WO2009020199A1 - 鉛フリーハンダフラックス除去用洗浄剤組成物、および鉛フリーハンダフラックスの除去方法 - Google Patents

鉛フリーハンダフラックス除去用洗浄剤組成物、および鉛フリーハンダフラックスの除去方法 Download PDF

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Publication number
WO2009020199A1
WO2009020199A1 PCT/JP2008/064275 JP2008064275W WO2009020199A1 WO 2009020199 A1 WO2009020199 A1 WO 2009020199A1 JP 2008064275 W JP2008064275 W JP 2008064275W WO 2009020199 A1 WO2009020199 A1 WO 2009020199A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
removal
soldering flux
free soldering
cleanser composition
Prior art date
Application number
PCT/JP2008/064275
Other languages
English (en)
French (fr)
Inventor
Takashi Tanaka
Kazutaka Zenfuku
Original Assignee
Arakawa Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arakawa Chemical Industries, Ltd. filed Critical Arakawa Chemical Industries, Ltd.
Priority to CN2008801022975A priority Critical patent/CN101827928B/zh
Priority to JP2009526499A priority patent/JP5428859B2/ja
Priority to US12/668,798 priority patent/US8372792B2/en
Priority to KR1020107002821A priority patent/KR101530321B1/ko
Publication of WO2009020199A1 publication Critical patent/WO2009020199A1/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3227—Ethers thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/50—Solvents
    • C11D7/5004—Organic solvents
    • C11D7/5022—Organic solvents containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/20—Industrial or commercial equipment, e.g. reactors, tubes or engines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/263—Ethers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Detergent Compositions (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

　本発明の目的は、引火の危険性や環境への影響が小さいだけでなく、鉛フリーハンダでハンダ付した被洗浄物の狭小な部分・間隙に付着したフラックス残渣の溶解力に優れ、かつ、水すすぎ工程における被洗浄物の再汚染が生じにくい、新規な洗浄剤組成物を提供することである。 　特定の一般式で表される化合物からなる非ハロゲン系有機溶剤（Ａ）、特定の一般式で表されるアミン系化合物（Ｂ）、アミノ基非含有キレート剤（Ｃ）、ならびに必要に応じて水を含有する組成物を用いる。
PCT/JP2008/064275 2007-08-08 2008-08-08 鉛フリーハンダフラックス除去用洗浄剤組成物、および鉛フリーハンダフラックスの除去方法 WO2009020199A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801022975A CN101827928B (zh) 2007-08-08 2008-08-08 用于除去无铅助焊剂的清洁剂组合物以及用于除去无铅助焊剂的方法
JP2009526499A JP5428859B2 (ja) 2007-08-08 2008-08-08 鉛フリーハンダフラックス除去用洗浄剤組成物、および鉛フリーハンダフラックスの除去方法
US12/668,798 US8372792B2 (en) 2007-08-08 2008-08-08 Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux
KR1020107002821A KR101530321B1 (ko) 2007-08-08 2008-08-08 무연 땜납 플럭스 제거용 세정제 조성물 및 무연 땜납 플럭스의 제거 방법

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007207107 2007-08-08
JP2007-207107 2007-08-08
JP2008-018852 2008-01-30
JP2008018852 2008-01-30

Publications (1)

Publication Number Publication Date
WO2009020199A1 true WO2009020199A1 (ja) 2009-02-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/064275 WO2009020199A1 (ja) 2007-08-08 2008-08-08 鉛フリーハンダフラックス除去用洗浄剤組成物、および鉛フリーハンダフラックスの除去方法

Country Status (6)

Country Link
US (1) US8372792B2 (ja)
JP (1) JP5428859B2 (ja)
KR (1) KR101530321B1 (ja)
CN (1) CN101827928B (ja)
TW (1) TWI443191B (ja)
WO (1) WO2009020199A1 (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010024141A1 (ja) * 2008-08-27 2010-03-04 荒川化学工業株式会社 鉛フリーはんだフラックス除去用洗浄剤組成物および鉛フリーはんだフラックス除去システム
WO2011027673A1 (ja) * 2009-09-03 2011-03-10 荒川化学工業株式会社 鉛フリーハンダ水溶性フラックス除去用洗浄剤、除去方法及び洗浄方法
CN102051286A (zh) * 2011-01-18 2011-05-11 广州瀚源电子科技有限公司 一种松香型焊锡膏用水基清洗剂
JP2015113379A (ja) * 2013-12-10 2015-06-22 花王株式会社 半田フラックス残渣除去用洗浄剤組成物
JP2015145476A (ja) * 2014-02-03 2015-08-13 花王株式会社 半田フラックス残渣除去用洗浄剤組成物
JP2015178599A (ja) * 2014-02-27 2015-10-08 荒川化学工業株式会社 洗浄剤組成物原液、洗浄剤組成物および洗浄方法
JP2016014081A (ja) * 2014-06-30 2016-01-28 花王株式会社 半田フラックス残渣除去用洗浄剤組成物
JP2017513988A (ja) * 2014-04-16 2017-06-01 エコラボ ユーエスエー インコーポレイティド 錠剤コーティングを除去するために有用な組成物及び方法
JP2018021093A (ja) * 2016-08-01 2018-02-08 花王株式会社 スクリーン版用洗浄剤組成物
JP2019147150A (ja) * 2014-04-16 2019-09-05 エコラボ ユーエスエー インコーポレイティド 錠剤コーティングを除去するために有用な組成物及び方法
JPWO2020116534A1 (ja) * 2018-12-05 2021-10-21 花王株式会社 フラックス残渣の洗浄

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US8372792B2 (en) * 2007-08-08 2013-02-12 Arakawa Chemical Industries, Ltd. Cleaner composition for removing lead-free soldering flux, and method for removing lead-free soldering flux
US8309502B2 (en) * 2009-03-27 2012-11-13 Eastman Chemical Company Compositions and methods for removing organic substances
US8614053B2 (en) 2009-03-27 2013-12-24 Eastman Chemical Company Processess and compositions for removing substances from substrates
US8444768B2 (en) * 2009-03-27 2013-05-21 Eastman Chemical Company Compositions and methods for removing organic substances
JP5514657B2 (ja) * 2010-07-09 2014-06-04 日本特殊陶業株式会社 配線基板の製造方法
US9170051B2 (en) * 2012-04-02 2015-10-27 Illinois Tool Works Inc. Reflow oven and methods of treating surfaces of the reflow oven
US8940099B2 (en) 2012-04-02 2015-01-27 Illinois Tool Works Inc. Reflow oven and methods of treating surfaces of the reflow oven
US9029268B2 (en) 2012-11-21 2015-05-12 Dynaloy, Llc Process for etching metals
US9902006B2 (en) 2014-07-25 2018-02-27 Raytheon Company Apparatus for cleaning an electronic circuit board
CN108929808B (zh) * 2017-05-26 2020-11-27 荒川化学工业株式会社 无铅软钎料焊剂用清洗剂组合物、无铅软钎料焊剂的清洗方法
KR20210099579A (ko) * 2018-12-05 2021-08-12 카오카부시키가이샤 플럭스 잔사 제거용 세정제 조성물
CN111073765A (zh) * 2019-12-11 2020-04-28 长沙凯泽工程设计有限公司 一种电子线路板清洁清洗剂的制备方法

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US8211845B2 (en) 2008-08-27 2012-07-03 Arakawa Chemical Industries, Ltd. Cleaning composition for removing lead-free solder flux and system for removing lead-free solder flux
WO2010024141A1 (ja) * 2008-08-27 2010-03-04 荒川化学工業株式会社 鉛フリーはんだフラックス除去用洗浄剤組成物および鉛フリーはんだフラックス除去システム
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JP2019147150A (ja) * 2014-04-16 2019-09-05 エコラボ ユーエスエー インコーポレイティド 錠剤コーティングを除去するために有用な組成物及び方法
JP2017513988A (ja) * 2014-04-16 2017-06-01 エコラボ ユーエスエー インコーポレイティド 錠剤コーティングを除去するために有用な組成物及び方法
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JP2016014081A (ja) * 2014-06-30 2016-01-28 花王株式会社 半田フラックス残渣除去用洗浄剤組成物
WO2018025648A1 (ja) * 2016-08-01 2018-02-08 花王株式会社 スクリーン版用洗浄剤組成物
JP2018021093A (ja) * 2016-08-01 2018-02-08 花王株式会社 スクリーン版用洗浄剤組成物
JPWO2020116534A1 (ja) * 2018-12-05 2021-10-21 花王株式会社 フラックス残渣の洗浄
JP7370339B2 (ja) 2018-12-05 2023-10-27 花王株式会社 フラックス残渣の洗浄

Also Published As

Publication number Publication date
TWI443191B (zh) 2014-07-01
CN101827928A (zh) 2010-09-08
CN101827928B (zh) 2012-10-03
JP5428859B2 (ja) 2014-02-26
US8372792B2 (en) 2013-02-12
KR20100047254A (ko) 2010-05-07
TW200914606A (en) 2009-04-01
JPWO2009020199A1 (ja) 2010-11-04
US20100180917A1 (en) 2010-07-22
KR101530321B1 (ko) 2015-06-19

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