WO2010095719A1 - 着色セラミック真空チャックおよびその製造方法 - Google Patents
着色セラミック真空チャックおよびその製造方法 Download PDFInfo
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- WO2010095719A1 WO2010095719A1 PCT/JP2010/052553 JP2010052553W WO2010095719A1 WO 2010095719 A1 WO2010095719 A1 WO 2010095719A1 JP 2010052553 W JP2010052553 W JP 2010052553W WO 2010095719 A1 WO2010095719 A1 WO 2010095719A1
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- WIPO (PCT)
- Prior art keywords
- vacuum chuck
- oxide
- spherical particles
- weight
- chuck according
- Prior art date
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- H—ELECTRICITY
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
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- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
- C04B2235/9646—Optical properties
- C04B2235/9661—Colour
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/11—Vacuum
Definitions
- the present invention relates to an exposure apparatus that exposes a glass substrate in a process of manufacturing an FPD such as an LCD (liquid crystal display) or a PDP (plasma display).
- an FPD such as an LCD (liquid crystal display) or a PDP (plasma display).
- the present invention relates to a colored ceramic vacuum chuck on which a glass substrate is placed.
- Incident light in the ultraviolet region used in the exposure process passes through the glass substrate and is reflected by the upper surface of the vacuum chuck. Since this reflected light causes uneven exposure, a low reflectance is required for the vacuum chuck.
- the proportion of incident light that is reflected at the same angle as the incident angle is referred to as regular reflectance or specular reflectance. It is considered that the regular reflectance decreases as the surface roughness of the upper surface of the vacuum chuck increases.
- Patent Documents 1-3 disclose a substrate holding device in which the upper surface of the vacuum chuck is roughened to reduce the regular reflectance. However, roughening may increase the diffuse reflectance.
- the reflectance obtained by adding diffuse reflectance to regular reflectance is referred to as total reflectance or cumulative reflectance. In particular, recent LCD exposure apparatuses require low total reflectance.
- the vacuum chuck is manufactured from black-anodized aluminum or ceramics.
- Patent Document 4 states that the total reflectance of aluminum treated with black alumite is 6 to 8% at a light wavelength of 200 to 650 nm.
- the blackened thin film may be worn or peeled off by repeated chucking of the glass substrate.
- finishing the vacuum chuck material after the black alumite treatment has a limit from the viewpoint of protecting the blackened thin film.
- Patent Document 5 discloses a colored alumina ceramic suitable for a support for a large metric substrate.
- the disclosed preferred colored ceramic has a regular reflectance of 0.6 to 0.9% at a light wavelength of 220 to 350 nm, and a total reflectance of 10.3 to 22.5% at a light wavelength of 220 to 350 nm.
- a large number of convex pins for supporting the glass substrate are formed in the vacuum chuck in order to reduce the area where the vacuum chuck contacts the glass substrate.
- Several suction holes communicating with the vacuum source are opened in the non-contact surface of the vacuum chuck.
- the space formed between the non-contact surface and the glass substrate is separated by a convex rim.
- the rim is also called a bank or a bank.
- the suction hole and most of the pins are surrounded by a rim.
- the rim usually has almost the same height as the pin.
- the pins and rims are formed by shot blasting following the formation of the mask pattern.
- Hard abrasive grains are used for shot blasting.
- the total reflectance is different between the concave portion and the convex portion thus formed. Even in the same convex portion, the total reflectance of the rim is slightly higher than that of the pin due to the difference in the area ratio of the convex portion to the peripheral concave portion.
- An object of the present invention is to provide a low-reflectance vacuum chuck that supports a large glass substrate of about 1 square meter. Therefore, the vacuum chuck is manufactured from a colored ceramic sintered body having a high Young's modulus. Another object of the present invention is that the total reflectivity is sufficiently low even without forming a colored film. In particular, the aluminum vacuum chuck treated with black alumite is sufficiently competitive in terms of the total reflectivity. A colored ceramic vacuum chuck is provided. Furthermore, another object of the present invention is to provide a colored ceramic vacuum chuck in which the total reflectance of the mounting surface on which the pins and rims are formed is uniform.
- the ceramic vacuum chuck for adsorbing the substrate on the upper surface has at least 3 wt% converted to 55 to 75 wt% alumina (Al 2 O 3 ) and oxide (SiO 2 ).
- Si at least 0.4 wt% Ca in terms of oxide (CaO), at least 0.4 wt% Mg in terms of oxide (MgO), a colorant, and 1% or less
- a plurality of pins that comprise a colored ceramic sintered body containing impurities, a rim that at least partially surrounds the plurality of pins that support the substrate, are formed on the upper surface by shot blasting with abrasive grains, and shot peening with spherical particles is performed as described above. It is characterized by being applied to the entire top surface.
- the ceramic vacuum chuck of the present invention has a Young's modulus of 200 GPa or more.
- the ceramic vacuum chuck of the present invention has a total reflectance of 7% or less at a light wavelength of 360 nm when light is irradiated on the upper surface.
- the colorant may be any one selected from Fe, Mn, Co, Ti and Cr.
- the colorant contains 2 to 20% by weight of Fe in terms of oxide (Fe 2 O 3 ).
- Shot peening with spherical particles forms a large number of minute dents on the upper surface of the vacuum chuck material.
- the spherical particles are preferably glass beads, particularly glass beads having an average particle diameter of 10 to 25 ⁇ m.
- the spherical particles may be any particles having a particle size smaller than that of the abrasive particles.
- a method of manufacturing a vacuum chuck includes 55 to 75% by weight or more of alumina (Al 2 O 3 ), a sintering aid, a colorant, and 1% or less of impurities. Sintering the raw material at 1200 to 1450 ° C.
- a ceramic sintered body having a flat upper surface, polishing the upper surface, and alumina, silicon carbide, silicon nitride or zirconia with a mask pattern formed Subjecting the upper surface to shot blasting with abrasive grains containing as a main component to form a large number of pins and a rim that at least partially surrounds the large number of pins, and applying shot peening with glass beads to the upper surface and total reflection thereof Reducing the rate to 7% or less at a light wavelength of 360 nm.
- the ceramic vacuum chuck has a sufficient Young's modulus and can support a large substrate of about 1 square meter.
- the pin and rim are formed by shot blasting with abrasive grains on the upper surface of the colored ceramic sintered body, shot peening with spherical particles is performed, so that the total reflectance of the upper surface becomes uniform. If the spherical particles are glass beads, shot peening further reduces the total reflectance of the upper surface of the colored ceramic sintered body. As a result, the colored ceramic vacuum chuck of the present invention has a long life.
- FIGS. A large number of pins 4 that support the glass substrate are formed on the upper surface of the vacuum chuck 2.
- the glass substrate is in contact with the flat top surface of the pins 4.
- a convex rim 6 that at least partially surrounds a large number of pins 4 is formed on the upper surface of the vacuum chuck 2.
- the rim 6 has a rectangular shape along the contour of the vacuum chuck 2 and has the same or almost the same height as the pin 4.
- Several suction holes (not shown) communicating with the vacuum source are opened in the non-contact surface 8 that does not contact the substrate.
- the ceramic vacuum chuck 2 is formed from a colored ceramic sintered body mainly composed of alumina. If the alumina ratio in the colored ceramic sintered body is less than 55% by weight, it is difficult to manufacture the vacuum chuck 2 having a sufficient Young's modulus. Sufficient Young's modulus is such that the vacuum chuck 2 supports a large substrate of about 1 square meter, specifically 200 GPa or more. On the other hand, when the ratio of alumina contained in the colored ceramic sintered body is larger than 75% by weight, the ratio of the sintering aid and the colorant becomes small and the ceramic sintered body does not exhibit a dark color.
- the colored ceramic sintered body preferably contains 3 to 12% by weight of Si in terms of oxide (SiO 2 ).
- the colored ceramic sintered body may contain at least 0.4 wt% Ca in terms of oxide (CaO) and at least 0.4 wt% Mg in terms of oxide (MgO). desirable. If the sintering aid is less than the desired range, the sintering temperature will increase.
- the colorant contained in the colored ceramic sintered body is selected from Fe, Mn, Co, Ti, and Cr.
- a colorant containing 2 to 20% by weight of Fe in terms of oxide (Fe 2 O 3 ) contributes to a decrease in regular reflectance.
- the ceramic raw material is sintered at a temperature of 1200 to 1450 ° C.
- the sintering furnace may be an electric furnace or a highly productive LPG furnace.
- the abrasive grains are hard abrasive grains that can scrape the alumina ceramic sintered body.
- the hard abrasive grains of shot blast are mainly composed of alumina (Al 2 O 3 ), silicon carbide (SiC), silicon nitride (Si 3 N 4 ) or zirconia (ZrO 2 ).
- the abrasive grains are, for example, green carborundum (GC) and white alundum (WC).
- the ceramic vacuum chuck of the present invention is required to perform shot peening on the upper surface of the colored ceramic sintered body. Shot peening with fine spherical particles reduces the difference in total reflectivity at the pin 4, rim 6 and non-contact surface 8.
- the spherical particles used in shot peening are preferably glass beads. Moreover, shot peening with glass beads further reduces the total reflectance of the upper surface of the colored ceramic sintered body by about 1%. As a result, the total reflectance of the upper surface of the colored ceramic sintered body is 7% or less at a light wavelength of 360 nm. Even when shot peening with glass beads was applied to the white ceramic sintered body, the total reflectance was not lowered.
- Table 1 shows a sample of a colored ceramic sintered body. The constituent elements of the sample are converted to oxides. The production of a colored ceramic sintered body sample will be described below. First, manganese dioxide (MnO 2 ), iron oxide (Fe 2 O 3 ), meteorite or clay, dolomite (MgCO 3 ⁇ CaCO 3 ), calcite (CaCO 3 ), magnesite (MgCO 3 ), chromium oxide (Cr 2 O 3 ) and titanium oxide (TiO 2 ) powder were weighed and mixed with alumina (Al 2 O 3 ) powder as a main component. Next, the slurry was produced
- the slurry was dried by a spray drying method to produce raw material granules.
- the raw material granules were press-molded and then sintered at a temperature of 1300 to 1450 ° C. in an electric furnace. In this way, two samples of different sizes were produced for each sample number. Although not shown in Table 1, cracks occurred in the sample having an alumina content of 47% by weight or less.
- the colored ceramic sintered body is composed of alumina (Al 2 O 3 ) crystals, spinel crystals, anorthite (CaO ⁇ Al 2 O 3 ⁇ 2SiO 2 ) crystals, and other trace amounts of crystal phases.
- Spinel crystals include Mn—Al spinel (MnO.Al 2 O 3 ) crystal, Mg—Fe spinel (MgFe 3+ 2 O 4 ) crystal, Mn—Mg—Fe—Al (MnO.MgFe 3+ 2 O 4 .Al 2 O 3 ) any of spinel crystals.
- the spinel crystal has a reddish brown color, black color or blackish brown color and absorbs light to reduce the total reflectance.
- the Young's modulus (GPa) in Table 1 was measured by the resonance method defined in JIS R1602.
- the specific gravity in Table 1 is a bulk specific gravity obtained by measuring a sample of ⁇ 30 mm ⁇ t20 mm by the Archimedes method. Examples of the present invention will be described below.
- Example 1 The flat upper and lower surfaces of Sample 1 were polished with a diamond grindstone having a particle size of 325 until the thickness became 30 mm, and then washed. The surface roughness of the polished surface of Sample 1 was 1.0 to 1.6 ⁇ mRa. The polished surface of Sample 1 had a total reflectance in the range of 6 to 10% and a regular reflectance in the range of 0.4 to 0.7% at a light wavelength of 360 nm. Next, a mask pattern corresponding to a large number of pins 4 and rims 6 was formed on the polished surface of Sample 1, and Sample 1 was subjected to shot blasting with alumina abrasive grains. The surface roughness of the non-contact surface 8 of the sample 1 was 2 to 5 ⁇ mRa.
- the non-contact surface 8 of the sample 1 had a total reflectance exceeding 7% at a light wavelength of 360 nm.
- the total reflectance of the non-contact surface 8 is about 1% higher than that of the pin 4 by shot blasting of alumina abrasive grains.
- the total reflectance of the rim 6 was about 1% higher than that of the pin 4 although it depends on the size of the pin 4 and the rim 6.
- shot peening with spherical particles was performed on the upper surface of the sample 1.
- the spherical particles were # 1200 glass beads and the average particle size was 10-25 ⁇ m. When observed with an electron microscope, a large number of spherical dents were overlapped and formed on the upper surface of the sample 1.
- the size of the spherical dent was the same as that of the spherical particles.
- the non-contact surface 8 of the sample 1 had a total reflectance of 6.1 to 6.5% and 7% or less at a light wavelength of 360 nm. The difference in total reflectance at the pin 4, the rim 6 and the non-contact surface 8 was within 0.5%.
- Example 2 The flat upper and lower surfaces of Sample 2 were polished with a diamond grindstone having a particle size of 140 until the thickness became 30 mm, and then washed. The surface roughness of the polished surface of Sample 2 was 0.8 to 0.9 ⁇ mRa. The polished surface of Sample 2 had a total reflectance of 8.7 to 8.8% exceeding 7% at a light wavelength of 360 nm. The regular reflectance was 0.1 to 0.2% at a light wavelength of 360 nm. Next, shot blasting with silicon carbide abrasive grains having a grain size of No. 400 was performed on the sample 2 (by this shot blasting, the surface of the sample 2 became a surface corresponding to the non-contact surface 8 of Example 1).
- the surface roughness increased to 1.4 to 1.5 ⁇ mRa.
- the total reflectivity increased to 8.9 to 9.0% at a light wavelength of 360 nm.
- the regular reflectance was 0.1% or less at a light wavelength of 360 nm.
- shot peening with spherical particles was performed on the upper surface of Sample 2.
- the spherical particles were glass beads, and shot peening was performed 8 times under the conditions shown in Table 2. When observed with an electron microscope, a large number of spherical dents were overlapped and formed on the upper surface of the sample 2.
- the size of the spherical dent was the same as that of the spherical particles.
- the surface roughness was larger than that immediately after polishing (before shot blasting), but slightly smaller than that after shot blasting.
- the total reflectance was 6.5 to 6.6% and 7% or less at a light wavelength of 360 nm.
- the regular reflectance was 0.1% or less at a light wavelength of 360 nm.
- Example 3 The flat upper and lower surfaces of Sample 2 were polished with a diamond grindstone having a particle size of 325 until the thickness became 30 mm, and then washed.
- the surface roughness of the polished surface of Sample 2 was 0.5 to 0.6 ⁇ mRa.
- the polished surface of Sample 2 had a total reflectance of 8.0 to 8.1% exceeding 7% at a light wavelength of 360 nm.
- the regular reflectance was 0.2 to 0.3% at a light wavelength of 360 nm.
- shot peening with spherical particles was performed on the polished surface of sample 2 (the surface corresponding to pin 4 and rim 6 of Example 1).
- the spherical particles were glass beads, and shot peening was performed 4 times under the conditions shown in Table 2.
- the size of the spherical dent was the same as that of the spherical particles.
- the surface roughness increased to 0.7 to 0.8 ⁇ mRa.
- the total reflectance was 6.6 to 6.8%, which is 7% or less, at a light wavelength of 360 nm.
- the regular reflectance was 0.1% or less at a light wavelength of 360 nm.
- Example 4 The polished surface of Sample 2 of Example 3 was further subjected to shot peening with glass beads four times under the conditions shown in Table 2.
- the surface roughness was 0.9 to 1.0 ⁇ mRa, which was larger than that of Example 3.
- the total reflectivity was 6.2 to 6.3% at a light wavelength of 360 nm, which was further reduced as compared with Example 3.
- the regular reflectance was 0.1% or less at a light wavelength of 360 nm.
- Example 5 The flat upper and lower surfaces of Sample 2 were polished with a diamond grindstone having a particle size of 325 until the thickness became 30 mm, and then hand lapping was performed using a lapping solution containing diamond having a particle size of 3 ⁇ m.
- the surface roughness of the lap surface of Sample 2 was 0.2 to 0.3 ⁇ mRa.
- the lapped surface of Sample 2 had a total reflectance of about 7.1% and slightly over 7% at a light wavelength of 360 nm.
- the regular reflectance was 0.9 to 1.0% at a light wavelength of 360 nm.
- shot peening with spherical particles was performed on the lapping surface of Sample 2.
- the spherical particles were glass beads, and shot peening was performed 8 times under the conditions shown in Table 2.
- the size of the spherical dent was the same as that of the spherical particles.
- the surface roughness increased to 0.6 to 0.7 ⁇ mRa.
- the total reflectance was 6.4 to 6.6% and 7% or less at a light wavelength of 360 nm.
- the regular reflectance was 0.4 to 0.5% at a light wavelength of 360 nm.
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Abstract
Description
試料1の平坦な上下面を粒度325番のダイヤモンド砥石で厚さが30mmになるまで研磨された後に洗浄した。試料1の研磨面の表面粗さは1.0~1.6μmRaであった。試料1の研磨面は、360nmの光波長において全反射率が6~10%の範囲、正反射率が0.4~0.7%の範囲であった。
次いで、試料1の研磨面に多数のピン4とリム6に相当するマスクパターンを形成し、アルミナ砥粒によるショットブラストを試料1に施した。試料1の非接触面8の表面粗さは2~5μmRaであった。試料1の非接触面8は、360nmの光波長において全反射率が7%を超えていた。アルミナ砥粒のショットブラストにより非接触面8の全反射率はピン4よりも1%程度高くなった。また、リム6の全反射率は、ピン4およびリム6のサイズにもよるが、ピン4よりも1%程度高くなった。
続いて、試料1の上面に球形粒子によるショットピーニングを施した。球形粒子は#1200のガラスビーズであり、平均粒径は10~25μmとした。電子顕微鏡で観察したところ、多数の球形打痕が重なって試料1の上面に形成されていた。球形打痕のサイズは球形粒子と同様であった。試料1の非接触面8は、360nmの光波長において全反射率が6.1~6.5%と7%以下であった。ピン4、リム6および非接触面8における全反射率の差は0.5%以内であった。
試料2の平坦な上下面を粒度140番のダイヤモンド砥石で厚さが30mmになるまで研磨した後に洗浄した。試料2の研磨面の表面粗さは0.8~0.9μmRaであった。試料2の研磨面は、360nmの光波長において全反射率が8.7~8.8%と7%を超えていた。正反射率は360nmの光波長において0.1~0.2%であった。
次いで、粒度400番の炭化珪素砥粒によるショットブラストを試料2に施した(このショットブラストにより、試料2の表面が実施例1の非接触面8に相当する面となる)。表面粗さは1.4~1.5μmRaと大きくなった。全反射率は360nmの光波長において8.9~9.0%と上昇した。正反射率は360nmの光波長において0.1%以下であった。
続いて、試料2の上面に球形粒子によるショットピーニングを施した。球形粒子はガラスビーズとし、表2の条件でショットピーニングを8回施した。電子顕微鏡で観察したところ、多数の球形打痕が重なって試料2の上面に形成されていた。球形打痕のサイズは球形粒子と同様であった。表面粗さは、研磨直後(ショットブラスト前)よりも大きくなったものの、ショットブラスト後に対しては若干小さくなった。全反射率は360nmの光波長において6.5~6.6%と7%以下であった。正反射率は360nmの光波長において0.1%以下であった。
試料2の平坦な上下面を粒度325番のダイヤモンド砥石で厚さが30mmになるまで研磨した後に洗浄した。試料2の研磨面の表面粗さは0.5~0.6μmRaであった。試料2の研磨面は、360nmの光波長において全反射率が8.0~8.1%と7%を超えていた。正反射率は360nmの光波長において0.2~0.3%であった。
次いで、試料2の研磨面(実施例1のピン4およびリム6に相当する面)に球形粒子によるショットピーニングを施した。球形粒子はガラスビーズとし、表2の条件でショットピーニングを4回施した。電子顕微鏡で観察したところ、多数の球形打痕が重なって試料2の上面に形成されていた。球形打痕のサイズは球形粒子と同様であった。表面粗さは、0.7~0.8μmRaと大きくなった。全反射率は、360nmの光波長において6.6~6.8%と7%以下であった。正反射率は360nmの光波長において0.1%以下であった。
実施例3の試料2の研磨面に表2の条件でガラスビーズによるショットピーニングを更に4回施した。表面粗さは、0.9~1.0μmRaと実施例3に対し更に大きくなった。また、全反射率は360nmの光波長において6.2~6.3%と実施例3に対し更に低下した。正反射率は360nmの光波長において0.1%以下であった。
試料2の平坦な上下面を粒度325番のダイヤモンド砥石で厚さが30mmになるまで研磨した後に、粒径3μmのダイヤモンドを含むラップ液を用いてハンドラップ加工を行った。試料2のラップ面の表面粗さは0.2~0.3μmRaであった。試料2のラップ面は、360nmの光波長において全反射率が7.1%程度%と7%を僅かに超えていた。正反射率は360nmの光波長において0.9~1.0%であった。
次いで、試料2のラップ面に球形粒子によるショットピーニングを施した。球形粒子はガラスビーズとし、表2の条件でショットピーニングを8回施した。電子顕微鏡で観察したところ、多数の球形打痕が重なって試料2の上面に形成されていた。球形打痕のサイズは球形粒子と同様であった。表面粗さは、0.6~0.7μmRaと大きくなった。全反射率は360nmの光波長において6.4~6.6%と7%以下であった。正反射率は360nmの光波長において0.4~0.5%であった。
4・・・ピン
6・・・リム
8・・・非接触面
Claims (10)
- 上面に基板を吸着するセラミック真空チャックにおいて、55~75重量%以上のアルミナ(Al2O3)と、酸化物(SiO2)に換算して少なくとも3重量%のSiと、酸化物(CaO)に換算して少なくとも0.4重量%のCaと、酸化物(MgO)に換算して少なくとも0.4重量%のMgと、着色剤と、1%以下の不純物を含む着色セラミック焼結体から成り、前記基板を支持する多数のピンと前記多数のピンを少なくとも部分的に囲むリムが砥粒によるショットブラストにより前記上面に形成され、球形粒子によるショットピーニングが前記上面全体に施されたことを特徴とするセラミック真空チャック。
- セラミック真空チャックのヤング率が200GPa以上である請求項1に記載の真空チャック。
- 前記上面に光が照射されたとき、全反射率が360nmの光波長において7%以下である請求項1に記載の真空チャック。
- 前記着色剤は、Fe、Mn、Co、TiおよびCrの中から選ばれる請求項1に記載の真空チャック。
- 前記着色剤は、酸化物(Fe2O3)に換算して2~20重量%のFeを含む請求項4に記載の真空チャック。
- 前記球形粒子はガラスビーズである請求項1に記載の真空チャック。
- 前記球形粒子は平均粒径が10~25μmのガラスビーズである請求項6に記載の真空チャック。
- 前記球形粒子は砥粒よりも小さい粒度を有する請求項1に記載の真空チャック。
- 着色セラミック真空チャックの製造方法において、55~75重量%以上のアルミナ(Al2O3)と、焼結助剤と、着色剤と、1%以下の不純物を含む原料を1200~1450℃で焼結して平坦な上面を有するセラミック焼結体を生成するステップと、前記上面を研磨するステップと、マスクパターンを形成した状態でアルミナ、炭化珪素、窒化珪素又はジルコニアを主成分とする砥粒によるショットブラストを前記上面に施して多数のピンと前記多数のピンを少なくとも部分的に囲むリムを形成するステップと、ガラスビーズによるショットピーニングを前記上面に施してその全反射率を360nmの光波長において7%以下へ低下させるステップを含む着色セラミック真空チャックの製造方法。
- 前記ガラスビーズは平均粒径が10~25μmである請求項9に記載の着色セラミック真空チャックの製造方法。
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