WO2009157373A1 - レーザアニール方法及び装置 - Google Patents
レーザアニール方法及び装置 Download PDFInfo
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- WO2009157373A1 WO2009157373A1 PCT/JP2009/061162 JP2009061162W WO2009157373A1 WO 2009157373 A1 WO2009157373 A1 WO 2009157373A1 JP 2009061162 W JP2009061162 W JP 2009061162W WO 2009157373 A1 WO2009157373 A1 WO 2009157373A1
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- mask
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- laser annealing
- axis direction
- linear beam
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- 238000005224 laser annealing Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims abstract description 12
- 230000003247 decreasing effect Effects 0.000 claims abstract description 4
- 230000001678 irradiating effect Effects 0.000 claims description 11
- 230000007423 decrease Effects 0.000 claims description 9
- 238000000137 annealing Methods 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 23
- 239000004065 semiconductor Substances 0.000 abstract description 14
- 239000010409 thin film Substances 0.000 abstract description 11
- 239000010408 film Substances 0.000 description 13
- 230000010355 oscillation Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02678—Beam shaping, e.g. using a mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
- C30B1/023—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing from solids with amorphous structure
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Definitions
- the present invention relates to a laser annealing method and apparatus for annealing a target object by irradiating the target object with laser light.
- a method of forming a semiconductor element such as a high-performance thin film transistor on an insulating substrate such as a glass substrate has been developed.
- thin-film polycrystalline silicon obtained by crystallizing amorphous silicon by heat treatment is used for this semiconductor element.
- an amorphous silicon film is generally formed on a substrate in advance and crystallized by irradiating with laser light. According to this method, since a crystallization phenomenon in the process of melting and solidifying a semiconductor thin film is used, a high-quality polycrystalline silicon film having a relatively large particle size can be obtained.
- a laser beam is shaped into a linear beam having a maximum beam length of 465 mm and a minor axis direction of 0.4 to 5 mm by an optical system.
- a linear beam having a maximum beam length of 200 mm and a minor axis direction of 40 to 50 ⁇ m can be obtained.
- the semiconductor film is crystallized by relatively moving the substrate and the laser beam so that the irradiation position of the linear beam partially overlaps the irradiation region in the beam minor axis direction.
- the overlap ratio is set to about 95%, and the same region is irradiated about 20 times.
- FIG. 1A and 1B are explanatory diagrams of a conventional laser annealing method.
- FIG. 1A shows a state in which the substrate 30 is irradiated with the laser beam 31 while being relatively moved in the beam minor axis direction.
- first row R1 is irradiated as shown in FIG. 1A.
- the laser light 31 is moved relatively in the long axis direction, and the second and subsequent rows are irradiated.
- FIG. 1B shows an example in which the entire surface of the substrate is processed by two rows of irradiation. At this time, a beam joint W is generated between adjacent rows (the first row R1 and the second row R2 in FIG. 1B).
- a joint W is generated by overlapping and irradiating the ends of linear beams in adjacent rows.
- the overlap becomes excessive and the crystal quality is different from other portions, so that the joint portion W can be visually observed.
- the overlap is insufficient at the beam end, and an amorphous portion remains, and the crystallinity is also different from other portions.
- the beam joint W is an area irradiated with both beams in adjacent rows (for example, the first row R1 and the second row R2), the crystallinity of the region is different from the other portions.
- the variation in crystallinity becomes large, and the second harmonic of the YAG laser has a smaller variation than the excimer laser, but the crystallinity also varies.
- the performance of the thin film transistor cannot be made uniform.
- a display device such as a liquid crystal display or an organic EL display
- the display quality is easily influenced by the uniformity of the performance of the thin film transistor. Therefore, in order to maintain the display quality, display is performed within an area limited by the beam length of the laser beam. Panels must be made. In the case of the green YAG laser, since the beam length is short, it is difficult to produce a large display exceeding 20 inches.
- Patent Documents 1 and 2 disclose techniques for preventing the non-uniformity of crystallinity of the beam joint W as described above.
- Patent Document 1 adjusts the width dimension and energy density of a laser beam when crystallizing a semiconductor thin film having a large area by superimposing the laser beam irradiation regions, so that the laser beam overlapped portion is not aligned.
- the crystallinity is made uniform at the overlapping portion.
- Patent Document 2 The method of Patent Document 2 is to uniform the crystallinity by setting so that the slope portions of the beam profile of the joint portion overlap each other in a region of 20% to 80% of the laser intensity.
- the present invention has been made in view of the above-described problems.
- a semiconductor thin film formed on a substrate such as glass is crystallized by laser irradiation, the crystallinity is obtained at the joint portion in the long axis direction of the laser beam. It is an object of the present invention to provide a laser annealing method and apparatus capable of forming a crystalline semiconductor thin film on the entire surface of a substrate having a good and high uniformity so that the joint portion cannot be visually confirmed without impairing the uniformity.
- the present invention irradiates a processing object by irradiating the processing object with a linear beam that is shaped into a linear shape while moving the laser beam relatively in the short axis direction of the linear beam.
- irradiation by relative movement of the linear beam in the minor axis direction is performed in two or more rows while being shifted in the beam major axis direction.
- a mask placed on the optical path of the laser beam is used to shield the portion corresponding to the end of the linear beam so that the amount of shielding increases or decreases periodically. It is characterized by operating.
- the shielding amount is periodically increased or decreased by swinging the mask.
- the mask is swung using a piezo element.
- the present invention also anneals the object to be processed by irradiating the object to be processed with a linear beam shaped linearly while moving the laser beam in the short axis direction of the linear beam.
- a laser annealing apparatus for performing processing and a mask that is disposed on an optical path of a laser beam and shields a portion corresponding to an end of a linear beam, and operates the mask so that the shielding amount by the mask periodically increases and decreases And a mask driving device.
- the mask driving device periodically increases or decreases the shielding amount by swinging the mask.
- the mask driving device is a piezo element.
- the portion corresponding to the end of the linear beam is shielded by the mask, and the mask is operated so that the shielding amount periodically increases or decreases.
- the overlap rate at the end of the beam is lower than that at the non-shielded portion.
- the overlap rate can be easily controlled by swinging the mask.
- the piezo element can generate high-frequency vibrations by controlling the applied voltage, so that high-speed rocking of the mask can be easily realized and overlapped. The rate can be easily controlled.
- FIG. 2 is a diagram showing an overall configuration of the laser annealing apparatus 1 according to the embodiment of the present invention.
- the laser annealing apparatus 1 has, as its basic components, a laser light source 3 that emits laser light 2, a beam shaping optical system 4 that shapes the laser light 2 from the laser light source 3, and the laser light 2 that is to be processed by the object 7.
- a reflecting mirror 5 that reflects in the direction
- a condenser lens 6 that condenses the laser beam 2 from the reflecting mirror 5 on the surface of the object 7 to be processed
- a moving stage 9 that moves the object 7 to be moved are provided.
- the laser light source 3 for example, an excimer laser, a solid-state laser, or a semiconductor laser can be applied.
- the laser beam 2 may be either pulse oscillation or continuous oscillation.
- the beam shaping optical system 4 shapes the laser light 2 so as to be a linear beam on the surface of the object 7 to be processed, and can include a beam expander, a homogenizer, and the like as constituent elements.
- the object to be processed 7 includes a substrate 7a and an amorphous semiconductor film 7b formed thereon.
- the substrate 7a is a glass substrate or a semiconductor substrate.
- the amorphous semiconductor film 7b is, for example, an amorphous silicon film.
- the moving stage 9 is configured to be movable in the direction of arrow A in the figure. Therefore, by moving the object 7 to be processed in the minor axis direction (A direction) of the linear beam while irradiating the laser light 2, the irradiated portion of the laser light 1 is shortened with respect to the object 7. It can be moved relatively in the axial direction.
- the moving stage 9 is configured to be movable in the same direction as the long axis direction of the linear beam and in a direction perpendicular to the paper surface of FIG.
- the laser annealing apparatus 1 of the present invention further includes a mask 10 that is disposed on the optical path of the laser light 2 and shields a portion corresponding to the end of the linear beam, and the shielding amount by the mask 10 is periodically increased or decreased. And a mask driving device 12 for operating the mask 10.
- FIG. 3A is a diagram illustrating a configuration example of the mask 10 and the mask driving device 12, and in this figure, the horizontal direction is the beam major axis direction of the laser light 2.
- the mask 10 is disposed at a position directly above the substrate, and shields the laser beam 2 at this position.
- the mask 10 is disposed at both ends of the laser beam 2 in the long axis direction.
- FIG. 3B shows the energy distribution in the major axis direction of the beam end (only the left side in the figure).
- the gradient part by the diffracted light 2a is made in the position of the beam edge part in the energy distribution A.
- the mask 10 can be made of, for example, a metal plate, a glass plate with metal plating, or single crystal silicon.
- the mask driving device 12 may be configured to periodically increase or decrease the shielding amount by swinging the mask 10.
- the mask driving device 12 swings the mask 10 in the beam long axis direction. By swinging the mask 10, it is possible to easily control the overlap rate described later.
- the mask driving device 12 that swings the mask 10 can be constituted by a piezo element. Since the piezo element can generate high-frequency vibrations by controlling the applied voltage, high-speed oscillation of the mask 10 can be easily realized.
- the mask driving device 12 can also be configured by a motor and a mechanism that converts the rotational motion of the motor into a reciprocating motion.
- the operation mode of the mask 10 may be not only swing but also rotation.
- the same effect can be obtained even if the mask 10 is a rotating plate with a cut corresponding to the swinging width of the mask (metal or ceramic or glass coated with a light shielding film such as a chromium film).
- a pulse laser with a pulse frequency of 2 kHz is set with an overlap rate of 95% (for example, when the beam width is 100 ⁇ m and the conveyance speed is 5 ⁇ m / pulse: the same area is irradiated with the laser 20 times)
- the overlap rate remains 95%.
- the edge of the image once formed may be shielded by the mask 10, and the image may be formed on the irradiation surface by the optical system 14.
- the masks 10 may be disposed at both ends of the laser beam 2 in the major axis direction as in FIG.
- FIG. 5 shows a pulse laser with a pulse frequency of 2 kHz and an overlap rate of 95% (for example, when the beam width is 100 ⁇ m and the conveyance speed is 5 ⁇ m / pulse: the same area is irradiated with the laser 20 times).
- FIG. 6 shows how the overlap rate applied to the beam end portion changes depending on the oscillation frequency of the mask 10.
- the oscillation frequency is 1 kHz
- the beam edge is irradiated only 10 times, so that the apparent conveyance speed per pulse is doubled, and the overlap rate is changed from 95% to 90%.
- the frequency is changed to 500 Hz
- the beam edge is irradiated only five times from FIG. 5, so that the overlap rate can be reduced to 80%.
- the overlap rate of the beam end can be lowered by controlling the oscillation frequency to be lower.
- laser light 2 is emitted from a laser light source 3, and the laser light 2 is condensed into a linear beam by beam shaping 4 by a beam shaping optical system 4 and condensing by a condensing lens 6, to be processed 7. Irradiate.
- the movement of the moving stage 9 causes the linear beam (irradiation portion B) to move relative to the object 7 in the short axis direction as shown in FIG.
- the amorphous semiconductor film is crystallized.
- the amorphous silicon film is changed to a polysilicon film.
- FIG. 6B shows an example in which the object to be processed 7 is processed by irradiation of two rows, where R1 is the first row and R2 is the second row. W is an overlapping portion (joint portion) in the first and second rows.
- the mask 10 disposed on the optical path of the laser beam 2 shields the portion corresponding to the end of the linear beam so that the shielding amount periodically increases or decreases. 10 is operated to reduce the overlap rate of the beam end.
- the overlap rate is not controlled as in the conventional case, irradiation for two rows is performed on the joint portion W.
- irradiation at the joint portion W is performed by lowering the overlap rate at the beam end as in the present invention. The amount can be reduced, thereby preventing an excessive overlap rate.
- by overlapping and irradiating beams between adjacent rows it is possible to prevent lack of overlap.
- the overlap ratio of the beam end portion by the mask 10 may be controlled for the beam end portion on the side that becomes the joint portion W when at least one of the two adjacent rows is irradiated.
- the first row may be irradiated without being shielded by the mask 10, and the overlap ratio of the beam end portion may be controlled by the second row irradiation.
- the irradiation of the first row R1 may be performed at the beam end portion.
- the overlap rate may be controlled, and the second row may be irradiated without being shielded by the mask 10.
- the mask 10 to be arranged may be only on one side of the laser light 2.
- the vibration width of the mask 10 is preferably set according to the overlapping width of the joint portion W.
- the vibration width of the piezo element is usually 100 ⁇ m or less, so it is desirable to set within this range.
- the oscillation frequency of the mask 10 is determined by the pulse frequency of the pulse laser and the necessary overlap rate. The relationship between the oscillation frequency of the mask 10 and the overlap rate of the beam end is as described above (see FIG. 5).
- the mask 10 is made of single crystal silicon or the like so that the energy intensity at the beam end is not increased by the diffracted light 2a from the mask 10 and is adjusted while monitoring the energy distribution in the beam major axis direction with a profile monitor. Is desirable.
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Abstract
Description
特許文献2の方法では、エネルギー密度の異なる条件でビームを重ねるため、特にエネルギー変動に対して結晶性が大きく変動するエキシマレーザの場合、結晶性が不均一となることが予想される。
(1)本発明は、レーザ光を線状に整形した線状ビームを、被処理物に対して線状ビームの短軸方向に相対的に移動させながら照射して、被処理物にアニール処理を施すレーザアニール方法であって、線状ビームの短軸方向の相対移動による照射を、ビーム長軸方向にずらして2列以上行い、この際に、隣接する列同士のビーム照射領域が一部重なるように照射し、線状ビームの照射中、レーザ光の光路上に配置されたマスクにより、線状ビームの端部に対応する部分を遮蔽し、遮蔽量が周期的に増減するようにマスクを動作させる、ことを特徴とする。
上記(3)の方法及び上記(6)の装置によれば、ピエゾ素子は印加電圧の制御によって高い周波数の振動を発生させることができるので、マスクの高速揺動を容易に実現し、オーバーラップ率を容易に制御することができる。
レーザアニール装置1は、その基本構成要素として、レーザ光2を出射するレーザ光源3と、レーザ光源3からのレーザ光2を整形するビーム整形光学系4と、レーザ光2を被処理体7の方向に反射する反射ミラー5と、反射ミラー5からのレーザ光2を被処理体7の表面に集光する集光レンズ6と、被処理体7を載せて移動する移動ステージ9とを備える。
上記のレーザ光源3としては、例えば、エキシマレーザ、固体レーザあるいは半導体レーザを適用することが可能である。固体レーザとしては、YAG、YLF、YVO4等がある。レーザ光2は、パルス発振、連続発振のいずれであってもよい。
マスク10は、例えば、金属板や、ガラス板に金属メッキを施したものや、単結晶シリコンで構成することが可能である。
なお、オーバーラップ率ORは、以下の式により定義される。
OR=(1-V/W)×100 W:ビーム幅 V:搬送速度(1パルスあたり)
揺動周波数が1kHzとした場合、ビームエッジには10回しか照射されなくなるため、見かけのパルスあたりの搬送速度は2倍になり、オーバーラップ率は、95%から90%に変化する。500Hzに変化させると、図5から、ビームエッジには5回しか照射されなくなるため、オーバーラップ率は80%に低減できる。
以上のように、揺動周波数をより低く制御することで、ビーム端部のオーバーラップ率を下げることができる。
なお、オーバーラップ率ORは、以下の式により定義される。
OR=(1-V/W)×100 W:ビーム幅 V:搬送速度(1パルスあたり)
図2において、レーザ光源3からレーザ光2を出射させ、ビーム整形光学系4によるビーム整形4及び集光レンズ6による集光によりレーザ光2を線状ビームに集光して被処理体7に照射する。
また、隣接する列同士でビームを重ねて照射することでオーバーラップの不足も防止することができる。
この場合、ビーム端部のオーバーラップ率の制御は、両端部において行う必要があるため、図3の構成例のようにレーザ光2の長軸方向の両側にマスク10が配置される必要がある。
Claims (6)
- レーザ光を線状に整形した線状ビームを、被処理物に対して線状ビームの短軸方向に相対的に移動させながら照射して、被処理物にアニール処理を施すレーザアニール方法であって、
線状ビームの短軸方向の相対移動による照射を、ビーム長軸方向にずらして2列以上行い、この際に、隣接する列同士のビーム照射領域が一部重なるように照射し、
線状ビームの照射中、レーザ光の光路上に配置されたマスクにより、線状ビームの端部に対応する部分を遮蔽し、遮蔽量が周期的に増減するようにマスクを動作させる、ことを特徴とするレーザアニール方法。 - 前記マスクを揺動させることで遮蔽量を周期的に増減する、請求項1記載のレーザアニール方法。
- ピエゾ素子を用いて前記マスクを揺動させる、請求項2記載のレーザアニール方法。
- レーザ光を線状に整形した線状ビームを、被処理物に対して線状ビームの短軸方向に相対的に移動させながら照射して、被処理物にアニール処理を施すレーザアニール装置であって、
レーザ光の光路上に配置され線状ビームの端部に対応する部分を遮蔽するマスクと、
前記マスクによる遮蔽量が周期的に増減するようにマスクを動作させるマスク駆動装置と、を備えることを特徴とするレーザアニール装置。 - 前記マスク駆動装置は、前記マスクを揺動させることで遮蔽量を周期的に増減する、請求項4記載のレーザアニール装置。
- 前記マスク駆動装置はピエゾ素子である請求項5記載のレーザアニール装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801240211A CN102077318B (zh) | 2008-06-26 | 2009-06-19 | 激光退火方法及装置 |
EP09770083A EP2299476A4 (en) | 2008-06-26 | 2009-06-19 | METHOD AND APPARATUS FOR LASER RECEIVER |
JP2010517966A JP5366023B2 (ja) | 2008-06-26 | 2009-06-19 | レーザアニール方法及び装置 |
US13/001,311 US8598050B2 (en) | 2008-06-26 | 2009-06-19 | Laser annealing method and apparatus |
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JP2008166747 | 2008-06-26 | ||
JP2008-166747 | 2008-06-26 |
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JP2017079318A (ja) * | 2015-10-21 | 2017-04-27 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | レーザアニーリング装置、及びそれを利用したディスプレイ装置の製造方法 |
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KR101288993B1 (ko) * | 2011-12-20 | 2013-08-16 | 삼성디스플레이 주식회사 | 레이저 어닐링 장치 |
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Cited By (3)
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US9812471B2 (en) | 2015-08-07 | 2017-11-07 | Samsung Display Co., Ltd. | Laser annealing apparatus and method of manufacturing display apparatus by using the same |
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US9966392B2 (en) | 2015-10-21 | 2018-05-08 | Samsung Display Co., Ltd. | Laser annealing apparatus and method of manufacturing display apparatus by using the same |
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CN102077318A (zh) | 2011-05-25 |
EP2299476A1 (en) | 2011-03-23 |
US20110097907A1 (en) | 2011-04-28 |
TW201008690A (en) | 2010-03-01 |
EP2299476A4 (en) | 2011-08-03 |
KR20110020794A (ko) | 2011-03-03 |
JPWO2009157373A1 (ja) | 2011-12-15 |
JP5366023B2 (ja) | 2013-12-11 |
CN102077318B (zh) | 2013-03-27 |
US8598050B2 (en) | 2013-12-03 |
TWI410290B (zh) | 2013-10-01 |
KR101213659B1 (ko) | 2012-12-18 |
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