WO2009041235A1 - 電子部品の実装方法及び実装装置 - Google Patents
電子部品の実装方法及び実装装置 Download PDFInfo
- Publication number
- WO2009041235A1 WO2009041235A1 PCT/JP2008/065906 JP2008065906W WO2009041235A1 WO 2009041235 A1 WO2009041235 A1 WO 2009041235A1 JP 2008065906 W JP2008065906 W JP 2008065906W WO 2009041235 A1 WO2009041235 A1 WO 2009041235A1
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- WO
- WIPO (PCT)
- Prior art keywords
- electronic part
- anisotropic conductive
- adhesive film
- conductive adhesive
- chip
- Prior art date
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/065—Press rams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B5/00—Presses characterised by the use of pressing means other than those mentioned in the preceding groups
- B30B5/02—Presses characterised by the use of pressing means other than those mentioned in the preceding groups wherein the pressing means is in the form of a flexible element, e.g. diaphragm, urged by fluid pressure
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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Abstract
弾性体を用いた熱圧着の利点を活かしながら、ボイドの発生を最小限に抑え、接続不良の発生を大幅に低減することが可能な電子部品の実装方法及び実装装置を提供する。配線基板11上に接着剤(例えば異方導電性接着フィルム13)を介して電子部品(ICチップ12)を配置し、弾性体からなる圧着部4を備えた熱圧着ヘッド2により電子部品であるICチップ12を加圧するとともに、異方導電性接着フィルム13を加熱し、ICチップ12を配線基板11に熱圧着する。この時、異方導電性接着フィルム13の温度が異方導電性接着フィルム13に含まれる結着樹脂13aの硬化開始温度Kに到達する前に、熱圧着ヘッド2による加圧力が所定の圧力(ボイドを追い出すのに必要な圧力)に到達するように設定する。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2007250641A JP5164499B2 (ja) | 2007-09-27 | 2007-09-27 | 電子部品の実装方法及び電子部品実装基板 |
JP2007-250641 | 2007-09-27 |
Publications (1)
Publication Number | Publication Date |
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WO2009041235A1 true WO2009041235A1 (ja) | 2009-04-02 |
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ID=40511125
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2008/065906 WO2009041235A1 (ja) | 2007-09-27 | 2008-09-03 | 電子部品の実装方法及び実装装置 |
Country Status (3)
Country | Link |
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JP (1) | JP5164499B2 (ja) |
TW (1) | TW200939370A (ja) |
WO (1) | WO2009041235A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015037632A1 (ja) * | 2013-09-11 | 2015-03-19 | デクセリアルズ株式会社 | アンダーフィル材、及びこれを用いた半導体装置の製造方法 |
CN113611688A (zh) * | 2021-08-03 | 2021-11-05 | 东莞记忆存储科技有限公司 | 一种芯片结构及其加工方法 |
Families Citing this family (2)
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JP2010199546A (ja) * | 2009-11-25 | 2010-09-09 | Sony Chemical & Information Device Corp | 電子部品実装構造体及びその製造方法 |
CN113618192B (zh) * | 2021-10-13 | 2021-12-24 | 深圳荣耀智能机器有限公司 | 电路板组件焊接装置及电路板组件焊接方法 |
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JPH09219579A (ja) * | 1996-02-13 | 1997-08-19 | Oki Electric Ind Co Ltd | 電子部品の接続方法及び接続装置 |
JP2000306927A (ja) * | 1999-04-20 | 2000-11-02 | Sony Chem Corp | 半導体装置の製造方法 |
JP2002368395A (ja) * | 2001-06-11 | 2002-12-20 | Sony Corp | 部品の熱圧着固定方法及びその装置 |
JP3921459B2 (ja) * | 2003-07-11 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装方法及び実装装置 |
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- 2007-09-27 JP JP2007250641A patent/JP5164499B2/ja not_active Expired - Fee Related
-
2008
- 2008-09-03 WO PCT/JP2008/065906 patent/WO2009041235A1/ja active Application Filing
- 2008-09-24 TW TW097136757A patent/TW200939370A/zh unknown
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JPH09219579A (ja) * | 1996-02-13 | 1997-08-19 | Oki Electric Ind Co Ltd | 電子部品の接続方法及び接続装置 |
JP2000306927A (ja) * | 1999-04-20 | 2000-11-02 | Sony Chem Corp | 半導体装置の製造方法 |
JP2002368395A (ja) * | 2001-06-11 | 2002-12-20 | Sony Corp | 部品の熱圧着固定方法及びその装置 |
JP3921459B2 (ja) * | 2003-07-11 | 2007-05-30 | ソニーケミカル&インフォメーションデバイス株式会社 | 電気部品の実装方法及び実装装置 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2015037632A1 (ja) * | 2013-09-11 | 2015-03-19 | デクセリアルズ株式会社 | アンダーフィル材、及びこれを用いた半導体装置の製造方法 |
JP2015056479A (ja) * | 2013-09-11 | 2015-03-23 | デクセリアルズ株式会社 | アンダーフィル材、及びこれを用いた半導体装置の製造方法 |
US9691677B2 (en) | 2013-09-11 | 2017-06-27 | Dexerials Corporation | Underfill material and method for manufacturing semiconductor device using the same |
CN113611688A (zh) * | 2021-08-03 | 2021-11-05 | 东莞记忆存储科技有限公司 | 一种芯片结构及其加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2009081337A (ja) | 2009-04-16 |
JP5164499B2 (ja) | 2013-03-21 |
TW200939370A (en) | 2009-09-16 |
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