WO2010084592A1 - Circuit board for mounting electronic component thereon - Google Patents
Circuit board for mounting electronic component thereon Download PDFInfo
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- WO2010084592A1 WO2010084592A1 PCT/JP2009/050994 JP2009050994W WO2010084592A1 WO 2010084592 A1 WO2010084592 A1 WO 2010084592A1 JP 2009050994 W JP2009050994 W JP 2009050994W WO 2010084592 A1 WO2010084592 A1 WO 2010084592A1
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- conductive ink
- copper
- silver
- circuit pattern
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
Definitions
- the present invention relates to a substrate on which a circuit pattern is formed using conductive ink, and is particularly effective for improving the solder mountability of electronic components and improving the reliability of circuits.
- a copper foil laminated substrate has been used to form a circuit pattern on each copper foil through steps such as resist coating, circuit pattern irradiation, and etching.
- the conductive inks proposed so far include copper conductive ink made by pasting copper powder or powder coated with copper on core particles, and silver powder made by pasting silver powder or powder coated with silver on core particles.
- copper conductive ink made by pasting copper powder or powder coated with copper on core particles
- silver powder made by pasting silver powder or powder coated with silver on core particles.
- the inventors have found the following. Although the resistance value of the copper conductive ink after pattern printing was lower than that using the silver conductive ink, as shown in FIG. 9, the solder did not get on and the electronic component could not be mounted on the circuit.
- FIG. 9 shows that the solder 2 was melted using the soldering iron 20 on the circuit pattern 11 formed of copper conductive ink, but the molten solder 2a was not applied.
- the silver conductive ink was sufficiently solderable.
- the silver conductive ink has an electric resistance value about 10 times larger than that of the copper conductive ink, the potential of the wiring part in the circuit becomes high, silver ion migration is likely to occur, and the circuit reliability remains uneasy.
- An object of the present invention is to provide an electronic component mounting circuit board that does not require a large facility and can be manufactured at low cost, has a short production lead time, and is excellent in circuit reliability.
- a circuit board for mounting electronic components according to the present invention is formed by printing a circuit pattern on a substrate using a copper conductive ink containing copper powder, and a silver conductive ink containing silver powder on the circuit pattern.
- the soldering part is printed and formed using
- the copper conductive ink containing copper powder includes, in addition to copper powder, a powder obtained by coating inorganic core particles with copper, etc., and these powders are kneaded with various organic binders to form a paste.
- an ink in which electrolytic copper powder manufactured by Tatta System Electronics Co., Ltd. is made into a paste, or an ink made of copper nanoparticles made in Asahi Glass Co., Ltd. in a colloidal paste can be used.
- the silver conductive ink also includes powder coated with inorganic core particles.
- the silver conductive ink is the same as the copper conductive ink except that these powders are kneaded with various organic binders to form a paste.
- Examples of the silver conductive ink include those obtained by pasting a powder obtained by coating silver powder onto nickel powder described in Patent Document 1 or those obtained by pasting silver nanoparticles manufactured by PChem Associates.
- a circuit pattern is printed and formed using a copper conductive ink having a low electrical resistance value, and silver conductive ink is overprinted only on a portion where an electronic component is to be solder-mounted. Effects are produced.
- a circuit board that requires soldering of electronic components could only use a copper foil laminated board, whereas large equipment such as etching processing equipment was required. Since the present invention requires only a printing press, the manufacturing equipment is inexpensive, the power consumption is low, and the wastewater treatment is unnecessary, so the environmental load can be reduced.
- the circuit lead pattern can be printed and formed directly on the insulating substrate, and the components can be soldered as they are, so that the production lead time can be shortened.
- the resistance value of the wiring part is smaller than that of forming the entire circuit pattern with silver conductive ink, The occurrence of silver ion migration can be suppressed and the reliability is improved.
- substrate is shown.
- the soldering part which carried out the overprinting using the silver conductive ink in a part of circuit pattern is shown.
- substrate is shown.
- the undercoat is shown from above the resist coat.
- the state which formed the carbon wiring electrode from the undercoat is shown. Represents symbols and characters printed on a substrate. Sectional micrographs of copper conductive ink and silver conductive ink are shown.
- the state where the electronic parts are solder-mounted is shown. An explanation will be given of a state in which no solder is placed on the copper conductive ink.
- an electronic component mounting board (hereinafter simply referred to as a board) according to the present invention
- a board an example applied to a control board of a remote control transmitter used in various electric appliances such as a television and an air conditioner will be described below.
- the substrate according to the present invention is not limited to this, and can be widely used in an effective technical field in which silver conductive ink is partially overprinted on a pattern using copper conductive ink.
- FIG. 1 shows a state in which a circuit pattern 11 is formed on an insulating resin substrate 10 by a screen printing method using copper conductive ink as printed in black and then dried.
- the outermost frame is the outline of the insulating resin substrate 10. Since the entire circuit pattern is formed using copper conductive ink, the electrical resistance value of the wiring path is small.
- the copper conductive ink used for the evaluation was NF2000 manufactured by Tatta System Electronics, and was dried at 160 ° C. for 60 minutes after printing. The specific resistance value is 5 ⁇ 10 ⁇ 5 ⁇ ⁇ cm.
- FIG. 1 shows a state in which a circuit pattern 11 is formed on an insulating resin substrate 10 by a screen printing method using copper conductive ink as printed in black and then dried.
- the outermost frame is the outline of the insulating resin substrate 10. Since the entire circuit pattern is formed using copper conductive ink, the electrical resistance value of the wiring path is small.
- the copper conductive ink used for the evaluation was NF2000 manufactured by Tatta System Electronics
- FIG. 2 shows a part where a soldering portion is partially formed using silver conductive ink on the circuit pattern shown in FIG. Only the printed part is shown, and the part shown in black in FIG. 2 is a soldered part with silver conductive ink.
- the silver conductive ink used for the evaluation was DP-002MA manufactured by Maxell Hokuriku Seiki Co., Ltd., which was dried at 160 ° C. for 30 minutes after printing.
- the specific resistance value is 3 ⁇ 10 ⁇ 4 ⁇ ⁇ cm.
- FIG. 3 shows a state in which the resist coat 13 is printed and cured on the state of FIG. 2, and a portion 13a shown in black in FIG. 3 is a portion where the electrode portion and soldering portion of the pattern are exposed. The portion other than black is the portion where the resist is applied.
- FIG. 4 shows a state in which the undercoat 14 is printed and cured on the resist coat 13 shown in FIG.
- the undercoat 14 is formed as a base layer for forming the following carbon electrode, and is an organic insulating film layer.
- a black portion 14a is a portion that is not undercoated.
- FIG. 5 shows a state in which the carbon wiring electrode 15 is printed and cured after the undercoat 14 shown in FIG. 4 is applied, and a black portion in FIG.
- FIG. 5 is a portion where carbon is applied. .
- the carbon wiring electrode 15 is electrically connected to an electrode portion formed of copper conductive ink at a portion 14a where the undercoat 14 is not applied.
- FIG. 6 shows only a part of a character or the like on which a symbol or a character is printed on a substrate as necessary. When the substrate thus manufactured is used, electronic components such as a resistor chip and a capacitor can be soldered and mounted on the soldering portion 12 formed of silver conductive ink according to a conventional method.
- FIG. 7 shows a microscopic cross-sectional photograph of a portion in which a circuit pattern 11 is formed on an insulating substrate 10 using copper conductive ink, and a soldering portion 12 is formed thereon by using silver conductive ink.
- FIG. 8 shows a state where a 3216 square chip resistor is soldered on the substrate.
- a circuit pattern is formed with copper conductive ink on an insulating substrate, silver conductive ink is overprinted thereon, and the above-mentioned square chip is soldered thereon, and directly on the insulating substrate.
- Table 1 shows the results of measuring the square chip peeling load, in which a silver conductive ink was printed and formed, and the square chip was soldered thereon.
- the present invention is the one in which the silver conductive ink is overprinted only on the portion that needs to be soldered while maintaining the low resistance characteristic of the copper conductive ink, and the generation of silver ion migration is suppressed while the It is characterized in that the component can be solder-mounted, and can be developed on various circuit boards in which such a feature is utilized.
Abstract
Provided is a circuit board, which is for mounting an electronic component thereon, manufactured at low cost without requiring large equipment, and has a short production lead time and excellent circuit reliability. The circuit board for mounting an electronic component thereon is characterized in that a circuit pattern is formed on a substrate by printing by using a copper conductive ink containing a copper powder, and that a soldering section is formed on the circuit pattern by printing by using a silver conductive ink containing a silver powder.
Description
本発明は、導電性インクを用いて回路パターンを形成した基板に関し、特に、電子部品のはんだ実装性の向上及び回路の信頼性向上に有効である。
The present invention relates to a substrate on which a circuit pattern is formed using conductive ink, and is particularly effective for improving the solder mountability of electronic components and improving the reliability of circuits.
電子機器用の回路基板の分野においては、従来、銅箔積層基板を用いて、銅箔の上にレジスト塗布、回路パターン照射、エッチング処理等の各工程を経て回路パターンを形成していた。
In the field of circuit boards for electronic devices, conventionally, a copper foil laminated substrate has been used to form a circuit pattern on each copper foil through steps such as resist coating, circuit pattern irradiation, and etching.
しかし、このような銅箔積層基板を用いた方法ではエッチング処理に加温設備や排水処理設備等が必要であるために専用の大型設備となり環境負荷や電力消費が大きいばかりでなく、生産のリードタイムが長い問題があった。
そこで、導電性インクを用いてエポキシ基板，フェノール基板等の絶縁性基板上に直接的に回路パターンを印刷形成する方法が開発検討されている。 However, such a method using a copper foil laminated substrate requires a heating facility and a wastewater treatment facility for the etching process, so that it becomes a dedicated large-scale facility and not only has a large environmental load and power consumption but also leads to production. There was a problem with long time.
In view of this, a method for printing and forming a circuit pattern directly on an insulating substrate such as an epoxy substrate or a phenol substrate using a conductive ink has been developed and studied.
そこで、導電性インクを用いてエポキシ基板，フェノール基板等の絶縁性基板上に直接的に回路パターンを印刷形成する方法が開発検討されている。 However, such a method using a copper foil laminated substrate requires a heating facility and a wastewater treatment facility for the etching process, so that it becomes a dedicated large-scale facility and not only has a large environmental load and power consumption but also leads to production. There was a problem with long time.
In view of this, a method for printing and forming a circuit pattern directly on an insulating substrate such as an epoxy substrate or a phenol substrate using a conductive ink has been developed and studied.
これまでに提案されている導電性インクには、銅粉末又は核粒子に銅コートした粉末をペースト状にした銅導電性インクと、銀粉末又は核粒子に銀コートした粉末をペースト状にした銀導電性インクの二種類が存在する。
本願発明者らが、これらの導電性インクを用いて、回路パターンを印刷形成した回路基板を試作評価した結果、次のようなことが明らかになった。
銅導電性インクはパターン印刷形成した後の抵抗値が銀導電性インクを用いたものよりも低いが、図９に示すように、はんだが乗らなく、電子部品を回路にはんだ実装できなかった。
なお、図９は、銅導電性インクにて形成した回路パターン１１の上にはんだこて２０を用いてはんだ２を溶かしたが、溶融はんだ２ａが乗らなかったことを示す。
これに対して銀導電性インクは、はんだ付けが充分に可能であった。
しかし、銀導電性インクは銅導電性インクよりも電気抵抗値が約１０倍も大きく、回路における配線部の電位が高くなり、銀イオンマイグレーションの発生が生じやすく、回路信頼性に不安が残る。 The conductive inks proposed so far include copper conductive ink made by pasting copper powder or powder coated with copper on core particles, and silver powder made by pasting silver powder or powder coated with silver on core particles. There are two types of conductive ink.
As a result of the trial evaluation of a circuit board on which a circuit pattern is printed by using these conductive inks, the inventors have found the following.
Although the resistance value of the copper conductive ink after pattern printing was lower than that using the silver conductive ink, as shown in FIG. 9, the solder did not get on and the electronic component could not be mounted on the circuit.
FIG. 9 shows that thesolder 2 was melted using the soldering iron 20 on the circuit pattern 11 formed of copper conductive ink, but the molten solder 2a was not applied.
In contrast, the silver conductive ink was sufficiently solderable.
However, the silver conductive ink has an electric resistance value about 10 times larger than that of the copper conductive ink, the potential of the wiring part in the circuit becomes high, silver ion migration is likely to occur, and the circuit reliability remains uneasy.
本願発明者らが、これらの導電性インクを用いて、回路パターンを印刷形成した回路基板を試作評価した結果、次のようなことが明らかになった。
銅導電性インクはパターン印刷形成した後の抵抗値が銀導電性インクを用いたものよりも低いが、図９に示すように、はんだが乗らなく、電子部品を回路にはんだ実装できなかった。
なお、図９は、銅導電性インクにて形成した回路パターン１１の上にはんだこて２０を用いてはんだ２を溶かしたが、溶融はんだ２ａが乗らなかったことを示す。
これに対して銀導電性インクは、はんだ付けが充分に可能であった。
しかし、銀導電性インクは銅導電性インクよりも電気抵抗値が約１０倍も大きく、回路における配線部の電位が高くなり、銀イオンマイグレーションの発生が生じやすく、回路信頼性に不安が残る。 The conductive inks proposed so far include copper conductive ink made by pasting copper powder or powder coated with copper on core particles, and silver powder made by pasting silver powder or powder coated with silver on core particles. There are two types of conductive ink.
As a result of the trial evaluation of a circuit board on which a circuit pattern is printed by using these conductive inks, the inventors have found the following.
Although the resistance value of the copper conductive ink after pattern printing was lower than that using the silver conductive ink, as shown in FIG. 9, the solder did not get on and the electronic component could not be mounted on the circuit.
FIG. 9 shows that the
In contrast, the silver conductive ink was sufficiently solderable.
However, the silver conductive ink has an electric resistance value about 10 times larger than that of the copper conductive ink, the potential of the wiring part in the circuit becomes high, silver ion migration is likely to occur, and the circuit reliability remains uneasy.
本発明は、大型設備が不要で安価に製造でき、生産リードタイムが短く、回路信頼性に優れる電子部品実装用回路基板の提供を目的とする。
An object of the present invention is to provide an electronic component mounting circuit board that does not require a large facility and can be manufactured at low cost, has a short production lead time, and is excellent in circuit reliability.
本発明に係る電子部品実装用回路基板は、銅粉末を含有する銅導電性インクを用いて基板上に回路パターンを印刷形成し、当該回路パターンの上に、銀粉末を含有する銀導電性インクを用いてはんだ付け部を印刷形成してあることを特徴とする。
A circuit board for mounting electronic components according to the present invention is formed by printing a circuit pattern on a substrate using a copper conductive ink containing copper powder, and a silver conductive ink containing silver powder on the circuit pattern. The soldering part is printed and formed using
ここで、銅粉末を含有する銅導電性インクとは銅粉末の他に無機の核粒子に銅コートした粉末等も含み、これらの粉末を各種有機バインダーと混練し、ペースト状にすることでスクリーン印刷工法、インクジェット工法等により印刷形成可能なインクをいい、銅導電性塗料とも称する。
例えば、タッタシステムエレクトロニクス社製の電解銅粉末をペースト状にしたインクや旭硝子社製の銅のナノ粒子をコロイド状ペーストにしたインクを用いることができる。 Here, the copper conductive ink containing copper powder includes, in addition to copper powder, a powder obtained by coating inorganic core particles with copper, etc., and these powders are kneaded with various organic binders to form a paste. An ink that can be printed by a printing method, an ink jet method, or the like, and is also referred to as a copper conductive paint.
For example, an ink in which electrolytic copper powder manufactured by Tatta System Electronics Co., Ltd. is made into a paste, or an ink made of copper nanoparticles made in Asahi Glass Co., Ltd. in a colloidal paste can be used.
例えば、タッタシステムエレクトロニクス社製の電解銅粉末をペースト状にしたインクや旭硝子社製の銅のナノ粒子をコロイド状ペーストにしたインクを用いることができる。 Here, the copper conductive ink containing copper powder includes, in addition to copper powder, a powder obtained by coating inorganic core particles with copper, etc., and these powders are kneaded with various organic binders to form a paste. An ink that can be printed by a printing method, an ink jet method, or the like, and is also referred to as a copper conductive paint.
For example, an ink in which electrolytic copper powder manufactured by Tatta System Electronics Co., Ltd. is made into a paste, or an ink made of copper nanoparticles made in Asahi Glass Co., Ltd. in a colloidal paste can be used.
銀導電性インクは、銀粉末の他に無機の核粒子に銀コートした粉末も含み、これらの粉末を各種有機バインダーと混練し、ペースト状にした点以外は銅導電性インクと同じである。
銀導電性インクの例としては特許文献１に記載のニッケル粉末に銀コートした粉末をペースト状にしたものやＰＣｈｅｍ Ａｓｓｏｃｉａｔｅｓ社製の銀のナノ粒子をペースト状にしたものを用いることができる。 In addition to silver powder, the silver conductive ink also includes powder coated with inorganic core particles. The silver conductive ink is the same as the copper conductive ink except that these powders are kneaded with various organic binders to form a paste.
Examples of the silver conductive ink include those obtained by pasting a powder obtained by coating silver powder onto nickel powder described inPatent Document 1 or those obtained by pasting silver nanoparticles manufactured by PChem Associates.
銀導電性インクの例としては特許文献１に記載のニッケル粉末に銀コートした粉末をペースト状にしたものやＰＣｈｅｍ Ａｓｓｏｃｉａｔｅｓ社製の銀のナノ粒子をペースト状にしたものを用いることができる。 In addition to silver powder, the silver conductive ink also includes powder coated with inorganic core particles. The silver conductive ink is the same as the copper conductive ink except that these powders are kneaded with various organic binders to form a paste.
Examples of the silver conductive ink include those obtained by pasting a powder obtained by coating silver powder onto nickel powder described in
本発明にあっては、電気抵抗値の低い銅導電性インクを用いて回路パターンを印刷形成し、電子部品をはんだ実装したい部分にのみ銀導電性インクを重ね印刷形成したことにより、次のような作用効果が生じる。
まず第１に、従来は、電子部品のはんだ付けが必要な回路基板にあっては銅箔積層基板を用いることしかできなかったので、エッチング処理設備等の大型設備が必要であったのに対して、本発明は印刷機のみでよいため、製造設備が安価であり、電力消費も少なく、排水処理が不要である点において環境負荷も低減できる。
第２に、絶縁性基板に直接的に回路パターンを印刷形成し、そのまま、部品のはんだ付けが可能であるために生産リードタイムの短縮を図ることができる。
第３に、電子部品のはんだ付け部以外は、抵抗値の小さい銅導電性インクにて回路を形成したので回路パターン全体を銀導電性インクで形成するよりも、配線部位の抵抗値が小さく、銀イオンマイグレーションの発生を抑えることができ、信頼性が向上する。 In the present invention, a circuit pattern is printed and formed using a copper conductive ink having a low electrical resistance value, and silver conductive ink is overprinted only on a portion where an electronic component is to be solder-mounted. Effects are produced.
First of all, in the past, a circuit board that requires soldering of electronic components could only use a copper foil laminated board, whereas large equipment such as etching processing equipment was required. Since the present invention requires only a printing press, the manufacturing equipment is inexpensive, the power consumption is low, and the wastewater treatment is unnecessary, so the environmental load can be reduced.
Secondly, the circuit lead pattern can be printed and formed directly on the insulating substrate, and the components can be soldered as they are, so that the production lead time can be shortened.
Thirdly, since the circuit is formed with copper conductive ink having a small resistance value except for the soldered portion of the electronic component, the resistance value of the wiring part is smaller than that of forming the entire circuit pattern with silver conductive ink, The occurrence of silver ion migration can be suppressed and the reliability is improved.
まず第１に、従来は、電子部品のはんだ付けが必要な回路基板にあっては銅箔積層基板を用いることしかできなかったので、エッチング処理設備等の大型設備が必要であったのに対して、本発明は印刷機のみでよいため、製造設備が安価であり、電力消費も少なく、排水処理が不要である点において環境負荷も低減できる。
第２に、絶縁性基板に直接的に回路パターンを印刷形成し、そのまま、部品のはんだ付けが可能であるために生産リードタイムの短縮を図ることができる。
第３に、電子部品のはんだ付け部以外は、抵抗値の小さい銅導電性インクにて回路を形成したので回路パターン全体を銀導電性インクで形成するよりも、配線部位の抵抗値が小さく、銀イオンマイグレーションの発生を抑えることができ、信頼性が向上する。 In the present invention, a circuit pattern is printed and formed using a copper conductive ink having a low electrical resistance value, and silver conductive ink is overprinted only on a portion where an electronic component is to be solder-mounted. Effects are produced.
First of all, in the past, a circuit board that requires soldering of electronic components could only use a copper foil laminated board, whereas large equipment such as etching processing equipment was required. Since the present invention requires only a printing press, the manufacturing equipment is inexpensive, the power consumption is low, and the wastewater treatment is unnecessary, so the environmental load can be reduced.
Secondly, the circuit lead pattern can be printed and formed directly on the insulating substrate, and the components can be soldered as they are, so that the production lead time can be shortened.
Thirdly, since the circuit is formed with copper conductive ink having a small resistance value except for the soldered portion of the electronic component, the resistance value of the wiring part is smaller than that of forming the entire circuit pattern with silver conductive ink, The occurrence of silver ion migration can be suppressed and the reliability is improved.
１０ 絶縁性基板（基材）
１１ 銅導電性インクによる回路パターン
１２ 銀導電性インクによるはんだ付け部 10 Insulating substrate (base material)
11 Circuit pattern with copperconductive ink 12 Solder part with silver conductive ink
１１ 銅導電性インクによる回路パターン
１２ 銀導電性インクによるはんだ付け部 10 Insulating substrate (base material)
11 Circuit pattern with copper
本発明に係る電子部品実装用基板（以下、単に基板と称する。）の実施例として、テレビ，空調機等の各種電気器具に使用されているリモコン送信機の制御基板に応用した例を以下説明するが、本発明に係る基板はこれに限定されるものでなく、銅導電性インクを用いたパターンの上に、部分的に銀導電性インクを重ね印刷する有効な技術分野において広く採用できる。
As an embodiment of an electronic component mounting board (hereinafter simply referred to as a board) according to the present invention, an example applied to a control board of a remote control transmitter used in various electric appliances such as a television and an air conditioner will be described below. However, the substrate according to the present invention is not limited to this, and can be widely used in an effective technical field in which silver conductive ink is partially overprinted on a pattern using copper conductive ink.
次に図１～図６に基づいて、基板の製造手順を説明する。
基板原板を所定の大きさに分割し、必要に応じて位置決め用の穴をあけ、回路パターンを形成する。
図１は絶縁性樹脂基板１０の上に、スクリーン印刷工法により、銅導電性インクを用いて、黒で表したように印刷し、その後に乾燥し、回路パターン１１を形成した状態を示す。
なお、図１にて最も外側の枠は、絶縁性樹脂基板１０の外形線である。
回路パターン全体を銅導電性インクを用いて形成したので配線経路の電気抵抗値が小さい。
評価に用いた銅導電性インクはタッタシステムエレクトロニクス社製のＮＦ２０００であり、印刷後に１６０℃，６０分間乾燥した。
なお、比抵抗値は５×１０－５Ω・ｃｍである。
図２は、図１に示した回路パターンの上に、銀導電性インクを用いて部分的にはんだ付け部を形成したものであるが、説明上、分かりやすくするために銀導電性インクを重ね印刷した部分のみを表し、図２おいて黒で表した部分が銀導電性インクによるはんだ付け部である。
なお、はんだ付け箇所は、銅導電性インクを印刷する工程以外の他の工程において加工部分が重なることはないのでこの銀導電性インクを用いてはんだ付けする工程は最後に行ってもよい。
評価に用いた銀導電性インクはマクセル北陸精機株式会社製のＤＰ－００２ＭＡであり、印刷後に１６０℃，３０分間乾燥した。
比抵抗値は３×１０－４Ω・ｃｍである。
図３は、図２の状態の上にレジストコ－ト１３を印刷及び硬化させた状態を示し、図３にて黒色で表した部分１３ａはパターンの電極部やはんだ付け部を露出させてある部分であり、黒以外の部分がレジストを塗布した部分である。
図４は、図３で示したレジストコート１３の上にアンダーコート１４を印刷及び硬化させた状態を示す。
アンダーコート１４は、次に示すカーボン電極を形成するための下地層として形成したものであり、有機絶縁性皮膜層である。
図４にて、黒色で表した部分１４ａは、アンダーコートされていない部分である。
図５は、図４に示したアンダ－コート１４を施した上からカーボン配線電極１５を印刷し、硬化させた状態を示し、図５にて黒で表した部分がカーボンを塗布した部分である。
カーボン配線電極１５はアンダーコート１４を施してない部分１４ａにて銅導電性インクにて形成した電極部と電気接続されている。
図６は、必要に応じて基板上に記号や文字を印刷した、文字等の部分のみを表す。
このようにして製造した基板を用いると、銀導電性インクで形成したはんだ付け部１２に抵抗チップやコンデンサー等の電子部品を常法に従いはんだ付け実装できる。 Next, a substrate manufacturing procedure will be described with reference to FIGS.
The substrate original plate is divided into a predetermined size, and positioning holes are formed as necessary to form a circuit pattern.
FIG. 1 shows a state in which acircuit pattern 11 is formed on an insulating resin substrate 10 by a screen printing method using copper conductive ink as printed in black and then dried.
In FIG. 1, the outermost frame is the outline of theinsulating resin substrate 10.
Since the entire circuit pattern is formed using copper conductive ink, the electrical resistance value of the wiring path is small.
The copper conductive ink used for the evaluation was NF2000 manufactured by Tatta System Electronics, and was dried at 160 ° C. for 60 minutes after printing.
The specific resistance value is 5 × 10 −5 Ω · cm.
FIG. 2 shows a part where a soldering portion is partially formed using silver conductive ink on the circuit pattern shown in FIG. Only the printed part is shown, and the part shown in black in FIG. 2 is a soldered part with silver conductive ink.
In addition, since a processed part does not overlap in a process other than the process of printing a copper conductive ink, you may perform the process soldered using this silver conductive ink at the last.
The silver conductive ink used for the evaluation was DP-002MA manufactured by Maxell Hokuriku Seiki Co., Ltd., which was dried at 160 ° C. for 30 minutes after printing.
The specific resistance value is 3 × 10 −4 Ω · cm.
FIG. 3 shows a state in which theresist coat 13 is printed and cured on the state of FIG. 2, and a portion 13a shown in black in FIG. 3 is a portion where the electrode portion and soldering portion of the pattern are exposed. The portion other than black is the portion where the resist is applied.
FIG. 4 shows a state in which theundercoat 14 is printed and cured on the resist coat 13 shown in FIG.
Theundercoat 14 is formed as a base layer for forming the following carbon electrode, and is an organic insulating film layer.
In FIG. 4, ablack portion 14a is a portion that is not undercoated.
FIG. 5 shows a state in which thecarbon wiring electrode 15 is printed and cured after the undercoat 14 shown in FIG. 4 is applied, and a black portion in FIG. 5 is a portion where carbon is applied. .
Thecarbon wiring electrode 15 is electrically connected to an electrode portion formed of copper conductive ink at a portion 14a where the undercoat 14 is not applied.
FIG. 6 shows only a part of a character or the like on which a symbol or a character is printed on a substrate as necessary.
When the substrate thus manufactured is used, electronic components such as a resistor chip and a capacitor can be soldered and mounted on thesoldering portion 12 formed of silver conductive ink according to a conventional method.
基板原板を所定の大きさに分割し、必要に応じて位置決め用の穴をあけ、回路パターンを形成する。
図１は絶縁性樹脂基板１０の上に、スクリーン印刷工法により、銅導電性インクを用いて、黒で表したように印刷し、その後に乾燥し、回路パターン１１を形成した状態を示す。
なお、図１にて最も外側の枠は、絶縁性樹脂基板１０の外形線である。
回路パターン全体を銅導電性インクを用いて形成したので配線経路の電気抵抗値が小さい。
評価に用いた銅導電性インクはタッタシステムエレクトロニクス社製のＮＦ２０００であり、印刷後に１６０℃，６０分間乾燥した。
なお、比抵抗値は５×１０－５Ω・ｃｍである。
図２は、図１に示した回路パターンの上に、銀導電性インクを用いて部分的にはんだ付け部を形成したものであるが、説明上、分かりやすくするために銀導電性インクを重ね印刷した部分のみを表し、図２おいて黒で表した部分が銀導電性インクによるはんだ付け部である。
なお、はんだ付け箇所は、銅導電性インクを印刷する工程以外の他の工程において加工部分が重なることはないのでこの銀導電性インクを用いてはんだ付けする工程は最後に行ってもよい。
評価に用いた銀導電性インクはマクセル北陸精機株式会社製のＤＰ－００２ＭＡであり、印刷後に１６０℃，３０分間乾燥した。
比抵抗値は３×１０－４Ω・ｃｍである。
図３は、図２の状態の上にレジストコ－ト１３を印刷及び硬化させた状態を示し、図３にて黒色で表した部分１３ａはパターンの電極部やはんだ付け部を露出させてある部分であり、黒以外の部分がレジストを塗布した部分である。
図４は、図３で示したレジストコート１３の上にアンダーコート１４を印刷及び硬化させた状態を示す。
アンダーコート１４は、次に示すカーボン電極を形成するための下地層として形成したものであり、有機絶縁性皮膜層である。
図４にて、黒色で表した部分１４ａは、アンダーコートされていない部分である。
図５は、図４に示したアンダ－コート１４を施した上からカーボン配線電極１５を印刷し、硬化させた状態を示し、図５にて黒で表した部分がカーボンを塗布した部分である。
カーボン配線電極１５はアンダーコート１４を施してない部分１４ａにて銅導電性インクにて形成した電極部と電気接続されている。
図６は、必要に応じて基板上に記号や文字を印刷した、文字等の部分のみを表す。
このようにして製造した基板を用いると、銀導電性インクで形成したはんだ付け部１２に抵抗チップやコンデンサー等の電子部品を常法に従いはんだ付け実装できる。 Next, a substrate manufacturing procedure will be described with reference to FIGS.
The substrate original plate is divided into a predetermined size, and positioning holes are formed as necessary to form a circuit pattern.
FIG. 1 shows a state in which a
In FIG. 1, the outermost frame is the outline of the
Since the entire circuit pattern is formed using copper conductive ink, the electrical resistance value of the wiring path is small.
The copper conductive ink used for the evaluation was NF2000 manufactured by Tatta System Electronics, and was dried at 160 ° C. for 60 minutes after printing.
The specific resistance value is 5 × 10 −5 Ω · cm.
FIG. 2 shows a part where a soldering portion is partially formed using silver conductive ink on the circuit pattern shown in FIG. Only the printed part is shown, and the part shown in black in FIG. 2 is a soldered part with silver conductive ink.
In addition, since a processed part does not overlap in a process other than the process of printing a copper conductive ink, you may perform the process soldered using this silver conductive ink at the last.
The silver conductive ink used for the evaluation was DP-002MA manufactured by Maxell Hokuriku Seiki Co., Ltd., which was dried at 160 ° C. for 30 minutes after printing.
The specific resistance value is 3 × 10 −4 Ω · cm.
FIG. 3 shows a state in which the
FIG. 4 shows a state in which the
The
In FIG. 4, a
FIG. 5 shows a state in which the
The
FIG. 6 shows only a part of a character or the like on which a symbol or a character is printed on a substrate as necessary.
When the substrate thus manufactured is used, electronic components such as a resistor chip and a capacitor can be soldered and mounted on the
次に、銅導電性インクと銀導電性インクとの重ね印刷部の評価を実施した。
図７は、銅導電性インクを用いて絶縁性基板１０の上に回路パターン１１を形成し、その上にはんだ付け部１２を銀導電性インクを用いて重ね形成した部分の顕微鏡断面写真を示す。
図８は、基板上に３２１６角チップ抵抗をはんだ付けした状態を示す。
絶縁性基板上に銅導電性インクにて回路パターンを形成し、その上に銀導電性インクを重ね印刷し、この上に上記角チップをはんだ付けしたものと、絶縁性基板の上に直接的に銀導電性インクを印刷形成し、その上に角チップをはんだ付けしたものの、角チップ剥離荷重を測定した結果を表１に示す。 Next, evaluation of the overprinting part of copper conductive ink and silver conductive ink was implemented.
FIG. 7 shows a microscopic cross-sectional photograph of a portion in which acircuit pattern 11 is formed on an insulating substrate 10 using copper conductive ink, and a soldering portion 12 is formed thereon by using silver conductive ink. .
FIG. 8 shows a state where a 3216 square chip resistor is soldered on the substrate.
A circuit pattern is formed with copper conductive ink on an insulating substrate, silver conductive ink is overprinted thereon, and the above-mentioned square chip is soldered thereon, and directly on the insulating substrate. Table 1 shows the results of measuring the square chip peeling load, in which a silver conductive ink was printed and formed, and the square chip was soldered thereon.
図７は、銅導電性インクを用いて絶縁性基板１０の上に回路パターン１１を形成し、その上にはんだ付け部１２を銀導電性インクを用いて重ね形成した部分の顕微鏡断面写真を示す。
図８は、基板上に３２１６角チップ抵抗をはんだ付けした状態を示す。
絶縁性基板上に銅導電性インクにて回路パターンを形成し、その上に銀導電性インクを重ね印刷し、この上に上記角チップをはんだ付けしたものと、絶縁性基板の上に直接的に銀導電性インクを印刷形成し、その上に角チップをはんだ付けしたものの、角チップ剥離荷重を測定した結果を表１に示す。 Next, evaluation of the overprinting part of copper conductive ink and silver conductive ink was implemented.
FIG. 7 shows a microscopic cross-sectional photograph of a portion in which a
FIG. 8 shows a state where a 3216 square chip resistor is soldered on the substrate.
A circuit pattern is formed with copper conductive ink on an insulating substrate, silver conductive ink is overprinted thereon, and the above-mentioned square chip is soldered thereon, and directly on the insulating substrate. Table 1 shows the results of measuring the square chip peeling load, in which a silver conductive ink was printed and formed, and the square chip was soldered thereon.
この結果、銅導電性インクの上に銀導電性インクを重ね印刷してもはんだ付け強度にほとんど差がないことが確認できた。
As a result, it was confirmed that there was almost no difference in soldering strength even when the silver conductive ink was overprinted on the copper conductive ink.
本発明は、銅導電性インクに有する低抵抗値の特性を維持しつつ、はんだ付けが必要な部分にのみ銀導電性インクを重ね印刷したものであり、銀イオンマイグレーションの発生を抑えつつ、電子部品をはんだ実装可能にした点に特徴があり、このような特徴が活かされる各種回路基板に展開できる。
The present invention is the one in which the silver conductive ink is overprinted only on the portion that needs to be soldered while maintaining the low resistance characteristic of the copper conductive ink, and the generation of silver ion migration is suppressed while the It is characterized in that the component can be solder-mounted, and can be developed on various circuit boards in which such a feature is utilized.
Claims (1)
- 銅粉末を含有する銅導電性インクを用いて基板上に回路パターンを印刷形成し、
当該回路パターンの上に、銀粉末を含有する銀導電性インクを用いてはんだ付け部を印刷形成してあることを特徴とする電子部品実装用回路基板。 A circuit pattern is printed on the substrate using copper conductive ink containing copper powder,
A circuit board for mounting an electronic component, wherein a soldered portion is printed and formed on the circuit pattern using silver conductive ink containing silver powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/050994 WO2010084592A1 (en) | 2009-01-22 | 2009-01-22 | Circuit board for mounting electronic component thereon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2009/050994 WO2010084592A1 (en) | 2009-01-22 | 2009-01-22 | Circuit board for mounting electronic component thereon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2010084592A1 true WO2010084592A1 (en) | 2010-07-29 |
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ID=42355666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2009/050994 WO2010084592A1 (en) | 2009-01-22 | 2009-01-22 | Circuit board for mounting electronic component thereon |
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| Country | Link |
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| WO (1) | WO2010084592A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103620907A (en) * | 2011-08-31 | 2014-03-05 | 丰田自动车株式会社 | Charge/discharge assist device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04208593A (en) * | 1990-12-03 | 1992-07-30 | Nec Corp | Thick film printed board |
-
2009
- 2009-01-22 WO PCT/JP2009/050994 patent/WO2010084592A1/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04208593A (en) * | 1990-12-03 | 1992-07-30 | Nec Corp | Thick film printed board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103620907A (en) * | 2011-08-31 | 2014-03-05 | 丰田自动车株式会社 | Charge/discharge assist device |
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