TWI425031B - A compound containing silicon, a hardened composition and a hardened product - Google Patents
A compound containing silicon, a hardened composition and a hardened product Download PDFInfo
- Publication number
- TWI425031B TWI425031B TW097114901A TW97114901A TWI425031B TW I425031 B TWI425031 B TW I425031B TW 097114901 A TW097114901 A TW 097114901A TW 97114901 A TW97114901 A TW 97114901A TW I425031 B TWI425031 B TW I425031B
- Authority
- TW
- Taiwan
- Prior art keywords
- compound
- group
- carbon atoms
- parts
- decane
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Silicon Polymers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007112735A JP5248032B2 (ja) | 2007-04-23 | 2007-04-23 | ケイ素含有化合物、硬化性組成物及び硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200911887A TW200911887A (en) | 2009-03-16 |
TWI425031B true TWI425031B (zh) | 2014-02-01 |
Family
ID=39925678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097114901A TWI425031B (zh) | 2007-04-23 | 2008-04-23 | A compound containing silicon, a hardened composition and a hardened product |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5248032B2 (ja) |
KR (1) | KR101478803B1 (ja) |
CN (1) | CN101616961B (ja) |
TW (1) | TWI425031B (ja) |
WO (1) | WO2008133227A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9593209B2 (en) | 2009-10-22 | 2017-03-14 | Dow Corning Corporation | Process for preparing clustered functional polyorganosiloxanes, and methods for their use |
TWI502004B (zh) * | 2009-11-09 | 2015-10-01 | Dow Corning | 群集官能性聚有機矽氧烷之製法及其使用方法 |
WO2011084250A2 (en) * | 2009-12-21 | 2011-07-14 | Dow Corning Corporation | Methods for fabricating flexible waveguides using alkyl-functional silsesquioxane resins |
JP5857039B2 (ja) * | 2011-03-30 | 2016-02-10 | 旭化成ケミカルズ株式会社 | オルガノポリシロキサン、その製造方法、及びオルガノポリシロキサンを含有する硬化性樹脂組成物 |
CN103459469B (zh) * | 2011-03-30 | 2015-09-09 | 旭化成化学株式会社 | 有机聚硅氧烷、其制造方法和含有有机聚硅氧烷的固化性树脂组合物 |
WO2014124389A1 (en) | 2013-02-11 | 2014-08-14 | Dow Corning Corporation | Moisture-curable hot melt silicone adhesive compositions including an alkoxy-functional siloxane reactive resin |
EP2954024B1 (en) | 2013-02-11 | 2019-05-15 | Dow Silicones Corporation | Curable silicone compositions comprising clustered functional polyorganosiloxanes and silicone reactive diluents |
KR102206708B1 (ko) | 2013-02-11 | 2021-01-25 | 다우 실리콘즈 코포레이션 | 안정한 열 라디칼 경화성 실리콘 접착제 조성물 |
KR102170918B1 (ko) | 2013-02-11 | 2020-10-29 | 다우 실리콘즈 코포레이션 | 열 전도성 열 라디칼 경화 실리콘 조성물을 형성하는 방법 |
KR102215439B1 (ko) * | 2013-07-24 | 2021-02-16 | 가부시키가이샤 아데카 | 경화성 수지 조성물 |
KR101630769B1 (ko) | 2014-06-24 | 2016-06-16 | 매그나칩 반도체 유한회사 | 방열 반도체 칩 패키지 및 그 제조 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200513483A (en) * | 2003-10-10 | 2005-04-16 | Shinetsu Chemical Co | Curable composition |
CN1656174A (zh) * | 2002-05-01 | 2005-08-17 | 陶氏康宁公司 | 槽池寿命改进的组合物 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07309950A (ja) * | 1994-05-17 | 1995-11-28 | Toray Dow Corning Silicone Co Ltd | 有機ケイ素重合体およびその製造方法 |
JP3317092B2 (ja) * | 1994-06-06 | 2002-08-19 | 信越化学工業株式会社 | シリコーン接着剤組成物及びシリコーン硬化物と有機樹脂との複合体 |
GB0127983D0 (en) * | 2001-11-22 | 2002-01-16 | Neutec Pharma Plc | Treatment of micro-organism infection |
ATE363504T1 (de) * | 2002-05-01 | 2007-06-15 | Dow Corning | Organowasserstoffsiliziumverbindungen |
KR101028347B1 (ko) * | 2002-12-20 | 2011-04-11 | 다우 코닝 코포레이션 | 유기 수소화 규소 화합물로부터의 분지된 중합체 |
DE60321218D1 (de) * | 2002-12-20 | 2008-07-03 | Dow Corning | Verzweigte polymere aus organohydrogensilicon-zusammensetzungen |
JP4520251B2 (ja) * | 2003-10-10 | 2010-08-04 | 信越化学工業株式会社 | 硬化性組成物 |
JP5137295B2 (ja) * | 2005-02-24 | 2013-02-06 | 株式会社Adeka | ケイ素含有硬化性組成物及びその硬化物 |
-
2007
- 2007-04-23 JP JP2007112735A patent/JP5248032B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-21 KR KR1020097017296A patent/KR101478803B1/ko not_active IP Right Cessation
- 2008-04-21 CN CN2008800055878A patent/CN101616961B/zh not_active Expired - Fee Related
- 2008-04-21 WO PCT/JP2008/057663 patent/WO2008133227A1/ja active Application Filing
- 2008-04-23 TW TW097114901A patent/TWI425031B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1656174A (zh) * | 2002-05-01 | 2005-08-17 | 陶氏康宁公司 | 槽池寿命改进的组合物 |
TW200513483A (en) * | 2003-10-10 | 2005-04-16 | Shinetsu Chemical Co | Curable composition |
Also Published As
Publication number | Publication date |
---|---|
TW200911887A (en) | 2009-03-16 |
CN101616961B (zh) | 2012-01-04 |
CN101616961A (zh) | 2009-12-30 |
JP5248032B2 (ja) | 2013-07-31 |
KR20090129989A (ko) | 2009-12-17 |
KR101478803B1 (ko) | 2015-01-02 |
WO2008133227A1 (ja) | 2008-11-06 |
JP2008266483A (ja) | 2008-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |