JP2003218398A - Surface mount type light emitting diode and its manufacturing method - Google Patents
Surface mount type light emitting diode and its manufacturing methodInfo
- Publication number
- JP2003218398A JP2003218398A JP2002010876A JP2002010876A JP2003218398A JP 2003218398 A JP2003218398 A JP 2003218398A JP 2002010876 A JP2002010876 A JP 2002010876A JP 2002010876 A JP2002010876 A JP 2002010876A JP 2003218398 A JP2003218398 A JP 2003218398A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- metal substrate
- package
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【発明の属する技術分野】本発明は、表面実装型発光ダ
イオード（以下ＬＥＤと略記する）に関し、更に詳しく
は、特に放熱性・信頼性を重視する表面実装型ＬＥＤ及
びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount light emitting diode (hereinafter abbreviated as an LED), and more particularly to a surface mount LED in which heat dissipation and reliability are particularly important and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】ＬＥＤはＡｌＩｎＧａＰやＧａＮ等の化
合物半導体ウエハ上にＰＮ接合を形成し、これに順方向
電流を通じて可視光又は近赤外光の発光を得るものであ
り、近年、表示をはじめ、通信、計測、制御等に広く応
用されている。一方、近年の電子機器は、高性能化・多
機能化と共に、小型化・軽量化を追求している。更に、
特に放熱性・信頼性が重視される分野にも適用範囲が拡
大している。そのために電子部品は、プリント基板上に
表面実装できる部品としたものが多い。そしてこのよう
な電子部品の多くは略立方体形状をしており、プリント
基板上の配線パターンにリフロー半田付け等の固着手段
で接続される。ＬＥＤにもこうした要求に応えるものが
開発されている。2. Description of the Related Art An LED is one in which a PN junction is formed on a compound semiconductor wafer such as AlInGaP or GaN and a forward current is applied to the PN junction to obtain visible or near-infrared light emission. Widely applied in communication, measurement, control, etc. On the other hand, in recent years, electronic devices are pursuing miniaturization and weight reduction as well as high performance and multifunction. Furthermore,
In particular, the range of application is expanding to fields where heat dissipation and reliability are important. Therefore, many electronic components are components that can be surface-mounted on a printed circuit board. Most of such electronic components have a substantially cubic shape and are connected to a wiring pattern on a printed circuit board by fixing means such as reflow soldering. LEDs that meet these requirements have also been developed.
【０００３】このような従来の表面実装型ＬＥＤについ
て、図面に基づいてその概要を説明する。図１０は従来
の表面実装型ＬＥＤの縦断面図である。図１０におい
て、７０は表面実装型ＬＥＤである。７１は、予めプレ
ス成形されたＣｕ系、Ｆｅ系の材料から成るリードフレ
ームを、耐熱性ポリマーによって光反射面７１ａを含む
ように立体形状にインサート成形して成るパッケージで
ある。An outline of such a conventional surface mount LED will be described with reference to the drawings. FIG. 10 is a vertical sectional view of a conventional surface mount LED. In FIG. 10, reference numeral 70 denotes a surface mount LED. Reference numeral 71 is a package formed by insert-molding a lead frame made of a Cu-based or Fe-based material that has been press-molded in advance into a three-dimensional shape with a heat-resistant polymer so as to include the light-reflecting surface 71a.
【０００４】７２は、上面電極７２ａから側面電極７２
ｂを経由して下面電極７２ｃに至るリードフレームであ
る一方の電極パターンであり、７３は同じく上面電極７
３ａから側面電極７３ｂを経由して下面電極７３ｃに至
る他方の電極パターンである。７４は、上面電極７２ａ
に一方の電極を銀ペーストによりダイボンディングした
ＬＥＤ素子である。７５はＡｕ線等より成るワイヤであ
り、ワイヤ７５によりＬＥＤ素子７４の他方の電極と上
面電極７３ａとがワイヤボンディングにより接続されて
いる。７６は、ＬＥＤ素子７４、ＬＥＤ素子７４の接続
部及びワイヤ５５等の保護と、ＬＥＤ素子７４の発光を
効果的にすることのために封止している、透光性のエポ
キシ樹脂等から成る封止樹脂である。こうして表面実装
型ＬＥＤ７０が構成されている。Reference numeral 72 denotes a top surface electrode 72a to a side surface electrode 72.
One electrode pattern, which is a lead frame reaching the lower surface electrode 72c through b, 73 is the upper surface electrode 7 as well.
It is the other electrode pattern from 3a to the lower surface electrode 73c via the side surface electrode 73b. 74 is an upper surface electrode 72a
It is an LED element in which one electrode is die-bonded with silver paste. Reference numeral 75 is a wire made of an Au wire or the like, and the wire 75 connects the other electrode of the LED element 74 and the upper surface electrode 73a by wire bonding. Reference numeral 76 is made of a translucent epoxy resin or the like, which is sealed to protect the LED element 74, the connection portion of the LED element 74 and the wire 55, and to make the LED element 74 emit light effectively. It is a sealing resin. In this way, the surface mount LED 70 is configured.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
表面実装型ＬＥＤ７０においては、ＬＥＤ素子７４から
の放熱をリードフレーム部でしか、受け取れない為に、
放熱性が十分ではない。また、封止樹脂７６の影響で屈
折率が変化し、ＬＥＤ素子７４から出射される光の反射
効率がうまく活用されない。パッケージをインサート成
形で形成しているため、集合体での多数個同時生産方式
が活用できない、金型コストが嵩む等、生産性の点で問
題があった。更に、ＬＥＤ素子７４にはワイヤボンディ
ング、樹脂封止を採用しているので、車載用などの耐環
境性（温度や振動など）の厳しい条件のもとでは、信頼
性が不十分であった。However, in the conventional surface mount LED 70, the heat radiation from the LED element 74 can be received only by the lead frame portion.
The heat dissipation is not sufficient. In addition, the refractive index changes due to the influence of the sealing resin 76, and the reflection efficiency of the light emitted from the LED element 74 is not effectively utilized. Since the package is formed by insert molding, there are problems in terms of productivity, such as not being able to utilize the simultaneous production method for a large number of pieces in an aggregate, and increasing die cost. Further, since wire bonding and resin sealing are adopted for the LED element 74, the reliability is insufficient under the environment of severe environment resistance (temperature, vibration, etc.) such as vehicle mounting.
【０００６】上記発明は、このような従来の問題を解決
するためになされたものであり、その目的は、放熱性、
信頼性に優れた表面実装型ＬＥＤ及びその製造方法を提
供することである。The above invention has been made in order to solve such a conventional problem.
It is an object of the present invention to provide a surface mount LED having excellent reliability and a method for manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】前述した目的を達成する
ための本発明の手段は、内面には発光素子を接続する電
極を有し、外面には該電極と導通する端子電極を有する
パッケージ上に、発光素子を実装した表面実装型発光ダ
イオードにおいて、前記パッケージは、メタルコア材料
より成ると共に、中央がスリットにより縦に２分され
て、該スリットに絶縁部材が充填されている平板状メタ
ル基板の上面に、中央に貫通穴を有する平板状成形樹脂
を接合して形成されており、前記メタル基板上面に前記
発光素子が実装され、前記パッケージの上面にはカバー
板を接合することにより前記発光素子を封止して、光の
媒質が空気であることを特徴とする。[Means for Solving the Problems] The means of the present invention for achieving the above-mentioned object is a package having an electrode for connecting a light emitting element on the inner surface and a terminal electrode for conducting the electrode on the outer surface. In a surface mount type light emitting diode having a light emitting element mounted thereon, the package is made of a metal core material, and the center of the package is vertically divided by a slit, and the slit is filled with an insulating member. The light emitting device is formed by joining a flat plate-shaped molding resin having a through hole in the center to the upper face, the light emitting device is mounted on the upper face of the metal substrate, and a cover plate is joined to the upper face of the package. Is sealed, and the medium of light is air.
【０００８】また、前記発光素子は前記スリットを跨い
で実装されたフリップチップであり、該フリップチップ
と前記パッケージの前記メタル基板との隙間にアンダー
フィル樹脂を充填した前記発光素子は前記スリットを跨
いで実装されたフリップチップであり、該フリップチッ
プと前記パッケージの前記メタル基板との隙間にアンダ
ーフィル樹脂を充填したことを特徴とする。Further, the light emitting element is a flip chip mounted over the slit, and the light emitting element in which a gap between the flip chip and the metal substrate of the package is filled with an underfill resin extends over the slit. And a underfill resin is filled in a gap between the flip chip and the metal substrate of the package.
【０００９】また、前記メタル基板の少なくとも上面の
前記発光素子ボンディング部、並びに下面の外部接続端
子部には、金メッキ又は銀メッキの表面処理が施されて
いることを特徴とする。Further, at least the light emitting element bonding portion on the upper surface of the metal substrate and the external connection terminal portion on the lower surface are subjected to surface treatment of gold plating or silver plating.
【００１０】また、前記成形樹脂の貫通穴内面は、円錐
面、略球面又は略放物面のいずれか一つの面の一部であ
る前記成形樹脂の貫通穴内面は、円錐面、略球面又は略
放物面のいずれか一つの面の一部であることを特徴とす
る。The inner surface of the through hole of the molding resin is a part of one of a conical surface, a substantially spherical surface or a substantially parabolic surface, and the inner surface of the through hole of the molding resin is a conical surface, a substantially spherical surface or It is characterized by being a part of any one of the substantially paraboloids.
【００１１】また、前記貫通穴内面は、反射膜により被
覆されていることを特徴とする。The inner surface of the through hole is covered with a reflective film.
【００１２】また、前記カバー板は、透明ガラス又は透
明樹脂で形成されていることを特徴とすることを特徴と
する。Further, the cover plate is characterized by being formed of transparent glass or transparent resin.
【００１３】また、前記カバー板は、シート状又は平板
状に形成されていることを特徴とする。Further, the cover plate is formed in a sheet shape or a flat plate shape.
【００１４】また、前記カバー板には、レンズ形状が形
成されていることを特徴とする。Further, the cover plate has a lens shape.
【００１５】また、前述した目的を達成するための本発
明の他の手段は、請求項１乃至請求項８のいずれかに記
載の表面実装型ダイオードを製造する方法において、前
記発光ダイオードを多数個取りすることができる集合状
態のメタル基板上に発光素子を実装する工程と、前記メ
タル基板上に集合状態の成形樹脂を接合してパッケージ
基板を形成する工程と、前記発光素子実装後の前記パッ
ケージ基板に、集合状態のカバー板を接合して集合状態
の前記発光ダイオードを形成する工程と、集合状態の前
記発光ダイオードをダイシングして、単個の前記発光ダ
イオードに分割する工程を有することを特徴とする。Further, another means of achieving the above-mentioned object of the present invention is to provide a method for manufacturing a surface mount diode according to any one of claims 1 to 8, wherein a plurality of the light emitting diodes are provided. Mounting a light emitting element on a metal substrate in a collective state that can be taken; forming a package substrate by bonding a molding resin in a collective state on the metal substrate; and the package after mounting the light emitting element. It has a step of joining a cover plate in a collective state to a substrate to form the light emitting diode in a collective state, and a step of dicing the light emitting diode in a collective state to divide it into the single light emitting diode. And
【００１６】[0016]
【発明の実施の形態】以下、本発明の実施の形態を図面
に基づいて詳細に説明する。図１は本発明の実施の形態
である表面実装型ＬＥＤの縦断面図、図２はこのＬＥＤ
のパッケージの斜視図である。図３乃至図９はこの表面
実装型ＬＥＤの製造方法を示す斜視図である。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a vertical cross-sectional view of a surface-mounted LED which is an embodiment of the present invention, and FIG.
3 is a perspective view of the package of FIG. 3 to 9 are perspective views showing a method of manufacturing the surface mount LED.
【００１７】図１、図２において、１０は光の媒質を空
気とする表面実装型ＬＥＤである。１はパッケージであ
り、２はこのパッケージ１を構成する、５０Ｗ／（ｍ・
Ｋ）以上の熱伝導性の高いＭｇ系、Ａｌ系、Ｃｕ系等の
メタルコア材料から成るメタル基板である。メタル基板
２の全面に金メッキ又はぜが施されている。メタル基板
２の上面２ａから下面２ｂにかけて、メタル基板２を縦
に２分するスリット２ｃが形成されている。In FIGS. 1 and 2, reference numeral 10 is a surface-mount type LED in which the medium of light is air. 1 is a package, 2 is the package 1, 50 W / (m ·
K) is a metal substrate made of a metal core material such as Mg-based, Al-based, or Cu-based having high thermal conductivity. The entire surface of the metal substrate 2 is plated with gold or gold. A slit 2c that vertically divides the metal substrate 2 into two is formed from the upper surface 2a to the lower surface 2b of the metal substrate 2.
【００１８】３はスリット２ｃに充填されて両側を接合
しているエポキシ樹脂又は耐熱性ポリマー等の樹脂接着
剤である絶縁部材である。メタル基板２は、このように
絶縁部材３によって電気的に２分割されて一対の電極を
構成している。スリット２ｃを除くメタル基板２の全面
に、金メッキ等の表面処理が施されている。４は、パッ
ケージ１を構成する樹脂基板であり、メタル基板２の上
面２ａに、後述の接着シートを介して接合されている。
樹脂基板４には、円形の上部開口４ａ及び下部開口４ｂ
並びにこれらを接続する鍋状の側面４ｃを有する貫通穴
４ｄが形成されている。側面４ｃは円錐面の一部、放物
面の一部、又は球面の一部を成す形状をしている。樹脂
基板４の全面は、光沢銀メッキ等で被覆されて貫通穴４
ｄ内面は光反射面となっている。Reference numeral 3 denotes an insulating member which is a resin adhesive such as an epoxy resin or a heat resistant polymer, which is filled in the slit 2c and joined on both sides. The metal substrate 2 is thus electrically divided into two by the insulating member 3 to form a pair of electrodes. The entire surface of the metal substrate 2 excluding the slits 2c is subjected to surface treatment such as gold plating. Reference numeral 4 denotes a resin substrate that constitutes the package 1, and is bonded to the upper surface 2a of the metal substrate 2 via an adhesive sheet described later.
The resin substrate 4 has a circular upper opening 4a and a lower opening 4b.
Also, a through hole 4d having a pan-shaped side surface 4c for connecting them is formed. The side surface 4c has a shape of a part of a conical surface, a part of a paraboloid, or a part of a spherical surface. The entire surface of the resin substrate 4 is covered with bright silver plating or the like, and the through hole 4
The inner surface of d is a light reflecting surface.
【００１９】５は接着剤樹脂をフィルム状に成形した接
着シートであり、下部開口４ｂに対応する部分には穴が
明けてある。６は予めフリップチップ（ＦＣ）として形
成された発光素子であるバンプ付きＬＥＤ素子であり、
バンプがスリット２ｃを跨ぐように、メタル基板２の上
面２ａの両電極面にＦＣボンディングにより接合されて
いる。７はＬＥＤ素子６とメタル基板２の上面２ａとの
隙間に充填され、ボンディング部を被覆しているアンダ
ーフィル樹脂である。８はパッケージ１上面に、接着シ
ート５と同様の上部開口４ａに対応する穴が明けられた
接着シート９を介して接合され、貫通穴４ｄ内部を封止
している透明ガラス又は透明樹脂から成るシート状又は
平板状のカバー板である。Reference numeral 5 is an adhesive sheet formed by molding an adhesive resin into a film, and a hole is formed in a portion corresponding to the lower opening 4b. Reference numeral 6 is an LED element with bumps, which is a light emitting element previously formed as a flip chip (FC),
The bumps are joined to both electrode surfaces of the upper surface 2a of the metal substrate 2 by FC bonding so as to straddle the slits 2c. Reference numeral 7 is an underfill resin that fills the gap between the LED element 6 and the upper surface 2a of the metal substrate 2 and covers the bonding portion. Reference numeral 8 is made of a transparent glass or a transparent resin which is bonded to the upper surface of the package 1 through an adhesive sheet 9 having a hole corresponding to the upper opening 4a similar to the adhesive sheet 5 and sealing the inside of the through hole 4d. It is a sheet-shaped or flat-shaped cover plate.
【００２０】ＬＥＤ素子６を発した上向きの光は、矢印
のように媒質である空気中を通り、カバー板８を経て出
射方向である上方へ向かう。また、ＬＥＤ素子６を発し
た横方向の光は、側面４ｃにおいて反射して、矢印のよ
うにやはりカバー板８を経て上方へと向かう。The upward light emitted from the LED element 6 passes through the air, which is a medium, as shown by the arrow, and goes through the cover plate 8 to the upward direction which is the emission direction. Further, the lateral light emitted from the LED element 6 is reflected on the side surface 4c and also goes upward through the cover plate 8 as indicated by an arrow.
【００２１】次に、このＬＥＤ１０の製造方法について
説明する。この方法は表面実装型ＬＥＤ１０を多数個同
時に加工することができる集合基板を用いた製造方法で
ある。まず、図３に示すように、メタルコア材料から平
板状に成形した集合基板状態のメタル基板１２を用意
し、これにレーザー若しくはプレス抜き加工によって、
板厚を貫通するスリット１２ａ、１２ｂを、それぞれ所
定の間隔で互いに平行に、両端はメタル基板１２の外周
までには達しないように加工する。Next, a method of manufacturing the LED 10 will be described. This method is a manufacturing method using a collective substrate capable of simultaneously processing a large number of surface-mounted LEDs 10. First, as shown in FIG. 3, a metal substrate 12 is prepared from a metal core material in the form of a flat plate in the state of a collective substrate, and laser or press punching is applied to the metal substrate 12.
The slits 12a and 12b penetrating the plate thickness are processed in parallel with each other at predetermined intervals so that both ends do not reach the outer periphery of the metal substrate 12.
【００２２】スリット１２ａは、完成ＬＥＤ１０のスリ
ット２ｃになる部分であり、スリット１２ｂは、完成Ｌ
ＥＤ１０の外周にあたる部分である。その後、全面を金
メッキ又は銀メッキ処理をする。次に、スリット１２ａ
内に絶縁部材３である樹脂接着剤を充填・硬化させる。The slit 12a is a portion which becomes the slit 2c of the completed LED 10, and the slit 12b is a completed L.
It is a portion corresponding to the outer circumference of the ED 10. After that, the entire surface is plated with gold or silver. Next, the slit 12a
A resin adhesive, which is the insulating member 3, is filled and cured inside.
【００２３】次に、図４に示すように、予備加熱したメ
タル基板１２のスリット１２ａに沿って所定間隔に、バ
ンプがスリット１２ａを跨ぐように、金バンプ付きＬＥ
Ｄ素子６を超音波振動を加えながら搭載して半田接合
し、更にアンダーフィル樹脂７を供給して加熱硬化さ
せ、フリップチップ実装をする。Next, as shown in FIG. 4, LE with gold bumps is provided so that the bumps straddle the slits 12a at predetermined intervals along the slits 12a of the preheated metal substrate 12.
The D element 6 is mounted while applying ultrasonic vibration and solder-bonded, and further, the underfill resin 7 is supplied and heat-cured to perform flip-chip mounting.
【００２４】一方、図５に示すように、貫通穴４ｄが所
定の配列になるように、射出成形又はプレス成形などに
より形成した集合基板状態の成形樹脂である樹脂基板１
４を用意する。樹脂基板１４の面形状はメタル基板１２
と同じである。次に、樹脂基板１４に、板厚を貫通する
スリット１４ｂを、１方向のみのダイシング加工により
形成する。スリット１４ｂは完成ＬＥＤ１０の外周にあ
たる部分である。次に、樹脂基板１４全体に光沢銀メッ
キ処理をする。On the other hand, as shown in FIG. 5, a resin substrate 1 which is a molding resin in a collective substrate state formed by injection molding or press molding so that the through holes 4d are arranged in a predetermined arrangement.
Prepare 4. The surface shape of the resin substrate 14 is the metal substrate 12
Is the same as. Next, a slit 14b penetrating the plate thickness is formed in the resin substrate 14 by dicing processing in only one direction. The slit 14b is a portion corresponding to the outer circumference of the completed LED 10. Next, the entire resin substrate 14 is subjected to bright silver plating.
【００２５】次に、図６に示すように、ＬＥＤ素子６を
実装済みのメタル基板１２上に、集合状態の接着シート
１５を挟んで樹脂基板１４を加圧・加熱して接合し、パ
ッケージ基板１１を形成する。接着シート１５には、予
め所定の配列で、下部開口４ｂに合致する穴１５ａが形
成されている。Next, as shown in FIG. 6, the resin substrate 14 is pressed and heated to be bonded onto the metal substrate 12 on which the LED elements 6 are mounted, with the adhesive sheet 15 in the assembled state interposed therebetween, and the package substrate 11 is formed. The adhesive sheet 15 has holes 15a formed in advance in a predetermined arrangement so as to match the lower openings 4b.
【００２６】次に、図７に示すように、パッケージ基板
１１と同じ面形状を持つ集合状態のカバー板１８を用意
して、図８に示すように、カバー基板１８をパッケージ
基板１１上に集合状態の接着シート１９を介して接合す
る。接着シート１９には、予め所定の配列で、上部開口
４ａに合致する穴１９ａが形成されている。Next, as shown in FIG. 7, a cover plate 18 having the same surface shape as the package substrate 11 is prepared, and the cover substrates 18 are assembled on the package substrate 11 as shown in FIG. Bonding is performed via the adhesive sheet 19 in the state. The adhesive sheet 19 has holes 19a formed in advance in a predetermined arrangement so as to match the upper openings 4a.
【００２７】最後に、図９に示すように、２方向のダイ
シングラインに沿って、ＬＥＤ１０を単個に分離して、
図２に示す表面実装型ＬＥＤ１０を得る。なお、以上の
説明に使用した各図面において、ＬＥＤの取り個数を９
個としてあるが、取り個数、集合基板の大きさはこれに
限定されず、適宜選択できることは勿論である。また。
樹脂基板１４は、一旦部品として完成させてからメタル
基板１４上に接合しているが、これをメタル基板上に、
直接樹脂モールドすることによって形成してもよい。Finally, as shown in FIG. 9, the LEDs 10 are separated into single pieces along the dicing lines in two directions,
The surface-mounted LED 10 shown in FIG. 2 is obtained. In each drawing used in the above description, the number of LEDs taken is 9
However, the number of pieces to be taken and the size of the collective substrate are not limited to this, and it goes without saying that they can be appropriately selected. Also.
The resin substrate 14 is once completed as a component and then joined onto the metal substrate 14.
You may form by resin-molding directly.
【００２８】次に、本実施の形態であるＬＥＤ１０の効
果について説明する。ＬＥＤ素子３の接合をＦＣ実装に
よって行ったので、耐衝撃性に優れている。吸湿性があ
り、熱膨張の大きな封止樹脂を用いないで、線膨張係数
がパッケージ材料と近似したカバー板８を用いて封止し
た場合には、耐湿性、耐熱性に優れている。凹部４ｄ内
は空であるから、屈折率の影響を受けず、光の反射効率
が向上する。パッケージ１が熱伝導性の高いメタルコア
材料で構成されているので、従来のＬＥＤと比べて遙か
に放熱性に優れており、大電流が必要で、発熱量の大き
いＬＥＤには特に有効な構成である。また、射出成形又
はプレス成形といった方法で製造できるので、特殊な技
術や設備を必要としない。更に、多数個取りのできる集
合基板方式を用いて、集合状態で同時多数個の製造が可
能になるので、生産性が高く、高品質な製品とすること
ができ、製造コストの削減ができる。Next, the effect of the LED 10 of this embodiment will be described. Since the LED element 3 is joined by FC mounting, it has excellent impact resistance. When sealing is performed using the cover plate 8 having a hygroscopic property and a large thermal expansion and having a linear expansion coefficient similar to that of the package material, the moisture resistance and heat resistance are excellent. Since the inside of the recess 4d is empty, it is not affected by the refractive index and the light reflection efficiency is improved. Since the package 1 is made of a metal core material having high thermal conductivity, it has much better heat dissipation than conventional LEDs, requires a large current, and is particularly effective for LEDs that generate a large amount of heat. Is. Moreover, since it can be manufactured by a method such as injection molding or press molding, no special technique or equipment is required. Furthermore, since a large number of substrates can be manufactured at the same time by using a collective substrate system capable of collecting a large number of products, a product having high productivity and high quality can be manufactured, and the manufacturing cost can be reduced.
【００２９】なお、本発明は、以上説明した実施の形態
に限定されるものではなく、例えば、平板状のカバー板
５の代わりに、透明樹脂又は透明ガラスで凸レンズ状に
形成したカバー板を用いてもよい。カバー板には、他
に、凹レンズ、フレネルレンズ、セルフォックレンズ又
はホログラムレンズのいずれか一つが形成されていても
よい。これにより、発射光を絞れるから高輝度のＬＥＤ
を得られる。また、光反射面となる凹部４ｄの側面を円
錐形状、略球面形状、若しくは略放物面形状に形成して
もよい。これらの場合、出射光の直行性がより向上す
る。The present invention is not limited to the embodiment described above, and for example, instead of the flat cover plate 5, a cover plate formed of transparent resin or transparent glass in the shape of a convex lens is used. May be. Besides, any one of a concave lens, a Fresnel lens, a Selfoc lens, and a hologram lens may be formed on the cover plate. As a result, the emitted light can be narrowed down so that the high-intensity LED
Can be obtained. Further, the side surface of the concave portion 4d, which becomes the light reflecting surface, may be formed in a conical shape, a substantially spherical shape, or a substantially parabolic shape. In these cases, the orthogonality of the emitted light is further improved.
【００３０】[0030]
【発明の効果】以上説明したように、本発明によれば、
内面には発光素子を接続する電極を有し、外面には該電
極と導通する端子電極を有するパッケージ上に、発光素
子を実装した表面実装型発光ダイオードであって、前記
パッケージは、メタルコア材料より成ると共に、中央が
スリットにより縦に２分されて、該スリットに絶縁部材
が充填されている平板状メタル基板の上面に、中央に貫
通穴を有する平板状成形樹脂を接合して形成されてお
り、前記メタル基板上面に前記発光素子が実装され、前
記パッケージの上面にはカバー板を接合することにより
前記発光素子を封止したので、放熱性、信頼性、耐熱性
に優れたＬＥＤパッケージを実現することができた。As described above, according to the present invention,
A surface-mounted light-emitting diode having a light-emitting element mounted on a package having an electrode for connecting a light-emitting element on an inner surface and a terminal electrode electrically connected to the electrode on an outer surface, wherein the package is made of a metal core material. In addition, the center is vertically divided into two by a slit, and a flat plate-shaped molding resin having a through hole in the center is joined to the upper surface of the flat plate-shaped metal substrate in which the slit is filled with an insulating member. Since the light emitting element is mounted on the upper surface of the metal substrate and the light emitting element is sealed by joining a cover plate to the upper surface of the package, an LED package excellent in heat dissipation, reliability, and heat resistance is realized. We were able to.
【００３１】また、貫通穴の内面形状を円錐、略球面、
略放物面等にして、内面の広さや深さを可変にすること
で、光の指向性を自由に制御することができた。Further, the shape of the inner surface of the through hole is conical, substantially spherical,
It was possible to freely control the directivity of light by making the width and depth of the inner surface variable, such as a parabolic surface.
【００３２】また、集合基板方式によって、同時多数個
の製造が可能になるので、生産効率の高い製造プロセス
を実現することができた。Further, since the collective substrate method enables simultaneous production of a large number of substrates, it is possible to realize a production process with high production efficiency.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の実施の形態である表面実装型ＬＥＤの
縦断面図である。FIG. 1 is a vertical cross-sectional view of a surface-mounted LED that is an embodiment of the present invention.
【図２】本発明の実施の形態である表面実装型ＬＥＤの
斜視図である。FIG. 2 is a perspective view of a surface-mounted LED that is an embodiment of the present invention.
【図３】本発明の実施の形態である表面実装型ＬＥＤの
製造方法を示す斜視図である。FIG. 3 is a perspective view showing a method of manufacturing a surface-mounted LED that is an embodiment of the present invention.
【図４】本発明の実施の形態である表面実装型ＬＥＤの
製造方法を示す斜視図である。FIG. 4 is a perspective view showing a method for manufacturing a surface-mounted LED that is an embodiment of the present invention.
【図５】本発明の実施の形態である表面実装型ＬＥＤの
製造方法を示す斜視図である。FIG. 5 is a perspective view showing a method of manufacturing a surface-mounted LED that is an embodiment of the present invention.
【図６】本発明の実施の形態である表面実装型ＬＥＤの
製造方法を示す斜視図である。FIG. 6 is a perspective view showing a method for manufacturing a surface-mounted LED that is an embodiment of the present invention.
【図７】本発明の実施の形態である表面実装型ＬＥＤの
製造方法を示す斜視図である。FIG. 7 is a perspective view showing a method for manufacturing a surface-mounted LED that is an embodiment of the present invention.
【図８】本発明の実施の形態である表面実装型ＬＥＤの
製造方法を示す斜視図である。FIG. 8 is a perspective view showing a method of manufacturing a surface-mounted LED that is an embodiment of the present invention.
【図９】本発明の実施の形態である表面実装型ＬＥＤの
製造方法を示す斜視図である。FIG. 9 is a perspective view showing a method of manufacturing a surface-mounted LED that is an embodiment of the present invention.
【図１０】従来の表面実装型ＬＥＤを示す縦断面図であ
る。FIG. 10 is a vertical sectional view showing a conventional surface mount LED.
１ パッケージ
１ａ、２ａ 上面
２、１２ メタル基板
２ｂ 下面
２ｃ、１２ａ、１２ｂ、１４ｂ、１５ｂ、１８ｂ、１９
ｂ スリット
３ 絶縁部材
４、１４ 樹脂基板
４ｃ 側面
４ｄ 凹部
５、９、１５、１９ 接着シート
６ ＬＥＤ素子
７ アンダーフィル樹脂
８、１８ カバー板
１０ 表面実装型発光ダイオード
１１ パッケージ基板1 Package 1a, 2a Upper surface 2, 12 Metal substrate 2b Lower surface 2c, 12a, 12b, 14b, 15b, 18b, 19
b Slit 3 Insulating member 4 and 14 Resin substrate 4c Side surface 4d Recessed portion 5, 9, 15 and 19 Adhesive sheet 6 LED element 7 Underfill resin 8 and 18 Cover plate 10 Surface mount type light emitting diode 11 Package substrate
フロントページの続き (72)発明者 中村 忍 山梨県南都留郡河口湖町船津6663番地の２ 河口湖精密株式会社内 Ｆターム(参考） 5F041 DA04 DA09 DA19 DA33 DA35 DA74 DA76 DA78 DA92 DB03 DC03 DC23 EE23 Continued front page (72) Inventor Shinobu Nakamura 2 6663 Funatsu, Kawaguchiko Town, Minamitsuru District, Yamanashi Prefecture Kawaguchiko Precision Co., Ltd. F term (reference) 5F041 DA04 DA09 DA19 DA33 DA35 DA35 DA74 DA76 DA78 DA92 DB03 DC03 DC23 EE23
Claims (9)
し、外面には該電極と導通する端子電極を有するパッケ
ージ上に、発光素子を実装した表面実装型発光ダイオー
ドにおいて、前記パッケージは、メタルコア材料より成
ると共に、中央がスリットにより縦に２分されて、該ス
リットに絶縁部材が充填されている平板状メタル基板の
上面に、中央に貫通穴を有する平板状成形樹脂を接合し
て形成されており、前記メタル基板上面に前記発光素子
が実装され、前記パッケージの上面にはカバー板を接合
することにより前記発光素子を封止して、光の媒質が空
気であることを特徴とする表面実装型発光ダイオード。1. A surface-mounted light-emitting diode in which a light emitting element is mounted on a package having an electrode for connecting a light emitting element on an inner surface and a terminal electrode electrically connected to the electrode on an outer surface, wherein the package comprises: Formed by joining a flat plate-shaped molding resin having a through hole in the center to the upper surface of a flat plate-shaped metal substrate which is made of a metal core material and whose center is vertically divided into two parts and the slit is filled with an insulating member. The light emitting device is mounted on the upper surface of the metal substrate, and the light emitting device is sealed by bonding a cover plate to the upper surface of the package, and the medium of light is air. Surface mount light emitting diode.
装されたフリップチップであり、該フリップチップと前
記パッケージの前記メタル基板との隙間にアンダーフィ
ル樹脂を充填したことを特徴とする請求項１記載の表面
実装型発光ダイオード。2. The light emitting element is a flip chip mounted over the slit, and an underfill resin is filled in a gap between the flip chip and the metal substrate of the package. The surface-mounted light-emitting diode described.
発光素子ボンディング部、並びに下面の外部接続端子部
には、金メッキ又は銀メッキの表面処理が施されている
ことを特徴とする請求項又は請求項２記載の表面実装型
発光ダイオード。3. The surface treatment of gold plating or silver plating is applied to at least the light emitting element bonding portion on the upper surface of the metal substrate and the external connection terminal portion on the lower surface of the metal substrate. 2. The surface mount light emitting diode described in 2.
略球面又は略放物面のいずれか一つの面の一部であるこ
とを特徴とする請求項１乃至請求項３のいずれかに記載
の表面実装型発光ダイオード。4. The inner surface of the through hole of the molding resin is a conical surface,
The surface mount light emitting diode according to claim 1, wherein the surface mount light emitting diode is a part of one of a substantially spherical surface and a substantially parabolic surface.
れていることを特徴とする請求項１乃至請求項４のいず
れかに記載の表面実装型発光ダイオード。5. The surface mount light emitting diode according to claim 1, wherein the inner surface of the through hole is covered with a reflective film.
脂で形成されていることを特徴とする請求項１乃至請求
項５のいずれかに記載の表面実装型発光ダイオード。6. The surface mount light emitting diode according to claim 1, wherein the cover plate is formed of transparent glass or transparent resin.
形成されていることを特徴とする請求項６記載の表面実
装型発光ダイオード。7. The surface mount light emitting diode according to claim 6, wherein the cover plate is formed in a sheet shape or a flat plate shape.
れていることを特徴とする請求項６記載の表面実装型発
光ダイオード。8. The surface mount light emitting diode according to claim 6, wherein the cover plate has a lens shape.
の表面実装型ダイオードを製造する方法において、前記
発光ダイオードを多数個取りすることができる集合状態
のメタル基板上に発光素子を実装する工程と、前記メタ
ル基板上に集合状態の成形樹脂を接合してパッケージ基
板を形成する工程と、前記発光素子実装後の前記パッケ
ージ基板に、集合状態のカバー板を接合して集合状態の
前記発光ダイオードを形成する工程と、集合状態の前記
発光ダイオードをダイシングして、単個の前記発光ダイ
オードに分割する工程を有することを特徴とする表面実
装型発光ダイオードの製造方法。9. The method of manufacturing a surface mount diode according to claim 1, wherein the light emitting element is mounted on a metal substrate in an assembled state in which a large number of the light emitting diodes can be taken. And a step of joining a molding resin in a collective state onto the metal substrate to form a package substrate, and a step of joining a cover plate in a collective state to the package substrate after mounting the light emitting device, A method for manufacturing a surface-mounted light emitting diode, comprising: a step of forming a light emitting diode; and a step of dicing the light emitting diode in an assembled state to divide the light emitting diode into a single light emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002010876A JP2003218398A (en) | 2002-01-18 | 2002-01-18 | Surface mount type light emitting diode and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002010876A JP2003218398A (en) | 2002-01-18 | 2002-01-18 | Surface mount type light emitting diode and its manufacturing method |
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| Publication Number | Publication Date |
|---|---|
| JP2003218398A true JP2003218398A (en) | 2003-07-31 |
Family
ID=27648493
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
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| Country | Link |
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