip 10 is mounted on the surface of the board 15.
- the feeder circuit board may be a single layer board, and the coil pattern may be formed only on the surface of the single layer board.
- FIG. 6B various forms can be employed for mounting the feeder circuit board 15 on the antenna pattern 35 in addition to mounting on the corner portion of the antenna pattern 35.
- the first region X of the loop electrode 20 is mounted so as to overlap the linear portion of the antenna pattern 35.
- the power feeding circuit board 15 is displaced in the line length direction (see arrow a) of the antenna pattern 35, the frequency characteristics do not change.
- the area of the portion where the loop electrode 20 (coil patterns 21a to 21d) is orthogonal to the line length direction of the antenna pattern 35 and overlaps the antenna pattern 35 is smaller.
- a bent portion 35a is formed in the antenna pattern 35, and three sides of the loop electrode 20 (coil patterns 21a to 21d) are superimposed on the bent portion 35a.
- Region Y does not overlap antenna pattern 35.
- the loop electrodes 20 (coil patterns 21a to 21d) and the antenna pattern 35 are arranged so that the line length directions thereof substantially coincide with each other so that an induced current flows from one to the other in the line length direction. It suffices if they are arranged.
- the feeder circuit board 15A as the second example is formed so that the cavity portion 16 is opened on the back side of the feeder circuit board 15, and the wireless IC chip 10 is formed in the cavity portion 16. It is accommodated and filled with the sealing material 17.
- the power supply circuit board 15A is adhered to the base substrate 36 with an insulating adhesive 19 in a state where the opening of the cavity portion 16 faces the base substrate 36.
- the wireless communication device 1A is adhered to the base substrate 36 with an insulating adhesive 19 in a state where the opening of the cavity portion 16 faces the base substrate 36.
- the effects of the power supply circuit board 15A and the wireless communication device 1A are basically the same as those shown in FIG. 3, and in particular, the bottom surface of the cavity portion 16 (disposed on the top surface in FIG. 13A).
- the wireless IC chip 10 is protected.
- the bottom surface of the power supply circuit board 15 (which is the upper surface in FIG. 13A) has high flatness, suction when the power supply circuit board 15A is mounted on the base base material 36 by vacuum suction using a mounter. Good performance.
- the sealing material 17 slightly protrudes from the cavity portion 16, the protruding portion is not mounted when mounted on the base substrate 36 (when bonded with the adhesive 19). The anchor effect is exhibited, and the feeder circuit board 15 is firmly bonded onto the base substrate 36. In addition, even if the sealing material 17 has a concave shape on the contrary, the anchor effect is exhibited.
- FIGS. 14 to 16 Next, a second embodiment of the wireless communication device on which the power feeding circuit board 15 is mounted will be described.
- the wireless communication device 1B includes a power supply circuit board 15 mounted on a flexible base base material 36A having a circular shape, and on the front and back surfaces of the base base material 36A, FIG.
- An antenna pattern 35A as a second example shown in (B) is formed. Note that the antenna pattern 35A on the back surface side shown in FIG. 15B is seen through from the front surface side.
- the antenna patterns 35A are wound in a circular shape, overlap each other in plan view over almost the entire length, and are capacitively coupled to each other.
- the antenna pattern 35A forms the equivalent circuit shown in FIG.
- Capacitance C3 is generated between the front and back patterns which are coupled by the capacitance C2.
- the operation of the antenna pattern 35A capacitively coupled to each other is the same as that of the antenna pattern 35 shown in FIG. 3, and the current flows in the same direction. Then, the coiled electrode 20 of the feeder circuit board 15 disposed on the surface of the base substrate 36A so as to partially overlap the antenna pattern 35A and the antenna pattern 35A are magnetically coupled. Therefore, the reader / writer antenna and the wireless IC chip 10 can communicate with each other via the antenna pattern 35A.
- the basic operational effects of the wireless communication device 1B are as described in the wireless communication device 1.
- both end portions of the antenna pattern 35A arranged on the front and back sides of the base substrate 36A may be DC coupled by crimping (pouching). May be combined. In short, it is only necessary that the directions of the currents flowing through the antenna patterns 35A on the front and back sides are the same.
- FIG. 17 shows an antenna pattern 35B as a third example.
- the antenna pattern 35B has a substantially circular shape having a rectangular portion 35B ′, is formed on the front and back surfaces of the base substrate 36A, and the antenna pattern on the back surface side is formed so as to overlap the antenna pattern 35B on the front surface side in plan view. Yes.
- the antenna patterns 35B on the front and back surfaces are capacitively coupled to each other, and the equivalent circuit thereof is the same as in FIG.
- the feeder circuit board 15 is mounted along the inner peripheral portion of the rectangular portion 35B ′ on the surface side of the base substrate 36A, and the coiled electrode 20 built in the feeder circuit board 15 is connected to the antenna pattern 35B and the magnetic field. Combine to form a wireless communication device.
- the operational effects of the antenna pattern 35B are as described for the antenna pattern 35A.
- the antenna pattern 35B is coupled to the coiled electrode 20 at three sides, and the amount of coupling between the antenna pattern 35B and the coiled electrode 20 is increased.
- FIG. 18 shows an antenna pattern 35C as a fourth example.
- the antenna pattern 35C has a substantially circular shape having a stepped portion 35C ′, is formed on the front and back surfaces of the base substrate 36A, and the antenna pattern on the back surface side is formed so as to overlap the antenna pattern 35C on the front surface side in plan view. ing.
- the antenna patterns 35C on the front and back surfaces are capacitively coupled to each other, and an equivalent circuit thereof is the same as that in FIG.
- the feeder circuit board 15 is mounted along the inner peripheral portion of the stepped portion 35C ′ on the surface side of the base base material 36A, and the coiled electrode 20 is electromagnetically coupled to the antenna pattern 35C to form a wireless communication device. Constitute.
- the operational effects of the antenna pattern 35C are as described for the antenna pattern 35A.
- the antenna pattern 35C is coupled to the coiled electrode 20 at two sides, and the amount of coupling between the antenna pattern 35C and the coiled electrode 20 is increased.
- FIG. 19 shows an antenna pattern 35D as a fifth example.
- the antenna pattern 35D is basically arranged in the same shape as the antenna pattern 35A shown in FIG. 15, and the outermost turn portion 35D ′ is formed thicker than the other portions. Other configurations and operational effects are basically the same as described in the antenna pattern 35A.
- the coupling capacitance value at the outermost turn portion 35D ′ increases, the resonance frequency of the antenna pattern 35D can be lowered.
- the magnetic flux passage region can be increased without reducing the opening diameter. That is, in the antenna pattern 35D, the resonance frequency can be shifted to the lower side, and the communication distance can be maintained and improved without increasing the overall size.
- FIG. 20 shows an antenna pattern 35E as a sixth example.
- the outermost turn portion 35E ′ is thick like the antenna pattern 35D shown in FIG.
- the antenna pattern 35E forms an equivalent circuit shown in FIG.21, and the inductor L1 formed by the antenna pattern 35E on the front surface side and the inductor L2 formed by the antenna pattern 35E on the back surface side are magnetically coupled to each other.
- DC coupling is made at one end 35E ′′, and the outermost turn portions 35 ′ are coupled by a capacitor C2.
- the operation of the antenna patterns 35E magnetically coupled to each other is the same as that of the antenna pattern 35A shown in FIG.
- the coupling capacitance value at the outermost turn portion 35E ' is increased, so that the resonance frequency of the antenna pattern 35E can be lowered.
- the magnetic flux passage area can be increased without reducing the opening diameter. That is, in the antenna pattern 35E, the resonance frequency can be shifted to the lower side, and the communication distance can be maintained and improved without increasing the overall size.
- FIG. 22 As an example of a wireless communication terminal according to the present invention, an IC card 50 is shown in FIG.
- the IC card 50 has the wireless communication device 1 incorporated therein.
- the wireless communication device and the wireless communication terminal according to the present invention are not limited to the above-described embodiments, and can be variously modified within the scope of the gist.
- the loop electrode has a predetermined width by winding the coil pattern a plurality of turns, but may be wound by one turn to have a predetermined width.
- the coil pattern may be wound in a single layer without being wound in multiple layers.
- the wireless IC may be formed integrally with the inside of the power supply circuit board other than the chip mounted on the power supply circuit board.
- the wireless IC may be mounted as a chip on another substrate disposed in the vicinity of the power supply circuit substrate.
- the wireless communication device can be mounted on various portable products.
- the wireless IC chip and the loop electrode may not be DC-connected (directly connected), and may be coupled via an electromagnetic field. In other words, it only needs to be electrically connected.
- the antenna pattern may have various shapes as long as it plays a role as an antenna. Further, the present invention is not limited to the HF band such as the 13.56 MHz band, and can be used for a UHF band or a SHF band wireless communication device.
- the present invention is useful for a wireless communication device and a wireless communication terminal.
- the loop electrode included in the feeder circuit board and the antenna pattern are surely coupled, and signals can be transmitted efficiently. Are better.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Power Engineering (AREA)
- Details Of Aerials (AREA)
- Near-Field Transmission Systems (AREA)
- Support Of Aerials (AREA)
Abstract
Description
無線信号を処理する無線ICと、
前記無線ICに結合され、コイルパターンが所定幅で巻回されてなるループ状電極を含む給電回路基板と、
前記ループ状電極と磁界結合されたアンテナパターンと、
を備え、
前記給電回路基板は、コイル軸方向から平面視したとき、前記コイルパターンが第1の方向に延在している前記ループ状電極の第1領域が前記アンテナパターンに重なるように配置されており、前記コイルパターンが第1の方向とは反対の第2の方向に延在している前記ループ状電極の第2領域が前記アンテナパターンに重ならないように配置されており、
前記第1の方向と前記アンテナパターンの線路長方向とが一致している又は略一致していること、
を特徴とする。
本発明に係る無線通信デバイスにおける、ループ状電極とアンテナパターンとの結合状態について原理的に説明する。
図2に示すように、第1実施例である無線通信デバイス1は13.56MHz帯に使用されるものであり、無線信号を処理する無線ICチップ10と、無線ICチップ10に電気的に接続され、コイルパターン21a~21dが所定幅W1(図5参照)で巻回されてなるループ状電極20を含む給電回路基板15と、ループ状電極20と磁界結合されたアンテナパターン35と、を備えている。無線ICチップ10は、クロック回路、ロジック回路、メモリ回路などを含み、必要な情報がメモリされている。無線ICチップ10は、その裏面に設けた入力用端子電極及び出力用端子電極をループ状電極20の両端に電気的に接続されている。
給電回路基板15に対する無線ICチップ10は、図4に示したように、基板15の表面に設けたキャビティ16に収容して封止材17で封止する以外に種々の搭載形態を採用することができる。ここで、給電回路基板の種々の変形例について説明する。
アンテナパターン35に対する給電回路基板15の搭載形態は、図6(B)に示したように、アンテナパターン35のコーナー部に搭載する以外に種々の形態を採用することができる。
第2例である給電回路基板15Aは、図13(A)に示すように、キャビティ部16を給電回路基板15の裏面側に開口するように形成し、該キャビティ部16に無線ICチップ10を収容して封止材17を充填したものである。他の構成は前記第1実施例と同様である。この給電回路基板15Aは、図13(B)に示すように、キャビティ部16の開口部分がベース基材36に対向した状態でベース基材36上に絶縁性の接着剤19にて貼着され、無線通信デバイス1Aとされる。
次に、給電回路基板15を搭載した無線通信デバイスの第2実施例について説明する。
図17に第3例であるアンテナパターン35Bを示す。このアンテナパターン35Bは方形部35B'を有する概略円形状をなし、ベース基材36Aの表裏面に形成され、裏面側のアンテナパターンは表面側のアンテナパターン35Bと平面視で重なるように形成されている。表裏面のアンテナパターン35Bは互いに容量結合しており、その等価回路は図16と同様である。
図18に第4例であるアンテナパターン35Cを示す。このアンテナパターン35Cは階段状部35C'を有する概略円形状をなし、ベース基材36Aの表裏面に形成され、裏面側のアンテナパターンは表面側のアンテナパターン35Cと平面視で重なるように形成されている。表裏面のアンテナパターン35Cは互いに容量結合しており、その等価回路は図16と同様である。
図19に第5例であるアンテナパターン35Dを示す。このアンテナパターン35Dは、図15に示したアンテナパターン35Aと基本的には同じ形状に配置され、最外ターン部分35D’が他の部分よりも線太に形成されている。他の構成及び作用効果は基本的には前記アンテナパターン35Aで説明したとおりである。加えて、最外ターン部分35D’での結合容量値が大きくなるため、アンテナパターン35Dの共振周波数を低下させることができる。換言すれば、アンテナパターン35Dでは開口径を小さくしないで磁束の通過領域を大きくできる。つまり、アンテナパターン35Dでは全体のサイズを大きくすることなく、共振周波数の低域側へのシフト、及び、通信距離の維持、向上を実現できる。
図20に第6例であるアンテナパターン35Eを示す。このアンテナパターン35Eは、図19に示したアンテナパターン35Dと同様に最外ターン部分35E'を線太とし、ベース基材36Aの表裏面に配置したアンテナパターン35Eの一端35E”どうしをクリンピング(パウチング)によって直流的に結合したものである。アンテナパターン35Eは図21に示す等価回路を形成し、表面側のアンテナパターン35EによるインダクタL1と裏面側のアンテナパターン35EによるインダクタL2とが互いに磁気結合Mし、かつ、一端35E”で直流的に結合し、最外ターン部分35’どうしは容量C2によって結合されている。
本発明に係る無線通信端末の一例として、図22にICカード50を示す。このICカード50は前記無線通信デバイス1を内蔵させたものである。
なお、本発明に係る無線通信デバイス及び無線通信端末は前記実施例に限定するものではなく、その要旨の範囲内で種々に変更することができる。
10…無線ICチップ
15,15A…給電回路基板
20…ループ状電極
21a~21d…コイルパターン
35,35A~35E…アンテナパターン
X…第1領域
Y…第2領域
Claims (11)
- 無線信号を処理する無線ICと、
前記無線ICに結合され、コイルパターンが所定幅で巻回されてなるループ状電極を含む給電回路基板と、
前記ループ状電極と磁界結合されたアンテナパターンと、
を備え、
前記給電回路基板は、コイル軸方向から平面視したとき、前記コイルパターンが第1の方向に延在している前記ループ状電極の第1領域が前記アンテナパターンに重なるように配置されており、前記コイルパターンが第1の方向とは反対の第2の方向に延在している前記ループ状電極の第2領域が前記アンテナパターンに重ならないように配置されており、
前記第1の方向と前記アンテナパターンの線路長方向とが一致している又は略一致していること、
を特徴とする無線通信デバイス。 - 前記コイルパターンは同一平面にて前記所定幅で複数ターン巻回されていること、を特徴とする請求項1に記載の無線通信デバイス。
- 前記給電回路基板は多層基板からなり、前記コイルパターンは層間導体を介して多層に巻回されていること、を特徴とする請求項1又は請求項2に記載の無線通信デバイス。
- 前記給電回路基板は、コイル軸方向から平面視したとき、前記第1領域の全幅が前記アンテナパターンに重なるように配置されていること、を特徴とする請求項1ないし請求項3のいずれかに記載の無線通信デバイス。
- 前記アンテナパターンの線路幅は前記コイルパターンの所定幅よりも広いこと、を特徴とする請求項4に記載の無線通信デバイス。
- 前記給電回路基板は、コイル軸方向から平面視したとき、前記コイルパターンの開口部が前記アンテナパターンに重ならないように配置されていること、を特徴とする請求項1ないし請求項4のいずれかに記載の無線通信デバイス。
- 前記ループ状電極は、コイル軸方向から平面視したとき、矩形状に形成されていること、を特徴とする請求項1ないし請求項6のいずれかに記載の無線通信デバイス。
- 前記アンテナパターンは同一平面にてコイル状に複数ターン巻回されていること、を特徴とする請求項1ないし請求項7のいずれかに記載の無線通信デバイス。
- 前記給電回路基板は、コイル軸方向から平面視したとき、前記第1領域の全幅が前記アンテナパターンの各ターン跨らないように配置されていること、を特徴とする請求項8に記載の無線通信デバイス。
- 前記給電回路基板は前記アンテナパターンのコーナー部に対向して配置され、
前記ループ状電極の隣接する2辺が、コイル軸方向から平面視したとき、前記アンテナパターンに重なっていること、を特徴とする請求項8に記載の無線通信デバイス。 - 無線通信デバイスを備えた無線通信端末であって、
前記無線通信デバイスは、
無線信号を処理する無線ICと、
前記無線ICに結合され、コイルパターンが所定幅で巻回されてなるループ状電極を含む給電回路基板と、
前記ループ状電極と磁界結合されたアンテナパターンと、
を備え、
前記給電回路基板は、コイル軸方向から平面視したとき、前記コイルパターンが第1の方向に延在している前記ループ状電極の第1領域が前記アンテナパターンに重なるように配置されており、前記コイルパターンが第1の方向とは反対の第2の方向に延在している前記ループ状電極の第2領域が前記アンテナパターンに重ならないように配置されており、
前記第1の方向と前記アンテナパターンの線路長方向とが一致している又は略一致していること、
を特徴とする無線通信端末。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012503049A JP5403146B2 (ja) | 2010-03-03 | 2011-02-08 | 無線通信デバイス及び無線通信端末 |
CN201180011866.7A CN102782937B (zh) | 2010-03-03 | 2011-02-08 | 无线通信器件及无线通信终端 |
US13/600,256 US8602310B2 (en) | 2010-03-03 | 2012-08-31 | Radio communication device and radio communication terminal |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010046539 | 2010-03-03 | ||
JP2010-046539 | 2010-03-03 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/600,256 Continuation US8602310B2 (en) | 2010-03-03 | 2012-08-31 | Radio communication device and radio communication terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011108341A1 true WO2011108341A1 (ja) | 2011-09-09 |
Family
ID=44542007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/052596 WO2011108341A1 (ja) | 2010-03-03 | 2011-02-08 | 無線通信デバイス及び無線通信端末 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8602310B2 (ja) |
JP (1) | JP5403146B2 (ja) |
CN (1) | CN102782937B (ja) |
WO (1) | WO2011108341A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014200086A (ja) * | 2013-03-29 | 2014-10-23 | 株式会社村田製作所 | アンテナ装置 |
US9634714B2 (en) | 2012-10-12 | 2017-04-25 | Murata Manufacturing Co., Ltd. | HF-band wireless communication device |
JPWO2017179562A1 (ja) * | 2016-04-13 | 2019-02-28 | 京セラ株式会社 | Rfidタグおよびrfidシステム |
US10659106B2 (en) | 2017-04-28 | 2020-05-19 | Murata Manufacturing Co., Ltd. | RFID tag |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5652470B2 (ja) | 2010-03-03 | 2015-01-14 | 株式会社村田製作所 | 無線通信モジュール及び無線通信デバイス |
GB2491447B (en) * | 2010-03-24 | 2014-10-22 | Murata Manufacturing Co | RFID system |
WO2014129147A1 (ja) | 2013-02-20 | 2014-08-28 | Necアクセステクニカ株式会社 | アンテナ装置およびその設計方法 |
WO2015166834A1 (ja) * | 2014-04-30 | 2015-11-05 | 株式会社村田製作所 | アンテナ装置および電子機器 |
JP6342369B2 (ja) * | 2015-08-21 | 2018-06-13 | 矢崎総業株式会社 | 電力伝送通信ユニット |
DE102016215273A1 (de) * | 2015-08-21 | 2017-02-23 | Yazaki Corporation | Leistungsübertragungs-kommunikationseinheit |
US10327268B2 (en) * | 2015-09-25 | 2019-06-18 | Intel Corporation | Microelectronic package with wireless interconnect |
CN105170421A (zh) * | 2015-10-23 | 2015-12-23 | 京东方科技集团股份有限公司 | 一种供胶装置 |
JP6643152B2 (ja) * | 2016-03-09 | 2020-02-12 | 京セラ株式会社 | 電子機器 |
US9997102B2 (en) * | 2016-04-19 | 2018-06-12 | X-Celeprint Limited | Wirelessly powered display and system |
US10198890B2 (en) | 2016-04-19 | 2019-02-05 | X-Celeprint Limited | Hybrid banknote with electronic indicia using near-field-communications |
US10522912B2 (en) * | 2016-05-12 | 2019-12-31 | Tdk Corporation | Antenna device and mobile wireless device provided with the same |
CN109417218B (zh) * | 2016-06-22 | 2021-03-12 | 阿莫技术有限公司 | 环形天线模块及用于制造该环形天线模块的夹具 |
JP6776867B2 (ja) | 2016-12-15 | 2020-10-28 | Tdk株式会社 | 配線部品 |
JP1590181S (ja) * | 2017-02-14 | 2017-11-06 | ||
JP6873263B2 (ja) * | 2017-10-30 | 2021-05-19 | 三菱電機株式会社 | 受電装置、及び非接触電力伝送システム |
KR102194290B1 (ko) | 2018-07-23 | 2020-12-22 | 동우 화인켐 주식회사 | 안테나 구조체 및 이를 포함하는 디스플레이 장치 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008167190A (ja) * | 2006-12-28 | 2008-07-17 | Philtech Inc | 基体シート |
JP2008211572A (ja) * | 2007-02-27 | 2008-09-11 | Dainippon Printing Co Ltd | 非接触式データキャリア装置、ブースターアンテナ基板 |
JP2008226099A (ja) * | 2007-03-15 | 2008-09-25 | Dainippon Printing Co Ltd | 非接触式データキャリア装置 |
Family Cites Families (394)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3364564A (en) | 1965-06-28 | 1968-01-23 | Gregory Ind Inc | Method of producing welding studs dischargeable in end-to-end relationship |
JPS6193701A (ja) | 1984-10-13 | 1986-05-12 | Toyota Motor Corp | 自動車用アンテナ装置 |
US5253969A (en) | 1989-03-10 | 1993-10-19 | Sms Schloemann-Siemag Aktiengesellschaft | Feeding system for strip material, particularly in treatment plants for metal strips |
JP2763664B2 (ja) | 1990-07-25 | 1998-06-11 | 日本碍子株式会社 | 分布定数回路用配線基板 |
NL9100176A (nl) | 1991-02-01 | 1992-03-02 | Nedap Nv | Antenne met transformator voor contactloze informatieoverdracht vanuit integrated circuit-kaart. |
NL9100347A (nl) | 1991-02-26 | 1992-03-02 | Nedap Nv | Geintegreerde transformator voor een contactloze identificatiekaart. |
JPH04321190A (ja) | 1991-04-22 | 1992-11-11 | Mitsubishi Electric Corp | 非接触型携帯記憶装置のアンテナ回路 |
DE69215283T2 (de) | 1991-07-08 | 1997-03-20 | Nippon Telegraph & Telephone | Ausfahrbares Antennensystem |
US5491483A (en) | 1994-01-05 | 1996-02-13 | Texas Instruments Incorporated | Single loop transponder system and method |
US6096431A (en) | 1994-07-25 | 2000-08-01 | Toppan Printing Co., Ltd. | Biodegradable cards |
JP3141692B2 (ja) | 1994-08-11 | 2001-03-05 | 松下電器産業株式会社 | ミリ波用検波器 |
US5528222A (en) | 1994-09-09 | 1996-06-18 | International Business Machines Corporation | Radio frequency circuit and memory in thin flexible package |
US5955723A (en) | 1995-05-03 | 1999-09-21 | Siemens Aktiengesellschaft | Contactless chip card |
US5629241A (en) | 1995-07-07 | 1997-05-13 | Hughes Aircraft Company | Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
JP3150575B2 (ja) | 1995-07-18 | 2001-03-26 | 沖電気工業株式会社 | タグ装置及びその製造方法 |
GB2305075A (en) | 1995-09-05 | 1997-03-26 | Ibm | Radio Frequency Tag for Electronic Apparatus |
DE19534229A1 (de) | 1995-09-15 | 1997-03-20 | Licentia Gmbh | Transponderanordnung |
US6104611A (en) | 1995-10-05 | 2000-08-15 | Nortel Networks Corporation | Packaging system for thermally controlling the temperature of electronic equipment |
AUPO055296A0 (en) | 1996-06-19 | 1996-07-11 | Integrated Silicon Design Pty Ltd | Enhanced range transponder system |
AU4705097A (en) | 1996-10-09 | 1998-05-05 | Evc Rigid Film Gmbh | Method and connection arrangement for producing a smart card |
JP3279205B2 (ja) | 1996-12-10 | 2002-04-30 | 株式会社村田製作所 | 表面実装型アンテナおよび通信機 |
JPH10193849A (ja) | 1996-12-27 | 1998-07-28 | Rohm Co Ltd | 回路チップ搭載カードおよび回路チップモジュール |
DE19703029A1 (de) | 1997-01-28 | 1998-07-30 | Amatech Gmbh & Co Kg | Übertragungsmodul für eine Transpondervorrichtung sowie Transpondervorrichtung und Verfahren zum Betrieb einer Transpondervorrichtung |
US6181287B1 (en) | 1997-03-10 | 2001-01-30 | Precision Dynamics Corporation | Reactively coupled elements in circuits on flexible substrates |
DE69831592T2 (de) | 1997-11-14 | 2006-06-22 | Toppan Printing Co. Ltd. | Zusammengesetzte ic-karte |
JP2001084463A (ja) | 1999-09-14 | 2001-03-30 | Miyake:Kk | 共振回路 |
JPH11261325A (ja) | 1998-03-10 | 1999-09-24 | Shiro Sugimura | コイル素子と、その製造方法 |
WO1999050932A1 (fr) | 1998-03-31 | 1999-10-07 | Matsushita Electric Industrial Co., Ltd. | Antenne et televiseur numerique |
JP4260917B2 (ja) | 1998-03-31 | 2009-04-30 | 株式会社東芝 | ループアンテナ |
US5936150A (en) | 1998-04-13 | 1999-08-10 | Rockwell Science Center, Llc | Thin film resonant chemical sensor with resonant acoustic isolator |
AU8588698A (en) | 1998-04-14 | 1999-11-01 | Liberty Carton Company | Container for compressors and other goods |
US6107920A (en) | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US6018299A (en) | 1998-06-09 | 2000-01-25 | Motorola, Inc. | Radio frequency identification tag having a printed antenna and method |
JP2000021639A (ja) | 1998-07-02 | 2000-01-21 | Sharp Corp | インダクター、これを用いた共振回路、整合回路、アンテナ回路及び発振回路 |
JP2000022421A (ja) | 1998-07-03 | 2000-01-21 | Murata Mfg Co Ltd | チップアンテナ及びそれを搭載した無線機器 |
AUPP473898A0 (en) | 1998-07-20 | 1998-08-13 | Integrated Silicon Design Pty Ltd | Metal screened electronic labelling system |
JP2000311226A (ja) | 1998-07-28 | 2000-11-07 | Toshiba Corp | 無線icカード及びその製造方法並びに無線icカード読取り書込みシステム |
EP0977145A3 (en) | 1998-07-28 | 2002-11-06 | Kabushiki Kaisha Toshiba | Radio IC card |
JP2000059260A (ja) | 1998-08-04 | 2000-02-25 | Sony Corp | 記憶装置 |
AU5469099A (en) | 1998-08-14 | 2000-03-06 | 3M Innovative Properties Company | Radio frequency identification systems applications |
JP2002522999A (ja) | 1998-08-14 | 2002-07-23 | スリーエム イノベイティブ プロパティズ カンパニー | 無線周波数識別システムへの用途 |
JP4411670B2 (ja) | 1998-09-08 | 2010-02-10 | 凸版印刷株式会社 | 非接触icカードの製造方法 |
JP4508301B2 (ja) | 1998-09-16 | 2010-07-21 | 大日本印刷株式会社 | 非接触icカード |
JP3632466B2 (ja) | 1998-10-23 | 2005-03-23 | 凸版印刷株式会社 | 非接触icカード用の検査装置および検査方法 |
JP3924962B2 (ja) | 1998-10-30 | 2007-06-06 | 株式会社デンソー | 皿状物品用idタグ |
JP2000137779A (ja) | 1998-10-30 | 2000-05-16 | Hitachi Maxell Ltd | 非接触情報媒体とその製造方法 |
JP2000137785A (ja) | 1998-10-30 | 2000-05-16 | Sony Corp | 非接触型icカードの製造方法および非接触型icカード |
US6837438B1 (en) | 1998-10-30 | 2005-01-04 | Hitachi Maxell, Ltd. | Non-contact information medium and communication system utilizing the same |
JP2000148948A (ja) | 1998-11-05 | 2000-05-30 | Sony Corp | 非接触型icラベルおよびその製造方法 |
JP2000172812A (ja) | 1998-12-08 | 2000-06-23 | Hitachi Maxell Ltd | 非接触情報媒体 |
FR2787640B1 (fr) | 1998-12-22 | 2003-02-14 | Gemplus Card Int | Agencement d'une antenne dans un environnement metallique |
JP3088404B2 (ja) | 1999-01-14 | 2000-09-18 | 埼玉日本電気株式会社 | 移動無線端末および内蔵アンテナ |
JP2000222540A (ja) | 1999-02-03 | 2000-08-11 | Hitachi Maxell Ltd | 非接触型半導体タグ |
JP2000228602A (ja) | 1999-02-08 | 2000-08-15 | Alps Electric Co Ltd | 共振線路 |
JP2000243797A (ja) | 1999-02-18 | 2000-09-08 | Sanken Electric Co Ltd | 半導体ウエハ及びその切断法並びに半導体ウエハ組立体及びその切断法 |
JP3967487B2 (ja) | 1999-02-23 | 2007-08-29 | 株式会社東芝 | Icカード |
JP2000251049A (ja) | 1999-03-03 | 2000-09-14 | Konica Corp | カード及びその製造方法 |
JP4106673B2 (ja) | 1999-03-05 | 2008-06-25 | 株式会社エフ・イー・シー | コイルユニットを使用するアンテナ装置、プリント回路基板 |
JP4349597B2 (ja) | 1999-03-26 | 2009-10-21 | 大日本印刷株式会社 | Icチップの製造方法及びそれを内蔵したメモリー媒体の製造方法 |
JP2000286634A (ja) | 1999-03-30 | 2000-10-13 | Ngk Insulators Ltd | アンテナ装置及びアンテナ装置の製造方法 |
JP3751178B2 (ja) | 1999-03-30 | 2006-03-01 | 日本碍子株式会社 | 送受信機 |
US6542050B1 (en) | 1999-03-30 | 2003-04-01 | Ngk Insulators, Ltd. | Transmitter-receiver |
JP3067764B1 (ja) | 1999-03-31 | 2000-07-24 | 株式会社豊田自動織機製作所 | 移動体通信用結合器、移動体及び移動体の通信方法 |
JP2000321984A (ja) | 1999-05-12 | 2000-11-24 | Hitachi Ltd | Rf−idタグ付きラベル |
JP3557130B2 (ja) | 1999-07-14 | 2004-08-25 | 新光電気工業株式会社 | 半導体装置の製造方法 |
JP2001043340A (ja) | 1999-07-29 | 2001-02-16 | Toppan Printing Co Ltd | 複合icカード |
US6259369B1 (en) | 1999-09-30 | 2001-07-10 | Moore North America, Inc. | Low cost long distance RFID reading |
JP2001101369A (ja) | 1999-10-01 | 2001-04-13 | Matsushita Electric Ind Co Ltd | Rfタグ |
JP3451373B2 (ja) | 1999-11-24 | 2003-09-29 | オムロン株式会社 | 電磁波読み取り可能なデータキャリアの製造方法 |
JP4186149B2 (ja) | 1999-12-06 | 2008-11-26 | 株式会社エフ・イー・シー | Icカード用の補助アンテナ |
JP2001188890A (ja) | 2000-01-05 | 2001-07-10 | Omron Corp | 非接触タグ |
JP2001209767A (ja) | 2000-01-27 | 2001-08-03 | Hitachi Maxell Ltd | 非接触icモジュールを備えた被アクセス体 |
US7334734B2 (en) | 2000-01-27 | 2008-02-26 | Hitachi Maxwell, Ltd. | Non-contact IC module |
JP2001240046A (ja) | 2000-02-25 | 2001-09-04 | Toppan Forms Co Ltd | 容器及びその製造方法 |
JP4514880B2 (ja) | 2000-02-28 | 2010-07-28 | 大日本印刷株式会社 | 書籍の配送、返品および在庫管理システム |
JP2001257292A (ja) | 2000-03-10 | 2001-09-21 | Hitachi Maxell Ltd | 半導体装置 |
JP2001256457A (ja) | 2000-03-13 | 2001-09-21 | Toshiba Corp | 半導体装置及びその製造方法、icカード通信システム |
JP2003529163A (ja) | 2000-03-28 | 2003-09-30 | ルカトロン アーゲー | 共振周波数を調整する部材を有するrfidラベル |
JP4624537B2 (ja) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | 非接触式データキャリア装置、収納体 |
JP4624536B2 (ja) | 2000-04-04 | 2011-02-02 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
JP2001291181A (ja) | 2000-04-07 | 2001-10-19 | Ricoh Elemex Corp | センサ装置及びセンサシステム |
JP2001319380A (ja) | 2000-05-11 | 2001-11-16 | Mitsubishi Materials Corp | Rfid付光ディスク |
JP2001331976A (ja) | 2000-05-17 | 2001-11-30 | Casio Comput Co Ltd | 光記録型記録媒体 |
JP4223174B2 (ja) | 2000-05-19 | 2009-02-12 | Dxアンテナ株式会社 | フィルムアンテナ |
JP2001339226A (ja) | 2000-05-26 | 2001-12-07 | Nec Saitama Ltd | アンテナ装置 |
JP2001344574A (ja) | 2000-05-30 | 2001-12-14 | Mitsubishi Materials Corp | 質問器のアンテナ装置 |
JP2001352176A (ja) | 2000-06-05 | 2001-12-21 | Fuji Xerox Co Ltd | 多層プリント配線基板および多層プリント配線基板製造方法 |
JP2003536302A (ja) | 2000-06-06 | 2003-12-02 | バッテル メモリアル インスティテュート | 遠隔通信のシステムおよび方法 |
JP2001358527A (ja) | 2000-06-12 | 2001-12-26 | Matsushita Electric Ind Co Ltd | アンテナ装置 |
JP2002157564A (ja) | 2000-11-21 | 2002-05-31 | Toyo Aluminium Kk | Icカード用アンテナコイルとその製造方法 |
EP1172760B1 (en) | 2000-06-23 | 2004-12-01 | Toyo Aluminium Kabushiki Kaisha | Antenna coil for IC card and manufacturing method thereof |
CN1233104C (zh) | 2000-07-04 | 2005-12-21 | 克里蒂帕斯株式会社 | 无源型发射机应答器识别*** |
JP4138211B2 (ja) | 2000-07-06 | 2008-08-27 | 株式会社村田製作所 | 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置 |
JP2002024776A (ja) | 2000-07-07 | 2002-01-25 | Nippon Signal Co Ltd:The | Icカード用リーダライタ |
WO2002007078A1 (fr) | 2000-07-19 | 2002-01-24 | Hanex Co., Ltd. | Structure de logement et d'installation d'etiquette d'identification et procede de communication d'une telle etiquette |
RU2163739C1 (ru) | 2000-07-20 | 2001-02-27 | Криштопов Александр Владимирович | Антенна |
JP2002042076A (ja) | 2000-07-21 | 2002-02-08 | Dainippon Printing Co Ltd | 非接触型データキャリア及び非接触型データキャリアを有する冊子 |
JP2002042083A (ja) | 2000-07-27 | 2002-02-08 | Hitachi Maxell Ltd | 非接触通信式情報担体 |
JP3075400U (ja) | 2000-08-03 | 2001-02-16 | 昌栄印刷株式会社 | 非接触型icカード |
JP2002063557A (ja) | 2000-08-21 | 2002-02-28 | Mitsubishi Materials Corp | Rfid用タグ |
JP2002076750A (ja) | 2000-08-24 | 2002-03-15 | Murata Mfg Co Ltd | アンテナ装置およびそれを備えた無線機 |
JP3481575B2 (ja) | 2000-09-28 | 2003-12-22 | 寛児 川上 | アンテナ |
JP4615695B2 (ja) | 2000-10-19 | 2011-01-19 | 三星エスディーエス株式会社 | Icカード用のicモジュールと、それを使用するicカード |
US6634564B2 (en) | 2000-10-24 | 2003-10-21 | Dai Nippon Printing Co., Ltd. | Contact/noncontact type data carrier module |
JP4628611B2 (ja) | 2000-10-27 | 2011-02-09 | 三菱マテリアル株式会社 | アンテナ |
JP4432254B2 (ja) | 2000-11-20 | 2010-03-17 | 株式会社村田製作所 | 表面実装型アンテナ構造およびそれを備えた通信機 |
JP2002185358A (ja) | 2000-11-24 | 2002-06-28 | Supersensor Pty Ltd | 容器にrfトランスポンダを装着する方法 |
JP4641096B2 (ja) | 2000-12-07 | 2011-03-02 | 大日本印刷株式会社 | 非接触式データキャリア装置とブースターアンテナ部用配線部材 |
JP2002183676A (ja) | 2000-12-08 | 2002-06-28 | Hitachi Ltd | 情報読み取り装置 |
JP2002183690A (ja) | 2000-12-11 | 2002-06-28 | Hitachi Maxell Ltd | 非接触icタグ装置 |
AU2002226093A1 (en) | 2000-12-15 | 2002-06-24 | Electrox Corp. | Process for the manufacture of novel, inexpensive radio frequency identificationdevices |
JP3788325B2 (ja) | 2000-12-19 | 2006-06-21 | 株式会社村田製作所 | 積層型コイル部品及びその製造方法 |
TW531976B (en) | 2001-01-11 | 2003-05-11 | Hanex Co Ltd | Communication apparatus and installing structure, manufacturing method and communication method |
JP3621655B2 (ja) | 2001-04-23 | 2005-02-16 | 株式会社ハネックス中央研究所 | Rfidタグ構造及びその製造方法 |
JP2002280821A (ja) | 2001-01-12 | 2002-09-27 | Furukawa Electric Co Ltd:The | アンテナ装置および端末機器 |
KR20020061103A (ko) | 2001-01-12 | 2002-07-22 | 후루까와덴끼고오교 가부시끼가이샤 | 안테나 장치 및 이 안테나 장치가 부착된 단말기기 |
JP2002232221A (ja) | 2001-01-30 | 2002-08-16 | Alps Electric Co Ltd | 送受信ユニット |
JPWO2002061675A1 (ja) | 2001-01-31 | 2004-06-03 | 株式会社ルネサステクノロジ | 非接触識別媒体 |
JP4662400B2 (ja) | 2001-02-05 | 2011-03-30 | 大日本印刷株式会社 | コイルオンチップ型の半導体モジュール付き物品 |
JP2002246828A (ja) | 2001-02-15 | 2002-08-30 | Mitsubishi Materials Corp | トランスポンダのアンテナ |
WO2002071547A1 (en) | 2001-03-02 | 2002-09-12 | Koninklijke Philips Electronics N.V. | Module and electronic device |
JP4712986B2 (ja) | 2001-03-06 | 2011-06-29 | 大日本印刷株式会社 | Rfidタグ付き液体容器 |
JP3772778B2 (ja) | 2001-03-30 | 2006-05-10 | 三菱マテリアル株式会社 | アンテナコイル及びそれを用いた識別タグ、リーダライタ装置、リーダ装置及びライタ装置 |
JP2002298109A (ja) | 2001-03-30 | 2002-10-11 | Toppan Forms Co Ltd | 非接触型icメディアおよびその製造方法 |
JP3570386B2 (ja) | 2001-03-30 | 2004-09-29 | 松下電器産業株式会社 | 無線機能内蔵携帯用情報端末 |
JP2002308437A (ja) | 2001-04-16 | 2002-10-23 | Dainippon Printing Co Ltd | Rfidタグを用いた検査システム |
JP2002319812A (ja) | 2001-04-20 | 2002-10-31 | Oji Paper Co Ltd | データキャリヤ貼着方法 |
JP4700831B2 (ja) | 2001-04-23 | 2011-06-15 | 株式会社ハネックス | Rfidタグの通信距離拡大方法 |
JP2005236339A (ja) | 2001-07-19 | 2005-09-02 | Oji Paper Co Ltd | Icチップ実装体 |
FI112550B (fi) | 2001-05-31 | 2003-12-15 | Rafsec Oy | Älytarra ja älytarraraina |
JP2002362613A (ja) | 2001-06-07 | 2002-12-18 | Toppan Printing Co Ltd | 非接触icが積層された積層包装材及びこれを用いた包装容器、並びに包装容器の開封検出方法 |
JP2002366917A (ja) | 2001-06-07 | 2002-12-20 | Hitachi Ltd | アンテナを内蔵するicカード |
JP4710174B2 (ja) | 2001-06-13 | 2011-06-29 | 株式会社村田製作所 | バランス型lcフィルタ |
JP4882167B2 (ja) | 2001-06-18 | 2012-02-22 | 大日本印刷株式会社 | 非接触icチップ付きカード一体型フォーム |
JP2002373029A (ja) | 2001-06-18 | 2002-12-26 | Hitachi Ltd | Icタグによるソフトウェアの不正コピーの防止方法 |
JP4759854B2 (ja) | 2001-06-19 | 2011-08-31 | 株式会社寺岡精工 | Icタグの金属物への装着方法及びicタグ内蔵マーカー |
JP2003087008A (ja) | 2001-07-02 | 2003-03-20 | Ngk Insulators Ltd | 積層型誘電体フィルタ |
JP4058919B2 (ja) | 2001-07-03 | 2008-03-12 | 日立化成工業株式会社 | 非接触式icラベル、非接触式icカード、非接触式icラベルまたは非接触式icカード用icモジュール |
JP2003026177A (ja) | 2001-07-12 | 2003-01-29 | Toppan Printing Co Ltd | 非接触方式icチップ付き包装体 |
JP2003030612A (ja) | 2001-07-19 | 2003-01-31 | Oji Paper Co Ltd | Icチップ実装体 |
JP4670195B2 (ja) | 2001-07-23 | 2011-04-13 | 凸版印刷株式会社 | 非接触式icカードを備えた携帯電話機用筐体 |
EP1280350B1 (en) | 2001-07-26 | 2007-11-07 | Irdeto Access B.V. | Time validation system |
JP3629448B2 (ja) | 2001-07-27 | 2005-03-16 | Tdk株式会社 | アンテナ装置及びそれを備えた電子機器 |
JP2003069335A (ja) | 2001-08-28 | 2003-03-07 | Hitachi Kokusai Electric Inc | 補助アンテナ |
JP2003067711A (ja) | 2001-08-29 | 2003-03-07 | Toppan Forms Co Ltd | Icチップ実装体あるいはアンテナ部を備えた物品 |
JP2003078333A (ja) | 2001-08-30 | 2003-03-14 | Murata Mfg Co Ltd | 無線通信機 |
JP2003078336A (ja) | 2001-08-30 | 2003-03-14 | Tokai Univ | 積層スパイラルアンテナ |
JP4514374B2 (ja) | 2001-09-05 | 2010-07-28 | トッパン・フォームズ株式会社 | Rf−idの検査システム |
JP4747467B2 (ja) | 2001-09-07 | 2011-08-17 | 大日本印刷株式会社 | 非接触icタグ |
JP2003085520A (ja) | 2001-09-11 | 2003-03-20 | Oji Paper Co Ltd | Icカードの製造方法 |
JP4845306B2 (ja) | 2001-09-25 | 2011-12-28 | トッパン・フォームズ株式会社 | Rf−idの検査システム |
JP2003099184A (ja) | 2001-09-25 | 2003-04-04 | Sharp Corp | 情報処理システム、それに用いる情報処理装置および入力ペン |
JP4698096B2 (ja) | 2001-09-25 | 2011-06-08 | トッパン・フォームズ株式会社 | Rf−idの検査システム |
JP2003110344A (ja) | 2001-09-26 | 2003-04-11 | Hitachi Metals Ltd | 表面実装型アンテナおよびそれを搭載したアンテナ装置 |
JP2003132330A (ja) | 2001-10-25 | 2003-05-09 | Sato Corp | Rfidラベルプリンタ |
JP2003134007A (ja) | 2001-10-30 | 2003-05-09 | Auto Network Gijutsu Kenkyusho:Kk | 車載機器間における信号送受信システム及び車載機器間における信号送受信方法 |
JP3984458B2 (ja) | 2001-11-20 | 2007-10-03 | 大日本印刷株式会社 | Icタグ付き包装体の製造方法 |
JP3908514B2 (ja) | 2001-11-20 | 2007-04-25 | 大日本印刷株式会社 | Icタグ付き包装体とicタグ付き包装体の製造方法 |
US6812707B2 (en) | 2001-11-27 | 2004-11-02 | Mitsubishi Materials Corporation | Detection element for objects and detection device using the same |
JP3894540B2 (ja) | 2001-11-30 | 2007-03-22 | トッパン・フォームズ株式会社 | 導電接続部を有するインターポーザ |
JP2003188338A (ja) | 2001-12-13 | 2003-07-04 | Sony Corp | 回路基板装置及びその製造方法 |
JP3700777B2 (ja) | 2001-12-17 | 2005-09-28 | 三菱マテリアル株式会社 | Rfid用タグの電極構造及び該電極を用いた共振周波数の調整方法 |
JP2003188620A (ja) | 2001-12-19 | 2003-07-04 | Murata Mfg Co Ltd | モジュール一体型アンテナ |
JP4028224B2 (ja) | 2001-12-20 | 2007-12-26 | 大日本印刷株式会社 | 非接触通信機能を有する紙製icカード用基材 |
JP3895175B2 (ja) | 2001-12-28 | 2007-03-22 | Ntn株式会社 | 誘電性樹脂統合アンテナ |
JP2003209421A (ja) | 2002-01-17 | 2003-07-25 | Dainippon Printing Co Ltd | 透明アンテナを有するrfidタグ、及びその製造方法 |
JP3915092B2 (ja) | 2002-01-21 | 2007-05-16 | 株式会社エフ・イー・シー | Icカード用のブースタアンテナ |
JP2003216919A (ja) | 2002-01-23 | 2003-07-31 | Toppan Forms Co Ltd | Rf−idメディア |
JP3815337B2 (ja) * | 2002-01-28 | 2006-08-30 | 株式会社デンソーウェーブ | 非接触式icカード |
JP2003233780A (ja) | 2002-02-06 | 2003-08-22 | Mitsubishi Electric Corp | データ通信装置 |
JP3998992B2 (ja) | 2002-02-14 | 2007-10-31 | 大日本印刷株式会社 | ウェブに実装されたicチップへのアンテナパターン形成方法とicタグ付き包装体 |
JP2003243918A (ja) | 2002-02-18 | 2003-08-29 | Dainippon Printing Co Ltd | 非接触icタグ用アンテナと非接触icタグ |
JP2003249813A (ja) | 2002-02-25 | 2003-09-05 | Tecdia Kk | ループアンテナ付きrfid用タグ |
US7119693B1 (en) | 2002-03-13 | 2006-10-10 | Celis Semiconductor Corp. | Integrated circuit with enhanced coupling |
JP2003288560A (ja) | 2002-03-27 | 2003-10-10 | Toppan Forms Co Ltd | 帯電防止機能を有するインターポーザおよびインレットシート |
US7129834B2 (en) | 2002-03-28 | 2006-10-31 | Kabushiki Kaisha Toshiba | String wireless sensor and its manufacturing method |
JP2003309418A (ja) | 2002-04-17 | 2003-10-31 | Alps Electric Co Ltd | ダイポールアンテナ |
JP2003309401A (ja) | 2002-04-17 | 2003-10-31 | Mitsubishi Electric Corp | フィルタ回路およびこのフィルタ回路を用いた周波数逓倍回路 |
JP2003317060A (ja) | 2002-04-22 | 2003-11-07 | Dainippon Printing Co Ltd | Icカード |
JP2003317052A (ja) | 2002-04-24 | 2003-11-07 | Smart Card:Kk | Icタグシステム |
JP3879098B2 (ja) | 2002-05-10 | 2007-02-07 | 株式会社エフ・イー・シー | Icカード用のブースタアンテナ |
JP3979178B2 (ja) | 2002-05-14 | 2007-09-19 | 凸版印刷株式会社 | 非接触ic媒体用モジュール及び非接触ic媒体 |
US6753814B2 (en) | 2002-06-27 | 2004-06-22 | Harris Corporation | Dipole arrangements using dielectric substrates of meta-materials |
JP3863464B2 (ja) | 2002-07-05 | 2006-12-27 | 株式会社ヨコオ | フィルタ内蔵アンテナ |
JP3803085B2 (ja) | 2002-08-08 | 2006-08-02 | 株式会社日立製作所 | 無線icタグ |
JP4107381B2 (ja) | 2002-08-23 | 2008-06-25 | 横浜ゴム株式会社 | 空気入りタイヤ |
JP2004096566A (ja) | 2002-09-02 | 2004-03-25 | Toenec Corp | 誘導通信装置 |
JP3925364B2 (ja) | 2002-09-03 | 2007-06-06 | 株式会社豊田中央研究所 | アンテナ及びダイバーシチ受信装置 |
AU2003272420A1 (en) | 2002-09-20 | 2004-04-08 | Fairchild Semiconductor Corporation | Rfid tag wide bandwidth logarithmic spiral antenna method and system |
JP3975918B2 (ja) | 2002-09-27 | 2007-09-12 | ソニー株式会社 | アンテナ装置 |
JP2004126750A (ja) | 2002-09-30 | 2004-04-22 | Toppan Forms Co Ltd | 情報書込/読出装置、アンテナ及びrf−idメディア |
JP3958667B2 (ja) | 2002-10-16 | 2007-08-15 | 株式会社日立国際電気 | リーダライタ用ループアンテナ、及びそれを備えた物品管理棚及び図書管理システム |
CN1706099A (zh) | 2002-10-17 | 2005-12-07 | 安比恩特公司 | 对用于通信的电力线进行分段的滤波器 |
JP3659956B2 (ja) | 2002-11-11 | 2005-06-15 | 松下電器産業株式会社 | 圧力測定装置および圧力測定システム |
JP2004213582A (ja) | 2003-01-09 | 2004-07-29 | Mitsubishi Materials Corp | Rfidタグ及びリーダ/ライタ並びに該タグを備えたrfidシステム |
JP2004234595A (ja) | 2003-02-03 | 2004-08-19 | Matsushita Electric Ind Co Ltd | 情報記録媒体読取装置 |
US7250910B2 (en) | 2003-02-03 | 2007-07-31 | Matsushita Electric Industrial Co., Ltd. | Antenna apparatus utilizing minute loop antenna and radio communication apparatus using the same antenna apparatus |
EP1445821A1 (en) | 2003-02-06 | 2004-08-11 | Matsushita Electric Industrial Co., Ltd. | Portable radio communication apparatus provided with a boom portion |
US7225992B2 (en) | 2003-02-13 | 2007-06-05 | Avery Dennison Corporation | RFID device tester and method |
JP2004253858A (ja) | 2003-02-18 | 2004-09-09 | Minerva:Kk | Icタグ用のブースタアンテナ装置 |
JP2004280390A (ja) | 2003-03-14 | 2004-10-07 | Toppan Forms Co Ltd | Rf−idメディア及びrf−idメディアの製造方法 |
JP4010263B2 (ja) | 2003-03-14 | 2007-11-21 | 富士電機ホールディングス株式会社 | アンテナ、及びデータ読取装置 |
JP4034676B2 (ja) | 2003-03-20 | 2008-01-16 | 日立マクセル株式会社 | 非接触通信式情報担体 |
JP2004297249A (ja) | 2003-03-26 | 2004-10-21 | Matsushita Electric Ind Co Ltd | 異相線間カプラーとその装着方法、及び、異相線間のカップリング方法 |
JP4097139B2 (ja) | 2003-03-26 | 2008-06-11 | Necトーキン株式会社 | 無線タグ |
JP2004297681A (ja) | 2003-03-28 | 2004-10-21 | Toppan Forms Co Ltd | 非接触型情報記録媒体 |
JP2004304370A (ja) | 2003-03-28 | 2004-10-28 | Sony Corp | アンテナコイル及び通信機器 |
JP4208631B2 (ja) | 2003-04-17 | 2009-01-14 | 日本ミクロン株式会社 | 半導体装置の製造方法 |
JP2004326380A (ja) | 2003-04-24 | 2004-11-18 | Dainippon Printing Co Ltd | Rfidタグ |
JP2004334268A (ja) | 2003-04-30 | 2004-11-25 | Dainippon Printing Co Ltd | 紙片icタグと紙片icタグ付き書籍・雑誌、紙片icタグ付き書籍 |
JP2004336250A (ja) | 2003-05-02 | 2004-11-25 | Taiyo Yuden Co Ltd | アンテナ整合回路、アンテナ整合回路を有する移動体通信装置、アンテナ整合回路を有する誘電体アンテナ |
JP2004343000A (ja) | 2003-05-19 | 2004-12-02 | Fujikura Ltd | 半導体モジュールとそれを備えた非接触icタグ及び半導体モジュールの製造方法 |
JP2004362190A (ja) | 2003-06-04 | 2004-12-24 | Hitachi Ltd | 半導体装置 |
JP4828088B2 (ja) | 2003-06-05 | 2011-11-30 | 凸版印刷株式会社 | Icタグ |
JP2005005866A (ja) | 2003-06-10 | 2005-01-06 | Alps Electric Co Ltd | アンテナ一体型モジュール |
JP2005033461A (ja) | 2003-07-11 | 2005-02-03 | Mitsubishi Materials Corp | Rfidシステム及び該システムにおけるアンテナの構造 |
JP2005064799A (ja) | 2003-08-11 | 2005-03-10 | Toppan Printing Co Ltd | 携帯型情報端末機器用rfidアンテナ |
JP3982476B2 (ja) | 2003-10-01 | 2007-09-26 | ソニー株式会社 | 通信システム |
JP4062233B2 (ja) | 2003-10-20 | 2008-03-19 | トヨタ自動車株式会社 | ループアンテナ装置 |
JP4680489B2 (ja) | 2003-10-21 | 2011-05-11 | 三菱電機株式会社 | 情報記録読取システム |
JP3570430B1 (ja) | 2003-10-29 | 2004-09-29 | オムロン株式会社 | ループコイルアンテナ |
JP4402426B2 (ja) | 2003-10-30 | 2010-01-20 | 大日本印刷株式会社 | 温度変化感知検出システム |
JP4343655B2 (ja) | 2003-11-12 | 2009-10-14 | 株式会社日立製作所 | アンテナ |
JP4451125B2 (ja) | 2003-11-28 | 2010-04-14 | シャープ株式会社 | 小型アンテナ |
JP4177241B2 (ja) | 2003-12-04 | 2008-11-05 | 株式会社日立情報制御ソリューションズ | 無線icタグ用アンテナ、無線icタグ及び無線icタグ付き容器 |
JP2005165839A (ja) | 2003-12-04 | 2005-06-23 | Nippon Signal Co Ltd:The | リーダライタ、icタグ、物品管理装置、及び光ディスク装置 |
US6999028B2 (en) | 2003-12-23 | 2006-02-14 | 3M Innovative Properties Company | Ultra high frequency radio frequency identification tag |
JP4326936B2 (ja) | 2003-12-24 | 2009-09-09 | シャープ株式会社 | 無線タグ |
EP1548674A1 (en) | 2003-12-25 | 2005-06-29 | Hitachi, Ltd. | Radio IC tag, method and apparatus for manufacturing the same |
JP2005210676A (ja) | 2003-12-25 | 2005-08-04 | Hitachi Ltd | 無線用icタグ、無線用icタグの製造方法、及び、無線用icタグの製造装置 |
EP1703586A4 (en) | 2003-12-25 | 2008-01-23 | Mitsubishi Materials Corp | ANTENNA DEVICE AND COMMUNICATION DEVICE |
JP4089680B2 (ja) | 2003-12-25 | 2008-05-28 | 三菱マテリアル株式会社 | アンテナ装置 |
JP4218519B2 (ja) | 2003-12-26 | 2009-02-04 | 戸田工業株式会社 | 磁界アンテナ、それを用いて構成したワイヤレスシステムおよび通信システム |
JP2005190417A (ja) | 2003-12-26 | 2005-07-14 | Taketani Shoji:Kk | 固定物管理システム及びこのシステムに用いる個体識別子 |
JP4174801B2 (ja) | 2004-01-15 | 2008-11-05 | 株式会社エフ・イー・シー | 識別タグのリーダライタ用アンテナ |
FR2865329B1 (fr) | 2004-01-19 | 2006-04-21 | Pygmalyon | Dispositif recepteur-emetteur passif alimente par une onde electromagnetique |
JP2005210223A (ja) | 2004-01-20 | 2005-08-04 | Tdk Corp | アンテナ装置 |
EP1706857A4 (en) | 2004-01-22 | 2011-03-09 | Mikoh Corp | Modular High Frequency Identification Labeling Method |
KR101270180B1 (ko) | 2004-01-30 | 2013-05-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 검사장치 및 검사방법과, 반도체장치 제작방법 |
JP4271591B2 (ja) | 2004-01-30 | 2009-06-03 | 双信電機株式会社 | アンテナ装置 |
JP2005229474A (ja) | 2004-02-16 | 2005-08-25 | Olympus Corp | 情報端末装置 |
JP4393228B2 (ja) | 2004-02-27 | 2010-01-06 | シャープ株式会社 | 小型アンテナ及びそれを備えた無線タグ |
JP2005252853A (ja) | 2004-03-05 | 2005-09-15 | Fec Inc | Rf−id用アンテナ |
WO2005091434A1 (ja) | 2004-03-24 | 2005-09-29 | Uchida Yoko Co.,Ltd. | 記録媒体用icタグ貼付シート及び記録媒体 |
JP2005275870A (ja) | 2004-03-25 | 2005-10-06 | Matsushita Electric Ind Co Ltd | 挿入型無線通信媒体装置および電子機器 |
JP2005284352A (ja) | 2004-03-26 | 2005-10-13 | Toshiba Corp | 携帯可能電子装置 |
JP2005284455A (ja) | 2004-03-29 | 2005-10-13 | Fujita Denki Seisakusho:Kk | Rfidシステム |
JP4067510B2 (ja) | 2004-03-31 | 2008-03-26 | シャープ株式会社 | テレビジョン受信装置 |
JP2005293537A (ja) | 2004-04-05 | 2005-10-20 | Fuji Xynetics Kk | Icタグ付き段ボ−ル |
US8139759B2 (en) | 2004-04-16 | 2012-03-20 | Panasonic Corporation | Line state detecting apparatus and transmitting apparatus and receiving apparatus of balanced transmission system |
JP2005311205A (ja) | 2004-04-23 | 2005-11-04 | Nec Corp | 半導体装置 |
JP2005340759A (ja) | 2004-04-27 | 2005-12-08 | Sony Corp | アンテナモジュール用磁芯部材、アンテナモジュールおよびこれを備えた携帯情報端末 |
JP2005322119A (ja) | 2004-05-11 | 2005-11-17 | Ic Brains Co Ltd | Icタグ付き物品の不正持ち出し防止装置 |
JP2005321305A (ja) | 2004-05-10 | 2005-11-17 | Murata Mfg Co Ltd | 電子部品測定治具 |
JP4360276B2 (ja) | 2004-06-02 | 2009-11-11 | 船井電機株式会社 | 無線icタグを有する光ディスク及び光ディスク再生装置 |
US7317396B2 (en) | 2004-05-26 | 2008-01-08 | Funai Electric Co., Ltd. | Optical disc having RFID tag, optical disc apparatus, and system for preventing unauthorized copying |
JP4551122B2 (ja) | 2004-05-26 | 2010-09-22 | 株式会社岩田レーベル | Rfidラベルの貼付装置 |
JP2005345802A (ja) | 2004-06-03 | 2005-12-15 | Casio Comput Co Ltd | 撮像装置、この撮像装置に用いられる交換ユニット、交換ユニット使用制御方法及びプログラム |
JP4348282B2 (ja) | 2004-06-11 | 2009-10-21 | 株式会社日立製作所 | 無線用icタグ、及び無線用icタグの製造方法 |
JP2005352858A (ja) | 2004-06-11 | 2005-12-22 | Hitachi Maxell Ltd | 通信式記録担体 |
JP4530140B2 (ja) | 2004-06-28 | 2010-08-25 | Tdk株式会社 | 軟磁性体及びそれを用いたアンテナ装置 |
JP4359198B2 (ja) | 2004-06-30 | 2009-11-04 | 株式会社日立製作所 | Icタグ実装基板の製造方法 |
JP4328682B2 (ja) | 2004-07-13 | 2009-09-09 | 富士通株式会社 | 光記録媒体用の無線タグアンテナ構造および無線タグアンテナ付き光記録媒体の収納ケース |
JP2006033312A (ja) | 2004-07-15 | 2006-02-02 | Matsushita Electric Ind Co Ltd | アンテナ及びアンテナ取り付け方法 |
JP2004362602A (ja) | 2004-07-26 | 2004-12-24 | Hitachi Ltd | Rfidタグ |
JP2006039947A (ja) | 2004-07-27 | 2006-02-09 | Daido Steel Co Ltd | 複合磁性シート |
JP2006050200A (ja) | 2004-08-04 | 2006-02-16 | Matsushita Electric Ind Co Ltd | リーダライタ |
JP4653440B2 (ja) | 2004-08-13 | 2011-03-16 | 富士通株式会社 | Rfidタグおよびその製造方法 |
JP4186895B2 (ja) | 2004-09-01 | 2008-11-26 | 株式会社デンソーウェーブ | 非接触通信装置用コイルアンテナおよびその製造方法 |
JP2005129019A (ja) | 2004-09-03 | 2005-05-19 | Sony Chem Corp | Icカード |
US20060055531A1 (en) | 2004-09-14 | 2006-03-16 | Honeywell International, Inc. | Combined RF tag and SAW sensor |
JP4600742B2 (ja) | 2004-09-30 | 2010-12-15 | ブラザー工業株式会社 | 印字ヘッド及びタグラベル作成装置 |
JP2006107296A (ja) | 2004-10-08 | 2006-04-20 | Dainippon Printing Co Ltd | 非接触icタグおよび非接触icタグ用アンテナ |
GB2419779A (en) | 2004-10-29 | 2006-05-03 | Hewlett Packard Development Co | Document having conductive tracks for coupling to a memory tag and a reader |
US20070268113A1 (en) | 2004-11-05 | 2007-11-22 | Johnson Daniel R | Detunable Rf Tags |
JP4088797B2 (ja) | 2004-11-18 | 2008-05-21 | 日本電気株式会社 | Rfidタグ |
JP2006148518A (ja) | 2004-11-19 | 2006-06-08 | Matsushita Electric Works Ltd | 非接触icカードの調整装置および調整方法 |
JP2006151402A (ja) | 2004-11-25 | 2006-06-15 | Rengo Co Ltd | 無線タグを備えた段ボール箱 |
US7545328B2 (en) | 2004-12-08 | 2009-06-09 | Electronics And Telecommunications Research Institute | Antenna using inductively coupled feeding method, RFID tag using the same and antenna impedance matching method thereof |
JP4281683B2 (ja) | 2004-12-16 | 2009-06-17 | 株式会社デンソー | Icタグの取付構造 |
JP4942998B2 (ja) | 2004-12-24 | 2012-05-30 | 株式会社半導体エネルギー研究所 | 半導体装置及び半導体装置の作製方法 |
JP4541246B2 (ja) | 2004-12-24 | 2010-09-08 | トッパン・フォームズ株式会社 | 非接触icモジュール |
WO2006068286A1 (en) | 2004-12-24 | 2006-06-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4737505B2 (ja) | 2005-01-14 | 2011-08-03 | 日立化成工業株式会社 | Icタグインレット及びicタグインレットの製造方法 |
JP4711692B2 (ja) | 2005-02-01 | 2011-06-29 | 富士通株式会社 | メアンダラインアンテナ |
JP2006232292A (ja) | 2005-02-22 | 2006-09-07 | Nippon Sheet Glass Co Ltd | 電子タグ付き容器およびrfidシステム |
JP2006237674A (ja) | 2005-02-22 | 2006-09-07 | Suncall Corp | パッチアンテナ及びrfidインレット |
JP2006238282A (ja) | 2005-02-28 | 2006-09-07 | Matsushita Electric Ind Co Ltd | アンテナユニット、送受信装置、無線タグ読み取り装置、及び無線タグ読み取りシステム |
JP4639857B2 (ja) | 2005-03-07 | 2011-02-23 | 富士ゼロックス株式会社 | Rfidタグが取り付けられた物品を収納する収納箱、その配置方法、通信方法、通信確認方法および包装構造。 |
US8615368B2 (en) | 2005-03-10 | 2013-12-24 | Gen-Probe Incorporated | Method for determining the amount of an analyte in a sample |
JP4330575B2 (ja) | 2005-03-17 | 2009-09-16 | 富士通株式会社 | タグアンテナ |
JP4437965B2 (ja) | 2005-03-22 | 2010-03-24 | Necトーキン株式会社 | 無線タグ |
JP4087859B2 (ja) | 2005-03-25 | 2008-05-21 | 東芝テック株式会社 | 無線タグ |
JP2006270681A (ja) | 2005-03-25 | 2006-10-05 | Sony Corp | 携帯機器 |
JP2006287659A (ja) | 2005-03-31 | 2006-10-19 | Tdk Corp | アンテナ装置 |
EP1865574B1 (en) | 2005-04-01 | 2015-06-17 | Fujitsu Frontech Limited | Rfid tag applicable to metal and rfid tag section of the same |
JP4750450B2 (ja) | 2005-04-05 | 2011-08-17 | 富士通株式会社 | Rfidタグ |
JP2006302219A (ja) | 2005-04-25 | 2006-11-02 | Fujita Denki Seisakusho:Kk | Rfidタグ通信範囲設定装置 |
JP2008535372A (ja) | 2005-04-26 | 2008-08-28 | イー.エム.ダブリュ.アンテナ カンパニー リミテッド | 帯域阻止特性を有する超広帯域アンテナ |
JP4452865B2 (ja) | 2005-04-28 | 2010-04-21 | 智三 太田 | 無線icタグ装置及びrfidシステム |
JP4529786B2 (ja) | 2005-04-28 | 2010-08-25 | 株式会社日立製作所 | 信号処理回路、及びこれを用いた非接触icカード並びにタグ |
US8111143B2 (en) | 2005-04-29 | 2012-02-07 | Hewlett-Packard Development Company, L.P. | Assembly for monitoring an environment |
JP4740645B2 (ja) | 2005-05-17 | 2011-08-03 | 富士通株式会社 | 半導体装置の製造方法 |
US7688272B2 (en) | 2005-05-30 | 2010-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP4255931B2 (ja) | 2005-06-01 | 2009-04-22 | 日本電信電話株式会社 | 非接触ic媒体及び制御装置 |
JP2007007888A (ja) | 2005-06-28 | 2007-01-18 | Oji Paper Co Ltd | 非接触icチップ実装体装着ダンボールおよびその製造方法 |
JP4286813B2 (ja) | 2005-07-08 | 2009-07-01 | 富士通株式会社 | アンテナ及びこれを搭載するrfid用タグ |
JP2007040702A (ja) | 2005-07-29 | 2007-02-15 | Oki Electric Ind Co Ltd | 半導体集積回路、無線タグ及びセンサ |
JP4720348B2 (ja) | 2005-08-04 | 2011-07-13 | パナソニック株式会社 | Rf−idリーダーライター装置用アンテナ及びそれを用いたrf−idリーダーライター装置並びにrf−idシステム |
JP4737716B2 (ja) | 2005-08-11 | 2011-08-03 | ブラザー工業株式会社 | 無線タグic回路保持体、タグテープロール、無線タグカートリッジ |
JP4801951B2 (ja) | 2005-08-18 | 2011-10-26 | 富士通フロンテック株式会社 | Rfidタグ |
DE102005042444B4 (de) | 2005-09-06 | 2007-10-11 | Ksw Microtec Ag | Anordnung für eine RFID - Transponder - Antenne |
JP4384102B2 (ja) | 2005-09-13 | 2009-12-16 | 株式会社東芝 | 携帯無線機およびアンテナ装置 |
JP4075919B2 (ja) | 2005-09-29 | 2008-04-16 | オムロン株式会社 | アンテナユニットおよび非接触icタグ |
JP4826195B2 (ja) | 2005-09-30 | 2011-11-30 | 大日本印刷株式会社 | Rfidタグ |
JP2007116347A (ja) | 2005-10-19 | 2007-05-10 | Mitsubishi Materials Corp | タグアンテナ及び携帯無線機 |
JP4774273B2 (ja) | 2005-10-31 | 2011-09-14 | 株式会社サトー | Rfidラベルおよびrfidラベルの貼付方法 |
JP2007159083A (ja) | 2005-11-09 | 2007-06-21 | Alps Electric Co Ltd | アンテナ整合回路 |
JP2007150642A (ja) | 2005-11-28 | 2007-06-14 | Hitachi Ulsi Systems Co Ltd | 無線タグ用質問器、無線タグ用アンテナ、無線タグシステムおよび無線タグ選別装置 |
JP2007150868A (ja) | 2005-11-29 | 2007-06-14 | Renesas Technology Corp | 電子装置およびその製造方法 |
US7573388B2 (en) | 2005-12-08 | 2009-08-11 | The Kennedy Group, Inc. | RFID device with augmented grain |
JP4560480B2 (ja) | 2005-12-13 | 2010-10-13 | Necトーキン株式会社 | 無線タグ |
JP4815211B2 (ja) | 2005-12-22 | 2011-11-16 | 株式会社サトー | Rfidラベルおよびrfidラベルの貼付方法 |
JP4848764B2 (ja) | 2005-12-26 | 2011-12-28 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
JP4123306B2 (ja) | 2006-01-19 | 2008-07-23 | 株式会社村田製作所 | 無線icデバイス |
US7519328B2 (en) | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
EP2375494B1 (en) | 2006-01-19 | 2018-06-27 | Murata Manufacturing Co., Ltd. | Wireless IC device |
WO2007086130A1 (ja) | 2006-01-27 | 2007-08-02 | Totoku Electric Co., Ltd. | タグ装置、トランシーバ装置およびタグシステム |
CN101385196B (zh) | 2006-02-19 | 2012-07-25 | 日本写真印刷株式会社 | 带天线壳体的馈电结构 |
EP1988491B1 (en) | 2006-02-22 | 2014-05-07 | Toyo Seikan Group Holdings, Ltd. | Base material for rfid tag adapted to metallic material |
JP4524674B2 (ja) | 2006-02-23 | 2010-08-18 | ブラザー工業株式会社 | 無線タグ通信システムの質問器 |
JP4026080B2 (ja) | 2006-02-24 | 2007-12-26 | オムロン株式会社 | アンテナ、およびrfidタグ |
JP5055478B2 (ja) | 2006-02-28 | 2012-10-24 | 凸版印刷株式会社 | Icタグ |
KR20080098412A (ko) | 2006-03-06 | 2008-11-07 | 미쓰비시덴키 가부시키가이샤 | Rfid태그, rfid태그의 제조 방법 및 rfid태그의 설치 방법 |
JP2007241789A (ja) | 2006-03-10 | 2007-09-20 | Ic Brains Co Ltd | 無線タグリーダ/ライタ、通信装置及び通信システム |
JP3933191B1 (ja) | 2006-03-13 | 2007-06-20 | 株式会社村田製作所 | 携帯電子機器 |
JP2007287128A (ja) | 2006-03-22 | 2007-11-01 | Orient Sokki Computer Kk | 非接触ic媒体 |
JP4735368B2 (ja) | 2006-03-28 | 2011-07-27 | 富士通株式会社 | 平面アンテナ |
JP4854362B2 (ja) | 2006-03-30 | 2012-01-18 | 富士通株式会社 | Rfidタグ及びその製造方法 |
JP4927625B2 (ja) | 2006-03-31 | 2012-05-09 | ニッタ株式会社 | 磁気シールドシート、非接触icカード通信改善方法および非接触icカード収容容器 |
CN101416353B (zh) | 2006-04-10 | 2013-04-10 | 株式会社村田制作所 | 无线集成电路设备 |
CN102780085A (zh) | 2006-04-14 | 2012-11-14 | 株式会社村田制作所 | 天线 |
EP2009736B1 (en) | 2006-04-14 | 2016-01-13 | Murata Manufacturing Co. Ltd. | Wireless ic device |
RU2386169C2 (ru) | 2006-04-26 | 2010-04-10 | Мурата Мэньюфэкчуринг Ко., Лтд. | Изделие с модулем электромагнитной связи |
US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
WO2007125752A1 (ja) | 2006-04-26 | 2007-11-08 | Murata Manufacturing Co., Ltd. | 給電回路基板付き物品 |
US20080068132A1 (en) | 2006-05-16 | 2008-03-20 | Georges Kayanakis | Contactless radiofrequency device featuring several antennas and related antenna selection circuit |
US7589675B2 (en) | 2006-05-19 | 2009-09-15 | Industrial Technology Research Institute | Broadband antenna |
JP2007324865A (ja) | 2006-05-31 | 2007-12-13 | Sony Chemical & Information Device Corp | アンテナ回路及びトランスポンダ |
WO2007138857A1 (ja) | 2006-06-01 | 2007-12-06 | Murata Manufacturing Co., Ltd. | 無線icデバイス及び無線icデバイス用複合部品 |
JP4957724B2 (ja) | 2006-07-11 | 2012-06-20 | 株式会社村田製作所 | アンテナ及び無線icデバイス |
JP2008033716A (ja) | 2006-07-31 | 2008-02-14 | Sankyo Kk | コイン型rfidタグ |
KR100797172B1 (ko) | 2006-08-08 | 2008-01-23 | 삼성전자주식회사 | 정합회로가 일체로 형성된 루프 안테나 |
JP4836899B2 (ja) | 2006-09-05 | 2011-12-14 | パナソニック株式会社 | 磁性体ストライプ状配列シート、rfid磁性シート、電磁遮蔽シートおよびそれらの製造方法 |
US7981528B2 (en) | 2006-09-05 | 2011-07-19 | Panasonic Corporation | Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same |
JP2008083867A (ja) | 2006-09-26 | 2008-04-10 | Matsushita Electric Works Ltd | メモリカード用ソケット |
JP2008092131A (ja) | 2006-09-29 | 2008-04-17 | Tdk Corp | アンテナ素子及び携帯情報端末 |
JP2008098993A (ja) | 2006-10-12 | 2008-04-24 | Dx Antenna Co Ltd | アンテナ装置 |
JP4913529B2 (ja) | 2006-10-13 | 2012-04-11 | トッパン・フォームズ株式会社 | Rfidメディア |
JP2008107947A (ja) | 2006-10-24 | 2008-05-08 | Toppan Printing Co Ltd | Rfidタグ |
DE102006057369A1 (de) | 2006-12-04 | 2008-06-05 | Airbus Deutschland Gmbh | RFID-Etikett, sowie dessen Verwendung und ein damit gekennzeichnetes Objekt |
US8237622B2 (en) | 2006-12-28 | 2012-08-07 | Philtech Inc. | Base sheet |
US7886315B2 (en) | 2007-01-30 | 2011-02-08 | Sony Corporation | Optical disc case, optical disc tray, card member, and manufacturing method |
JP2008207875A (ja) | 2007-01-30 | 2008-09-11 | Sony Corp | 光ディスクケース、光ディスクトレイ、カード部材、および製造方法 |
JP2008197714A (ja) | 2007-02-08 | 2008-08-28 | Dainippon Printing Co Ltd | 非接触データキャリア装置及び非接触データキャリア用補助アンテナ |
JP5061657B2 (ja) | 2007-03-05 | 2012-10-31 | 大日本印刷株式会社 | 非接触式データキャリア装置 |
JP5024372B2 (ja) | 2007-04-06 | 2012-09-12 | 株式会社村田製作所 | 無線icデバイス |
CN101657938B (zh) | 2007-04-13 | 2014-05-14 | 株式会社村田制作所 | 磁场耦合型天线、磁场耦合型天线模块及磁场耦合型天线装置、及这些的制造方法 |
CN101568934A (zh) | 2007-05-10 | 2009-10-28 | 株式会社村田制作所 | 无线ic器件 |
WO2008140037A1 (ja) | 2007-05-11 | 2008-11-20 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
JP2008288845A (ja) * | 2007-05-17 | 2008-11-27 | Nippon Telegr & Teleph Corp <Ntt> | 読み書き装置 |
JP4770792B2 (ja) | 2007-05-18 | 2011-09-14 | パナソニック電工株式会社 | アンテナ装置 |
JP4885093B2 (ja) | 2007-06-11 | 2012-02-29 | 株式会社タムラ製作所 | ブースターアンテナコイル |
JP2009017284A (ja) | 2007-07-05 | 2009-01-22 | Panasonic Corp | アンテナ装置 |
KR101023582B1 (ko) | 2007-07-09 | 2011-03-21 | 가부시키가이샤 무라타 세이사쿠쇼 | 무선 ic 디바이스 |
CN101578616A (zh) | 2007-07-17 | 2009-11-11 | 株式会社村田制作所 | 无线ic器件及电子设备 |
WO2009011423A1 (ja) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
WO2009011376A1 (ja) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | 無線icデバイス |
US7830311B2 (en) | 2007-07-18 | 2010-11-09 | Murata Manufacturing Co., Ltd. | Wireless IC device and electronic device |
US20090021352A1 (en) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Radio frequency ic device and electronic apparatus |
JP4702336B2 (ja) | 2007-08-10 | 2011-06-15 | 株式会社デンソーウェーブ | 携帯型rfidタグ読取器 |
JP2009110144A (ja) | 2007-10-29 | 2009-05-21 | Oji Paper Co Ltd | コイン型rfidタグ |
KR101082702B1 (ko) | 2007-12-20 | 2011-11-15 | 가부시키가이샤 무라타 세이사쿠쇼 | 무선 ic 디바이스 |
JP2009182630A (ja) | 2008-01-30 | 2009-08-13 | Dainippon Printing Co Ltd | ブースタアンテナ基板、ブースタアンテナ基板シート及び非接触式データキャリア装置 |
WO2009110381A1 (ja) | 2008-03-03 | 2009-09-11 | 株式会社村田製作所 | 無線icデバイス及び無線通信システム |
JP4404166B2 (ja) | 2008-03-26 | 2010-01-27 | 株式会社村田製作所 | 無線icデバイス |
JP4535209B2 (ja) | 2008-04-14 | 2010-09-01 | 株式会社村田製作所 | 無線icデバイス、電子機器及び無線icデバイスの共振周波数の調整方法 |
EP2840648B1 (en) | 2008-05-21 | 2016-03-23 | Murata Manufacturing Co., Ltd. | Wireless IC device |
KR101148534B1 (ko) * | 2008-05-28 | 2012-05-21 | 가부시키가이샤 무라타 세이사쿠쇼 | 무선 ic 디바이스용 부품 및 무선 ic 디바이스 |
JP4557186B2 (ja) | 2008-06-25 | 2010-10-06 | 株式会社村田製作所 | 無線icデバイスとその製造方法 |
JP2010050844A (ja) | 2008-08-22 | 2010-03-04 | Sony Corp | ループアンテナ及び通信装置 |
JP5319313B2 (ja) | 2008-08-29 | 2013-10-16 | 峰光電子株式会社 | ループアンテナ |
JP4618459B2 (ja) | 2008-09-05 | 2011-01-26 | オムロン株式会社 | Rfidタグ、rfidタグセット及びrfidシステム |
JP3148168U (ja) | 2008-10-21 | 2009-02-05 | 株式会社村田製作所 | 無線icデバイス |
-
2011
- 2011-02-08 WO PCT/JP2011/052596 patent/WO2011108341A1/ja active Application Filing
- 2011-02-08 JP JP2012503049A patent/JP5403146B2/ja active Active
- 2011-02-08 CN CN201180011866.7A patent/CN102782937B/zh active Active
-
2012
- 2012-08-31 US US13/600,256 patent/US8602310B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008167190A (ja) * | 2006-12-28 | 2008-07-17 | Philtech Inc | 基体シート |
JP2008211572A (ja) * | 2007-02-27 | 2008-09-11 | Dainippon Printing Co Ltd | 非接触式データキャリア装置、ブースターアンテナ基板 |
JP2008226099A (ja) * | 2007-03-15 | 2008-09-25 | Dainippon Printing Co Ltd | 非接触式データキャリア装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9634714B2 (en) | 2012-10-12 | 2017-04-25 | Murata Manufacturing Co., Ltd. | HF-band wireless communication device |
JP2014200086A (ja) * | 2013-03-29 | 2014-10-23 | 株式会社村田製作所 | アンテナ装置 |
JPWO2017179562A1 (ja) * | 2016-04-13 | 2019-02-28 | 京セラ株式会社 | Rfidタグおよびrfidシステム |
US10659106B2 (en) | 2017-04-28 | 2020-05-19 | Murata Manufacturing Co., Ltd. | RFID tag |
Also Published As
Publication number | Publication date |
---|---|
US8602310B2 (en) | 2013-12-10 |
JP5403146B2 (ja) | 2014-01-29 |
US20120325915A1 (en) | 2012-12-27 |
CN102782937B (zh) | 2016-02-17 |
CN102782937A (zh) | 2012-11-14 |
JPWO2011108341A1 (ja) | 2013-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5403146B2 (ja) | 無線通信デバイス及び無線通信端末 | |
JP5652470B2 (ja) | 無線通信モジュール及び無線通信デバイス | |
US11392784B2 (en) | RFID system | |
JP5376060B2 (ja) | アンテナ及びrfidデバイス | |
JP5660188B2 (ja) | 無線通信モジュール | |
US9165240B2 (en) | Coupling in and to RFID smart cards | |
US8366009B2 (en) | Coupling in and to RFID smart cards | |
KR101006808B1 (ko) | 무선 ic 디바이스 | |
WO2013035821A1 (ja) | アンテナ装置および無線デバイス | |
US10476147B2 (en) | Antenna device and method of manufacturing the same | |
KR20140082648A (ko) | Rfid 스마트 카드에서/에 대한 커플링 개선 | |
JP5672874B2 (ja) | 無線icタグ及びrfidシステム | |
JP5655602B2 (ja) | アンテナおよびrfidデバイス | |
JP2013141164A (ja) | アンテナ装置および通信端末装置 | |
JP5637004B2 (ja) | 半導体集積回路モジュール、無線通信モジュール及び無線通信デバイス | |
JP5630166B2 (ja) | 無線icタグ及びrfidシステム | |
JP6555320B2 (ja) | 無線icタグ及びrfidシステム | |
JP5983724B2 (ja) | 無線icタグ及びrfidシステム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201180011866.7 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11750454 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2012503049 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11750454 Country of ref document: EP Kind code of ref document: A1 |