WO2011007621A1 - 発光装置 - Google Patents
発光装置 Download PDFInfo
- Publication number
- WO2011007621A1 WO2011007621A1 PCT/JP2010/059109 JP2010059109W WO2011007621A1 WO 2011007621 A1 WO2011007621 A1 WO 2011007621A1 JP 2010059109 W JP2010059109 W JP 2010059109W WO 2011007621 A1 WO2011007621 A1 WO 2011007621A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- substrate electrode
- substrate
- light emitting
- outer peripheral
- Prior art date
Links
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Definitions
- the present invention relates to a light emitting device in which an element such as a light emitting element is mounted on a mounting substrate such as a semiconductor insulating substrate.
- a surface-mount type light emitting device in which a light emitting element such as a light emitting diode (LED) or a laser diode (LD) is mounted on a substrate is known.
- This light-emitting device is used in lighting fixtures, backlights for display screens, in-vehicle light sources, display light sources, video illumination auxiliary light sources, and other general consumer light sources.
- a light emitting element having a positive electrode and a negative electrode on the same surface side is used.
- a structure in which a light emitting device is joined by flip chip on an insulating substrate on which a wiring pattern is formed has been proposed.
- the light emitting device melts the solder paste by applying solder paste to a predetermined position of a pair of electrodes formed on an insulating substrate, flip-chip mounting the LED element, joining, and then reflowing. It is comprised so that electrical continuity may be taken.
- the pair of electrodes formed on the insulating substrate of the light emitting device is formed in the same shape as the electrode on the LED element side, it is applied onto the insulating substrate when the LED element is pressed against the electrode and mounted. A portion where the solder paste protrudes from the electrode may be detached from the electrode portion due to heat during reflow and deposited as a solder ball.
- the light-emitting device has a configuration as described in Patent Document 1 in order to prevent the above-described solder balls from being generated in the manufacturing process. That is, in patent document 1, it was set as the structure which suppresses generation
- the above-described conventional light emitting device has the following problems.
- the shape of the redundant reflow pad is larger than the electrode portion of the element, it is not suitable for the shape for performing self-alignment. There was a problem that the position was not appropriate and self-alignment was not performed properly.
- the molten solder on the first electrode side may concentrate on the second electrode side. Therefore, the molten solder concentrates, the connection thickness on the second electrode side becomes excessive, and the connection thickness of the second electrode increases, so that the first electrode side is pulled upward, and voids are formed in the molten solder on the first electrode side. It sometimes occurred. Therefore, it has been desired to suppress the generation of voids on the first electrode side in the light emitting device.
- the present invention was devised in view of the above-described problems, and even if the substrate-side electrode is formed separately from one element to be mounted, self-alignment can be reliably performed. It is an object of the present invention to provide a light emitting device capable of suppressing generation of solder balls and suppressing generation of voids in molten solder under the electrodes.
- the light emitting device is formed on the mounting substrate so as to face the first element electrode and the second element electrode formed inside the outer peripheral edge of the rectangular element.
- the first substrate electrode and the second substrate electrode are the first element electrode and the second substrate electrode, respectively.
- the device electrode is formed in a shape that matches at least a part of the outer periphery of the device electrode, and the first substrate electrode includes a notch recess formed by being recessed inwardly from the outer periphery of the first substrate electrode.
- the two substrate electrodes are formed at positions spaced along the notch recesses of the first substrate electrode, and the first substrate electrode and the second substrate electrode have a part of the outer periphery thereof than the outer periphery of the element.
- the first that extends outward And a first extending portion formed on at least one side of an outer peripheral edge of the rectangular element, and the first substrate electrode includes at least one of the edges on both sides of the notch recess.
- the second extending portion is formed along the first extending portion of the second substrate electrode, and the second extending portion extends outward from the outer peripheral edge of the element.
- the light emitting device when the element is mounted on the mounting substrate, the light emitting device has at least a part of the outer peripheral edge of the first substrate electrode and the second substrate electrode when the heat-melting connection material is reflowed and melted. Since the first element electrode and the second element electrode are formed in a shape that faces and coincides with each other, the element is self-aligned by the surface tension of the molten hot-melt connection material, and the element is placed at a predetermined mounting position. Fit. And since the light-emitting device is equipped with the 1st extension part in the 1st substrate electrode and the 2nd substrate electrode when it self-aligns, the fusion
- the solder balls are not formed outside due to the surface tension. Furthermore, since the second extending portion is formed on the first substrate electrode along the first extending portion of the second substrate electrode, the second extending portion is formed of the heat-melting connecting material during reflow. Responsible for suppressing excessive concentration.
- the light emitting device according to claim 2 is the light emitting device according to claim 1, wherein the second extending portion is formed to be equal to or smaller than a width of the first extending portion.
- the total width of the extension part and the second extension part is formed in a range of 10 to 50% with respect to the length of one side when one end to the other end of the first substrate electrode is a straight line. It is convenient. According to such a configuration, the light-emitting device can perform more effective self-alignment of the element with respect to the first substrate electrode or the second substrate electrode, and more effectively suppress solder balls.
- the light emitting device according to claim 3 is the light emitting device according to claim 1 or 2, wherein the first extending portion is symmetric with respect to the center of one side of the outer peripheral edge of the element. It was set as the structure arrange
- the light-emitting device is the light-emitting device according to claim 1 or 2, wherein the first substrate electrode further includes a third extending portion extending in a diagonal direction at a corner thereof.
- the third extension portion may extend outward from the outer peripheral edge of the element.
- the light-emitting device has, for example, a large amount of application of the heat-melting connection material, and covers the heat-melting connection material along the third extending portion when covering the corner portion side of the first substrate electrode. Even if the application amount of the heating and melting connecting material is large, the height positions of the elements mounted on the first substrate electrode and the second substrate electrode are aligned with the heights of the other elements. be able to.
- the light emitting device is a first substrate electrode formed on the mounting substrate so as to face the first element electrode and the second element electrode formed on the inner side of the outer peripheral edge of the rectangular element.
- the first substrate electrode and the second substrate electrode are arranged at outer peripheral edges of the first element electrode and the second element electrode.
- the first substrate electrode includes a cutout recess formed by cutting inwardly from the outer peripheral edge of the first substrate electrode, and the second substrate electrode includes the cutout recess.
- the first substrate electrode and the second substrate electrode are formed at positions separated from each other along a notch recess of the first substrate electrode, and a part of the outer periphery of the first substrate electrode and the second substrate electrode extends outward from the outer periphery of the element.
- 1 extension part said 1st The extension part is formed at least at one place with respect to one side of the outer peripheral edge of the rectangular element, and the second substrate electrode has a connection area larger than that of the second element electrode facing the first extension part.
- the element or a part of the element that extends from the outer peripheral edge of the element to the outside, or the arrangement of the first substrate electrode with respect to the notch recess is arranged outside the element facing the second element electrode. It was set as the structure which is the part extended outside from the outer periphery.
- the element electrode and the second element electrode are formed so as to face each other and coincide with each other, they are self-aligned by the surface tension of the melted hot-melt connection material, and the element is placed in a predetermined mounting position.
- the light-emitting device is equipped with the 1st extension part in the 1st substrate electrode and the 2nd substrate electrode when self-aligning, a heating fusion connecting material follows the 1st extension part. Thus, no solder balls are formed outside due to surface tension.
- the light-emitting device is a first substrate electrode formed on the mounting substrate so as to face the first element electrode and the second element electrode formed on the inner side of the outer peripheral edge of the rectangular element.
- the first substrate electrode and the second substrate electrode are arranged at outer peripheral edges of the first element electrode and the second element electrode.
- the first substrate electrode includes a cutout recess formed by cutting inwardly from the outer peripheral edge of the first substrate electrode, and the second substrate electrode includes the cutout recess.
- the first substrate electrode is formed at a position spaced along the notch recess of the first substrate electrode, and the first substrate electrode includes an extension part (second extension part) on at least one of both sides of the notch recess.
- the protruding portion (second extending portion) is the element It has a configuration that extends from the outer periphery to the outer.
- the device when the element is mounted on the mounting substrate, at least a part of the outer peripheral edge of the first substrate electrode and the second substrate electrode is a part of the first element electrode and the second element electrode. Therefore, the device is self-aligned by the surface tension of the heated and melted connecting material that has been reflowed and melted, and the element is placed in a predetermined mounting position.
- the extension portion (second extension portion) is formed on the first substrate electrode, so that the extension portion (second extension portion) is heated and melted during reflow. responsible for suppressing excessive concentration of connecting materials.
- the light emitting device has excellent effects as described below. Since the light emitting device includes the first extending portion and the second extending portion, the heat-melting connecting material is prevented from generating solder balls at the time of reflow, and the self-alignment property is also ensured. It is a high-quality product that is less affected by variations in position during assembly.
- the light emitting device includes the second extending portion along the first extending portion, thereby preventing the concentrated flow to the second substrate electrode side at the time of reflow of the heated and melted connecting material, and the first substrate electrode. And the first element electrode are in a good connection state.
- the light emitting device can further align the height after reflow of the elements connected by the heat-melting connection material by further including the third extending portion on the first substrate electrode. Since the light emitting device has the first extending portion, it is possible to suppress the generation of solder balls during reflow of the heat-melting connection material and to ensure self-alignment.
- 1st Embodiment of the light-emitting device which concerns on this invention the structure and positional relationship with the 1st substrate electrode and 2nd substrate electrode of a mounting board
- FIGS. 1 to (h) are a perspective view and a cross-sectional view schematically showing a state in which a light-emitting element is mounted on a mounting substrate according to the present invention via a heat-melting connection material.
- 2nd Embodiment of the light-emitting device which concerns on this invention it is a top view which shows a mounting substrate typically.
- (A), (b) is the bottom view and top view which show typically a mounting substrate and a light emitting element in 3rd Embodiment of the light-emitting device which concerns on this invention.
- (A)-(f) is the bottom view of a light emitting element and the top view of the 1st board
- (A), (b) is a top view which shows the state which formed the 3rd extension part in the 1st board
- the light emitting device 1 includes a mounting substrate 20 having a concave center, and a light emitting element (element) 10 such as an LED chip mounted on the central concave portion of the mounting substrate 20. And.
- a case C is formed around the central concave portion of the mounting substrate 20, and the wiring pattern Hp is formed on the upper surface 20 a of the substrate where the central light emitting element 10 is mounted.
- the substrate electrode (first substrate electrode 2, substrate second electrode 3 and the like) continuous with the wiring pattern Hp is coated with a heat-melting connection material kh such as solder paste and electrically connected to the light emitting element 10 to emit light.
- a heat-melting connection material kh such as solder paste
- Light is irradiated through a resin P filled so as to cover the element 10.
- the light emitting device 1 is used as a configuration in which a protective element (for example, a Zener diode) Zd that stably operates the light emitting element 10 is mounted on the mounting substrate 20 as necessary.
- the light emitting element 10 is flip-chip mounted on the first substrate electrode 2 and the second substrate electrode 3 serving as a mounting portion provided on the upper surface 20 a of the mounting substrate 20.
- the light emitting element 10 includes a light emitting portion 11 (light extraction portion) on one surface side, and a first element electrode 12 and a second element electrode 13 on the other surface side.
- the light emitting element 10 includes, for example, a semiconductor stacked structure (not shown) that includes at least a light emitting layer, and a first conductive semiconductor, a light emitting layer, and a second conductive semiconductor are formed in this order on a substrate. It has a semiconductor light emitting element structure in which an electrode for supplying current is provided in the stacked structure.
- the light emitting element 10 is not limited to these configurations, and may be configured using other semiconductor materials, and may be configured to include a protective layer, a reflective layer (not shown), and the like as appropriate. May be.
- the light emitting element 10 when the light emitting element 10 emits white light, the outside of a semiconductor light emitting element structure that emits blue light (not shown) may be covered with a phosphor layer made of phosphor or a resin containing the phosphor.
- a phosphor layer made of phosphor or a resin containing the phosphor.
- a YAG (yttrium, aluminum, garnet) phosphor that emits yellow light or a silicate phosphor such as (Sr, Ba) 2 SiO 4 : Eu
- the light-emitting element 10 can emit white light.
- the light emitting portion 11 of the light emitting element 10 is not particularly limited in its emission color or structure as long as it can irradiate light.
- the 1st element electrode 12 and the 2nd element electrode 13 which were formed in the other surface side of the light emitting element 10 are formed in the position inside the outer periphery of the said light emitting element.
- the first element electrode 12 is formed such that both sides facing each other are formed in a straight line, and further, notched recesses 12c and 12c are formed on both sides facing each other.
- the second element electrode 13 is formed at a position separated along the notch recess 12 c of the first element electrode 12.
- the second element electrode 13 is formed in a D shape surrounded by a curved line along the curve of the notch recess 12c and a straight line connecting both ends of the curved line.
- the 2nd element electrode 13 is arrange
- the material of the 1st element electrode 12 and the 2nd element electrode 13 is used as an element electrode, it will not specifically limit.
- the mounting substrate 20 has a predetermined wiring pattern Hp (for example, a substrate electrode) formed thereon, and the light emitting element 10 is mounted via a heating and melting connection material kh such as solder paste.
- the mounting substrate 20 is configured, for example, by laminating alumina ceramic sheets as a support substrate, and laminating a metal film or the like on the support substrate.
- the mounting substrate 20 has a first substrate electrode 2 and a second substrate formed on the upper surface 20a formed in a predetermined position (in a concave shape) in a shape corresponding to the first element electrode 12 and the second element electrode 13 of the light emitting element 10.
- the electrode 3 has an external connection electrode terminal (not shown) for electrical connection with an external drive circuit.
- the first substrate electrode 2 of the mounting substrate 20 is the same as the first element electrode 12 serving as a P-type electrode of the light emitting element 10 except for the first extending portions 2 b and 2 b. It is formed so that the shape of the electrode body 2a matches when facing each other. In other words, the first substrate electrode 2 has a shape that coincides with the outer peripheral edge of the first element electrode 12 where the straight line portion and the curved portion of the portion excluding the first extending portion 2 b face the outer peripheral edge.
- the first substrate electrode 2 includes first extending portions 2b and 2b formed on one opposing sides of the electrode body 2a, and a notch recess 2c formed on the other opposing sides of the electrode body 2a. , 2c.
- the first extension portion 2b is for preventing generation of solder balls during reflow, similarly to the first extension portion 3b of the second substrate electrode 3 described later.
- the first extending portion 2b is formed at the center of one side of the electrode body 2a, and is formed so as to protrude outward from the outer peripheral edge gs of the light emitting element 10 to be mounted.
- the first extending portion 2b has a width L with respect to the length of one side (when it is a straight line) of the electrode body (first substrate electrode 2) 2a, together with a second extending portion 2d described later. Thus, it is formed to be in the range of 10 to 50%.
- the width L of the first extension portion 2b is formed to be in the range of 10 to 50% with respect to the length of one side (when straight) of the electrode body 2a, and more preferably 10 to It is in the range of 45%, more preferably in the range of 15 to 40%.
- the extension length of the first extension portion 2b is not particularly limited, and it is sufficient that the first extension portion 2b extends outward from the outer peripheral edge gs of the light emitting element 10.
- the extension length of the 1st extension part 2b may be formed largely by relationship with another structure.
- the first extending portion 2b is formed so that the end portion extending from the outer peripheral edge gs of the light emitting element 10 is linear and the shape of the portion is a rectangle. It does not specifically limit about the shape after being taken out.
- the notch recesses 2c and 2c form an area for installing a second substrate electrode 3 to be described later, and are recessed inwardly from the outer peripheral edge of the electrode body 2a at the center of both sides of the other side of the electrode body 2a. Notched and formed.
- the position, shape, size, curvature, etc. of the notch recesses 2c, 2c are not particularly limited, and are formed corresponding to the shape of the first element electrode 12 of the light emitting element 10 to be mounted.
- substrate electrode 2 is a linear part and curved part of the notch recessed part 2c except the position of the 1st extension part 2b in the linear part and curved part which form the outer periphery periphery. However, they coincide with each other when facing the straight line portion on the outer peripheral edge of the first element electrode 12 of the light emitting element 10 and the curved portion of the notch recess 12c.
- the heating and melting connecting material kh after self-alignment in that portion is reversed in a cross-sectional view.
- the trapezoidal shape is obtained, and the accuracy of preventing short circuit of the heat-melting connecting material kh between the electrodes can be improved.
- the second substrate electrode 3 is formed on the mounting substrate 20 in a state where the second substrate electrode 3 is spaced apart from the first substrate electrode 2 by a predetermined interval Sp along the notch recesses 2c and 2c.
- the second substrate electrode 3 corresponds to a linear portion formed along a straight portion (one side) of the second element electrode 13 of the light emitting element 10 and a curved portion of the first element electrode 12, and the first substrate electrode Here, it is formed so as to have a D shape surrounded by a curved portion formed along the two notch recesses 2c.
- the second substrate electrode 3 has a first extending portion 3 b formed continuously from the connecting portion 3 a so as to be outside the outer peripheral edge of the light emitting element 10.
- the first extending portion 3b is larger than the original area (the area of the second element electrode) so that the portion from the straight portion of the second substrate electrode 3 to a predetermined position is outside the outer peripheral edge of the light emitting element 10. Is formed.
- connection portion 3 a of the second substrate electrode 3 is a portion facing the second element electrode 13.
- first extending portion 3b of the second substrate electrode 3 is a portion that extends outward from the straight line of the electrode body 2a, and continues from the connecting portion 3a to a portion that extends outward from the outer peripheral edge gs of the light emitting element 10. Is formed.
- first extending portion 3b the same conditions as the first extending portion 2b of the first substrate electrode 2 already described and the extending length, formation width, shape, and the like are applied.
- the first extending portion 3 b of the second substrate electrode 3 is formed to have a width L (area) larger than that of the first extending portion 2 b of the first substrate electrode 2.
- the reason why the width L of the first extending portion 3b is formed large is that the heat-melting connection material kh is concentrated because the space Sp between the first substrate electrode 2 and the second substrate electrode 3 is provided. This is to prevent the solder balls from becoming solder balls.
- the second substrate electrode 3 has a positional relationship facing the second element electrode 13 in a portion excluding the first extending portion 3b. Further, the second substrate electrode 3 has a first extending portion 3b that extends over the entire width along the straight portion parallel to the outer peripheral edge gs of the light emitting element 10.
- the outer peripheral edge gs of the light emitting element 10 indicates the peripheral edge of the outer surface of the semiconductor multilayer structure on the surface on which the first element electrode 12 and the second element electrode 13 are formed.
- substrate electrode shows the periphery used as the outer side of each electrode.
- the light emitting device 1 has the mounting substrate 20 mounted with a protective element Zd and the like in addition to the light emitting element 10 at a predetermined position.
- the mounting substrate 20 is formed by laminating a plurality of sheets that have been subjected to drilling such as through-holes as necessary, and a conductor pattern is printed, and the center is concave, It is formed in a state of a case C having a concave periphery as a side wall (for example, a ceramic package process).
- the resin P is filled into the position which has mounted the light emitting element 10 as a sealing member.
- an alumina ceramic or a conductor pattern is plated with a metal having high reflectivity with respect to light from the light emitting element 10 (Au or silver-white metal, particularly Ag or Ag with high reflectivity). It is not particularly limited as long as it is a form used as the case C of the light emitting device 1 such as a metal such as Al.
- the resin P as a sealing member seals the entire light emitting element 10 and the upper portion of the concave portion of the mounting substrate 20 (the upper surface 20 a and a part of the inner side surface 20 b that becomes the case C).
- the light extraction surface of the light emitting device 1 has a light extraction surface on the upper side from the concave portion.
- the resin P prevents the light emitting element 10 from being deteriorated by the outside air.
- the light emitting element 10 is arranged at substantially the center (outer shape) of the resin P in a plan view, light can be uniformly irradiated from the light emitting element 10 to the light extraction surface.
- the light extraction surface of the resin P is a hemispherical surface, and the light emitting element 10 is arranged at substantially the center of the hemispherical surface in plan view, so that the incident angle of light incident on the hemispherical surface is greater than the critical angle of total reflection. It can be suppressed.
- the light extraction surface of the resin P may have a desired shape such as a hemispherical surface, a convex curved surface flattened from a spherical surface, a shell shape, or a concave curved surface, and may function as a lens that collects and diffuses light.
- the resin P is made of a transparent resin, glass or the like.
- the resin P for example, a hard silicone resin, an epoxy resin, or the like can be used.
- FIG. 5 a state when the light emitting element 10 is mounted on the mounting substrate 20 will be described with reference to FIG. Note that the state shown in FIG. 5 is illustrated with respect to the concave portion of the mounting substrate 20 formed in the case C state.
- the first substrate electrode 2 and the second substrate electrode 3 are formed on the mounting substrate 20 in the electrode forming step.
- the first substrate electrode 2 and the second substrate electrode 3 are formed together with other circuits on the mounting substrate 20 by an exposure operation or the like.
- a heat-melting connection material kh such as solder paste is applied to the first substrate electrode 2 and the second substrate electrode 3 of the mounting substrate 20.
- the light emitting element 10 is mounted on the heating and melting connecting material kh.
- the heated and melted connecting material kh is in a state of protruding outward from the light emitting element 10.
- the heated and melted connecting material kh is heated.
- the heating and melting connecting material kh includes the position where the first element electrode 12 and the first substrate electrode 2 face each other, and the second element electrode 13 and the second element electrode 13 The position facing the two substrate electrodes 3 and the upper surfaces of the first extending portions 2b and 3b are located. That is, the light emitting element 10 does not generate solder balls when it is electrically and mechanically mounted on the first substrate electrode 2 and the second substrate electrode 3 of the mounting substrate 20 by flip chip mounting.
- the light emitting element 10 moves to an appropriate position by moving so as to perform self-alignment by the surface tension of the heated and melted connecting material kh.
- the mounting position of the light-emitting element 10 is intentionally shifted from the appropriate position of the first substrate electrode 2 and the second substrate electrode 3 by a predetermined angle in the rotation direction, and is heated during reflow to be self-aligned. It may be one installation judgment that alignment is generated and an appropriate position is obtained. That is, when there is a light emitting element 10 that does not cause self-alignment, it may be determined that there is a problem with the light emitting element 10 or the first substrate electrode 2 and the second substrate electrode 3.
- the light emitting element 10 maintains the self-alignment operation, and the heating and melting connecting material kh suppresses the generation of solder balls.
- the concave portion of the case C that is, the portion where the light emitting element 10 is mounted is used as a sealing member.
- the light emitting device 1 is manufactured by filling the resin P. Therefore, in the manufacturing process, the light emitting device 1 does not generate solder balls by the first extending portions 2b and 3b and the second extending portion 2d, and is less affected by variations when assembling in mass production. Become a high quality product.
- the light emitting device 1 when the light emitting device 1 is lit, the following operation is performed.
- the light emitting device 1 is connected to an external drive circuit (not shown) at the electrode terminal for external connection, and the first substrate electrode 2 and the first substrate electrode 2 through a metal film that is a wiring pattern disposed on the upper surface 20a side of the mounting substrate 20 Electric power is supplied to the light emitting elements 10 electrically connected by the second substrate electrode 3.
- the light emitting element 10 emits light upon receiving power supply, and emits light to the outside of the light emitting element 10 through the resin P.
- the first substrate electrode 2 having a configuration as shown in FIG. 6 is desirable.
- the same structure attaches
- the first substrate electrode 2 and the second substrate electrode 3 are separated from each other with an interval Sp. Therefore, the heated and melted connecting material kh easily gathers on the second substrate electrode 3 side during reflow.
- the second extending portion 2d is disposed along both sides which are the edges of the notch recess 2c of the first extending portion 3b so that the heated and melted connecting material kh is not collected on the second substrate electrode 3 more than necessary. Formed.
- the second extending portions 2d and 2d are formed at a position where the curved portion is separated from the straight portion of the first substrate electrode 2 (an end portion on the second substrate electrode 3 side of the straight portion).
- the second extending portion 2 d is outside the outer peripheral edge gs of the light emitting element 10 so as to have the same extending length as the first extending portion 3 b of the second substrate electrode 3. Is formed. Moreover, the 2nd extension part 2d is formed so that it may become a width
- the heated and melted connecting material kh is suppressed from flowing to the second substrate electrode 3 side more than necessary during reflow, and the first element electrode 12 of the light emitting element 10 is suppressed. It is possible to suppress defects such as voids in the heated and melted connecting material kh positioned between the first substrate electrode 2 and the first substrate electrode 2.
- the second extending portion 2d is formed on the mounting substrate 20 in the same manner when the first substrate electrode 2 and the second substrate electrode 3 are formed.
- the light emitting element 10 in a present Example becomes the same structure as what is shown in FIG.
- first substrate electrode 2A and the second substrate electrode 3A may be configured as shown in FIG. 7B.
- the configuration of the light emitting element 10A as shown in FIG. 7A is used.
- the size relationship between the first extension 2b 1 and the second extension 2d 1 and the range of the ratio to one side are the same as those already described.
- the light emitting element 10A has a light emitting portion (not shown) on one side (front side), and the first element electrode 12A and the second element electrode 13A on the other side.
- the first element electrode 12A the entire surface consisting of an outer periphery and inside has a electrode, and the electrode recesses 12A 1 is formed with a plurality at predetermined intervals.
- the first element electrode 12A one of sides A1, A2 facing is formed by a straight line, the other sides A3, cutout recess 12c 1 by cutting inwardly A4 facing is formed. Cutout recess 12c 1 is provided with a semicircular recess 12c 11, continuously from the semi-circular arc recess 12c 11, and a facing or adjacent groove portions 12c 12 extending sides to, 12c 13, 12c 14 Prefecture.
- the concave groove portion 12c 13 is formed to be parallel to the adjacent sides A1 and A2, and is formed to have a notch depth of about 1/3 from the side A3 to the side A4. Further, the concave groove portions 12c 12 and 12c 14 are formed symmetrically with the concave groove portion 12c 13 as the center. Then, the groove 12c 12 is formed to be inclined at a predetermined angle so as to be directed substantially to the center of the side A2, and is formed to have substantially the same notch depth as the groove 12c 13 toward the opposite side A4. .
- the concave groove portion 12c 14 is formed to be inclined at a predetermined angle so as to be directed substantially to the center of the side A1, and is formed to have substantially the same notch depth as the concave groove portion 12c 13 toward the opposite side A4. .
- the second element electrode 13A is formed at a position spaced apart from the notch recesses 12c 1 and 12c 1 of the first element electrode 12A by a predetermined interval Sp.
- the second element electrodes 13A are formed respectively on the shell-shaped consisting of each side A3, A4 and straight portion formed on the same straight line and the two ends formed along the cutout recess 12c 1 from the curved section of the linear portion ing. Note that the second element electrodes 13A, each of 13A, and includes recessed groove portion 12c 12, 12c 13, 12c 14 formed along the auxiliary electrode 13Aa, 13Ab, and 13Ac.
- the first substrate electrode 2A and the second substrate electrode 3A are formed by applying a heat-melting connection material kh (see FIG. 5) to the first element electrode 12A and the second element electrode 13A of the light emitting element 10A.
- the first substrate electrode 2A has first extending portions 2b 1 and 2b 1 formed on one opposing side B1 and B2, respectively, and the other opposing sides B3 and B4 are notched inwardly to form a notch recess.
- 2c 1 and 2c 1 are formed.
- the first extending portion 2b 1, 2b 1 is omitted already first extending portion 2b has been described, so the description of the same configuration as 2b.
- cutout recess 2c 1, 2c 1 is formed into a shape having a curved portion substantially coincides when facing the cutout recess 12c 1 of the first element electrode 12A, respectively, the semicircular arc recess 2c 11, the semi-circular arc continuously from the recess 2c 11, and a groove portion 2c 12, 2c 13, 2c 14 extending cut away on opposing or adjacent sides.
- the concave groove 2c 13 is formed so as to be parallel to the adjacent sides B1 and B2, and is formed so as to have a notch depth of about 1/3 from the side B3 to the side B4. Further, the recessed groove portions 2c 12 and 2c 14 are formed symmetrically with the recessed groove portion 2c 13 as the center.
- the concave groove 2c 12 is formed to be inclined at a predetermined angle so as to be directed substantially to the center of the side B2, and is formed to have substantially the same notch depth as the concave groove 2c 13 toward the opposite side B4. .
- the concave groove portion 2c 14 is formed so as to be inclined at a predetermined angle so as to be directed substantially to the center of the side B1, and is formed to have substantially the same notch depth as the concave groove portion 2c 13 toward the opposite side B4. .
- second extending portions 2d 1 and 2d 1 are formed on both sides of the edges of the cutout recesses 2c 1 and 2c 1 , respectively.
- the second extending portions 2d 1 and 2d 1 are formed so that the extending length is shorter than the first extending portion 3b 1 described later, as indicated by d1.
- the second extending portions 2d 1 and 2d 1 are formed so that the width is smaller than the first extending portion 3b 1 described later.
- Second substrate electrode 3A one end side of the rectangle is a shape formed in a circular arc shape along the cutout recess 2c 1 of the first substrate electrode 2A, the one end side is facing along a curved section of the second element electrodes 13A
- the shape is sometimes consistent.
- the second substrate electrode 3A, the first extending portion 3b 1 as on the outside is formed than the outer periphery gs of the linear portion side light-emitting element 10A that becomes the other end. That is, the second substrate electrode 3A is provided with a connecting part 3a 1 facing the second element electrode 13A, the first and the extending portion 3b 1 that is continuous with the connecting portion 3a 1.
- the mounting substrate 20 see FIG.
- the first extending portion 2b 1 is formed on the first substrate electrode 2A and the second substrate electrode 3A, and one opposing first extending portion 2b is formed.
- 1 , 2 b 1 , the second extending portions 2 d 1 , 2 d 1 are formed so that the widths are in a specific range (ratio of widths on one side), so that heating and melting are performed while maintaining self-alignment It is possible to prevent the connection material kh from concentrating on the second substrate electrode 3 ⁇ / b> A side, and to prevent the connection material kh from becoming a solder ball of the heating and melting connection material kh.
- the heating and melting connecting material kh hardly generates solder balls. It has a shape. Further, the recessed groove portions 2c 12 to 2c 14 are formed in the notched recessed portions 2c 1 and 2c 1 on the mounting substrate side, and the recessed groove portions 12c 12 to 12c 14 are formed in the notched recessed portions 12c 1 and 12c 1 on the light emitting element 10A side. Therefore, self-alignment can be improved.
- the second substrate electrode has a structure opposite to the first substrate electrode.
- the self-alignment can be maintained and the generation of solder balls can be prevented. That is, as shown in FIG. 8 (a), the first element electrode 12B of the light emitting element 10B is cutout recess 12c 2 which is notched inwardly on one of the rectangular long side is formed along the cutout recess 12c 2 Thus, the second arc-shaped second element electrode 13B is formed.
- the first substrate electrode 2B is formed with first extending portions 2b 2 and 2b 2 on both opposing sides, and on the other opposing side. to form a first extending portion 2b 2, cutout recess 2c 2 on the other side, it is configured to form a second extending portion 2d 2, 2d 2.
- the first substrate electrode 2B also formed to be greater in proportion the width of the first extending portion 2b 2 according to the length also the size of each side.
- the second substrate electrode 3B is formed in a shape in which a short side which is one end side of the rectangle is formed in an arc shape.
- the second substrate electrode 3B forms a first extending portion 3b 2 formed continuously from the connecting portion 3a 2 so as to be outside the outer peripheral edge gs of the light emitting element 10B.
- the light emitting device 10C is formed a cutout recess 12c 3 in one corner of the rectangle, the first element electrodes arranged second element electrode 13C along the cutout recess 12c 3 12C is provided.
- cutout recess 12c 3 is formed concave groove 12c 31 until approximately half of the first element electrode 12C towards one short side of the first element electrode.
- the first substrate electrode 2C is to form a cutout recess 2c 3 in one corner of the rectangle to form a first extending portion 2b 3 on each side.
- the long side and one short side of the first substrate electrode 2C, the first extended portion 2b 3 has formed nearly in the center at its sides.
- the first extended portion 2b 3 it is disposed so as to be continuously formed from the edge of the cutout recess 2c 3.
- the second substrate electrode 3C is formed in a shape in which one corner has an arc shape on one end side of the rectangle.
- the second substrate electrode 3C includes a first extension portion 3b 3 formed so as to be outside the outer peripheral edge gs of the light emitting element 10C continuously from the connection portion 3a 3 .
- the first extending portion 2b 3 formed on the second substrate electrode 3C is parallel to the first extending portion 3b 3 of the second substrate electrode 3C on one side of the four sides of the light emitting element 10C that are rectangular. It is formed in a state.
- the first extending portion 3b 3 of the second substrate electrode 3C is configured to be longer than the position indicated by the solid line so as to be connected to other wiring as shown by the two-dot chain line. It doesn't matter.
- the first extension 3b of the second substrate electrode 3C is used.
- the first extension 2b 3 of the first substrate electrode 2 also serves as the second extension shown in FIG. That is, the second substrate electrode 3C, as one of the first extending portion 2b 3 of the first substrate electrode 2C becomes the outside of the outer periphery gs of the light emitting element 10C from one edge of the cutout recess 2c 3
- the concentration of the heated and melted connecting material kh (see FIG. 5) on the second substrate electrode 3C is prevented depending on the formation position (first). 2 function of the extending portion 2d).
- the configuration shown in FIGS. 8E and 8F may be used.
- the light-emitting element 10D is formed a cutout recess 12c 4 at one corner of the square, the first element electrode 12D where the second element electrode 13D is arranged along the cutout recess 12c 4 I have.
- cutout recess 12c 4 are formed to concave groove portions 12c 41 is toward the diagonal direction of the first element electrode 12D almost half of the first element electrode 12D (middle).
- the first substrate electrode 2D is to form a cutout recess 2c 4 in a corner of the square, to form a first extending portion 2b 4 at the center of each side. Cutout in the recess 2c 4, the groove portion 2c 41 to approximately half of that toward the diagonal direction of the first substrate electrode 2D first substrate electrode 2D are formed.
- the first extension 2b 4 of the first substrate electrode 2D is formed with the same width and the same edge length.
- the first substrate electrode 2D is configured such that the first extending portions 2b 4 and 2b 4 are formed at positions on both sides which are the edges of the notch recess 2c 4 , respectively.
- the second substrate electrode 3D is formed in a shape in which one corner has an arc shape on one end side of the rectangle.
- the second substrate electrode 3D includes a first extending portion 3b 4 that is formed continuously from the connecting portion 3a 4 so as to be outside the outer peripheral edge gs of the light emitting element 10D.
- the second first extending portion 3b is formed on the substrate electrode 3D 4, in one side among the four sides the rectangular light emitting element 10D (square), the first extending portion 3b 4 of the second substrate electrode 3D Are formed in parallel.
- the first extending portion 3b 4 of the second substrate electrode 3D is configured to be longer than the position indicated by the solid line so as to be connected to other wiring as shown by the two-dot chain line. It doesn't matter.
- the first extension 3b 4 of the second substrate electrode 3D When the area is smaller than that of FIG. 3 and the length of each side is small like the first substrate electrode 2D, the first extension 3b 4 of the second substrate electrode 3D
- the first extending portions 2b 4 and 2b 4 of the first substrate electrode 2D located on both sides also serve as the second extending portions shown in FIG. That is, with respect to the second substrate electrode 3D, the first extending portions 2b 4 and 2b 4 of the first substrate electrode 2D are formed so as to be outside the outer peripheral edge gs of the light emitting element 10D from the edge of the notch recess 2c 4.
- the concentration of the heated and melted connecting material kh (see FIG. 5) is prevented from being formed on the second substrate electrode 3D by the formation position during reflow. (The same function as the second extending portion 2d).
- the first substrate electrode 2C, as 2D, the first extending section 2b 3 of the first substrate electrode, 2b 4 is a second substrate electrode 3C, with respect to 3D, cutout recess 2c 3, Since the first extension portions 2b 3 and 2b 4 are formed along one side or both sides of the 2c 4 , the first extension portions 2b 3 and 2b 4 have the function of the second extension portion of the first substrate electrode together with the original function. It may become.
- the third extending portions 102a and 102b may be formed at the corners indicated by the first substrate electrodes 2 and 2A described above.
- the components already described are denoted by the same reference numerals and description thereof is omitted.
- substrate electrode 2 forms the 3rd extension part 102a in the four corner
- the third extending portion 102 a is formed so as to be outside the outer peripheral edge gs of the light emitting element 10.
- the third extending portion 102a has a width of the first extending portion 2b or a total width of the first extending portion 2b and the second extending portion 2d so that one side of the first substrate electrode is straight. It is formed so as not to exceed 50%.
- the shape of the 3rd extension part 102a is shown as a shape which connected the rectangle to the corner
- the third extending portion 102a may be formed at the corner of the first substrate electrode 2A already described.
- the third extending portion 102a is formed under the same conditions as already described.
- the first substrate electrodes 2 and 2A are provided with the third extending portion 102a, so that the application amount of the heated and melted connecting material kh (see FIGS. 4 and 5) can be increased. Even if the coating is thick and thick, the heated and melted connecting material kh flows along the third extending portion 102a side during reflow, so that the height when the light emitting element 10 is mounted can be made uniform.
- the third extending portion 102a does not function.
- first substrate electrode 52 and the second substrate electrode 53 are arranged to be adjacent to each other with substantially the same size, the first substrate electrode 52 and the second substrate electrode 53 are connected to each other. If the first extending portions 52b and 53b are respectively formed, it is possible to prevent the generation of solder balls.
- the light emitting element 10E to be used is also rectangular, and a first element electrode and a second element electrode (not shown) formed in parallel inside the outer peripheral edge gs. Is formed. Then, as in the configuration already described, the light emitting element is mounted by self-alignment via the heating and melting connecting material kh (see FIG. 5).
- the first substrate electrode 52 and the second substrate electrode 53 are substantially the same size, here, in order not to misidentify the polarity of the electrodes, here, one electrode body 53a has a shape having a linear portion, and the other The electrode body 52a is formed in a curved shape.
- the first extending portions 52b and 53b extending outward from the outer peripheral edge gs are arranged so as to extend two with respect to one side of the light emitting element 10E. Yes.
- the ratio of the width of the 1st extension parts 52b and 53b to the long side is increased, and prevention of generation of a solder ball is aimed at.
- the light emitting element 10E be symmetrical with respect to the center of the side.
- the entire width of the linear portion along the outer peripheral edge gs of the light emitting element 10 is set to be the first extending portion continuously from the connection portion.
- the width portion of the portion may be the first extension portion.
- the second substrate electrode forms a first extension part continuously from the connection part, and the part where the area of the part facing and joining the second element electrode is increased is shown as the first extension part. Without changing the area facing the second element electrode, the position of the second substrate electrode is moved, and the portion that is outside the outer peripheral edge gs of the light emitting element 10 as the first extension part is moved. You may comprise.
- the light emitting device has been described as the configuration including the first extension portion and the second extension portion in FIGS. 1 to 10, it may be configured to include only the second extension portion. In other words, the light emitting device has the second extending portion (extending portion) even if the first extending portion is configured at the same position as the outer peripheral edge of the element. It is possible to reduce the formation of solder balls.
- the light emitting device of the present invention includes a light source for illumination, a backlight light source such as an LED display and a liquid crystal display device, a traffic light, an illumination type switch, various sensors and various indicators, a moving image illumination auxiliary light source, a light source for other general consumer products, etc. Can be suitably used.
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Abstract
Description
特許文献1の発光装置の構成では、冗長リフローパッドの形状が素子の電極部分よりも大きく形成されていることで、セルフアライメントを行うための形状に適していないため、リフロー時に実装する発光素子の位置が適切にならず、セルフアライメントが適切に行われない問題が発生した。
かかる構成によれば、発光装置は、素子が第1基板電極あるいは第2基板電極に対してより有効なセルフアライメントを行い、かつ、ハンダボールの抑制をより有効に行うことが可能となる。
かかる構成によれば、発光装置は、第1延出部が中央に一箇所あるいは2箇所以上であっても、素子の一辺の中央に対して対称となる位置に配置されるので、加熱溶融接続材の塗布されたときの状態が、表面張力により上から見たときに素子の一辺の中央に出っ張っている場合が多いことから、リフロー時に加熱溶融接続材をバランスよく第1延出部により導いてハンダボールの発生をより効率的に抑制する。
かかる構成によれば、発光装置は、例えば、加熱溶融接続材の塗布量が多くなり、第1基板電極の角部側まで覆うような場合に、第3延出部に沿って加熱溶融接続材が流れて付着することになり、加熱溶融接続材の塗布量が多い場合であっても、第1基板電極及び第2基板電極に実装される素子の高さ位置を他の素子の高さと揃えることができる。
発光装置は、第1延出部及び第2延出部を備えることで、加熱溶融接続材がリフロー時にハンダボールを発生させることを抑制すると共に、セルフアライメント性も確保されるので、量産時の組み立てを行うときの位置のばらつきの影響が少なく高品質な製品になる。
発光装置は、特に、第2延出部を第1延出部に沿って備えることで、加熱溶融接続材のリフロー時の第2基板電極側に集中して流れることを防ぎ、第1基板電極と第1素子電極との接続状態を良好とする。
発光装置は、第1基板電極に第3延出部をさらに備えることで、加熱溶融接続材で接続される素子のリフロー後の高さをより揃えることができる。
発光装置は、第1延出部があることで、加熱溶融接続材がリフロー時にハンダボールの発生することを抑制すると共に、セルフアライメント性も確保される。
図1及び図2に示すように、発光装置1は、中央が凹状に形成された実装基板20と、この実装基板20の中央の凹状部分に実装されるLEDチップ等の発光素子(素子)10とを備えている。なお、発光装置1は、例えば、実装基板20の中央の凹状に形成した部分の回りをケースCとし、中央の発光素子10の実装位置となる基板の上面20aに配線パターンHpが形成されており、その配線パターンHpに連続する基板電極(第1基板電極2、基板第2電極3等)にハンダペースト等の加熱溶融接続材khを塗布して電気的に発光素子10と接続し、その発光素子10を覆うように充填された樹脂Pを介して光を照射するように構成されている。また、発光装置1は、必要に応じて発光素子10を安定して動作させる保護素子(例えばツェナーダイオード)Zdが実装基板20に実装される構成として使用される。
なお、発光素子10は、これらの構成に限定されるものではなく、他の半導体材料を用いて構成するようにしてもよく、適宜保護層や反射層(図示せず)などを備えるように構成してもよい。
なお、発光素子10の発光部11は、光を照射することができればその発光色あるいは構造を、ここでは、特に限定されるものではない。
そして、第1素子電極12は、対向する一方の両辺が直線状に形成され、さらに、対向する他方の両辺に内側に凹状に切欠かれた切欠凹部12c,12cが形成されている。
また、第2素子電極13は、第1素子電極12の切欠凹部12cに沿って離間した位置に形成されている。第2素子電極13は、切欠凹部12cの曲線に沿った形状の曲線とその曲線の両端をつなぐ直線とで囲まれたD字形状に形成されている。そして、第2素子電極13は、外側周縁の直線部分が第1素子電極の外側周縁の直線部分と同一線上になるように配置されている。なお、第1素子電極12及び第2素子電極13の材質は、素子電極として使用されるものであれば、特に限定されるものではない。
また、第1延出部2bは、発光素子10の外側周縁gsから延出されている端部は直線状として、その部分の形状が長方形となるように形成されているが、一定幅で延出された後の形状について特に限定されるものではない。
なお、このほか樹脂Pの光取り出し面は、半球面、球面から扁形された凸曲面、砲弾型、凹曲面などの所望の形状とし、光を集光、拡散させるレンズとして機能させることもできる。樹脂Pは、透明な樹脂、ガラスなどからなる。樹脂Pとしては、例えば、硬質シリコーン樹脂、エポキシ樹脂などを用いることができる。
図5(a)、(b)に示すように、電極形成工程において、実装基板20に第1基板電極2及び第2基板電極3が形成されている。第1基板電極2及び第2基板電極3は、露光作業等により実装基板20に他の回路と一緒に形成される。
図5(c)、(d)に示すように、塗布工程において、実装基板20の第1基板電極2及び第2基板電極3にハンダペースト等の加熱溶融接続材khを塗布する。
図5(e)、(f)に示すように、素子載置工程において、発光素子10を加熱溶融接続材kh上に載置する。このとき、図5(f)に示すように、加熱溶融接続材khは、発光素子10から外側にはみ出した状態となっている。
実装基板20に発光素子10あるいはその他の必要な素子(保護素子Zd等)が実装されると、その後、ケースCの凹部分、つまり、発光素子10が実装されている部分に封止部材としての樹脂Pが充填されて発光装置1が製造される。
したがって、発光装置1は、製造工程において、第1延出部2b,3b及び第2延出部2dにより、ハンダボールを発生させることがなく、量産時の組み立てを行うときのばらつきの影響が少なく高品質な製品になる。
第1基板電極2と第2基板電極3とは、間隔Spをあけて離間している。そのため、リフロー時に加熱溶融接続材khが第2基板電極3側に集まり易くなっている。したがって、加熱溶融接続材khが必要以上に、第2基板電極3に集まらないように、ここでは、第2延出部2dを第1延出部3bの切欠凹部2cの縁となる両側に沿って形成している。第2延出部2d,2dは、第1基板電極2の直線部分から曲線部分の区切りとなる位置(直線部分の第2基板電極3側となる端部)に形成されている。
第1素子電極12Aは、外側周縁より内側となる面の全体が電極となっており、かつ、電極凹部12A1が所定間隔で複数形成されている。そして、第1素子電極12Aは、対向する一方の両辺A1,A2は直線で形成され、対向する他方の両辺A3,A4に内側に切り欠いて切欠凹部12c1が形成されている。切欠凹部12c1は、半円弧凹部12c11と、この半円弧凹部12c11から連続して、対向あるいは隣接する辺側に延びる凹溝部12c12、12c13、12c14とから構成されている。
第1延出部2b1,2b1は、すでに説明した第1延出部2b,2bと同じ構成であるので説明を省略する。
このように、実装基板20(図1参照)では、第1基板電極2A及び第2基板電極3Aに第1延出部2b1を形成していると共に、対向する一方の第1延出部2b1,2b1に沿って第2延出部2d1,2d1をそれぞれ幅が特定の範囲(一辺における幅の割合)となるように形成しているので、セルフアライメントを維持しながら、加熱溶融接続材khが第2基板電極3A側に集中することを防ぐと共に、加熱溶融接続材khのハンダボールとなることを防ぐことができる。
すなわち、図8(a)に示すように、発光素子10Bの第1素子電極12Bは、長方形の長辺の一方に内側に切り欠いた切欠凹部12c2が形成され、その切欠凹部12c2に沿って半円弧形状の第2素子電極13Bが形成されている。
第2基板電極3Bは、長方形の一端側となる短辺を円弧状にした形状に形成されている。この第2基板電極3Bは、接続部3a2から連続して、発光素子10Bの外側周縁gsより外側になるように形成した第1延出部3b2を形成している。
このように、発光素子10Bの電極構成により第2基板電極3Bが第1基板電極2Bの一方の辺にしか配置されない構成であっても、すでに説明した構成と同様に発明の効果を達成することができる。
図9(a)に示すように、第1基板電極2は、その4つの角部に第3延出部102aを形成している。この第3延出部102aは、発光素子10の外側周縁gsよりも外側となるように形成されている。また、この第3延出部102aは、第1延出部2bの幅、又は、第1延出部2b及び第2延出部2dとの合計の幅が、第1基板電極の一辺を直線としたときの50%を超えることがないように形成されている。また、第3延出部102aの形状は、図面では、角部に長方形を接続した形状として示しているが、その外側となる先端側は、円弧形状であっても構わない。
図9(a)、(b)に示すように、第3延出部102aを第1基板電極2,2Aが備えることで、加熱溶融接続材kh(図4、図5参照)の塗布量が多くなり厚く塗られていても、リフロー時にその加熱溶融接続材khが第3延出部102a側に沿うように流れるので、発光素子10を実装したときの高さを揃えることが可能となる。なお、加熱溶融接続材khの塗布量が多い場合には、第1基板電極2,2Aの角部分を覆うように加熱溶融接続材khが塗布されることから、塗布量が多いときのみに、第3延出部102aに沿って加熱溶融接続材khを流すことができ、塗布量が適量であるときには、第3延出部102aは機能しないことになる。
2 第1基板電極
2A 第1基板電極
2a 電極体
2b 第1延出部
2c 凹部
2d 第2延出部
3 第2基板電極
3a 接続部
3b 第1延出部
10 発光素子(素子)
11 発光部
12 第1素子電極
12c 凹部
13 第2素子電極
20 実装基板
20a 上面
20b 側面
C ケース
Hp 配線パターン
P 樹脂
Sp 間隔
Zd 保護素子
gs 外側周縁
kh 加熱溶融接続材
Claims (6)
- 矩形状の素子の外側周縁より内側に形成された第1素子電極及び第2素子電極に対面するように実装基板上に形成された第1基板電極及び第2基板電極に、加熱溶融接続材を介して前記素子を実装する発光装置において、
前記第1基板電極及び前記第2基板電極は、前記第1素子電極及び第2素子電極における外側周縁のすくなくとも一部に一致する形状に形成され、
前記第1基板電極は、当該第1基板電極の外側周縁から内側に凹状に切欠かれて形成された切欠凹部を備え、
前記第2基板電極は、前記第1基板電極の切欠凹部に沿って離間した位置に形成され、
前記第1基板電極及び前記第2基板電極は、その外側周縁の一部が、前記素子の外側周縁より外側に延出する第1延出部を備え、
前記第1延出部は、矩形状の前記素子の外側周縁における一辺に対して少なくとも一箇所以上形成され、
前記第1基板電極は、前記切欠凹部の両側の縁の少なくとも一方に前記第2基板電極の第1延出部に沿って形成した第2延出部を備え、前記第2延出部は、前記素子の外側周縁より外側に延出することを特徴とする発光装置。 - 前記第2延出部は、前記第1延出部の幅と同等以下に形成されると共に、前記第1延出部及び前記第2延出部の合計の幅が、前記第1基板電極の一端から他端までを直線としたときの一辺の長さに対して10~50%の範囲で形成されたことを特徴とする請求の範囲第1項に記載の発光装置。
- 前記第1延出部は、前記第1基板電極の一辺の中央に対して対称となるように配置されたことを特徴とする請求の範囲第1項又は第2項に記載の発光装置。
- 前記第1基板電極は、その角部に対角線方向に延びる第3延出部をさらに備え、前記第3延出部は、前記素子の外側周縁より外側に延出することを特徴とする請求の範囲第1項又は第2項に記載の発光装置。
- 矩形状の素子の外側周縁より内側に形成された第1素子電極及び第2素子電極に対面するように実装基板上に形成された第1基板電極及び第2基板電極に、加熱溶融接続材を介して前記素子を実装する発光装置において、
前記第1基板電極及び前記第2基板電極は、前記第1素子電極及び第2素子電極における外側周縁のすくなくとも一部に一致する形状に形成され、
前記第1基板電極は、当該第1基板電極の外側周縁から内側に凹状に切欠かれて形成された切欠凹部を備え、
前記第2基板電極は、前記第1基板電極の切欠凹部に沿って離間した位置に形成され、
前記第1基板電極及び前記第2基板電極は、その外側周縁の一部が、前記素子の外側周縁より外側に延出する第1延出部を備え、
前記第1延出部は、矩形状の前記素子の外側周縁における一辺に対して少なくとも一箇所以上形成され、
前記第2基板電極は、その第1延出部が、対面する前記第2素子電極より接続面積を大きく形成して前記素子の外側周縁より外側に延出した部分であること、又は、前記第1基板電極の切欠凹部に対する配置を前記第2素子電極に対面する配置から外側にして前記素子の外側周縁より外側に延出した部分であることを特徴とする発光装置。 - 矩形状の素子の外側周縁より内側に形成された第1素子電極及び第2素子電極に対面するように実装基板上に形成された第1基板電極及び第2基板電極に、加熱溶融接続材を介して前記素子を実装する発光装置において、
前記第1基板電極及び前記第2基板電極は、前記第1素子電極及び第2素子電極における外側周縁のすくなくとも一部に一致する形状に形成され、
前記第1基板電極は、当該第1基板電極の外側周縁から内側に凹状に切欠かれて形成された切欠凹部を備え、
前記第2基板電極は、前記第1基板電極の切欠凹部に沿って離間した位置に形成され、
前記第1基板電極は、前記切欠凹部の両側の縁の少なくとも一方に延出部を備え、前記延出部は、前記素子の外側周縁より外側に延出することを特徴とする発光装置。
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