WO2008018429A1 - Évaporateur - Google Patents

Évaporateur Download PDF

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Publication number
WO2008018429A1
WO2008018429A1 PCT/JP2007/065399 JP2007065399W WO2008018429A1 WO 2008018429 A1 WO2008018429 A1 WO 2008018429A1 JP 2007065399 W JP2007065399 W JP 2007065399W WO 2008018429 A1 WO2008018429 A1 WO 2008018429A1
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WO
WIPO (PCT)
Prior art keywords
heat transfer
evaporator
heat
gas
liquid separation
Prior art date
Application number
PCT/JP2007/065399
Other languages
English (en)
Japanese (ja)
Inventor
Takahiro Agata
Original Assignee
Takahiro Agata
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Takahiro Agata filed Critical Takahiro Agata
Priority to JP2007551500A priority Critical patent/JP4917048B2/ja
Publication of WO2008018429A1 publication Critical patent/WO2008018429A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/083—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning capable of being taken apart
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01B—BOILING; BOILING APPARATUS ; EVAPORATION; EVAPORATION APPARATUS
    • B01B1/00—Boiling; Boiling apparatus for physical or chemical purposes ; Evaporation in general
    • B01B1/005—Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D1/00—Evaporating
    • B01D1/0011—Heating features
    • B01D1/0041—Use of fluids
    • B01D1/0047—Use of fluids in a closed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D3/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium flows in a continuous film, or trickles freely, over the conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0061—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for phase-change applications
    • F28D2021/0064—Vaporizers, e.g. evaporators

Definitions

  • the present invention relates to an evaporator, and more particularly to an evaporator that can generate a vapor of the working fluid by heating the working fluid with a heat source and can be used in various situations.
  • Patent Document 1 shows an evaporator used in a thermoelectric generator.
  • Patent Document 2 shows an evaporator for cooling a stack of a solid polymer electrolyte fuel cell
  • Patent Document 3 describes evaporation as a component of a heat exchange device.
  • a vessel is shown.
  • Patent Document 4 shows an evaporator as a stacked heat exchanger
  • Patent Document 5 is used as a heat sink for a power semiconductor element by being incorporated in a stack assembly of a semiconductor device.
  • An evaporator as a boiling cooling body is shown.
  • nucleate boiling As the steam generation mode of the evaporator, nucleate boiling, which has the potential to greatly increase the heat transfer rate from the heat transfer surface to the working fluid, has been conventionally used (Patent Documents 1 to 5). If nucleate boiling can be used, it depends greatly on the state of occurrence of nucleate boiling, but it is possible to achieve a heat transfer coefficient that is approximately 10 to 100 times that of forced convection water flow. Yes.
  • the bubble nuclei formed on the basis of minute scratches and cavities on the heat transfer surface become the foaming points (boiling nuclei), from which the growth and separation of vapor bubbles occur. It happens by being repeated.
  • the size of bubble nuclei will increase, and nucleate boiling will start and be sustained even if the degree of superheat, which is the difference between the surface temperature of the heat transfer surface and the saturation temperature of the working fluid, is small. .
  • the heat transfer surface is lined with a sintered metal, the protrusion is formed, the minute recess is formed, the reinforcing rib It has been shown that the bottom shape of the tube is made V-shaped to facilitate nucleate boiling.
  • a vertical plane such as a machine or device is directly used as a heat transfer surface to transfer heat.
  • a smooth heat transfer surface is required. It will cause nucleate boiling, and the superheating degree at the boiling start point will be as high as 10 ° C. For this reason, the evaporation temperature of the working fluid is 10 ° C or more lower than the heat source temperature. If the temperature of the heat source to be used is 100 ° C or less, the heat utilization efficiency and the heat dissipation efficiency will be reduced! there were.
  • the volume and shape of the evaporator are limited due to the spatial restrictions of the installation location, and the critical heat flux phenomenon may occur before nucleate boiling reaches the interference region.
  • the heat flux increases rapidly with a slight increase in superheat, so the number of foaming points increases rapidly, generating steam bubbles.
  • the withdrawal cycle is also very fast.
  • the heat transfer surface may be covered. As a result, supply of the working fluid to the heat transfer surface may be delayed, causing intermittent and local dryout, resulting in a decrease or fluctuation in heat flux.
  • the heat source temperature is 100 ° C or lower, it is desirable to use water as a working fluid from the viewpoints of cost, safety, ease of maintenance, and the like.
  • the working fluid depth in the evaporator has a problem of suppressing nucleate boiling.
  • the heat source temperature is 30 ° C
  • the working fluid is water and boiling at 25 ° C, its saturated vapor pressure is 3168 Pascals (Pa).
  • the water depth is 10cm, it will boil at a temperature that makes about 4200Pa saturated vapor pressure by adding about lOOOPa as water pressure.
  • Patent Document 1 Japanese Patent Laid-Open No. 2005-24132
  • Patent Document 2 JP-A-2005-190725
  • Patent Document 3 Japanese Patent Laid-Open No. 5-52491
  • Patent Document 4 Japanese Patent Laid-Open No. 7-127987
  • Patent Document 5 JP 2000-77586 Koyuki
  • the present invention has been made in view of the above problems, and does not cause intermittent and local dryout, and the supply of the working fluid to the heat transfer surface does not stagnate, so that the heat flux increases.
  • the evaporator is not required to be large and water is used as the working fluid and the heat source temperature is 100 ° C or less, only a slight temperature difference from the heat source can be used effectively.
  • the goal is to provide an evaporator that will be revolutionary eco-technologies!
  • an evaporator (1) has a nucleation member that forms boiling nuclei between two planes arranged opposite to each other. One of these two planes or two planes are sandwiched and constitute a heat transfer surface that transfers heat from the heat source to the working fluid.
  • the structure of the nucleation member is not particularly limited as long as it can form boiling nuclei at an appropriate density by contacting the flat surface at an appropriate ratio.
  • an expanded metal is sufficient.
  • the material that is desired to have space There is no particular limitation on the material that is desired to have space.
  • the nucleation member that forms the boiling nuclei is sandwiched between the two planes arranged opposite to each other.
  • Nucleate boiling which can maximize the heat transfer coefficient, can be generated and maintained very reliably and efficiently.
  • it takes time and effort to increase the cost such as lining sintered metal on the heat transfer surface, forming protrusions, forming minute recesses, and making the bottom shape of the reinforcing rib V-shaped. It is possible to provide a small, revolutionary, high-performance evaporator at a low cost that does not require a manufacturing process.
  • the thickness of the nucleation member may be 2 mm or less, whereas the evaporation part depth may be several hundred mm or more, which makes it extremely thin and has a wide area. Can provide you with an evaporator. In conventional evaporators, the shape of such a thin evaporation section could not eliminate the gravitational action (buoyancy) that lifts and raises the vapor bubbles from the foaming point, and the critical heat flux could not be very low.
  • the heat transfer is performed at a stage of relatively small heat flux.
  • the surface of the heat transfer surface can be covered with a steam flow, and the heat transferred from the heat transfer surface is transferred to the gas-liquid interface in contact with the steam flow through heat conduction, where the saturated vapor pressure 'temperature It becomes an efficient form to continuously evaporate the steam.
  • This efficient evaporation form not involving convection heat transfer is the same as the vapor mass generation seen in the interference region of nucleate boiling. Select a working fluid that has a high saturation pressure and does not cause low-pressure boiling.
  • the two planes sandwiching the nucleation member may be inclined rather than substantially vertical.
  • the evaporator (2) according to the present invention is characterized in that the two planes are arranged substantially vertically.
  • the installation area of the evaporator can be minimized.
  • the evaporator (3) according to the present invention is characterized in that the two planes are arranged to be inclined with respect to a vertical plane.
  • the evaporator (3) can be stably mounted on the roof or the like according to the inclination angle of the mounting surface such as the roof.
  • the evaporator (4) according to the present invention is exposed above the gas-liquid separation interface of the nucleation member working fluid in any of the evaporators (1) to (3).
  • the special feature is that it is structured as follows.
  • the evaporator (4) even if the vapor ejected from the heat transfer surface violently boiles the gas-liquid separation interface, the upper end of the nucleation member is completely encased in the vapor and causes dryout.
  • the working fluid can always be maintained in a state where it flows down the nucleation member and heat transfer efficiency can be improved.
  • the evaporator (5) according to the present invention is characterized in that in any of the evaporators (1) to (4), the nucleation member is formed of an expanded metal! As! /
  • Expanded metal is widely used, and various types can be obtained at low cost. Therefore, according to the evaporator (5), it is possible to form the nucleation member at a low cost, and to optimize the force according to the situation, and to provide a high-performance evaporator at a low cost. It will be defeated with force S.
  • a gas-liquid separation header is continuously provided above the two planes. It is a feature.
  • the plane is covered with the vapor flow, so that the working liquid filling the evaporator is pushed out and flows out from the evaporator to the condenser in a gas-liquid mixed flow state.
  • Gas-liquid separation is performed to prevent the occurrence of dryout, and the working fluid can always be stably supplied between the nucleation member and the flat surface, and more reliably preventing the occurrence of dryout and increasing the heat transfer efficiency. be able to.
  • a liquid reservoir is connected to a lower portion of the two planes, and the liquid reservoir and the gas-liquid separation header are connected to each other.
  • the conveying means connected via the connecting means and sending the working fluid accumulated in the liquid reservoir to the gas-liquid separation header is interposed in the connecting means.
  • the evaporator (7) when the working fluid flows, when the saturated vapor pressure is in a low pressure region, the bubble nuclei formed at the contact point between the nucleation member and the two planes become the working fluid.
  • An amount of working fluid is circulated between the gas-liquid separation header and the liquid reservoir so as not to be immersed and capable of maintaining a liquid flow flowing down the nucleation member. Regardless of the vertical distance of the heat transfer surface, it is possible to cause nucleate boiling with the entire surface of the heat transfer surface covered with steam flow.
  • a nucleation member is sandwiched between two heat transfer plates to constitute one unit
  • a through hole is formed in the opposite location of the upper part of the two heat transfer plates,
  • a through hole is formed at a location facing the through hole of the upper separator
  • a gas-liquid separation header is constituted by the upper separator and the through holes of the two heat transfer plates, while a space formed by two adjacent heat transfer plates and the upper and lower separators is a heat source flow portion.
  • the evaporator (8) an extremely thin and extremely high performance evaporator can be realized. Also, since the heat source flow part is surrounded by a flat surface, Teflon (registered trademark) Coating such as processing can be easily performed, and it can be applied regardless of the type of heat source, and it can be made suitable for exhaust heat use of hot springs, which are usually difficult to use due to scale problems.
  • Teflon registered trademark
  • an evaporator as a cooling device for a solid polymer electrolyte fuel cell stack and an evaporation as a boiling type cooling body used as a heat sink for a power semiconductor element incorporated in a stack assembly of a semiconductor device. If the evaporator (8) is used in a vacuum vessel, etc., it is possible to provide a high performance, excellent workability, inexpensive, thin, and space-saving evaporator.
  • a nucleation member is sandwiched between two heat transfer plates to constitute one unit
  • Through-holes are formed at opposite locations of the upper and lower portions of the two heat transfer plates, and these units are stacked horizontally via two upper and lower separators,
  • a through-hole is formed at a location facing the through-hole of the upper and lower separators, and a gas-liquid separation header and a liquid reservoir are configured by the through-holes of the upper and lower separators and the two heat transfer plates,
  • the liquid reservoir and the gas-liquid separation header are connected via a connecting means,
  • the space formed by the two adjacent heat transfer plates and the upper and lower separators serves as a flow path for the heat source.
  • the evaporator (9) even when the saturated vapor pressure is in a low pressure region during operation of the working fluid, the entire surface of the heat transfer plate is covered regardless of the vertical distance of the heat transfer plate. Thus, it is possible to cause nucleate boiling at substantially the same saturation temperature to occur at the foaming point formed at the contact point between the heat transfer plate and the nucleation member. Therefore, it is possible to provide a high-performance evaporator that makes the best use of nucleate boiling even with a heat exchange system that uses only a small temperature difference.
  • FIG. 1 is an exploded perspective view showing an evaporator according to a first embodiment of the present invention.
  • FIG. 2 is an assembled perspective view showing the evaporator according to the first embodiment.
  • FIG. 3 is an enlarged cross-sectional view taken along line m- ⁇ in FIG. 2 showing the evaporator according to the first embodiment.
  • FIG. 4 is an exploded perspective view showing an evaporator according to a second embodiment of the present invention.
  • FIG. 5 is an assembled perspective view showing an evaporator according to a second embodiment.
  • FIG. 6 is an enlarged sectional view taken along line VI-VI in FIG. 5 showing an evaporator according to a second embodiment.
  • FIG. 7 is an assembled perspective view showing an evaporator according to a third embodiment of the present invention.
  • FIG. 8 is a cross-sectional view taken along the line vm-vm in FIG. 7, showing an evaporator according to a third embodiment.
  • FIG. 9 is a partially exploded perspective view showing an evaporator according to a fourth embodiment of the present invention.
  • FIG. 10 is an exploded perspective view showing an evaporation plate unit according to a fourth embodiment.
  • FIG. 11 is a cross-sectional view of the ⁇ -Xl spring assembly in FIG.
  • FIG. 12 is a partially exploded perspective view showing an evaporator according to a fifth embodiment of the present invention.
  • FIG. 13 is an exploded perspective view showing an evaporation plate unit according to a fifth embodiment.
  • FIG. 14 is a sectional view taken along line XIV-XIV in FIG.
  • FIG. 1 is an exploded perspective view showing an evaporator according to a first embodiment of the present invention
  • FIG. 2 is an assembled perspective view
  • FIG. 3 is an enlarged sectional view taken along the line in FIG.
  • Evaporator 1 indicates an evaporator.
  • Evaporator 1 includes two rectangular metal heat transfer plates 2, and stainless steel expanded metal 3 4 as a nucleation member cut into a rectangular shape. It includes a stainless steel frame 4 with the upper side removed, and a heat transfer plate 2, expanded metal 3, and a stainless steel gas-liquid separation header 5 connected to the top of the frame 4. It is made.
  • the gas-liquid separation header 5 is connected to a metal condensate pipe LP and a metal steam pipe VP.
  • the working fluid liquefied by a condenser (not shown) is condensed into the condensate pipe LP.
  • the working fluid receives heat from a heat source (not shown) via the heat transfer surface 2a of the heat transfer plate 2, and evaporates to the boiling point. I will do it.
  • the heat source side plane of the heat transfer plate 2 is processed with Teflon (registered trademark), and even if the heat source has a scale problem such as hot spring water, it is configured to be maintenance-free.
  • the expanded metal 3 and the heat transfer surface are formed on the upper layer portion of the heat transfer plate 2 in contact with the heat source (not shown).
  • the heat source not shown.
  • Contact with 2a Weak nucleate boiling occurred at BP as the foaming point, and the separated vapor bubbles rose as if they were sewed between the expanded metals 3.
  • the heat transfer plate 2 has a simple configuration in which the expanded metal 3 that forms boiling nuclei is sandwiched between the heat transfer plates 2 that are arranged substantially opposite to each other. It was possible to generate nucleate boiling with extremely high heat transfer rate from the working fluid to the working fluid very reliably and efficiently. In addition, the cost increases such as lining the sintered metal on the heat transfer surface 2a, forming protrusions, forming minute recesses, and making the bottom shape of the reinforcing rib V-shaped. It was possible to provide a low-cost, extremely high-performance evaporator that did not require time-consuming manufacturing processes.
  • the expanded metal 3 is configured to be exposed above the gas-liquid separation interface Ld of the working fluid, the steam ejected from the heat transfer plate 2 violently boils the gas-liquid separation interface Ld. Even if it is erected, the working fluid can be maintained in a state where the upper end of the expanded metal 3 is completely encased in steam and does not dry out. did it.
  • the expanded metal 3 is widely used, and it is possible to obtain various types at low cost. Therefore, it is possible to form the nucleation member at a low cost and with an optimum force according to the situation, and to provide a high-performance evaporator at a low cost.
  • the gas-liquid separation header 5 is connected to the upper part of the heat transfer plate 2, the working fluid can always be stably supplied between the expanded metal 3 and the heat transfer plate 2. Therefore, it is possible to reliably prevent the occurrence of dryout and increase the heat transfer efficiency.
  • the expanded metal 3 cannot be sandwiched between the heat transfer plates 2 if the internal pressure becomes larger than the external pressure. Therefore, it is necessary to select a working fluid having an appropriate saturated vapor pressure in which the internal pressure is smaller than the external pressure in accordance with the heat source temperature.
  • FIG. 4 to 6 show an evaporator 1A according to the second embodiment of the present invention.
  • FIG. 4 is an exploded perspective view
  • FIG. 5 is an assembled perspective view
  • FIG. An enlarged cross-sectional view of line VI is shown.
  • the evaporator 1A force according to the second embodiment shown in FIGS. 4 to 6 is different from the evaporator 1 according to the first embodiment shown in FIGS.
  • the shape of the gas-liquid separation header 5A is the same as that of the gas-liquid separation header 5 of the first embodiment. In addition, it has a rectangular parallelepiped shape rather than a cylindrical shape, and is designed to reduce costs based on ease of manufacture.
  • Gas-liquid separation header 5A is attached to the upper side of heat transfer plate 2A.
  • the supply ports 5b and 2b for supplying the working fluid stored in the gas-liquid separation header 5A between the heat transfer plates 2 and 2A are formed in the gas-liquid separation header 5A and the heat transfer plate 2A.
  • the force S can provide a cheaper and higher performance evaporator.
  • FIG. 7 and 8 show an evaporator according to a third embodiment of the present invention.
  • FIG. 7 is an assembled perspective view
  • FIG. 8 is a sectional view taken along the line vm-vm in FIG. Show.
  • a liquid reservoir header 6 is connected to the lower part of the hot plates 2 and 2, and the liquid reservoir header 6 and the gas-liquid separation header 5 are connected via a pipe 7, and the working fluid accumulated in the liquid reservoir header 6 is gas-liquid.
  • a pump 8 as a conveying means to be sent to the separation header 5 is interposed near the liquid reservoir header 6 of the pipe 7. Since the other points are the same as those of the evaporator 1 according to the first embodiment, a detailed description thereof is omitted here.
  • the evaporator 1B According to the evaporator 1B according to the third embodiment, even when the saturated vapor pressure is in the low pressure region during operation of the working fluid, regardless of the vertical distance between the heat transfer plates 2 and 2, Over the entire surface of the heat transfer plates 2 and 2, nucleate boiling at substantially the same saturation temperature can be caused at the foaming points formed at the contact points between the heat transfer plates 2 and 2 and the expanded metal 3. Therefore, even with a heat exchange system that uses only a small temperature difference, it is possible to provide a high-performance evaporator that makes the most of nucleate boiling.
  • a solar heat collector using sunlight as a heat source may be incorporated as a heat collection medium heater (evaporator).
  • a solar heat collector is installed on the south side wall of the building, and in winter heat collection at low solar altitude, a low boiling point working fluid is used, so there is a concern about freezing even in sub-freezing environments. It can collect heat as a heat source of a heat pump for heating.
  • FIGS. 9 to 11 show a stack type evaporator according to a fourth embodiment of the present invention
  • FIG. 9 is a partially exploded perspective view
  • FIG. 10 is an exploded perspective view showing an evaporation plate unit.
  • FIG. 11 shows a sectional view taken along line X-XI in FIG.
  • evaporator 1C In the evaporator 1C according to the fourth embodiment shown in Figs. 9 to 11, two heat transfer plates 2B, Expanded metal 3 as a nucleation member is sandwiched between 2B to constitute one unit of evaporation plate 20.
  • Through-holes 2c and 2c constituting the gas-liquid separation header 5B are formed at opposite positions on the top of the two heat transfer plates 2B and 2B.
  • These evaporation plates 20 are connected via two upper and lower separators 9 and 10, respectively. They are stacked horizontally.
  • a through hole 9a is formed at a position facing the through hole 2c of the upper separator 9, and a gas-liquid separation header 5B is configured by the upper separator 9 and the through holes 2c and 2c of the two heat transfer plates 2B and 2B.
  • the space formed by the two adjacent heat transfer plates 2B and 2B and the upper and lower separators 9 and 10 serves as a heat source flow passage 15.
  • the evaporation plate 20 includes two heat transfer plates 2B and 2B each having a rectangular shape, an expanded metal 3 cut into a rectangular shape, and a frame 4B having four sides. A large number of these evaporation plates 20 are stacked horizontally between the end plates 11 and 11 via two upper and lower separators 9 and 10, supported by a large number of tie rods 12, and fastened and fixed by bolts 13. ing.
  • a condensate pipe LP and a steam pipe VP are connected to the gas-liquid separation header 5B via an end plate 11, and the working fluid liquefied by a condenser (not shown) is connected to the condensate pipe LP.
  • the working fluid receives heat from the heat source (not shown) via the heat transfer surface 2a of the heat transfer plates 2B and 2B, and evaporates to the boiling point.
  • the evaporator 1C According to the evaporator 1C according to the fourth embodiment, an extremely thin and extremely high performance evaporator can be realized.
  • the heat source flow portion 15 is formed by being surrounded by a flat surface, coating such as Teflon (registered trademark) processing can be easily performed, and it can be applied regardless of the type of heat source.
  • the power S is suitable for the use of exhaust heat from hot springs that are difficult to use.
  • an evaporator as a cooling device for a stack of a solid polymer electrolyte fuel cell and an evaporation as a boiling type cooling body used as a heat sink for a power semiconductor element incorporated in a stack assembly of a semiconductor device.
  • Extremely thin and extremely high performance evaporator Can be realized.
  • coating such as Teflon (registered trademark) processing can be performed easily, and it can be applied regardless of the type of heat source. Power that is suitable for the use of exhaust heat from hot springs that are difficult to use.
  • an evaporator as a cooling device for a solid polymer electrolyte fuel cell stack, and an evaporation as a boiling type cooling device used as a heat sink for a power semiconductor element incorporated in a stack assembly of a semiconductor device. If the evaporator 1C is applied to an evaporator, etc., it is possible to provide an evaporator that has high performance, excellent workability, is inexpensive, thin, and does not require installation space.
  • FIGS. 12 to 14 show a stack type evaporator according to a fifth embodiment of the present invention
  • FIG. 12 is a partially exploded perspective view
  • FIG. 13 is an exploded view showing an evaporation plate unit.
  • a perspective view, FIG. 14 shows a sectional view taken along line XIV-XIV in FIG.
  • the expanded metal 3 as a nucleation member is sandwiched between the two heat transfer plates 2C, 2C, and the evaporation plate One unit of 20A is configured.
  • Through holes 2c, 2c, 2d, and 2d constituting the gas-liquid separation header 5B and the liquid reservoir header 6B are formed at the opposite locations of the upper and lower portions of the two heat transfer plates 2C and 2C. They are stacked in the horizontal direction via two separators 9 and 10A.
  • a through hole 9a is formed at a position facing the through hole 2c of the upper separator 9, and gas-liquid separation is performed by the through hole 9a of the upper separator 9 and the through holes 2c and 2c of the two heat transfer plates 2C and 2C.
  • a through hole 10d is formed at a position facing the through hole 2d of the lower separator 10A, and the through hole 10 (one and two heat transfer plates 2 (:, 2) of the lower separator 10 8 is formed.
  • Through-hole 2 (1, 2 (1) The reservoir 6B is formed, and the space surrounded by the two adjacent heat transfer plates 2C, 2C and the upper and lower separators 9, 10A is the heat source. It is a convection section 15.
  • the evaporation plate 20A includes two rectangular heat transfer plates 2C and 2C, an expanded metal 3 cut into a rectangular shape, and a frame 4B composed of four sides. A large number of these evaporation plates 20A are stacked in a horizontal direction between the end plates 11 and 11 via two separators 9 and 10A, and are supported by a large number of tie rods 12 and bolts. Tightened and fixed by 13
  • a condensate pipe LP and a steam pipe VP are connected to the gas-liquid separation header 5B via an end plate 11, and the working fluid liquefied by a condenser (not shown) is connected to the condensate pipe LP.
  • the working fluid receives heat from a heat source (not shown) via the heat transfer surface 2a of the heat transfer plates 2C and 2C, and evaporates to the boiling point.
  • liquid reservoir header 6B and the gas-liquid separation header 5B are connected via the pipe 7, and a pump as a conveying means for sending the working fluid accumulated in the liquid reservoir header 6B to the gas-liquid separation header 5B.
  • 8 is installed near the reservoir header 6B of the pipe 7. Since the other points are the same as those of the evaporator 1C according to the fourth embodiment, detailed description thereof is omitted here.
  • the saturated vapor pressure is in the low pressure region when the working fluid is operated.
  • the nucleate boiling at substantially the same saturation temperature occurs over the entire surface of the heat transfer plates 2C and 2C, and the heat transfer plates 2C and 2C and the expanded metal 3 It can be caused to occur at the foaming point formed at the contact. Therefore, it is possible to provide a high-performance evaporator that makes the best use of nucleate boiling even with a heat exchange system that uses only a small temperature difference.
  • the heat transfer plate 2 and the like are arranged substantially vertically.
  • the heat transfer plate and the like are inclined with respect to the vertical plane. May be arranged.
  • the evaporator can be stably mounted on the roof according to the inclination angle of the mounting surface such as the roof.
  • the evaporator according to the present invention is, for example, used in a thermoelectric generator, for cooling a stack of solid polymer electrolyte fuel cells, as a component of a heat exchange device, or as a heat sink of a power semiconductor element. As such, it can be used industrially in various situations.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

L'invention concerne un évaporateur qui ne cause pas d'assèchement local et intermittent ni une interruption d'alimentation d'un fluide actif à un plan conducteur de chaleur. En conséquence, même si le flux de chaleur augmente, la taille de l'évaporateur n'a pas besoin d'être augmentée. L'évaporateur utilise de l'eau comme fluide actif. Même si la température de la source de chaleur est inférieure à 100 degrés Celsius, l'évaporateur peut utiliser efficacement une légère différence de température de la source de chaleur. Deux plaques conductrices de chaleur (2) sont disposées à l'opposé l'une de l'autre pour prendre en sandwich un métal qui se dilate (3) utilisé comme élément formant un noyau d'ébullition entre les plaques conductrices de chaleur (2).
PCT/JP2007/065399 2006-08-10 2007-08-07 Évaporateur WO2008018429A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007551500A JP4917048B2 (ja) 2006-08-10 2007-08-07 蒸発器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-217882 2006-08-10
JP2006217882 2006-08-10

Publications (1)

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WO2008018429A1 true WO2008018429A1 (fr) 2008-02-14

Family

ID=39032959

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PCT/JP2007/065399 WO2008018429A1 (fr) 2006-08-10 2007-08-07 Évaporateur

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Country Link
JP (1) JP4917048B2 (fr)
WO (1) WO2008018429A1 (fr)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2015056290A1 (fr) * 2013-10-15 2015-04-23 隆啓 阿賀田 Procédé d'amélioration de caractéristiques d'écoulement de fluide, et échangeur de chaleur dans lequel le procédé d'amélioration est réalisé, dispositif de distillation, dispositif de désodorisation et feuille extrudée par filière droite plate et étirée utilisée dans le procédé d'amélioration

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JPS57148432U (fr) * 1981-03-12 1982-09-17
JPS62175595A (ja) * 1986-01-27 1987-08-01 Matsushita Refrig Co 伝熱管

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JPH01179892A (ja) * 1987-12-29 1989-07-17 Showa Alum Corp ヒートパイプ
JP2682584B2 (ja) * 1991-08-22 1997-11-26 三菱電機株式会社 熱交換装置
JPH07127987A (ja) * 1993-11-05 1995-05-19 Zexel Corp 積層型熱交換器
JP2000077586A (ja) * 1998-08-28 2000-03-14 Fuji Electric Co Ltd 沸騰式冷却体
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JP4573525B2 (ja) * 2003-12-24 2010-11-04 本田技研工業株式会社 固体高分子電解質型燃料電池

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JPS57148432U (fr) * 1981-03-12 1982-09-17
JPS62175595A (ja) * 1986-01-27 1987-08-01 Matsushita Refrig Co 伝熱管

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015056290A1 (fr) * 2013-10-15 2015-04-23 隆啓 阿賀田 Procédé d'amélioration de caractéristiques d'écoulement de fluide, et échangeur de chaleur dans lequel le procédé d'amélioration est réalisé, dispositif de distillation, dispositif de désodorisation et feuille extrudée par filière droite plate et étirée utilisée dans le procédé d'amélioration
EP3059543A4 (fr) * 2013-10-15 2017-07-12 Takahiro Agata Procédé d'amélioration de caractéristiques d'écoulement de fluide, et échangeur de chaleur dans lequel le procédé d'amélioration est réalisé, dispositif de distillation, dispositif de désodorisation et feuille extrudée par filière droite plate et étirée utilisée dans le procédé d'amélioration
US9939212B2 (en) 2013-10-15 2018-04-10 Takahiro Agata Method for improving fluid flow characteristics, heat exchanger, distillation apparatus and deodorizing apparatus with the same applied thereto, and expanded metal used for the same

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JPWO2008018429A1 (ja) 2009-12-24
JP4917048B2 (ja) 2012-04-18

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