WO2010104039A1 - Substrat de verre et son procédé de fabrication - Google Patents

Substrat de verre et son procédé de fabrication Download PDF

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Publication number
WO2010104039A1
WO2010104039A1 PCT/JP2010/053800 JP2010053800W WO2010104039A1 WO 2010104039 A1 WO2010104039 A1 WO 2010104039A1 JP 2010053800 W JP2010053800 W JP 2010053800W WO 2010104039 A1 WO2010104039 A1 WO 2010104039A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
polishing
chamfered
end surface
chamfered surface
Prior art date
Application number
PCT/JP2010/053800
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English (en)
Japanese (ja)
Inventor
浩一 下津
広之 中津
泰紀 三成
祐之 高橋
道治 江田
久敏 饗場
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009240672A external-priority patent/JP5516940B2/ja
Priority claimed from JP2009240674A external-priority patent/JP5516941B2/ja
Priority claimed from JP2010000570A external-priority patent/JP5516952B2/ja
Priority claimed from JP2010022112A external-priority patent/JP5440786B2/ja
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to KR1020117014792A priority Critical patent/KR101707056B1/ko
Priority to CN201080010281.9A priority patent/CN102341214B/zh
Publication of WO2010104039A1 publication Critical patent/WO2010104039A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J17/00—Gas-filled discharge tubes with solid cathode
    • H01J17/02—Details
    • H01J17/16—Vessels; Containers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2217/00—Gas-filled discharge tubes
    • H01J2217/38—Cold-cathode tubes
    • H01J2217/49—Display panels, e.g. not making use of alternating current
    • H01J2217/492—Details
    • H01J2217/49264—Vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2329/00—Electron emission display panels, e.g. field emission display panels
    • H01J2329/86—Vessels
    • H01J2329/8605—Front or back plates
    • H01J2329/861—Front or back plates characterised by the shape

Definitions

  • the present invention relates to a glass substrate formed by optimizing the surface properties of a boundary portion between a front surface and a back surface and end surfaces existing between outer peripheral ends of both surfaces, and a manufacturing method thereof.
  • image (video) display devices in recent years are flat panel displays (FPD) represented by a liquid crystal display (LCD), a plasma display (PDP), a field emission display (FED), an organic EL display (OLED), and the like.
  • FPD flat panel displays
  • LCD liquid crystal display
  • PDP plasma display
  • FED field emission display
  • OLED organic EL
  • planar light source such as a backlight of an LCD or a light source for indoor lighting by causing only three colors (for example, white) to emit light without causing the three primary colors to be flickered by a TFT unlike OLED.
  • FPDs and illuminations are each configured by attaching and combining various components including respective elements and wirings on the surface of the glass substrate.
  • FPD is formed by forming a plurality of FPD panel elements on a single large glass substrate, and finally dividing them appropriately to obtain individual FPD glass panels. So-called multi-taking is performed. Since this multi-collection improves the efficiency as the glass substrate becomes larger, a glass substrate having a side length of more than 3 m has been used. Further, in recent years, since the size of the FPD itself has been promoted, a thinner glass substrate is required to meet the demand for preventing the increase in weight. Moreover, this kind of glass substrate has come to be used as a glass substrate for solar cells in addition to the above-mentioned FPD and organic EL illumination.
  • the glass substrate when the glass substrate is increased in size and thinned, an extremely large deflection occurs when it is lifted, and tensile stress acts on the convex surface due to the deflection, and the concave surface becomes. Compressive stress acts.
  • the glass substrate has a form in which the front surface and the back surface and the end surfaces existing between the outer peripheral ends of both surfaces are connected via a boundary portion, respectively. The stress concentrates on the part. Therefore, when the glass substrate is bent, a large tensile stress is generated around the boundary between the convex surface or back surface and the end surface connected to the surface.
  • this kind of glass substrate is made to have a desired size by dividing.
  • a scribe line is engraved on the surface of the glass substrate with a diamond chip or the like, and tensile stress is applied to the scribe line.
  • splitting in which a glass substrate is cut by applying a force so as to act, is generally employed.
  • innumerable minute defects are generated at the boundary between the front and back surfaces and the end surface of the glass substrate after the division, so that the glass substrate is deformed or heat-treated as described above. The probability of breakage increases.
  • a chamfered surface is formed by subjecting a boundary portion between the front and back surfaces of the glass substrate and the end surface to a chamfered surface, and a chamfered surface after polishing from the end surface. Smoothing out is disclosed.
  • the end surface of the glass substrate is perpendicular to both the front and back surfaces, the surface maximum unevenness of the end surface is 0.05 mm or less, and the surface maximum unevenness of the chamfered surface is 0.007 mm or less. It is described that it is preferable.
  • the end surface of the glass substrate is curved outwardly from the outer peripheral ends of both the front and back surfaces, the maximum surface unevenness of the end surface is 0.04 mm or less, and the maximum surface unevenness of the chamfered surface Is preferably 0.007 mm or less.
  • the glass substrates disclosed in Patent Documents 1 and 2 are tempered glass, even if a glass substrate that has not been subjected to a tempering process is subjected to a process for forming a chamfered surface as in the same document, the glass substrate. If the glass substrate is bent or has an inappropriate temperature distribution, the glass substrate cannot be reliably prevented from being damaged. That is, it can be said that the chamfered surface described in each document is not a surface property that can be suitably applied to any glass substrate including the glass substrates used for the above-described applications.
  • the surface properties of the chamfered surface of the glass substrate described in each document are defined by using the maximum surface unevenness as a parameter, and the surface properties based on such a rule ensure that the glass substrate is not damaged as described above. Cannot be stopped. In other words, it is not optimal to use the maximum surface roughness as a parameter, so even if the surface properties of the chamfered surface satisfy the provisions described in each of the documents, the substrate may be bent or have an inappropriate temperature distribution. Therefore, the glass substrate cannot be dealt with accurately due to the damage of the glass substrate.
  • the above-mentioned problems are caused by chamfering by polishing at the boundary portion of a glass substrate divided by using a laser such as laser cleaving other than the above-described splitting of the glass substrate. In the case of formation, it can occur in the same manner.
  • the present invention is made by optimizing the surface properties of the boundary surface (chamfered surface) extending from the front surface and the back surface of the glass substrate to the glass substrate, regardless of whether the strengthening treatment is performed or not. It is a technical problem to reliably prevent the occurrence of breakage due to the bending of the glass and the inappropriate temperature distribution, and to solve the problem of glass particles.
  • a first invention created to solve the above technical problem is a glass substrate having a front surface and a back surface, and end surfaces existing between outer peripheral ends of the both surfaces, and at least one surface of the front surface and the back surface. and said end face and a chamfered surface is formed at the boundary portion between the ten point average roughness Rz 2 of the chamfered surface is less than ten-point average roughness Rz 1 of the end face, and, crude chamfered surface
  • An average length RSm 2 of the roughness curve element is characterized by being larger than an average length RSm 1 of the roughness curve element of the end face.
  • the surface roughness is measured using Surfcom 590A manufactured by Tokyo Seimitsu Co., Ltd. (hereinafter the same).
  • the ten-point average roughness Rzjis (Rz 1 , Rz 2 ) and the average length RSm (RSm 1 , RSm 2 ) of the roughness curve elements conform to JIS B0601: 2001 (the same applies hereinafter).
  • the “chamfered surface” means the surface of the chamfered portion obtained by chamfering the boundary portion (hereinafter the same).
  • the ten-point average roughness of the chamfered surface formed at the boundary portion between at least one of the front and back surfaces of the glass substrate and the end surface is smaller than the ten-point average roughness of the end surface.
  • the average length of the roughness curve element of the chamfered surface is made larger than the average length of the roughness curve element of the end face.
  • the chamfered surface has a ten-point average roughness Rz 2 and an end surface has a ten-point average roughness Rz 1 that satisfies Rz 2 ⁇ 1.5 ⁇ m and 1.5 ⁇ Rz 1 / Rz. It is preferable to satisfy the relationship of 2 ⁇ 10.0.
  • Rz 1 / Rz 2 is preferably within the above numerical range.
  • the average length RSm 2 of the roughness curve element of the particular polished surface it is preferable to satisfy the relation of RSm 2 ⁇ 100 ⁇ m.
  • the ratio of the average lengths of the roughness curve elements is preferably 0.1 or more and 0.7 or less.
  • RSm 1 / RSm 2 is preferably within the above numerical range.
  • a second invention created in order to solve the above technical problem is a glass substrate having a front surface and a back surface and end surfaces existing between outer peripheral ends of both surfaces, and at least one surface of the front surface and the back surface.
  • a chamfered surface is formed at a boundary portion between the first and second end surfaces, and a protruding valley depth Rvk at the chamfered surface satisfies a relationship of Rvk ⁇ 0.95 ⁇ m.
  • the protruding valley depth Rvk conforms to JIS B0671-2: 2002 (hereinafter the same).
  • the surface property of the chamfered surface formed at the boundary portion of the glass substrate is defined using the protruding valley depth Rvk as a parameter, and the Rvk is equal to 0. Since it is a glass substrate having a chamfered surface defined as 95 ⁇ m or less, the problem of breakage due to bending of the glass substrate and improper temperature distribution and degradation of quality due to glass particles are suppressed as much as possible. That is, the protruding valley depth Rvk is a value indicating how much the portion deeper than the average unevenness of the surface is, and if this value is large, an abnormally deep valley portion exists. become.
  • the boundary portion has such an abnormal valley portion, when the tensile stress is generated in the boundary portion due to bending or an inappropriate temperature distribution, the stress concentration is abnormally deep in the valley portion. As a result, breakage is likely to occur, and the glass particles are likely to remain and stay in the abnormally deep valley portion.
  • the projecting trough depth Rvk of the chamfered surface formed at the boundary portion is 0.95 ⁇ m or less as described above, there is no abnormally deep trough portion at the boundary portion. The stress concentration is less likely to occur even if acts, and the glass particles are less likely to remain.
  • the protruding valley depth Rvk of the chamfered surface formed at the boundary portion is 0.20 ⁇ m or less.
  • the protruding valley depth Rvk at the boundary portion of the glass substrate is smaller than the protruding valley depth Rvk of the end surface connected to the chamfered surface of the boundary portion. That is, it has been found that when stress is generated inside the glass substrate due to bending of the glass substrate or an inappropriate temperature distribution, these stresses are most likely to occur near the boundary.
  • the protruding valley depth Rvk of the boundary portion is made smaller than the protruding valley depth Rvk of the end face, an abnormally deep valley portion that causes the stress concentration is generated from the boundary portion where stress concentration is likely to occur. It will be reduced. As a result, it is possible to reduce as much as possible the damage caused by the bending of the glass substrate and the inappropriate temperature distribution, and in addition to this, the problem of remaining glass particles is avoided.
  • the protruding valley depth Rvk at the end surface of the glass substrate is smaller than the protruding valley depth Rvk of the chamfered surface of the boundary portion, although it becomes an excessive quality from the viewpoint of surface properties, The problem will not be disturbed. And even in the glass substrate which concerns on this 2nd invention, even if it does not perform the reinforcement
  • a third invention devised to solve the above technical problem is a glass substrate having a front surface and a back surface, and end surfaces existing between outer peripheral ends of both surfaces, and at least one surface of the front surface and the back surface.
  • a chamfered surface is formed at a boundary portion between the surface and the end surface, and the root mean square slope R ⁇ q of the roughness curve on the chamfered surface satisfies the relationship of R ⁇ q ⁇ 0.10.
  • the root mean square slope R ⁇ q of the roughness curve conforms to JIS B0601-2001 (the same applies hereinafter).
  • the surface property of the chamfered surface formed at the boundary portion of the glass substrate is defined using the root mean square slope R ⁇ q of the roughness curve as a parameter
  • the root mean square slope R ⁇ q of the roughness curve is an average value of the slope of each concave portion and each convex portion of the roughness curve with respect to the normal of the surface. This means that there are many concave portions in which the valley bottom has a sharp shape.
  • the boundary portion is a chamfered surface having such a property
  • stress concentration occurs in the concave portion where the bottom of the valley forms a sharp shape.
  • breakage is likely to occur, and the glass particles are liable to remain in the recesses.
  • the root mean square slope R ⁇ q of the roughness curve in the chamfered surface formed at the boundary portion as described above is 0.10 or less
  • the boundary portion has few concave portions having sharp valley bottoms so as not to cause a problem. For this reason, even if tensile stress acts on the boundary portion, stress concentration is less likely to occur, and the glass particles are less likely to remain.
  • the root mean square slope R ⁇ q of the roughness curve on the chamfered surface formed at the boundary is more preferably 0.05 or less.
  • the root mean square slope R ⁇ q of the roughness curve at the boundary surface of the glass substrate is smaller than the root mean square slope R ⁇ q of the roughness curve of the end surface connected to the boundary surface. That is, it has been found that when stress is generated inside the glass substrate due to bending of the glass substrate or an inappropriate temperature distribution, these stresses are most likely to occur near the boundary. Therefore, if the root mean square slope R ⁇ q of the roughness curve of the boundary portion is made smaller than the root mean square slope R ⁇ q of the end surface roughness curve, it causes stress concentration from the boundary portion where stress concentration is likely to occur.
  • a fourth invention devised to solve the above technical problem is a glass substrate having a front surface and a back surface, and end surfaces existing between the outer peripheral ends of the both surfaces, and at least one surface of the front surface and the back surface.
  • a chamfered surface is formed at a boundary portion between the first and second end surfaces, and the maximum valley depth Rv in the chamfered surface satisfies the relationship of Rv ⁇ 2.0 ⁇ m.
  • the maximum valley depth Rv conforms to JIS B0601-2001 (the same applies hereinafter).
  • the surface property of the chamfered surface formed at the boundary portion of the glass substrate is defined using the maximum valley depth Rv as a parameter, and the Rv is 2.0 ⁇ m. Since the glass substrate has a chamfered surface defined as follows, the problem of breakage due to bending of the glass substrate and an inappropriate temperature distribution and the deterioration of quality caused by glass particles are suppressed as much as possible.
  • the chamfered surface has a valley portion having such a depth that tearing develops due to heat or bending tensile stress.
  • the glass substrate is not easily damaged, and the glass particles hardly remain in the valleys.
  • the maximum valley depth Rv of the chamfered surface formed at the boundary portion is 1.5 ⁇ m or less.
  • the maximum valley depth Rv on the chamfered surface of the glass substrate is smaller than the maximum valley depth Rv of the end surface connected to the chamfered surface. That is, it has been found that when stress is generated inside the glass substrate due to bending of the glass substrate or an inappropriate temperature distribution, these stresses are most likely to occur near the boundary.
  • the maximum valley depth Rv of the boundary portion (chamfered surface) is made smaller than the maximum valley depth Rv of the end surface, a deep valley portion that causes the stress concentration is generated from the boundary portion where stress concentration easily occurs. It will be reduced or disappeared. As a result, it is possible to reduce as much as possible the damage caused by the bending of the glass substrate and the inappropriate temperature distribution, and in addition to this, the problem of remaining glass particles is avoided.
  • the maximum valley depth Rv at the end face of the glass substrate is smaller than the maximum valley depth Rv at the chamfered surface of the boundary portion, although it becomes excessive quality from the viewpoint of surface properties, it is a problem of breakage and glass particles. There will be no hindrance. Even in the glass substrate according to the fourth invention, the above-described advantages can be obtained even if the strengthening process (thermal strengthening process) is not performed or is performed.
  • the chamfered surface is preferably formed by a polishing process.
  • the surface properties (Rzjis and RSm, second in the first invention) Rvk in the present invention, R ⁇ q in the third invention, and Rv in the fourth invention) can be made uniform. Therefore, a chamfer having a uniform surface property over the entire length in the longitudinal direction at the boundary portion of a single glass substrate. A surface can be formed. In addition, it is possible to form a chamfered surface having the same surface property at each boundary portion for a plurality of glass substrates, regardless of the difference in glass substrates, and to reduce variation in quality. Become.
  • the chamfered surface is formed by a polishing process after the end surface is polished.
  • the surface properties of the end surface are appropriately improved (Rzjis is reduced and RSm is increased in the first invention, Rvk is reduced in the second invention, In the third invention, R ⁇ q is reduced, and in the fourth invention, Rv is reduced), and then the surface property of the chamfered surface is made better than the surface property of the end surface by forming a chamfered surface by polishing. It is possible to achieve surface properties that can efficiently solve the problem of glass substrate breakage and particles. Therefore, it is an efficient process from the viewpoint of surface properties.
  • the end surface can be formed as a flat surface between the outer peripheral ends of the front surface and the back surface.
  • the end surface of the glass substrate may be subjected to a polishing process, or a glass substrate that has been divided using a laser, such as laser cutting, is subjected to a polishing process. It does not have to be. That is, when the glass substrate is divided by laser cleaving or the like, the surface properties of the end surface of the glass substrate formed as a flat surface are close to the same surface as the front and back surfaces, so the end surface is polished. Without it, it is sufficient to form a chamfered surface by polishing at the boundary.
  • the end surface can be formed as a curved surface that gradually protrudes outward from the outer peripheral ends of the front and back surfaces to the center portion of the plate thickness.
  • the connecting portion between the chamfered surface and the end surface and the connecting portion between the chamfered surface and the front surface (or the back surface) can be connected via a gentle bent portion, so that the periphery of the chamfered surface This is advantageous in reducing the tensile stress or stress concentration generated in the case.
  • the boundary portion z1 has an uneven shape, and this boundary portion z1 originally exists at the position indicated by the straight line zx, but is actually biased toward the center side of the front surface (or back surface) 2a1. Will exist.
  • Such a phenomenon is caused by the fact that the abrasive grains of the grindstone bite into the front surface (or back surface) 2a1 side rather than the straight line zx that should be the original boundary when the end surface 3b1 of the glass substrate 11 is polished.
  • the grindstone 6b1 of the grindstone is about 45 ° in the vicinity of the straight line zx that should essentially be the boundary between the front surface (or back surface) 2a1 of the glass substrate 11 and the end surface 3b1. If the contact is made with the inclination, the grinding surface 6b1 of the grindstone is not in contact with the actual boundary portion z1. Therefore, the grindstone cannot polish the uneven boundary portion z1 or can only polish a part of the boundary portion z1, and as a result, the uneven boundary portion z is completely polished.
  • the angles ⁇ and ⁇ are preferably set to 45 ° or less. However, when the angles ⁇ and ⁇ are smaller than 10 °, the polishing region on the end surface side when the chamfered surface is formed by polishing becomes narrow. In order to avoid glass chipping or chipping or cracks remaining at the boundary between the end surface and the front surface (or the back surface), the polishing region is on the front surface side (or the back surface side). ) Is required to be widened, resulting in an unfavorable form as a boundary.
  • angles ⁇ and ⁇ exceed 30 °, the chamfered surface cannot be formed unless the polishing region on the end surface side is excessively wide when the chamfered surface is formed by polishing. Invite the deterioration. Therefore, if the angles ⁇ and ⁇ are within the above numerical range, these problems do not occur. From such a viewpoint, more preferably, the lower limits of the angles ⁇ and ⁇ are 15 ° and the upper limit is 20 °.
  • the plate thickness T preferably satisfies the relationship of 0.05 mm ⁇ T ⁇ 1.1 mm.
  • the thickness T of the glass substrate exceeds 1.1 mm, the influence of the thickness T of the glass substrate on the strength of the glass substrate increases, and the stress due to the bending or the inappropriate temperature distribution that leads to the breakage of the glass substrate described above. There is a possibility that the effects unique to the present invention (first to fourth inventions) for combating the above cannot be fully exhibited.
  • the plate thickness T of the glass substrate is less than 0.05 mm, it may be difficult to perform an appropriate polishing process on the boundary portion between both the front surface and the back surface. Therefore, if the thickness T of the glass substrate is within the above numerical range, such a problem can be avoided. From these viewpoints, more preferably, the lower limit value of the plate thickness T of the glass substrate is 0.1 mm, and the upper limit value is 0.7 mm.
  • the plate thickness T and the width W in the direction perpendicular to the longitudinal direction of the chamfered surface satisfy the relationship of 0.07 ⁇ W / T ⁇ 0.30.
  • the chamfered surface of the glass substrate having the above configuration is formed over the entire length of the side.
  • an invention of a method created to solve the above technical problem is a method of manufacturing a glass substrate formed with the above-mentioned chamfered surface, and a rotating shaft as a polishing tool for polishing the chamfered surface.
  • a rotary polishing tool having a polishing surface orthogonal to the surface, and forming the roughness of the outer peripheral portion of the polishing surface to be smaller than the roughness of the inner peripheral portion, and at least one of the front and back surfaces of the glass substrate;
  • the polishing surface (abrasive surface) of the rotary polishing tool is orthogonal to the rotation axis, and the roughness of the outer peripheral portion of the polishing surface is smaller than the roughness of the inner peripheral portion.
  • the occurrence of chipping or cracking at the rear end of the chamfered surface due to the vibration of the rotary polishing tool acting on the chamfered surface from the rear end in the moving direction of the polishing surface is suppressed, and due to relative rough polishing.
  • the fine grinding powder or glass powder remaining on the chamfered surface is removed.
  • a series of polishing processes including fine polishing (relative polishing), relative rough polishing, and final polishing are performed along the relative linear movement of a single rotary polishing tool. Since the chamfered surface can be formed in a short time while suppressing the occurrence of chips and cracks, the device is simplified and the quality around the chamfered surface is improved. Once secured, productivity can be significantly improved.
  • either one or both of the rotary polishing tool and the glass substrate may be linearly moved.
  • the glass substrate It is advantageous to move the rotating polishing tool in the longitudinal direction of the boundary portion while the tool is fixed on the work table or the like. It is advantageous to move the substrate linearly across the polishing surface.
  • the surface property of the chamfered surface can be made suitable by bringing the rotary polishing tool into elastic contact with an elastic body such as a spring and press-contacting the boundary portion of the glass substrate. .
  • an invention of a method created to solve the above technical problem is a method of manufacturing a glass substrate formed by forming a chamfered surface after the above-described end surface polishing treatment, and the method is directed to the end surface of the glass substrate.
  • the final polishing process is performed, and then, polishing at a boundary portion between at least one of the front surface and the back surface of the glass substrate and the end surface has a finer particle size than the final polishing process.
  • the chamfered surface is formed by performing a specific polishing process using a tool.
  • the end face of the glass substrate can be polished efficiently in a short time by rough polishing and finish polishing, for example, in a substantially arc-shaped cross section, and the end face is further polished at a finer grain size as subsequent polishing.
  • the chamfered surface is formed with a finer-grained polishing tool at the boundary portion, instead of being polished to the same shape with a tool. Therefore, the end face strength can be efficiently improved by optimizing the three kinds of surface properties of the end face, the chamfered face, and the front and back faces.
  • a polishing tool for performing rough polishing processing of the end surface preferably, by arranging a polishing tool for performing rough polishing processing of the end surface, a polishing tool for performing final polishing processing of the end surface, and a polishing tool for performing specific polishing processing on the same path,
  • Each polishing tool can perform each polishing process while continuously moving relatively linearly, and compared with the case where each process is performed separately, the processing time is greatly reduced and the productivity is improved. It becomes possible to plan.
  • the surface property of the chamfered surface is made suitable by bringing the polishing tool for performing the specific polishing treatment into pressure contact with the boundary portion of the glass substrate in a state where the polishing tool is elastically supported using an elastic body such as a spring. can do.
  • a chamfered surface is formed at a boundary portion existing between at least one of the front and back surfaces of the glass substrate and the end surface, and the surface properties of the chamfered surface use appropriate parameters. Therefore, even if tensile stress is generated on the chamfered surface due to bending of the glass substrate or an inappropriate temperature distribution, stress that causes cracking or chipping of the glass substrate. Concentration is less likely to occur, the probability of breakage is drastically reduced, and glass particles are less likely to stay and improve the quality of the product.
  • FIG. 1 is an enlarged longitudinal sectional view of a main part of the glass substrate 1 according to the present embodiment.
  • the glass substrate 1 has a planar surface 2a, an end surface 3 having a convex arcuate cross section, and a planar chamfer formed between the surface 2a and the end surface 3.
  • Surface 4 In other words, in the glass substrate 1, the end surface 3 existing between the outer peripheral ends of the front surface 2 a and the back surface, and the front surface 2 a and the back surface are connected via the chamfered surfaces 4, respectively.
  • this glass substrate 1 is not subjected to the tempering process (thermal tempering process or the like), the glass substrate 1 may be subjected to the process.
  • the end surface 3 of the glass substrate 1 is a polished surface that has been subjected to a final polishing process after being subjected to a rough polishing process
  • the surface 2a is a molded surface, that is, an unpolished surface, and is chamfered.
  • the surface 4 is a specific polished surface that has been subjected to a specific polishing process after the final polishing process of the end surface 3.
  • Ten-point average roughness Rz 2 of the chamfered surface 4 of the glass substrate 1 is smaller than the ten-point average roughness Rz 1 of the end face 3, and an average length RSm 2 of the roughness curve element of the chamfered surface 4, It is made larger than the average length RSm 1 of the roughness curve element of the end face 3.
  • the surface 2a since a mirror surface, the average roughness thereof ten-point is smaller than the ten-point average roughness Rz 2 of the chamfered surface 4, and the average length of the roughness curve element chamfer It is larger than the average length RSm 2 of the roughness curve element of 4.
  • the ten-point average roughness Rz 2 of the chamfered surface 4 is 1.5 ⁇ m or less, and the ratio Rz 1 / Rz 2 to the ten-point average roughness Rz 1 of the polished surface of the end face 3 is 1 .5 or more and 10.0 or less.
  • the average length RSm 2 of the roughness curve element of the chamfered surface 4 is 100 ⁇ m or more, and RSm 1 / RSm 2 , which is a ratio with the average length RSm 1 of the roughness curve element of the end face 3, is 0. .1 or more and 0.7 or less.
  • the protruding valley depth Rvk of the chamfered surface 4 of the glass substrate 1 is 0.95 or less (preferably 0.20 or less). Since the surface 2 a is a mirror surface, the protruding valley depth Rvk is smaller than the protruding valley depth Rvk of the chamfered surface 4.
  • the root mean square slope R ⁇ q of the roughness curve of the chamfered surface 4 of the glass substrate 1 is 0.10 or less (preferably 0.05 or less). Since the surface 2a is a mirror surface, the root mean square slope R ⁇ q of the roughness curve thereof is smaller than the root mean square slope R ⁇ q of the roughness curve of the chamfered surface 4.
  • the maximum valley depth Rv of the chamfered surface 4 of the glass substrate 1 is set to 2.0 ⁇ m or less (preferably 1.5 ⁇ m or less). Since the surface 2 a is a mirror surface, the maximum valley depth Rv is smaller than the maximum valley depth Rv of the chamfered surface 4.
  • the angle ⁇ between the tangent line A to the surface 2a side of the chamfered surface 4 and the surface 2a is 10 ° or more and 30 ° or less (18 ° in the present embodiment), and although not shown, the chamfered surface on the back surface also has an angle formed between the tangent to the back surface side and the back surface of 10 ° or more and It is 30 degrees or less (18 degrees in this embodiment).
  • the chamfered surface 4 is a periphery of the original boundary portion z that forms a waveform between the surface 2a and the end surface 3 in a state where the polishing process of the end surface 3 has been performed (a periphery of a portion indicated by a broken line in FIG. Is removed by a specific polishing process, and the removed portion has a width W1 from the original boundary z to the end surface 3 side of 70 ⁇ m and a width W2 from the original boundary z to the surface 2a side.
  • the region is 30 ⁇ m.
  • the angle ⁇ formed between the tangent line B of the original boundary portion z and the surface 2a is 25 ° in the present embodiment.
  • the glass substrate 1 has a thickness T of 1.1 mm or less and 0.05 mm or more, and is orthogonal to the width W of the chamfered surface 4 (longitudinal direction of the chamfered surface 4 (direction along the side)).
  • W / T which is the ratio of the thickness 2 in the direction parallel to the front surface 2a and the back surface) and the plate thickness T, is set to be 0.07 or more and 0.30 or less.
  • the glass substrate 1 having the above-described configuration is manufactured as follows.
  • Fig. 2 shows scribing at four locations on the surface of the glass glass after molding by the downdraw method, float method, etc., so that areas with roughly rectangular engraving lines are drawn, and the scribe marks are the starting points.
  • a substantially rectangular glass substrate 1 obtained by folding a glass original plate and a polishing tool 5 for polishing the end surface portion 3a of the glass substrate 1 that has been broken are illustrated.
  • the end surface portion 3a of the glass substrate 1 is first subjected to a rough polishing process using a first polishing tool, and then a final polishing process using a second polishing tool. As shown in FIG.
  • the first polishing tool is a rough polishing rotary grindstone wheel (metal) that is formed by attaching a diamond abrasive grain layer held by a metal bond to an outer peripheral surface having a concave arc shape when viewed from the front. Bond diamond wheel). Then, with the first polishing tool pressed against the end surface portion 3a of the glass substrate 1, the first polishing tool is relatively moved in the longitudinal direction (direction along the side) of the end surface portion 3a of the glass substrate 1. Rough polishing is performed.
  • the second polishing tool is a grinding wheel for finishing polishing (resin bond wheel) having the same shape as the first polishing tool, and fine abrasive grains such as silicon carbide bonded to the outer peripheral surface thereof with polyurethane resin or the like.
  • the second polishing tool is subjected to a final polishing process by moving in the same manner as described above while being pressed against the end surface of the glass substrate 1 subjected to the rough polishing process.
  • the glass substrate 1 has a ten-point average roughness Rzjis of about 1 to 3 ⁇ m, a protruding valley depth Rvk of about 1.0 to 1.5, and a root mean square slope R ⁇ q of the roughness curve of about 0.12 to 0. 20.
  • An end surface 3b having a substantially arc-shaped cross section having a maximum valley depth Rv of about 3.0 to 5.0 ⁇ m is formed.
  • the formation of the end face 3b of the glass substrate 1 is not limited to the two-stage polishing process as described above, and may be performed by a three-stage or more polishing process.
  • the end surface 3b having a substantially arc-shaped cross section is formed on the glass substrate 1, the boundary portion z between the end surface 3b and the surface 2a, and the boundary portion z between the end surface 3b and the back surface 2b,
  • the chamfered surface 4 is formed by performing a specific polishing process using the third polishing tool 6.
  • the third polishing tool 6 has a flat polishing surface (abrasive surface) 6b orthogonal to the rotation shaft 6a.
  • the polishing surface 6b is finer than the second polishing tool. It is made of abrasive grains.
  • the glass substrate 1 is set on the upper surface of the work table (surface plate) 7 with the periphery of the end surface 3b protruding.
  • the third polishing tool The specific polishing process is performed by relatively moving 6 in the longitudinal direction of the boundary portion z of the glass substrate 1. Thereby, a large number of glass chippings and the like remaining at the boundary z of the glass substrate 1 are removed.
  • the angles formed between the polishing surfaces 6b of the two third polishing tools 6 and the front surface 2a and the back surface 2b of the glass substrate 1 are each set to 10 ° or more and 30 ° or less (18 ° in this embodiment). .
  • the third polishing tool 6 is a concave portion having a circular central portion, and an inner peripheral side polishing portion 6 ba having a relatively small roughness so as to surround the concave portion, and the roughness Are arranged with a relatively large outer peripheral side polishing portion 6bb, and the boundary portion z of the glass substrate 1 is subjected to a specific polishing treatment by both of the polishing portions 6ba and 6bb. Note that the two third polishing tools 6 are spaced apart from each other in the relative movement direction.
  • a chamfered surface 4 is obtained by completely removing the boundary portion z between the surface 2a and the end surface 3 of the glass substrate 1. It is formed.
  • the chamfered surface 4 even if a tensile stress caused by the bending of the glass substrate 1 or an inappropriate temperature distribution acts on the chamfered surface 4, no stress concentration occurs on the chamfered surface 4, and the end surface 3 (including the chamfered surface 4) is increased in strength, and the problem of remaining glass particles or glass chipping remaining is also avoided.
  • the present invention is applied to the glass substrate 1 in which the end surface 3 is curved outwardly from the outer peripheral ends of the front surface 2a and the back surface 2b, but the end surface 3 is a flat surface (preferably The present invention can be similarly applied to a glass substrate having a flat surface perpendicular to the front and back surfaces.
  • the present invention is applied to the glass substrate on which the end surface forming the curved surface that gradually protrudes outward from the outer peripheral edge of the front surface and the back surface to the central portion of the plate thickness.
  • the present invention can be similarly applied to a glass substrate in which an end surface forming a flat surface perpendicular to these surfaces is formed between them.
  • this invention was applied to the glass substrate formed by dividing
  • the present invention can be similarly applied to.
  • the polishing process is not performed on the end surface forming the flat surface, and the chamfered surface is formed only by the polishing process on the boundary portion.
  • the present invention is applied to a glass substrate for FPD.
  • the present invention can also be applied to a glass substrate for organic EL lighting or a solar cell, for example.
  • Examples 1a to 1c and Comparative Examples 1a and 1b of the present invention shown in Table 1 below as a sample to be used, a glass original plate having a plate thickness of 700 ⁇ m is split along a scribe mark so as to have a short side dimension. A glass substrate having a length of 1500 mm and a long side dimension of 1800 mm was obtained. Similarly, for Examples 1d and 1e and Comparative Example 1c, as a sample to be used, a glass original plate having a plate thickness of 500 ⁇ m is folded and divided along a scribe mark so that a short side dimension is 550 mm and a long side dimension is Obtained a glass substrate of 670 mm.
  • a rough polishing as a first polishing tool having the form shown in FIG. 2 in a state where a glass substrate is placed on a surface plate and fixed by suction.
  • the outer peripheral surface of the polishing grindstone (abrasive grain # 400) is brought into pressure contact with the end surface portion of the glass substrate and linearly moved at the grinding speed shown in Table 1 to obtain an end surface portion that is a rough surface having a substantially arc-shaped cross section. Formed.
  • the outer peripheral surface of the rotary grindstone for finishing polishing (abrasive grain # 1000) as the second polishing tool having the form shown in FIG.
  • the final polishing rotary grindstone (abrasive grain # 1000) as the second polishing tool having the form shown in FIG. ) was pressed into contact with the end surface of the glass substrate after rough polishing to form an end surface that was finished and polished into a substantially circular arc cross section.
  • a specific polishing process was performed with a third polishing tool on each boundary portion between the end surface, the front surface, and the back surface of the glass substrate.
  • the third polishing tool there was used a flat diamond polishing plate in which diamond abrasive grains were dispersed in a resin material on a circular base.
  • size of the abrasive grain shown to Table 1, 2 are based on JISR6001: 1998.
  • the angle formed by the front and back surfaces of the glass substrate and the tangent line of the chamfered surface is 18 ° to 22 ° as appropriate.
  • a grinding liquid grinding water
  • the third polishing tool polishing plate
  • it is linearly moved at different grinding speeds as shown in Tables 1 and 2, and near the corner portion.
  • a specific polishing treatment was performed over the entire outer periphery of the glass substrate except for. As described above, the glass substrates of Examples 1a to 1c and Examples 1d and 1e were obtained.
  • the abrasive grains of the third polishing tool are # 3000, and in Examples 1c and 1e, the abrasive grains of the third polishing tool are # 2000, whereas in Comparative Examples 1a to 1c, Without performing the specific polishing process with the third polishing tool, only the rough polishing process with the first polishing tool and the final polishing process with the second polishing tool were performed on the end surface portion of the glass substrate.
  • the moving speed and grinding conditions of the third polishing tool are selected so that the chamfer dimension (chamfer width) is in the range of 60 to 200 ⁇ m, and all the end surfaces of the glass substrate as a sample are selected. A substantially flat chamfered surface was formed at the boundary between the front surface and the back surface.
  • a method of forming a chamfered surface at the boundary between the front surface and the back surface of the end surface using the third polishing tool after forming a substantially arc-shaped polished surface on the end surface portion of the glass substrate is installed on the same traveling rail in a state where the glass substrate is sucked and fixed on the surface plate, and simultaneously along the traveling rail. You may make it complete
  • the roughness was measured at a measurement length of 5.0 mm using Surfcom 590A manufactured by Tokyo Seimitsu Co., Ltd., and the glass was measured according to JIS B0601: 2001.
  • the roughness parameters of the ten-point average roughness Rzjis (Rz 1 , Rz 2 ) and the average length RSm (RSm 1 , RSm 2 ) value of the roughness curve element of the end face and chamfered surface of the substrate were calculated.
  • the ten-point average roughness Rz 1 , Rz 2 and the average length RSm 1 , RSm 2 of the roughness curve element were subjected to chamfering treatment on 10 glass substrates under the same conditions, and 10 times for each. Measurements were made and evaluated by calculating the average value. The results are shown in Tables 1 and 2 below.
  • the breaking strength was measured by a three-point bending test method using Orientec's Tensilon RTA-250.
  • a test piece obtained by cutting out the central part of the side of the end face of the glass substrate into a size of 80 ⁇ 15 mm is used, and the load is applied with the apex of the end face (the apex of the substantially arc of the cross section) facing upward.
  • the fracture stress (end face strength) ⁇ was measured by applying the load, measuring the load at the time of breakage, and calculating by the equation shown in the following formula 1.
  • P is the breaking load
  • L is the distance between fulcrums
  • B is the sample width
  • h is the glass thickness.
  • Examples 1a to 1e of the present invention have a small ten-point average roughness at the boundary between the front surface and the back surface of the end surface of the glass substrate and are close to a mirror surface.
  • a chamfered surface having a sufficient width is formed, and the fracture strength (that is, the end surface strength is 160 MPa) is significantly higher than that of a glass substrate having no chamfered surface as in Comparative Examples 1a to 1c. Super).
  • the chamfered surface of each example it was confirmed that no level difference or minute cracks at the polishing boundary due to chipping were observed, and that good or extremely good results were exhibited in all of the adhesion of glass particles and the like.
  • the glass substrate according to each embodiment of the present invention hardly induces breakage in the post-process, becomes extremely high in strength, and generates very little glass particles due to the end face. Further, even when used in a high-resolution display such as an organic EL, it is possible to effectively suppress a disconnection failure that occurs when a display element or device is formed on a glass substrate.
  • the same chamfered surface can be efficiently obtained by appropriately selecting the polishing plate of the polishing tool and setting the grinding conditions. It can be obtained well and the efficiency of the process can be increased.
  • each comparative example not only when the moving speed of the polishing tool is 200 mm / sec or 400 mm / sec but also at a low speed of 100 mm / sec, the minimum fracture strength of the end face is relatively low and the strength is low. There is a risk of causing breakage due to the contact of the conveying means to the end face and the concentration of thermal stress.
  • the particle value is relatively high and the chipping level difference at the boundary is large, for example, in the process such as cleaning, drying, transporting, and packing, the glass is higher than the chipping part at the boundary. Particles may peel off and adhere to the glass substrate, causing a disconnection failure when forming a display element or device. Therefore, it was confirmed that the glass substrate according to each example of the present invention was extremely excellent in both the breaking strength and the glass particle as compared with the glass substrate according to these comparative examples.
  • Examples 2a to 2d and Comparative Examples of the present invention shown in Table 4 below as a sample to be used, a glass original plate having a plate thickness of 700 ⁇ m is scribed and divided into two pieces, whereby the short side dimension is 1500 mm and A glass substrate having a side dimension of 1800 mm was obtained.
  • a scribe was made on the surface of the glass original plate with a diamond tip, and a bending moment was applied to the glass original plate so that a tensile stress was generated on the scribe line.
  • initial scratches are formed on a part of the glass original plate with a diamond wheel, etc., and this part is irradiated with laser to perform local heating, and then cooled rapidly by blowing a refrigerant. It is also possible to cause the initial crack to progress by cutting the glass original plate.
  • the end surface of the glass substrate is a flat surface, and thus has an end surface shape different from those of the glass substrates according to this example and the comparative example.
  • a cylindrical grindstone whose outer peripheral surface is a cylindrical surface (in this example and the comparative example, the outer peripheral surface is recessed in a substantially arc shape) is rotated. Polishing of the end surface is performed by moving the shaft relatively linearly in the longitudinal direction of the end surface while rotating while pressing in a state where the shaft is arranged in parallel with the normal direction of the surface of the glass substrate. .
  • the grindstone for polishing the end surface of the glass substrate a plurality of types of grindstones having different abrasive grains and binders are prepared. First, the grindstone is rough and the binder is hard, and the grindstone is gradually finer and the binder is softer. Changed to
  • a substantially flat chamfered surface was formed by polishing at the boundary between the end surface and the front surface (back surface) of the glass substrate that had been subjected to the end surface polishing treatment.
  • the grindstone used for chamfered surface polishing is finer in abrasive grains and softer in binder than the grindstone for polishing the end face described above.
  • the surface pressed against the chamfered surface may be a cylindrical surface or a conical surface, or may be a substantially flat circular end surface or an annular end surface.
  • the surface of the polishing cloth which fixed the grain may be sufficient.
  • Example 2a shown in Table 4 below will be described specifically.
  • the first polishing tool having the form shown in FIG. 2 in a state where the divided glass substrate is placed on the surface plate and fixed by suction.
  • a rough grinding rotary grindstone # 400 abrasive grains fixed by metal bond
  • the outer peripheral surface is linearly moved while being pressed against the end surface portion of the glass substrate, so that the end surface portion is a rough surface having a substantially arc-shaped cross section. Formed.
  • the outer peripheral surface of the final polishing rotary grindstone (# 1000 abrasive grains fixed by resin bond) as the second polishing tool having the form shown in FIG. 2 is used as the end surface portion after rough polishing of the glass substrate.
  • An end face that was finished and polished into a substantially arc shape in cross section was formed by linearly moving while pressing. Thereafter, a specific polishing process was performed with a third polishing tool on each boundary portion between the end surface, the front surface, and the back surface of the glass substrate.
  • a specific polishing process was performed with a third polishing tool on each boundary portion between the end surface, the front surface, and the back surface of the glass substrate.
  • the third polishing tool a flat diamond polishing plate obtained by dispersing diamond abrasive grains (# 3000 abrasive grains) in a resin material on a circular base was used.
  • the angle formed by the front and back surfaces of the glass substrate and the tangent line of the chamfered surface is 18 ° to 22 ° as appropriate.
  • Example 2a After adjusting the angle of the 3 polishing tool, a grinding liquid (grinding water) was supplied to the contact surface between the third polishing tool and the glass substrate. Then, while rotating the third polishing tool (polishing plate) at a peripheral speed of 2000 m / min so as to obtain a desired chamfered surface width dimension, it extends over the entire outer periphery excluding the vicinity of the corner portion in plan view of the glass substrate. Specific polishing treatment was performed. As described above, a glass substrate of Example 2a was obtained. In addition, the size of the above-mentioned abrasive grains conforms to JIS R6001: 1998. In this case, about Example 2b, 2c, 2d and a comparative example, the abrasive grain of the 1st, 2nd, 3rd polishing tool is different from Example 2a, respectively.
  • a grinding liquid grinding water
  • the protrusion valley depth Rvk of the chamfered surface of the glass substrate and the protrusion valley depth Rvk of the end face shown in Table 4 below are measured over a measurement length of 5.0 mm using a surfcom 590A manufactured by Tokyo Seimitsu Co., Ltd. The measurement was performed, and the value of each Rvk was calculated according to JIS B0601: 2001. Each of these two types of protruding valley depth Rvk was evaluated by measuring the chamfered surface on 10 glass substrates under the same conditions for each of the 10 glass substrates, measuring them 10 times, and calculating an average value thereof. did.
  • the maximum cross-sectional height Pt of the end surface of the glass substrate and the maximum cross-sectional height Pt of the chamfered surface were determined.
  • the strength of the end face of the glass substrate was determined as a measure of the ease with which the glass substrate was bent or damaged by thermal stress.
  • the fracture strength was measured by a three-point bending test method using Orientsil's Tensilon RTA-250, and this was used as the end face strength.
  • a test piece obtained by cutting the center part of the end face part of the glass substrate into a size of 80 ⁇ 15 mm is used, and a load is applied with the apex of the end face part (vertical arc of the cross section) facing upward. Then, the load at the time of breakage was measured, and the fracture stress (end surface strength) ⁇ was measured by calculating with the above-described equation (1).
  • Table 4 below shows the protruding valley depth Rvk of the chamfered surface, the end surface strength, the maximum cross-sectional height Pt of the chamfered surface, and the maximum cross-sectional height Pt of the end surface obtained as described above.
  • the maximum cross-sectional height Pt of the end face and the maximum cross-sectional height Pt of the chamfered surface correspond to the maximum height Rmax in JIS B0601: 1982. It can be considered that it corresponds to unevenness.
  • the maximum height Pt of the chamfered surface of the glass substrate of the comparative example is 5.57 ⁇ m and 7 ⁇ m (0.007 mm) or less, and the maximum height Pt of the end surface is 7.44 ⁇ m. Since it is 40 ⁇ m (0.04 mm) or less, the conditions of the numerical ranges described in Patent Documents 1 and 2 are satisfied.
  • the present inventors have confirmed that the glass substrate according to this comparative example is frequently damaged in the manufacturing process of FPD, organic EL, solar cell and the like. This means that the glass substrate according to the comparative example has insufficient end face strength. Considering this, it can be understood that the end face strength needs to be 160 MPa. And, in Examples 2a to 2d of the present invention, the end face strength exceeds 160 MPa because the protruding valley depth Rvk of the chamfered surface is 0.95 or less, and the end face strength is sufficient. I can grasp.
  • the protrusion valley depth Rvk of the chamfered surface of the glass substrate to be 0.95 or less suppresses the generation of tensile stress due to the bending of the glass substrate and the inappropriate temperature distribution, thereby enabling stress concentration. It can be confirmed that there is a great significance in reducing the amount of damage and preventing breakage of the glass substrate.
  • the glass substrate divided by laser cutting the glass original plate is close to a mirror surface as in the case of the front and back surfaces, the surface property of the flat surface of the glass substrate is similar to the above on the boundary portion of the glass substrate. Even when a chamfered surface is formed, if the projecting valley depth Rvk of the chamfered surface is 0.95 or less, a result equal to or better than the good results shown in Table 4 above can be obtained. I can guess.
  • the inventors of the present invention compared the Examples 3a to 3d of the present invention with the comparative example. This was performed as shown below.
  • OA-10 manufactured by Nippon Electric Glass Co., Ltd. (not subjected to strengthening treatment) formed by the overflow downdraw method was used as a glass original plate.
  • Examples 3a to 3d and Comparative Examples of the present invention shown in Table 5 below as a sample to be used, a short side dimension of 1500 mm and a long length was obtained by putting a scribe into a glass original plate having a plate thickness of 700 ⁇ m and splitting it. A glass substrate having a side dimension of 1800 mm was obtained. As a specific method for dividing the glass original plate, a scribe was made on the surface of the glass original plate with a diamond tip, and a bending moment was applied to the glass original plate so that a tensile stress was generated on the scribe line.
  • initial scratches are formed on a part of the glass original plate with a diamond wheel, etc., and this part is irradiated with laser to perform local heating, and then cooled rapidly by blowing a refrigerant. It is also possible to cause the initial crack to progress by cutting the glass original plate.
  • the end surface of the glass substrate is a flat surface, and thus has an end surface shape different from those of the glass substrates according to the examples and comparative examples.
  • a cylindrical grindstone whose outer peripheral surface is a cylindrical surface (in this example and the comparative example, the outer peripheral surface is recessed in a substantially arc shape) is rotated. Polishing of the end surface is performed by moving the shaft relatively linearly in the longitudinal direction of the end surface while rotating while pressing in a state where the shaft is arranged in parallel with the normal direction of the surface of the glass substrate. .
  • the grindstone for polishing the end surface of the glass substrate a plurality of types of grindstones having different abrasive grains and binders are prepared. First, the grindstone is rough and the binder is hard, and the grindstone is gradually finer and the binder is softer. Changed to
  • a substantially flat chamfered surface was formed by polishing at the boundary between the end surface and the front surface (back surface) of the glass substrate that had been subjected to the end surface polishing treatment.
  • the grindstone used for chamfered surface polishing is finer in abrasive grains and softer in binder than the grindstone for polishing the end face described above.
  • the surface pressed against the chamfered surface may be a cylindrical surface or a conical surface, or may be a substantially flat circular end surface or an annular end surface.
  • the surface of the polishing cloth which fixed the grain may be sufficient.
  • Example 3a shown in Table 5 below will be described in detail.
  • the first polishing tool having the form shown in FIG. 2 in a state where the divided glass substrate is placed on a surface plate and fixed by suction.
  • a rough grinding rotary grindstone # 400 abrasive grains fixed by metal bond
  • the outer peripheral surface is linearly moved while being pressed against the end surface portion of the glass substrate, so that the end surface portion is a rough surface having a substantially arc-shaped cross section. Formed.
  • the outer peripheral surface of the final polishing rotary grindstone (# 1000 abrasive grains fixed by resin bond) as the second polishing tool having the form shown in FIG. 2 is used as the end surface portion after rough polishing of the glass substrate.
  • An end face that was finished and polished into a substantially arc shape in cross section was formed by linearly moving while pressing. Thereafter, a specific polishing process was performed with a third polishing tool on each boundary portion between the end surface, the front surface, and the back surface of the glass substrate.
  • a specific polishing process was performed with a third polishing tool on each boundary portion between the end surface, the front surface, and the back surface of the glass substrate.
  • the third polishing tool a flat diamond polishing plate obtained by dispersing diamond abrasive grains (# 3000 abrasive grains) in a resin material on a circular base was used.
  • the angle formed by the front and back surfaces of the glass substrate and the tangent line of the chamfered surface is 18 ° to 22 ° as appropriate.
  • Example 3a After adjusting the angle of the 3 polishing tool, a grinding liquid (grinding water) was supplied to the contact surface between the third polishing tool and the glass substrate. Then, while rotating the third polishing tool (polishing plate) at a peripheral speed of 2000 m / min so as to obtain a desired chamfered surface width dimension, it extends over the entire outer periphery excluding the vicinity of the corner portion in plan view of the glass substrate. Specific polishing treatment was performed. As described above, a glass substrate of Example 3a was obtained. In addition, the size of the above-mentioned abrasive grains conforms to JIS R6001: 1998. In this case, about Example 3b, 3c, 3d and a comparative example, the abrasive grain of a 1st, 2nd, 3rd polishing tool is different from Example 3a, respectively.
  • a grinding liquid grinding water
  • the root mean square slope R ⁇ q of the chamfered surface roughness curve and the root mean square slope R ⁇ q of the end surface roughness curve of the glass substrate shown in Table 5 below were measured using a Surfcom 590A manufactured by Tokyo Seimitsu Co., Ltd. The roughness was measured over 0 mm, and the value of each R ⁇ q was calculated according to JIS BO601: 2001.
  • Each of these two types of root-mean-square slope R ⁇ q was evaluated by measuring a chamfered surface on 10 glass substrates under the same conditions for each of them, measuring them 10 times, and calculating the average value. .
  • the maximum cross-sectional height Pt of the end surface of the glass substrate and the maximum cross-sectional height Pt of the chamfered surface were determined.
  • the strength of the end face of the glass substrate was determined as a measure of the ease with which the glass substrate is bent or damaged by thermal stress.
  • the fracture strength was measured by a three-point bending test method using Orientsil's Tensilon RTA-250, and this was used as the end face strength.
  • a test piece obtained by cutting the center part of the side of the end face of the glass substrate into a size of 80 ⁇ 15 mm is used, and a load is applied with the apex of the end face (vertical arc of the cross section) facing upward. Then, the load at the time of breakage was measured, and the fracture stress (end surface strength) ⁇ was measured by calculating with the above-described equation (1).
  • Table 5 below shows the root mean square slope R ⁇ q of the chamfered surface, the end surface strength, the maximum cross-sectional height Pt of the chamfered surface, and the maximum cross-sectional height Pt of the end surface obtained as described above.
  • the maximum cross-sectional height Pt of the end surface and the maximum cross-sectional height Pt of the chamfered surface are JIS Since it corresponds to the maximum height Rmax in B0601: 1982, it can be considered that it corresponds to the maximum surface unevenness of Patent Documents 1 and 2 described above.
  • the maximum height Pt of the chamfered surface of the glass substrate of the comparative example is 5.57 ⁇ m and 7 ⁇ m (0.007 mm) or less, and the maximum height Pt of the end surface is 7.44 ⁇ m. Since it is 40 ⁇ m (0.04 mm) or less, the conditions of the numerical ranges described in Patent Documents 1 and 2 are satisfied.
  • the present inventors have confirmed that the glass substrate according to this comparative example is frequently damaged in the manufacturing process of FPD, organic EL, solar cell and the like. This means that the glass substrate according to the comparative example has insufficient end face strength. Considering this, it can be understood that the end face strength needs to be 160 MPa. In Examples 3a to 3d of the present invention, the root mean square slope R ⁇ q of the chamfered surface is 0.10 or less, so that the end face strength exceeds 160 MPa, and it is understood that the end face strength is sufficient. it can.
  • the glass substrate divided by laser cutting the glass original plate is close to a mirror surface as in the case of the front and back surfaces, the surface property of the flat surface of the glass substrate is similar to the above on the boundary portion of the glass substrate. Even when a chamfered surface is formed, if the root mean square slope R ⁇ q of the chamfered surface is 0.10 or less, it is estimated that a result equal to or better than the good results shown in Table 5 above can be obtained. it can.
  • the present inventors show the comparison between Examples 4a to 4d of the present invention and the comparative example. It was done like that.
  • OA-10 manufactured by Nippon Electric Glass Co., Ltd. (not subjected to strengthening treatment) formed by the overflow downdraw method was used as a glass original plate.
  • Examples 4a to 4d and Comparative Examples of the present invention shown in Table 6 below as a sample to be used, a short side dimension of 1500 mm and a long length was obtained by putting a scribe into a glass original plate having a plate thickness of 700 ⁇ m and splitting it. A glass substrate having a side dimension of 1800 mm was obtained. As a specific method for dividing the glass original plate, a scribe was made on the surface of the glass original plate with a diamond tip, and a bending moment was applied to the glass original plate so that a tensile stress was generated on the scribe line.
  • initial scratches are formed on a part of the glass original plate with a diamond wheel, etc., and this part is irradiated with laser to perform local heating, and then cooled rapidly by blowing a refrigerant. It is also possible to cause the initial crack to progress by cutting the glass original plate.
  • the end surface of the glass substrate is a flat surface, and thus has an end surface shape different from those of the glass substrates according to the examples and comparative examples.
  • a cylindrical grindstone whose outer peripheral surface is a cylindrical surface (in this example and the comparative example, the outer peripheral surface is recessed in a substantially arc shape) is rotated. Polishing of the end surface is performed by moving the shaft relatively linearly in the longitudinal direction of the end surface while rotating while pressing in a state where the shaft is arranged in parallel with the normal direction of the surface of the glass substrate. .
  • the grindstone for polishing the end surface of the glass substrate a plurality of types of grindstones having different abrasive grains and binders are prepared. First, the grindstone is rough and the binder is hard, and the grindstone is gradually finer and the binder is softer. Changed to
  • a substantially flat chamfered surface was formed by polishing at the boundary between the end surface and the front surface (back surface) of the glass substrate that had been subjected to the end surface polishing treatment.
  • the grindstone used for chamfered surface polishing is finer in abrasive grains and softer in binder than the grindstone for polishing the end face described above.
  • the surface pressed against the chamfered surface may be a cylindrical surface or a conical surface, or may be a substantially flat circular end surface or an annular end surface.
  • the surface of the polishing cloth which fixed the grain may be sufficient.
  • Example 4a shown in Table 6 below will be described specifically.
  • the first polishing tool having the form shown in FIG. 2 in a state where the divided glass substrate is placed on a surface plate and fixed by suction.
  • a rough grinding rotary grindstone # 400 abrasive grains fixed by metal bond
  • the outer peripheral surface is linearly moved while being pressed against the end surface portion of the glass substrate, so that the end surface portion is a rough surface having a substantially arc-shaped cross section. Formed.
  • the outer peripheral surface of the final polishing rotary grindstone (# 1000 abrasive grains fixed by resin bond) as the second polishing tool having the form shown in FIG. 2 is used as the end surface portion after rough polishing of the glass substrate.
  • An end face that was finished and polished into a substantially arc shape in cross section was formed by linearly moving while pressing. Thereafter, a specific polishing process was performed with a third polishing tool on each boundary portion between the end surface, the front surface, and the back surface of the glass substrate.
  • a specific polishing process was performed with a third polishing tool on each boundary portion between the end surface, the front surface, and the back surface of the glass substrate.
  • the third polishing tool a flat diamond polishing plate obtained by dispersing diamond abrasive grains (# 3000 abrasive grains) in a resin material on a circular base was used.
  • the angle formed by the front and back surfaces of the glass substrate and the tangent line of the chamfered surface is 18 ° to 22 ° as appropriate.
  • Example 4a After adjusting the angle of the 3 polishing tool, a grinding liquid (grinding water) was supplied to the contact surface between the third polishing tool and the glass substrate. Then, while rotating the third polishing tool (polishing plate) at a peripheral speed of 2000 m / min so as to obtain a desired chamfered surface width dimension, it extends over the entire outer periphery excluding the vicinity of the corner portion in plan view of the glass substrate. Specific polishing treatment was performed. As described above, a glass substrate of Example 4a was obtained. In addition, the size of the above-mentioned abrasive grains conforms to JIS R6001: 1998. In this case, about Example 4b, 4c, 4d and a comparative example, the abrasive grain of the 1st, 2nd, 3rd polishing tool is different from Example 4a, respectively.
  • a grinding liquid grinding water
  • the maximum valley depth Rv of the chamfered surface in the glass substrate shown in Table 6 below is measured with a surfcom 590A manufactured by Tokyo Seimitsu Co., Ltd., and the roughness is measured over a measurement length of 5.0 mm, according to JIS B0601: 2001. The value was calculated.
  • This maximum valley depth Rv was evaluated by measuring 10 times of chamfered surfaces on 10 glass substrates under the same conditions and calculating an average value thereof.
  • the maximum cross-sectional height Pt of the end surface of the glass substrate and the maximum cross-sectional height Pt of the chamfered surface were determined.
  • the strength of the end face of the glass substrate was determined as a measure of the ease with which the glass substrate is bent or damaged by thermal stress.
  • the fracture strength was measured by a three-point bending test method using Orientsil's Tensilon RTA-250, and this was used as the end face strength.
  • a test piece obtained by cutting the center part of the side of the end face of the glass substrate into a size of 80 ⁇ 15 mm is used, and a load is applied with the apex of the end face (vertical arc of the cross section) facing upward. Then, the load at the time of breakage was measured, and the fracture stress (end surface strength) ⁇ was measured by calculating with the above-described equation (1).
  • Table 6 below shows the maximum chamfer depth Rv, end face strength ⁇ , maximum cross section height Pt of the chamfered face, and maximum cross section height Pt of the end face obtained as described above.
  • the maximum cross-sectional height Pt of the end surface and the maximum cross-sectional height Pt of the chamfered surface are JIS Since it corresponds to the maximum height Rmax in B0601: 1982, it can be considered that it corresponds to the maximum surface unevenness of Patent Documents 1 and 2 described above.
  • the maximum height Pt of the chamfered surface is 5.57 ⁇ m and 7 ⁇ m (0.007 mm) or less, and the maximum height Pt of the end surface is 7.44 ⁇ m. Since it is 40 ⁇ m (0.04 mm) or less, the conditions of the numerical ranges described in Patent Documents 1 and 2 are satisfied.
  • the present inventors have confirmed that the glass substrate according to this comparative example is frequently damaged in the manufacturing process of FPD, organic EL, solar cell and the like. This means that the glass substrate according to the comparative example has insufficient end face strength. Considering this, it can be understood that the end face strength needs to be 160 MPa. In Examples 4a to 4d of the present invention, it is understood that the end face strength exceeds 160 MPa because the maximum valley depth Rv of the chamfered surface is 2.0 ⁇ m or less, and the end face strength is sufficient. it can.
  • the maximum valley depth Rv of the chamfered surface of the glass substrate to be 2.0 ⁇ m or less suppresses the generation of tensile stress due to the bending of the glass substrate or an inappropriate temperature distribution, thereby allowing stress concentration as much as possible. It was confirmed that there was a great significance in reducing the glass substrate and preventing breakage of the glass substrate.
  • the glass substrate divided by laser cutting the glass original plate is close to a mirror surface as in the case of the front and back surfaces, the surface property of the flat surface of the glass substrate is similar to the above on the boundary portion of the glass substrate. Even when a chamfered surface is formed, if the maximum valley depth Rv of the chamfered surface is 2.0 ⁇ m or less, it is estimated that a result equal to or better than the good results shown in Table 6 above can be obtained. it can.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

La présente invention se rapporte à un substrat de verre (1) comportant la surface avant (2a), la surface arrière (2b), et la surface d'arête (3b) entre les extrémités circonférentielles extérieures des deux surfaces (2a, 2b). Une surface chanfreinée (4) est formée sur la section limite entre la surface avant (2a) et/ou la surface arrière (2b) et la surface d'arête (3b), la rugosité moyenne en dix points (Rz2) de la surface chanfreinée (4) est inférieure à la rugosité moyenne en dix points (Rz1) de la surface d'arête (3b), et la longueur moyenne (RSm2) des éléments de courbe de rugosité de la surface chanfreinée (4) est supérieure à la longueur moyenne (RSm1) des éléments de courbe de rugosité de la surface d'arête. De préférence, la rugosité moyenne en dix points (Rz2) de la surface chanfreinée (4) et la rugosité moyenne en dix points (Rz1) de la surface d'arête (3b) répondent aux inégalités de Rz1≤1,5 et 1,5≤Rz1/Rz2≤10,0.
PCT/JP2010/053800 2009-03-10 2010-03-08 Substrat de verre et son procédé de fabrication WO2010104039A1 (fr)

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JP2009240674A JP5516941B2 (ja) 2009-10-19 2009-10-19 ガラス基板およびその製造方法
JP2009-240672 2009-10-19
JP2009-240674 2009-10-19
JP2010-000570 2010-01-05
JP2010000570A JP5516952B2 (ja) 2010-01-05 2010-01-05 ガラス基板およびその製造方法
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Cited By (14)

* Cited by examiner, † Cited by third party
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JP2011241126A (ja) * 2010-05-20 2011-12-01 Nippon Electric Glass Co Ltd ガラス基板およびその製造方法
WO2012090378A1 (fr) * 2010-12-27 2012-07-05 コニカミノルタオプト株式会社 Procédé de fabrication de substrat en verre pour support d'enregistrement magnétique d'informations
JP2012185891A (ja) * 2011-03-07 2012-09-27 Asahi Glass Co Ltd 磁気記録媒体用ガラス基板の製造方法および磁気記録媒体用ガラス基板
JP2012256426A (ja) * 2012-10-01 2012-12-27 Asahi Glass Co Ltd 磁気記録媒体用ガラス基板
WO2013031547A1 (fr) * 2011-08-29 2013-03-07 旭硝子株式会社 Plaque de verre, et procédé de fabrication de plaque de verre
JP2014001123A (ja) * 2012-05-25 2014-01-09 Asahi Glass Co Ltd 化学強化ガラス板、カバーガラスおよびディスプレイ装置
WO2014027546A1 (fr) * 2012-08-13 2014-02-20 旭硝子株式会社 Substrat de verre et procédé de fabrication de substrat de verre
KR20140063611A (ko) 2011-08-29 2014-05-27 아사히 가라스 가부시키가이샤 유리판
JP5668828B1 (ja) * 2013-11-22 2015-02-12 旭硝子株式会社 化学強化ガラス板
WO2017030112A1 (fr) * 2015-08-19 2017-02-23 旭硝子株式会社 Plaque de verre
JP2019055534A (ja) * 2017-09-21 2019-04-11 日東電工株式会社 薄ガラス積層体
DE102016013491B4 (de) 2015-11-13 2020-07-23 AGC Inc. Platte mit einer Druckschicht und Anzeigevorrichtung, bei der diese verwendet wird
US11307458B2 (en) 2020-09-23 2022-04-19 Luca HUNG Display device
EP3998245A4 (fr) * 2019-07-10 2023-08-02 Agc Inc. Substrat de verre et son procédé de fabrication

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JP2009134802A (ja) * 2007-11-29 2009-06-18 Furukawa Electric Co Ltd:The 磁気ディスク用ガラス基板および磁気ディスク装置
WO2009084683A1 (fr) * 2007-12-28 2009-07-09 Hoya Corporation Procédé de support de fabrication de disque magnétique, procédé de fabrication de disque magnétique, conditionnement de substrat en verre de disque magnétique, procédé pour conditionner le substrat en verre de disque magnétique, et procédé de fabrication du substrat en verre de disque magnétique

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JP2008119801A (ja) * 2006-11-15 2008-05-29 Shoda Techtron Corp ガラス基板の面取加工装置
JP2009099250A (ja) * 2007-09-28 2009-05-07 Hoya Corp 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法
JP2009134802A (ja) * 2007-11-29 2009-06-18 Furukawa Electric Co Ltd:The 磁気ディスク用ガラス基板および磁気ディスク装置
WO2009084683A1 (fr) * 2007-12-28 2009-07-09 Hoya Corporation Procédé de support de fabrication de disque magnétique, procédé de fabrication de disque magnétique, conditionnement de substrat en verre de disque magnétique, procédé pour conditionner le substrat en verre de disque magnétique, et procédé de fabrication du substrat en verre de disque magnétique

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011241126A (ja) * 2010-05-20 2011-12-01 Nippon Electric Glass Co Ltd ガラス基板およびその製造方法
JP5177328B2 (ja) * 2010-12-27 2013-04-03 コニカミノルタアドバンストレイヤー株式会社 磁気情報記録媒体用ガラス基板の製造方法
WO2012090378A1 (fr) * 2010-12-27 2012-07-05 コニカミノルタオプト株式会社 Procédé de fabrication de substrat en verre pour support d'enregistrement magnétique d'informations
JP2012185891A (ja) * 2011-03-07 2012-09-27 Asahi Glass Co Ltd 磁気記録媒体用ガラス基板の製造方法および磁気記録媒体用ガラス基板
CN108296901A (zh) * 2011-08-29 2018-07-20 旭硝子株式会社 玻璃板及玻璃板的制造方法
US9700985B2 (en) 2011-08-29 2017-07-11 Asahi Glass Company, Limited Glass plate and method for manufacturing the glass plate
KR20190068636A (ko) 2011-08-29 2019-06-18 에이지씨 가부시키가이샤 유리판
WO2013031547A1 (fr) * 2011-08-29 2013-03-07 旭硝子株式会社 Plaque de verre, et procédé de fabrication de plaque de verre
CN103764585A (zh) * 2011-08-29 2014-04-30 旭硝子株式会社 玻璃板及玻璃板的制造方法
KR20140063611A (ko) 2011-08-29 2014-05-27 아사히 가라스 가부시키가이샤 유리판
JPWO2013031547A1 (ja) * 2011-08-29 2015-03-23 旭硝子株式会社 ガラス板、およびガラス板の製造方法
JP2014001123A (ja) * 2012-05-25 2014-01-09 Asahi Glass Co Ltd 化学強化ガラス板、カバーガラスおよびディスプレイ装置
WO2014027546A1 (fr) * 2012-08-13 2014-02-20 旭硝子株式会社 Substrat de verre et procédé de fabrication de substrat de verre
JP2012256426A (ja) * 2012-10-01 2012-12-27 Asahi Glass Co Ltd 磁気記録媒体用ガラス基板
JP5668828B1 (ja) * 2013-11-22 2015-02-12 旭硝子株式会社 化学強化ガラス板
WO2017030112A1 (fr) * 2015-08-19 2017-02-23 旭硝子株式会社 Plaque de verre
JPWO2017030112A1 (ja) * 2015-08-19 2017-12-21 旭硝子株式会社 ガラス板
DE102016013491B4 (de) 2015-11-13 2020-07-23 AGC Inc. Platte mit einer Druckschicht und Anzeigevorrichtung, bei der diese verwendet wird
JP2019055534A (ja) * 2017-09-21 2019-04-11 日東電工株式会社 薄ガラス積層体
JP7029912B2 (ja) 2017-09-21 2022-03-04 日東電工株式会社 薄ガラス積層体
EP3998245A4 (fr) * 2019-07-10 2023-08-02 Agc Inc. Substrat de verre et son procédé de fabrication
US11307458B2 (en) 2020-09-23 2022-04-19 Luca HUNG Display device

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