JPH04171889A - Method of inter-layer connection of metallic substrate - Google Patents
Method of inter-layer connection of metallic substrateInfo
- Publication number
- JPH04171889A JPH04171889A JP30080390A JP30080390A JPH04171889A JP H04171889 A JPH04171889 A JP H04171889A JP 30080390 A JP30080390 A JP 30080390A JP 30080390 A JP30080390 A JP 30080390A JP H04171889 A JPH04171889 A JP H04171889A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- wiring pattern
- tip
- metal plate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 31
- 239000011229 interlayer Substances 0.000 title claims description 26
- 238000000034 method Methods 0.000 title claims description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 87
- 239000002184 metal Substances 0.000 claims abstract description 87
- 239000010410 layer Substances 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000004033 plastic Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器に利用されている金属基板にお
ける配線パターンとそのベース材である金属板とを接続
する金属基板の層間接続方法に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to an interlayer connection method for metal substrates that connects wiring patterns on metal substrates used in various electronic devices and metal plates that are base materials thereof. be.
従来の技術
第６図は従来の金属基板における配線パターンと金属板
との接続（以下、層間接続と呼ぶ）方法の−例を示して
いる。第６図において、１は金属基板であり、アルミ板
、鉄板、ステンレス板等より成る金属板ＩＡと、金属板
ＩＡの表面に形成された樹脂等より成る絶縁層ＩＢと、
絶縁層ＩＢ上に積層された銅泊をエツチングする等の方
法によって形成された配線パターンＩＣとによって構成
されている。２は金属板に設けられためねじであり、こ
のめねじ２には頭部を有するおねじ３がねじこまれてい
る。おねじ３の頭部は配線パターンＩＣに半田づけ４さ
れており、さらにおねじ３の先端部は樹脂等によって封
止され、ねじのかみ合い部に湿気、ガス等が侵入して接
続が不確実になるのを防いでいる。BACKGROUND ART FIG. 6 shows an example of a conventional method for connecting a wiring pattern and a metal plate on a metal substrate (hereinafter referred to as interlayer connection). In FIG. 6, 1 is a metal substrate, which includes a metal plate IA made of an aluminum plate, a steel plate, a stainless steel plate, etc., an insulating layer IB made of a resin etc. formed on the surface of the metal plate IA,
The wiring pattern IC is formed by etching a copper layer laminated on the insulating layer IB. 2 is a female screw provided on the metal plate, and a male screw 3 having a head is screwed into this female screw 2. The head of the male screw 3 is soldered 4 to the wiring pattern IC, and the tip of the male screw 3 is sealed with resin, etc., and moisture, gas, etc. can enter the screw engagement part, making the connection uncertain. It prevents it from becoming.
第７図１ｂ＋他の従来例であり、第７図（ａｌにおいて
、６は金属板ＩＡに設けられた座ぐり部、７は金線、ア
ルミ等より成るボンディングワイヤーで、金属板ＩＡと
配線パターンＩＣとの間をワ層ＩＢに設けられた開孔部
で、ボンデグワイヤー７によって金属板ＩＡと配線パタ
ーンＩＣとの間をワイヤーボンド方式によって接続して
いる。Fig. 7 1b + another conventional example, in Fig. 7 (al), 6 is a counterbore provided in the metal plate IA, 7 is a bonding wire made of gold wire, aluminum, etc., and the wiring pattern is connected to the metal plate IA. The metal plate IA and the wiring pattern IC are connected by a wire bonding method using a bonding wire 7 through an opening provided in the wire layer IB between the metal plate IA and the IC.
発明が解決しようとする課題
このように、従来の方法によっても金属基板の層間接続
を行うことができる。しかしながら上記従来の方法にお
いては下記のような問題があった。Problems to be Solved by the Invention As described above, interlayer connections of metal substrates can be performed also by the conventional method. However, the above conventional method has the following problems.
先ず、第６図に示した方法においては、層間接続をさせ
るために広い基板面積を必要とし高密度実装用途には不
適当であること、金属板の厚さが薄い場合にはめねじを
形成するのが困難になること、金属板とおねじの接続は
接触接続であるため接続が不確実になりやすいこと、及
び金属板へのめねじ形成、おねじのねじこみ、おねじの
頭部とφ
配線パターンとの半田づけおねじ先端部の樹脂止を必要
とするので加工工数が大となって接続コストが高くなる
等の問題点があった。First, the method shown in Figure 6 requires a large board area to make interlayer connections and is unsuitable for high-density mounting applications, and when the metal plate is thin, a female thread is formed. The connection between the metal plate and the male screw is a contact connection, so the connection is likely to be uncertain. Also, forming a female thread on the metal plate, screwing in the male screw, and connecting the head of the male screw to φ wiring. Since the tip of the male screw needs to be fixed with resin for soldering to the pattern, there are problems such as an increase in the number of processing steps and a high connection cost.
小さくなるが、確実な接続を得るためには配線パターン
のワイヤーボンド個所及び金属板の材質によっでは座ぐ
り面に金メツキをほどこす必要がありコスト高になるこ
と、ボンディングワイヤーに外力が加わると容易にワイ
ヤーが断線すること、及び座ぐり加工を必要とするので
コスト高となるとともに金属板の厚さが薄い場合には座
ぐり加工が困難となって実施できなくなる等の問題点が
あった。第７図１ｂ＋に示した方法によれば座ぐり加工
は不要となり、薄い金属板にてもボンディング接続が可
能であるが、絶縁層の部分的なエツチング除去のために
は複雑な処理を必要とし、第７図（ａｌにおける問題点
に加えてさらに接続コストが高くなる欠点がある。Although it is smaller, in order to obtain a reliable connection, depending on the wire bonding point of the wiring pattern and the material of the metal plate, it is necessary to apply gold plating to the counterbore surface, which increases the cost and adds external force to the bonding wire. There are problems such as the wire easily breaks, and the need for counterbore processing, which increases costs.If the thickness of the metal plate is thin, counterbore processing becomes difficult and cannot be carried out. Ta. According to the method shown in Fig. 7, 1b+, spot boring is not required and bonding connection is possible even with thin metal plates, but complicated processing is required to partially remove the insulating layer by etching. , FIG. 7 (In addition to the problems with al, there is a further drawback that the connection cost increases.
金属基板はその構造上、絶縁層をはさんでその片側に配
線パターンを、反対側に導電性の金属板を有しているの
で配線パターンと金属板とを任意の個所で簡単に、微細
に接続できれば、金属板を単にケース、シールド、放熱
板等として利用するのみでなく、電源回路、グランド回
路等全回路に共通の回路構成用導体としても活用するこ
とができ、あたかも両面スルーホール基板のような使い
方をすることが可能となる。Due to its structure, a metal substrate has a wiring pattern on one side with an insulating layer in between, and a conductive metal plate on the other side, so it is easy to finely connect the wiring pattern and the metal plate at any location. If it can be connected, the metal plate can be used not only as a case, shield, heat sink, etc., but also as a conductor for circuit configurations common to all circuits such as power supply circuits and ground circuits, as if it were a double-sided through-hole board. It is possible to use it like this.
本発明は上記の事柄を可能とするために、従来の層間接
続方法における問題点を解決して基板上の任意の個所で
、金属板の厚さに関係なく、微少基板面積内で、確実に
、簡単に、低コストで層間接続する方法を提供する事を
目的とするものである。In order to make the above possible, the present invention solves the problems with the conventional interlayer connection method and reliably connects any part of the board, regardless of the thickness of the metal plate, within a minute board area. The purpose of this invention is to provide a simple and low-cost method for interlayer connection.
課題を解決するための手段
本発明は上記目的を達成するために、金属基板の層間接
続すべき個所の配線パターンの表面から、鋭角状の先端
部頂点を有する接続用工具の先端を上記金属基板の金属
板内部まで圧入することを特徴表するものである。Means for Solving the Problems In order to achieve the above-mentioned object, the present invention aims to connect the tip of a connection tool having an acute-angled tip apex to the surface of the wiring pattern at the location where interlayer connection is to be made on the metal substrate. It is characterized by being press-fitted into the inside of the metal plate.
作 用
本発明によれば、接続用工具の先端は鋭角状の頂点を有
しているので、上記接続用工具の先端が配線パターンに
接すると先ず配線パターンが穿孔され、引き続いて絶縁
層が穿孔される。さらに上記工具の先端部が金属基板内
に進入すると、上記工具の先端部に接触している部分の
配線パターンは、先端部と配線パターン間の摩擦力のた
め、絶縁層をその周辺に排除しつつ金属板内に押しこま
れ、遂に金属板と接触することとなる。この場合、配線
パターンと金属板との界面は強い力で相互に圧迫されな
がら塑性流動を起こすので両者の表面汚染は物理的に除
去されて活性な金属面同志が直接接触することとなり、
配線パターンと金属板との間には理想的な金属間結合が
得られるものである。According to the present invention, the tip of the connection tool has an acute apex, so when the tip of the connection tool comes into contact with the wiring pattern, the wiring pattern is first perforated, and then the insulating layer is perforated. be done. Furthermore, when the tip of the tool enters the metal substrate, the wiring pattern in the portion that is in contact with the tip of the tool will eliminate the insulating layer around it due to the frictional force between the tip and the wiring pattern. It is pushed into the metal plate and finally comes into contact with the metal plate. In this case, the interface between the wiring pattern and the metal plate is pressed against each other by a strong force and plastic flow occurs, so the surface contamination on both is physically removed and the active metal surfaces come into direct contact with each other.
An ideal metal-to-metal bond can be obtained between the wiring pattern and the metal plate.
実施例
第１図ａ −ｄは本発明の一実施例による層間接続方法
を示している。第１図において、１は金属基板であり、
アルミ板、鉄板、ステンレス板等より成る金属板ＩＡと
、上記金属板ＩＡの表面に主としてエポキシ、ポリイミ
ド等の樹脂を被覆して成る絶縁層ＩＢと、絶縁層ＩＢ上
に積層された銅泊をエツチングする等の方法によって形
成された配線パターンＩＣとによって構成されている。Embodiment FIGS. 1a to 1d show an interlayer connection method according to an embodiment of the present invention. In FIG. 1, 1 is a metal substrate;
A metal plate IA made of an aluminum plate, a steel plate, a stainless steel plate, etc., an insulating layer IB made of a resin such as epoxy or polyimide coated on the surface of the metal plate IA, and a copper foil laminated on the insulating layer IB. The wiring pattern IC is formed by a method such as etching.
尚、金属基板１は上記以外の材料、方法によって構成さ
れているものであってもよい。９は接続用工具であって
、例えば鋼製で、その先端部９Ａは鋭角状の頂点をもつ
円錐形成型されている。１０は、加工用の台座、１１は
配線パターンＩＣと金属板ＩＡとの接続個所である。Note that the metal substrate 1 may be constructed using materials and methods other than those described above. Reference numeral 9 denotes a connecting tool, which is made of steel, for example, and its tip 9A has a conical shape with an acute apex. 10 is a pedestal for processing, and 11 is a connection point between the wiring pattern IC and the metal plate IA.
次に上記実施例の動作について説明する。第１図＋ａｌ
は準備状態を示し、金属基板１を加工用の台座１０の上
にのせ、接続用工具９を層間接続すべ（ｂｌは接続用工
具９の先端部の頂点９Ａが配線パターンＩＣと絶縁層Ｉ
Ｂとを貫通、穿孔した状態を示している。引き続いて接
続用工具９が更に下方に移動すると、第１図（Ｃ）に示
すように、接続用工具９の先端部９Ａの周辺の配線パタ
ーンＩＣは１、先端部９Ａと配線パターンＩＣとの間の
摩擦力によって先端部９Ａとともに金属板ＩＡ中に押し
こまれることとなる。この際、絶縁層ＩＢはすでに穿孔
されているので先端部９Ａの進入につれて周辺に排除さ
れ、配線パターンＩＣは金属板ＩＡに直接接触するとと
もに両者の界面には先端部９Ａの圧入による強い圧力と
著しい塑性流動を生じ、両者は金属間結合によって接続
１１される。第１図（ｄ）は層間接続完了の状態である
。Next, the operation of the above embodiment will be explained. Figure 1 +al
indicates the preparation state, the metal substrate 1 is placed on the processing pedestal 10, and the connection tool 9 is used for interlayer connection (bl indicates that the apex 9A of the tip of the connection tool 9 is connected to the wiring pattern IC and the insulating layer I).
B is shown in a state where it is penetrated and perforated. Subsequently, when the connection tool 9 moves further downward, as shown in FIG. 1(C), the wiring pattern IC around the tip 9A of the connection tool 9 becomes 1, and the connection between the tip 9A and the wiring pattern IC Due to the frictional force therebetween, the tip portion 9A is pushed into the metal plate IA. At this time, since the insulating layer IB has already been perforated, it is removed to the periphery as the tip 9A enters, and the wiring pattern IC comes into direct contact with the metal plate IA, and a strong pressure is applied to the interface between the two due to the press-fitting of the tip 9A. Significant plastic flow occurs and the two are connected 11 by an intermetallic bond. FIG. 1(d) shows a state in which the interlayer connection is completed.
この場合、接続用工具９の先端部９Ａの頂点が半球状を
成していると、第２図に示すように、絶縁層ＩＢが穿孔
、排除されないので層間接続されることがない。In this case, if the apex of the tip 9A of the connection tool 9 has a hemispherical shape, as shown in FIG. 2, the insulating layer IB will not be perforated and removed, and no interlayer connection will occur.
なお、接続用工具９の材質は必要とする強度がさえあれ
ば、円錐形以外の如何なる形状であっても同様の効果が
得られる。Note that the same effect can be obtained even if the material of the connecting tool 9 has any shape other than a conical shape as long as it has the required strength.
第３図は第２の実施例を示しており、この実施例は、第
１図に示した方法によって層間接続した後、上記接続個
所を半球状の先端部頂点をもつ加圧用工具１２によって
再度加圧をしたものである。FIG. 3 shows a second embodiment, in which after the interlayer connection is made by the method shown in FIG. It is pressurized.
この実施例によれば、配線パターンＩＣと金属板ｉの接
触面積が第１図の実施例よりも増大するので、より確実
な接続とより低い接続抵抗が得られる利点がある。According to this embodiment, since the contact area between the wiring pattern IC and the metal plate i is larger than that of the embodiment shown in FIG. 1, there is an advantage that more reliable connection and lower connection resistance can be obtained.
第４図は第３の実施例であり、この実施例では、第１図
に示した実施例における接続用工具９の先端部９Ａを金
属板ＩＡの内部で留めることなく、金属板ＩＡを貫通さ
せるようにしたものである。FIG. 4 shows a third embodiment, and in this embodiment, the tip 9A of the connecting tool 9 in the embodiment shown in FIG. It was designed so that
この実施例によれば配線パターンＩＣと金属板ＩＡとの
接続がより確実、より低抵抗になるとともに、層間接続
と同時に金属基板を開孔することができる。According to this embodiment, the connection between the wiring pattern IC and the metal plate IA becomes more reliable and the resistance is lower, and holes can be formed in the metal substrate at the same time as the interlayer connection.
更に、上記した３種類の実施例に共通して下記のような
改良が可能である。Furthermore, the following improvements can be made in common to the three types of embodiments described above.
まず、加工用台座１０、接続用工具９、加圧用工具１２
のすべて又は何れかを加熱することによって配線パター
ンＩＣと金属板ＩＡとを加熱圧着することが可能となり
、より確実な接続が得られる。First, a processing pedestal 10, a connection tool 9, a pressure tool 12
By heating all or any of the wiring pattern IC and the metal plate IA, it becomes possible to heat and press the wiring pattern IC and the metal plate IA, and a more reliable connection can be obtained.
次に、接続又は再加圧終了後、上記接続又は再加圧個所
を半田づけしたり、超音波、電気抵抗、レーザー等によ
って溶接すれば、より確実で低抵抗の接続を得ることが
できる。Next, after the connection or repressurization is completed, a more reliable and low resistance connection can be obtained by soldering or welding the connection or repressurization points using ultrasonic waves, electrical resistance, laser, or the like.
また、第５図は第１図に示した実施例における接続個所
の谷底の拡大図であるが、第５図に示すように谷底には
配線パターンが穿孔されたことによる金属板ＩＡの露出
個所１３があり、この個所で金属板ＩＡが酸化、腐食す
る場合がある。この他、金属板ＩＡがアルミ板、配線パ
ターンＩＣが銅泊の場合には両者の境界１４において局
部電池形成による電解腐食を起こす場合がある。接続又
は再加圧個所を半田づけした場合には、金属板ＩＡの露
出個所１３は半田によって被覆されるので上記の恐れは
ないが、はんだづけ以外の場合で、必要ならば露出個所
１３を樹脂等によってオーバーコートすれば上記の恐れ
が解消される。特に図示はしないが、第３．４図に示し
た実施例においても全く同様である。Furthermore, FIG. 5 is an enlarged view of the valley bottom of the connection point in the embodiment shown in FIG. 1, and as shown in FIG. 13, and the metal plate IA may oxidize and corrode at this location. In addition, if the metal plate IA is an aluminum plate and the wiring pattern IC is a copper plate, electrolytic corrosion may occur at the boundary 14 between the two due to local battery formation. If the connection or repressurization points are soldered, the exposed portion 13 of the metal plate IA will be covered with solder, so there is no risk of the above, but in cases other than soldering, if necessary, the exposed portion 13 can be covered with resin, etc. The above-mentioned fear can be eliminated by overcoating. Although not particularly shown, the same applies to the embodiment shown in FIG. 3.4.
また、上記実施例においては、すべてベース材である金
属板の片面に絶縁層を介して配線パターンを形成した場
合を示したが、金属板の両面に絶縁層を介して配線パタ
ーンを形成した場合においても全く同様の効果を有する
ものである。In addition, in the above embodiments, the wiring pattern was formed on one side of the metal plate, which is the base material, with an insulating layer interposed therebetween, but when the wiring pattern was formed on both sides of the metal plate with an insulating layer interposed therebetween, It also has exactly the same effect.
発明の効果
本発明は上記実施例より明らかなように、以下に示すよ
うな効果を有する。Effects of the Invention As is clear from the above embodiments, the present invention has the following effects.
（１） 鋭角状の先端部頂点をもつ接続用工具の先端
を、層間接続すべき個所の配線パターン表面から金属板
内部に圧入するようにしたので、簡単な装置によって１
回の動作で、簡単に、低コストで、金属板の厚さに関係
なく、金属基板上の任意の個所で層間接続することがで
きる。(1) The tip of the connection tool, which has an acute-angled tip apex, is press-fitted into the metal plate from the surface of the wiring pattern where interlayer connections are to be made.
Interlayer connections can be made easily, at low cost, and at any location on a metal substrate in just one operation, regardless of the thickness of the metal plate.
（２） 接続用工具の先端部を圧入するだけであるの
で、層間接続のために必要な金属基板の面積はスルーホ
ール基板のスルーホール経程度でよい。(2) Since the tip of the connection tool is simply press-fitted, the area of the metal substrate required for interlayer connection may be approximately the diameter of the through-hole of the through-hole substrate.
（３） 配線パターンと金属板との接合は理想的な金
属間結合であるので、確実な接続が得られる。(3) Since the connection between the wiring pattern and the metal plate is an ideal metal-to-metal bond, a reliable connection can be obtained.
（４）以上のことから金属板を電源回路、グランド回路
等全回路に共通の回路構成用導体として活用することが
できるようになり、片面金属基板あっても両面スルーホ
ール基板に匹敵する布線処理能力をもたせられ、金属基
板における高密度実装が可能となる。(4) From the above, metal plates can now be used as conductors for circuit configurations common to all circuits such as power supply circuits and ground circuits, and even with a single-sided metal board, wiring is comparable to a double-sided through-hole board. It has processing capacity and enables high-density packaging on metal substrates.
特に、金属板をグランド回路とした場合には、グランド
インピーダンスを著しく低く保つ事が可能となり、動
作の安定した電気回路を提供することができる。In particular, when a metal plate is used as a ground circuit, the ground impedance can be kept extremely low, and an electrical circuit with stable operation can be provided.
（５） 接続用工具の先端部を金属板内で留めず、金
属板を貫通させれば、層間接続と同時に金属基板に孔を
あけることができる。(5) If the tip of the connection tool is not held within the metal plate but is passed through the metal plate, a hole can be made in the metal substrate at the same time as the interlayer connection.
（６）更に、接続個所の再加圧、金属板貫通接続、加熱
圧着接続、接続個所の半田づけ又は溶接等を行えば、よ
り一層確実で低抵抗の層間接続が得られる。(6) Furthermore, by performing repressurization of the connection points, metal plate penetration connection, heat-pressing connection, soldering or welding of the connection points, even more reliable and low-resistance interlayer connections can be obtained.
（７）接続又は再加圧個所を半田づけ又は樹脂等によっ
てオーバーコートすれば、接続又は再加圧個所よおける
金属板露出のための酸化や腐食を防止することができる
。(7) If the connection or repressurization points are soldered or overcoated with resin or the like, oxidation or corrosion due to exposure of the metal plate at the connection or repressurization points can be prevented.
第１図Ｂ −、−ｄは本発明の一実施例における金属基
板の層間接続方法を示す図、第２図〜第４図はそれぞれ
他の実施例の金属基板の層間接続方法を示す図、第５図
は第１図に示す実施例の一部を拡大して示す図、第６図
は従来の層間接続方法を示す図、第７図ａ、ｂは他の従
来例を示す図である。
１・・・金属基板、ＩＡ・・・金属板、ＩＢ・・・絶縁
層、ＩＣ・・・配線パターン、９・・・接続用工具、９
Ａ・・・先端部、１０・・・加工用台座、１１・・・接
続個所、１２・・・加工用工具、１３・・・金属板の露
出個所、１４・・・接合境界線。
代理人の氏名 弁理士 小鍜冶 明 ほか２名第１図
第２図
第３図
第４図
第５図
第７図1B-, -d are diagrams showing an interlayer connection method of metal substrates in one embodiment of the present invention, and FIGS. 2 to 4 are diagrams showing interlayer connection methods of metal substrates in other embodiments, respectively. FIG. 5 is an enlarged view of a part of the embodiment shown in FIG. 1, FIG. 6 is a diagram showing a conventional interlayer connection method, and FIG. 7 a and b are diagrams showing other conventional examples. . 1... Metal substrate, IA... Metal plate, IB... Insulating layer, IC... Wiring pattern, 9... Connection tool, 9
A... Tip portion, 10... Processing pedestal, 11... Connection location, 12... Processing tool, 13... Exposed location of metal plate, 14... Joining boundary line. Name of agent: Patent attorney Akira Kokaji and two others Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 7
Claims (6)
、金属板上に絶縁層を設け、この絶縁層上に配線パター
ンを形成して成る金属基板の上記配線パターンの表面か
ら上記絶縁層をその周辺に排除しつつ上記金属板の内部
まで圧入することによって、上記配線パターンと上記金
属板とを特定の個所において接続することを特徴とする
金属基板の層間接続方法。(1) The tip of a connection tool having an acute-angled tip apex is connected to the insulating layer from the surface of the wiring pattern of a metal substrate, which is formed by providing an insulating layer on a metal plate and forming a wiring pattern on the insulating layer. A method for connecting layers between metal substrates, characterized in that the wiring pattern and the metal plate are connected at a specific location by press-fitting the layer to the inside of the metal plate while excluding the layer from its periphery.
個所を半球状の先端部頂点を有する加圧用工具の先端で
再加圧することを特徴とする請求項第１項記載の金属基
板の層間接続方法。(2) The metal substrate according to claim 1, wherein after the wiring pattern and the metal plate are connected, the connection point is re-pressurized with a tip of a pressure tool having a hemispherical tip apex. Interlayer connection method.
く、金属板を貫通させることを特徴とする請求項第１項
記載の金属基板の層間接続方法。(3) The interlayer connection method for metal substrates according to claim 1, characterized in that the tip of the connection tool is passed through the metal plate without being held inside the metal plate.
接又は半田づけすることを特徴とする請求項第１項ない
し第３項のいずれかに記載の金属基板の層間接続方法。(4) The interlayer connection method for metal substrates according to any one of claims 1 to 3, characterized in that after the connection or repressurization, the connection or repressurization location is welded or soldered.
を同時に、或いは別々に加熱しながら接続又は加圧する
ことを特徴とする請求項第１ないし第３項のいずれかに
記載の金属基板の層間接続方法。(5) The metal according to any one of claims 1 to 3, characterized in that the connection or pressure is applied while heating the tip of the connection tool or the repressurization tool and the metal plate simultaneously or separately. Connection method between board layers.
溶接個所を樹脂等によりオーバーコートすることを特徴
とする請求項第１項ないし第５項のいずれかに記載の金
属基板の層間接続方法。(6) After connection, repressurization, or welding, the above connection, repressurization,
6. The interlayer connection method for metal substrates according to claim 1, wherein the welding location is overcoated with a resin or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300803A JP2671599B2 (en) | 1990-11-05 | 1990-11-05 | Interlayer connection method for metal substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2300803A JP2671599B2 (en) | 1990-11-05 | 1990-11-05 | Interlayer connection method for metal substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04171889A true JPH04171889A (en) | 1992-06-19 |
| JP2671599B2 JP2671599B2 (en) | 1997-10-29 |
Family
ID=17889290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2300803A Expired - Fee Related JP2671599B2 (en) | 1990-11-05 | 1990-11-05 | Interlayer connection method for metal substrates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2671599B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008065972A1 (en) * | 2006-11-27 | 2008-06-05 | Shinano Kenshi Kabushiki Kaisha | Board-mounted brushless motor |
| JP2010074621A (en) * | 2008-09-19 | 2010-04-02 | Nitto Denko Corp | Circuit board for isolator, isolator, and method for manufacturing isolator |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927866A (en) * | 1972-07-11 | 1974-03-12 | ||
| JPS5569456A (en) * | 1978-11-20 | 1980-05-26 | Yazaki Corp | Method of connecting uppandddown conductor in both surface laminated board |
| JPS55102291A (en) * | 1979-01-29 | 1980-08-05 | Nippon Mektron Kk | Structure for and method of conducting through hole of flexible circuit substrate |
-
1990
- 1990-11-05 JP JP2300803A patent/JP2671599B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927866A (en) * | 1972-07-11 | 1974-03-12 | ||
| JPS5569456A (en) * | 1978-11-20 | 1980-05-26 | Yazaki Corp | Method of connecting uppandddown conductor in both surface laminated board |
| JPS55102291A (en) * | 1979-01-29 | 1980-08-05 | Nippon Mektron Kk | Structure for and method of conducting through hole of flexible circuit substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008065972A1 (en) * | 2006-11-27 | 2008-06-05 | Shinano Kenshi Kabushiki Kaisha | Board-mounted brushless motor |
| JP2010074621A (en) * | 2008-09-19 | 2010-04-02 | Nitto Denko Corp | Circuit board for isolator, isolator, and method for manufacturing isolator |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2671599B2 (en) | 1997-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3015712B2 (en) | Film carrier and semiconductor device using the same | |
| US6448644B1 (en) | Flip chip assembly with via interconnection | |
| JPH045844A (en) | Multilayer circuit board for mounting ic and manufacture thereof | |
| US6406939B1 (en) | Flip chip assembly with via interconnection | |
| JPH0399456A (en) | Semiconductor device and method of manufacturing the same | |
| US6007669A (en) | Layer to layer interconnect | |
| JP2019029535A (en) | Flexible printed wiring board, electronic device having flexible printed wiring board, method for manufacturing electronic device having flexible printed wiring board | |
| JP2640780B2 (en) | Interlayer connection method for metal substrates | |
| JPH04171889A (en) | Method of inter-layer connection of metallic substrate | |
| JP4635331B2 (en) | Printed wiring board | |
| US8334465B2 (en) | Wafer of circuit board and joining structure of wafer or circuit board | |
| JP2640009B2 (en) | Interlayer connection method for metal substrates | |
| JPS6358708A (en) | Anisotropic conducting film | |
| JPH01220494A (en) | Multilayer interconnection substrate | |
| JP2007157771A (en) | Printed wiring board and method of forming its continuity | |
| JP2001332860A (en) | Multi-layered wiring board, semiconductor device, electronic device, and their manufacturing method | |
| JP3360492B2 (en) | Electronic circuit board | |
| JP2002124770A (en) | Electric circuit board and production method therefor | |
| JPH0786751A (en) | Manufacture of multilayer printed-wiring board | |
| JPS58184786A (en) | Metal core printed circuit board | |
| JPH11186346A (en) | Substrate for semiconductor device and manufacture thereof | |
| JPH05206143A (en) | Composite film, and formation of transfer bump by use thereof | |
| JPS63195A (en) | Manufacture of wiring board | |
| JPH0653347A (en) | Leadless chip carrier | |
| JPH0653348A (en) | Leadless chip carrier |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070711 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080711 Year of fee payment: 11 |
|
| LAPS | Cancellation because of no payment of annual fees |