WO2009060687A1 - Adhesive sheet and method for manufacturing semiconductor device using the same - Google Patents

Adhesive sheet and method for manufacturing semiconductor device using the same Download PDF

Info

Publication number
WO2009060687A1
WO2009060687A1 PCT/JP2008/068340 JP2008068340W WO2009060687A1 WO 2009060687 A1 WO2009060687 A1 WO 2009060687A1 JP 2008068340 W JP2008068340 W JP 2008068340W WO 2009060687 A1 WO2009060687 A1 WO 2009060687A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive sheet
semiconductor wafer
semiconductor device
same
base film
Prior art date
Application number
PCT/JP2008/068340
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshio Terada
Fumiteru Asai
Hirokuni Hashimoto
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007291254A external-priority patent/JP2009117718A/en
Priority claimed from JP2007291248A external-priority patent/JP5060249B2/en
Priority claimed from JP2007295526A external-priority patent/JP2009135124A/en
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to CN200880001164.9A priority Critical patent/CN101568611B/en
Priority to US12/513,316 priority patent/US8048690B2/en
Publication of WO2009060687A1 publication Critical patent/WO2009060687A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)

Abstract

Disclosed is an adhesive sheet wherein an adhesive layer is formed on a base film. This adhesive sheet is characterized in that the base film is composed of conductive fibers and a path for electrical conduction is formed between the adhesive layer and the base film. Consequently, an inspection for electrical conduction can be performed even when the adhesive sheet is bonded to a semiconductor wafer or a semiconductor chip obtained by dicing a semiconductor wafer. In addition, this adhesive sheet makes it possible to prevent deformation (warping) or breakage of a semiconductor wafer or generation of cracks or scratches on the back surface of the semiconductor wafer during the inspection.
PCT/JP2008/068340 2007-11-08 2008-10-09 Adhesive sheet and method for manufacturing semiconductor device using the same WO2009060687A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880001164.9A CN101568611B (en) 2007-11-08 2008-10-09 Adhesive sheet and method for manufacturing semiconductor device using the same
US12/513,316 US8048690B2 (en) 2007-11-08 2008-10-09 Pressure-sensitive adhesive sheet and process for producing semiconductor device having same

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2007291254A JP2009117718A (en) 2007-11-08 2007-11-08 Adhesive sheet for dicing
JP2007291248A JP5060249B2 (en) 2007-11-08 2007-11-08 Inspection adhesive sheet
JP2007-291254 2007-11-08
JP2007291251 2007-11-08
JP2007-291248 2007-11-08
JP2007-291251 2007-11-08
JP2007295526A JP2009135124A (en) 2007-11-08 2007-11-14 Adhesive sheet for dicing
JP2007-295526 2007-11-14

Publications (1)

Publication Number Publication Date
WO2009060687A1 true WO2009060687A1 (en) 2009-05-14

Family

ID=40625588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/068340 WO2009060687A1 (en) 2007-11-08 2008-10-09 Adhesive sheet and method for manufacturing semiconductor device using the same

Country Status (1)

Country Link
WO (1) WO2009060687A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130330546A1 (en) * 2011-03-03 2013-12-12 Nitto Denko Corporation Heat-peelable adhesive sheet
WO2016031786A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031788A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031787A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPH07294585A (en) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd Electric continuity inspection method of electronic parts
JP2000290616A (en) * 1999-04-06 2000-10-17 Tomoegawa Paper Co Ltd Electroconductive adhesive composition, electroconductive adhesive sheet and electromagnetic wave shielding material and electromagnetic wave shielding flexible printed circuit board using the same
JP2003020462A (en) * 2001-07-09 2003-01-24 Somar Corp Electroconductive adhesive composition having excellent flame-retardance and adhesive product produced by using the same
JP2005263876A (en) * 2004-03-16 2005-09-29 Lintec Corp Double-sided pressure-sensitive adhesive sheet and transfer method for brittle member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS526465A (en) * 1975-07-05 1977-01-18 Sankenshiya:Kk Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPH07294585A (en) * 1994-04-21 1995-11-10 Hitachi Chem Co Ltd Electric continuity inspection method of electronic parts
JP2000290616A (en) * 1999-04-06 2000-10-17 Tomoegawa Paper Co Ltd Electroconductive adhesive composition, electroconductive adhesive sheet and electromagnetic wave shielding material and electromagnetic wave shielding flexible printed circuit board using the same
JP2003020462A (en) * 2001-07-09 2003-01-24 Somar Corp Electroconductive adhesive composition having excellent flame-retardance and adhesive product produced by using the same
JP2005263876A (en) * 2004-03-16 2005-09-29 Lintec Corp Double-sided pressure-sensitive adhesive sheet and transfer method for brittle member

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130330546A1 (en) * 2011-03-03 2013-12-12 Nitto Denko Corporation Heat-peelable adhesive sheet
WO2016031786A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031788A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
WO2016031787A1 (en) * 2014-08-28 2016-03-03 リンテック株式会社 Conductive adhesive sheet
KR20170046659A (en) * 2014-08-28 2017-05-02 린텍 가부시키가이샤 Conductive adhesive sheet
JPWO2016031786A1 (en) * 2014-08-28 2017-06-15 リンテック株式会社 Conductive adhesive sheet
JPWO2016031788A1 (en) * 2014-08-28 2017-06-15 リンテック株式会社 Conductive adhesive sheet
JPWO2016031787A1 (en) * 2014-08-28 2017-06-15 リンテック株式会社 Conductive adhesive sheet
KR102390524B1 (en) 2014-08-28 2022-04-25 린텍 가부시키가이샤 Conductive adhesive sheet

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