Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/18—Printed circuits structurally associated with non-printed electric components
  • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
  • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B60—VEHICLES IN GENERAL
  • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
  • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
  • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
  • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
  • B60R16/0239—Electronic boxes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/28—Applying non-metallic protective coatings
  • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K5/00—Casings, cabinets or drawers for electric apparatus
  • H05K5/06—Hermetically-sealed casings
  • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K5/00—Casings, cabinets or drawers for electric apparatus
  • H05K5/06—Hermetically-sealed casings
  • H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
  • H05K2203/1178—Means for venting or for letting gases escape
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
  • H05K2203/1305—Moulding and encapsulation
  • H05K2203/1316—Moulded encapsulation of mounted components
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
  • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Definitions

• the invention relates to a circuit module according to the preamble of independent claim 1 and a method for producing such a circuit module according to the preamble of independent claim 8.
• Control units are well known for controlling a variety of functions and facilities and are used in the automotive sector increasingly to control a variety of functions of a motor vehicle.
• control units Motor vehicles leads to a significantly increasing number of control units. This increasingly requires the use of smaller and lighter as well as less expensive control devices. Such control units could thus also be used in future in middle-class vehicles or in small cars or in motorized two-wheeled vehicles.
• Control devices have so far on a circuit module, which consists of a circuit substrate, such as a printed circuit board or a ceramic substrate, electrical / electronic components and a housing. Due to the ever increasing demands on robustness, such as corrosion resistance and temperature resistance, new embodiments of the circuit modules are required.
• the housing of the circuit module is increasingly designed as a protective ground surrounding the circuit carrier and the components.
• the protective compound of the circuit carrier and the components are usually potted with a hard potting material or a thermosetting plastic, for example by thermal transfer molding overmolded.
• the patent application DE 102 52 755 A1 describes a circuit module which comprises a circuit carrier, a circuit mounted on the circuit carrier and a discrete component, the circuit being surrounded by a protective compound.
• a protective compound In order to protect the discrete component from the stress in the preparation of the protective composition, this has a protective sheath surrounding the discrete component.
• the protective compound covers both the circuit and the discrete component surrounded by the protective jacket.
• electrolytic capacitors do not mechanically resist the pressure generated during casting or encapsulation. It is also not possible to completely shed electrolytic capacitors since an electrolytic capacitor "breathes" during operation, that is, the diameter of the electrolytic capacitor changes slightly during operation.
• Pressure sensors for example, absorb the ambient air pressure which is usually required in control units of vehicle engines for adapting the injection parameters to the respective ambient air pressure.
• the circuit module according to the invention with the features of independent claim 1 has the advantage that a protective at least one e- lectric / electronic component protective jacket is only partially surrounded by the protective compound 30.
• the method according to the invention for producing a circuit module having the features of independent claim 8 has the advantage that at least one circuit and at least one electrical / electronic component is mounted on a switch carrier, arranged around the at least one electrical / electronic component Protective jacket is applied to the circuit carrier, the protective jacket is pressed onto the circuit carrier via a suitable tool, and a protective compound is poured, which completely surrounds the at least one circuit and the protective jacket of the at least one electrical / electronic component.
• Embodiments of the present invention provide thermal and mechanical protection of electrical / electronic components which, due to their mechanical properties or their executable functions, can not be directly overmolded or molded and yet are used for molded circuit modules.
• a component protection is realized which protects the sensitive electrical / electronic components against encapsulation or potting or against the potting compound, so that the electrical / electronic components can fulfill their function completely.
• electrolytic capacitors do not mechanically resist the pressure generated during casting or encapsulation.
• the protective jacket By providing the protective jacket to protect the electrolytic capacitor from the protective compound and only partially enclosing it by protective compound, it is also possible to use electrolytic capacitors. Since an electrolytic capacitor "breathes" during operation, ie changes its diameter slightly during operation, the protective casing according to the invention makes it possible to fulfill the function of the electrolytic capacitor, even after the protective compound has been cast Since the protective jacket accommodating the pressure sensor is only partially surrounded by protective compound, the pressure sensor can absorb the ambient air pressure even after the protective compound has been poured in the independent patent Speech 1 specified circuit module as well as the specified in the independent claim 8 method for producing a circuit module possible. It is particularly advantageous that the protective sheath a receiving area for
• the receiving area of the protective jacket is designed in the form of a pot, at the open end of which is designed as a peripheral collar flange region is arranged.
• a simple and cost-effective installation of the protective jacket to the circuit board is possible by the simple geometric structure of the components to be joined in an advantageous manner.
• the pot-shaped or cup-shaped protective casing advantageously has great stability with the flange region designed as a peripheral collar.
• the protective jacket has a high dimensional stability during assembly, in particular during the pressing-on process, in which a pressing force is applied to the protective jacket, and offers a large area as a secure rear grip for connection to the circuit carrier during encapsulation or potting with protective compound. Furthermore, via the designed as a circumferential collar flange in an advantageous
• the at least one electrical / electronic component is optimally protected during the assembly process and during the subsequent operation of the finished circuit module.
• the flange region has at least one sealing device.
• the at least one sealing device attached to the protective jacket is elastically deformed when the protective compound is poured, thereby performing a sealing function.
• the flange region has at least one structure into which protective compound is advantageously introduced when casting the protective compound, so that a better connection of the protective jacket to the protective ground and to the circuit carrier is ensured.
• the protective jacket on a pressure compensation device, so that the ambient air pressure can prevail in an advantageous manner in the interior of the protective jacket. This advantageously makes it possible to provide a pressure sensor as an electrical / electronic component that receives the ambient air pressure to perform its intended function. Such pressure sensors are usually used in control units of vehicle engines for adapting the injection parameters to the respective ambient air pressure.
• the protective jacket and / or the protective compound are produced in an injection molding process.
• this results in a simple and cost-effective production of the circuit module.
• any desired shape can be produced thereby, so that, for example, the protective jacket can be designed such that a plurality of electrical / electronic components arranged on the circuit carrier can also be protected.
• the protective jacket is made of a plastic, in particular of a thermoplastic
• the protective sheath is advantageously able to protect the at least one electrical / electronic component from the thermal and mechanical stresses that occur during the encapsulation of the protective compound or during encapsulation of the circuit module with protective compound.
• FIG. 1 shows a schematic sectional view of an exemplary embodiment of a circuit module according to the invention with a circuit carrier, on which a circuit surrounded by a protective compound and a component surrounded by a protective jacket are mounted.
• FIG. 2 shows a plan view of the circuit module of FIG. 1.
• FIG. 3 shows a perspective view of the circuit module of FIG. 1.
• FIG. 4 shows a perspective sectional view of a portion of the circuit module from FIG. 1 with the component surrounded by the protective jacket.
• FIG. 5 shows a perspective sectional view of the subregion of the circuit module from FIG. 4 without protection ground.
• Fig. 6 shows a perspective view of a side view of the protective jacket with a sealing device and structures.
• FIG. 7 shows a perspective view of the protective jacket from FIG. 6 from below with the sealing device and the structures.
• Fig. 8 shows a perspective view of a side view of the protective jacket with a pressure compensation device.
• FIG. 2 show an embodiment according to the invention of a circuit module 10 having a circuit carrier 12, a circuit 14 mounted on the circuit carrier 12, which is surrounded by a protective compound 16, and an electrical / electronic component 18, which is surrounded by a protective casing 20 is.
• the circuit carrier 12 preferably comprises a printed circuit board and / or a substrate, which is preferably designed as a plastic substrate or as a ceramic substrate.
• the circuit 14 comprises a plurality of electrical / electronic components 14a to 14d, which are completely surrounded by the protective compound 16.
• the protective compound 16 forms the housing of the electronic / electrical components 14a to 14d and protects them from electrical and mechanical loads.
• the for injection or Vergie- Suitable electronic / electrical components 14a to 14d may, for example, be implemented as integrated circuits (ICs), transformers, inductors, relays, plugs or similar discrete components.
• the discrete components may include all types of active or passive devices, such as resistors, capacitors, inductors, semiconductor devices, such as diodes, transistors, or the like. Likewise, combinations of such devices, such as series or parallel, may be provided as the circuit 14.
• the circuits 14 or discrete components 14a to 14d can be used, for example, as packaged or encapsulated or overmolded wire components or SMD components (Surface
• the electrical / electronic component 18 which is not suitable for encapsulation or casting is preferably designed as an electrolytic capacitor and / or pressure sensor.
• the electrical / electronic component 18 is surrounded by a protective jacket 20, which protects the electrical / electronic component 18 from the thermal and mechanical stresses which occur during the encapsulation of the protective compound or during encapsulation of the circuit module with protective compound.
• a protective jacket 20 As material of the protective jacket 20, any type of material is suitable which is able to protect the electrical / electronic component 18 from the thermal and mechanical stresses when casting the protective compound 16 or when encapsulating the circuit module 10 with protective compound 16.
• the protective jacket 20 is made of a plastic, in particular of a thermoplastic material, which is preferably elastically deformable.
• the protective jacket 20 and / or the protective compound 16 are produced in an injection molding process.
• the protective compound 16 is preferably made by thermosetting Molden, with high mechanical and thermal stresses occur. In thermoset molding, the components are exposed to pressures of around 2 to 40 bar and temperatures of up to 180 ° C.
• the protective jacket 20 of the discrete component ment 18 only partially surrounded by the protective mass 16.
• the circuit carrier 12 is completely surrounded by the protective compound 16, with the exception of the area of the protective jacket 20.
• the protective jacket 20 may be designed such that a plurality of components 18 are receivable. That the shape of the protective jacket 20 can be arbitrarily designed and executed, so that a plurality of electrical / electronic components 18 can be protected.
• the protective jacket 20 forms a receiving region 22 for receiving the at least one component 18 and a flange region 24 for connecting the protective jacket 20 to the circuit carrier 12.
• the receiving region 22 of the protective sheath 20 is preferably designed in the form of a pot or a cup, at the open end of which the flange region 24 designed as a circumferential collar is arranged.
• the flange region 24 of the protective jacket 20 has at least one sealing device 26.
• this sealing device 26 is executed as shown in FIG. 1 and 5 to 8 as a circumferential rib.
• the protective jacket 20 in the flange region 24 has at least one structure 28 shown in FIGS. 4 to 8.
• a plurality of structures 28 designed as apertures are provided.
• the protective jacket 20 In order to ensure that the ambient air pressure also prevails in the receiving region 22 of the protective jacket 20, the protective jacket 20 according to FIG. 8 preferably has a pressure compensation device 30.
• this pressure compensation device 30 is designed as a membrane which is arranged at the bottom of the cup-shaped protective jacket 20.
• a circuit 14 which comprises one or more electrical / electronic components 14 to 14d suitable for encapsulation and at least one electrical / electronic component 18 which is not suitable for encapsulation, mounted on a circuit board 12.
• a protective jacket 20 surrounding the electrical / electronic component 18 is applied or placed on the circuit carrier 12.
• the protective jacket 20 is pressed onto the circuit carrier 12 via a suitable pressing tool or a spraying or casting tool.
• the protective jacket 20 is pressed further onto the circuit carrier 12, so that the sealing devices 26 designed as ribs are elastically deformed or crimped and thus perform a sealing function between the protective jacket 20 and the circuit carrier 12.
• the protective compound 16 can thus not penetrate into the receiving region 22 of the protective jacket 20.
• protective compound 16 is also introduced into a structure 28 provided in the protective jacket 20, so that a better connection of the protective jacket 20 to the protective ground 16 and to the circuit carrier 12 is ensured.
• the protective compound 16 is injected or molded in such a way that it completely surrounds the circuit 14 and the protective jacket 20 of the electrical / electronic component 18 only partially.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Mechanical Engineering (AREA)
• Non-Metallic Protective Coatings For Printed Circuits (AREA)
• Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
• Casings For Electric Apparatus (AREA)
• Connection Or Junction Boxes (AREA)

Priority Applications (6)

Applications Claiming Priority (2)

Publications (2)

Family

ID=43534330

Family Applications (1)

Country Status (8)

Cited By (6)

Families Citing this family (5)

Citations (1)

Family Cites Families (15)

• 2009
  • 2009-12-08 DE DE102009047681A patent/DE102009047681A1/de not_active Withdrawn
• 2010
  • 2010-12-07 IN IN5096DEN2012 patent/IN2012DN05096A/en unknown
  • 2010-12-07 US US13/514,549 patent/US9462696B2/en active Active
  • 2010-12-07 JP JP2012542516A patent/JP5638088B2/ja active Active
  • 2010-12-07 WO PCT/EP2010/069072 patent/WO2011070015A2/de active Application Filing
  • 2010-12-07 CN CN201080055484.XA patent/CN102668732B/zh active Active
  • 2010-12-07 ES ES10790405.4T patent/ES2460625T3/es active Active
  • 2010-12-07 EP EP10790405.4A patent/EP2510762B1/de active Active

Patent Citations (1)

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