TWI260962B - Heat pipe cooling assembly and method of manufacturing the same - Google Patents

Heat pipe cooling assembly and method of manufacturing the same Download PDF

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Publication number
TWI260962B
TWI260962B TW93115303A TW93115303A TWI260962B TW I260962 B TWI260962 B TW I260962B TW 93115303 A TW93115303 A TW 93115303A TW 93115303 A TW93115303 A TW 93115303A TW I260962 B TWI260962 B TW I260962B
Authority
TW
Taiwan
Prior art keywords
heat pipe
base
cooling assembly
manufacturing
same
Prior art date
Application number
TW93115303A
Other languages
Chinese (zh)
Other versions
TW200539788A (en
Inventor
Jian-Qing Sheng
Meng-Tzu Lee
Shu-Ho Lin
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW93115303A priority Critical patent/TWI260962B/en
Publication of TW200539788A publication Critical patent/TW200539788A/en
Application granted granted Critical
Publication of TWI260962B publication Critical patent/TWI260962B/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat pipe cooling assembly and the method of manufacture, the heat pipe cooling assembly includes: a base defined a groove in the under side thereof; at least one heat pipe and at least one group of cooling fins. The heat pipe heaving an evaporating portion thermally received in the groove of the base, and at least one condensing portion thermally coupled to the group of cooling fins. The evaporating portion has a flat surface directly contacting a heat source, and the flatness of the flat surface is the same as the under side of the base. In manufacturing, the heat pipe is thermally received in the groove of the base. The combined heat pipe and the base is then mechanically processed to form the flat surface.
TW93115303A 2004-05-28 2004-05-28 Heat pipe cooling assembly and method of manufacturing the same TWI260962B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93115303A TWI260962B (en) 2004-05-28 2004-05-28 Heat pipe cooling assembly and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93115303A TWI260962B (en) 2004-05-28 2004-05-28 Heat pipe cooling assembly and method of manufacturing the same

Publications (2)

Publication Number Publication Date
TW200539788A TW200539788A (en) 2005-12-01
TWI260962B true TWI260962B (en) 2006-08-21

Family

ID=37874917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93115303A TWI260962B (en) 2004-05-28 2004-05-28 Heat pipe cooling assembly and method of manufacturing the same

Country Status (1)

Country Link
TW (1) TWI260962B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI394032B (en) * 2008-03-14 2013-04-21 Foxconn Tech Co Ltd Heat sink and method for manufacturing the same
TWI396462B (en) * 2007-12-21 2013-05-11 Foxconn Tech Co Ltd Heat dissipation device for leds
DE102016102188B4 (en) 2015-10-09 2021-07-22 Tsung-Hsien Huang Heat sink assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396462B (en) * 2007-12-21 2013-05-11 Foxconn Tech Co Ltd Heat dissipation device for leds
TWI394032B (en) * 2008-03-14 2013-04-21 Foxconn Tech Co Ltd Heat sink and method for manufacturing the same
DE102016102188B4 (en) 2015-10-09 2021-07-22 Tsung-Hsien Huang Heat sink assembly

Also Published As

Publication number Publication date
TW200539788A (en) 2005-12-01

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