JP2015056479A - アンダーフィル材、及びこれを用いた半導体装置の製造方法 - Google Patents
アンダーフィル材、及びこれを用いた半導体装置の製造方法 Download PDFInfo
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- JP2015056479A JP2015056479A JP2013188291A JP2013188291A JP2015056479A JP 2015056479 A JP2015056479 A JP 2015056479A JP 2013188291 A JP2013188291 A JP 2013188291A JP 2013188291 A JP2013188291 A JP 2013188291A JP 2015056479 A JP2015056479 A JP 2015056479A
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- Prior art keywords
- temperature
- melt viscosity
- underfill material
- underfill
- epoxy resin
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- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
- C09J133/16—Homopolymers or copolymers of esters containing halogen atoms
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/18—Homopolymers or copolymers of nitriles
- C09J133/20—Homopolymers or copolymers of acrylonitrile
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
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Abstract
Description
工程B:基板上で半導体チップの位置合わせを行う。
工程C:高温・高圧により半導体チップと基板を圧着し、ハンダバンプの金属結合による導通確保、及びアンダーフィルフィルムの硬化による半導体チップと基板の接着を行う。
1.アンダーフィル材
2.半導体装置の製造方法
3.実施例
本実施の形態に係るアンダーフィル材は、ハンダ付き電極が形成された半導体チップを、ハンダ付き電極と対向する対向電極が形成された電子部品に搭載する前に、半導体チップに予め貼り合わされるものである。
次に、前述した先供給型アンダーフィルフィルムを用いた半導体装置の製造方法について説明する。
また、本技術は、半導体チップに設けた小さな孔に金属を充填することによって、サンドイッチ状に積み重ねた複数のチップ基板を電気的に接続するTSV(Through Silicon Via)技術にも適用可能である。
以下、本発明の実施例について説明する。本実施例では、先供給型のアンダーフィルフィルムを作製し、最低溶融粘度を測定し、最低溶融粘度到達温度+10℃〜最低溶融粘度到達温度+20℃の温度範囲における溶融粘度の傾きを算出した。そして、アンダーフィルフィルムを用いてハンダ付き電極を有するICチップと、これに対向する電極を有するIC基板とを接続させて実装体を作製し、ボイド及びハンダ接合状態を評価した。なお、本発明はこれらの実施例に限定されるものではない。
各アンダーフィルフィルムについて、レオメータ(TA社製ARES)を用いて、5℃/min、1Hzの条件でサンプルの最低溶融粘度及び最低溶融粘度到達温度を測定した。そして、最低溶融粘度到達温度+10℃〜最低溶融粘度到達温度+20℃の温度範囲における溶融粘度の傾きを算出した。
アンダーフィルフィルムをウエハ上にプレス機にて、50℃−0.5MPaの条件で貼り合わせ、ダンシングしてハンダ付き電極を有するICチップを得た。
50℃/secの昇温速度で熱圧着した第1の実装体、及び150℃/secの昇温速度で熱圧着した第2の実装体をSAT(Scanning Acoustic Tomograph, 超音波映像装置)を用いて観察した。第1の実装体及び第2の実装体の両者ともボイドが発生していない場合を「○」と評価し、いずれかの実装体にボイドが発生している場合を「×」と評価した。一般的に、ボイドが生じると、長期信頼性に悪影響を及ぼす可能性が高くなる。
50℃/secの昇温速度で熱圧着した第1の実装体、及び150℃/secの昇温速度で熱圧着した第2の実装体のサンプルを切断し、断面研磨を行い、ICチップの電極とIC基板の電極との間のハンダの状態をSEM(Scanning Electron Microscope)観察した。第1の実装体及び第2の実装体の両者ともハンダ接続、ハンダ濡れ共に良好な状態を「○」と評価し、いずれかの実装体のハンダ接続、又はハンダ濡れが不十分な状態を「×」と評価した。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を20質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を10質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を68質量部、有機過酸化物(品名:パーヘキサV、日油社製)を2質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが70/30の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を30質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を20質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を49質量部、有機過酸化物(品名:パーヘキサV、日油社製)を1質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが50/50の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を45質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を15質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を39質量部、有機過酸化物(品名:パーヘキサV、日油社製)を1質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが50/50の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を13質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を7質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を76質量部、有機過酸化物(品名:パーヘキサV、日油社製)を4質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが80/20の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
膜形成樹脂としてのアクリルゴムポリマー(品名:テイサンレジンSG−P3、ナガセケムテックス社製)を40質量部、エポキシ樹脂(品名:JER1031S、三菱化学社製)を40質量部、酸無水物(品名:リカシッドHNA−100、新日本理化社製)を30質量部、硬化促進剤としてのイミダゾール(品名:U−CAT−5002、サンアプロ社製)を1質量部、アクリル樹脂(品名:オクゾールEA−0200、大阪有機化学社製)を29質量部、有機過酸化物(品名:パーヘキサV、日油社製)を1質量部、フィラー(品名:アエロジルR202、日本アエロジル社製)を15質量部配合し、アクリル/エポキシが30/70の樹脂組成物を調製した。これを、剥離処理されたPET(Polyethylene terephthalate)にバーコーターを用いて塗布し、80℃のオーブンで3分間乾燥させ、厚み50μmのアンダーフィルフィルムを作製した(カバー剥離PET(25μm)/アンダーフィルフィルム(50μm)/ベース剥離PET(50μm))。
Claims (8)
- 第1の温度から第2の温度まで所定の昇温速度で昇温させるボンディング条件に用いられるアンダーフィル材であって、
エポキシ樹脂と、酸無水物と、アクリル樹脂と、有機過酸化物とを含有し、
最低溶融粘度が、1000Pa・s以上2000Pa・s以下であり、
最低溶融粘度到達温度より10℃高い温度から該温度より10℃高い温度までの溶融粘度の傾きが、900Pa・s/℃以上3100Pa・s/℃以下であるアンダーフィル材。 - 前記最低溶融粘度到達温度が、前記第1の温度と略同一である請求項1記載のアンダーフィル材。
- 前記アクリル樹脂と前記有機過酸化物との合計質量と、前記エポキシ樹脂と前記酸無水物との合計質量との比が、7:3〜4:6である請求項1又は2記載のアンダーフィル材。
- 前記エポキシ樹脂が、グリシジルエーテル型エポキシ樹脂であり、
前記酸無水物が、脂環式酸無水物である請求項1乃至3のいずれか1項に記載のアンダーフィル材。 - 前記アクリル樹脂が、フルオレン系アクリレートであり、
前記有機過酸化物が、パーオキシケタールである請求項1乃至4のいずれか1項に記載のアンダーフィル材。 - ハンダ付き電極が形成され、該電極面にアンダーフィル材が貼り合わされた半導体チップを、前記ハンダ付き電極と対向する対向電極が形成された電子部品に搭載する搭載工程と、
前記半導体チップと前記電子部品とを、第1の温度から第2の温度まで所定の昇温速度で昇温させて熱圧着する熱圧着工程とを有し、
前記アンダーフィル材は、エポキシ樹脂と、酸無水物と、アクリル樹脂と、有機過酸化物とを含有し、最低溶融粘度が、1000Pa・s以上2000Pa・s以下であり、最低溶融粘度到達温度より10℃高い温度から該温度より10℃高い温度までの溶融粘度の傾きが、900Pa・s/℃以上3100Pa・s/℃以下である半導体装置の製造方法。 - 前記第1の温度が、前記アンダーフィル材の最低溶融粘度到達温度と略同一である請求項6記載の半導体装置の製造方法。
- 前記第1の温度が、50℃以上150℃以下であり、
前記昇温速度が、50℃/sec以上150℃/sec以下である請求項6記載の半導体装置の製造方法。
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WO2016158960A1 (ja) * | 2015-03-31 | 2016-10-06 | デクセリアルズ株式会社 | 半導体装置の製造方法 |
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JPWO2017073630A1 (ja) * | 2015-10-29 | 2018-08-16 | 日立化成株式会社 | 半導体用接着剤、半導体装置及びそれを製造する方法 |
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WO2015037632A1 (ja) | 2015-03-19 |
US20150348858A1 (en) | 2015-12-03 |
KR20160058718A (ko) | 2016-05-25 |
JP6069143B2 (ja) | 2017-02-01 |
US9691677B2 (en) | 2017-06-27 |
TW201522485A (zh) | 2015-06-16 |
TWI637021B (zh) | 2018-10-01 |
KR102308395B1 (ko) | 2021-10-06 |
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