WO2009031472A1 - 接着剤及びそれを用いた接続構造体 - Google Patents

接着剤及びそれを用いた接続構造体 Download PDF

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Publication number
WO2009031472A1
WO2009031472A1 PCT/JP2008/065570 JP2008065570W WO2009031472A1 WO 2009031472 A1 WO2009031472 A1 WO 2009031472A1 JP 2008065570 W JP2008065570 W JP 2008065570W WO 2009031472 A1 WO2009031472 A1 WO 2009031472A1
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WIPO (PCT)
Prior art keywords
adhesive
same
connecting structure
polymerizable compound
radical polymerizable
Prior art date
Application number
PCT/JP2008/065570
Other languages
English (en)
French (fr)
Inventor
Emi Miyazawa
Shigeki Katogi
Hiroyuki Izawa
Toshiaki Shirasaka
Keiko Tomizawa
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009531210A priority Critical patent/JP5456475B2/ja
Priority to CN200880105355XA priority patent/CN101821352B/zh
Priority to KR1020097016727A priority patent/KR101187092B1/ko
Publication of WO2009031472A1 publication Critical patent/WO2009031472A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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  • Wire Bonding (AREA)
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  • Combinations Of Printed Boards (AREA)

Abstract

　（ａ）熱可塑性樹脂、（ｂ）ラジカル重合性化合物、及び（ｃ）ラジカル重合開始剤を含有してなる接着剤であって、（ｂ）ラジカル重合性化合物が３０°C以下で固体である接着剤。
PCT/JP2008/065570 2007-09-05 2008-08-29 接着剤及びそれを用いた接続構造体 WO2009031472A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009531210A JP5456475B2 (ja) 2007-09-05 2008-08-29 接着剤及びそれを用いた接続構造体
CN200880105355XA CN101821352B (zh) 2007-09-05 2008-08-29 粘接剂以及使用该粘接剂的连接结构体
KR1020097016727A KR101187092B1 (ko) 2007-09-05 2008-08-29 접착제 및 그것을 이용한 접속 구조체

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JP2007230166 2007-09-05
JP2007-230166 2007-09-05

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WO2009031472A1 true WO2009031472A1 (ja) 2009-03-12

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JP (3) JP5456475B2 (ja)
KR (2) KR101187092B1 (ja)
CN (3) CN103351829A (ja)
TW (3) TWI509044B (ja)
WO (1) WO2009031472A1 (ja)

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JP2010225312A (ja) * 2009-03-19 2010-10-07 Hitachi Chem Co Ltd 樹脂ペースト組成物及び半導体装置
CN101955735A (zh) * 2009-07-17 2011-01-26 日立化成工业株式会社 粘接剂组合物以及使用该组合物的电路部件的连接结构体
WO2011111784A1 (ja) * 2010-03-12 2011-09-15 日立化成工業株式会社 接着材リール

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CN103717698B (zh) * 2011-07-29 2018-05-18 日立化成株式会社 粘接剂组合物、使用了其的膜状粘接剂及电路连接材料、电路构件的连接结构及其制造方法
KR20130139134A (ko) 2012-06-12 2013-12-20 제일모직주식회사 접착제 조성물, 이를 이용한 편광판, 그 제조 방법 및 이를 포함하는 광학 부재
JP6051662B2 (ja) * 2012-08-03 2016-12-27 日立化成株式会社 回路接続用接着剤組成物、接着シート、接着剤リール及び回路部材の接続構造体
JP6135243B2 (ja) * 2013-03-29 2017-05-31 東洋インキＳｃホールディングス株式会社 粘着剤およびそれを用いた粘着シート
CN104293247B (zh) * 2014-10-16 2016-06-08 安徽省阜阳沪千人造板制造有限公司 一种含有竹纤维的防水板材胶黏剂
KR102528123B1 (ko) 2015-10-09 2023-05-03 주식회사 다이셀 접착제
GB2543756B (en) * 2015-10-22 2017-10-18 Henkel IP & Holding GmbH Anaerobically curable compositions
DE102016224169A1 (de) * 2016-12-05 2018-06-07 Tesa Se Reaktives 2-Komponentenklebesystem in Filmform mit verbesserter Feuchtwärmebeständigkeit
WO2018222273A1 (en) * 2017-05-31 2018-12-06 Dow Global Technologies Llc Solvent-based adhesive compositions
JP6898413B2 (ja) 2018-10-31 2021-07-07 デクセリアルズ株式会社 接続体の製造方法、異方性接合フィルム、接続体
JP6946395B2 (ja) * 2019-10-25 2021-10-06 日本化学工業株式会社 導電性接着剤、それを用いた接着構造体及び電子部品
WO2022036307A1 (en) * 2020-08-14 2022-02-17 Brewer Science, Inc. Permanent bonding and patterning material

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CN103351829A (zh) 2013-10-16
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