WO2008133227A1 - ケイ素含有化合物、硬化性組成物及び硬化物 - Google Patents

ケイ素含有化合物、硬化性組成物及び硬化物 Download PDF

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Publication number
WO2008133227A1
WO2008133227A1 PCT/JP2008/057663 JP2008057663W WO2008133227A1 WO 2008133227 A1 WO2008133227 A1 WO 2008133227A1 JP 2008057663 W JP2008057663 W JP 2008057663W WO 2008133227 A1 WO2008133227 A1 WO 2008133227A1
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WO
WIPO (PCT)
Prior art keywords
silicon
containing compound
curable composition
cured product
general formula
Prior art date
Application number
PCT/JP2008/057663
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English (en)
French (fr)
Inventor
Takashi Sueyoshi
Ken-Ichiro Hiwatari
Tadashi Janado
Yoshikazu Shoji
Original Assignee
Adeka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corporation filed Critical Adeka Corporation
Priority to CN2008800055878A priority Critical patent/CN101616961B/zh
Priority to KR1020097017296A priority patent/KR101478803B1/ko
Publication of WO2008133227A1 publication Critical patent/WO2008133227A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

　本発明のケイ素含有化合物は、下記一般式（１）で表されるものである。本発明の硬化性組成物は、下記一般式（１）におけるＺが水素原子である該ケイ素含有化合物、ＺがＣ2-4アルケニル基又はアルキニル基である該ケイ素含有化合物、及びヒドロシリル化反応触媒を含有してなるものであり、ハンドリング性及び硬化性に優れ、得られる硬化物が透明性及び可撓性に優れる。 （式中、Ｒa～ＲdはＣ1-12飽和脂肪族炭化水素基であり、ＲeはＣ1-12飽和脂肪族炭化水素基又はＣ6-12芳香族炭化水素基であり、ＹはＣ2-4炭素原子数２～４のアルキレン基であり、Ｚは水素原子又はＣ2-4アルケニル基若しくはアルキニル基であり、Ｋは２～７の数であり、Ｔは１～７の数であり、Ｐは０～３の数であり、Ｍは該ケイ素含有化合物の質量平均分子量を３０００～１００万とする数である。）
PCT/JP2008/057663 2007-04-23 2008-04-21 ケイ素含有化合物、硬化性組成物及び硬化物 WO2008133227A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800055878A CN101616961B (zh) 2007-04-23 2008-04-21 含硅化合物、固化性组合物以及固化物
KR1020097017296A KR101478803B1 (ko) 2007-04-23 2008-04-21 규소 함유 화합물, 경화성 조성물 및 경화물

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-112735 2007-04-23
JP2007112735A JP5248032B2 (ja) 2007-04-23 2007-04-23 ケイ素含有化合物、硬化性組成物及び硬化物

Publications (1)

Publication Number Publication Date
WO2008133227A1 true WO2008133227A1 (ja) 2008-11-06

Family

ID=39925678

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057663 WO2008133227A1 (ja) 2007-04-23 2008-04-21 ケイ素含有化合物、硬化性組成物及び硬化物

Country Status (5)

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JP (1) JP5248032B2 (ja)
KR (1) KR101478803B1 (ja)
CN (1) CN101616961B (ja)
TW (1) TWI425031B (ja)
WO (1) WO2008133227A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JPWO2012133432A1 (ja) * 2011-03-30 2014-07-28 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9593209B2 (en) 2009-10-22 2017-03-14 Dow Corning Corporation Process for preparing clustered functional polyorganosiloxanes, and methods for their use
CN102713684B (zh) * 2009-12-21 2015-05-13 道康宁公司 利用烷基官能的硅倍半氧烷树脂制造柔性波导管的方法
KR101630769B1 (ko) * 2014-06-24 2016-06-16 매그나칩 반도체 유한회사 방열 반도체 칩 패키지 및 그 제조 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07309950A (ja) * 1994-05-17 1995-11-28 Toray Dow Corning Silicone Co Ltd 有機ケイ素重合体およびその製造方法
JPH0853661A (ja) * 1994-06-06 1996-02-27 Shin Etsu Chem Co Ltd シリコーン接着剤組成物
JP2005133073A (ja) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd 硬化性組成物
JP2005523980A (ja) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション オルガノハイドロジェンシリコン化合物
JP2005529989A (ja) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション 向上したバス・ライフを持つ組成物
JP2006511645A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物由来の分岐ポリマー
JP2006511646A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物から得られる分岐ポリマー
WO2006090609A1 (ja) * 2005-02-24 2006-08-31 Adeka Corporation ケイ素含有硬化性組成物及びその硬化物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0127983D0 (en) * 2001-11-22 2002-01-16 Neutec Pharma Plc Treatment of micro-organism infection
TW200513483A (en) * 2003-10-10 2005-04-16 Shinetsu Chemical Co Curable composition

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07309950A (ja) * 1994-05-17 1995-11-28 Toray Dow Corning Silicone Co Ltd 有機ケイ素重合体およびその製造方法
JPH0853661A (ja) * 1994-06-06 1996-02-27 Shin Etsu Chem Co Ltd シリコーン接着剤組成物
JP2005523980A (ja) * 2002-05-01 2005-08-11 ダウ・コーニング・コーポレイション オルガノハイドロジェンシリコン化合物
JP2005529989A (ja) * 2002-05-01 2005-10-06 ダウ・コーニング・コーポレイション 向上したバス・ライフを持つ組成物
JP2006511645A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物由来の分岐ポリマー
JP2006511646A (ja) * 2002-12-20 2006-04-06 ダウ・コーニング・コーポレイション 有機水素シリコン化合物から得られる分岐ポリマー
JP2005133073A (ja) * 2003-10-10 2005-05-26 Shin Etsu Chem Co Ltd 硬化性組成物
WO2006090609A1 (ja) * 2005-02-24 2006-08-31 Adeka Corporation ケイ素含有硬化性組成物及びその硬化物

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014208826A (ja) * 2009-11-09 2014-11-06 ダウ コーニング コーポレーションＤｏｗｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
JP2016153512A (ja) * 2009-11-09 2016-08-25 ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ クラスタ化官能性ポリオルガノシロキサンの調製プロセス、及びそれらの使用方法
WO2012133432A1 (ja) * 2011-03-30 2012-10-04 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
JPWO2012133432A1 (ja) * 2011-03-30 2014-07-28 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
US9243007B2 (en) 2011-03-30 2016-01-26 Asahi Kasei Chemicals Corporation Organopolysiloxane, method for producing the same, and curable resin composition containing the organopolysiloxane
JP5857039B2 (ja) * 2011-03-30 2016-02-10 旭化成ケミカルズ株式会社 オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物
US9670392B2 (en) 2013-02-11 2017-06-06 Dow Corning Corporation Stable thermal radical curable silicone adhesive compositions
US9718925B2 (en) 2013-02-11 2017-08-01 Dow Corning Corporation Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents
US10370572B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin
US10370574B2 (en) 2013-02-11 2019-08-06 Dow Silicones Corporation Method for forming thermally conductive thermal radical cure silicone compositions
WO2015012141A1 (ja) * 2013-07-24 2015-01-29 株式会社Adeka 硬化性樹脂組成物
JPWO2015012141A1 (ja) * 2013-07-24 2017-03-02 株式会社Adeka 硬化性樹脂組成物

Also Published As

Publication number Publication date
CN101616961A (zh) 2009-12-30
JP5248032B2 (ja) 2013-07-31
JP2008266483A (ja) 2008-11-06
TW200911887A (en) 2009-03-16
KR101478803B1 (ko) 2015-01-02
KR20090129989A (ko) 2009-12-17
TWI425031B (zh) 2014-02-01
CN101616961B (zh) 2012-01-04

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