JPH04208593A - Thick film printed board - Google Patents
Thick film printed boardInfo
- Publication number
- JPH04208593A JPH04208593A JP40015390A JP40015390A JPH04208593A JP H04208593 A JPH04208593 A JP H04208593A JP 40015390 A JP40015390 A JP 40015390A JP 40015390 A JP40015390 A JP 40015390A JP H04208593 A JPH04208593 A JP H04208593A
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- pad
- printed board
- screen printing
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 238000007650 screen-printing Methods 0.000 claims abstract description 11
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 abstract description 15
- 239000012299 nitrogen atmosphere Substances 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- 238000010301 surface-oxidation reaction Methods 0.000 abstract description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000010304 firing Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
Abstract
Description
［０００１１ [00011
【産業上の利用分野］本発明は厚膜印刷基板に関し、特
に部品搭載用のパッドの構造に関する。
［０００２］
【従来の技術】従来、混成集積回路等に用いられる厚膜
印刷基板は、セラミック基板上にスクリーン印刷法で銅
導体ペーストを用いて印刷し、乾燥したのち中性ガス雰
囲気中で６００〜９００℃で焼成して銅の厚膜導体を形
成している。この種の厚膜印刷基板は、回路構成や用途
等により、銅の厚膜導体からなる配線と部品搭載用のパ
ッドのほかに、抵抗体、クロスガラスや保護ガラス等が
それぞれの場合に合せて形成されている。
［０００３］銅の厚膜導体の表面あらさＲｍａｘは２〜
３μｍ程度であり、膜内体ポーラスであるため、メツキ
等で形成されたバルク状態の銅導体に比べて表面積が大
きく、それだけ酸化する確率も高い。また、銅厚膜導体
を形成した後に形成する抵抗体、クロスガラスや保護ガ
ラスは、銅厚膜導体の表面の酸化が起こらない様に１５
０℃以上の処理を行う場合は中性雰囲気中（通常は窒素
雰囲気中）で行っている。
［０００４１[Industrial Field of Application] The present invention relates to a thick film printed circuit board, and more particularly to the structure of a pad for mounting components. [0002] Conventionally, thick film printed circuit boards used for hybrid integrated circuits, etc. are printed on a ceramic substrate using a screen printing method using a copper conductor paste, dried, and then dried for 600 minutes in a neutral gas atmosphere. A copper thick film conductor is formed by firing at ~900°C. This type of thick-film printed circuit board is equipped with resistors, cross glass, protective glass, etc., in addition to wiring made of thick-film copper conductors and pads for mounting components, depending on the circuit configuration and application. It is formed. [0003] The surface roughness Rmax of the copper thick film conductor is 2~
Since it is about 3 μm and porous within the film, it has a larger surface area than a bulk copper conductor formed by plating or the like, and the probability of oxidation is correspondingly high. In addition, the resistor, cross glass, and protective glass that are formed after forming the copper thick film conductor should be
When processing at 0° C. or higher, it is carried out in a neutral atmosphere (usually in a nitrogen atmosphere). [00041
【発明が解決しようとする課題］この従来の厚膜印刷基
板は、スクリーン印刷法で形成した銅厚膜導体のパッド
に部品を直接半田付していたので、半田付時に基板にか
かる熱のため表面が酸化し、半田付性が低下するという
欠点がある。また、半田付温度にさらされることがなく
とも、室温中にパッド表面を露出したまま長期間（たと
えば１力月）放置した場合も表面が酸化するため、半田
付性が低下するという欠点がある。
［０００５］さらに、表面の酸化に対して半田付性を十
分に保つために強力なフラックスを使用すると、フラッ
クスに含有するハロゲン元素が搭載する部品に対して悪
影響を及ぼし、混成集積回路の信頼性を低下させるとい
う欠点がある。
［０００６］
【課題を解決するための手段】本発明の厚膜印刷基板は
、セラミック基板上にスクリーン印刷法で形成された銅
からなるパッドを有する厚膜印刷基板において、前記パ
ッドは半田付性がよくかつ酸化されにくい金属膜で覆わ
れているものである。
［０００７］[Problem to be solved by the invention] In this conventional thick film printed circuit board, components were directly soldered to copper thick film conductor pads formed by screen printing, so the heat applied to the board during soldering caused problems. The disadvantage is that the surface is oxidized and solderability is reduced. Furthermore, even if the pad surface is not exposed to soldering temperature, if the pad surface is left exposed for a long period of time (for example, one month), the surface will oxidize, resulting in a decrease in solderability. . [0005] Furthermore, when a strong flux is used to maintain sufficient solderability against surface oxidation, the halogen elements contained in the flux have an adverse effect on the mounted components, reducing the reliability of the hybrid integrated circuit. It has the disadvantage of lowering the [0006] [Means for Solving the Problems] A thick film printed board of the present invention has a pad made of copper formed by screen printing on a ceramic board, wherein the pad has solderability. It is covered with a metal film that has good oxidation properties and is difficult to oxidize. [0007]
【実施例】次に本発明について図面を参照して説明する
。図１ （ａ） 、 （ｂ）は本発明の実施例１の平
面図及びＡ−Ａ線断面図である。
［０００８］アルミナセラミツク基板４上に銅の厚膜導
体からなる配線とパッド１とが形成されており、このパ
ッド上には酸化されにくい金属としてのＡｇ−Ｐｄ膜３
が形成されている。尚、２はパッドの周囲の配線部を覆
う保護ガラスである。
［０００９］製造方法としては、まずアルミナセラミッ
ク基板４上にスクリーン印刷法で銅導体ペーストを用い
てパターン形成後、１２０℃で１０分間乾燥する。次で
９００℃の窒素雰囲気中で焼成を行う。次に銅導体上の
半田付用のパッド１の上だけに、スクリーン印刷法で銀
パラジウム（Ａｇ−Ｐｄ）ペーストを用いてパターン形
成後、１２０℃で１０分間乾燥し、次で９００℃の窒素
雰囲気中で焼成する。この時用いるＡｇ−Ｐｄペースト
は市販の空気中焼成用のものは使用できないので、ペー
スト中の樹脂成分が熱のみで分解する高分解性の組成の
ものを使用した。次に、スクリーン印刷法で非晶質ガラ
スの保護ガラスペーストを印刷し、１２０℃１０分間乾
燥後５００℃の窒素雰囲気中で焼成した。
［００１０１このように構成された実施例１によれば、
半田付用のパッド１の表面がＡｇ−Ｐｄ膜３で覆われて
いるので、熱等による表面酸化は発生することがなく、
半田付性の優れた厚膜印刷基板を得ることができた。
［００１１］図２ （ａ） 、 （ｂ）は本発明の実
施例２の平面図及びＢ−Ｂ線断面図である。
［００１２］アルミナセラミツク基板４上にスクリーン
印刷法で銅導体ペーストを用いて印刷後、１２０℃で１
０分間乾燥し、次で９００℃の窒素雰囲気中で焼成し配
線及びパッド１のパターンを形成する。次にパッド１を
除く部分にソルダーレジスト５を形成し、窒素雰囲気中
で２００℃で３０分間硬化させる。次でパッド１上を除
く部分に選択的にメツキ用レジストを塗布し、無電解金
メツキを行ない、パッド１上に金メツキ膜６を形成する
。次でメツキ用のレジストを剥離する。
［００１３］このように構成された実施例２によれば、
パッド１の表面が金メツキ膜６で覆われているので、熱
等による表面酸化は発生することなく、半田付性に優れ
た特性を得ることができる。更にパッド１の表面がなめ
らかになるので、ワイヤポンディング用パッドとしても
使用が可能になるという利点がある。
［００１４］尚、上記実施例においては、パッドを覆う
酸化されにくい金属膜としてＡｇ−Ｐｄ及びＡｕを用い
た場合について説明したが、これに限定されるものでは
なく、Ａｕ、Ａｇ、Ｐｔ、Ｐｄのうち少くとも一つを成
分として含むものであればよい。
［００１５］DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIGS. 1A and 1B are a plan view and a sectional view taken along the line A-A of Example 1 of the present invention. [0008] On an alumina ceramic substrate 4, wiring and pads 1 made of a copper thick film conductor are formed, and on these pads, an Ag-Pd film 3 as a metal that is difficult to oxidize is formed.
is formed. Note that 2 is a protective glass that covers the wiring portion around the pad. [0009] As for the manufacturing method, first, a pattern is formed on the alumina ceramic substrate 4 by screen printing using a copper conductor paste, and then it is dried at 120° C. for 10 minutes. Next, firing is performed in a nitrogen atmosphere at 900°C. Next, after forming a pattern using silver-palladium (Ag-Pd) paste by screen printing only on the soldering pad 1 on the copper conductor, it was dried at 120°C for 10 minutes, and then heated with nitrogen at 900°C. Firing in an atmosphere. As the Ag-Pd paste used at this time cannot be used as a commercially available one for firing in the air, a paste with a highly decomposable composition in which the resin component in the paste decomposes only by heat was used. Next, a protective glass paste of amorphous glass was printed using a screen printing method, dried at 120°C for 10 minutes, and then fired at 500°C in a nitrogen atmosphere. [00101 According to the first embodiment configured as described above,
Since the surface of the soldering pad 1 is covered with the Ag-Pd film 3, surface oxidation due to heat etc. does not occur.
A thick film printed circuit board with excellent solderability could be obtained. [0011] FIGS. 2(a) and 2(b) are a plan view and a sectional view taken along the line BB of Example 2 of the present invention. [0012] After printing copper conductor paste on the alumina ceramic substrate 4 by screen printing method,
The film is dried for 0 minutes, and then baked in a nitrogen atmosphere at 900° C. to form wiring and pad 1 patterns. Next, a solder resist 5 is formed on the portion excluding the pad 1, and cured at 200° C. for 30 minutes in a nitrogen atmosphere. Next, a plating resist is selectively applied to the portions other than the pad 1, and electroless gold plating is performed to form a gold plating film 6 on the pad 1. Next, remove the plating resist. [0013] According to the second embodiment configured as described above,
Since the surface of the pad 1 is covered with the gold plating film 6, surface oxidation due to heat or the like does not occur, and excellent solderability can be obtained. Furthermore, since the surface of the pad 1 is smooth, there is an advantage that it can also be used as a wire bonding pad. [0014] In the above embodiment, a case was explained in which Ag-Pd and Au were used as the metal film that does not easily oxidize to cover the pad, but the invention is not limited to this, and Au, Ag, Pt, Pd It is sufficient if it contains at least one of these as a component. [0015]
【発明の効果】以上説明したように本発明は、スクリー
ン印刷法で形成した銅厚膜導体からなる半田付用のパッ
ド上を半田付性がよくかつ酸化されにくい金属膜で覆う
ことにより、半田付性に優れた厚膜印刷基板が得られる
という効果がある。Effects of the Invention As explained above, the present invention provides a soldering pad made of a thick copper film conductor formed by a screen printing method, by covering it with a metal film that has good solderability and is resistant to oxidation. This has the effect of providing a thick film printed substrate with excellent adhesion properties.
Claims (1)
成された銅からなるパッドを有する厚膜印刷基板におい
て、前記パッドは半田付性がよくかつ酸化されにくい金
属膜で覆われていることを特徴とする厚膜印刷基板。1. A thick film printed board having a pad made of copper formed by screen printing on a ceramic board, characterized in that the pad is covered with a metal film that has good solderability and is resistant to oxidation. thick film printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40015390A JPH04208593A (en) | 1990-12-03 | 1990-12-03 | Thick film printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40015390A JPH04208593A (en) | 1990-12-03 | 1990-12-03 | Thick film printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04208593A true JPH04208593A (en) | 1992-07-30 |
Family
ID=18510070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40015390A Pending JPH04208593A (en) | 1990-12-03 | 1990-12-03 | Thick film printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04208593A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730242A (en) * | 1993-07-14 | 1995-01-31 | Nec Corp | Thin-film circuit substrate |
| US5424093A (en) * | 1991-11-15 | 1995-06-13 | Murata Mfg. Co., Ltd. | Method of manufacturing electronic elements |
| JPH08232072A (en) * | 1994-12-09 | 1996-09-10 | Alpha Metals Ltd | Silver plating |
| JPH08335602A (en) * | 1995-06-08 | 1996-12-17 | Ngk Spark Plug Co Ltd | Ceramic substrate and its manufacturing method |
| JP2002124744A (en) * | 2000-10-12 | 2002-04-26 | Eastern Co Ltd | Circuit board |
| US6885104B2 (en) * | 1998-10-05 | 2005-04-26 | Kulicke & Soffa Investments, Inc. | Semiconductor copper bond pad surface protection |
| JP2007103816A (en) * | 2005-10-07 | 2007-04-19 | Nec Electronics Corp | Interconnect substrate and electronic circuit device |
| JP2007103840A (en) * | 2005-10-07 | 2007-04-19 | Nec Electronics Corp | Method of manufacturing electronic circuit device |
| WO2010084592A1 (en) * | 2009-01-22 | 2010-07-29 | Smk株式会社 | Circuit board for mounting electronic component thereon |
| JP2012221983A (en) * | 2011-04-04 | 2012-11-12 | Murata Mfg Co Ltd | Ceramic substrate |
| JPWO2014103541A1 (en) * | 2012-12-27 | 2017-01-12 | 日本碍子株式会社 | Electronic component and manufacturing method thereof |
-
1990
- 1990-12-03 JP JP40015390A patent/JPH04208593A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424093A (en) * | 1991-11-15 | 1995-06-13 | Murata Mfg. Co., Ltd. | Method of manufacturing electronic elements |
| JPH0730242A (en) * | 1993-07-14 | 1995-01-31 | Nec Corp | Thin-film circuit substrate |
| JPH08232072A (en) * | 1994-12-09 | 1996-09-10 | Alpha Metals Ltd | Silver plating |
| JPH08335602A (en) * | 1995-06-08 | 1996-12-17 | Ngk Spark Plug Co Ltd | Ceramic substrate and its manufacturing method |
| US6885104B2 (en) * | 1998-10-05 | 2005-04-26 | Kulicke & Soffa Investments, Inc. | Semiconductor copper bond pad surface protection |
| JP2002124744A (en) * | 2000-10-12 | 2002-04-26 | Eastern Co Ltd | Circuit board |
| JP2007103816A (en) * | 2005-10-07 | 2007-04-19 | Nec Electronics Corp | Interconnect substrate and electronic circuit device |
| JP2007103840A (en) * | 2005-10-07 | 2007-04-19 | Nec Electronics Corp | Method of manufacturing electronic circuit device |
| WO2010084592A1 (en) * | 2009-01-22 | 2010-07-29 | Smk株式会社 | Circuit board for mounting electronic component thereon |
| JP2012221983A (en) * | 2011-04-04 | 2012-11-12 | Murata Mfg Co Ltd | Ceramic substrate |
| JPWO2014103541A1 (en) * | 2012-12-27 | 2017-01-12 | 日本碍子株式会社 | Electronic component and manufacturing method thereof |
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