WO2010058987A2 - Film multicouche et son procédé de production - Google Patents

Film multicouche et son procédé de production Download PDF

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Publication number
WO2010058987A2
WO2010058987A2 PCT/KR2009/006841 KR2009006841W WO2010058987A2 WO 2010058987 A2 WO2010058987 A2 WO 2010058987A2 KR 2009006841 W KR2009006841 W KR 2009006841W WO 2010058987 A2 WO2010058987 A2 WO 2010058987A2
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WIPO (PCT)
Prior art keywords
formula
multilayer film
buffer layer
group
curing
Prior art date
Application number
PCT/KR2009/006841
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English (en)
Korean (ko)
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WO2010058987A3 (fr
Inventor
마승락
김동렬
김기철
류상욱
이호준
황장연
Original Assignee
주식회사 엘지화학
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Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to CN200980146323.9A priority Critical patent/CN102216073B/zh
Priority to EP20090827752 priority patent/EP2357079B1/fr
Priority to US13/130,008 priority patent/US20110287221A1/en
Priority to JP2011537362A priority patent/JP5334069B2/ja
Publication of WO2010058987A2 publication Critical patent/WO2010058987A2/fr
Publication of WO2010058987A3 publication Critical patent/WO2010058987A3/fr

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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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Definitions

  • the present invention relates to a multilayer film and a method for manufacturing the same, and more particularly, to a film having a multilayer structure with improved heat resistance and high temperature flatness and a method for manufacturing the same.
  • Glass plates used in various electronic devices including organic and inorganic light emitters, display devices, and photovoltaic power generators have satisfactory characteristics in light transmittance, thermal expansion coefficient, chemical resistance, etc., but they are heavy, fragile and hard, and require careful handling. It is a limiting factor in product design.
  • plastic films which are typical materials having light weight, excellent impact resistance, and flexible properties.
  • plastics which are typical materials having light weight, excellent impact resistance, and flexible properties.
  • plastic film has a number of disadvantages compared to the glass plate, it is necessary to supplement the physical properties.
  • the conventional plastic film has a problem that it is difficult to perform a roll process (curl), adhesion, elongation occurs when processing at a glass transition temperature (Tg) or more.
  • the process can be easily carried out at the glass transition temperature (Tg) or less due to the improved heat resistance and the high temperature flatness, and the curl, adhesion, and elongation at or above the glass transition temperature (Tg) are increased. It is possible to suppress the occurrence or to proceed the process easily without curling, sticking or stretching.
  • An object of the present invention is to provide a film having a multilayer structure and a method of manufacturing the same.
  • the polymer substrate Provided is a multilayer film including a buffer layer on the upper and lower surfaces of the polymer substrate, the buffer layer comprising a cured product by UV curing and thermosetting of the buffer composition capable of UV curing and thermosetting.
  • the polymer substrate may have a single layer structure, or may have a structure in which two or more polymer layers are bonded.
  • the present invention (a) coating the UV curable and thermosetting buffer composition on one surface of the polymer substrate to form a buffer layer, (b) UV curing the buffer layer formed in the step (a), (c ) Coating a buffer composition capable of UV curing and thermosetting on the other surface of the polymer substrate having the buffer layer on one surface to form a buffer layer, (d) UV curing the buffer layer formed in step (c), and ( d) it provides a method for producing a multilayer film comprising the step of thermally curing the UV cured buffer layer provided on both sides of the polymer substrate at the same time.
  • the present invention (a) coating a UV curable and thermosetting buffer composition on one surface of the polymer substrate to form a buffer layer; (b) UV curing the buffer layer; (c) thermosetting the UV-cured buffer layer to form a multilayer film having a structure in which a polymer substrate and a buffer layer are laminated; (d) repeating the above steps (a) to (c) to produce one more multilayer film having the same structure as in step (c); And (e) bonding the multilayer films prepared in the steps (c) and (d) to each other such that the polymer substrate surfaces are adjacent to each other to form a symmetrical multilayer film. do.
  • the present invention provides an electronic device comprising the multilayer film.
  • the present invention provides a buffer composition comprising a sol-like composition of the hydrolyzate of at least one of an organosilane and a metal alkoxide and a curable epoxy resin as a buffer composition for forming the buffer layer.
  • the content of the sol composition of the hydrolyzate of at least one of the organosilane and the metal alkoxide is 5 to 95 parts by weight
  • the content of the curable epoxy resin is preferably 5 to 95% by weight.
  • the process can be easily performed at the glass transition temperature (Tg) or less, and the curl, adhesion, and stretching phenomenon at the glass transition temperature (Tg) or more can be achieved. It is possible to suppress the occurrence or to proceed the process easily without curling, sticking, or stretching.
  • 1 and 2 each show a cross section of a multilayer film according to one embodiment of the invention.
  • Figure 3 is a graph showing a comparison of the coefficient of linear expansion according to the temperature of the multilayer film prepared according to the Examples and Comparative Examples.
  • Example 4 is a photograph showing a multilayer film having excellent flatness according to Example 1 of the present invention.
  • FIG. 5 is a photograph showing a multilayer film in which warpage occurs according to Comparative Example 1 of the present invention.
  • the present invention a polymer substrate; Provided is a multilayer film including a buffer layer on the upper and lower surfaces of the polymer substrate, the buffer layer including a cured product by UV curing and thermosetting of a buffer composition capable of UV curing and thermosetting.
  • the buffer layer 110, the polymer substrate 100, and the buffer layer 110 may have a stacked structure.
  • the polymer substrate may have a single layer structure or a structure in which two or more polymer layers are bonded to each other.
  • 2 illustrates a structure in which the polymer substrate includes the polymer substrate 100, the bonding layer 111, and the polymer substrate 100, but the scope of the present invention is not limited thereto.
  • the polymer substrate is preferably in the form of a film or sheet of 10 to 2,000 ⁇ m thickness.
  • the polymer substrate may be made of a single layer.
  • the polymer substrate may have a structure in which two or more polymer layers are bonded.
  • the final multilayer film produced has a symmetrical structure up and down, thereby minimizing warpage of the film.
  • the polymer thickness is a structure in which two or more polymer layers are bonded, they may be manufactured using a conventional acrylic adhesive or a thermal bonding method.
  • the content is not particularly limited, but the thickness of the bonding layer containing the adhesive is preferably 0.1 to 10 ⁇ m.
  • the polymer substrate may be prepared through a solution casting method or a film extrusion process, and may be briefly annealed for a few seconds to several minutes in the vicinity of the glass transition temperature in order to minimize deformation due to temperature after the preparation. After annealing, primer coating may be applied to the surface of the polymer substrate in order to improve the coating property and adhesion, or surface treatment may be performed by plasma treatment using corona, oxygen or carbon dioxide, ultraviolet-ozone treatment, ion beam treatment with a reaction gas, or the like. have.
  • the polymer substrate may be selected from one or more selected from the group consisting of a single polymer, two or more polymer blends, and a polymer composite material containing an organic or inorganic additive.
  • the polymer when the multilayer film of the present invention is used as a substrate of the liquid crystal display device, since the manufacturing process for forming the thin film transistor and the transparent electrode is performed at a high temperature of 200 ° C or higher, high heat resistance that can withstand such high temperature It is preferable to use a polymer having.
  • the polymer having the above-mentioned properties include polynorbornene, aromatic florene polyester, polyethersulfone, bisphenol A polysulfone, polyimide and the like.
  • polymers such as polyethylene terephthalate, polyethylene naphthalene, polyarylate, polycarbonate, and cyclic olefin copolymer can be used. It may be.
  • the PET film when used as the polymer substrate, curvature, adhesion, and stretching of the PET film is suppressed at the glass transition temperature (Tg) or higher, or the curvature, adhesion,
  • Tg glass transition temperature
  • the process can be easily carried out without stretching.
  • the process is possible at a high temperature of 100 degrees or more, and a multilayer film having excellent surface hardness is possible.
  • a nanomaterial is dispersed in a polymer, and a polymer composite material containing an organic or inorganic additive may be used.
  • the polymer composite material may include a polymer-clay nanocomposite in which clay nanomaterials are dispersed in a polymer matrix.
  • the polymer-clay nanocomposite has a smaller amount of clay than a conventional composite such as glass fiber due to the small particle size ( ⁇ 1 ⁇ m) and the large aspect ratio of the clay.
  • physical properties such as dimensional stability can be improved. That is, in order to improve the above properties, it is important to peel off the clay layer having a layered structure and disperse it well in the polymer matrix, and to satisfy this, the polymer-clay nanocomposite is satisfied.
  • Polymers that can be used in the polymer-clay nanocomposite include polystyrene, polymethacrylate, polyethylene terephthalate, polyethylene naphthalene, polyarylate, polycarbonate, cyclic olefin copolymer, polynorbornene, aromatic florene polyester, Polyether sulfone, polyimide, epoxy resin, polyfunctional acrylate, and the like, and as the clay, laponite, montmorillonite, megadite and the like can be used.
  • the buffer layer serves to alleviate the difference in the large coefficient of linear expansion with the polymer substrate, and to improve the adhesion with the polymer substrate.
  • the buffer layer may planarize the surface of the polymer substrate.
  • the buffer layer comprises a UV cured and heat-cured cured product, the content of the uncured epoxy group after curing is not less than 10% by weight and less than 100% by weight, preferably 30% by weight to 95% by weight, more Preferably it is 50 to 90 weight%.
  • the buffer layer may include a cured product by UV curing and thermosetting of a mixture of at least one hydrolyzate of the organosilane and metal alkoxide and a curable epoxy resin.
  • the hydrolyzate of at least one of the organosilane and the metal alkoxide is 5 to 95 parts by weight
  • the curable epoxy resin is 5 to 95 parts by weight based on 100 parts by weight of the cured product.
  • the buffer layer may be formed by coating a UV curable and thermosetting buffer composition on a polymer substrate, followed by UV curing and thermosetting. Specifically, at least one of the organosilane and the metal alkoxide is partially hydrolyzed to prepare a sol composition, and then mixed with a curable epoxy resin and coated on a polymer substrate, followed by UV curing and thermosetting.
  • the organosilane is not particularly limited as long as it includes an organosilane group, and at least one member selected from the group consisting of compounds represented by Formulas 1 to 3 may be used.
  • the metal alkoxide is not particularly limited as long as it is a metal alkoxide, and at least one member selected from the group consisting of compounds represented by the following general formula (4) may be used.
  • the curable epoxy resin is not particularly limited as long as it includes an epoxy group, and may include at least one selected from alicyclic epoxy resins represented by the following Formulas 5 to 10 and triglycidyl isocyanurate represented by the following Formula 11, and the like. .
  • X may be the same or different from each other, hydrogen, halogen, alkoxy, acyloxy, alkylcarbonyl, alkoxycarbonyl, or -N (R 2 ) 2 having 1 to 12 carbon atoms,
  • R 1 may be the same or different from each other, alkyl having 1 to 12 carbon atoms, alkenyl having 2 to 12 carbon atoms, alkynyl, aryl having 6 to 20 carbon atoms, arylalkyl, alkylaryl, arylalkenyl, alkenylaryl, aryl Alkynyl, alkynylaryl, halogen, amide, aldehyde, ketone, alkylcarbonyl, carboxy, mercapto, cyano, hydroxy, alkoxy having 1 to 12 carbon atoms, alkoxycarbonyl having 1 to 12 carbon atoms, sulfonic acid, phosphoric acid , Acryloxy, methacryloxy, epoxy, or a vinyl group,
  • R 2 is hydrogen or alkyl having 1 to 12 carbon atoms
  • n 1 to 3
  • M represents a metal selected from the group consisting of aluminum, zirconium and titanium
  • R 3 may be the same as or different from each other, a halogen, an alkyl, alkoxy, acyloxy, or hydroxy group having 1 to 12 carbon atoms,
  • Z is an integer of 3 or 4.
  • R 20 in formula (8) represents an alkyl group or trimethylolpropane residue and q is 1-20.
  • R 21 and R 22 may be the same or different and each represents H or CH 3 and r is 0 to 2.
  • the buffer composition for forming the buffer layer may include an organosilane and a metal alkoxide alone or in the form of a mixture.
  • the content of the organosilane and the metal alkoxide is preferably 5 to 95 parts by weight based on 100 parts by weight of the buffer composition. Do.
  • the curable epoxy resin may be used in an amount of 5 to 95 parts by weight based on 100 parts by weight of the buffer composition, and may further include 1 to 90 parts by weight of a curing agent based on 100 parts by weight of the buffer composition.
  • the curable epoxy resin may further include 0.1 to 20 parts by weight of catalyst based on 100 parts by weight of the buffer composition.
  • the preparing of the curable epoxy resin may include mixing 1 to 90 parts by weight of the curing agent with respect to 100 parts by weight of the buffer composition and 0.1 to 20 parts by weight of the catalyst based on 100 parts by weight of the buffer composition; And mixing 1 to 95 parts by weight of the epoxy resin with respect to 100 parts by weight of the curing agent and the buffer composition to which the catalyst is added. More preferably, 91 parts by weight of the epoxy curing agent and 1 part by weight of the catalyst are mixed, heated and stirred for 30 minutes, and then 50 parts by weight of the solid epoxy is stirred for 10 minutes to melt, and then the catalyst is added to the curing agent and the melted epoxy. By mixing and stirring, a transparent curable epoxy resin can be prepared.
  • the epoxy resin may be a compound selected from an alicyclic epoxy resin represented by the formula (5) to 10 and the triglycidyl isocyanurate represented by the formula (11), or a combination of two or more.
  • the combination may be used in combination with other epoxy resins for refractive index adjustment so that the refractive index of the resin combination and, if necessary, the glass filler are equal.
  • curing agent is preferable,
  • Anhydride, glutaric anhydride, methylhexahydro phthalic anhydride, methyltetrahydrophthalic anhydride, hydrogenated methylnadic anhydride, hydrogenated hydric anhydride, etc. can be selected and used 1 or more types.
  • methylhexahydrophthalic anhydride and hydrogenated methylnadic anhydride are preferred from the viewpoint of transparency.
  • the catalyst contains acetic acid, benzoic acid, salicylic acid, para-toluenesulfonic acid, boron trifluoride-amine complex, boron trifluoride ammonium salt, aromatic diazonium salt, aromatic sulfonium salt, aromatic iodonium salt and aluminum complex as curing accelerators.
  • Tertiary amines such as 1,8-diazabicyclo [5.4.0] undecene-7 and triethylenediamine
  • Imidazoles such as 2-ethyl-4-methylimidazole
  • Phosphorus compounds such as triphenylphosphine and tetraphenylphosphinium; Tetraphenylborate; Quaternary ammonium salts; Organometallic salts;
  • the buffer composition may be prepared from the compound exemplified above, and optionally, a filler and a solvent may be additionally added to the composition.
  • the filler is metal, glass powder, diamond powder, silicon oxide, clay, calcium phosphate, magnesium phosphate, barium sulfate, aluminum fluoride, calcium silicate, magnesium silicate, barium silicate, barium carbonate, barium hydroxide, and aluminum silicate. It can select and use 1 or more types from the group which consists of.
  • the solvent is not particularly limited as long as it is a solvent compatible or soluble with epoxy, a curing agent, and a catalyst.
  • One or more solvents selected from butyl ketone, methanol, ethanol, propanol and isopropanol can be used.
  • the amount of the filler and the solvent to be added is not particularly limited as needed.
  • the buffer layer By forming the buffer layer using the above-described materials, it is possible to provide a multilayer film having a flat surface even at high temperatures while minimizing deformation during thermosetting.
  • UV curing of the buffer composition is not particularly limited as long as it can achieve a radical reaction with a UV light source, but it is preferable to use a mercury or metal halide lamp alone or in combination.
  • the surface hardness of the buffer layer may be increased by UV curing.
  • the buffer composition by UV curing on both surfaces of the polymer substrate to increase the surface hardness, it can be thermally cured to produce a multi-layered film.
  • the buffer layer serves to alleviate the difference in the coefficient of linear expansion with the polymer substrate and to improve the adhesion with the polymer substrate.
  • the buffer layer may planarize the surface of the polymer substrate.
  • Another embodiment of the present invention (a) coating a UV curable and thermosetting buffer composition on one surface of the polymer substrate to form a buffer layer, (b) UV curing the buffer layer formed in the step (a) Step, (c) coating the UV curable and thermosetting buffer composition on the other surface of the polymer substrate having the buffer layer on one surface to form a buffer layer, (d) UV curing the buffer layer formed in the step (c) It provides a method for producing a multi-layer film comprising the step, and (d) thermally curing the UV-cured buffer layer provided on both sides of the polymer substrate at the same time.
  • Another embodiment of the present invention comprises the steps of (a) coating a UV curable and thermosetting buffer composition on one surface of the polymer substrate to form a buffer layer; (b) UV curing the buffer layer; (c) thermosetting the UV-cured buffer layer to form a multilayer film having a structure in which a polymer substrate and a buffer layer are laminated; (d) repeating the above steps (a) to (c) to produce one more multilayer film having the same structure as in step (c); And (e) bonding the multilayer films prepared in the steps (c) and (d) to each other such that the polymer substrate surfaces are adjacent to each other to form a symmetrical multilayer film. do.
  • the coating method of the buffer layer is not particularly limited, but methods such as spin coating, roll coating, bar coating, dip coating, gravure coating, and spray coating may be used, but are not limited thereto.
  • the buffer layer formed as described above preferably has a thickness of 0.1 to 50 ⁇ m.
  • the thickness is thinner than 0.1 ⁇ m, it is susceptible to obstacles due to pinhole defects and suffers from limitations in which leakage current appears.
  • the thickness exceeds 50 ⁇ m, distortion of the film during curing may occur. This is formed and there is a problem of poor flatness.
  • the flatness of roughness Ra of the surface of the buffer layer is very important. If the buffer layer is not flat, defects may occur when another layer is formed thereon.
  • the surface flatness of the buffer layer is preferably about 1 nm, and more preferably within 1 nm.
  • the flatness may have a Ra value of 0.1 to 1.2 nm.
  • UV curing is not particularly limited as long as it can achieve a radical reaction by a UV light source, but it is preferable to use a mercury or metal halide lamp alone or in combination.
  • UV curing for example, may be performed for 1 second to several hours, such as 1 minute or less, with an energy of 20 mJ / cm 2 to 3000 mJ / cm 2 .
  • thermosetting may be carried out, for example, at a temperature of 100-200 degrees for 1 minute to several hours, such as 1 hour or less, preferably 10 to 20 minutes.
  • the multilayer film according to the present invention may have a small value up to 6.5 ppm / KR by minimizing deformation during thermal curing by instantaneously improving surface hardness by UV curing.
  • the coefficient of linear expansion of the multilayer film according to the present invention may be 5 to 30ppm / KR or less, preferably 6 to 20ppm / KR or less.
  • the multilayer film according to the present invention has a pencil hardness of 2 or more, preferably may have a pencil hardness of 2H or more and 8H or less. Therefore, the multilayer film of the present invention can replace the fragile and heavy glass substrate that has been mainly used in the conventional display device, etc., and may also be used as a material requiring excellent gas barrier property.
  • an electronic device such as an image display device including the multilayer film.
  • the multilayer film according to the present invention can be used as a substrate material of an image display device or a cover material of a display element.
  • the electronic device may be manufactured by a conventional method known in the art using the multilayer film as a substrate.
  • the multilayer film according to the present invention is a film having a flat surface even at high temperature by minimizing deformation during thermal curing by instantaneous improvement of surface hardness by UV curing, and it is possible to replace the fragile and heavy glass substrates that have been mainly used in display devices. In addition, it can be used as a material that requires excellent heat resistance and high temperature flatness.
  • TEOS tetraethoxysilane
  • GTMS glycidoxypropyltrimethoxysilane
  • the solvent was removed for 5 minutes in a 90 ° C convection oven and UV cured, then coated on the other side of the uncoated PET and 5 minutes in a 90 ° C convection oven.
  • the solvent was removed, UV cured, and thermally cured in a convection oven at 180 ° C. for 1 hour to obtain a PET film coated on both sides with a buffer composition.
  • the thickness of the buffer layer measured by alpha stepper after the curing reaction was 10 ⁇ m.
  • the surface roughness of the buffer layer measured in the room temperature tapping mode of AFM is 0.4 nm or less in a measurement area of 10 ⁇ m ⁇ 10 ⁇ m.
  • Pencil hardness measured by the method of ASTM D3363 under a load of 200 g.
  • the substrate according to Example 1 had no curvature when placed on a flat bottom as shown in FIG. 4, ie, excellent in heat resistance and high temperature flatness, and as shown in Table 1, the plastic substrate produced had small linear expansion. It can be seen that the properties of modulus and dimensional stability are satisfied at the same time.
  • a buffer composition and a coating film were prepared in the same manner as in Example 1, except that 10 parts by weight of an anhydride (MH700G, New Japan Chemical) was added.
  • an anhydride MH700G, New Japan Chemical
  • the buffer composition and the coating film were prepared by the method.
  • a buffer composition and a coating film were prepared in the same manner as in Example 1, except that 30 parts by weight of colloidal silica (MIBK-ST) was further added.
  • MIBK-ST colloidal silica
  • a buffer composition and a coating film were prepared in the same manner as in Example 1.
  • TEOS tetraethoxysilane
  • GTMS glycidoxypropyltrimethoxysilane
  • the solvent was removed for 5 minutes in a 90 ° C convection oven, UV cured, and thermally cured in a 120 ° C convection oven for 1 hour to coat a buffer layer on one surface of the PET film.
  • the surface roughness of the buffer layer measured in the room temperature tapping mode of AFM is 0.4 nanometer or less at a measurement area of 50 microns x 50 microns.
  • the multilayer film was prepared once more in the same manner as above.
  • the adhesive composition the main component of which is an acrylate oligomer having a multifunctional group
  • the polymer substrate of the multilayer film prepared in the same manner as described above is laminated. And irradiated for 6 minutes with an ultraviolet irradiator (DYMAX 2000-EC) to induce a curing reaction of the adhesive composition to make a plastic substrate of a symmetrical structure.
  • an ultraviolet irradiator DYMAX 2000-EC
  • the substrate according to Example 6 had no bending when placed on a flat bottom.
  • UV curing alone does not completely cure, and thus the adhesion between the interfaces is lowered to produce a coated film having low physical properties such as pencil hardness.

Abstract

La présente invention concerne un film multicouche à matrice polymère, qui comprend: un substrat polymère et des couches tampons d'une substance durcie obtenue par polymérisation par les UV et par la chaleur d'une composition tampon polymérisable par les UV et par la chaleur, ces couches tampons étant disposées sur les surfaces supérieure et inférieure du substrat polymère. L'invention concerne en outre un procédé de production du film multicouche.
PCT/KR2009/006841 2008-11-19 2009-11-19 Film multicouche et son procédé de production WO2010058987A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200980146323.9A CN102216073B (zh) 2008-11-19 2009-11-19 多层膜及其制造方法
EP20090827752 EP2357079B1 (fr) 2008-11-19 2009-11-19 Film multicouche et son procédé de production
US13/130,008 US20110287221A1 (en) 2008-11-19 2009-11-19 Multilayer film and a production method for same
JP2011537362A JP5334069B2 (ja) 2008-11-19 2009-11-19 多層フィルム及びその製造方法

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KR20080115391 2008-11-19
KR10-2008-0115391 2008-11-19

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WO2010058987A2 true WO2010058987A2 (fr) 2010-05-27
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EP (1) EP2357079B1 (fr)
JP (1) JP5334069B2 (fr)
KR (1) KR101133062B1 (fr)
CN (1) CN102216073B (fr)
WO (1) WO2010058987A2 (fr)

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US20120308794A1 (en) * 2011-06-01 2012-12-06 Cheng-Chuan Lai Optical composite substrate
KR20150113916A (ko) * 2014-03-31 2015-10-08 주식회사 동진쎄미켐 기재의 휨현상 방지 코팅방법
WO2015152617A1 (fr) * 2014-03-31 2015-10-08 주식회사 동진쎄미켐 Procede de revêtement pour la prevention de phenomene de flexion de substrat

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WO2014027761A1 (fr) * 2012-08-17 2014-02-20 제일모직 주식회사 Substrat flexible pour élément d'affichage, son procédé de fabrication, et dispositif d'affichage l'utilisant
KR102650412B1 (ko) * 2022-03-21 2024-03-22 박현배 다회성 열압착용 실리콘 쿠션패드를 이용한 모니터링 시스템

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WO2010058987A3 (fr) 2010-08-26
CN102216073B (zh) 2015-07-15
KR20100056420A (ko) 2010-05-27
EP2357079A2 (fr) 2011-08-17
KR101133062B1 (ko) 2012-04-04
JP2012509212A (ja) 2012-04-19
CN102216073A (zh) 2011-10-12
EP2357079B1 (fr) 2014-07-16
JP5334069B2 (ja) 2013-11-06
EP2357079A4 (fr) 2012-06-20
US20110287221A1 (en) 2011-11-24

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