TWI260962B - Heat pipe cooling assembly and method of manufacturing the same - Google Patents
Heat pipe cooling assembly and method of manufacturing the same Download PDFInfo
- Publication number
- TWI260962B TWI260962B TW93115303A TW93115303A TWI260962B TW I260962 B TWI260962 B TW I260962B TW 93115303 A TW93115303 A TW 93115303A TW 93115303 A TW93115303 A TW 93115303A TW I260962 B TWI260962 B TW I260962B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat pipe
- base
- cooling assembly
- manufacturing
- same
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat pipe cooling assembly and the method of manufacture, the heat pipe cooling assembly includes: a base defined a groove in the under side thereof; at least one heat pipe and at least one group of cooling fins. The heat pipe heaving an evaporating portion thermally received in the groove of the base, and at least one condensing portion thermally coupled to the group of cooling fins. The evaporating portion has a flat surface directly contacting a heat source, and the flatness of the flat surface is the same as the under side of the base. In manufacturing, the heat pipe is thermally received in the groove of the base. The combined heat pipe and the base is then mechanically processed to form the flat surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93115303A TWI260962B (en) | 2004-05-28 | 2004-05-28 | Heat pipe cooling assembly and method of manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW93115303A TWI260962B (en) | 2004-05-28 | 2004-05-28 | Heat pipe cooling assembly and method of manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200539788A TW200539788A (en) | 2005-12-01 |
TWI260962B true TWI260962B (en) | 2006-08-21 |
Family
ID=37874917
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW93115303A TWI260962B (en) | 2004-05-28 | 2004-05-28 | Heat pipe cooling assembly and method of manufacturing the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI260962B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI394032B (en) * | 2008-03-14 | 2013-04-21 | Foxconn Tech Co Ltd | Heat sink and method for manufacturing the same |
TWI396462B (en) * | 2007-12-21 | 2013-05-11 | Foxconn Tech Co Ltd | Heat dissipation device for leds |
DE102016102188B4 (en) | 2015-10-09 | 2021-07-22 | Tsung-Hsien Huang | Heat sink assembly |
-
2004
- 2004-05-28 TW TW93115303A patent/TWI260962B/en not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI396462B (en) * | 2007-12-21 | 2013-05-11 | Foxconn Tech Co Ltd | Heat dissipation device for leds |
TWI394032B (en) * | 2008-03-14 | 2013-04-21 | Foxconn Tech Co Ltd | Heat sink and method for manufacturing the same |
DE102016102188B4 (en) | 2015-10-09 | 2021-07-22 | Tsung-Hsien Huang | Heat sink assembly |
Also Published As
Publication number | Publication date |
---|---|
TW200539788A (en) | 2005-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MC4A | Revocation of granted patent |