WO2008065972A1 - Board-mounted brushless motor - Google Patents

Board-mounted brushless motor Download PDF

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Publication number
WO2008065972A1
WO2008065972A1 PCT/JP2007/072684 JP2007072684W WO2008065972A1 WO 2008065972 A1 WO2008065972 A1 WO 2008065972A1 JP 2007072684 W JP2007072684 W JP 2007072684W WO 2008065972 A1 WO2008065972 A1 WO 2008065972A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground pattern
conductive metal
metal plate
substrate
brushless motor
Prior art date
Application number
PCT/JP2007/072684
Other languages
French (fr)
Japanese (ja)
Inventor
Yukio Shinozuka
Masahiro Miyashita
Original Assignee
Shinano Kenshi Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007296258A external-priority patent/JP2008161041A/en
Application filed by Shinano Kenshi Kabushiki Kaisha filed Critical Shinano Kenshi Kabushiki Kaisha
Publication of WO2008065972A1 publication Critical patent/WO2008065972A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0039Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K11/00Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/40Structural association with grounding devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/44Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/091Locally and permanently deformed areas including dielectric material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/095Conductive through-holes or vias
    • H05K2201/09554Via connected to metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers

Definitions

  • the present invention relates to a substrate-mounted brushless motor that is driven at high speed by mounting a polygon mirror, CD, DVD or the like on a rotor, for example.
  • Spindle motors that drive a rotor at high speed are used in disk drive devices that drive OA equipment such as laser beam printers and copiers equipped with polygon mirrors, CDs, and DVDs.
  • an outer rotor type DC brushless motor is preferably used.
  • the rotor has a cup-shaped mouth housing supported on a rotating shaft, and a polygon mirror and various disks are positioned and mounted on the rotor housing in the horizontal and vertical directions, for example.
  • a housing is assembled to the substrate, and a stator is assembled to the outer periphery of the housing.
  • a rotor shaft is rotatably supported by the housing.
  • an iron substrate is formed by exposing a conductive pattern formed on an electrically conductive metal plate through an insulating layer from a surface resist layer. This board doubles as a motor mounting frame and a motor board!
  • a motor drive circuit is provided on the substrate, and electronic components such as sensors and switching elements are mounted.
  • the rotor is driven to rotate at high speed (for example, 10,000 rpm to 40, OOOrpm in the case of a polygon scanner motor), and the motor drive circuit is switched at high speed by PWM control.
  • high speed for example, 10,000 rpm to 40, OOOrpm in the case of a polygon scanner motor
  • the motor drive circuit is switched at high speed by PWM control.
  • electromagnetic noise is radiated due to a rapid voltage fluctuation generated in the wiring from the substrate to the motor coil or in the motor coil itself.
  • the metal plate on the back side of the substrate is connected to the ground pattern of the motor drive circuit because it easily diffuses electromagnetic waves.
  • a through hole is formed in a land portion of a ground pattern of a substrate, and the ground pattern and a metal plate (iron substrate) are electrically connected by filling the through hole with solder (Patent Document 1). .
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2000-60094
  • the through hole is filled with solder
  • the wettability between the solder and the metal plate (iron substrate) is good, but the solder is repelled by the insulating layer that exists between the ground pattern.
  • workability is poor, and there is a problem that the electrical connection reliability between the ground pattern and the metal plate is affected.
  • through holes are provided in the substrate, and solder is filled and reflowed. For example, the manufacturing process increases, resulting in an increase in production costs.
  • the present invention has been made to solve these problems, and an object of the present invention is to provide a board-mounted brushless motor that improves the connection reliability between a ground pattern and a conductive metal plate with a simple configuration. It is to provide.
  • the present invention comprises the following arrangement.
  • a protruding portion that is pressed on the ground pattern and escapes the insulating layer to the periphery is formed, and the ground pattern and the conductive metal plate are electrically connected.
  • the ground pattern is recessed into a wedge shape or a substantially L-shaped cross section to electrically connect the ground pattern depressed from the substrate surface and the conductive metal plate, and the depressed metal is filled with the conductive metal material. Being done! /, Characterized in that.
  • the conductive metal plate and the ground pattern can be electrically connected with a simple configuration without being affected by the insulating layer, and the ability to radiate electromagnetic noise can be achieved.
  • a raised portion is formed on the ground pattern by, for example, pressing a tool to release the insulating layer to the periphery, and the ground pattern and the conductive metal plate are connected to each other. Since it can be conducted, it can be grounded simply by pressing a tool at any point on the pattern and plastically deforming it, making it cheap and easy to assemble!
  • the ground pattern is recessed into a wedge shape or a substantially L-shaped cross section to electrically connect the ground pattern depressed from the substrate surface and the conductive metal plate, and a conductive metal material ( (For example, solder, solder alloy, etc.) can be used to ensure electrical continuity between the ground pattern on the surface layer and the conductive metal plate via the conductive metal material in addition to the connection due to the depression of the ground pattern. Connection reliability can be improved.
  • FIG. 1 is a plan view of a polygon scanner motor.
  • FIG. 2 is a half sectional view of a polygon scanner motor.
  • FIG. 3A and FIG. 3B are a cross-sectional view of a concave portion of a substrate and a plan view of the concave portion.
  • FIG. 4 is a plan view of a polygon scanner motor according to another example.
  • FIG. 5 is a plan view of a recess formed in a ground pattern according to another example.
  • FIG. 6 is a plan view showing a state in which the concave portion of FIG. 5 is filled with a conductive metal material.
  • FIG. 7 is a partial cross-sectional view in the direction of arrows AA in FIG.
  • a substrate and a stator core are assembled to a rotor in which a polygon mirror is mounted in a cup-shaped rotor housing with the horizontal and vertical positions aligned, and a stator housing that rotatably supports the rotating shaft of the rotor.
  • An outer rotor type DC brushless motor having a stator is preferably used.
  • the schematic configuration of the polygon scanner motor will be described with reference to FIG. 1 and FIG.
  • a cup-shaped rotor housing 2 is used as the rotor 1.
  • a shaft hole 3 is formed in the rotor housing 2, and a rotating shaft 4 is integrally fixed to the shaft hole 3 by press fitting or shrink fitting.
  • a polygon mirror 5 is mounted on the upper surface of the rotor housing 2 and is pressed. Even the spring 6 is pressed against the upper surface of the rotor housing 2.
  • the holding spring 6 is fixed by a C-type retaining ring 7 that is fitted into a cylindrical portion that is formed upright around the shaft hole 3.
  • a ring-shaped magnet 8 is fixed to the inner peripheral surface of the rotor housing 2.
  • the magnet 8 is alternately magnetized with N and S poles in the circumferential direction.
  • a stator 9 has a rotating shaft 4 coaxially incorporated in a stator housing 10 via a dynamic pressure bearing 11.
  • the stator housing 10 is formed by continuously forming cylindrical portions having different outer diameters.
  • a stator core 12 is fitted into the small diameter portion with an adhesive, and a substrate (motor mounting plate / motor is mounted on the large diameter portion. Board) 13 is fixed.
  • a thrust receiver 14 is fitted into the stator housing 10 using a hole diameter step from the motor substrate 13 side. The thrust receiver 14 receives the shaft end (lower end) of the rotating shaft 4 and defines the shaft end position.
  • the substrate 13 is caulked on the stator housing 10 in a direction perpendicular to the rotation axis 4.
  • This board 13 serves both as a motor mounting frame and a motor board.
  • On the substrate 13 are mounted electronic components (drive IC) 15 and a magnetic pole sensor 23 that constitute a motor drive circuit.
  • the magnetic pole sensor 23 detects the magnetic pole position of the rotor 1 from the leakage magnetic flux of the magnet 8.
  • the motor drive circuit switches the energization of the stator coil 16 in the direction for energizing the rotation of the rotor 1.
  • an iron substrate 13 is formed on a conductive metal plate 17 with a conductor pattern (ground pattern 19) exposed from a resist film 20 via an insulating layer 18.
  • a concave portion 21 that is plastically deformed from the ground pattern 19 side toward the substrate 13 is formed in a part of the ground pattern 19.
  • FIG. 3A when a tool (not shown) is pressed against the ground pattern 19 exposed on the substrate surface side, the insulating layer 18 between the ground pattern 19 and the substrate 13 is crushed, escapes to the surroundings, and rises upward in a ring shape. A raised ridge 22 is formed (see FIG. 3B). As a result, the insulating layer 18 is broken, and the ground pattern 19 on the upper side of the recess can be electrically connected to the substrate 13 on the lower side of the recess. Further, since the cross section of the substrate is not exposed, wrinkles or the like do not occur in the concave portion 21. In this way, the conductive metal plate 17 and the ground pattern 19 can be electrically connected reliably and inexpensively with an extremely simple configuration. The power to suppress the radiation of S.
  • the ground pattern 19 is covered with the resist film 20.
  • the concave portion 21 is formed using a tool having a spherical tip shape.
  • the concave portion 21 may be formed using a tool having another tip shape.
  • a branch pattern 19a is provided in a part of the ground pattern 19.
  • a concave portion (recessed portion) 21 is formed by protruding on the branch pattern 19a with a tool.
  • An example of the planar shape of the recess 21 is shown in FIG. In this state, the ground pattern 19 depressed in the recess 21 and the conductive metal plate 17 may be electrically connected.
  • FIG. 6 it is more preferable that the recess 21 is filled with a conductive metal material (eg, solder, solder alloy, etc.) 24.
  • FIG. 7 shows a cross-sectional view along arrow AA in FIG.
  • the concave portion 21 is formed by being recessed in a cross-sectional wedge shape or a substantially L-shaped cross section, and the recessed ground pattern 19 is electrically connected to the conductive metal plate 17 by the insulating layer 18 being crushed.
  • a conductive metal material is formed so as to cover the ground pattern end 19A existing on the inclined surface 25 of the recessed portion 21 formed by this depression and the ground pattern end 19B exposed from the resist film 20 provided on the surface layer of the motor substrate 13. 24 is filled.
  • the cross-sectional shape of the concave portion 21 is slightly larger than the L-shape from the acute-angled wedge shape! /, The obtuse-angle shape! /, Or may be misaligned! /. The shape is preferred!
  • the electrical connection between the ground pattern end 19B on the surface layer side through the conductive metal material 24 and the conductive metal plate 17 can be secured, so the connection Reliability can be improved.
  • the above-described embodiment can also be used for other board-mounted brushless motors such as the power described with the polygon scanner motor and the spindle motor for driving the disk.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Brushless Motors (AREA)

Abstract

A board-mounted brushless motor in which the reliability of connection between a ground pattern and an electrically conductive metal plate is improved by a simple structure. A portion of the ground pattern (19) is hollowed to form a hollow section (21). By this, an intermediate insulation layer (18) is pressed and crushed to electrically connect the ground pattern (19) and the electrically conductive metal plate (17).

Description

明 細 書  Specification
基板取付型ブラシレスモータ  Board-mounted brushless motor
技術分野  Technical field
[0001] 本発明は、例えばロータにポリゴンミラーや CD、 DVDなどを搭載して高速回転駆 動する基板取付型ブラシレスモータに関する。  [0001] The present invention relates to a substrate-mounted brushless motor that is driven at high speed by mounting a polygon mirror, CD, DVD or the like on a rotor, for example.
背景技術  Background art
[0002] ポリゴンミラーが設けられたレーザービームプリンターや複写機などの OA機器、 C Dや DVDなどを駆動するディスク駆動装置には、ロータを高速回転駆動するスピンド ルモータが用いられている。このスピンドルモータとしては、アウターロータ型の DCブ ラシレスモータが好適に用いられる。具体的には、ロータは、回転軸にカップ状の口 ータハウジングが支持されており、ロータハウジングには例えばポリゴンミラーや各種 ディスクが水平方向及び鉛直方向に位置決めして搭載される。  [0002] Spindle motors that drive a rotor at high speed are used in disk drive devices that drive OA equipment such as laser beam printers and copiers equipped with polygon mirrors, CDs, and DVDs. As this spindle motor, an outer rotor type DC brushless motor is preferably used. Specifically, the rotor has a cup-shaped mouth housing supported on a rotating shaft, and a polygon mirror and various disks are positioned and mounted on the rotor housing in the horizontal and vertical directions, for example.
基板にハウジングが組み付けられ、ハウジングの外周に固定子が組み付けられる。 ハウジングには、ロータシャフトが回転可能に支持されている。例えば鉄基板は、導 電性金属板上に絶縁層を介して形成された導体パターンが表面レジスト層より露出 して形成されてレ、る。この基板はモータ取付フレームとモータ基板とを兼用して!/、る。 基板にはモータ駆動回路が設けられ、センサやスイッチング素子など電子部品が搭 載されている。  A housing is assembled to the substrate, and a stator is assembled to the outer periphery of the housing. A rotor shaft is rotatably supported by the housing. For example, an iron substrate is formed by exposing a conductive pattern formed on an electrically conductive metal plate through an insulating layer from a surface resist layer. This board doubles as a motor mounting frame and a motor board! A motor drive circuit is provided on the substrate, and electronic components such as sensors and switching elements are mounted.
ロータは、高速回転駆動(例えばポリゴンスキャナモータの場合に 10,000rpm〜40, OOOrpm)され、モータ駆動回路は PWM制御により高速に通電切替えが行なわれる 。このとき、基板からモータコイルに至る配線やモータコイル自身に発生する急激な 電圧変動により電磁波ノイズが放射される。特に、基板の裏面側金属板は電磁波を 拡散させやすいためモータ駆動回路のグランドパターンと接続される。例えば、基板 のグランドパターンのランド部に貫通孔を設け、該貫通孔にはんだを充填してグラン ドパターンと金属板 (鉄基板)とを電気的に導通させてレ、る(特許文献 1 )。  The rotor is driven to rotate at high speed (for example, 10,000 rpm to 40, OOOrpm in the case of a polygon scanner motor), and the motor drive circuit is switched at high speed by PWM control. At this time, electromagnetic noise is radiated due to a rapid voltage fluctuation generated in the wiring from the substrate to the motor coil or in the motor coil itself. In particular, the metal plate on the back side of the substrate is connected to the ground pattern of the motor drive circuit because it easily diffuses electromagnetic waves. For example, a through hole is formed in a land portion of a ground pattern of a substrate, and the ground pattern and a metal plate (iron substrate) are electrically connected by filling the through hole with solder (Patent Document 1). .
特許文献 1 :特開 2000— 60094号公報  Patent Document 1: Japanese Unexamined Patent Publication No. 2000-60094
発明の開示 [0003] しかしながら、貫通孔にはんだを充填しても、はんだと金属板 (鉄基板)とのぬれ性 はよいが、グランドパターンとの中間に存在する絶縁層によりはんだがはじかれてしま うため、作業性が悪いうえにグランドパターンと金属板との電気的接続信頼性にかけ るという課題があった。また、基板に貫通孔を設けるうえにはんだを充填してリフロー するなど、製造工程が増えるため生産コストも増加する。 Disclosure of the invention However, even if the through hole is filled with solder, the wettability between the solder and the metal plate (iron substrate) is good, but the solder is repelled by the insulating layer that exists between the ground pattern. In addition, workability is poor, and there is a problem that the electrical connection reliability between the ground pattern and the metal plate is affected. In addition, through holes are provided in the substrate, and solder is filled and reflowed. For example, the manufacturing process increases, resulting in an increase in production costs.
本発明はこれらの課題を解決すべくなされたものであり、その目的とするところは、 簡易な構成でグランドパターンと導電性金属板との接続信頼性を向上させた基板取 付型ブラシレスモータを提供することにある。  The present invention has been made to solve these problems, and an object of the present invention is to provide a board-mounted brushless motor that improves the connection reliability between a ground pattern and a conductive metal plate with a simple configuration. It is to provide.
本発明は上記目的を達成するため、次の構成を備える。  In order to achieve the above object, the present invention comprises the following arrangement.
導電性金属板上に絶縁層を介して導体パターンがレジスト被膜より露出して形成さ れた基板にハウジングが組み付けられ、該ハウジングに固定子が組み付けられ回転 子シャフトが回転可能に支持される基板取付型ブラシレスモータであって、グランド ノ ターンの一部をへこませて凹部を形成し中間の絶縁層を押し潰すことで当該ダラ ンドパターンと導電性金属板が電気的に導通していることを特徴とする。  A substrate in which a conductor pattern is exposed from a resist film on a conductive metal plate through an insulating layer, and a housing is assembled, and a stator is assembled in the housing and a rotor shaft is rotatably supported It is a mounting type brushless motor, and a part of the ground pattern is dented to form a recess and the intermediate insulating layer is crushed so that the dust pattern and the conductive metal plate are electrically connected. It is characterized by.
また、グランドパターン上を押圧されて絶縁層を周囲に逃がした***部が形成され 、当該グランドパターンと導電性金属板が電気的に導通していることを特徴とする。 或いはグランドパターン上を断面くさび状若しくは断面略 L字状にへこませて、基板 面より陥没したグランドパターンと導電性金属板を電気的に導通させ、該陥没部に導 電性金属材が充填されて!/、ることを特徴とする。  In addition, a protruding portion that is pressed on the ground pattern and escapes the insulating layer to the periphery is formed, and the ground pattern and the conductive metal plate are electrically connected. Alternatively, the ground pattern is recessed into a wedge shape or a substantially L-shaped cross section to electrically connect the ground pattern depressed from the substrate surface and the conductive metal plate, and the depressed metal is filled with the conductive metal material. Being done! /, Characterized in that.
[0004] 発明の効果 [0004] Effect of the Invention
上述した基板取付型ブラシレスモータを用いれば、グランドパターンの一部をへこ ませて凹部を形成し中間の絶縁層を押し潰すことで当該グランドパターンと導電性金 属板が電気的に導通しているので、絶縁層の影響をうけることなく簡易な構成で導電 性金属板とグランドパターンとを電気的導通させることができ、電磁波ノイズの放射を 才卬えること力 Sできる。  If the above-described substrate-mounted brushless motor is used, a part of the ground pattern is recessed to form a recess, and the intermediate insulating layer is crushed to electrically connect the ground pattern and the conductive metal plate. Therefore, the conductive metal plate and the ground pattern can be electrically connected with a simple configuration without being affected by the insulating layer, and the ability to radiate electromagnetic noise can be achieved.
また、グランドパターン上を例えば工具を押し付けるなどして押圧されることにより絶 縁層を周囲に逃がした***部が形成され、当該グランドパターンと導電性金属板を 導通させることができるので、パターン上の任意の箇所で工具を押し当てて塑性変形 させるだけでアースすることができ、安価で組立性がよ!/、。 In addition, a raised portion is formed on the ground pattern by, for example, pressing a tool to release the insulating layer to the periphery, and the ground pattern and the conductive metal plate are connected to each other. Since it can be conducted, it can be grounded simply by pressing a tool at any point on the pattern and plastically deforming it, making it cheap and easy to assemble!
また、グランドパターン上を断面くさび状若しくは断面略 L字状にへこませて、基板 面より陥没したグランドパターンと導電性金属板を電気的に導通させ、該陥没部に導 電性金属材 (例えばはんだ、はんだ合金等)が充填されていると、グランドパターンの 陥没による接続に加えて導電性金属材を介した表層側のグランドパターンと導電性 金属板との電気的導通が確保できるので、接続信頼性を向上できる。 図面の簡単な説明  In addition, the ground pattern is recessed into a wedge shape or a substantially L-shaped cross section to electrically connect the ground pattern depressed from the substrate surface and the conductive metal plate, and a conductive metal material ( (For example, solder, solder alloy, etc.) can be used to ensure electrical continuity between the ground pattern on the surface layer and the conductive metal plate via the conductive metal material in addition to the connection due to the depression of the ground pattern. Connection reliability can be improved. Brief Description of Drawings
[0005] [図 1]ポリゴンスキャナモータの平面図である。  FIG. 1 is a plan view of a polygon scanner motor.
[図 2]ポリゴンスキャナモータの半断面図である。  FIG. 2 is a half sectional view of a polygon scanner motor.
[図 3]図 3A及び図 3Bは、基板の凹部の断面図及び凹部の平面図である。  FIG. 3A and FIG. 3B are a cross-sectional view of a concave portion of a substrate and a plan view of the concave portion.
[図 4]他例に係るポリゴンスキャナモータの平面図である。  FIG. 4 is a plan view of a polygon scanner motor according to another example.
[図 5]他例に係るグランドパターンに形成された凹部の平面図である。  FIG. 5 is a plan view of a recess formed in a ground pattern according to another example.
[図 6]図 5の凹部に導電性金属材が充填された状態を示す平面図である。  FIG. 6 is a plan view showing a state in which the concave portion of FIG. 5 is filled with a conductive metal material.
[図 7]図 6の矢印 A— A方向の部分断面図である。  FIG. 7 is a partial cross-sectional view in the direction of arrows AA in FIG.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0006] 以下、本発明に係る基板取付型ブラシレスモータの最良の実施形態について、添 付図面を参照しながら説明する。本実施形態では、一例としてポリゴンスキャナモー タを参照して説明する。ポリゴンスキャナモータは、カップ状のロータハウジングにポリ ゴンミラーを水平方向及び鉛直方向に位置を合わせて搭載したロータと、ロータの回 転軸を回転可能に支持するステータハウジングに基板とステータコアが組み付けら れるステータを備えたアウターロータ型の DCブラシレスモータが好適に用いられる。 図 1及び図 2を参照して、ポリゴンスキャナモータの概略構成について説明する。 図 2において、ロータ 1は、カップ状のロータハウジング 2が用いられる。ロータハウ ジング 2には軸孔 3が穿孔されており、該軸孔 3には回転軸 4が圧入若しくは焼嵌め などにより一体に固定されている。 Hereinafter, a best mode of a board-mounted brushless motor according to the present invention will be described with reference to the accompanying drawings. This embodiment will be described with reference to a polygon scanner motor as an example. In the polygon scanner motor, a substrate and a stator core are assembled to a rotor in which a polygon mirror is mounted in a cup-shaped rotor housing with the horizontal and vertical positions aligned, and a stator housing that rotatably supports the rotating shaft of the rotor. An outer rotor type DC brushless motor having a stator is preferably used. The schematic configuration of the polygon scanner motor will be described with reference to FIG. 1 and FIG. In FIG. 2, a cup-shaped rotor housing 2 is used as the rotor 1. A shaft hole 3 is formed in the rotor housing 2, and a rotating shaft 4 is integrally fixed to the shaft hole 3 by press fitting or shrink fitting.
図 1において、ロータハウジング 2の上面にはポリゴンミラー 5が搭載されており、押 さえバネ 6によりロータハウジング 2の上面に押圧されている。押さえバネ 6は、軸孔 3 の周囲に起立形成された円筒部に嵌め込まれる C型止め輪 7により固定されている。 また、図 2において、ロータハウジング 2の内周面には、リング状のマグネット 8が固着 されている。マグネット 8は、周方向に N極と S極とで交互に着磁されている。 In FIG. 1, a polygon mirror 5 is mounted on the upper surface of the rotor housing 2 and is pressed. Even the spring 6 is pressed against the upper surface of the rotor housing 2. The holding spring 6 is fixed by a C-type retaining ring 7 that is fitted into a cylindrical portion that is formed upright around the shaft hole 3. In FIG. 2, a ring-shaped magnet 8 is fixed to the inner peripheral surface of the rotor housing 2. The magnet 8 is alternately magnetized with N and S poles in the circumferential direction.
図 2において、ステータ 9は、ステータハウジング 10には動圧軸受 11を介して回転 軸 4が同軸に組み込まれている。ステータハウジング 10は、外径の異なる円筒部分 が連続して形成されており、小径の部分にはステータコア 12が接着剤を介して嵌め 込まれ、大径の部分には基板 (モータ取付板兼モータ基板) 13が固定されている。ス テータハウジング 10には、モータ基板 13側より孔径段差を利用してスラスト受 14が 嵌め込まれている。スラスト受 14は、回転軸 4の軸端(下端)を受けて軸端位置を規 定している。  In FIG. 2, a stator 9 has a rotating shaft 4 coaxially incorporated in a stator housing 10 via a dynamic pressure bearing 11. The stator housing 10 is formed by continuously forming cylindrical portions having different outer diameters. A stator core 12 is fitted into the small diameter portion with an adhesive, and a substrate (motor mounting plate / motor is mounted on the large diameter portion. Board) 13 is fixed. A thrust receiver 14 is fitted into the stator housing 10 using a hole diameter step from the motor substrate 13 side. The thrust receiver 14 receives the shaft end (lower end) of the rotating shaft 4 and defines the shaft end position.
基板 13は、ステータハウジング 10に回転軸 4と直交する向きにかしめられている。 この基板 13はモータ取付フレームとモータ基板を兼用している。基板 13にはモータ 駆動回路を構成する電子部品(駆動 IC) 15、磁極センサ 23などが搭載されている。 磁極センサ 23は、マグネット 8の漏れ磁束からロータ 1の磁極位置を検出する。磁極 センサ 23により検出されたロータ 1の回転位置に応じて、モータ駆動回路はステータ コイル 16への通電を当該ロータ 1の回転を付勢する方向へ切り換える。  The substrate 13 is caulked on the stator housing 10 in a direction perpendicular to the rotation axis 4. This board 13 serves both as a motor mounting frame and a motor board. On the substrate 13 are mounted electronic components (drive IC) 15 and a magnetic pole sensor 23 that constitute a motor drive circuit. The magnetic pole sensor 23 detects the magnetic pole position of the rotor 1 from the leakage magnetic flux of the magnet 8. In accordance with the rotational position of the rotor 1 detected by the magnetic pole sensor 23, the motor drive circuit switches the energization of the stator coil 16 in the direction for energizing the rotation of the rotor 1.
図 1において、例えば鉄基板 13は導電性金属板 17上に絶縁層 18を介して導体パ ターン (グランドパターン 19)がレジスト被膜 20より露出して形成されている。図 1にお いて、グランドパターン 19の一部に、グランドパターン 19側から基板 13に向けて塑 性変形した凹部 21が形成されている。  In FIG. 1, for example, an iron substrate 13 is formed on a conductive metal plate 17 with a conductor pattern (ground pattern 19) exposed from a resist film 20 via an insulating layer 18. In FIG. 1, a concave portion 21 that is plastically deformed from the ground pattern 19 side toward the substrate 13 is formed in a part of the ground pattern 19.
図 3Aにおいて、基板表面側に露出するグランドパターン 19に図示しない工具を押 し付けると、グランドパターン 19と基板 13との間の絶縁層 18が押し潰されて周囲に 逃げてリング状に上方に盛り上がった***部 22が形成される(図 3B参照)。これによ り、絶縁層 18が破壊されて凹部上側のグランドパターン 19が凹部下側の基板 13と 電気的に導通させることができる。また、基板断面が露出することがないので、凹部 2 1に鯖などが発生することはない。このように、極めて簡易な構成で確実かつ安価に 導電性金属板 17とグランドパターン 19とを電気的導通させることができ、電磁波ノィ ズの放射を抑えること力 Sできる。尚、グランドパターン 19はレジスト被膜 20に覆われてIn FIG. 3A, when a tool (not shown) is pressed against the ground pattern 19 exposed on the substrate surface side, the insulating layer 18 between the ground pattern 19 and the substrate 13 is crushed, escapes to the surroundings, and rises upward in a ring shape. A raised ridge 22 is formed (see FIG. 3B). As a result, the insulating layer 18 is broken, and the ground pattern 19 on the upper side of the recess can be electrically connected to the substrate 13 on the lower side of the recess. Further, since the cross section of the substrate is not exposed, wrinkles or the like do not occur in the concave portion 21. In this way, the conductive metal plate 17 and the ground pattern 19 can be electrically connected reliably and inexpensively with an extremely simple configuration. The power to suppress the radiation of S. The ground pattern 19 is covered with the resist film 20.
V、ても!/、なくても!/、ずれでも良レ、。 V, even! / Even without! /
また、上述した実施の形態では球状の先端形状を持つ工具により凹部 21を形成し たが、他の先端形状をもつ工具を用いて凹部 21を形成しても良い。  In the above-described embodiment, the concave portion 21 is formed using a tool having a spherical tip shape. However, the concave portion 21 may be formed using a tool having another tip shape.
次に、ポリゴンスキャナモータの他例について図 4乃至図 7を参照して説明する。 モータの概略構成は前記図 1及び図 2と同様であるので省略し、異なる構成につい て説明する。尚、前記実施例と同一部材には同一番号を付して説明を援用するもの とする。  Next, another example of the polygon scanner motor will be described with reference to FIGS. Since the schematic configuration of the motor is the same as that shown in FIGS. 1 and 2, a description thereof will be omitted. It should be noted that the same members as those in the above-described embodiment are denoted by the same reference numerals and the description thereof is incorporated.
図 4において、グランドパターン 19の一部には枝パターン 19aが設けられている。 この枝パターン 19a上を工具で突いて凹部(陥没部) 21が形成されている。凹部 21 の平面形状の一例を示すと図 5の通りである。この状態で凹部 21に陥没したグランド パターン 19と導電性金属板 17とが電気的に導通がとれていればよい。  In FIG. 4, a branch pattern 19a is provided in a part of the ground pattern 19. A concave portion (recessed portion) 21 is formed by protruding on the branch pattern 19a with a tool. An example of the planar shape of the recess 21 is shown in FIG. In this state, the ground pattern 19 depressed in the recess 21 and the conductive metal plate 17 may be electrically connected.
また、図 6において、凹部 21に導電性金属材 (例えばはんだ、はんだ合金等) 24が 充填されているとより好ましい。図 7は図 6の矢印 A— A断面図を示す。凹部 21は、断 面くさび状乃至断面略 L字状にへこませて形成され、陥没したグランドパターン 19は 絶縁層 18が押し潰されて導電性金属板 17と電気的に導通するようになって!/、る。こ の陥没して形成された凹部 21の傾斜面 25に存在するグランドパターン端部 19Aと モータ基板 13の表層に設けられるレジスト被膜 20より露出するグランドパターン端部 19Bを覆うように導電性金属材 24が充填されている。尚、凹部 21の断面形状は鋭角 状のくさび形状から L字状よりやや大き!/、鈍角形状の!/、ずれでもよ!/、が、導電性金属 材 25の充填性を考慮すると、くさび形状が好まし!/、。  In FIG. 6, it is more preferable that the recess 21 is filled with a conductive metal material (eg, solder, solder alloy, etc.) 24. FIG. 7 shows a cross-sectional view along arrow AA in FIG. The concave portion 21 is formed by being recessed in a cross-sectional wedge shape or a substantially L-shaped cross section, and the recessed ground pattern 19 is electrically connected to the conductive metal plate 17 by the insulating layer 18 being crushed. /! A conductive metal material is formed so as to cover the ground pattern end 19A existing on the inclined surface 25 of the recessed portion 21 formed by this depression and the ground pattern end 19B exposed from the resist film 20 provided on the surface layer of the motor substrate 13. 24 is filled. The cross-sectional shape of the concave portion 21 is slightly larger than the L-shape from the acute-angled wedge shape! /, The obtuse-angle shape! /, Or may be misaligned! /. The shape is preferred!
このように、陥没したグランドパターン端部 19Aによる接続に加えて導電性金属材 2 4を介した表層側のグランドパターン端部 19Bと導電性金属板 17との電気的導通が 確保できるので、接続信頼性を向上できる。  Thus, in addition to the connection by the recessed ground pattern end 19A, the electrical connection between the ground pattern end 19B on the surface layer side through the conductive metal material 24 and the conductive metal plate 17 can be secured, so the connection Reliability can be improved.
上記実施例は、ポリゴンスキャナモータを用いて説明したカ、ディスク駆動用のスピ ンドルモータなど、他の基板取付型ブラシレスモータに用いることも可能である。  The above-described embodiment can also be used for other board-mounted brushless motors such as the power described with the polygon scanner motor and the spindle motor for driving the disk.

Claims

請求の範囲 The scope of the claims
[1] 導電性金属板上に絶縁層を介して導体パターンがレジスト被膜より露出して形成さ れた基板にハウジングが組み付けられ、該ハウジングに固定子が組み付けられ回転 子シャフトが回転可能に支持される基板取付型ブラシレスモータであって、  [1] A housing is assembled on a substrate on which a conductive pattern is exposed from a resist film on an electrically conductive metal plate via an insulating layer, and a stator is assembled to the housing so that the rotor shaft is rotatably supported. A board-mounted brushless motor,
グランドパターンの一部をへこませて凹部を形成し中間の絶縁層を押し潰すことで 当該グランドパターンと導電性金属板が電気的に導通していることを特徴とする基板 取付型ブラシレスモータ。  A substrate-mounted brushless motor characterized in that a part of the ground pattern is recessed to form a recess and the intermediate insulating layer is crushed to electrically connect the ground pattern and the conductive metal plate.
[2] グランドパターン上を押圧されて絶縁層を周囲に逃がした***部が形成され、当該 グランドパターンと導電性金属板が電気的に導通していることを特徴とする請求項 1 記載の基板取付型ブラシレスモータ。  [2] The substrate according to claim 1, wherein a protuberance is formed by pressing the ground pattern and releasing the insulating layer to the periphery, and the ground pattern and the conductive metal plate are electrically connected. Mounted brushless motor.
[3] グランドパターン上を断面くさび状若しくは断面略 L字状にへこませて、基板面より 陥没したグランドパターンと導電性金属板を電気的に導通させ、該陥没部に導電性 金属材が充填されていることを特徴とする請求項 1記載の基板取付型ブラシレスモー タ。  [3] The ground pattern is recessed into a wedge shape or a substantially L-shaped cross section to electrically connect the ground pattern depressed from the substrate surface and the conductive metal plate, and the conductive metal material is formed in the depressed portion. 2. The board-mounted brushless motor according to claim 1, wherein the motor is filled.
PCT/JP2007/072684 2006-11-27 2007-11-22 Board-mounted brushless motor WO2008065972A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006317963 2006-11-27
JP2006-317963 2006-11-27
JP2007296258A JP2008161041A (en) 2006-11-27 2007-11-15 Brushless motor mounted on substrate
JP2007-296258 2007-11-15

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Publication number Priority date Publication date Assignee Title
JP2010051046A (en) * 2008-08-19 2010-03-04 Panasonic Corp Brushless motor
JP2014110706A (en) * 2012-12-03 2014-06-12 Minebea Co Ltd Brushless motor

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JPH07288368A (en) * 1994-04-19 1995-10-31 Sony Corp Method of grounding printed board
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Publication number Priority date Publication date Assignee Title
JPH03201498A (en) * 1989-12-28 1991-09-03 Matsushita Electric Ind Co Ltd Metal board interconnection
JPH04171889A (en) * 1990-11-05 1992-06-19 Matsushita Electric Ind Co Ltd Method of inter-layer connection of metallic substrate
JPH07162104A (en) * 1993-12-02 1995-06-23 Sankyo Seiki Mfg Co Ltd Circuit board and its manufacture
JPH07288368A (en) * 1994-04-19 1995-10-31 Sony Corp Method of grounding printed board
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JP2000060094A (en) * 1998-08-06 2000-02-25 Kitashiba Electric Co Ltd Board mounted brushless motor

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Publication number Priority date Publication date Assignee Title
JP2010051046A (en) * 2008-08-19 2010-03-04 Panasonic Corp Brushless motor
JP2014110706A (en) * 2012-12-03 2014-06-12 Minebea Co Ltd Brushless motor

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