JPS526465A - Manufacturing method of semi-conductor pellet slices for integrated ci rcuit - Google Patents
Manufacturing method of semi-conductor pellet slices for integrated ci rcuitInfo
- Publication number
- JPS526465A JPS526465A JP8298575A JP8298575A JPS526465A JP S526465 A JPS526465 A JP S526465A JP 8298575 A JP8298575 A JP 8298575A JP 8298575 A JP8298575 A JP 8298575A JP S526465 A JPS526465 A JP S526465A
- Authority
- JP
- Japan
- Prior art keywords
- rcuit
- slices
- semi
- integrated
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Dicing (AREA)
Abstract
PURPOSE: Affixing of the wafer to the base by a conductive binder so as to test the continuity without separating each sliced piece.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298575A JPS526465A (en) | 1975-07-05 | 1975-07-05 | Manufacturing method of semi-conductor pellet slices for integrated ci rcuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8298575A JPS526465A (en) | 1975-07-05 | 1975-07-05 | Manufacturing method of semi-conductor pellet slices for integrated ci rcuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS526465A true JPS526465A (en) | 1977-01-18 |
Family
ID=13789498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8298575A Pending JPS526465A (en) | 1975-07-05 | 1975-07-05 | Manufacturing method of semi-conductor pellet slices for integrated ci rcuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS526465A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5974731U (en) * | 1982-11-10 | 1984-05-21 | クラリオン株式会社 | Sample measuring device |
| JP2002025947A (en) * | 2000-07-10 | 2002-01-25 | Dowa Mining Co Ltd | Manufacturing method for semiconductor device |
| JP2007234344A (en) * | 2006-02-28 | 2007-09-13 | Toshiba Corp | Microwave tube |
| WO2009060687A1 (en) * | 2007-11-08 | 2009-05-14 | Nitto Denko Corporation | Adhesive sheet and method for manufacturing semiconductor device using the same |
| WO2009060686A1 (en) * | 2007-11-08 | 2009-05-14 | Nitto Denko Corporation | Adhesive sheet for inspection |
| JP2009114393A (en) * | 2007-11-08 | 2009-05-28 | Nitto Denko Corp | Adhesive sheet for inspection |
| US8048690B2 (en) | 2007-11-08 | 2011-11-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet and process for producing semiconductor device having same |
-
1975
- 1975-07-05 JP JP8298575A patent/JPS526465A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5974731U (en) * | 1982-11-10 | 1984-05-21 | クラリオン株式会社 | Sample measuring device |
| JP2002025947A (en) * | 2000-07-10 | 2002-01-25 | Dowa Mining Co Ltd | Manufacturing method for semiconductor device |
| JP4564138B2 (en) * | 2000-07-10 | 2010-10-20 | Ｄｏｗａホールディングス株式会社 | Manufacturing method of semiconductor device |
| JP2007234344A (en) * | 2006-02-28 | 2007-09-13 | Toshiba Corp | Microwave tube |
| WO2009060687A1 (en) * | 2007-11-08 | 2009-05-14 | Nitto Denko Corporation | Adhesive sheet and method for manufacturing semiconductor device using the same |
| WO2009060686A1 (en) * | 2007-11-08 | 2009-05-14 | Nitto Denko Corporation | Adhesive sheet for inspection |
| JP2009114394A (en) * | 2007-11-08 | 2009-05-28 | Nitto Denko Corp | Adhesive sheet for inspection |
| JP2009114393A (en) * | 2007-11-08 | 2009-05-28 | Nitto Denko Corp | Adhesive sheet for inspection |
| US8048690B2 (en) | 2007-11-08 | 2011-11-01 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet and process for producing semiconductor device having same |
| US8146438B2 (en) | 2007-11-08 | 2012-04-03 | Nitto Denko Corporation | Pressure-sensitive adhesive sheet for testing |
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