WO2009005017A1 - Boîtier semi-conducteur et procédé de fabrication correspondant - Google Patents
Boîtier semi-conducteur et procédé de fabrication correspondant Download PDFInfo
- Publication number
- WO2009005017A1 WO2009005017A1 PCT/JP2008/061773 JP2008061773W WO2009005017A1 WO 2009005017 A1 WO2009005017 A1 WO 2009005017A1 JP 2008061773 W JP2008061773 W JP 2008061773W WO 2009005017 A1 WO2009005017 A1 WO 2009005017A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor
- semiconductor package
- substrate
- manufacturing
- same
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 11
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 8
- 125000006850 spacer group Chemical group 0.000 abstract 2
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880022659A CN101689533A (zh) | 2007-06-29 | 2008-06-27 | 半导体封装组件及其制造方法 |
EP08790715A EP2164098A4 (fr) | 2007-06-29 | 2008-06-27 | Boîtier semi-conducteur et procédé de fabrication correspondant |
US12/648,172 US8330268B2 (en) | 2007-06-29 | 2009-12-28 | Semiconductor package and manufacturing method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007171915A JP2009010261A (ja) | 2007-06-29 | 2007-06-29 | 半導体パッケージおよびその製造方法 |
JP2007-171915 | 2007-06-29 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/648,172 Continuation US8330268B2 (en) | 2007-06-29 | 2009-12-28 | Semiconductor package and manufacturing method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009005017A1 true WO2009005017A1 (fr) | 2009-01-08 |
Family
ID=40226063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/061773 WO2009005017A1 (fr) | 2007-06-29 | 2008-06-27 | Boîtier semi-conducteur et procédé de fabrication correspondant |
Country Status (7)
Country | Link |
---|---|
US (1) | US8330268B2 (fr) |
EP (1) | EP2164098A4 (fr) |
JP (1) | JP2009010261A (fr) |
KR (1) | KR20100025538A (fr) |
CN (1) | CN101689533A (fr) |
TW (1) | TW200913239A (fr) |
WO (1) | WO2009005017A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010095201A1 (fr) * | 2009-02-20 | 2010-08-26 | パナソニック株式会社 | Dispositif à semi-conducteur et procédé de fabrication de dispositif à semi-conducteur |
WO2011035783A1 (fr) * | 2009-09-24 | 2011-03-31 | Msg Lithoglas Ag | Procédé de réalisation d'un agencement comprenant un composant appliqué sur un substrat support et agencement ainsi que procédé de réalisation d'un produit semi-fini et produit semi-fini |
WO2014045633A1 (fr) * | 2012-09-24 | 2014-03-27 | オリンパス株式会社 | Dispositif d'imagerie et endoscope équipé du dispositif d'imagerie |
JP2015529394A (ja) * | 2012-08-23 | 2015-10-05 | レイセオン カンパニー | ウエハーレベルパッケージングされる赤外線フォーカルプレーンアレイの反射防止コーティングされるキャップウエハーにおける応力緩和方法 |
US11174705B2 (en) | 2019-04-30 | 2021-11-16 | Weatherford Technology Holdings, Llc | Tubing tester valve and associated methods |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0914350D0 (en) * | 2009-08-17 | 2009-09-30 | St Microelectronics Res & Dev | Improvements in or relating to filters in an image sensor |
WO2011156926A1 (fr) * | 2010-06-14 | 2011-12-22 | Heptagon Oy | Procédé de fabrication d'une pluralité de dispositifs optiques |
US9075182B2 (en) * | 2011-06-03 | 2015-07-07 | VisEra Technology Company Limited | Camera module and spacer of a lens structure in the camera module |
KR101980634B1 (ko) * | 2011-06-30 | 2019-05-22 | 엘지이노텍 주식회사 | 렌즈 유닛, 및 이를 포함하는 카메라 모듈 |
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EP3297036A1 (fr) * | 2009-09-24 | 2018-03-21 | MSG Lithoglas GmbH | Procédé de fabrication d'un dispositif pourvu d'un élément de construction sur un substrat de support et dispositif ainsi que procédé de fabrication d'un produit semi-fini |
JP2015529394A (ja) * | 2012-08-23 | 2015-10-05 | レイセオン カンパニー | ウエハーレベルパッケージングされる赤外線フォーカルプレーンアレイの反射防止コーティングされるキャップウエハーにおける応力緩和方法 |
US9427776B2 (en) | 2012-08-23 | 2016-08-30 | Raytheon Company | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays |
US10315918B2 (en) | 2012-08-23 | 2019-06-11 | Raytheon Company | Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays |
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US11174705B2 (en) | 2019-04-30 | 2021-11-16 | Weatherford Technology Holdings, Llc | Tubing tester valve and associated methods |
Also Published As
Publication number | Publication date |
---|---|
KR20100025538A (ko) | 2010-03-09 |
US20100102437A1 (en) | 2010-04-29 |
CN101689533A (zh) | 2010-03-31 |
JP2009010261A (ja) | 2009-01-15 |
EP2164098A1 (fr) | 2010-03-17 |
EP2164098A4 (fr) | 2013-03-13 |
US8330268B2 (en) | 2012-12-11 |
TW200913239A (en) | 2009-03-16 |
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