WO2008142864A1 - 部品実装方法、部品実装機、実装条件決定方法、実装条件決定装置およびプログラム - Google Patents

部品実装方法、部品実装機、実装条件決定方法、実装条件決定装置およびプログラム Download PDF

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Publication number
WO2008142864A1
WO2008142864A1 PCT/JP2008/001250 JP2008001250W WO2008142864A1 WO 2008142864 A1 WO2008142864 A1 WO 2008142864A1 JP 2008001250 W JP2008001250 W JP 2008001250W WO 2008142864 A1 WO2008142864 A1 WO 2008142864A1
Authority
WO
WIPO (PCT)
Prior art keywords
mounting
component
prescribed
determining
conditions
Prior art date
Application number
PCT/JP2008/001250
Other languages
English (en)
French (fr)
Inventor
Yasuhiro Maenishi
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to CN2008800172227A priority Critical patent/CN101690445B/zh
Priority to DE112008001382T priority patent/DE112008001382T5/de
Priority to US12/600,574 priority patent/US8527082B2/en
Priority to KR1020097024042A priority patent/KR101123464B1/ko
Publication of WO2008142864A1 publication Critical patent/WO2008142864A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0452—Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

　基板に部品を実装する部品実装方法であって、前記部品実装方法は、基板に部品を実装する実装ヘッドと、基板の表面状態を検査する検査ヘッドとを備える部品実装機に適用され、前記実装ヘッドにより所定の基板に対し部品の実装を繰り返す実装ステップと、実装すべき部品が所定の部品か否かを判定する判定ステップと、前記判定ステップにおいて前記実装すべき部品が前記所定の部品と判断された場合に、（ｉ）前記所定の部品の装着が終了した後に、前記所定の部品の装着状態を検査する、および（ｉｉ）前記所定の部品の装着が開始されるまでの間に、前記所定の部品に関する実装面状態を検査する、の少なくとも一方を実行する前記実装ステップの途中で、前記検査ヘッドにより前記基板の表面状態を検査する検査ステップとを含む。
PCT/JP2008/001250 2007-05-24 2008-05-20 部品実装方法、部品実装機、実装条件決定方法、実装条件決定装置およびプログラム WO2008142864A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008800172227A CN101690445B (zh) 2007-05-24 2008-05-20 元件安装方法及元件安装机
DE112008001382T DE112008001382T5 (de) 2007-05-24 2008-05-20 Bauelement-Montageverfahren, Bauelement-Montagevorrichtung, Verfahren zum Bestimmen von Montagebedingungen sowie Vorrichtung und Programm zum Bestimmen von Montagebedingungen
US12/600,574 US8527082B2 (en) 2007-05-24 2008-05-20 Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions
KR1020097024042A KR101123464B1 (ko) 2007-05-24 2008-05-20 부품 실장 방법, 부품 실장기, 실장 조건 결정 방법, 실장 조건 결정 장치 및 프로그램

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007138341 2007-05-24
JP2007-138341 2007-05-24
JP2007-183657 2007-07-12
JP2007183657 2007-07-12

Publications (1)

Publication Number Publication Date
WO2008142864A1 true WO2008142864A1 (ja) 2008-11-27

Family

ID=40031583

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001250 WO2008142864A1 (ja) 2007-05-24 2008-05-20 部品実装方法、部品実装機、実装条件決定方法、実装条件決定装置およびプログラム

Country Status (5)

Country Link
US (1) US8527082B2 (ja)
KR (1) KR101123464B1 (ja)
CN (1) CN101690445B (ja)
DE (1) DE112008001382T5 (ja)
WO (1) WO2008142864A1 (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
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US8673685B1 (en) 2011-12-22 2014-03-18 Panasonic Corporation Electronic component mounting line and electronic component mounting method
JP2014143365A (ja) * 2013-01-25 2014-08-07 Juki Corp 電子部品実装装置および電子部品実装方法
US10194570B2 (en) 2014-11-13 2019-01-29 Fuji Corporation Mounter and method for inspecting suction posture of electronic component using mounter
WO2020170349A1 (ja) * 2019-02-20 2020-08-27 株式会社Ｆｕｊｉ 外観検査方法、実装機
JP2020136599A (ja) * 2019-02-25 2020-08-31 株式会社Ｆｕｊｉ データ作成装置、決定装置、装着作業機、及び、装着作業実行方法
WO2023105606A1 (ja) * 2021-12-07 2023-06-15 株式会社Fuji 作業機

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JP6043993B2 (ja) * 2011-10-31 2016-12-14 Ｊｕｋｉオートメーションシステムズ株式会社 部品実装装置、情報処理装置、情報処理方法及び基板の製造方法
JP5746610B2 (ja) * 2011-12-22 2015-07-08 ヤマハ発動機株式会社 部品撮像装置および同装置を備えた部品実装装置
CN106879245A (zh) * 2012-02-08 2017-06-20 Juki株式会社 电子部件安装装置、电子部件安装***以及电子部件安装方法
JP5903660B2 (ja) * 2012-05-21 2016-04-13 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装システムにおける部品管理方法
WO2014041624A1 (ja) 2012-09-12 2014-03-20 富士機械製造株式会社 対基板作業システム、作業手順最適化プログラム、作業台数決定プログラム
JP5996983B2 (ja) * 2012-09-19 2016-09-21 ヤマハ発動機株式会社 電子部品装着装置
JP5945697B2 (ja) * 2012-11-19 2016-07-05 パナソニックＩｐマネジメント株式会社 電子部品実装システムおよび電子部品実装方法
US9615495B2 (en) * 2012-11-19 2017-04-04 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system and electronic component mounting method
US9661793B2 (en) * 2012-11-19 2017-05-23 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system and electronic component mounting method
US10420269B2 (en) * 2013-09-17 2019-09-17 Fuji Corporation Mounting inspection device
CN105744824A (zh) * 2014-12-10 2016-07-06 安徽海创自动控制设备有限公司 一种自动贴片装置
EP3329755A1 (en) * 2015-07-31 2018-06-06 ISMECA Semiconductor Holding SA An assembly and method for handling components
EP3346814B1 (en) * 2015-09-01 2020-10-21 FUJI Corporation Work allocation device
CN107926151B (zh) * 2015-09-01 2021-02-05 株式会社富士 要求精度设定装置
CN108142000B (zh) * 2015-10-14 2020-08-07 雅马哈发动机株式会社 基板作业***及元件安装装置
JP6695746B2 (ja) * 2016-06-27 2020-05-20 株式会社キーエンス 測定装置
US10824137B2 (en) * 2017-06-19 2020-11-03 Panasonic Intellectual Property Management Co., Ltd. Mounting board manufacturing system
JP6913851B2 (ja) * 2017-08-24 2021-08-04 パナソニックＩｐマネジメント株式会社 実装基板製造システムおよび実装基板製造方法
WO2019043892A1 (ja) * 2017-08-31 2019-03-07 株式会社Ｆｕｊｉ 部品装着機及び部品装着方法
KR102267919B1 (ko) * 2018-06-28 2021-06-23 주식회사 고영테크놀러지 기판에 실장된 부품의 실장 불량 원인을 결정하는 전자 장치 및 방법
WO2020111756A1 (ko) 2018-11-27 2020-06-04 주식회사 고영테크놀러지 기판에 대한 검사 결과를 표시하는 전자 장치 및 방법
CN114303451B (zh) * 2019-09-11 2024-01-30 株式会社富士 元件安装机
KR102459695B1 (ko) * 2020-11-03 2022-10-28 주식회사 고영테크놀러지 실장 정보를 결정하기 위한 장치, 방법 및 명령을 기록한 기록 매체

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JPH02129537A (ja) * 1988-11-10 1990-05-17 Matsushita Electric Works Ltd 電子部品装着状態検査方法
JPH0653694A (ja) * 1992-07-28 1994-02-25 Sony Corp 電子部品実装機
JP2003060396A (ja) * 2001-08-08 2003-02-28 Matsushita Electric Ind Co Ltd 電子部品実装装置および電子部品実装方法
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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8673685B1 (en) 2011-12-22 2014-03-18 Panasonic Corporation Electronic component mounting line and electronic component mounting method
JP2014143365A (ja) * 2013-01-25 2014-08-07 Juki Corp 電子部品実装装置および電子部品実装方法
US10194570B2 (en) 2014-11-13 2019-01-29 Fuji Corporation Mounter and method for inspecting suction posture of electronic component using mounter
WO2020170349A1 (ja) * 2019-02-20 2020-08-27 株式会社Ｆｕｊｉ 外観検査方法、実装機
JPWO2020170349A1 (ja) * 2019-02-20 2021-12-02 株式会社Fuji 外観検査方法、実装機
JP7232894B2 (ja) 2019-02-20 2023-03-03 株式会社Fuji 実装システム
JP2020136599A (ja) * 2019-02-25 2020-08-31 株式会社Ｆｕｊｉ データ作成装置、決定装置、装着作業機、及び、装着作業実行方法
JP7269028B2 (ja) 2019-02-25 2023-05-08 株式会社Fuji 決定装置
WO2023105606A1 (ja) * 2021-12-07 2023-06-15 株式会社Fuji 作業機

Also Published As

Publication number Publication date
US8527082B2 (en) 2013-09-03
DE112008001382T5 (de) 2010-04-08
KR20090130210A (ko) 2009-12-18
KR101123464B1 (ko) 2012-03-27
US20100152877A1 (en) 2010-06-17
CN101690445B (zh) 2012-10-10
CN101690445A (zh) 2010-03-31

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