WO2010076951A3 - Lead frame substrate for diode package and diode package including the same - Google Patents

Lead frame substrate for diode package and diode package including the same Download PDF

Info

Publication number
WO2010076951A3
WO2010076951A3 PCT/KR2009/005979 KR2009005979W WO2010076951A3 WO 2010076951 A3 WO2010076951 A3 WO 2010076951A3 KR 2009005979 W KR2009005979 W KR 2009005979W WO 2010076951 A3 WO2010076951 A3 WO 2010076951A3
Authority
WO
WIPO (PCT)
Prior art keywords
lead frame
frame substrate
diode package
same
housing
Prior art date
Application number
PCT/KR2009/005979
Other languages
French (fr)
Korean (ko)
Other versions
WO2010076951A2 (en
Inventor
조현춘
Original Assignee
(주)참빛
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)참빛 filed Critical (주)참빛
Publication of WO2010076951A2 publication Critical patent/WO2010076951A2/en
Publication of WO2010076951A3 publication Critical patent/WO2010076951A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

Disclosed are a lead frame substrate for an LED package and an LED package including the same. The lead frame substrate comprises: a metallic plate unit which is electrically divided into at least two regions by an insulation resin; a metallic housing unit that is placed at an edge of one surface of the plate unit and forms an inclined plane; and an adhesive layer that is placed between the housing and plate units and electrically insulates the housing and plate units. The lead frame substrate is designed to enable an electrode to supply electric power and radiate heat actively so that the heatsink property may be improved.
PCT/KR2009/005979 2008-10-16 2009-10-16 Lead frame substrate for diode package and diode package including the same WO2010076951A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0101592 2008-10-16
KR20080101592A KR100908299B1 (en) 2008-10-16 2008-10-16 Lead frame substrate and diode package having the same

Publications (2)

Publication Number Publication Date
WO2010076951A2 WO2010076951A2 (en) 2010-07-08
WO2010076951A3 true WO2010076951A3 (en) 2010-08-19

Family

ID=41337737

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/005979 WO2010076951A2 (en) 2008-10-16 2009-10-16 Lead frame substrate for diode package and diode package including the same

Country Status (2)

Country Link
KR (1) KR100908299B1 (en)
WO (1) WO2010076951A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012124836A1 (en) * 2011-03-14 2012-09-20 주식회사 포인트 엔지니어링 Optical device and method for manufacturing same
JP2012238830A (en) * 2011-05-09 2012-12-06 Lumirich Co Ltd Light emitting diode element
CN102820406B (en) * 2012-07-23 2015-06-24 厦门市朗星节能照明股份有限公司 Manufacturing method of LED (light emitting diode) packaging structure

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218398A (en) * 2002-01-18 2003-07-31 Citizen Electronics Co Ltd Surface mount type light emitting diode and its manufacturing method
JP2006186297A (en) * 2004-12-03 2006-07-13 Toshiba Corp Semiconductor light emitting device and its manufacturing method
JP2006253229A (en) * 2005-03-08 2006-09-21 Toyoda Gosei Co Ltd Led light emitting device, and method of forming reflector used therefor
JP2008103401A (en) * 2006-10-17 2008-05-01 C I Kasei Co Ltd Package for upper/lower electrode type light emitting diode, and its manufacturing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09121015A (en) * 1995-10-25 1997-05-06 Hitachi Ltd Semiconductor device
KR101464255B1 (en) * 2008-06-23 2014-11-25 삼성전자주식회사 Flash memory device and system including the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003218398A (en) * 2002-01-18 2003-07-31 Citizen Electronics Co Ltd Surface mount type light emitting diode and its manufacturing method
JP2006186297A (en) * 2004-12-03 2006-07-13 Toshiba Corp Semiconductor light emitting device and its manufacturing method
JP2006253229A (en) * 2005-03-08 2006-09-21 Toyoda Gosei Co Ltd Led light emitting device, and method of forming reflector used therefor
JP2008103401A (en) * 2006-10-17 2008-05-01 C I Kasei Co Ltd Package for upper/lower electrode type light emitting diode, and its manufacturing method

Also Published As

Publication number Publication date
KR100908299B1 (en) 2009-07-17
WO2010076951A2 (en) 2010-07-08

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