WO2009110548A1 - Method and system for washing electronic component - Google Patents

Method and system for washing electronic component Download PDF

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Publication number
WO2009110548A1
WO2009110548A1 PCT/JP2009/054167 JP2009054167W WO2009110548A1 WO 2009110548 A1 WO2009110548 A1 WO 2009110548A1 JP 2009054167 W JP2009054167 W JP 2009054167W WO 2009110548 A1 WO2009110548 A1 WO 2009110548A1
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WO
WIPO (PCT)
Prior art keywords
cleaning
electronic component
fluorine
tank
composition liquid
Prior art date
Application number
PCT/JP2009/054167
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French (fr)
Japanese (ja)
Inventor
秀明 菊地
Original Assignee
三井・デュポンフロロケミカル株式会社
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Application filed by 三井・デュポンフロロケミカル株式会社 filed Critical 三井・デュポンフロロケミカル株式会社
Priority to JP2010501952A priority Critical patent/JPWO2009110548A1/en
Publication of WO2009110548A1 publication Critical patent/WO2009110548A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Definitions

  • the present invention relates to a method and a cleaning system for cleaning an electronic component using a fluorine-containing organic cleaning composition liquid.
  • fluorine-based cleaning liquid a fluorine-containing organic cleaning composition liquid
  • vapor degreasing is used as a device for cleaning electronic components such as silicon wafers, silicon chips, and printed boards using a fluorine-containing organic cleaning composition liquid (hereinafter sometimes referred to as “fluorine-based cleaning liquid”)
  • a cleaning device is used (for example, Patent Document 1).
  • a method has also been proposed in which a dirty fluorine-based cleaning liquid in a cleaning device used for cleaning an electronic component is put into a regeneration device provided separately to be regenerated and used again for cleaning the electronic component (for example, Patent Document 2).
  • fluorine-based cleaning liquid since unused fluorine-based cleaning liquid is usually contained in a container and transported from the manufacturer to the site of use, a slight contamination component in the container is mixed in the fluorine-based cleaning liquid, and the container is opened.
  • the fluorine-based cleaning liquid is introduced into the cleaning device, it is considered that the fluorine-based cleaning liquid comes into contact with the external atmosphere and dirt components in the external atmosphere are mixed into the fluorine-based cleaning liquid.
  • the regenerated fluorine-based cleaning liquid the regenerated fluorine-based cleaning liquid is accommodated in the container from the regenerating apparatus and transported, and the container is opened and the fluorine-based cleaning liquid is introduced into the cleaning apparatus.
  • the fluorine-based cleaning liquid is contaminated in the same manner as described above, it cannot be said that the regenerated fluorine-based cleaning liquid is used at the required high purity. Therefore, it is desired to use a fluorine-based cleaning liquid having a higher purity in order to clean electronic components that tend to be denser and finer.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a method of cleaning an electronic component that can use a fluorine-based cleaning liquid with high purity, and a cleaning system using the same. That is, according to the present invention, a purification step of purifying an unused fluorine-containing organic detergent composition liquid by a purification apparatus and a purified detergent composition liquid supplied from the purification apparatus into the cleaning apparatus are used. And cleaning the electronic component, and in the purification step, the organic composition is removed by a rectifying device and the solid contaminant is removed by a filter device to purify the cleaning composition liquid. There is provided a method of cleaning an electronic component using the thus-purified cleaning composition liquid.
  • a cleaning system for cleaning an electronic component by the cleaning method wherein a contaminant contained in an unused fluorine-containing organic cleaning composition liquid is removed and purified. And a rectifying device for removing organic contaminants, and a cleaning device for cleaning an electronic component using the cleaning composition liquid purified by the purifying device.
  • a cleaning system for an electronic component that includes at least a filter device for removing solid contaminants and is configured to purify the rectifying device and the filter device through the cleaning composition liquid.
  • an unused fluorine-based cleaning liquid transported from a manufacturer of a fluorine-containing organic detergent composition liquid (fluorine-based cleaning liquid) is charged from the container into a purification apparatus,
  • the cleaning liquid can be purified by removing the dirt component in the cleaning liquid. Therefore, the manufacturer has filled the container with a small amount of dirt components with the fluorine-based cleaning liquid, so even if dirt components are mixed in the fluorine-based cleaning liquid, the purification equipment removes the dirt components in the fluorine-based cleaning liquid.
  • the electronic component can be cleaned by supplying the purified high-purity fluorine-based cleaning liquid to the cleaning device without contacting the external atmosphere.
  • the present invention provides a silicon wafer, a ceramic wafer, a silicon chip obtained by cutting the silicon wafer, a ceramic chip obtained by cutting the ceramic wafer, a glass substrate, a metal substrate, a color filter substrate, a printed circuit board, and an electronic component using these. It is possible to cope with higher density and miniaturization of electronic components. In addition, it becomes possible to always clean electronic components with a fluorine-based cleaning liquid that has been cleaned to a high purity, and stable cleaning quality can be ensured.
  • cleaning system of this invention It is a schematic block diagram which shows Embodiment 2 of the washing
  • the method for cleaning an electronic component according to the present invention includes a purification step of purifying an unused fluorine-containing organic cleaning composition liquid by a purification apparatus, and a purified cleaning composition liquid supplied from the purification apparatus into the cleaning apparatus.
  • a purification step of purifying an unused fluorine-containing organic cleaning composition liquid by a purification apparatus, and a purified cleaning composition liquid supplied from the purification apparatus into the cleaning apparatus.
  • the purification process at least removal of organic contaminants by a rectifying device and removal of solid contaminants by a filter device are performed, and water-soluble contamination by a water cleaning device is performed. You may remove the thing arbitrarily.
  • the order of removing organic contaminants, water-soluble contaminants, solid contaminants is arbitrary, but from the viewpoint of efficiently removing each contaminant, organic contaminants, water-soluble contaminants, It is preferable to purify the detergent composition liquid by removing in the order of solid contaminants, or in the order of water-soluble contaminants, organic contaminants, and solid contaminants.
  • this cleaning method does not limit the object to be cleaned, a silicon wafer, a ceramic wafer, a silicon chip obtained by cutting the silicon wafer, and the ceramic wafer are required to be highly cleaned with a high-purity fluorine-based cleaning liquid. It is suitable for cleaning electronic components such as cut ceramic chips, glass substrates, metal substrates, color filter substrates, printed boards and electronic components using these.
  • This cleaning method can also be used as a cleaning method for other objects to be cleaned, such as liquid crystal cells, PDP panels, stampers, molds, magnetic heads, VCMs (voice coil motors), HSAs (head stack assemblies), and cassettes. .
  • the fluorine-based cleaning liquid those suitable for cleaning electronic components can be used.
  • the fluorine-containing organic detergent composition liquid include fluorine compounds that have a molecular weight of less than 1000, contain carbon atoms and fluorine atoms in the skeleton, and are liquid and volatile at room temperature.
  • the fluorine compound is not particularly limited, but preferably contains hydrogen atoms in order to shorten the lifetime in the atmosphere from the viewpoint of preventing global warming.
  • the carbon skeleton may be linear, branched or cyclic, and may have a double bond or a triple bond.
  • the fluorine-based cleaning liquid having such characteristics include nonafluorobutyl methyl ether, 1,1,1,2,2,3,4,5,5,5-decafluoropropane, 1,2,2, 2-tetrafluoroethyl-2,2,2-trifluoromethyl ether, 1,1,1,3,3-pentafluorobutane, 1,1,2,2,3,3,4-heptafluorocyclopentane, Examples thereof include dichloropentafluoropropane, among which 1,1,1,2,2,3,4,5,5,5-decafluoropropane is preferable.
  • the fluorine-based cleaning liquid may be a mixture of one or more fluorine-based cleaning liquids.
  • a fluorine-based cleaning liquid may be one or a mixture of two or more of a fluorine-based cleaning liquid and another organic solvent.
  • the organic solvent include alcohols such as 2-propanol and ethanol, ketones such as acetone, ethers such as diethyl ether, organic acids such as acetic acid, esters such as ethyl acetate, dichloroethylene, dichloropentafluoropropane, etc. And halogenated hydrocarbons.
  • a mixture (azeotropic mixture) of a fluorine-based cleaning liquid and a water-soluble organic solvent for example, alcohol
  • the purification step does not include a water-soluble contaminant removal step.
  • the fluorine-based cleaning liquid is a mixture having an azeotropic composition, a mixing ratio in the azeotropic composition is desirable.
  • This cleaning system includes a purification device that removes and purifies contaminants contained in an unused fluorine-containing organic cleaning composition liquid, and an electronic component using the cleaning composition liquid purified by the purification apparatus.
  • a cleaning device for cleaning wherein the purification device includes at least a rectifying device for removing organic contaminants and a filter device for removing solid contaminants, and the cleaning agent is provided in the rectifying device and the filter device. It is comprised so that it may refine
  • the rectification apparatus In the purification apparatus, the rectification apparatus, the water washing apparatus, the water removal apparatus, and the filter apparatus may be arranged in any order. However, from the viewpoint of efficiently removing each contaminant as described above, the purification apparatus is a rectification apparatus.
  • the apparatus is preferably configured to purify through the detergent composition liquid in the order of apparatus, water cleaning apparatus, moisture removing apparatus and filter apparatus, or in the order of water cleaning apparatus, moisture removing apparatus, rectifying apparatus and filter apparatus.
  • the cleaning device is not particularly limited as long as it contains a fluorine-based cleaning liquid for removing dirt attached to the electronic component and is configured to clean the electronic component in the cleaning device. Is not to be done.
  • the cleaning device for example, a rinsing tank to which a fluorine-based cleaning liquid purified by a purification device is supplied, a cleaning tank that receives and heats the fluorine-based cleaning liquid overflowing from the rinsing tank, and heating in the cleaning tank A vapor retaining part in which the vapor of the vaporized fluorine-based cleaning liquid stays, and a steam condensing part for condensing the steam in the steam-retaining part and returning it to the rinsing tank, and in the fluorine-based cleaning liquid in the cleaning tank An electronic component is immersed and washed in the cleaning tank, and the cleaned electronic component is immersed and rinsed in a fluorine-based cleaning solution in the rinsing tank, and
  • the cleaning device may further include a shower nozzle, and the fluorine-based cleaning liquid purified by the purification device may be ejected from the shower nozzle to shower-wash the electronic component after the steam cleaning. If comprised in this way, the cleanliness of the electronic component by the washing
  • the purification apparatus removes dirt components mixed in an unused fluorine-based cleaning liquid according to the kind of the dirt, and as described above, a rectification apparatus that removes organic contaminants. And a filter device that removes solid contaminants, and further includes a water cleaning device that removes water-soluble contaminants, a moisture removal device that removes moisture, and an ionic contaminant removal device that removes ionic contaminants. It may be.
  • the types of contaminants include the organic contaminants, water-soluble contaminants, ionic contaminants, and solid contaminants.
  • the organic contaminant include fluorine oil (for example, Krytox (registered trademark)), fluorine polymer, and the like.
  • water-soluble contaminants include alcohols such as isopropyl alcohol and ethanol, and ketones such as acetone.
  • ionic contaminants include ions such as fluorine ions, nitrate ions, hydrogen carbonate ions, ammonium ions, and sodium ions.
  • solid contaminants include organic polymer compound particles such as plastics and elastomers, metal particles, and dust.
  • the purification apparatus may have an apparatus for removing contaminants other than those described above.
  • ⁇ Rectifying device> organic substances contained in unused fluorine-based cleaning liquids are obtained by heat exchange using the difference between the boiling point of fluorine-based cleaning liquids and the boiling point of organic contaminants (hereinafter referred to as “boiling point difference”). It can be configured to remove contaminants. For example, when the boiling point difference is small, a heat exchange action is required multiple times for the separation of the fluorine-based cleaning liquid and the organic contaminants, and a rectification apparatus having a high reflux function is selected, and the boiling point difference is reduced. If larger, a simple distillation apparatus or a heating apparatus that heats the fluorine-based cleaning liquid without boiling is selected.
  • the rectifying apparatus is appropriately selected depending on the difference in boiling point between the fluorine-based cleaning liquid and the organic contaminant or the cleanliness required for the electronic component.
  • a rectification apparatus for example, distillation apparatus
  • a rectification apparatus can be abbreviate
  • Water cleaning device> To remove water-soluble contaminants contained in the fluorine-based cleaning solution, it is effective to bring the fluorine-based cleaning solution into contact with water and dissolve the water-soluble contaminants in water.
  • the contact method is not particularly limited, but a counter-current contact method is preferable in view of simplicity and handling.
  • a water contact device for example, a plurality of partition plates are arranged inside a cylinder having a cleaning liquid inlet and a water outlet at the upstream end and a cleaning liquid outlet and a water inlet at the downstream end.
  • cleaning liquid and water in an internal flow path by filling with a filling material is mentioned.
  • the water contact device having such a configuration has a counter-current type contact in which an upstream end is arranged at the upper part and a downstream end is arranged at the lower part, and the fluorine-based cleaning liquid is poured from the upper part to the lower part in the water stream flowing from the lower part to the upper part. It is preferable to adopt a method.
  • the fluorine-based cleaning liquid when the fluorine-based cleaning liquid is brought into contact with water, water is dissolved in the fluorine-based cleaning liquid in a small amount, but the moisture removing device for removing water in the fluorine-based cleaning liquid is provided downstream of the water contact device. It is attached.
  • the cleaning liquid is composed of a mixture of a fluorine-based cleaning liquid and a water-soluble organic solvent, the water cleaning device and the water removing device are omitted from the purification device.
  • a moisture removing device for example, a moisture removing device having a structure in which a granular moisture absorbent typified by zeolite is filled inside a cylinder having a cleaning liquid inlet at the upstream end and a cleaning liquid discharge port at the downstream end.
  • a moisture removing device having a structure in which a granular moisture absorbent typified by zeolite is filled inside a cylinder having a cleaning liquid inlet at the upstream end and a cleaning liquid discharge port at the downstream end.
  • the water-soluble contaminant also has ionicity
  • the water-soluble contaminant removal by the water contact device and the water removing device also serves as ionic contaminant removal.
  • the moisture removing device may include a moisture discharging means for discharging the moisture adsorbed on the hygroscopic material to the outside.
  • the moisture discharge means include an air inlet and an air outlet formed at the upstream end and the downstream end of the moisture removing device, a hot air supply device that sends hot air to the air inlet, or room temperature air at the air inlet. What is comprised is equipped with the band heater wound around the blower which sends in and a cylinder, and the inside is heated, and the moisture absorption material is dried by letting the heated air pass through a cylinder.
  • two or more moisture removal apparatuses are installed in parallel. In this way, when the moisture absorbent material of one moisture removing device is being dried, the moisture in the fluorine-based cleaning liquid can be removed by the other moisture removing device. The cleaning liquid cleaning efficiency can be increased.
  • a part of the peripheral wall of the cylinder is formed of a transparent window, and a saturated indicator such as blue silica gel is mixed with the hygroscopic material, so that the moisture absorbent absorbs moisture depending on the color of the saturated indicator. You may make it visible visually (degree of drying).
  • a moisture measuring device may be installed on the downstream side of the moisture removing device, and the moisture content in the air used for drying may be measured by the moisture measuring device to examine the degree of drying of the moisture absorbent.
  • water separation that separates the fluorine-based cleaning liquid and water using the difference in specific gravity between the fluorine-based cleaning liquid and the water dissolved in the fluorine-based cleaning liquid
  • a vessel may be installed between the water contact device and the water removal device.
  • ionic contaminant removal apparatus for example, an ionic contaminant removal apparatus having a configuration in which alumina gel is filled inside a cylinder having a cleaning liquid inlet at the upstream end and a cleaning liquid discharge outlet at the downstream end is provided. Can be mentioned.
  • the filter device for removing solid contaminants examples include a filter device in which a microfiltration membrane, an ultrafiltration membrane, and the like are provided in a cylinder through which a fluorine-based cleaning liquid passes.
  • the solid contaminants removed by the filter device are discharged from the cylindrical body to the outside by replacing the filter.
  • a plurality of the same filtration membranes or different filtration membranes may be used in combination.
  • the purification apparatus in the present cleaning system is, in order from the upstream to the downstream, the rectification apparatus, the water cleaning apparatus, the water removing apparatus, and the filter apparatus in this order, or the water cleaning apparatus, It is preferable that each device is connected continuously by piping in the order of the moisture removing device, the rectifying device, and the filter device.
  • the installation position of an ionic contaminant removal apparatus is not specifically limited.
  • the cleaning system further includes a regeneration device that regenerates the used fluorine-based cleaning liquid used for cleaning the electronic components in the cleaning device, and the regeneration device is connected to the cleaning device by a circulation pipe, and the used fluorine-based cleaning liquid. May be configured to be supplied from the cleaning device to the regenerator and regenerated, and the regenerated fluorine-based cleaning liquid is circulated and supplied from the regenerator to the cleaning device.
  • the regenerator By integrating the regenerator into the cleaning system in this way, the used dirty fluorine-based cleaning liquid is transferred from the cleaning apparatus to the regenerator through the circulation pipe, and the regenerated fluorine-based cleaning liquid is recirculated from the regenerator to the circulation pipe. Through the cleaning device.
  • the regenerated fluorine-based cleaning liquid can be transferred to the cleaning device without contacting the external environment. It is possible to avoid contamination by contaminants.
  • the regenerator only needs to be able to remove various contaminants contained in the used fluorine-based cleaning liquid, and more preferably, the regenerating apparatus is a high-purity fluorine-based cleaning liquid similar to the purity before use. Anything that can be reproduced is acceptable.
  • the regenerator must remove all these contaminants.
  • the regenerator described in Japanese Patent Laid-Open No. 2001-129302 can be connected to the cleaning device by a circulation pipe.
  • a buffer tank for temporarily storing a fluorine-based cleaning liquid is further provided between at least one of the purification device and the cleaning device and between the cleaning device and the regeneration device. Also good.
  • a purification buffer tank is installed on the downstream side of the purification device, in parallel with the cleaning process by the cleaning device, the purified, unused fluorine-based cleaning solution is put into the purification buffer tank for the next batch cleaning process. Can be stored. Therefore, when the dirty used fluorine-based cleaning solution in the cleaning device is replaced with a new fluorine-based cleaning solution, or when the used fluorine-based cleaning solution is regenerated in the regenerator, the purified fluorine-based cleaning solution in the purification buffer tank is used.
  • the cleaning liquid can be used for the next batch cleaning process, and the cleaning process can be performed efficiently.
  • the used fluorine-based cleaning liquid is put into the regenerator buffer tank when the dirty spent fluorine-based cleaning liquid in the cleaning device is regenerated by the regenerator. While transporting, supply the purified fluorine-based cleaning solution from the purification device to the cleaning device, and supply the used fluorine-based cleaning solution from the regeneration buffer tank to the regeneration device during the cleaning process by the cleaning device to perform the regeneration process. Can do. If a second regeneration buffer tank is provided on the downstream side of the regenerator, the regenerated fluorine-based cleaning liquid is continuously sent to the second regeneration buffer tank and stored for the next cleaning batch. I can keep it. Further, when both the purification and regeneration buffer tanks are provided, the above-described advantages of each buffer tank can be obtained, and the washing process can be performed more efficiently.
  • the purification apparatus in which each of the contaminant removing apparatuses is continuously connected by piping and the cleaning apparatus are connected and integrated by piping, thereby continuously from the unused fluorine-based cleaning liquid.
  • a high-purity fluorine-based cleaning liquid that has been purified by removing various contaminants can be directly supplied to the cleaning apparatus without being brought into contact with the external environment.
  • a pump-type or air-type transfer means may be provided in the middle of the pipe so that the transfer of the fluorine-based cleaning liquid is not delayed, or the fluorine-based cleaning liquid is transferred by a gravity difference. Also good.
  • the cleaning method of the present invention in which the electronic component is cleaned by the cleaning system configured as described above, is a cleaning liquid regeneration step in which the fluorine-based cleaning liquid discharged from the cleaning apparatus is regenerated by the regenerating apparatus and circulated to the cleaning apparatus May further be included.
  • the electronic component is immersed and cleaned in the fluorine-based cleaning liquid in the cleaning tank, the cleaned electronic component is immersed in the fluorine-based cleaning liquid in the rinsing tank and rinsed, and the rinsed electronic component is vaporized.
  • the electronic component that has been subjected to vapor cleaning with the vapor in the staying portion and then subjected to vapor cleaning may be subjected to shower cleaning with a purified fluorine-based cleaning liquid from a shower nozzle.
  • FIG. 1 is a schematic configuration diagram showing Embodiment 1 of the cleaning system of the present invention.
  • the cleaning system according to the first embodiment includes a cleaning device 10 and a purification device 20 connected to the cleaning device 10 by piping.
  • the cleaning device 10 includes a body 11 having an upper opening shape, a cleaning tank 12 and a rinsing tank 13 disposed in a lower portion of the body 11, and a vapor condensing unit 14 disposed along an upper opening edge of the body 11.
  • the fluorine-based cleaning liquid C is accommodated in the cleaning tank 12 and the rinsing tank 13.
  • the alternate long and two short dashes line represents the liquid level of the fluorine-based cleaning liquid C
  • the fluorine-based cleaning liquid C is an amount in which the liquid level of the cleaning tank 12 is always lower than the liquid level of the rinsing tank 13. ing.
  • the cleaning tank 12 has a heater 12a on the inner bottom surface, and the fluorine-based cleaning liquid C in the cleaning tank 12 is heated by the heater 12a. Further, a part of the heated fluorine-based cleaning liquid C in the cleaning tank 12 rises as vapor, and a vapor layer S of the fluorine-based cleaning liquid C is formed above the cleaning tank 12 and the rinsing tank 13. In FIG. 1, the dotted line represents the boundary between the vapor layer S and the outside air.
  • the rinsing tank 13 has an ultrasonic generator 13a on the inner bottom surface, and ultrasonic waves are applied to the fluorine-based cleaning liquid C in the rinsing tank 13 by the ultrasonic generator 13a.
  • the vapor condensing unit 14 includes a condensing tube 14a provided along the inner surface of the upper opening edge of the body 11, a cooling cycle unit (not shown) that circulates the refrigerant in the condensing tube 14a, and a soot provided under the condensing tube 14a.
  • the water separator 14c which connects the part 14b, the collar part 14b, and the rinse tank 13 through piping is provided. A part of the vapor in the vapor layer S comes into contact with the condenser tube 14 and is deprived of heat to be liquefied and collected in the flange 14b.
  • the fluorine-based cleaning liquid C contains moisture condensed from water vapor in the air
  • the fluorine-based cleaning liquid C is introduced into the water separator 14c from the flange 14b and separated from the water, and the fluorine-based cleaning liquid C Water having a smaller specific gravity than the water separator 14c is discharged to the outside from the drain outlet at the top of the water separator 14c, and the fluorine-based cleaning liquid C is introduced into the rinsing tank 13 through the piping from the opening at the bottom of the water separator 14c.
  • the purification device 20 constitutes a water contact column 21 constituting a water washing device for removing water-soluble contaminants, a water separator 22 and a hygroscopic material column 23 constituting a water removal device, and an ionic contaminant removal device.
  • An ionic contaminant removal column 24, a heater built-in distillation column 25 constituting a rectifying device for removing organic contaminants, and a filter device 26 for removing solid contaminants are arranged in this order from the upstream side.
  • the water contact column 21 has a cleaning liquid inlet and a water outlet at the upper upstream end, and has a cleaning liquid outlet and a water inlet at the lower downstream end.
  • the cleaning liquid inlet is an unused fluorine-based cleaning liquid C.
  • the filter device 26 is connected to the rinsing tank 13 of the cleaning device 10 by piping.
  • the cleaning method using this cleaning system includes a purification process in which an unused fluorine-based cleaning liquid is supplied to the purification apparatus 20 for purification, and a cleaning process in which electronic components are cleaned with the fluorine-based cleaning liquid C in the cleaning apparatus 10.
  • the purified fluorine-based cleaning liquid C is supplied to the cleaning device 10 before cleaning the electronic components in the cleaning device 10.
  • the fluorine-based cleaning liquid flows from above and water flows from below.
  • the fluorine-based cleaning liquid When water-soluble contaminants are contained in the fluorine-based cleaning liquid, the water-soluble contaminants are removed while the fluorine-based cleaning liquid descends, and then sent to the water separator 22.
  • water used for the treatment is discharged from the upper part of the water contact column 21. Since the fluorine-based cleaning liquid sent to the water separator 22 contains a slight amount of water, the fluorine-based cleaning liquid and water are separated into a lower layer and an upper layer in the water separator 22, and the lower-layer fluorine-based cleaning liquid becomes a hygroscopic material. Sent to column 23.
  • the separated water is discharged from the upper part of the water separator 22. Since the fluorine-based cleaning liquid sent to the hygroscopic material column 23 contains a small amount of moisture, the moisture is removed by the hygroscopic material (for example, zeolite), and then the fluorine-based cleaning liquid is transferred to the ionic contaminant removal column 24. Sent.
  • the ionic contaminant removal material for example, alumina gel
  • the fluorine-based cleaning liquid is sent to the distillation tower 25.
  • organic contaminants are contained in the fluorine-based cleaning liquid sent to the distillation column 25
  • the organic property is obtained by distillation operation in the distillation column 25 using the boiling point difference between the organic contaminants and the fluorine-based cleaning liquid. Contaminants are removed, and then the fluorine-based cleaning liquid is sent to the filter device 26.
  • the solid contaminant may include a hygroscopic material or an ionic contaminant removing material that has flowed from the upstream side.
  • the fluorine-based cleaning liquid that has passed through the water contact column 21, the water separator 22, the hygroscopic material column 23, the ionic contaminant removal column 24, the distillation tower 25, and the filter device 26 is water-soluble, ionic, organic
  • the fluorine-based cleaning liquid C is purified to a high purity and does not contain various solid contaminants, and is sent to the rinsing tank 13 of the cleaning apparatus 10. That is, when cleaning an electronic component using a brand new fluorine-based cleaning liquid, the purified fluorine-based cleaning liquid C is supplied into the empty rinsing tank 13 of the cleaning apparatus 10 and the fluorine-based cleaning liquid C overflowing from the rinsing tank 13 is supplied. Is supplied to the washing tank 12.
  • the electronic component is immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 12 to remove dirt (mainly organic contaminants) on the surface of the electronic component.
  • the electronic component is immersed in the fluorine-based cleaning liquid C in the rinsing tank 13. Since the fluorine-based cleaning liquid C in the rinsing tank 13 is maintained at a lower temperature than the fluorine-based cleaning liquid C in the cleaning tank 12, the electronic components are cooled in the rinsing tank 13.
  • the electronic component is pulled up from the rinsing tank 13 and introduced into the vapor layer S, and finally rinsed with a fluorine-based cleaning liquid that condenses and liquefies on the surface of the electronic component, and is taken out from the upper opening of the cleaning device 10. It is.
  • the clean fluorine-based cleaning liquid condensed into the condensing unit 14 is separated into water and then returned to the rinsing tank 13, and contaminants brought into the rinsing tank 13 accompanying the electronic components from the cleaning tank 12 are It is returned to the washing tank 12 by overflow.
  • the electronic component can be cleaned using a fluorine-based cleaning liquid in which the purity of the unused fluorine-based cleaning liquid is further increased, so that the cleanliness of the electronic component can be further improved.
  • the purified fluorine-based cleaning liquid is supplied to the rinsing tank 13 during and / or after cleaning. Can be replenished.
  • a valve of a discharge port (not shown) provided at the bottom of the cleaning tank 12 and the rinsing tank 13 is opened to collect the used fluorine-based cleaning liquid in a recovery container, and if necessary, the cleaning apparatus 10 is emptied.
  • the recovered used fluorine-based cleaning liquid may be discarded or regenerated in a regenerator, and the regenerated fluorine-based cleaning liquid may be directly put into the cleaning apparatus 10 to be reused or purified. After the purity is further increased by the apparatus, it may be put into the cleaning apparatus 10 and reused.
  • FIG. 2 is a schematic configuration diagram showing Embodiment 2 of the cleaning system of the present invention.
  • the cleaning system according to the second embodiment includes the cleaning device 100 and the purification device 200 connected to the cleaning device 100 through a pipe.
  • the configurations of the cleaning device 100 and the purification device 200 are as follows. Is slightly different from the first embodiment. Hereinafter, differences from the first embodiment in the second embodiment will be mainly described.
  • the cleaning device 100 includes a body 110 having an upper opening shape, a cleaning tank 120 and a rinsing tank 130 disposed in a lower portion of the body 110, a vapor condensing unit 140 disposed along an upper opening edge of the body 110, and a cleaning A steam generation tank 150 disposed adjacent to the tank 120 and a distillation tower 160 disposed above the steam generation tank 150 are provided.
  • the cleaning tank 120 includes a heater 120a
  • the rinsing tank 130 includes an ultrasonic generator 130a
  • the vapor condensing unit 140 includes a condensing pipe 140a, a ridge 140b, and a water separator 140c.
  • the steam generation tank 150 is provided outside the steam condensing unit 140, and has a heater 150a on the inner bottom surface.
  • the body 110 has a portion that covers the upper part of the steam generation tank 150, and the distillation tower 160 is mounted on this portion.
  • the distillation tower 160 and the steam generation tank 150 communicate with each other through a communication hole formed in the body 110. Further, a discharge port for discharging steam is formed at the upper end of the distillation column 160, and this discharge port communicates with the vicinity of the condensing pipe 140a of the steam condensing unit 140 through a pipe.
  • the electronic component is first immersed and cleaned in the heated fluorine-based cleaning liquid C in the cleaning tank 120, and then in the rinsing tank 130. After immersing and rinsing in the fluorine-based cleaning liquid C to which ultrasonic waves are applied, the heated fluorine-based cleaning liquid C in the cleaning tank 120 is pulled up into the vaporized vapor layer S and steam-cleaned, and then externally. It is taken out.
  • the fluorine-based cleaning liquid C overflowing the cleaning tank 120 is introduced into the steam generation tank 150, and a part of the vapor of the fluorine-based cleaning liquid C heated and vaporized in the steam generation tank 150 passes through the distillation tower 160.
  • the condenser tube 140a By contacting the condenser tube 140a, it is liquefied and collected in the collar 140b. That is, in the cleaning process, the dirty fluorine-based cleaning liquid in the cleaning tank 120 flows into the steam generation tank 150, and the fluorine-based cleaning liquid containing organic contaminants is vaporized in the steam generation tank 160, and organic contaminants out of the vapor are included.
  • the vapor is cooled and liquefied in the distillation column 160 and returned to the vapor generation tank 160, and only the fluorine-based cleaning solution vapor that does not contain organic contaminants passes through the distillation column 160 and is liquefied in the vapor condensing unit 140.
  • a part of the vapor in the vapor layer S is liquefied by the vapor condensing unit 140 and collected in the tub 140b, and a clean fluorine-based cleaning liquid is returned from the jar 140b to the rinsing tank 130 through the water separator 140c.
  • a water contact column 210 to which a hopper 210a is connected, a water separator 220, a moisture absorption column 230, an ionic contaminant removal column 240, and a filter device 260 are continuously connected in series by piping.
  • the filter device 260 is connected to the rinsing tank 130 of the cleaning device 100 by piping. That is, the purification apparatus 200 is the same as that of Embodiment 1 except that the distillation column 25 (see FIG. 1) in the purification apparatus 20 of Embodiment 1 is omitted.
  • the purification apparatus 200 passes through removal of water-soluble contaminants other than organic contaminants in the unused fluorine-based cleaning liquid, removal of ionic contaminants, and removal of solid contaminants.
  • the purified fluorine-based cleaning liquid is introduced into the rinsing tank 130 of the cleaning device 100, and the cleaning system 100 cleans the fluorine-based cleaning liquid containing organic contaminants while cleaning the electronic components by the distillation tower 160. It can be refluxed to the tank 130.
  • FIG. 3 is a schematic configuration diagram showing Embodiment 3 of the cleaning system of the present invention.
  • the cleaning system according to the third embodiment further includes a regenerator 30 that regenerates the used fluorine-based cleaning liquid in addition to the same cleaning apparatus 10 and purification apparatus 20 as those of the first embodiment described with reference to FIG.
  • the same components as those in FIG. 1 are denoted by the same reference numerals.
  • differences from the first embodiment in the third embodiment will be mainly described.
  • the regenerator 30 is connected to the cleaning tank 12 and the rinsing tank 13 of the cleaning apparatus 10 through a circulation pipe 31, and the dirty fluorine-based cleaning liquid in the cleaning tank 12 is introduced into the regenerator 30 and cleaned.
  • the regenerated fluorine-based cleaning liquid is returned to the rinsing tank 13 and reused.
  • the dirty fluorine-based cleaning liquid from the cleaning tank 12 is continuously transferred to the regenerator 30 for regeneration, and the regenerated cleaning composition liquid is subjected to the next batch cleaning process. It is continuously supplied to the rinsing tank 13 before starting.
  • the purified fluorine-based cleaning liquid is rinsed during and / or after cleaning. 13 may be replenished.
  • the regenerator 30 includes a plurality of contaminant removal devices that remove various contaminant components, for example, a water cleaning device, a moisture removal device, an ionic contaminant removal device, a rectification device, and a filter device similar to the purification device 20. It is preferable that a known reproducing apparatus can be used. According to this cleaning system, the used dirty fluorine-based cleaning liquid is transferred from the cleaning device 10 to the regenerator 30 through the circulation pipe 31, and the regenerated fluorine-based cleaning liquid is transferred from the regenerator 30 through the circulation pipe 31 to the cleaning apparatus 10. Can be transferred to. As a result, in addition to being able to transfer the fluorine-based cleaning liquid easily and in a short time, the regenerated fluorine-based cleaning liquid can be transferred to the cleaning device 10 without contacting the external environment. The contamination inside can be avoided.
  • a known reproducing apparatus can be used. According to this cleaning system, the used dirty fluorine-based cleaning liquid is transferred from the cleaning device 10 to the regenerator 30 through the
  • FIG. 4 is a schematic configuration diagram showing Embodiment 4 of the cleaning system of the present invention.
  • the cleaning system according to the fourth embodiment further includes a regeneration device 30 similar to that of the third embodiment in addition to the same cleaning device 100 and purification device 200 as those of the second embodiment described with reference to FIG.
  • the same components as those in FIGS. 2 and 3 are denoted by the same reference numerals.
  • the cleaning system according to the fourth embodiment can regenerate the used and dirty fluorine-based cleaning liquid easily and with high purity in the system.
  • FIG. 5 is a schematic configuration diagram showing Embodiment 5 of the cleaning system of the present invention.
  • the cleaning system of the fifth embodiment temporarily stores the purified fluorine-based cleaning liquid between the purification device 20 and the cleaning device 10 in the cleaning system of the third embodiment (see FIG. 3).
  • a purification buffer tank 41 is provided, and a regeneration buffer tank 42 is provided between the downstream side of the regeneration device 30 and the cleaning device 10 to temporarily store the regenerated fluorine-based cleaning liquid.
  • the fluorine-based cleaning liquid C in the cleaning apparatus 10 is continuously transferred to the regeneration apparatus 30 and regenerated, and the regenerated fluorine-based cleaning liquid is continuously supplied to the regeneration buffer tank 42.
  • the purified fluorine-based cleaning liquid in the purification buffer tank 41 can be continuously transferred to the cleaning device 10 to prepare for the next cleaning step.
  • the regenerated fluorine-based cleaning liquid in the regeneration buffer tank 42 is continuously transferred to the cleaning apparatus 10 while the fluorine-based cleaning liquid C in the cleaning apparatus 10 is continuously transferred to the regenerating apparatus 30 and regenerated. It is also possible to prepare for the next cleaning step. Therefore, it is possible to efficiently perform the cleaning process in batch units. It is also possible to replenish the cleaning apparatus 10 with a part of the purified or regenerated fluorine-based cleaning liquid stored in the buffer tanks 41 and 42 as needed.
  • the position of the purification buffer tank 41 is not limited to the position shown in the figure, and is between the distillation column 25 and the filter 26, between the ionic contaminant removal column 24 and the distillation column 25, and between the hygroscopic material column 23 and the ion. It may be between the toxic contaminant removal column 24 or before the water contact column 21. In this case, the fluorinated cleaning liquid during or before purification is temporarily stored in the purification buffer tank. Further, the position of the regeneration buffer tank 42 may be between the upstream side of the regeneration device 30 and the cleaning device 10. In this case, the fluorinated cleaning liquid before regeneration is temporarily stored in the regeneration buffer tank 42. In the fifth embodiment, the buffer tank may be either for purification or for regeneration. Further, it goes without saying that such a configuration including the purification buffer tank 41 and / or the regeneration buffer tank 42 can be applied to the cleaning systems of Embodiments 1, 2, and 4 in addition to the cleaning system of Embodiment 3. Yes.
  • FIG. 6 is a schematic configuration diagram showing Embodiment 6 of the cleaning system of the present invention.
  • the cleaning apparatus 10 further includes a shower nozzle 17 in addition to the same cleaning apparatus 10 and purification apparatus 20 as those of the third embodiment described with reference to FIG. 3, and the fluorine-based cleaning liquid purified by the purification apparatus 20. Is ejected from the shower nozzle 17 and the electronic component after the steam cleaning is configured to be shower cleaned.
  • the same components as those in FIG. 3 are denoted by the same reference numerals.
  • differences from the third embodiment in the sixth embodiment will be mainly described.
  • the shower nozzle 17 is disposed near the upper edge of the body 11 near the cleaning tank 12 above the vapor retention portion S in the cleaning device 10, and the filter 26 and the cleaning device 10 of the purification device 20 are arranged.
  • a branch pipe 28 that branches from the middle of the pipe 27 that connects the pipe 18 and the shower nozzle 17 is connected. Further, an open / close valve 28 a is provided in the middle of the branch pipe 28, and an open / close valve 27 a is provided downstream of the branch pipe 28 of the pipe 27.
  • the opening / closing valve 27a is closed, the opening / closing valve 28a is opened, the fluorine-based cleaning liquid purified by the purification device 20 is ejected from the shower nozzle 17, and the steam S in the steam retention part is used. It is possible to shower-wash the electronic component after being steam-washed. Further, the fluorine-based cleaning liquid subjected to shower cleaning can be dropped into the cleaning tank 12 and reused in the cleaning tank 12. Therefore, even if the vapor S contains the organic contaminant vapor, and the organic contaminant remains on the surface of the electronic component after the vapor cleaning, the surface of the electronic component is removed by the purified shower-like fluorine-based cleaning liquid.
  • the cleanliness of the electronic component can be further increased.
  • such a configuration that enables shower cleaning can be applied to the cleaning systems of the first, second, fourth, and fifth embodiments in addition to the cleaning system of the third embodiment.
  • the purified fluorine-based cleaning liquid can be supplied from the purification buffer tank 41 (see FIG. 5) to the shower nozzle 17 as needed.
  • FIG. 7 is a schematic configuration diagram showing Embodiment 7 of the cleaning system of the present invention.
  • the cleaning system of the seventh embodiment is the same as that of the first embodiment except that the cleaning device 10 in the cleaning system of the first embodiment described in FIG. 1 is different.
  • the same components as those in FIG. 1 are denoted by the same reference numerals.
  • differences from the first embodiment in the seventh embodiment will be mainly described.
  • the cleaning apparatus 10A includes a body 11 having an upper opening, a lid 11a that shields the upper opening of the body 11 so as to be openable and closable,
  • the rinsing tank 13 is provided, and the fluorine-based cleaning liquid C is accommodated in the cleaning tank 12 and the rinsing tank 13.
  • the fluorine-based cleaning liquid C is set so that the liquid level in the cleaning tank 12 is always lower than the liquid level in the rinsing tank 13.
  • the cleaning tank 12 and the rinsing tank 13 each have an ultrasonic generator 13 a on the inner bottom surface, and ultrasonic waves are generated in the cleaning liquid 12 in the cleaning tank 12 and the rinsing tank 13 by each ultrasonic generator 13 a. Is granted.
  • the lid 11a is opened. First, the electronic component is immersed in the fluorine-based cleaning liquid C in the cleaning tank 12 at room temperature, and the surface of the electronic component is ultrasonically cleaned. Peeled by action. Subsequently, the electronic component is immersed in the fluorine-based cleaning liquid C in the rinsing tank 13 at room temperature, and dirt remaining on the surface of the electronic component is peeled off by the action of ultrasonic waves, and then the upper opening of the cleaning device 10A. Is taken out more. Thus, in the seventh embodiment, the steam cleaning performed in the first embodiment is omitted.
  • the lid 11a is basically closed except for the electronic component cleaning step, and the cleaning apparatus 10A is hermetically sealed so that dust, dirt, dust, and the like do not enter the cleaning tank 13 and the rinsing tank 13.
  • FIG. 8 is a schematic configuration diagram showing Embodiment 8 of the cleaning system of the present invention.
  • the cleaning system of the eighth embodiment is the same as that of the seventh embodiment except that the cleaning device 10A in the cleaning system of the seventh embodiment described in FIG. 7 is different.
  • FIG. 8 the same components as those in FIG. 7 are denoted by the same reference numerals.
  • differences from the seventh embodiment in the eighth embodiment will be mainly described.
  • the cleaning device 10B according to the eighth embodiment is obtained by providing the cleaning device 10A according to the seventh embodiment with a shower nozzle 17 (see FIG. 6).
  • the shower nozzle 17 is connected to the purifier 20 as in the sixth embodiment.
  • the electronic device is cleaned by the cleaning device 10B, the electronic component is cleaned in the cleaning tank 12 and the rinsing tank 13 in the same manner as in the seventh embodiment, and then the purified fluorine-based cleaning liquid C ejected from the shower nozzle 17 is used. And shower washed.
  • shower cleaning may be performed after one or both of cleaning in the cleaning tank 12 and cleaning in the rinsing tank 13 are omitted.
  • the shower cleaning may be high-pressure shower cleaning.
  • FIG. 9 is a schematic configuration diagram showing Embodiment 9 of the cleaning system of the present invention.
  • the cleaning system of the ninth embodiment is the same as that of the first embodiment except that the cleaning device 10 in the cleaning system of the first embodiment described in FIG. 1 is different.
  • the same components as those in FIG. 1 are denoted by the same reference numerals.
  • differences from the first embodiment in the ninth embodiment will be mainly described.
  • the rinsing tank 13 of the cleaning device 10 according to the first embodiment is omitted.
  • the electronic component When cleaning the electronic component by the cleaning device 10C, the electronic component is not immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 12, but is cleaned in the vapor layer S.
  • the vapor of the cleaning liquid is condensed and liquefied on the component surface, thereby washing away the dirt on the component surface.
  • the temperature of the electronic component gradually increases and finally reaches the boiling point of the cleaning liquid by leaving it for a while, so that the cleaning liquid on the surface of the component is vaporized and the electronic component is dried.
  • the electronic component may be taken out from the vapor layer S and dried by natural drying or an external drying device before drying.
  • a circulation path for circulating the fluorine-based cleaning liquid in the rinsing tank of the cleaning device is provided, a filter is installed in the circulation path, and the fluorine-based cleaning liquid in the rinsing tank is passed through the filter to be circulated and cleaned. You may comprise so that it may become. According to this configuration, even if solid contaminants adhering to the electronic parts before cleaning are peeled off in the rinsing tank and mixed into the fluorinated cleaning liquid, the solid contaminants are removed from the fluorinated cleaning liquid in the rinsing tank. It is possible to increase the cleanliness of the electronic component. 2.
  • the cleaning systems of Embodiment 2 see FIG.
  • Embodiment 2 2) and Embodiment 4 (see FIG. 4) are provided with a distillation column 160 for removing organic contaminants from the used fluorine-based cleaning liquid.
  • the purification apparatus 200 may be provided with a distillation column as in the first embodiment (see FIG. 1) and the third embodiment (see FIG. 3).
  • the cleaning systems of Embodiments 7 to 9 may also include the regenerator 30 and the buffer tanks 41 and 42 as in Embodiments 3 to 6 (FIGS. 3 to 6).
  • Example 1 Vertrel (registered trademark) XF (manufactured by Mitsui DuPont Fluoro Chemical Co., Ltd.) as a fluorine-based cleaning liquid, 200 ppm by weight of 2-propanol (hereinafter referred to as IPA) as a water-soluble contaminant, and Krytox as an organic contaminant (Registered trademark) 143AC (manufactured by DuPont) was mixed with 5 ppm by weight to prepare a fluorine-based cleaning solution having simulated dirt.
  • IPA 2-propanol
  • Krytox as an organic contaminant
  • 143AC manufactured by DuPont
  • the fluorine-based cleaning liquid having simulated dirt is purified using the purification apparatus 20 in the first embodiment (see FIG. 1), and how much various contaminants and moisture are removed from the purified fluorine-based cleaning liquid.
  • the results were measured using a moisture meter (CA-06 model, manufactured by Mitsubishi Chemical Corporation), and the results are shown in Table 1.
  • the molecular sieve 3A made by Union Carbide was used for the ionic contaminant removal apparatus 24, and the distillation tower (Oldershaw type, 40 stages) was used for the rectification apparatus 25.
  • Example 1 From the results of Example 1, it was confirmed that a high-purity fluorine-based cleaning liquid can be obtained by purifying the fluorine-based cleaning liquid having simulated dirt with the purification apparatus of the present invention.
  • Example 2 First, what kind of contaminants are contained in the unused fluorine-based cleaning liquid used in the cleaning system of the present invention, and then the unused fluorine-based cleaning liquid is purified in the same manner as in Example 1, The extent to which various contaminants were removed from the purified fluorine-based cleaning solution was measured in the same manner as in Example 1, and the results are shown in Table 2.
  • the unused fluorine-based cleaning liquid the Bertrell XF (registered trademark) contained in an 18 L steel can was used.
  • Example 2 From the results of Example 2, a plurality of types of contaminants are also contained in the unused fluorine-based cleaning liquid, and a higher-purity fluorine-based cleaning liquid can be obtained by purifying the fluorine-based cleaning liquid with a purification apparatus. I was able to confirm.
  • the electronic component cleaning method and cleaning system of the present invention are not limited to electronic components, but cut silicon wafers, ceramic wafers, and silicon wafers that require high cleaning with a high-purity fluorine-based cleaning solution.
  • Particularly suitable for cleaning electronic components such as silicon chips, ceramic chips obtained by cutting the ceramic wafer, glass substrates, metal substrates, color filter substrates, printed circuit boards and electronic components using these, and are always highly clean. It becomes possible to use the fluorinated cleaning liquid for a long period of time.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

A method of washing electronic components comprises a purifying step of purifying an unused fluorine-containing organic detergent composition liquid by a purifier and a washing step of washing electronic components using the purified detergent composition liquid supplied from the purifier into a washing device. In the purifying step, at least the organic contaminants are removed by a rectifying device and solid contaminants are removed by a filter device.

Description

電子部品の洗浄方法および洗浄システムElectronic component cleaning method and cleaning system
　本発明は、フッ素含有有機洗浄剤組成物液を用いて電子部品を洗浄する方法および洗浄システムに関する。 The present invention relates to a method and a cleaning system for cleaning an electronic component using a fluorine-containing organic cleaning composition liquid.
　従来、フッ素含有有機洗浄剤組成物液（以下、「フッ素系洗浄液」という場合がある）を用いて、シリコンウェハ、シリコンチップ、プリント基板等の電子部品を洗浄するための装置としては、蒸気脱脂洗浄装置が使用されている（例えば、特許文献１）。
　また、電子部品の洗浄に使用した、洗浄装置内の汚れたフッ素系洗浄液を、別に設けられた再生装置に投入して再生し、電子部品の洗浄に再び使用する方法も提案されている（例えば、特許文献２）。
米国特許第３，８８１，９４９号 特開２００１－１２９３０２号公報 Conventionally, as a device for cleaning electronic components such as silicon wafers, silicon chips, and printed boards using a fluorine-containing organic cleaning composition liquid (hereinafter sometimes referred to as “fluorine-based cleaning liquid”), vapor degreasing is used. A cleaning device is used (for example, Patent Document 1).
In addition, a method has also been proposed in which a dirty fluorine-based cleaning liquid in a cleaning device used for cleaning an electronic component is put into a regeneration device provided separately to be regenerated and used again for cleaning the electronic component (for example, Patent Document 2).
U.S. Pat.No. 3,881,949 JP 2001-129302 A
　近年、電子部品における素子や配線等の高密度化により、従来許容されていた素子や配線のパターン形成で発生する残滓の量も許容されなくなってきており、加えて、素子や配線のピッチ間隔が狭くなってきているため、フッ素系洗浄液の高純度化が求められている。
　一方、従来の蒸気脱脂洗浄装置では、汚れ成分が洗浄装置内に蓄積され、時間の経過とともに洗浄装置内のフッ素系洗浄液の洗浄能力が低下するため、未使用のフッ素系洗浄液あるいは再生したフッ素系洗浄液と頻繁に交換する必要があった。 In recent years, with the increase in the density of elements and wiring in electronic components, the amount of residue generated in the pattern formation of elements and wiring that has been permitted in the past has become unacceptable. Since it is becoming narrower, higher purity of the fluorine-based cleaning liquid is demanded.
On the other hand, in the conventional vapor degreasing cleaning device, dirt components are accumulated in the cleaning device, and the cleaning capability of the fluorine-based cleaning solution in the cleaning device decreases with time. Therefore, the unused fluorine-based cleaning solution or the regenerated fluorine-based cleaning device It was necessary to change frequently with the cleaning solution.
　しかしながら、未使用のフッ素系洗浄液は、通常容器に収容されてメーカーから使用現場まで輸送されるため、容器内の僅かな汚れ成分がフッ素系洗浄液中に混入すること、および該容器を開封して洗浄装置内へフッ素系洗浄液を投入する際に、フッ素系洗浄液が外部雰囲気と接触し、外部雰囲気中の汚れ成分がフッ素系洗浄液中に混入することが十分に考えられ、未使用のフッ素系洗浄液であっても、必ずしも要求される高い純度で使用されているとは言えない。
　また、再生したフッ素系洗浄液の場合も、再生後のフッ素系洗浄液が再生装置から容器に収容されて搬送される間、また容器を開封して洗浄装置内へフッ素系洗浄液が投入される間に、前記と同様にフッ素系洗浄液が汚染されるため、再生されたフッ素系洗浄液が要求される高い純度で使用されているとは言えない。
　したがって、より高密度化、微細化される傾向にある電子部品を洗浄するためには、より高い純度のフッ素系洗浄液を使用することが望まれている。 However, since unused fluorine-based cleaning liquid is usually contained in a container and transported from the manufacturer to the site of use, a slight contamination component in the container is mixed in the fluorine-based cleaning liquid, and the container is opened. When the fluorine-based cleaning liquid is introduced into the cleaning device, it is considered that the fluorine-based cleaning liquid comes into contact with the external atmosphere and dirt components in the external atmosphere are mixed into the fluorine-based cleaning liquid. However, it cannot be said that it is used with the required high purity.
Also, in the case of the regenerated fluorine-based cleaning liquid, the regenerated fluorine-based cleaning liquid is accommodated in the container from the regenerating apparatus and transported, and the container is opened and the fluorine-based cleaning liquid is introduced into the cleaning apparatus. Since the fluorine-based cleaning liquid is contaminated in the same manner as described above, it cannot be said that the regenerated fluorine-based cleaning liquid is used at the required high purity.
Therefore, it is desired to use a fluorine-based cleaning liquid having a higher purity in order to clean electronic components that tend to be denser and finer.
　本発明は、前記の課題に鑑みてなされたものであり、フッ素系洗浄液を高純度で使用することができる電子部品の洗浄方法、およびそれを用いた洗浄システムを提供することを目的とする。
　すなわち、本発明によれば、精製装置によって未使用のフッ素含有有機洗浄剤組成物液を精製する精製工程と、前記精製装置から洗浄装置内へ供給された精製後の洗浄剤組成物液を用いて電子部品を洗浄する洗浄工程とを含み、前記精製工程で、精留装置による有機性汚染物の除去およびフィルター装置による固体汚染物の除去が少なくとも行われて前記洗浄剤組成物液が精製され、このようにして精製された洗浄剤組成物液を用いて電子部品を洗浄する方法が提供される。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a method of cleaning an electronic component that can use a fluorine-based cleaning liquid with high purity, and a cleaning system using the same.
That is, according to the present invention, a purification step of purifying an unused fluorine-containing organic detergent composition liquid by a purification apparatus and a purified detergent composition liquid supplied from the purification apparatus into the cleaning apparatus are used. And cleaning the electronic component, and in the purification step, the organic composition is removed by a rectifying device and the solid contaminant is removed by a filter device to purify the cleaning composition liquid. There is provided a method of cleaning an electronic component using the thus-purified cleaning composition liquid.
　また、本発明の別の観点によれば、前記洗浄方法によって電子部品を洗浄するための洗浄システムであって、未使用のフッ素含有有機洗浄剤組成物液に含まれる汚染物を除去して精製する精製装置と、該精製装置により精製された前記洗浄剤組成物液を用いて電子部品を洗浄するための洗浄装置とを備え、前記精製装置が、有機性汚染物を除去する精留装置および固体汚染物を除去するフィルター装置を少なくとも備え、前記精留装置および前記フィルター装置に前記洗浄剤組成物液を通して精製するように構成された電子部品の洗浄システムが提供される。 According to another aspect of the present invention, there is provided a cleaning system for cleaning an electronic component by the cleaning method, wherein a contaminant contained in an unused fluorine-containing organic cleaning composition liquid is removed and purified. And a rectifying device for removing organic contaminants, and a cleaning device for cleaning an electronic component using the cleaning composition liquid purified by the purifying device. There is provided a cleaning system for an electronic component that includes at least a filter device for removing solid contaminants and is configured to purify the rectifying device and the filter device through the cleaning composition liquid.
　本発明によれば、フッ素含有有機洗浄剤組成物液（フッ素系洗浄液）のメーカーから輸送された未使用のフッ素系洗浄液を該容器から精製装置に投入し、精製装置にて未使用のフッ素系洗浄液中の汚れ成分を除去して該洗浄液を精製することができる。
　したがって、メーカーにおいて、微量の汚れ成分が付着した容器内にフッ素系洗浄液を充填したために、フッ素系洗浄液中に汚れ成分が混入しても、精製装置にてフッ素系洗浄液中の汚れ成分を除去して精製し、その精製した高純度のフッ素系洗浄液を外部雰囲気と接触させずに洗浄装置へ供給して電子部品を洗浄することができる。換言すると、本発明によれば、未使用のフッ素系洗浄液を原因とする電子部品の品質低下を防ぐことが可能となる。
　よって、本発明は、シリコンウェハ、セラミックウェハ、前記シリコンウェハを切断したシリコンチップ、前記セラミックウェハを切断したセラミックチップ、ガラス基板、金属基板、カラーフィルター基板、プリント基板およびこれらを用いた電子部品等の電子部品のより一層の高密度化、微細化に対応することができる。
　また、常時、高純度に清浄化されたフッ素系洗浄液で電子部品を洗浄することが可能となり、安定した洗浄品質を確保することができる。 According to the present invention, an unused fluorine-based cleaning liquid transported from a manufacturer of a fluorine-containing organic detergent composition liquid (fluorine-based cleaning liquid) is charged from the container into a purification apparatus, The cleaning liquid can be purified by removing the dirt component in the cleaning liquid.
Therefore, the manufacturer has filled the container with a small amount of dirt components with the fluorine-based cleaning liquid, so even if dirt components are mixed in the fluorine-based cleaning liquid, the purification equipment removes the dirt components in the fluorine-based cleaning liquid. The electronic component can be cleaned by supplying the purified high-purity fluorine-based cleaning liquid to the cleaning device without contacting the external atmosphere. In other words, according to the present invention, it is possible to prevent deterioration of the quality of electronic components caused by unused fluorine-based cleaning liquid.
Accordingly, the present invention provides a silicon wafer, a ceramic wafer, a silicon chip obtained by cutting the silicon wafer, a ceramic chip obtained by cutting the ceramic wafer, a glass substrate, a metal substrate, a color filter substrate, a printed circuit board, and an electronic component using these. It is possible to cope with higher density and miniaturization of electronic components.
In addition, it becomes possible to always clean electronic components with a fluorine-based cleaning liquid that has been cleaned to a high purity, and stable cleaning quality can be ensured.
本発明の洗浄システムの実施形態１を示す概略構成図である。It is a schematic block diagram which shows Embodiment 1 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態２を示す概略構成図である。It is a schematic block diagram which shows Embodiment 2 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態３を示す概略構成図である。It is a schematic block diagram which shows Embodiment 3 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態４を示す概略構成図である。It is a schematic block diagram which shows Embodiment 4 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態５を示す概略構成図である。It is a schematic block diagram which shows Embodiment 5 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態６を示す概略構成図である。It is a schematic block diagram which shows Embodiment 6 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態７を示す概略構成図である。It is a schematic block diagram which shows Embodiment 7 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態８を示す概略構成図である。It is a schematic block diagram which shows Embodiment 8 of the washing | cleaning system of this invention. 本発明の洗浄システムの実施形態９を示す概略構成図である。It is a schematic block diagram which shows Embodiment 9 of the washing | cleaning system of this invention.
符号の説明Explanation of symbols
　１０、１００、１００Ａ、１００Ｂ、１００Ｃ　洗浄装置
　１１、１１０　ボディ
　１２、１２０　洗浄槽
　１２ａ、１５０ａ　ヒータ
　１３、１３０　濯ぎ槽
　１３ａ、１３０ａ　超音波発生機
　１４、１４０ａ　蒸気凝縮部
　１４ａ、１４０ａ　凝縮管
　１４ｂ、１４０ｂ　樋部
　１４ｃ、２２、１４０ｃ、２２０　水分離器
　１７　シャワーノズル
　２０、２００　精製装置
　２１、２１０　向流型水接触カラム
　２３、２３０　吸湿剤カラム
　２４、２４０　イオン性汚染物除去カラム
　２５、１６０　蒸留塔
　２６、２６０　フィルター
　３０　再生装置
　３１　循環配管
　４１　精製用バッファータンク
　４２　再生用バッファータンク
　１２０ａ　ヒータもしくは超音波発生機
　１５０　蒸気発生槽
　Ｃ　フッ素含有有機洗浄剤組成物液（フッ素系洗浄液）
　Ｓ　蒸気層 10, 100, 100A, 100B, 100C Cleaning device 11, 110 Body 12, 120 Cleaning tank 12a, 150a Heater 13, 130 Rinsing tank 13a, 130a Ultrasonic generator 14, 140a Steam condensing part 14a, 140a Condensation pipes 14b, 140b Saddle 14c, 22, 140c, 220 Water separator 17 Shower nozzle 20, 200 Purification device 21, 210 Counter-current water contact column 23, 230 Hygroscopic column 24, 240 Ionic contaminant removal column 25, 160 Distillation tower 26 , 260 Filter 30 Regenerator 31 Circulation piping 41 Purification buffer tank 42 Regeneration buffer tank 120a Heater or ultrasonic generator 150 Steam generation tank C Fluorine-containing organic detergent composition liquid (fluorine-based cleaning liquid)
S vapor layer
　本発明の電子部品の洗浄方法は、精製装置によって未使用のフッ素含有有機洗浄剤組成物液を精製する精製工程と、前記精製装置から洗浄装置内へ供給された精製後の洗浄剤組成物液を用いて電子部品を洗浄する洗浄工程とを含み、前記精製工程で、精留装置による有機性汚染物の除去およびフィルター装置による固体汚染物の除去が少なくとも行われ、水洗浄装置による水溶性汚染物の除去を任意に行なってもよい。 The method for cleaning an electronic component according to the present invention includes a purification step of purifying an unused fluorine-containing organic cleaning composition liquid by a purification apparatus, and a purified cleaning composition liquid supplied from the purification apparatus into the cleaning apparatus. In the purification process, at least removal of organic contaminants by a rectifying device and removal of solid contaminants by a filter device are performed, and water-soluble contamination by a water cleaning device is performed. You may remove the thing arbitrarily.
　前記精製工程において、有機性汚染物、水溶性汚染物、固体汚染物を除去する順は任意であるが、効率的に各汚染物を除去できる観点から、有機性汚染物、水溶性汚染物、固体汚染物の順、または水溶性汚染物、有機性汚染物、固体汚染物の順で除去して、洗浄剤組成物液を精製することが好ましい。 In the purification step, the order of removing organic contaminants, water-soluble contaminants, solid contaminants is arbitrary, but from the viewpoint of efficiently removing each contaminant, organic contaminants, water-soluble contaminants, It is preferable to purify the detergent composition liquid by removing in the order of solid contaminants, or in the order of water-soluble contaminants, organic contaminants, and solid contaminants.
　この洗浄方法は、被洗浄物を限定するものではないが、高純度のフッ素系洗浄液による高清浄化が要求されるようなシリコンウェハ、セラミックウェハ、前記シリコンウェハを切断したシリコンチップ、前記セラミックウェハを切断したセラミックチップ、ガラス基板、金属基板、カラーフィルター基板、プリント基板およびこれらを用いた電子部品等の電子部品を洗浄するのに好適である。
　この洗浄方法は、その他の被洗浄物、例えば液晶セル、ＰＤＰパネル、スタンパ、モールド、磁気ヘッド、ＶＣＭ（ボイスコイルモーター）、ＨＳＡ（ヘッドスタックアッセンブリー）、カセット等の洗浄方法としても用いることができる。 Although this cleaning method does not limit the object to be cleaned, a silicon wafer, a ceramic wafer, a silicon chip obtained by cutting the silicon wafer, and the ceramic wafer are required to be highly cleaned with a high-purity fluorine-based cleaning liquid. It is suitable for cleaning electronic components such as cut ceramic chips, glass substrates, metal substrates, color filter substrates, printed boards and electronic components using these.
This cleaning method can also be used as a cleaning method for other objects to be cleaned, such as liquid crystal cells, PDP panels, stampers, molds, magnetic heads, VCMs (voice coil motors), HSAs (head stack assemblies), and cassettes. .
　本発明において、フッ素系洗浄液としては、電子部品の洗浄に適したものを用いることができる。
　フッ素含有有機洗浄剤組成物液としては、分子量が１０００未満で骨格中に炭素原子およびフッ素原子を含み、室温において液状で揮発性を有するフッ素化合物が挙げられる。このフッ素化合物は、特に限定されないが、地球温暖化防止の観点から、大気中での寿命を短くするために、さらに水素原子を含有していることが好ましい。さらに、酸素原子、硫黄原子、窒素原子等のヘテロ原子を含有していてもよい。炭素骨格は、直鎖状、分枝鎖状または環状のいずれでもよく、二重結合または三重結合を有していてもよい。 In the present invention, as the fluorine-based cleaning liquid, those suitable for cleaning electronic components can be used.
Examples of the fluorine-containing organic detergent composition liquid include fluorine compounds that have a molecular weight of less than 1000, contain carbon atoms and fluorine atoms in the skeleton, and are liquid and volatile at room temperature. The fluorine compound is not particularly limited, but preferably contains hydrogen atoms in order to shorten the lifetime in the atmosphere from the viewpoint of preventing global warming. Furthermore, you may contain hetero atoms, such as an oxygen atom, a sulfur atom, and a nitrogen atom. The carbon skeleton may be linear, branched or cyclic, and may have a double bond or a triple bond.
　このような特性を有するフッ素系洗浄液としては、例えば、ノナフルオロブチルメチルエーテル、1,1,1,2,2,3,4,5,5,5-デカフルオロプロパン、1,2,2,2-テトラフルオロエチル-2,2,2-トリフルオロメチルエーテル、1,1,1,3,3-ペンタフルオロブタン、1,1,2,2,3,3,4-ヘプタフルオロシクロペンタン、ジクロロペンタフルオロプロパン等が挙げられ、これらの中でも1,1,1,2,2,3,4,5,5,5-デカフルオロプロパンが好ましい。
　また、本発明において、フッ素系洗浄液は、１種または２種以上のフッ素系洗浄液の混合液でもよい。
　さらに、フッ素系洗浄液と他の有機溶剤の１種または２種類以上の混合液であってもよい。有機溶剤としては、例えば、２－プロパノール、エタノール等のアルコール類、アセトン等のケトン類、ジエチルエーテル等のエーテル類、酢酸等の有機酸類、酢酸エチル等のエステル類、ジクロロエチレン、ジクロロペンタフルオロプロパン等のハロゲン化炭化水素類等が挙げられる。
　電子部品や汚れの種類によっては、フッ素系洗浄液と水溶性有機溶剤（例えばアルコール）との混合物（共沸混合物）を洗浄液として使用する場合がある。この場合、前記精製工程は水溶性汚染物の除去工程を含まないものとされる。
　また、フッ素系洗浄液が、共沸組成を有する混合物である場合には、共沸組成での混合比が望ましい。 Examples of the fluorine-based cleaning liquid having such characteristics include nonafluorobutyl methyl ether, 1,1,1,2,2,3,4,5,5,5-decafluoropropane, 1,2,2, 2-tetrafluoroethyl-2,2,2-trifluoromethyl ether, 1,1,1,3,3-pentafluorobutane, 1,1,2,2,3,3,4-heptafluorocyclopentane, Examples thereof include dichloropentafluoropropane, among which 1,1,1,2,2,3,4,5,5,5-decafluoropropane is preferable.
In the present invention, the fluorine-based cleaning liquid may be a mixture of one or more fluorine-based cleaning liquids.
Further, it may be one or a mixture of two or more of a fluorine-based cleaning liquid and another organic solvent. Examples of the organic solvent include alcohols such as 2-propanol and ethanol, ketones such as acetone, ethers such as diethyl ether, organic acids such as acetic acid, esters such as ethyl acetate, dichloroethylene, dichloropentafluoropropane, etc. And halogenated hydrocarbons.
Depending on the type of electronic component or dirt, a mixture (azeotropic mixture) of a fluorine-based cleaning liquid and a water-soluble organic solvent (for example, alcohol) may be used as the cleaning liquid. In this case, the purification step does not include a water-soluble contaminant removal step.
In addition, when the fluorine-based cleaning liquid is a mixture having an azeotropic composition, a mixing ratio in the azeotropic composition is desirable.
　次に、この洗浄方法によって電子部品を洗浄するための本発明の洗浄システムについて説明する。
　この洗浄システムは、未使用のフッ素含有有機洗浄剤組成物液に含まれる汚染物を除去して精製する精製装置と、該精製装置により精製された前記洗浄剤組成物液を用いて電子部品を洗浄するための洗浄装置とを備え、前記精製装置が、有機性汚染物を除去する精留装置および固体汚染物を除去するフィルター装置を少なくとも備え、前記精留装置および前記フィルター装置に前記洗浄剤組成物液を通して精製するように構成されており、水溶性汚染物を除去する水洗浄装置および水分を除去する水分除去装置をさらに備えていてもよい。 Next, the cleaning system of the present invention for cleaning electronic components by this cleaning method will be described.
This cleaning system includes a purification device that removes and purifies contaminants contained in an unused fluorine-containing organic cleaning composition liquid, and an electronic component using the cleaning composition liquid purified by the purification apparatus. A cleaning device for cleaning, wherein the purification device includes at least a rectifying device for removing organic contaminants and a filter device for removing solid contaminants, and the cleaning agent is provided in the rectifying device and the filter device. It is comprised so that it may refine | purify through a composition liquid, and may further be equipped with the water washing apparatus which removes a water-soluble contaminant, and the water removal apparatus which removes a water | moisture content.
　前記精製装置において、精留装置、水洗浄装置、水分除去装置、フィルター装置の配置順序は任意であるが、前記のように各汚染物を効率的に除去できる観点から、精製装置は、精留装置、水洗浄装置、水分除去装置およびフィルター装置の順、または水洗浄装置、水分除去装置、精留装置およびフィルター装置の順に前記洗浄剤組成物液を通して精製するように構成されることが好ましい。 In the purification apparatus, the rectification apparatus, the water washing apparatus, the water removal apparatus, and the filter apparatus may be arranged in any order. However, from the viewpoint of efficiently removing each contaminant as described above, the purification apparatus is a rectification apparatus. The apparatus is preferably configured to purify through the detergent composition liquid in the order of apparatus, water cleaning apparatus, moisture removing apparatus and filter apparatus, or in the order of water cleaning apparatus, moisture removing apparatus, rectifying apparatus and filter apparatus.
（洗浄装置の説明）
　本発明において、前記洗浄装置は、電子部品に付着した汚れを除去するためのフッ素系洗浄液を収容し、かつ洗浄装置内で電子部品を洗浄するように構成されたものであればよく、特に限定されるものではない。
　洗浄装置としては、例えば、精製装置により精製されたフッ素系洗浄液が供給される濯ぎ槽と、該濯ぎ槽から溢れ出たフッ素系洗浄液を受容しかつ加熱する洗浄槽と、該洗浄槽内で加熱されて気化したフッ素系洗浄液の蒸気が滞留する蒸気滞留部と、該蒸気滞留部の蒸気を凝縮させて前記濯ぎ槽に還流させる蒸気凝縮部とを備え、かつ前記洗浄槽内のフッ素系洗浄液中に電子部品を浸漬して洗浄し、洗浄した電子部品を前記濯ぎ槽内のフッ素系洗浄液中に浸漬して濯ぎ、濯いだ電子部品を蒸気滞留部の前記蒸気にて蒸気洗浄するように構成されたものが挙げられる。
　具体的には、例えば、特開平８－２４３５１５号公報、特開平１０－１９２７９７号公報等に記載された公知の多槽式洗浄装置を用いることができる。 (Description of cleaning device)
In the present invention, the cleaning device is not particularly limited as long as it contains a fluorine-based cleaning liquid for removing dirt attached to the electronic component and is configured to clean the electronic component in the cleaning device. Is not to be done.
As the cleaning device, for example, a rinsing tank to which a fluorine-based cleaning liquid purified by a purification device is supplied, a cleaning tank that receives and heats the fluorine-based cleaning liquid overflowing from the rinsing tank, and heating in the cleaning tank A vapor retaining part in which the vapor of the vaporized fluorine-based cleaning liquid stays, and a steam condensing part for condensing the steam in the steam-retaining part and returning it to the rinsing tank, and in the fluorine-based cleaning liquid in the cleaning tank An electronic component is immersed and washed in the cleaning tank, and the cleaned electronic component is immersed and rinsed in a fluorine-based cleaning solution in the rinsing tank, and the rinsed electronic component is steam-washed with the steam in the steam retaining portion. The thing which was done is mentioned.
Specifically, for example, a known multi-tank cleaning apparatus described in JP-A-8-243515, JP-A-10-192797 and the like can be used.
　また、洗浄装置は、シャワーノズルをさらに備え、精製装置により精製されたフッ素系洗浄液を前記シャワーノズルから噴出して、前記蒸気洗浄後の電子部品をシャワー洗浄するように構成されていてもよい。
　このように構成すれば、本発明の洗浄システムによる電子部品の清浄度をより高めることができる。 The cleaning device may further include a shower nozzle, and the fluorine-based cleaning liquid purified by the purification device may be ejected from the shower nozzle to shower-wash the electronic component after the steam cleaning.
If comprised in this way, the cleanliness of the electronic component by the washing | cleaning system of this invention can be raised more.
（精製装置の説明）
　本発明における前記精製装置は、未使用のフッ素系洗浄液中に混入した汚れ成分を、その汚れの種類に応じて除去するものであり、前記のように、有機性汚染物を除去する精留装置および固体汚染物を除去するフィルター装置を少なくとも備え、さらに、水溶性汚染物を除去する水洗浄装置、水分を除去する水分除去装置およびイオン性汚染物を除去するイオン性汚染物除去装置を具備していてもよい。 (Description of purification equipment)
The purification apparatus according to the present invention removes dirt components mixed in an unused fluorine-based cleaning liquid according to the kind of the dirt, and as described above, a rectification apparatus that removes organic contaminants. And a filter device that removes solid contaminants, and further includes a water cleaning device that removes water-soluble contaminants, a moisture removal device that removes moisture, and an ionic contaminant removal device that removes ionic contaminants. It may be.
　本発明において、汚染物の種類としては、前記有機性汚染物、水溶性汚染物、イオン性汚染物、固体汚染物が挙げられる。これら各種の汚染物として、具体的には次のようなものが挙げられる。
　有機性汚染物としては、フッ素オイル（例えば、クライトックス（登録商標））、フッ素ポリマー等が挙げられる。
　水溶性汚染物としては、イソプロピルアルコール、エタノール等のアルコール類、アセトン等のケトン類等が挙げられる。
　イオン性汚染物としては、フッ素イオン、硝酸イオン、炭酸水素イオン、アンモニウムイオン、ナトリウムイオン等のイオン類が挙げられる。
　固体汚染物としては、プラスチックやエラストマー等の有機高分子化合物粒子、金属粒子、ダスト等が挙げられる。
　以下、精製装置の具体構成について説明する。なお、精製装置は、前記以外の性質の汚染物を除去する装置を有していてもよいことは言うまでもない。 In the present invention, the types of contaminants include the organic contaminants, water-soluble contaminants, ionic contaminants, and solid contaminants. Specific examples of these various contaminants include the following.
Examples of the organic contaminant include fluorine oil (for example, Krytox (registered trademark)), fluorine polymer, and the like.
Examples of water-soluble contaminants include alcohols such as isopropyl alcohol and ethanol, and ketones such as acetone.
Examples of ionic contaminants include ions such as fluorine ions, nitrate ions, hydrogen carbonate ions, ammonium ions, and sodium ions.
Examples of solid contaminants include organic polymer compound particles such as plastics and elastomers, metal particles, and dust.
Hereinafter, a specific configuration of the purification apparatus will be described. Needless to say, the purification apparatus may have an apparatus for removing contaminants other than those described above.
＜精留装置＞
　精留装置としては、フッ素系洗浄液の沸点と有機性汚染物の沸点との差（以下、「沸点差」という）を利用した熱交換作用によって、未使用のフッ素系洗浄液中に含まれる有機性汚染物を除去するように構成することができる。
　例えば、沸点差が小さい場合には、フッ素系洗浄液と有機性汚染物との分離には複数回の熱交換作用が必要になり、高度の還流機能を有する精留装置が選択され、沸点差が大きい場合には、単蒸留装置またはフッ素系洗浄液を沸騰させずに加温する加温装置が選択される。
　このように、精留装置は、フッ素系洗浄液と有機性汚染物の沸点差または電子部品に要求される清浄度によって最適な装置が適宜選択される。
　なお、精留装置（例えば、蒸留装置）が洗浄装置に一体化されている場合は、精製装置から精留装置を省略することができる。 <Rectifying device>
As a rectifying device, organic substances contained in unused fluorine-based cleaning liquids are obtained by heat exchange using the difference between the boiling point of fluorine-based cleaning liquids and the boiling point of organic contaminants (hereinafter referred to as “boiling point difference”). It can be configured to remove contaminants.
For example, when the boiling point difference is small, a heat exchange action is required multiple times for the separation of the fluorine-based cleaning liquid and the organic contaminants, and a rectification apparatus having a high reflux function is selected, and the boiling point difference is reduced. If larger, a simple distillation apparatus or a heating apparatus that heats the fluorine-based cleaning liquid without boiling is selected.
As described above, the rectifying apparatus is appropriately selected depending on the difference in boiling point between the fluorine-based cleaning liquid and the organic contaminant or the cleanliness required for the electronic component.
In addition, when the rectification apparatus (for example, distillation apparatus) is integrated with the washing | cleaning apparatus, a rectification apparatus can be abbreviate | omitted from a refinement | purification apparatus.
＜水洗浄装置＞
　フッ素系洗浄液中に含まれる水溶性汚染物の除去には、フッ素系洗浄液を水と接触させて水溶性汚染物を水に溶かし込むことが効果的であるため、水洗浄装置としては水接触装置が好適である。接触方法は特に限定されないが、簡便性、取扱い性を考慮すれば、向流型接触方式が好ましい。
　このような水接触装置としては、例えば、上流端に洗浄液流入口および水排出口を有し、かつ下流端に洗浄液排出口および水流入口を有する筒体の内部に、複数の仕切り板を配置するか、あるいは充填物を充填することにより、内部流路でのフッ素系洗浄液と水との接触率を高めた構成の水接触装置が挙げられる。このような構成の水接触装置は、上流端を上部に配置し、かつ下流端を下部に配置し、下方から上方へ向かって流れる水流中にフッ素系洗浄液を上方から下方へ流し入れる向流型接触方式とすることが好ましい。 <Water cleaning device>
To remove water-soluble contaminants contained in the fluorine-based cleaning solution, it is effective to bring the fluorine-based cleaning solution into contact with water and dissolve the water-soluble contaminants in water. Is preferred. The contact method is not particularly limited, but a counter-current contact method is preferable in view of simplicity and handling.
As such a water contact device, for example, a plurality of partition plates are arranged inside a cylinder having a cleaning liquid inlet and a water outlet at the upstream end and a cleaning liquid outlet and a water inlet at the downstream end. Or the water contact apparatus of the structure which raised the contact rate of the fluorine-type washing | cleaning liquid and water in an internal flow path by filling with a filling material is mentioned. The water contact device having such a configuration has a counter-current type contact in which an upstream end is arranged at the upper part and a downstream end is arranged at the lower part, and the fluorine-based cleaning liquid is poured from the upper part to the lower part in the water stream flowing from the lower part to the upper part. It is preferable to adopt a method.
　また、フッ素系洗浄液を水と接触させることにより、フッ素系洗浄液中には微量ではあるが水が溶解するため、水接触装置の下流側にフッ素系洗浄液中の水分を除去する前記水分除去装置が併設される。
　なお、前記のように、洗浄液がフッ素系洗浄液と水溶性有機溶剤との混合物からなる場合は、水洗浄装置および水分除去装置は精製装置から省略される。 Further, when the fluorine-based cleaning liquid is brought into contact with water, water is dissolved in the fluorine-based cleaning liquid in a small amount, but the moisture removing device for removing water in the fluorine-based cleaning liquid is provided downstream of the water contact device. It is attached.
As described above, when the cleaning liquid is composed of a mixture of a fluorine-based cleaning liquid and a water-soluble organic solvent, the water cleaning device and the water removing device are omitted from the purification device.
＜水分除去装置＞
　水分除去装置としては、例えば、上流端に洗浄液流入口を有し、かつ下流端に洗浄液排出口を有する筒体の内部に、ゼオライトに代表される粒状吸湿材を充填した構成の水分除去装置が挙げられる。なお、水溶性汚染物がイオン性も有している場合、前記水接触装置および水分除去装置による水溶性汚染物除去は、イオン性汚染物除去も兼ねることとなる。 <Moisture removal device>
As the moisture removing device, for example, a moisture removing device having a structure in which a granular moisture absorbent typified by zeolite is filled inside a cylinder having a cleaning liquid inlet at the upstream end and a cleaning liquid discharge port at the downstream end. Can be mentioned. In addition, when the water-soluble contaminant also has ionicity, the water-soluble contaminant removal by the water contact device and the water removing device also serves as ionic contaminant removal.
　また、吸湿材の水分吸着量には限界があるため、水分除去装置は、吸湿材に吸着された水分を外部に排出するための水分排出手段を具備していてもよい。
　この水分排出手段としては、例えば、水分除去装置の上流端および下流端に形成された空気流入口および空気排出口と、空気流入口に熱風を送り込む熱風供給装置、あるいは空気流入口に室温の空気を送り込む送風機および筒体に巻きつけられて内部を加熱するバンドヒータを備え、筒体に加熱された空気を通すことよって吸湿材を乾燥させるように構成されたものを用いることができる。
　また、水分除去装置は、並列に２つ以上設置されていることが好ましい。このようにすれば、１つの水分除去装置の吸湿材が乾燥中であるときに、もう１つの水分除去装置にてフッ素系洗浄液中の水分の除去を行うことができるため、精製装置によるフッ素系洗浄液の清浄化効率を高めることができる。 Further, since there is a limit to the amount of moisture adsorbed by the hygroscopic material, the moisture removing device may include a moisture discharging means for discharging the moisture adsorbed on the hygroscopic material to the outside.
Examples of the moisture discharge means include an air inlet and an air outlet formed at the upstream end and the downstream end of the moisture removing device, a hot air supply device that sends hot air to the air inlet, or room temperature air at the air inlet. What is comprised is equipped with the band heater wound around the blower which sends in and a cylinder, and the inside is heated, and the moisture absorption material is dried by letting the heated air pass through a cylinder.
Moreover, it is preferable that two or more moisture removal apparatuses are installed in parallel. In this way, when the moisture absorbent material of one moisture removing device is being dried, the moisture in the fluorine-based cleaning liquid can be removed by the other moisture removing device. The cleaning liquid cleaning efficiency can be increased.
　また、筒体の周囲壁の一部を透明窓で構成し、かつ青色シリカゲルに代表されるような飽和指示材を吸湿材と混合しておくことによって、飽和指示材の色によって吸湿材の吸湿度合い（乾燥度合い）を目視できるようにしてもよい。あるいは、水分除去装置の下流側に水分測定装置を設置し、乾燥に供した空気中の水分率を水分測定装置によって測定することによって吸湿材の乾燥度合いを調べるようにしてもよい。
　さらに、吸湿材による水分除去効率を向上させるために、フッ素系洗浄液の比重とフッ素系洗浄液中に溶解している水分との比重の差を利用してフッ素系洗浄液と水とを分離する水分離器を、水接触装置と水分除去装置との間に設置してもよい。 In addition, a part of the peripheral wall of the cylinder is formed of a transparent window, and a saturated indicator such as blue silica gel is mixed with the hygroscopic material, so that the moisture absorbent absorbs moisture depending on the color of the saturated indicator. You may make it visible visually (degree of drying). Alternatively, a moisture measuring device may be installed on the downstream side of the moisture removing device, and the moisture content in the air used for drying may be measured by the moisture measuring device to examine the degree of drying of the moisture absorbent.
Furthermore, in order to improve the moisture removal efficiency by the hygroscopic material, water separation that separates the fluorine-based cleaning liquid and water using the difference in specific gravity between the fluorine-based cleaning liquid and the water dissolved in the fluorine-based cleaning liquid A vessel may be installed between the water contact device and the water removal device.
＜イオン性汚染物除去装置＞
　イオン性汚染物除去装置としては、例えば、上流端に洗浄液流入口を有し、かつ下流端に洗浄液排出口を有する筒体の内部に、アルミナゲルを充填した構成のイオン性汚染物除去装置が挙げられる。 <Ionic contaminant removal device>
As the ionic contaminant removal apparatus, for example, an ionic contaminant removal apparatus having a configuration in which alumina gel is filled inside a cylinder having a cleaning liquid inlet at the upstream end and a cleaning liquid discharge outlet at the downstream end is provided. Can be mentioned.
＜フィルター装置＞
　固体汚染物を除去するフィルター装置としては、フッ素系洗浄液を通過させる筒体内に精密ろ過膜、限外ろ過膜等が設けられたフィルター装置が挙げられる。この場合、フィルター装置にて除去された固体汚染物は、フィルターの交換により筒体内から外部ヘ排出される。なお、複数の同じろ過膜あるいは異なるろ過膜を組み合わせて用いてもよい。 <Filter device>
Examples of the filter device for removing solid contaminants include a filter device in which a microfiltration membrane, an ultrafiltration membrane, and the like are provided in a cylinder through which a fluorine-based cleaning liquid passes. In this case, the solid contaminants removed by the filter device are discharged from the cylindrical body to the outside by replacing the filter. A plurality of the same filtration membranes or different filtration membranes may be used in combination.
　本洗浄システムにおける精製装置は、前記の各種汚染物を効率よく除去する観点から、上流から下流に向かって、精留装置、水洗浄装置、水分除去装置およびフィルター装置の順、または水洗浄装置、水分除去装置、精留装置およびフィルター装置の順に各装置が配管にて連続的に接続されていることが好ましい。なお、精製装置がイオン性汚染物除去装置を有する場合には、水洗浄装置と水分除去装置との間以外であれば、イオン性汚染物除去装置の設置位置は特に限定されない。 From the viewpoint of efficiently removing the various contaminants described above, the purification apparatus in the present cleaning system is, in order from the upstream to the downstream, the rectification apparatus, the water cleaning apparatus, the water removing apparatus, and the filter apparatus in this order, or the water cleaning apparatus, It is preferable that each device is connected continuously by piping in the order of the moisture removing device, the rectifying device, and the filter device. In addition, when a refinement | purification apparatus has an ionic contaminant removal apparatus, if it is except between a water washing apparatus and a water | moisture-content removal apparatus, the installation position of an ionic contaminant removal apparatus is not specifically limited.
＜その他の構成＞
　本洗浄システムは、洗浄装置内で電子部品の洗浄に使用した使用済みのフッ素系洗浄液を再生する再生装置をさらに備え、再生装置が循環配管にて洗浄装置と接続され、使用済みのフッ素系洗浄液が洗浄装置から再生装置へ送られて再生され、再生されたフッ素系洗浄液が再生装置から洗浄装置へ循環供給されるように構成されていてもよい。
　このように再生装置を洗浄システムに一体的に組み込むことにより、使用済みの汚れたフッ素系洗浄液を洗浄装置から循環配管を通して再生装置へ移送し、再生処理されたフッ素系洗浄液を再生装置から循環配管を通して洗浄装置へ移送することができる。その結果、フッ素系洗浄液の移送を容易かつ短時間に行うことができることに加え、再生処理されたフッ素系洗浄液を外部環境に接触させずに洗浄装置へ移送することができるため、外部から洗浄液中への汚染物の混入を回避できる。 <Other configurations>
The cleaning system further includes a regeneration device that regenerates the used fluorine-based cleaning liquid used for cleaning the electronic components in the cleaning device, and the regeneration device is connected to the cleaning device by a circulation pipe, and the used fluorine-based cleaning liquid. May be configured to be supplied from the cleaning device to the regenerator and regenerated, and the regenerated fluorine-based cleaning liquid is circulated and supplied from the regenerator to the cleaning device.
By integrating the regenerator into the cleaning system in this way, the used dirty fluorine-based cleaning liquid is transferred from the cleaning apparatus to the regenerator through the circulation pipe, and the regenerated fluorine-based cleaning liquid is recirculated from the regenerator to the circulation pipe. Through the cleaning device. As a result, in addition to being able to transfer the fluorine-based cleaning liquid easily and in a short time, the regenerated fluorine-based cleaning liquid can be transferred to the cleaning device without contacting the external environment. It is possible to avoid contamination by contaminants.
　本発明において、再生装置は、使用済みのフッ素系洗浄液中に含まれる各種の汚染物を除去できるものであればよく、さらに好ましくは、使用前の純度と同程度の高い純度のフッ素系洗浄液に再生できるものであればよい。
　例えば、使用済みのフッ素系洗浄液中に有機性汚染物、水溶性汚染物、イオン性汚染物、固体汚染物が含まれている場合、再生装置はこれら各種の汚染物を全て除去するものでなければならず、例えば、特開２００１－１２９３０２号公報に記載の再生装置を洗浄装置と循環配管にて接続することができる。 In the present invention, the regenerator only needs to be able to remove various contaminants contained in the used fluorine-based cleaning liquid, and more preferably, the regenerating apparatus is a high-purity fluorine-based cleaning liquid similar to the purity before use. Anything that can be reproduced is acceptable.
For example, if the used fluorine-based cleaning liquid contains organic contaminants, water-soluble contaminants, ionic contaminants, or solid contaminants, the regenerator must remove all these contaminants. For example, the regenerator described in Japanese Patent Laid-Open No. 2001-129302 can be connected to the cleaning device by a circulation pipe.
　また、本洗浄システムは、フッ素系洗浄液を一時的に貯留するバッファータンクが、前記精製装置と前記洗浄装置との間および前記洗浄装置と前記再生装置との間の少なくとも一方にさらに備えられていてもよい。
　精製用バッファータンクを精製装置の下流側に設けた場合、洗浄装置による洗浄工程と並行して、次のバッチ洗浄処理のために、精製済みの未使用のフッ素系洗浄液を精製用バッファータンク内へ貯留しておくことができる。したがって、洗浄装置内の汚れた使用済みフッ素系洗浄液を新しいフッ素系洗浄液と交換する、または使用済みフッ素系洗浄液を再生装置にて再生処理する際に、精製用バッファータンク内の精製済みのフッ素系洗浄液を次のバッチの洗浄処理に供することができ、洗浄処理を効率よく行うことができる。 In the cleaning system, a buffer tank for temporarily storing a fluorine-based cleaning liquid is further provided between at least one of the purification device and the cleaning device and between the cleaning device and the regeneration device. Also good.
When a purification buffer tank is installed on the downstream side of the purification device, in parallel with the cleaning process by the cleaning device, the purified, unused fluorine-based cleaning solution is put into the purification buffer tank for the next batch cleaning process. Can be stored. Therefore, when the dirty used fluorine-based cleaning solution in the cleaning device is replaced with a new fluorine-based cleaning solution, or when the used fluorine-based cleaning solution is regenerated in the regenerator, the purified fluorine-based cleaning solution in the purification buffer tank is used. The cleaning liquid can be used for the next batch cleaning process, and the cleaning process can be performed efficiently.
　また、再生用バッファータンクを再生装置の上流側に設けた場合、洗浄装置内の汚れた使用済みフッ素系洗浄液を再生装置にて再生処理する際に、使用済みフッ素系洗浄液を再生用バッファータンクに移送しながら、精製装置から精製済みフッ素系洗浄液を洗浄装置へ供給し、洗浄装置による洗浄工程の間に、再生用バッファータンクから再生装置へ使用済みフッ素系洗浄液を供給して再生処理を行うことができる。なお、再生装置の下流側にも第２の再生用バッファータンクを設ければ、再生したフッ素系洗浄液をその第２の再生用バッファータンクに連続的に送り込んで、次の洗浄バッチ用として貯留しておくことができる。
　また、精製用と再生用のバッファータンクを両方設けた場合は、各バッファータンクによる前記の利点を得ることができ、より効率よく洗浄処理を行うことができる。 In addition, when a regeneration buffer tank is provided on the upstream side of the regenerator, the used fluorine-based cleaning liquid is put into the regenerator buffer tank when the dirty spent fluorine-based cleaning liquid in the cleaning device is regenerated by the regenerator. While transporting, supply the purified fluorine-based cleaning solution from the purification device to the cleaning device, and supply the used fluorine-based cleaning solution from the regeneration buffer tank to the regeneration device during the cleaning process by the cleaning device to perform the regeneration process. Can do. If a second regeneration buffer tank is provided on the downstream side of the regenerator, the regenerated fluorine-based cleaning liquid is continuously sent to the second regeneration buffer tank and stored for the next cleaning batch. I can keep it.
Further, when both the purification and regeneration buffer tanks are provided, the above-described advantages of each buffer tank can be obtained, and the washing process can be performed more efficiently.
　本発明の洗浄システムは、前記の各汚染物除去装置を配管で連続的に接続した精製装置と、洗浄装置とを配管にて接続して一体化することにより、未使用のフッ素系洗浄液から連続的に各種の汚染物を除去して精製した高純度のフッ素系洗浄液を、外部環境と接触させることなくそのまま洗浄装置に供給することができる。
　なお、本洗浄システムにおいて、フッ素系洗浄液の移送が滞らないように、例えばポンプ式またはエアー式の移送手段を配管の途中に設けてもよく、あるいは重力差によってフッ素系洗浄液を移送するようにしてもよい。 In the cleaning system of the present invention, the purification apparatus in which each of the contaminant removing apparatuses is continuously connected by piping and the cleaning apparatus are connected and integrated by piping, thereby continuously from the unused fluorine-based cleaning liquid. In addition, a high-purity fluorine-based cleaning liquid that has been purified by removing various contaminants can be directly supplied to the cleaning apparatus without being brought into contact with the external environment.
In this cleaning system, for example, a pump-type or air-type transfer means may be provided in the middle of the pipe so that the transfer of the fluorine-based cleaning liquid is not delayed, or the fluorine-based cleaning liquid is transferred by a gravity difference. Also good.
（洗浄方法の説明）
　前記のように構成された洗浄システムにて電子部品を洗浄する、本発明の洗浄方法は、洗浄装置から排出されたフッ素系洗浄液を再生装置にて再生して洗浄装置へ循環供給する洗浄液再生工程をさらに含んでいてもよい。
　また、精製されたフッ素系洗浄液を精製装置から洗浄装置へ補給する洗浄液補給工程を含んでいてもよい。
　また、洗浄工程が、洗浄槽内のフッ素系洗浄液中に電子部品を浸漬して洗浄し、洗浄した電子部品を濯ぎ槽内のフッ素系洗浄液中に浸漬して濯ぎ、濯いだ電子部品を蒸気滞留部の蒸気にて蒸気洗浄し、蒸気洗浄した電子部品をシャワーノズルからの精製済みフッ素系洗浄液によってシャワー洗浄するものであってもよい。 (Description of cleaning method)
The cleaning method of the present invention, in which the electronic component is cleaned by the cleaning system configured as described above, is a cleaning liquid regeneration step in which the fluorine-based cleaning liquid discharged from the cleaning apparatus is regenerated by the regenerating apparatus and circulated to the cleaning apparatus May further be included.
Moreover, you may include the washing | cleaning liquid replenishment process which replenishes the refine | purified fluorine-type washing | cleaning liquid from a refiner | purifier to a washing | cleaning apparatus.
In the cleaning process, the electronic component is immersed and cleaned in the fluorine-based cleaning liquid in the cleaning tank, the cleaned electronic component is immersed in the fluorine-based cleaning liquid in the rinsing tank and rinsed, and the rinsed electronic component is vaporized. The electronic component that has been subjected to vapor cleaning with the vapor in the staying portion and then subjected to vapor cleaning may be subjected to shower cleaning with a purified fluorine-based cleaning liquid from a shower nozzle.
　以下、図面を参照しながら本発明の実施形態を詳しく説明する。なお、本発明は以下に例示したものに限定されるものではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, this invention is not limited to what was illustrated below.
（実施形態１）
　図１は本発明の洗浄システムの実施形態１を示す概略構成図である。
　実施形態１の洗浄システムは、洗浄装置１０と、洗浄装置１０と配管にて接続された精製装置２０とから構成されている。 (Embodiment 1)
FIG. 1 is a schematic configuration diagram showing Embodiment 1 of the cleaning system of the present invention.
The cleaning system according to the first embodiment includes a cleaning device 10 and a purification device 20 connected to the cleaning device 10 by piping.
　洗浄装置１０は、上方開口状のボディ１１と、ボディ１１内の下部に配置された洗浄槽１２および濯ぎ槽１３と、ボディ１１の上部開口縁に沿って配置された蒸気凝縮部１４とを備え、洗浄槽１２および濯ぎ槽１３の内部にフッ素系洗浄液Ｃが収容される。なお、図１において、二点鎖線は、フッ素系洗浄液Ｃの液面を表しており、フッ素系洗浄液Ｃは、濯ぎ槽１３の液面よりも洗浄槽１２の液面が常に低くなる量とされている。 The cleaning device 10 includes a body 11 having an upper opening shape, a cleaning tank 12 and a rinsing tank 13 disposed in a lower portion of the body 11, and a vapor condensing unit 14 disposed along an upper opening edge of the body 11. The fluorine-based cleaning liquid C is accommodated in the cleaning tank 12 and the rinsing tank 13. In FIG. 1, the alternate long and two short dashes line represents the liquid level of the fluorine-based cleaning liquid C, and the fluorine-based cleaning liquid C is an amount in which the liquid level of the cleaning tank 12 is always lower than the liquid level of the rinsing tank 13. ing.
　洗浄槽１２は内部底面にヒータ１２ａを有しており、ヒータ１２ａにて洗浄槽１２内のフッ素系洗浄液Ｃが加熱される。また、洗浄槽１２内の加熱されたフッ素系洗浄液Ｃの一部は蒸気となって上昇し、洗浄槽１２および濯ぎ槽１３の上方にフッ素系洗浄液Ｃの蒸気層Ｓが形成される。なお、図１において、点線は蒸気層Ｓと外気との境界を表している。
　濯ぎ槽１３は内部底面に超音波発生機１３ａを有しており、超音波発生機１３ａにて濯ぎ槽１３内のフッ素系洗浄液Ｃに超音波が付与される。 The cleaning tank 12 has a heater 12a on the inner bottom surface, and the fluorine-based cleaning liquid C in the cleaning tank 12 is heated by the heater 12a. Further, a part of the heated fluorine-based cleaning liquid C in the cleaning tank 12 rises as vapor, and a vapor layer S of the fluorine-based cleaning liquid C is formed above the cleaning tank 12 and the rinsing tank 13. In FIG. 1, the dotted line represents the boundary between the vapor layer S and the outside air.
The rinsing tank 13 has an ultrasonic generator 13a on the inner bottom surface, and ultrasonic waves are applied to the fluorine-based cleaning liquid C in the rinsing tank 13 by the ultrasonic generator 13a.
　蒸気凝縮部１４は、ボディ１１の上部開口縁の内面に沿って設けられた凝縮管１４ａおよび凝縮管１４ａ内に冷媒を循環させる図示しない冷却サイクル部と、凝縮管１４ａの下部に設けられた樋部１４ｂと、樋部１４ｂと濯ぎ槽１３とを配管を介して接続する水分離器１４ｃとを備える。
　蒸気層Ｓ中の蒸気の一部は、凝縮管１４と接触して熱を奪われることにより液化して樋部１４ｂに集められる。液化したフッ素系洗浄液Ｃには、空気中の水蒸気が凝縮した水分を含んでいるため、フッ素系洗浄液Ｃは樋部１４ｂから水分離器１４ｃ内に導入されて水と分離され、フッ素系洗浄液Ｃよりも比重が小さい水は水分離器１４ｃの上部の排水口から外部に排出され、水分離器１４ｃの下部の開口からフッ素系洗浄液Ｃが配管を通って濯ぎ槽１３内に導入される。 The vapor condensing unit 14 includes a condensing tube 14a provided along the inner surface of the upper opening edge of the body 11, a cooling cycle unit (not shown) that circulates the refrigerant in the condensing tube 14a, and a soot provided under the condensing tube 14a. The water separator 14c which connects the part 14b, the collar part 14b, and the rinse tank 13 through piping is provided.
A part of the vapor in the vapor layer S comes into contact with the condenser tube 14 and is deprived of heat to be liquefied and collected in the flange 14b. Since the liquefied fluorine-based cleaning liquid C contains moisture condensed from water vapor in the air, the fluorine-based cleaning liquid C is introduced into the water separator 14c from the flange 14b and separated from the water, and the fluorine-based cleaning liquid C Water having a smaller specific gravity than the water separator 14c is discharged to the outside from the drain outlet at the top of the water separator 14c, and the fluorine-based cleaning liquid C is introduced into the rinsing tank 13 through the piping from the opening at the bottom of the water separator 14c.
　精製装置２０は、水溶性汚染物を除去する水洗浄装置を構成する水接触カラム２１と、水分除去装置を構成する水分離器２２および吸湿材カラム２３と、イオン性汚染物除去装置を構成するイオン性汚染物除去カラム２４と、有機性汚染物を除去する精留装置を構成するヒータ内蔵型蒸留塔２５と、固体状汚染物を除去するフィルター装置２６とが、上流側からこの順で配管にて直列的に接続されてなる。
　水接触カラム２１は、上部の上流端に洗浄液流入口および水排出口を有すると共に、下部の下流端に洗浄液排出口および水流入口を有しており、洗浄液流入口は未使用のフッ素系洗浄液Ｃを内部に導入するためのホッパ２１ａと配管を介して接続され、水流入口は図外の水供給源と配管を介して接続されている。
　また、フィルター装置２６は洗浄装置１０の濯ぎ槽１３と配管にて接続されている。 The purification device 20 constitutes a water contact column 21 constituting a water washing device for removing water-soluble contaminants, a water separator 22 and a hygroscopic material column 23 constituting a water removal device, and an ionic contaminant removal device. An ionic contaminant removal column 24, a heater built-in distillation column 25 constituting a rectifying device for removing organic contaminants, and a filter device 26 for removing solid contaminants are arranged in this order from the upstream side. Are connected in series.
The water contact column 21 has a cleaning liquid inlet and a water outlet at the upper upstream end, and has a cleaning liquid outlet and a water inlet at the lower downstream end. The cleaning liquid inlet is an unused fluorine-based cleaning liquid C. Is connected to the hopper 21a for introducing the water into the inside through a pipe, and the water inlet is connected to a water supply source (not shown) through the pipe.
The filter device 26 is connected to the rinsing tank 13 of the cleaning device 10 by piping.
　この洗浄システムを用いた洗浄方法は、精製装置２０に未使用のフッ素系洗浄液を供給して精製する精製工程と、洗浄装置１０内のフッ素系洗浄液Ｃにて電子部品を洗浄する洗浄工程とを含み、洗浄装置１０内での電子部品の洗浄前に、精製したフッ素系洗浄液Ｃを洗浄装置１０へ供給する。 The cleaning method using this cleaning system includes a purification process in which an unused fluorine-based cleaning liquid is supplied to the purification apparatus 20 for purification, and a cleaning process in which electronic components are cleaned with the fluorine-based cleaning liquid C in the cleaning apparatus 10. In addition, the purified fluorine-based cleaning liquid C is supplied to the cleaning device 10 before cleaning the electronic components in the cleaning device 10.
＜精製工程について＞
　水接触カラム２１内では、フッ素系洗浄液が上方から流入し、水が下方から流入する。フッ素系洗浄液中に水溶性汚染物が含まれている場合、フッ素系洗浄液が下降する間に水溶性汚染物が除去され、その後、水分離器２２へ送られる。なお、水接触カラム２１の上部からは処理に供された水が排出される。
　水分離器２２へ送られたフッ素系洗浄液には僅かに水が含まれているため、水分離器２２内においてフッ素系洗浄液と水が下層と上層に分離され、下層のフッ素系洗浄液が吸湿材カラム２３へ送られる。なお、水分離器２２の上部からは分離した水が排出される。
　吸湿材カラム２３へ送られたフッ素系洗浄液には微量の水分が含まれているため、吸湿材（例えばゼオライト）にて水分が除去され、その後、フッ素系洗浄液はイオン性汚染物除去カラム２４へ送られる。 <About the purification process>
In the water contact column 21, the fluorine-based cleaning liquid flows from above and water flows from below. When water-soluble contaminants are contained in the fluorine-based cleaning liquid, the water-soluble contaminants are removed while the fluorine-based cleaning liquid descends, and then sent to the water separator 22. In addition, water used for the treatment is discharged from the upper part of the water contact column 21.
Since the fluorine-based cleaning liquid sent to the water separator 22 contains a slight amount of water, the fluorine-based cleaning liquid and water are separated into a lower layer and an upper layer in the water separator 22, and the lower-layer fluorine-based cleaning liquid becomes a hygroscopic material. Sent to column 23. The separated water is discharged from the upper part of the water separator 22.
Since the fluorine-based cleaning liquid sent to the hygroscopic material column 23 contains a small amount of moisture, the moisture is removed by the hygroscopic material (for example, zeolite), and then the fluorine-based cleaning liquid is transferred to the ionic contaminant removal column 24. Sent.
　イオン性汚染物除去カラム２４へ送られたフッ素系洗浄液中にイオン性汚染物が含まれている場合、イオン性汚染物除去カラム２４内において、イオン性汚染物除去材（例えばアルミナゲル）にて該イオン性汚染物が除去され、その後、フッ素系洗浄液は蒸留塔２５へ送られる。
　蒸留塔２５へ送られたフッ素系洗浄液中に有機性汚染物が含まれている場合、有機性汚染物とフッ素系洗浄液の沸点差を利用した蒸留塔２５内での蒸留操作によって、該有機性汚染物が除去され、その後、フッ素系洗浄液はフィルター装置２６へ送られる。
　フィルター装置２６へ送られたフッ素系洗浄液中に固体汚染物が含まれている場合、精密ろ過膜、限外ろ過膜等を有するフィルター装置２６にて固体汚染物が除去される。なお、固体汚染物には、上流側から流れてきた吸湿材やイオン性汚染物除去材が含まれる場合もある。 When ionic contaminants are contained in the fluorine-based cleaning liquid sent to the ionic contaminant removal column 24, the ionic contaminant removal material (for example, alumina gel) is used in the ionic contaminant removal column 24. The ionic contaminants are removed, and then the fluorine-based cleaning liquid is sent to the distillation tower 25.
When organic contaminants are contained in the fluorine-based cleaning liquid sent to the distillation column 25, the organic property is obtained by distillation operation in the distillation column 25 using the boiling point difference between the organic contaminants and the fluorine-based cleaning liquid. Contaminants are removed, and then the fluorine-based cleaning liquid is sent to the filter device 26.
When solid contaminants are contained in the fluorine-based cleaning liquid sent to the filter device 26, the solid contaminants are removed by the filter device 26 having a microfiltration membrane, an ultrafiltration membrane, or the like. The solid contaminant may include a hygroscopic material or an ionic contaminant removing material that has flowed from the upstream side.
　このように水接触カラム２１、水分離器２２、吸湿材カラム２３、イオン性汚染物除去カラム２４、蒸留塔２５およびフィルター装置２６を通過したフッ素系洗浄液は、水溶性、イオン性、有機性、固体の各種汚染物を含まない高純度に精製されたフッ素系洗浄液Ｃとなり、洗浄装置１０の濯ぎ槽１３へ送られる。
　つまり、真新しいフッ素系洗浄液を用いて電子部品を洗浄する場合は、洗浄装置１０の空の濯ぎ槽１３内に精製されたフッ素系洗浄液Ｃが供給され、濯ぎ槽１３から溢れ出たフッ素系洗浄液Ｃが洗浄槽１２に供給される。 Thus, the fluorine-based cleaning liquid that has passed through the water contact column 21, the water separator 22, the hygroscopic material column 23, the ionic contaminant removal column 24, the distillation tower 25, and the filter device 26 is water-soluble, ionic, organic, The fluorine-based cleaning liquid C is purified to a high purity and does not contain various solid contaminants, and is sent to the rinsing tank 13 of the cleaning apparatus 10.
That is, when cleaning an electronic component using a brand new fluorine-based cleaning liquid, the purified fluorine-based cleaning liquid C is supplied into the empty rinsing tank 13 of the cleaning apparatus 10 and the fluorine-based cleaning liquid C overflowing from the rinsing tank 13 is supplied. Is supplied to the washing tank 12.
＜洗浄工程について＞
　洗浄工程では、まず、電子部品は洗浄槽１２内の加熱されたフッ素系洗浄液Ｃ中に浸漬され、電子部品表面の汚れ（主として有機性汚染物）が除去される。
　次に、電子部品は、濯ぎ槽１３内のフッ素系洗浄液Ｃ中に浸漬される。濯ぎ槽１３内のフッ素系洗浄液Ｃは、洗浄槽１２内のフッ素系洗浄液Ｃよりも低い温度に保たれているため、電子部品は濯ぎ槽１３内で冷却される。また、濯ぎ槽１３においては、超音波発生機１３ａによってフッ素系洗浄液Ｃに超音波が付与されているため、洗浄槽１２で除去されずに電子部品の表面に残留している汚れが、超音波の作用によって電子部品から剥離され、除去される。 <About the cleaning process>
In the cleaning process, first, the electronic component is immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 12 to remove dirt (mainly organic contaminants) on the surface of the electronic component.
Next, the electronic component is immersed in the fluorine-based cleaning liquid C in the rinsing tank 13. Since the fluorine-based cleaning liquid C in the rinsing tank 13 is maintained at a lower temperature than the fluorine-based cleaning liquid C in the cleaning tank 12, the electronic components are cooled in the rinsing tank 13. Further, in the rinsing tank 13, since ultrasonic waves are applied to the fluorine-based cleaning liquid C by the ultrasonic generator 13 a, dirt remaining on the surface of the electronic component without being removed in the cleaning tank 12 is ultrasonic. Is removed from the electronic component by the action of and removed.
　その後、電子部品は、濯ぎ槽１３から引き上げられて蒸気層Ｓに導入され、電子部品の表面で凝縮液化するフッ素系洗浄液にて最終的な濯ぎが行われ、洗浄装置１０の上方開口部より取り出される。
　洗浄工程中、凝縮部１４で凝縮液化した清浄なフッ素系洗浄液は、水分離した後に濯ぎ槽１３へ戻されると共に、洗浄槽１２から電子部品に同伴して濯ぎ槽１３に持ち込まれた汚染物はオーバーフローにより洗浄槽１２に戻される。
　この洗浄工程では、未使用のフッ素系洗浄液の純度をより一層高めたフッ素系洗浄液を用いて電子部品を洗浄することができるため、電子部品の清浄度をより一層向上させることができる。 Thereafter, the electronic component is pulled up from the rinsing tank 13 and introduced into the vapor layer S, and finally rinsed with a fluorine-based cleaning liquid that condenses and liquefies on the surface of the electronic component, and is taken out from the upper opening of the cleaning device 10. It is.
During the cleaning process, the clean fluorine-based cleaning liquid condensed into the condensing unit 14 is separated into water and then returned to the rinsing tank 13, and contaminants brought into the rinsing tank 13 accompanying the electronic components from the cleaning tank 12 are It is returned to the washing tank 12 by overflow.
In this cleaning step, the electronic component can be cleaned using a fluorine-based cleaning liquid in which the purity of the unused fluorine-based cleaning liquid is further increased, so that the cleanliness of the electronic component can be further improved.
　なお、本洗浄システムにおいて、洗浄装置１０による電子部品の洗浄処理を繰り返すことによって内部のフッ素系洗浄液Ｃが減少した場合は、洗浄中および／または洗浄後、精製したフッ素系洗浄液を濯ぎ槽１３に補充することができる。
　また、本洗浄システムにおいて、洗浄装置１０にて所定個数の電子部品の洗浄処理（１バッチ洗浄処理）が行われた後、洗浄装置１０内の汚れたフッ素系洗浄液Ｃを交換する必要がある。
　この場合、洗浄槽１２および濯ぎ槽１３の底部に設けた図示しない排出口のバルブを開けて内部の使用済みフッ素系洗浄液を回収容器に回収し、必要であれば空になった洗浄装置１０内を精製装置２０にて精製したフッ素系洗浄液Ｃで洗浄し、前記排出口を閉じた後、前記のように精製装置２０にて精製したフッ素系洗浄液Ｃを濯ぎ槽１３および洗浄槽１２に導入する。
　なお、回収した使用済みのフッ素系洗浄液は、廃棄処分されるか、あるいは再生装置にて再生され、再生されたフッ素系洗浄液を洗浄装置１０に直接投入して再使用してもよく、あるいは精製装置にてさらに純度を高めてから洗浄装置１０に投入して再使用してもよい。 In this cleaning system, when the internal fluorine-based cleaning liquid C is reduced by repeating the cleaning process of the electronic component by the cleaning device 10, the purified fluorine-based cleaning liquid is supplied to the rinsing tank 13 during and / or after cleaning. Can be replenished.
Further, in the present cleaning system, after a predetermined number of electronic components are cleaned (one batch cleaning process) in the cleaning device 10, it is necessary to replace the dirty fluorine-based cleaning liquid C in the cleaning device 10.
In this case, a valve of a discharge port (not shown) provided at the bottom of the cleaning tank 12 and the rinsing tank 13 is opened to collect the used fluorine-based cleaning liquid in a recovery container, and if necessary, the cleaning apparatus 10 is emptied. Is washed with the fluorine-based cleaning liquid C purified by the purification apparatus 20 and the discharge port is closed, and then the fluorine-based cleaning liquid C purified by the purification apparatus 20 as described above is introduced into the rinsing tank 13 and the cleaning tank 12. .
The recovered used fluorine-based cleaning liquid may be discarded or regenerated in a regenerator, and the regenerated fluorine-based cleaning liquid may be directly put into the cleaning apparatus 10 to be reused or purified. After the purity is further increased by the apparatus, it may be put into the cleaning apparatus 10 and reused.
（実施形態２）
　図２は本発明の洗浄システムの実施形態２を示す概略構成図である。
　実施形態２の洗浄システムは、実施形態１と同様に、洗浄装置１００と、洗浄装置１００と配管にて接続された精製装置２００とから構成されているが、洗浄装置１００および精製装置２００の構成が実施形態１とは若干異なる。
　以下、実施形態２における実施形態１とは異なる点を主として説明する。 (Embodiment 2)
FIG. 2 is a schematic configuration diagram showing Embodiment 2 of the cleaning system of the present invention.
As in the first embodiment, the cleaning system according to the second embodiment includes the cleaning device 100 and the purification device 200 connected to the cleaning device 100 through a pipe. The configurations of the cleaning device 100 and the purification device 200 are as follows. Is slightly different from the first embodiment.
Hereinafter, differences from the first embodiment in the second embodiment will be mainly described.
　洗浄装置１００は、上方開口状のボディ１１０と、ボディ１１０内の下部に配置された洗浄槽１２０および濯ぎ槽１３０と、ボディ１１０の上部開口縁に沿って配置された蒸気凝縮部１４０と、洗浄槽１２０に隣接して配置された蒸気発生槽１５０と、蒸気発生槽１５０の上方に配置された蒸留塔１６０とを備える。
　実施形態１と同様に、洗浄槽１２０はヒータ１２０ａを有し、濯ぎ槽１３０は超音波発生機１３０ａを有し、蒸気凝縮部１４０は凝縮管１４０ａ、樋部１４０ｂおよび水分離器１４０ｃを有している。なお、ヒータ１２０ａの代りに超音波発生機を洗浄槽１２０内に設けてもよい。 The cleaning device 100 includes a body 110 having an upper opening shape, a cleaning tank 120 and a rinsing tank 130 disposed in a lower portion of the body 110, a vapor condensing unit 140 disposed along an upper opening edge of the body 110, and a cleaning A steam generation tank 150 disposed adjacent to the tank 120 and a distillation tower 160 disposed above the steam generation tank 150 are provided.
As in the first embodiment, the cleaning tank 120 includes a heater 120a, the rinsing tank 130 includes an ultrasonic generator 130a, and the vapor condensing unit 140 includes a condensing pipe 140a, a ridge 140b, and a water separator 140c. ing. In addition, you may provide an ultrasonic generator in the washing tank 120 instead of the heater 120a.
　蒸気発生槽１５０は、蒸気凝縮部１４０から外側に設けられており、内部底面にヒータ１５０ａを有している。
　ボディ１１０は、蒸気発生槽１５０の上方を覆う部分を有し、この部分に蒸留塔１６０が搭載されている。なお、蒸留塔１６０と蒸気発生槽１５０とは、ボディ１１０に形成した連通孔にて相互に連通している。
　また、蒸留塔１６０の上端には蒸気を排出する排出口が形成されており、この排出口は配管を介して蒸気凝縮部１４０の凝縮管１４０ａの近傍に通じている。 The steam generation tank 150 is provided outside the steam condensing unit 140, and has a heater 150a on the inner bottom surface.
The body 110 has a portion that covers the upper part of the steam generation tank 150, and the distillation tower 160 is mounted on this portion. The distillation tower 160 and the steam generation tank 150 communicate with each other through a communication hole formed in the body 110.
Further, a discharge port for discharging steam is formed at the upper end of the distillation column 160, and this discharge port communicates with the vicinity of the condensing pipe 140a of the steam condensing unit 140 through a pipe.
　この洗浄装置１００による電子部品の洗浄工程も実施形態１と同様に、まず電子部品は、洗浄槽１２０内の加熱されたフッ素系洗浄液Ｃ中に浸漬されて洗浄され、次に濯ぎ槽１３０中の超音波が付与されたフッ素系洗浄液Ｃ中に浸漬されて濯がれ、洗浄槽１２０内の加熱されたフッ素系洗浄液Ｃが気化した蒸気層Ｓ中に引き上げられて蒸気洗浄された後、外部に取り出される。
　この間、洗浄槽１２０をオーバーフローしたフッ素系洗浄液Ｃが蒸気発生槽１５０内に導入され、蒸気発生槽１５０内で加熱されて気化したフッ素系洗浄液Ｃの蒸気の一部は、蒸留塔１６０を通って凝縮管１４０ａに接触することにより液化して樋部１４０ｂに集められる。つまり、洗浄工程において、洗浄槽１２０内の汚れたフッ素系洗浄液が蒸気発生槽１５０に流入し、有機汚染物を含むフッ素系洗浄液は蒸気発生槽１６０にて気化し、その蒸気のうち有機汚染物の蒸気は蒸留塔１６０で冷却され液化して蒸気発生槽１６０に戻り、有機性汚染物を含まないフッ素系洗浄液の蒸気のみが蒸留塔１６０を通り抜けて蒸気凝縮部１４０で液化する。それと同時に、蒸気層Ｓの一部の蒸気も蒸気凝縮部１４０で液化して樋部１４０ｂに集められ、樋部１４０ｂから清浄なフッ素系洗浄液が水分離器１４０ｃを通って濯ぎ槽１３０へ戻される。 In the electronic component cleaning process by the cleaning apparatus 100 as in the first embodiment, the electronic component is first immersed and cleaned in the heated fluorine-based cleaning liquid C in the cleaning tank 120, and then in the rinsing tank 130. After immersing and rinsing in the fluorine-based cleaning liquid C to which ultrasonic waves are applied, the heated fluorine-based cleaning liquid C in the cleaning tank 120 is pulled up into the vaporized vapor layer S and steam-cleaned, and then externally. It is taken out.
During this time, the fluorine-based cleaning liquid C overflowing the cleaning tank 120 is introduced into the steam generation tank 150, and a part of the vapor of the fluorine-based cleaning liquid C heated and vaporized in the steam generation tank 150 passes through the distillation tower 160. By contacting the condenser tube 140a, it is liquefied and collected in the collar 140b. That is, in the cleaning process, the dirty fluorine-based cleaning liquid in the cleaning tank 120 flows into the steam generation tank 150, and the fluorine-based cleaning liquid containing organic contaminants is vaporized in the steam generation tank 160, and organic contaminants out of the vapor are included. The vapor is cooled and liquefied in the distillation column 160 and returned to the vapor generation tank 160, and only the fluorine-based cleaning solution vapor that does not contain organic contaminants passes through the distillation column 160 and is liquefied in the vapor condensing unit 140. At the same time, a part of the vapor in the vapor layer S is liquefied by the vapor condensing unit 140 and collected in the tub 140b, and a clean fluorine-based cleaning liquid is returned from the jar 140b to the rinsing tank 130 through the water separator 140c. .
　精製装置２００は、ホッパ２１０ａが接続された水接触カラム２１０と、水分離器２２０と、吸湿カラム２３０と、イオン性汚染物除去カラム２４０と、フィルター装置２６０とが配管にて連続的に直列接続され、フィルター装置２６０が洗浄装置１００の濯ぎ槽１３０と配管にて接続されて構成されている。つまり、この精製装置２００は、実施形態１の精製装置２０における蒸留塔２５（図１参照）が省略されたこと以外は、実施形態１と同様である。 In the purification apparatus 200, a water contact column 210 to which a hopper 210a is connected, a water separator 220, a moisture absorption column 230, an ionic contaminant removal column 240, and a filter device 260 are continuously connected in series by piping. The filter device 260 is connected to the rinsing tank 130 of the cleaning device 100 by piping. That is, the purification apparatus 200 is the same as that of Embodiment 1 except that the distillation column 25 (see FIG. 1) in the purification apparatus 20 of Embodiment 1 is omitted.
　この実施形態２の洗浄システムによれば、精製装置２００によって未使用のフッ素系洗浄液中の有機性汚染物以外の水溶性汚染物の除去、イオン性汚染物の除去および固体汚染物の除去を経て精製されたフッ素系洗浄液を、洗浄装置１００の濯ぎ槽１３０に導入し、洗浄装置１００にて電子部品を洗浄しながら有機性汚染物を含むフッ素系洗浄液を蒸留塔１６０にて浄化して、濯ぎ槽１３０へ還流させることができる。 According to the cleaning system of the second embodiment, the purification apparatus 200 passes through removal of water-soluble contaminants other than organic contaminants in the unused fluorine-based cleaning liquid, removal of ionic contaminants, and removal of solid contaminants. The purified fluorine-based cleaning liquid is introduced into the rinsing tank 130 of the cleaning device 100, and the cleaning system 100 cleans the fluorine-based cleaning liquid containing organic contaminants while cleaning the electronic components by the distillation tower 160. It can be refluxed to the tank 130.
（実施形態３）
　図３は本発明の洗浄システムの実施形態３を示す概略構成図である。
　実施形態３の洗浄システムは、図１で説明した実施形態１と同じ洗浄装置１０および精製装置２０に加えて、使用済みのフッ素系洗浄液を再生する再生装置３０をさらに備えたものである。なお、図３において、図１と同一の構成要素には同一の符号を付している。
　以下、実施形態３における実施形態１とは異なる点を主として説明する。 (Embodiment 3)
FIG. 3 is a schematic configuration diagram showing Embodiment 3 of the cleaning system of the present invention.
The cleaning system according to the third embodiment further includes a regenerator 30 that regenerates the used fluorine-based cleaning liquid in addition to the same cleaning apparatus 10 and purification apparatus 20 as those of the first embodiment described with reference to FIG. In FIG. 3, the same components as those in FIG. 1 are denoted by the same reference numerals.
Hereinafter, differences from the first embodiment in the third embodiment will be mainly described.
　この再生装置３０は、洗浄装置１０の洗浄槽１２および濯ぎ槽１３と循環配管３１にて接続されており、洗浄槽１２内の汚れたフッ素系洗浄液が再生装置３０に導入され、清浄化されて再生されたフッ素系洗浄液が濯ぎ槽１３戻されて再使用される。
　例えば、１バッチの洗浄処理が終了した後に、洗浄槽１２から汚れたフッ素系洗浄液を連続的に再生装置３０へ移送して再生し、再生された洗浄剤組成物液を次のバッチ洗浄処理が始まる前の濯ぎ槽１３へ連続的に供給する。
　なお、本洗浄システムにおいても、洗浄装置１０による電子部品の洗浄処理を繰り返すことによって、内部のフッ素系洗浄液Ｃが減少した場合は、洗浄中および／または洗浄後に、精製したフッ素系洗浄液を濯ぎ槽１３に補充してもよい。 The regenerator 30 is connected to the cleaning tank 12 and the rinsing tank 13 of the cleaning apparatus 10 through a circulation pipe 31, and the dirty fluorine-based cleaning liquid in the cleaning tank 12 is introduced into the regenerator 30 and cleaned. The regenerated fluorine-based cleaning liquid is returned to the rinsing tank 13 and reused.
For example, after one batch of cleaning process is completed, the dirty fluorine-based cleaning liquid from the cleaning tank 12 is continuously transferred to the regenerator 30 for regeneration, and the regenerated cleaning composition liquid is subjected to the next batch cleaning process. It is continuously supplied to the rinsing tank 13 before starting.
In this cleaning system as well, when the internal fluorine-based cleaning liquid C is reduced by repeating the cleaning process of the electronic component by the cleaning device 10, the purified fluorine-based cleaning liquid is rinsed during and / or after cleaning. 13 may be replenished.
　再生装置３０は、各種の汚れ成分を除去する複数の汚染物除去装置、例えば精製装置２０と同様の水洗浄装置、水分除去装置、イオン性汚染物除去装置、精留装置、フィルター装置を備えたものが好ましく、公知の再生装置を用いることもできる。
　この洗浄システムによれば、使用済みの汚れたフッ素系洗浄液を洗浄装置１０から循環配管３１を通して再生装置３０へ移送し、再生処理されたフッ素系洗浄液を再生装置３０から循環配管３１を通して洗浄装置１０へ移送することができる。その結果、フッ素系洗浄液の移送を容易かつ短時間に行うことができることに加え、再生処理されたフッ素系洗浄液を外部環境に接触させずに洗浄装置１０へ移送することができるため、外部から洗浄液中への汚染物の混入を回避できる。 The regenerator 30 includes a plurality of contaminant removal devices that remove various contaminant components, for example, a water cleaning device, a moisture removal device, an ionic contaminant removal device, a rectification device, and a filter device similar to the purification device 20. It is preferable that a known reproducing apparatus can be used.
According to this cleaning system, the used dirty fluorine-based cleaning liquid is transferred from the cleaning device 10 to the regenerator 30 through the circulation pipe 31, and the regenerated fluorine-based cleaning liquid is transferred from the regenerator 30 through the circulation pipe 31 to the cleaning apparatus 10. Can be transferred to. As a result, in addition to being able to transfer the fluorine-based cleaning liquid easily and in a short time, the regenerated fluorine-based cleaning liquid can be transferred to the cleaning device 10 without contacting the external environment. The contamination inside can be avoided.
（実施形態４）
　図４は本発明の洗浄システムの実施形態４を示す概略構成図である。
　実施形態４の洗浄システムは、図２で説明した実施形態２と同じ洗浄装置１００および精製装置２００に加えて、実施形態３と同様の再生装置３０をさらに備えたものである。なお、図４において、図２および図３と同一の構成要素には同一の符号を付している。
　この実施形態４の洗浄システムも、実施形態３と同様に、使用済みの汚れたフッ素系洗浄液をシステム内で簡便かつ高純度に再生することができる。 (Embodiment 4)
FIG. 4 is a schematic configuration diagram showing Embodiment 4 of the cleaning system of the present invention.
The cleaning system according to the fourth embodiment further includes a regeneration device 30 similar to that of the third embodiment in addition to the same cleaning device 100 and purification device 200 as those of the second embodiment described with reference to FIG. In FIG. 4, the same components as those in FIGS. 2 and 3 are denoted by the same reference numerals.
Similarly to the third embodiment, the cleaning system according to the fourth embodiment can regenerate the used and dirty fluorine-based cleaning liquid easily and with high purity in the system.
（実施形態５）
　図５は本発明の洗浄システムの実施形態５を示す概略構成図である。
　実施形態５の洗浄システムは、図５に示すように、実施形態３の洗浄システム（図３参照）における精製装置２０と洗浄装置１０との間に精製後のフッ素系洗浄液を一時的に貯留する精製用バッファータンク４１を備えると共に、再生装置３０の下流側と洗浄装置１０との間に再生後のフッ素系洗浄液を一時的に貯留する再生用バッファータンク４２を備えたものである。
　この実施形態５の洗浄システムによれば、洗浄装置１０内のフッ素系洗浄液Ｃを再生装置３０に連続的に移送して再生処理しながら再生済みのフッ素系洗浄液を再生用バッファータンク４２に連続的に移送するとともに、この間、精製用バッファータンク４１内の精製済みフッ素系洗浄液を連続的に洗浄装置１０へ移送して次の洗浄工程の準備を行うことができる。
　また、洗浄装置１０内のフッ素系洗浄液Ｃを再生装置３０に連続的に移送して再生処理しながら、再生用バッファータンク４２内の再生済みのフッ素系洗浄液を連続的に洗浄装置１０へ移送して次の洗浄工程の準備を行うこともできる。したがって、バッチ単位の洗浄処理を効率よく行うことができる。
　また、各バッファータンク４１、４２に貯留している精製または再生したフッ素系洗浄液の一部を洗浄装置１０へ随時補充することも可能である。 (Embodiment 5)
FIG. 5 is a schematic configuration diagram showing Embodiment 5 of the cleaning system of the present invention.
As shown in FIG. 5, the cleaning system of the fifth embodiment temporarily stores the purified fluorine-based cleaning liquid between the purification device 20 and the cleaning device 10 in the cleaning system of the third embodiment (see FIG. 3). A purification buffer tank 41 is provided, and a regeneration buffer tank 42 is provided between the downstream side of the regeneration device 30 and the cleaning device 10 to temporarily store the regenerated fluorine-based cleaning liquid.
According to the cleaning system of the fifth embodiment, the fluorine-based cleaning liquid C in the cleaning apparatus 10 is continuously transferred to the regeneration apparatus 30 and regenerated, and the regenerated fluorine-based cleaning liquid is continuously supplied to the regeneration buffer tank 42. In the meantime, the purified fluorine-based cleaning liquid in the purification buffer tank 41 can be continuously transferred to the cleaning device 10 to prepare for the next cleaning step.
In addition, the regenerated fluorine-based cleaning liquid in the regeneration buffer tank 42 is continuously transferred to the cleaning apparatus 10 while the fluorine-based cleaning liquid C in the cleaning apparatus 10 is continuously transferred to the regenerating apparatus 30 and regenerated. It is also possible to prepare for the next cleaning step. Therefore, it is possible to efficiently perform the cleaning process in batch units.
It is also possible to replenish the cleaning apparatus 10 with a part of the purified or regenerated fluorine-based cleaning liquid stored in the buffer tanks 41 and 42 as needed.
　なお、精製用バッファータンク４１の位置は、図で示した位置に限定されず、蒸留塔２５とフィルター２６の間、イオン性汚染物除去カラム２４と蒸留塔２５の間、吸湿材カラム２３とイオン性汚染物除去カラム２４の間、または水接触カラム２１の前でもよい。この場合には、精製用バッファータンクには、精製中または精製前のフッ素系洗浄液が一時的に貯留される。
　また、再生用バッファータンク４２の位置は、再生装置３０の上流側と洗浄装置１０との間でもよい。この場合、再生用バッファータンク４２には、再生前のフッ素系洗浄液が一時的に貯留される。
　また、実施形態５において、バッファータンクは精製用と再生用のいずれか一方のみであってもよい。
　また、このような精製用バッファータンク４１および／または再生用バッファータンク４２を備える構成は、実施形態３の洗浄システム以外に、前記の実施形態１、２および４の洗浄システムにも適用できることは言うまでもない。 The position of the purification buffer tank 41 is not limited to the position shown in the figure, and is between the distillation column 25 and the filter 26, between the ionic contaminant removal column 24 and the distillation column 25, and between the hygroscopic material column 23 and the ion. It may be between the toxic contaminant removal column 24 or before the water contact column 21. In this case, the fluorinated cleaning liquid during or before purification is temporarily stored in the purification buffer tank.
Further, the position of the regeneration buffer tank 42 may be between the upstream side of the regeneration device 30 and the cleaning device 10. In this case, the fluorinated cleaning liquid before regeneration is temporarily stored in the regeneration buffer tank 42.
In the fifth embodiment, the buffer tank may be either for purification or for regeneration.
Further, it goes without saying that such a configuration including the purification buffer tank 41 and / or the regeneration buffer tank 42 can be applied to the cleaning systems of Embodiments 1, 2, and 4 in addition to the cleaning system of Embodiment 3. Yes.
（実施形態６）
　図６は本発明の洗浄システムの実施形態６を示す概略構成図である。
　実施形態６の洗浄システムは、図３で説明した実施形態３と同じ洗浄装置１０および精製装置２０に加えて、洗浄装置１０がシャワーノズル１７をさらに備え、精製装置２０により精製されたフッ素系洗浄液を前記シャワーノズル１７から噴出して、蒸気洗浄後の電子部品をシャワー洗浄するように構成されたものである。なお、図６において、図３と同一の構成要素には同一の符号を付している。
　以下、実施形態６における実施形態３とは異なる点を主として説明する。 (Embodiment 6)
FIG. 6 is a schematic configuration diagram showing Embodiment 6 of the cleaning system of the present invention.
In the cleaning system of the sixth embodiment, the cleaning apparatus 10 further includes a shower nozzle 17 in addition to the same cleaning apparatus 10 and purification apparatus 20 as those of the third embodiment described with reference to FIG. 3, and the fluorine-based cleaning liquid purified by the purification apparatus 20. Is ejected from the shower nozzle 17 and the electronic component after the steam cleaning is configured to be shower cleaned. In FIG. 6, the same components as those in FIG. 3 are denoted by the same reference numerals.
Hereinafter, differences from the third embodiment in the sixth embodiment will be mainly described.
　実施形態６では、例えば、シャワーノズル１７を洗浄装置１０における蒸気滞留部Ｓの上方であって洗浄槽１２寄りのボディ１１の上縁付近に配置し、精製装置２０のフィルター２６と洗浄装置１０とを接続する配管２７の途中から分岐する分岐配管２８を設け、分岐配管２８とシャワーノズル１７とを接続する。さらに、分岐配管２８の途中に開閉バルブ２８ａを設けると共に、配管２７の分岐配管２８よりも下流側に開閉バルブ２７ａを設ける。 In the sixth embodiment, for example, the shower nozzle 17 is disposed near the upper edge of the body 11 near the cleaning tank 12 above the vapor retention portion S in the cleaning device 10, and the filter 26 and the cleaning device 10 of the purification device 20 are arranged. A branch pipe 28 that branches from the middle of the pipe 27 that connects the pipe 18 and the shower nozzle 17 is connected. Further, an open / close valve 28 a is provided in the middle of the branch pipe 28, and an open / close valve 27 a is provided downstream of the branch pipe 28 of the pipe 27.
　このように構成することによって、洗浄工程中、開閉バルブ２７ａを閉じ、開閉バルブ２８ａを開いて、精製装置２０によって精製されたフッ素系洗浄液をシャワーノズル１７から噴出し、蒸気滞留部の蒸気Ｓによって蒸気洗浄された後の電子部品をシャワー洗浄することができる。また、シャワー洗浄に供したフッ素系洗浄液を洗浄槽１２中に落下させて、洗浄槽１２内で再利用することができる。
　したがって、蒸気Ｓ中に有機性汚染物の蒸気が含まれ、蒸気洗浄後の電子部品の表面に有機性汚染物が残留していたとしても、精製されたシャワー状のフッ素系洗浄液によって電子部品表面の有機性汚染物が洗い流されるため、電子部品の清浄度をより一層高めることができる。
　なお、このようなシャワー洗浄を可能とする構成は、実施形態３の洗浄システム以外にも、前記の実施形態１、２、４および５の洗浄システムにも適用できることは言うまでもない。
　特に、精製用バッファータンク４１（図５参照）からシャワーノズル１７に精製済みフッ素系洗浄液を随時供給することができるように構成することが好ましい。 With this configuration, during the cleaning process, the opening / closing valve 27a is closed, the opening / closing valve 28a is opened, the fluorine-based cleaning liquid purified by the purification device 20 is ejected from the shower nozzle 17, and the steam S in the steam retention part is used. It is possible to shower-wash the electronic component after being steam-washed. Further, the fluorine-based cleaning liquid subjected to shower cleaning can be dropped into the cleaning tank 12 and reused in the cleaning tank 12.
Therefore, even if the vapor S contains the organic contaminant vapor, and the organic contaminant remains on the surface of the electronic component after the vapor cleaning, the surface of the electronic component is removed by the purified shower-like fluorine-based cleaning liquid. Since the organic contaminants are washed away, the cleanliness of the electronic component can be further increased.
Needless to say, such a configuration that enables shower cleaning can be applied to the cleaning systems of the first, second, fourth, and fifth embodiments in addition to the cleaning system of the third embodiment.
In particular, it is preferable that the purified fluorine-based cleaning liquid can be supplied from the purification buffer tank 41 (see FIG. 5) to the shower nozzle 17 as needed.
（実施形態７）
　図７は本発明の洗浄システムの実施形態７を示す概略構成図である。
　実施形態７の洗浄システムは、図１で説明した実施形態１の洗浄システムにおける洗浄装置１０が異なる以外は、実施形態１と同様である。なお、図７において、図１と同一の構成要素には同一の符号を付している。
　以下、実施形態７における実施形態１とは異なる点を主として説明する。 (Embodiment 7)
FIG. 7 is a schematic configuration diagram showing Embodiment 7 of the cleaning system of the present invention.
The cleaning system of the seventh embodiment is the same as that of the first embodiment except that the cleaning device 10 in the cleaning system of the first embodiment described in FIG. 1 is different. In FIG. 7, the same components as those in FIG. 1 are denoted by the same reference numerals.
Hereinafter, differences from the first embodiment in the seventh embodiment will be mainly described.
　実施形態７における洗浄装置１０Ａは、上方開口部を有するボディ１１と、ボディ１１の上方開口部を開閉可能に遮蔽する蓋体１１ａと、ボディ１１内の下部に段違いに配置された洗浄槽１２および濯ぎ槽１３とを備え、洗浄槽１２および濯ぎ槽１３の内部にフッ素系洗浄液Ｃが収容される。なお、フッ素系洗浄液Ｃは、濯ぎ槽１３の液面よりも洗浄槽１２の液面が常に低くなる量とされている。
　また、洗浄槽１２および濯ぎ槽１３は内部底面に超音波発生機１３ａをそれぞれ有しており、各超音波発生機１３ａにて洗浄槽１２および濯ぎ槽１３内のフッ素系洗浄液Ｃに超音波が付与される。 The cleaning apparatus 10A according to the seventh embodiment includes a body 11 having an upper opening, a lid 11a that shields the upper opening of the body 11 so as to be openable and closable, The rinsing tank 13 is provided, and the fluorine-based cleaning liquid C is accommodated in the cleaning tank 12 and the rinsing tank 13. Note that the fluorine-based cleaning liquid C is set so that the liquid level in the cleaning tank 12 is always lower than the liquid level in the rinsing tank 13.
Further, the cleaning tank 12 and the rinsing tank 13 each have an ultrasonic generator 13 a on the inner bottom surface, and ultrasonic waves are generated in the cleaning liquid 12 in the cleaning tank 12 and the rinsing tank 13 by each ultrasonic generator 13 a. Is granted.
　この洗浄装置１０Ａによる電子部品の洗浄の際は、蓋体１１ａが開き、まず、電子部品は室温の洗浄槽１２内のフッ素系洗浄液Ｃ中に浸漬され、電子部品の表面の汚れが超音波の作用によって剥離される。続いて、電子部品は室温の濯ぎ槽１３内のフッ素系洗浄液Ｃ中に浸漬され、電子部品の表面に残留している汚れが超音波の作用によって剥離され、その後、洗浄装置１０Ａの上方開口部より取り出される。
　このように、実施形態７では、実施形態１で行っていた蒸気洗浄が省略されている。なお、基本的に電子部品の洗浄工程以外は蓋体１１ａは閉じており、洗浄槽１３および濯ぎ槽１３内に塵、埃、ごみ等が入らないように洗浄装置１０Ａ内が密閉される。 When the electronic device is cleaned by the cleaning device 10A, the lid 11a is opened. First, the electronic component is immersed in the fluorine-based cleaning liquid C in the cleaning tank 12 at room temperature, and the surface of the electronic component is ultrasonically cleaned. Peeled by action. Subsequently, the electronic component is immersed in the fluorine-based cleaning liquid C in the rinsing tank 13 at room temperature, and dirt remaining on the surface of the electronic component is peeled off by the action of ultrasonic waves, and then the upper opening of the cleaning device 10A. Is taken out more.
Thus, in the seventh embodiment, the steam cleaning performed in the first embodiment is omitted. The lid 11a is basically closed except for the electronic component cleaning step, and the cleaning apparatus 10A is hermetically sealed so that dust, dirt, dust, and the like do not enter the cleaning tank 13 and the rinsing tank 13.
（実施形態８）
　図８は本発明の洗浄システムの実施形態８を示す概略構成図である。
　実施形態８の洗浄システムは、図７で説明した実施形態７の洗浄システムにおける洗浄装置１０Ａが異なる以外は、実施形態７と同様である。なお、図８において、図７と同一の構成要素には同一の符号を付している。
　以下、実施形態８における実施形態７とは異なる点を主として説明する。 (Embodiment 8)
FIG. 8 is a schematic configuration diagram showing Embodiment 8 of the cleaning system of the present invention.
The cleaning system of the eighth embodiment is the same as that of the seventh embodiment except that the cleaning device 10A in the cleaning system of the seventh embodiment described in FIG. 7 is different. In FIG. 8, the same components as those in FIG. 7 are denoted by the same reference numerals.
Hereinafter, differences from the seventh embodiment in the eighth embodiment will be mainly described.
　実施形態８における洗浄装置１０Ｂは、実施形態７における洗浄装置１０Ａにシャワーノズル１７（図６参照）を設けたものである。シャワーノズル１７は、実施形態６と同様に精製装置２０と接続されている。
　この洗浄装置１０Ｂによる電子部品の洗浄の際は、電子部品は、実施形態７と同様に洗浄槽１２および濯ぎ槽１３で洗浄された後、シャワーノズル１７から噴出した精製されたフッ素系洗浄液Ｃにてシャワー洗浄される。あるいは、洗浄槽１２での洗浄と濯ぎ槽１３での洗浄のうちの一方あるいは両方を省略してから、シャワー洗浄を行ってもよい。また、シャワー洗浄は、高圧シャワー洗浄でもよい。 The cleaning device 10B according to the eighth embodiment is obtained by providing the cleaning device 10A according to the seventh embodiment with a shower nozzle 17 (see FIG. 6). The shower nozzle 17 is connected to the purifier 20 as in the sixth embodiment.
When the electronic device is cleaned by the cleaning device 10B, the electronic component is cleaned in the cleaning tank 12 and the rinsing tank 13 in the same manner as in the seventh embodiment, and then the purified fluorine-based cleaning liquid C ejected from the shower nozzle 17 is used. And shower washed. Alternatively, shower cleaning may be performed after one or both of cleaning in the cleaning tank 12 and cleaning in the rinsing tank 13 are omitted. The shower cleaning may be high-pressure shower cleaning.
（実施形態９）
　図９は本発明の洗浄システムの実施形態９を示す概略構成図である。
　実施形態９の洗浄システムは、図１で説明した実施形態１の洗浄システムにおける洗浄装置１０が異なる以外は、実施形態１と同様である。なお、図９において、図１と同一の構成要素には同一の符号を付している。
　以下、実施形態９における実施形態１とは異なる点を主として説明する。 (Embodiment 9)
FIG. 9 is a schematic configuration diagram showing Embodiment 9 of the cleaning system of the present invention.
The cleaning system of the ninth embodiment is the same as that of the first embodiment except that the cleaning device 10 in the cleaning system of the first embodiment described in FIG. 1 is different. In FIG. 9, the same components as those in FIG. 1 are denoted by the same reference numerals.
Hereinafter, differences from the first embodiment in the ninth embodiment will be mainly described.
　実施形態９における洗浄装置１０Ｃは、実施形態１における洗浄装置１０の濯ぎ槽１３が省略されたものである。
　この洗浄装置１０Ｃによる電子部品の洗浄の際は、電子部品は、洗浄槽１２内の加熱されたフッ素系洗浄液Ｃ中には浸漬されず、蒸気層Ｓ内で洗浄される。このとき、電子部品が冷えた状態で蒸気層Ｓ内に持ち込まれると、部品表面上で洗浄液の蒸気が凝縮して液化することにより、部品表面上の汚れを洗い流す。その後、しばらく放置することにより、電子部品の温度が次第に上昇し最終的に洗浄液の沸点に到達するため、部品表面上の洗浄液は気化して電子部品が乾燥する。なお、電子部品が乾燥する前に蒸気層Ｓから取り出し、自然乾燥または外部の乾燥装置により乾燥させてもよい。 In the cleaning device 10C according to the ninth embodiment, the rinsing tank 13 of the cleaning device 10 according to the first embodiment is omitted.
When cleaning the electronic component by the cleaning device 10C, the electronic component is not immersed in the heated fluorine-based cleaning liquid C in the cleaning tank 12, but is cleaned in the vapor layer S. At this time, when the electronic component is brought into the vapor layer S in a cold state, the vapor of the cleaning liquid is condensed and liquefied on the component surface, thereby washing away the dirt on the component surface. After that, the temperature of the electronic component gradually increases and finally reaches the boiling point of the cleaning liquid by leaving it for a while, so that the cleaning liquid on the surface of the component is vaporized and the electronic component is dried. Note that the electronic component may be taken out from the vapor layer S and dried by natural drying or an external drying device before drying.
（他の実施形態）
１．前記の各実施形態において、洗浄装置の濯ぎ槽内のフッ素系洗浄液を循環させる循環経路を設け、その循環経路にフィルターを設置し、濯ぎ槽内のフッ素系洗浄液をフィルターに通して循環式に清浄化するように構成してもよい。この構成によれば、洗浄前の電子部品に付着していた固体汚染物が濯ぎ槽内で剥離してフッ素系洗浄液中に混入した場合でも、濯ぎ槽内のフッ素系洗浄液から固体汚染物を除去することができ、電子部品の清浄度をより高めることができる。
２．実施形態２（図２参照）および実施形態４（図４参照）の洗浄システムは、使用したフッ素系洗浄液から有機性汚染物を除去する蒸留塔１６０が洗浄装置１００に備えられているため、精製装置２００から蒸留塔が省略されているが、実施形態１（図１参照）および実施形態３（図３参照）と同様に精製装置２００に蒸留塔が備えられていてもよい。精製装置２００に蒸留塔を設けることにより、有機性汚染物が除去された、より高純度の未使用フッ素系洗浄液を洗浄装置１００に供給することができる。
３．実施形態７～９（図７～９）の洗浄システムも、実施形態３～６（図３～６）と同様に再生装置３０およびバファータンク４１、４２が備えられてもよい。 (Other embodiments)
1. In each of the embodiments described above, a circulation path for circulating the fluorine-based cleaning liquid in the rinsing tank of the cleaning device is provided, a filter is installed in the circulation path, and the fluorine-based cleaning liquid in the rinsing tank is passed through the filter to be circulated and cleaned. You may comprise so that it may become. According to this configuration, even if solid contaminants adhering to the electronic parts before cleaning are peeled off in the rinsing tank and mixed into the fluorinated cleaning liquid, the solid contaminants are removed from the fluorinated cleaning liquid in the rinsing tank. It is possible to increase the cleanliness of the electronic component.
2. The cleaning systems of Embodiment 2 (see FIG. 2) and Embodiment 4 (see FIG. 4) are provided with a distillation column 160 for removing organic contaminants from the used fluorine-based cleaning liquid. Although the distillation column is omitted from the apparatus 200, the purification apparatus 200 may be provided with a distillation column as in the first embodiment (see FIG. 1) and the third embodiment (see FIG. 3). By providing a distillation tower in the purification apparatus 200, it is possible to supply the cleaning apparatus 100 with a higher-purity unused fluorine-based cleaning liquid from which organic contaminants have been removed.
3. The cleaning systems of Embodiments 7 to 9 (FIGS. 7 to 9) may also include the regenerator 30 and the buffer tanks 41 and 42 as in Embodiments 3 to 6 (FIGS. 3 to 6).
　以下、実施例を挙げて本発明を更に詳しく説明するが、本発明はこれらの実施例に限定されるものではない。
（実施例１）
　フッ素系洗浄液としてバートレル（登録商標）XF（三井・デュポンフロロケミカル株式会社製）に、水溶性汚染物として２－プロパノール（以下、ＩＰＡと記す）を２００重量ppmと、有機性汚染物としてクライトックス（登録商標）143AC（デュポン社製）を５重量ppmとを混合して模擬汚れを有するフッ素系洗浄液を調製した。
　模擬汚れを有する前記フッ素系洗浄液を、前記の実施形態１（図１参照）における精製装置２０を用いて精製し、精製後のフッ素系洗浄液から各種汚染物および水分がどの程度除去されているかを、水分計（三菱化学製、CA-06型）を用いて測定し、その結果を表１に示した。なお、イオン性汚染物除去装置２４にはモレキュラーシーブ３Ａ（ユニオンカーバイド社製）を用い、精留装置２５には蒸留塔（オルダーショウ型、４０段）を用いた。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in more detail, this invention is not limited to these Examples.
Example 1
Vertrel (registered trademark) XF (manufactured by Mitsui DuPont Fluoro Chemical Co., Ltd.) as a fluorine-based cleaning liquid, 200 ppm by weight of 2-propanol (hereinafter referred to as IPA) as a water-soluble contaminant, and Krytox as an organic contaminant (Registered trademark) 143AC (manufactured by DuPont) was mixed with 5 ppm by weight to prepare a fluorine-based cleaning solution having simulated dirt.
The fluorine-based cleaning liquid having simulated dirt is purified using the purification apparatus 20 in the first embodiment (see FIG. 1), and how much various contaminants and moisture are removed from the purified fluorine-based cleaning liquid. The results were measured using a moisture meter (CA-06 model, manufactured by Mitsubishi Chemical Corporation), and the results are shown in Table 1. In addition, the molecular sieve 3A (made by Union Carbide) was used for the ionic contaminant removal apparatus 24, and the distillation tower (Oldershaw type, 40 stages) was used for the rectification apparatus 25. FIG.
Figure JPOXMLDOC01-appb-T000001
 　実施例１の結果から、模擬汚れを有するフッ素系洗浄液を本発明における精製装置にて精製することにより、高純度のフッ素系洗浄液が得られることが確認できた。
Figure JPOXMLDOC01-appb-T000001
 From the results of Example 1, it was confirmed that a high-purity fluorine-based cleaning liquid can be obtained by purifying the fluorine-based cleaning liquid having simulated dirt with the purification apparatus of the present invention.
（実施例２）
　まず、本発明の洗浄システムに用いられる未使用のフッ素系洗浄液中にどのような汚染物が含まれているかを調べ、その後、未使用のフッ素系洗浄液を実施例１と同様に精製し、その精製後のフッ素系洗浄液中からどの程度各種汚染物が除去されたかを実施例１と同様に測定し、その結果を表２に示した。
　なお、未使用のフッ素系洗浄液として、１８Ｌスチール缶入りの前記バートレルXF（登録商標）を用いた。 (Example 2)
First, what kind of contaminants are contained in the unused fluorine-based cleaning liquid used in the cleaning system of the present invention, and then the unused fluorine-based cleaning liquid is purified in the same manner as in Example 1, The extent to which various contaminants were removed from the purified fluorine-based cleaning solution was measured in the same manner as in Example 1, and the results are shown in Table 2.
In addition, as the unused fluorine-based cleaning liquid, the Bertrell XF (registered trademark) contained in an 18 L steel can was used.
Figure JPOXMLDOC01-appb-T000002
Figure JPOXMLDOC01-appb-T000002
　実施例２の結果から、未使用のフッ素系洗浄液にも複数種類の汚染物が含まれており、このフッ素系洗浄液を精製装置にて精製することで、より高純度のフッ素系洗浄液が得られることが確認できた。 From the results of Example 2, a plurality of types of contaminants are also contained in the unused fluorine-based cleaning liquid, and a higher-purity fluorine-based cleaning liquid can be obtained by purifying the fluorine-based cleaning liquid with a purification apparatus. I was able to confirm.
　本発明の電子部品の洗浄方法および洗浄システムは、電子部品を限定するものではないが、高純度のフッ素系洗浄液による高清浄化が要求されるようなシリコンウェハ、セラミックウェハ、前記シリコンウェハを切断したシリコンチップ、前記セラミックウェハを切断したセラミックチップ、ガラス基板、金属基板、カラーフィルター基板、プリント基板およびこれらを用いた電子部品等の電子部品を洗浄するのに特に好適であり、常時、高度に清浄化されたフッ素系洗浄液を長期間に亘って使用することが可能となる。 The electronic component cleaning method and cleaning system of the present invention are not limited to electronic components, but cut silicon wafers, ceramic wafers, and silicon wafers that require high cleaning with a high-purity fluorine-based cleaning solution. Particularly suitable for cleaning electronic components such as silicon chips, ceramic chips obtained by cutting the ceramic wafer, glass substrates, metal substrates, color filter substrates, printed circuit boards and electronic components using these, and are always highly clean. It becomes possible to use the fluorinated cleaning liquid for a long period of time.

Claims (13)

  1. 　精製装置によって未使用のフッ素含有有機洗浄剤組成物液を精製する精製工程と、
    　前記精製装置から洗浄装置内へ供給された精製後の洗浄剤組成物液を用いて電子部品を洗浄する洗浄工程とを含み、
    　前記精製工程で、精留装置による有機性汚染物の除去およびフィルター装置による固体汚染物の除去が少なくとも行われる電子部品の洗浄方法。     A purification step of purifying an unused fluorine-containing organic detergent composition liquid by a purification device;
    A cleaning step of cleaning the electronic component using the purified cleaning composition liquid supplied from the purification device into the cleaning device,
    An electronic component cleaning method in which at least the organic contaminants are removed by a rectifying device and the solid contaminants are removed by a filter device in the purification step.
  2. 　前記精製工程が、水洗浄装置による水溶性汚染物の除去を含み、
    　前記精製工程を、有機性汚染物の除去、水溶性汚染物の除去、固体汚染物の除去の順、または水溶性汚染物の除去、有機性汚染物の除去、固体汚染物の除去の順で行って前記洗浄剤組成物液を精製する、請求項１に記載の電子部品の洗浄方法。     The purification step includes removal of water-soluble contaminants by a water washing device;
    The purification process is performed in the order of organic contaminant removal, water-soluble contaminant removal, solid contaminant removal, or water-soluble contaminant removal, organic contaminant removal, solid contaminant removal. The method for cleaning an electronic component according to claim 1, wherein the cleaning method is performed to purify the cleaning composition liquid.
  3. 　前記電子部品が、シリコンウェハ、セラミックウェハ、前記シリコンウェハを切断したシリコンチップ、前記セラミックウェハを切断したセラミックチップ、ガラス基板、金属基板、カラーフィルター基板、プリント基板およびこれらを用いた電子部品を含む、請求項１に記載の電子部品の洗浄方法。 The electronic component includes a silicon wafer, a ceramic wafer, a silicon chip obtained by cutting the silicon wafer, a ceramic chip obtained by cutting the ceramic wafer, a glass substrate, a metal substrate, a color filter substrate, a printed circuit board, and an electronic component using these. The method for cleaning an electronic component according to claim 1.
  4. 　洗浄装置から排出された洗浄剤組成物液を再生装置にて再生して洗浄装置へ循環供給する再生工程をさらに含む、請求項１に記載の電子部品の洗浄方法。 The method for cleaning an electronic component according to claim 1, further comprising a regeneration step of regenerating the detergent composition liquid discharged from the cleaning device with a regeneration device and circulatingly supplying the cleaning composition liquid to the cleaning device.
  5. 　精製された洗浄剤組成物液を精製装置から洗浄装置へ補給する補給工程をさらに含む、請求項１に記載の電子部品の洗浄方法。 2. The electronic component cleaning method according to claim 1, further comprising a replenishment step of replenishing the purified cleaning composition liquid from the purification device to the cleaning device.
  6. 　前記洗浄装置が、前記精製装置により精製された洗浄剤組成物液が供給される濯ぎ槽と、該濯ぎ槽から溢れ出た洗浄剤組成物液を受容しかつ加熱する洗浄槽と、該洗浄槽内で加熱されて気化した洗浄剤組成物液の蒸気が滞留する蒸気滞留部と、該蒸気滞留部の蒸気を凝縮させて前記濯ぎ槽に還流させる蒸気凝縮部と、精製装置により精製された洗浄剤組成物液を噴出するシャワーノズルとを備え、
    　前記洗浄工程が、前記洗浄槽内の洗浄剤組成物液中に電子部品を浸漬して洗浄し、洗浄され電子部品を前記濯ぎ槽内の洗浄剤組成物液中に浸漬して濯ぎ、濯がれた電子部品を蒸気滞留部の前記蒸気にて蒸気洗浄し、蒸気洗浄された電子部品を前記シャワーノズルからの洗浄剤組成物液によってシャワー洗浄する、請求項１に記載の電子部品の洗浄方法。     A rinsing tank in which the cleaning device is supplied with the cleaning composition liquid purified by the purification device, a cleaning tank that receives and heats the cleaning composition liquid overflowing from the rinsing tank, and the cleaning tank A vapor retention part where the vapor of the cleaning agent composition heated and vaporized is retained, a vapor condensation part for condensing the vapor of the vapor retention part and returning it to the rinsing tank, and a cleaning purified by a purification device A shower nozzle for jetting the agent composition liquid,
    In the cleaning step, the electronic component is immersed in the cleaning composition liquid in the cleaning tank for cleaning, and the cleaned electronic component is immersed in the cleaning composition liquid in the rinsing tank for rinsing and rinsing. The electronic component cleaning method according to claim 1, wherein the electronic component is subjected to steam cleaning with the steam in a steam retention portion, and the electronic component subjected to steam cleaning is shower cleaned with a cleaning agent composition liquid from the shower nozzle. .
  7. 　前記請求項１に記載の洗浄方法によって電子部品を洗浄するための洗浄システムであって、
    　未使用のフッ素含有有機洗浄剤組成物液に含まれる汚染物を除去して精製する精製装置と、該精製装置により精製された前記洗浄剤組成物液を用いて電子部品を洗浄するための洗浄装置とを備え、
    　前記精製装置が、有機性汚染物を除去する精留装置および固体汚染物を除去するフィルター装置を少なくとも備え、前記精留装置および前記フィルター装置に前記洗浄剤組成物液を通して精製するように構成された電子部品の洗浄システム。     A cleaning system for cleaning an electronic component by the cleaning method according to claim 1,
    A purification device that removes and purifies contaminants contained in an unused fluorine-containing organic cleaning composition liquid, and a cleaning for cleaning electronic components using the cleaning composition liquid purified by the purification apparatus With the device,
    The purification device includes at least a rectifying device for removing organic contaminants and a filter device for removing solid contaminants, and is configured to purify the cleaning composition liquid through the rectifying device and the filter device. Electronic component cleaning system.
  8. 　前記精製装置が、水溶性汚染物を除去する水洗浄装置および水分を除去する水分除去装置をさらに備え、前記精留装置、前記水洗浄装置、前記水分除去装置および前記フィルター装置の順、または水洗浄装置、水分除去装置、精留装置およびフィルター装置の順に前記洗浄剤組成物液を通して精製するように構成された、請求項７に記載の電子部品の洗浄システム。 The refining device further includes a water washing device for removing water-soluble contaminants and a water removing device for removing water, and the rectifying device, the water washing device, the water removing device, and the filter device in this order, or water The electronic component cleaning system according to claim 7, wherein the electronic component cleaning system is configured to purify through the cleaning composition liquid in the order of a cleaning device, a water removing device, a rectifying device, and a filter device.
  9. 　前記精製装置が、イオン性汚染物を除去するイオン性汚染物除去装置をさらに備えてなる、請求項７に記載の電子部品の洗浄システム。 The electronic component cleaning system according to claim 7, wherein the refining device further includes an ionic contaminant removing device for removing ionic contaminants.
  10. 　前記洗浄装置内で使用された洗浄剤組成物液を再生して前記洗浄装置へ循環供給する再生装置をさらに備えた、請求項７に記載の電子部品の洗浄システム。 The electronic component cleaning system according to claim 7, further comprising a regeneration device that regenerates the cleaning agent composition liquid used in the cleaning device and circulates and supplies it to the cleaning device.
  11. 　前記洗浄装置が、前記精製装置により精製された洗浄剤組成物液が供給される濯ぎ槽と、該濯ぎ槽から溢れ出た洗浄剤組成物液を受容しかつ加熱する洗浄槽と、該洗浄槽内で加熱されて気化した洗浄剤組成物液の蒸気が滞留する蒸気滞留部と、該蒸気滞留部の蒸気を凝縮させて前記濯ぎ槽に還流させる蒸気凝縮部とを備え、
    かつ前記洗浄槽内の洗浄剤組成物液中に電子部品を浸漬して洗浄し、洗浄された電子部品を前記濯ぎ槽内の洗浄剤組成物液中に浸漬して濯ぎ、濯がれた電子部品を蒸気滞留部の前記蒸気にて蒸気洗浄するように構成され、
    前記再生装置は、前記洗浄槽から排出される洗浄剤組成物液を再生して前記濯ぎ槽へ循環供給するように構成された、請求項７に記載の電子部品の洗浄システム。     A rinsing tank in which the cleaning device is supplied with the cleaning composition liquid purified by the purification device, a cleaning tank that receives and heats the cleaning composition liquid overflowing from the rinsing tank, and the cleaning tank A vapor retention part in which the vapor of the cleaning composition liquid heated and vaporized is retained, and a vapor condensation part for condensing the vapor in the vapor retention part and refluxing it to the rinsing tank,
    In addition, the electronic component is immersed in the cleaning composition liquid in the cleaning tank for cleaning, and the cleaned electronic component is immersed in the cleaning composition liquid in the rinsing tank for rinsing and rinsing. The component is configured to be subjected to steam cleaning with the steam in the steam retention part,
    The electronic device cleaning system according to claim 7, wherein the regeneration device is configured to regenerate the cleaning composition liquid discharged from the cleaning tank and circulate and supply the liquid to the rinsing tank.
  12. 　洗浄剤組成物液を一時的に貯留するバッファータンクが、前記精製装置と前記洗浄装置との間および前記洗浄装置と前記再生装置との間の少なくとも一方にさらに備えられた、請求項７に記載の電子部品の洗浄システム。 The buffer tank which temporarily stores a cleaning composition liquid is further provided in at least one between the said refinement | purification apparatus and the said washing | cleaning apparatus, and between the said washing | cleaning apparatus and the said regeneration apparatus. Electronic component cleaning system.
  13. 　前記洗浄装置が、シャワーノズルをさらに備え、精製装置により精製された洗浄剤組成物液を前記シャワーノズルから噴出して、前記蒸気洗浄後の電子部品をシャワー洗浄するように構成された、請求項１１に記載の電子部品の洗浄システム。 The cleaning device further includes a shower nozzle, and is configured to eject the cleaning composition liquid purified by the purification device from the shower nozzle to shower-wash the electronic component after the steam cleaning. The electronic component cleaning system according to 11.
PCT/JP2009/054167 2008-03-07 2009-03-05 Method and system for washing electronic component WO2009110548A1 (en)

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