TWI509044B - The connection of the circuit member connection and the connection of the circuit member using the circuit member Structure - Google Patents
The connection of the circuit member connection and the connection of the circuit member using the circuit member Structure Download PDFInfo
- Publication number
- TWI509044B TWI509044B TW103117356A TW103117356A TWI509044B TW I509044 B TWI509044 B TW I509044B TW 103117356 A TW103117356 A TW 103117356A TW 103117356 A TW103117356 A TW 103117356A TW I509044 B TWI509044 B TW I509044B
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- Taiwan
- Prior art keywords
- adhesive
- circuit member
- connection
- circuit
- connection terminal
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
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- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- Chemical & Material Sciences (AREA)
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- Spectroscopy & Molecular Physics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
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- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Conductive Materials (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
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JP2007230166 | 2007-09-05 |
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TW100126362A TWI441888B (zh) | 2007-09-05 | 2008-09-03 | An adhesive and a connecting structure using the circuit member |
TW097133756A TWI408198B (zh) | 2007-09-05 | 2008-09-03 | An adhesive and a connecting structure using the circuit member |
TW103117356A TWI509044B (zh) | 2007-09-05 | 2008-09-03 | The connection of the circuit member connection and the connection of the circuit member using the circuit member Structure |
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TW100126362A TWI441888B (zh) | 2007-09-05 | 2008-09-03 | An adhesive and a connecting structure using the circuit member |
TW097133756A TWI408198B (zh) | 2007-09-05 | 2008-09-03 | An adhesive and a connecting structure using the circuit member |
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JP2010225312A (ja) * | 2009-03-19 | 2010-10-07 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及び半導体装置 |
JP5418399B2 (ja) * | 2009-07-17 | 2014-02-19 | 日立化成株式会社 | 接着剤組成物及び該接着剤組成物を用いた回路部材の接続構造体 |
KR20120113803A (ko) * | 2010-03-12 | 2012-10-15 | 히다치 가세고교 가부시끼가이샤 | 접착재 릴 |
WO2013018152A1 (ja) * | 2011-07-29 | 2013-02-07 | 日立化成工業株式会社 | 接着剤組成物、それを用いたフィルム状接着剤及び回路接続材料、回路部材の接続構造及びその製造方法 |
KR20130139134A (ko) | 2012-06-12 | 2013-12-20 | 제일모직주식회사 | 접착제 조성물, 이를 이용한 편광판, 그 제조 방법 및 이를 포함하는 광학 부재 |
JP6051662B2 (ja) * | 2012-08-03 | 2016-12-27 | 日立化成株式会社 | 回路接続用接着剤組成物、接着シート、接着剤リール及び回路部材の接続構造体 |
JP6135243B2 (ja) * | 2013-03-29 | 2017-05-31 | 東洋インキScホールディングス株式会社 | 粘着剤およびそれを用いた粘着シート |
CN104293247B (zh) * | 2014-10-16 | 2016-06-08 | 安徽省阜阳沪千人造板制造有限公司 | 一种含有竹纤维的防水板材胶黏剂 |
US10947425B2 (en) | 2015-10-09 | 2021-03-16 | Daicel Corporation | Adhesive |
GB2543756B (en) * | 2015-10-22 | 2017-10-18 | Henkel IP & Holding GmbH | Anaerobically curable compositions |
DE102016224169A1 (de) * | 2016-12-05 | 2018-06-07 | Tesa Se | Reaktives 2-Komponentenklebesystem in Filmform mit verbesserter Feuchtwärmebeständigkeit |
EP3630862A1 (en) * | 2017-05-31 | 2020-04-08 | Dow Global Technologies LLC | Solvent-based adhesive compositions |
KR102568476B1 (ko) * | 2018-10-31 | 2023-08-18 | 데쿠세리아루즈 가부시키가이샤 | 접속체의 제조 방법, 이방성 접합 필름, 접속체 |
JP6946395B2 (ja) * | 2019-10-25 | 2021-10-06 | 日本化学工業株式会社 | 導電性接着剤、それを用いた接着構造体及び電子部品 |
US20220049095A1 (en) * | 2020-08-14 | 2022-02-17 | Brewer Science, Inc. | Permanent bonding and patterning material |
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JP2000008021A (ja) * | 1998-06-18 | 2000-01-11 | Nichiban Co Ltd | 熱硬化性接着剤組成物及びそれから得られるシート |
JP2006257208A (ja) * | 2005-03-16 | 2006-09-28 | Hitachi Chem Co Ltd | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
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JP3363331B2 (ja) * | 1996-11-14 | 2003-01-08 | 住友ベークライト株式会社 | 異方導電性接着剤 |
WO1998044067A1 (en) * | 1997-03-31 | 1998-10-08 | Hitachi Chemical Company, Ltd. | Circuit connecting material, and structure and method of connecting circuit terminal |
JP3503740B2 (ja) * | 1999-03-04 | 2004-03-08 | 住友ベークライト株式会社 | 異方導電性接着剤及びそれを用いた電子機器 |
JP2001049228A (ja) * | 1999-08-12 | 2001-02-20 | Sony Chem Corp | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
JP3915512B2 (ja) * | 2000-04-25 | 2007-05-16 | 日立化成工業株式会社 | 回路接続用接着剤並びにそれを用いた回路接続方法及び回路接続構造体 |
JP3660858B2 (ja) * | 2000-06-01 | 2005-06-15 | ニチバン株式会社 | 油面接着性熱硬化性組成物 |
JP4363844B2 (ja) * | 2002-12-26 | 2009-11-11 | ソニーケミカル&インフォメーションデバイス株式会社 | 低温硬化型接着剤及びこれを用いた異方導電性接着フィルム |
CN100368476C (zh) * | 2004-09-21 | 2008-02-13 | 广州宏昌胶粘带厂 | 宽温域聚丙烯酸酯/聚氨酯/聚硅氧烷阻尼胶乳的制备 |
CN102796487B (zh) * | 2005-03-16 | 2014-04-02 | 日立化成株式会社 | 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 |
JP4760069B2 (ja) * | 2005-03-16 | 2011-08-31 | 日立化成工業株式会社 | 接着剤組成物、回路接続用接着剤組成物及びそれを用いた回路接続構造体、半導体装置 |
WO2008065997A1 (fr) * | 2006-12-01 | 2008-06-05 | Hitachi Chemical Company, Ltd. | Adhésif et structure de liaison utilisant celui-ci |
JP2008195852A (ja) * | 2007-02-14 | 2008-08-28 | Hitachi Chem Co Ltd | フィルム状接着剤組成物及びこの組成物を用いた回路端子の接続構造体 |
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- 2008-09-03 TW TW100126362A patent/TWI441888B/zh active
- 2008-09-03 TW TW097133756A patent/TWI408198B/zh active
- 2008-09-03 TW TW103117356A patent/TWI509044B/zh active
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2011
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000008021A (ja) * | 1998-06-18 | 2000-01-11 | Nichiban Co Ltd | 熱硬化性接着剤組成物及びそれから得られるシート |
JP2006257208A (ja) * | 2005-03-16 | 2006-09-28 | Hitachi Chem Co Ltd | 接着剤、回路接続用接着剤、接続体及び半導体装置 |
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Publication number | Publication date |
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CN101821352A (zh) | 2010-09-01 |
CN102977798B (zh) | 2015-04-29 |
TW201141978A (en) | 2011-12-01 |
JPWO2009031472A1 (ja) | 2010-12-16 |
JP2011231334A (ja) | 2011-11-17 |
KR101187092B1 (ko) | 2012-09-28 |
KR20090128383A (ko) | 2009-12-15 |
JP2013007040A (ja) | 2013-01-10 |
TWI408198B (zh) | 2013-09-11 |
CN101821352B (zh) | 2013-06-19 |
TW201435029A (zh) | 2014-09-16 |
JP5456475B2 (ja) | 2014-03-26 |
CN103351829A (zh) | 2013-10-16 |
CN102977798A (zh) | 2013-03-20 |
TWI441888B (zh) | 2014-06-21 |
TW200930781A (en) | 2009-07-16 |
KR20110082092A (ko) | 2011-07-15 |
WO2009031472A1 (ja) | 2009-03-12 |
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