WO2007136066A1 - systÈme de dÉtection de dÉformation de plaque basale et procÉdÉ de dÉtection de dÉformation - Google Patents

systÈme de dÉtection de dÉformation de plaque basale et procÉdÉ de dÉtection de dÉformation Download PDF

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Publication number
WO2007136066A1
WO2007136066A1 PCT/JP2007/060453 JP2007060453W WO2007136066A1 WO 2007136066 A1 WO2007136066 A1 WO 2007136066A1 JP 2007060453 W JP2007060453 W JP 2007060453W WO 2007136066 A1 WO2007136066 A1 WO 2007136066A1
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WO
WIPO (PCT)
Prior art keywords
wafer
substrate
deformation
optical path
supported
Prior art date
Application number
PCT/JP2007/060453
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English (en)
Japanese (ja)
Inventor
Kohei Mori
Jyunji Kume
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2007136066A1 publication Critical patent/WO2007136066A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion

Definitions

  • the present invention relates to a deformation detection system and a deformation detection method for detecting deformation in the vicinity of a central portion due to warpage or the like in a substrate such as a semiconductor wafer.
  • the present invention also relates to a substrate processing system provided with the deformation detection system and a computer-readable storage medium storing a control program for executing the deformation detection method.
  • a single-wafer type substrate processing apparatus for cleaning semiconductor wafers (hereinafter referred to as “wafers”) as a substrate one by one is used.
  • a powerful substrate processing apparatus is equipped with a spin chuck that holds and rotates a single wafer substantially horizontally, and supplies the processing liquid to the upper surface of the wafer while rotating the wafer by this spin chuck.
  • cleaning is performed by supplying the processing liquid to the entire upper surface of the wafer.
  • a processing system in which various apparatuses such as such a substrate processing apparatus and a substrate transfer apparatus for transferring a wafer are incorporated is known.
  • the wafers are stored in an aligned state in the carrier, and are loaded into the processing system together with the carrier. Then, the substrate is taken out from the carrier by the substrate carrying device and is carried into the substrate processing device.
  • a configuration is known in which an inspection (mapping) is performed in which a wafer is stored in a carrier before the wafer is taken out of the carrier, and the alignment state of the wafer is confirmed using an optical sensor. (Refer to Unexamined-Japanese-Patent No. 2003-168715).
  • the wafer in a normal state (non-deformed state), the wafer has a thin flat plate shape having a flat upper surface and a lower surface that are parallel to each other in a horizontal posture.
  • the effects of thermal stress etc. As a result, the wafer may be distorted.
  • the wafer may be slightly warped in a convex shape with the center of the wafer at the bottom.
  • a mechanical chuck that mechanically holds a wafer that is, a spin chuck configured to hold a plurality of abutting members in contact with the peripheral edge of the wafer is known. Even when such a chuck is used, if the wafer is deformed as described above, the wafer may be broken by the pressing force applied from the contact member. Further, when the wafer is rotated by the spin chuck, the space below the wafer becomes negative pressure, and a downward force acts on the wafer. At this time, if the wafer is deformed as described above, the wafer may be damaged by the downward force.
  • mapping inspection it is possible to detect the thickness of the wafer and the like, and the deformation of the wafer may be detected by this inspection.
  • the light emitted from the optical sensor is irradiated only to a part of the peripheral part of the wafer (the part close to the opening of the carrier), if the peripheral part is defective such as large deformation or defect Although it could be detected, it was impossible to detect deformation near the center of the wafer. For this reason, it was impossible to detect deformations such as warping as described above.
  • the present invention has been made in view of the above points, and it is an object of the present invention to provide a technique for detecting deformation in the vicinity of a central portion due to warpage or the like in a substrate such as a semiconductor wafer.
  • a system for inspecting a substrate having a flat upper surface and a lower surface that are parallel to each other in an undeformed state and detecting the deformation is provided.
  • a support member that supports a standard posture When the non-deformable substrate is supported by the support member, a first optical path that passes immediately above the upper surface of the non-deformable substrate is formed, and the first optical path by the substrate to be inspected supported by the support member is formed.
  • deformation determination means for determining the presence or absence of deformation exceeding a reference deformation degree of the substrate to be inspected
  • a deformation detection system for a substrate is provided.
  • the first optical sensor includes a first projector, and a first receiver that receives the light projected by the first projector force, and the second optical sensor.
  • a transfer unit provided between the carrier port and the processing apparatus; a transfer apparatus for transferring a substrate between the carrier port and the processing apparatus via the transfer unit;
  • a substrate processing system characterized in that the transfer unit is provided with the substrate deformation detection system.
  • This substrate processing system determines whether or not the processing apparatus is capable of processing the inspected substrate based on the determination result of the deformation determination means for the inspected substrate in the detection system! It is preferable to further include a processing discriminating means for performing the above.
  • the substrate processing apparatus can prevent the substrate from being damaged by not processing the deformed substrate.
  • a method for inspecting a substrate having a flat upper surface and a lower surface that are parallel to each other in an undeformed state, and detecting the deformation When the non-deformable substrate is supported at a reference position in a substantially horizontal reference posture, first and second optical paths are formed that pass directly above the upper surface and immediately below the lower surface of the non-deformable substrate, respectively. Support the posture,
  • a method for detecting deformation of a substrate is provided.
  • At least one of the first optical path and the second optical path is preferably parallel to the upper surface and the lower surface of the non-deformable substrate supported by the support member.
  • At least one of the first optical path and the second optical path pass through a central portion of the non-deformable substrate supported by the support member in a plan view.
  • a computer-readable storage medium storing a control program for executing the deformation detection method.
  • FIG. 1 is a schematic plan view of a processing system according to the present embodiment
  • FIG. 2 is a schematic side view of the processing system
  • FIG. 3 is a schematic cross-sectional view illustrating the configuration of a processing unit
  • FIG. 4 is a perspective view of the carrier
  • FIG. 5 is a plan view of the wafer transfer device
  • FIG. 6 is a side view of the wafer transport device and a side view explaining its operation
  • FIG. 8 is a perspective view of the main wafer transfer device
  • FIG. 9 is a plan view illustrating the configuration of the wafer delivery unit
  • FIG. 10 is a side view illustrating the configuration of the deformation detection system
  • FIG. 11 is a side view illustrating the arrangement of the photoreceiver
  • FIG. 12 is a side view illustrating the configuration of the substrate cleaning unit
  • FIG. 13 is a side view for explaining a state in which wafer deformation is detected in the deformation detection system.
  • a preferred embodiment of the present invention is based on a processing system that performs a cleaning process on a wafer (silicon wafer) as a substrate! / Explain.
  • FIG. 1 is a plan view of a processing system 1 according to the present embodiment, and FIG. 2 is a side view thereof.
  • FIG. 3 is a longitudinal sectional view taken along the X-Z plane (substantially vertical plane) of the processing unit 3 to be described later.
  • the processing system 1 includes a loading / unloading unit 2 for loading / unloading carrier C to / from the external force processing system 1 and a processing unit 3 for performing a cleaning process on the wafer W. It has.
  • the carry-in / out unit 2 is provided with a carrier port (in / out port) 10 on which carrier C, which is a storage container capable of storing a plurality of, for example, 25 wafers W, and carrier port 10 and processing.
  • carrier C which is a storage container capable of storing a plurality of, for example, 25 wafers W
  • carrier port 10 and processing are provided between the unit 3 and the unit 3 .
  • the carrier port 10, the substrate transport unit 12, and the processing unit 3 are arranged in this order in the X-axis direction (substantially horizontal direction).
  • the carrier port 10 and the substrate transfer section 12 are partitioned by a boundary wall section 15 erected along the X-Z plane.
  • the wafer W has, for example, a substantially circular shape and a thin flat plate shape having a predetermined thickness, and a semiconductor device is formed on the surface (one surface).
  • the carrier C has an opening 20 on one side surface, and the wafer W is taken out from the carrier C through the opening 20 and stored in the carrier C. ing. Further, a lid body 21 for opening and closing the opening 20 is provided.
  • the inner wall of the carrier C is provided with a plurality of, for example, 25 slots 22 for holding the peripheral edge of the wafer W. For example, one wafer W is accommodated in each slot 22 in a state where the surface is the upper surface. As a result, up to 25 wafers W can be accommodated in the carrier C in a state of being substantially parallel to each other and arranged in parallel with a predetermined interval in parallel.
  • the carrier port 10 has a predetermined number, for example, up to three carriers C arranged in a row in the Y-axis direction (substantially horizontal direction substantially perpendicular to the X-axis direction). Can be placed side by side An appropriate carrier mounting table 25 is provided.
  • the boundary wall 15 is provided with gates 26 at positions corresponding to the places where the carriers C are placed.
  • a shutter 27 that closes the gate 26 also on the side of the substrate transport unit 12 is provided for each gate 26.
  • each shutter 27 has a built-in lid opening / closing mechanism that switches between the locked state and the unlocked state of the lid 21 of the carrier C. By holding and moving together with the shutter 27, the opening 20 can be opened and closed simultaneously with the opening and closing of the gate 26.
  • the operations of the shutter 27 and the lid opening / closing mechanism are controlled by a control signal transmitted from the control computer 200 described later.
  • a wafer transfer device (CRA) 30 as a first substrate transfer device for transferring the wafer W is disposed in the substrate transfer unit 12.
  • an FFU (fan filter unit) 31 for down-flowing a clean air flow such as an inert gas such as air or nitrogen gas is disposed in the substrate transfer unit 12 at the ceiling of the plate processing apparatus 12.
  • an exhaust path for exhausting the inside of the substrate transfer unit 12 is provided at the bottom of the substrate transfer unit 12.
  • the wafer transfer device 30 includes a rod 32 provided with the axial direction directed in the Z-axis direction, a moving means 33 that supports the lower end of the rod 32 and moves the rod 32 along the Y-axis direction, and the rod 32.
  • the base 34 supported by the upper end of the wafer, the transfer arm 35 capable of holding a single wafer W in a substantially horizontal posture, and the auxiliary provided along the edge of the wafer W held by the transfer arm 35 It has an apparatus main body 40 constituted by members 36A and 36B, and further includes a mapping mechanism 41 for detecting whether or not the wafer W in the carrier C is normally stored.
  • the rod 32 is configured to be movable up and down along the Z-axis direction by the rotational drive of the servo mechanism 42 connected to the lower end of the rod 32.
  • the output signal of the servo mechanism 42 (that is, information indicating the amount of movement of the rod 32 in the Z-axis direction) is transmitted to the storage state determination unit 55 of the mapping mechanism 41 described later.
  • the base 34 is attached to the upper end portion of the rod 32 via the motor 43. That is, the base 34 moves along the Y axis along with the movement of the rod 32 driven by the moving means 33 and the servo mechanism 42. It can be moved along the direction and the Z-axis direction, and can be configured to rotate (in the ⁇ direction) in the X 1 Y plane (horizontal plane) by driving the motor 43.
  • the transfer arm 35 is supported on a base 34, and has a substantially flat arm body 35a provided substantially horizontally.
  • a top end member 35 b is provided on the top surface of the front end portion (front edge portion) of the transfer arm 35.
  • the rear surface of the tip member 35b (the surface facing the base end side of the arm main body 35a) has, for example, an arcuate shape along the peripheral edge of the wafer W, and further along this rear surface.
  • a step portion 35c formed lower than the tip member 35b is provided.
  • a base end member 35d is provided on the upper surface side of the base end portion (rear edge portion) of the arm main body 35a, and the front surface of the base end member 35d (a surface facing the front end side of the arm main body 35a).
  • a step portion 35e formed lower than the base end member 35d is provided along the side.
  • the transfer arm 35 can move in the Y-axis direction and the Z-axis direction and can rotate in the ⁇ direction in accordance with the movement of the base 34 described above. Further, it is configured to slide (straightly move) in a substantially horizontal direction along the longitudinal direction of the arm body 35a relative to the base 34. That is, the transfer arm 35 is connected to the gate 26, with respect to all the carriers C mounted on the carrier mounting table 25 described above, and with respect to the slot 22 of an arbitrary height provided in each carrier C. It can be accessed through the opening 20, and can also be accessed through the loading / unloading port 131 in the chamber 121 of the wafer delivery units 111, 112 provided in the processing unit 3 described later. Thereby, the wafer transfer device 30 can transfer the wafer W from the abort 10 to the processing unit 3 and from the processing unit 3 to the carrier port 10.
  • the auxiliary members 36A and 36B are fixed to the base 34, and in a state where the transfer arm 35 is located directly above the base 34 (retracted position), the auxiliary members 36A and 36B are provided on both sides of the base end member 35d. Each is provided to be placed.
  • the mapping mechanism 41 includes a first sensor arm including a light projecting unit 51 that projects laser light. 52, a second sensor arm 54 having a light receiving part 53 for receiving the laser light projected from the light projecting part 51, and the amount of movement of the light receiving part 53 in the Z-axis direction and the detection signal of the light receiving part 53 Based on this, a storage state determination unit 55 is provided for determining whether or not the wafer W in the carrier C is stored normally.
  • the sensor arms 52 and 54 are respectively arranged on both sides of the base 34, and can move in the Y-axis direction and the Z-axis direction as the base 34 moves as described above, and can rotate in the ⁇ direction. It has become.
  • the sensor arms 52 and 54 are configured to slide in a substantially horizontal direction relative to the base 34 along the longitudinal direction of the sensor arms 52 and 54.
  • the light projecting unit 51 is provided at the tip of the sensor arm 52, and includes a light emitting element (for example, an LED such as a laser diode).
  • the light receiving unit 53 is provided at the tip of the sensor arm 54 and includes a light receiving element (for example, a phototransistor, a photodiode, or the like). The detection signal of the light receiving element is transmitted to the storage state determination unit 55.
  • the laser light projected from the light projecting unit 51 is in the Y-axis direction as shown in FIG.
  • the light travels straight along the straight optical path LO, and is received by the light receiving unit 53.
  • a current corresponding to the intensity of the received light is generated, and a detection signal with a predetermined threshold is detected. It is like that.
  • the laser light emitted from the light projecting unit 51 is reflected by the object, the optical path LO is blocked, and the light is received.
  • the light projecting unit 51 and the light receiving unit 53 constitute a mapping optical sensor 60 that detects the presence or absence of an object such as a wafer W using laser light.
  • the storage state determination unit 55 can detect the movement amount of the rod 32 in the Z-axis direction, that is, the movement amount of the light receiving unit 53 in the Z-axis direction, based on the output signal of the servo mechanism 42 described above. In addition, it is possible to detect whether or not an object such as the wafer W exists between the light projecting unit 51 and the light receiving unit 53 based on the detection signal to which the light receiving element force is transmitted. Furthermore, based on the amount of movement of the light receiving portion 53 and the detection signal of the light receiving element, it has a function of detecting mapping data to be described later and determining whether or not the wafer W in the carrier C is normally stored. ing.
  • the storage state determination unit 55 is provided in, for example, a control computer 200 provided in a control / utility unit group 75 to be described later.
  • the control computer 200 is based on the determination result of the storage state determination unit 55. Therefore, it is possible to determine whether or not to take out the wafer W from the carrier C.
  • the operation of the wafer conveyance device 30 having the above-described configuration is controlled based on a control signal transmitted from a control computer 200 described later. That is, the moving means 33, the servo mechanism 42, the motor 43, the transfer arm 35, etc. are driven by the control command of the control computer 200, respectively, so that the operation of the apparatus main body 40, that is, the transfer of the wafer W is related. The action is performed.
  • the operation of the mapping mechanism 41 is realized by controlling the sensor arms 52 and 54, the light projecting unit 51, the light receiving unit 53, and the like according to the control commands of the control computer 200, respectively.
  • a main wafer transfer device (PRA) 71 as a second substrate transfer device is disposed at a substantially central portion of the processing unit 3 in a plan view.
  • a delivery unit group 72, a cleaning unit group 73, a heating / cooling unit group 74, and a control / utility unit group 75 are provided so as to surround the main wafer transfer device 71.
  • an FFU 76 for downflowing a clean airflow in the processing unit 3 is disposed on the ceiling of the processing unit 3 (see FIG. 2).
  • the main wafer transfer device 71 includes a substantially cylindrical case 80 provided with the axial direction oriented in the Z-axis direction, and a base 81 that can be moved up and down in the Z-axis direction along the case 80.
  • An opening 80a is formed in the side wall of the case 80.
  • the case 80 can be rotated in the ⁇ direction around the central axis of the case 80 directed in the Z-axis direction by driving a motor 85 installed below the case 80.
  • a base lifting mechanism 86 for lifting the base 81 is provided on the side of the case 80.
  • the base lifting mechanism 86 includes a guide groove 91 provided on the inner surface of the case 80, a motor 92 provided on the bottom of the case 80, and a drive pulley 93 provided on the bottom side of the case 80 in the side wall of the case 80.
  • the driven pulley 94 provided on the ceiling side of the case 80 in the side wall of the case 80, and the drive provided so as to be wound around the upper and lower sides by being wound around the driven pulley 93 and the driven pulley 94. It is equipped with a belt 95.
  • the base 81 is provided in the case 80 with the front end (front end) facing the opening 80a, and is connected to the drive belt 95. That is, when the driving pulley 93 is rotated by driving the motor 92, the driving belt 95 rotates in the vertical direction between the driving pulley 93 and the driven pulley 94, and with this peripheral movement of the driving belt 95, The base 81 is configured to move up and down in the Z-axis direction along the opening 80a.
  • the transfer arm 82A is provided above the base 81, and the two arm bodies 101, 102 and the base end side of each arm body 101, 102 are connected to each other. It has the support body 103 to support.
  • the arm bodies 101 and 102 are curved in a substantially arc shape so as to follow the peripheral edge of the wafer W in a plan view, for example, and are symmetric with each other. When viewed from the side, the arm bodies 101 and 102 are formed in a flat plate shape and are arranged substantially horizontally at the same height. Further, on the upper surface of the transfer arm 82A, a plurality of protrusions 105 for contacting the lower surface of the wafer W are provided.
  • the powerful transfer arm 82A is movable in the Z-axis direction and rotatable in the ⁇ direction in accordance with the movement of the base 81 described above. Further, it is configured to be able to slide in a substantially horizontal direction relative to the base 81, that is, to be able to move forward and backward through the opening 80a. Accordingly, the transfer arm 82A can access the transfer unit group 72, the cleaning unit group 73, the heating / cooling unit group 74, etc. provided around the main wafer transfer device 71. . As a result, the main wafer transfer device 71 can carry the wafer W into and out of each device and transfer the wafer W between the devices.
  • the transfer arm 82B is provided above the transfer arm 82A.
  • the transfer arm 82B has substantially the same configuration as the transfer arm 82A, and a detailed description thereof will be omitted because it is redundant. It should be noted that the transfer arms 82A and 82B can be configured to slide individually with respect to the base 81.
  • the operation of the main wafer transfer device 71 is controlled by a control signal transmitted from a control computer 200 described later. That is, the motor 85, the motor 92, the transfer arms 82A, 82B, and the like are driven based on control signals of the control computer 200 described later, whereby the operation of the main wafer transfer device 71 is performed.
  • the transfer unit group 72 includes two wafer transfer units (TRS) 111 and 112. Wafer delivery units 111 and 112 are provided in a vertically stacked state between carry-in / out unit 2 and main wafer transfer device 71. That is, it is provided between the carrier C placed on the carrier port 10 and the cleaning unit group 73 in the transfer path of the wafer W.
  • TRS wafer transfer units
  • the lower wafer transfer unit 111 includes a container 121 for storing the wafer W and a deformation detection system 123 for detecting the deformation of the wafer W.
  • a deformation detection system 123 for detecting the deformation of the wafer W.
  • the container 121 a plurality of, for example, three support members 122A, 122B, and 122C for supporting the wafer W at a reference position in a substantially horizontal reference posture are provided.
  • a loading / unloading port 131 for loading the wafer W into the container 121 a shutter 132 for opening and closing the loading / unloading port 131, a loading / unloading port 133 for unloading the wafer W also in the container 121, A shutter 134 for opening and closing the loading / unloading port 133 is provided.
  • the loading / unloading port 131 and the shutter 132 are provided on the side wall on the loading / unloading portion 2 side, and the loading / unloading port 133 and the shutter 134 are provided on the side wall on the main wafer transfer device 71 side.
  • the support rods 122A, 122B, 122Ci are provided so as to protrude upward from the bottom rod 121a force in the container 121.
  • the lower surface of the wafer W By placing the lower surface of the wafer W on the upper end of each of these supporting members 122A, 122B, 122C, that is, the lower surface central portion W of the wafer W is surrounded.
  • the wafer W By bringing the upper ends of the support members 122A, 122B, and 122C into contact with the three positions, the wafer W can be supported in a stable state in a substantially horizontal reference posture at a reference position higher than the bottom 121a. It becomes.
  • a non-deformed wafer supported normally by the supporting members 122A, 122B, and 122C that is, supported in the reference position at the reference position) (no deformation, in a horizontal position, parallel to each other and flat)
  • a flat plate wafer having an upper surface and a lower surface "
  • the deformation detection system 123 includes, for example, a light projecting unit 141 that projects laser light as light for detecting the deformation of the wafer W, and a light receiving unit 142 that receives light projected from the light projecting unit 141. It has.
  • the detection system 123 includes a deformation determination unit 143 that determines the presence or absence of deformation exceeding the reference deformation amount of the wafer W as the substrate to be inspected based on the detection signal (detection information) of the light receiving unit 142. .
  • the light projecting unit 141 includes a first light projector 151 and a second light projector 152 disposed below the first light projector 151.
  • Each of the projectors 151 and 152 has a built-in light emitting element (for example, an LED such as a laser diode), and the laser light emitted by the light emitting element is emitted to the outside of the projectors 151 and 152, respectively. It has become.
  • Each of the projectors 151 and 152 is provided so as to be positioned on the outer side in the horizontal direction from the peripheral edge of the wafer W in the reference state.
  • the laser light projected by the projector 151 passes through a substantially horizontal first linear optical path L1 passing directly above the upper surface of the wafer W in the reference state (goes along the optical path L1).
  • the optical path L1 is substantially parallel to the upper surface of the wafer W in the reference state, that is, does not intersect the upper surface of the wafer W in the reference state. Further, the optical path L1 passes directly above the center W of the wafer W in the reference state, that is, in the plan view,
  • the wafer W which is a substantially circular substrate
  • Center means the center of the circle
  • the projector 152 is provided at a position lower than the projector 151, and projects laser light between the wafer W in the reference state and the bottom 121 a of the container 121.
  • the laser light projected by the projector 152 passes through a substantially horizontal second linear optical path L2 that passes immediately below the lower surface of the wafer W in the reference state (proceeds along the optical path L2).
  • the optical path L2 is substantially parallel to the lower surface of the wafer W in the reference state, that is, does not intersect the lower surface of the wafer W in the reference state.
  • the optical path L2 is provided so as not to be blocked by the support members 122A, 122B, and 122C. In the illustrated example, it passes between the support member 122A and the support member 122B, and is directly below the central portion W of the wafer W in the reference state, that is, in plan view.
  • the optical paths Ll and L2 are arranged to intersect each other at a predetermined angle in plan view. That is, they are in a relationship of being twisted with each other. Further, the distance (height difference) between the optical path L1 and the optical path L2 is formed to be larger than a predetermined thickness t that the wafer W in the reference state has, for example, as shown in FIG.
  • the thickness may be about twice the thickness t (2t).
  • the light receiving unit 142 includes two light receivers, that is, a first light receiver 155 and a second light receiver 156.
  • Each of the light receivers 155 and 156 includes a light receiving element (for example, a phototransistor or a photodiode) that receives laser light incident from the outside.
  • Each of the light receivers 155 and 156 is provided so as to be positioned outside the space where the peripheral edge of the wafer W in the reference state is to be located.
  • the light receiver 155 is arranged at a position for receiving the laser light projected from the light projector 151 and passed through the optical path L1. In this case, the light receiver 155 is disposed at a position facing the projector 151 in the diameter direction of the wafer W in the reference state.
  • the light receiver 156 is arranged at a position to receive the laser light emitted from the light projector 152 and passed through the optical path L2. In this case, the light receiver 156 is disposed at a position facing the projector 152 in the diameter direction of the wafer W in the reference state.
  • the detection signals of the light receiving elements provided in the respective light receivers 155 and 156 are transmitted to the deformation determining means 143.
  • the light projector 151 and the light receiver 155 constitute a first optical sensor 161 that uses laser light to detect whether the first optical path L1 is blocked or not. Further, the light projector 152 and the light receiver 156 constitute a second optical sensor 162 that detects the presence / absence of blocking of the second optical path L2 using laser light.
  • the laser light projected from the projector 151 (152) is transmitted through the optical path LI (L2 ) And go straight to receiver 155 (156).
  • a detection signal having an intensity equal to or greater than a predetermined threshold value is output from the light receiving element.
  • the optical path of the laser beam projected from the projector 151 (152) L1 (light path L2) is not part of the object And completely blocked.
  • the receiver 155 receives weaker laser light than when there is no object, or is not received at all, and a detection signal with an intensity less than a predetermined threshold value is output at the light receiving element. (This state is called “blocking of the optical path”).
  • the deformation determination means 143 is based on the detection signals of the light receiving elements of the light receivers 155 and 156, and the inspection wafer W supported by the supporting members 122A, 122B, and 122C at the reference position at the reference position is It can be determined whether or not the force is deforming beyond the reference deformation degree. Specifically, when neither of the optical paths L1 and L2 is blocked (when a detection signal with an intensity higher than a predetermined threshold value is output in either of the light receivers 155 and 156), It is determined that there is no deformation exceeding W in the W (normal).
  • the “reference deformation degree” as a determination criterion in the deformation determination means 143 can be arbitrarily set by adjusting the distance between the upper surface Z lower surface of the wafer W in the reference state and the optical path L1Z optical path L2. .
  • the deformation determination unit 143 can be configured as a part of the control computer 200 (described later).
  • the processing system 1 includes a processing determination unit 165 that can be configured as a part of the computer 200.
  • the processing determination unit 165 determines whether or not the processing unit 3 has the ability to process the inspected wafer W based on the determination result of the deformation determination unit 143 for the inspected wafer in the deformation detection system 123. To do.
  • the processing discriminating means 165 discriminates that the inspected weno and W are to be processed when it is determined to be normal, and determines that the inferior wafer and W are to be processed. It is determined that W is not processed.
  • the operation of the deformation detection system 123 having the above-described configuration that is, the opening / closing operation of the shutters 132 and 134, the timing of projecting the laser light from each of the projectors 151 and 152, and the like are transmitted from the control computer 200. Controlled based on the control signal.
  • the upper-stage wafer transfer unit 112 is a force-deformation detector provided with a container 121 and support members 122A, 122B, and 122C in substantially the same manner as the lower-level wafer transfer unit 111 described above. This is different from the wafer transfer unit 111 in that an output system 123 is provided.
  • substrate cleaning units 180A and 180B as substrate processing apparatuses are arranged side by side in the X-axis direction on the lower stage, and two in the upper stage.
  • Substrate cleaning unit 180C, 180D force as a substrate processing apparatus of this type is arranged side by side in the X-axis direction.
  • a spin chuck 182 that holds and rotates the wafer W substantially horizontally, and an upper surface of the wafer W held by the spin chuck 182
  • a supply nozzle 183 for supplying a processing liquid (cleaning liquid) such as a chemical liquid or a rinsing liquid is provided inside the container 181 of the substrate cleaning unit 180A.
  • the spin chuck 182 is, for example, a mechanical chuck, and has a plurality of, for example, three abutting members 184 that abut on the peripheral edge of the wafer W. These abutting members 184 are brought into contact with the three peripheral portions of the wafer W from the outside so as to hold the wafer W.
  • a motor 185 that rotates the spin chuck 182 is connected to the lower end of the spin chuck 182.
  • the driving of the motor 185 is controlled by a control signal of the control computer 200 described later.
  • the substrate cleaning units 180B, 180C, and 180D have substantially the same configuration as the substrate cleaning unit 180A, detailed description thereof is omitted.
  • the heating / cooling unit group 74 is disposed on the opposite side of the delivery unit group 72 with the main wafer transfer mechanism 71 interposed therebetween.
  • This heating / cooling unit group 74 is provided in a state where the cooling port unit 191 and the calo heat unit 192A, 192B, 192C and the like are stacked on this river page.
  • cleaning chemicals to be fed to the electrical unit 195, the control unit 196, and the substrate cleaning units 180A to 180D, which are the power sources of the processing system 1, are supplied.
  • a chemical storage unit 197 for storing is disposed.
  • the control unit 196 includes various devices in the processing system 1, such as the wafer transfer device 30, the main wafer transfer device 71, the wafer transfer units 111 and 112, and the substrate cleaning units 180A to 180D.
  • a control computer 200 is provided as a control unit for automatically controlling the operation of the apparatus.
  • the control computer 200 is connected via each functional element force signal line of the processing system 1.
  • the functional elements are all the elements that operate to realize a predetermined process, such as the moving means 33 of the wafer transfer device 30, the servo mechanism 42, the motor 85 of the main wafer transfer device 71, the motor 92, etc.
  • Means the element of The control computer 200 is typically a general-purpose computer that can realize an arbitrary function depending on the software to be executed.
  • the control computer 200 is inserted into the input / output unit 200b, the calculation unit 200a having a CPU (central processing unit), the input / output unit 200b connected to the calculation unit 200a. And a storage medium determination unit 55 (FIG. 5) of the above-described mapping mechanism 41 and a deformation determination unit 143 (FIG. 10) of the deformation detection system 123. And a processing discrimination means 165 (FIG. 10).
  • Control software that executes various operations by being executed by the control computer 200 is recorded in the recording medium 200c.
  • the control software that can be used is, for example, software that causes the deformation detection system 123 of the wafer transfer unit 111 to perform a predetermined deformation detection method that will be described later, or software that causes the substrate cleaning units 180A to 180D to perform a predetermined cleaning process that will be described later. Etc.
  • the control computer 200 controls each functional element of the processing system 1 so that various conditions (for example, the rotational speeds of the motors 85 and 92) are realized.
  • the recording medium 200c is fixedly provided in the control computer 200, or is detachably attached to a reading device (not shown) provided in the control computer 200 and can be read by the reading device. May be.
  • the recording medium 200c is a hard disk drive in which control software is installed.
  • the recording medium 200c is a removable disk such as a CD-ROM or DVD-ROM in which control software is written. Such a removable disk is read by an optical reading device (not shown) provided in the control computer 200.
  • the recording medium 200c may be in any format of RAM (Random Access Memory) or ROM (Read Only Memory). Yes.
  • the recording medium 200c may be a cassette type ROM. In short, any medium known in the technical field of computers can be used as the recording medium 200c.
  • the carrier C force containing a plurality of wafers W that have not yet been processed in the processing system 1 is transported to the carrier mounting table 25 by an external force of the processing system 1 by a carrier transport device (not shown). Placed. After carrier C is placed, shirt 27 and lid 21 are removed, and gate 26 and opening 20 are opened.
  • Wafers W are normally stored in the carrier C, one wafer W is stored in each slot 22 with a predetermined interval. Are in a state of being arranged substantially parallel to each other.
  • the carrier C is normally mounted on the carrier mounting table 25, the wafers W are vertically aligned in a substantially horizontal posture, and are arranged so as to overlap each other in the plan view.
  • a mapping inspection for confirming the alignment state of the wafers W in the carrier C is performed.
  • the sensor arms 52 and 54 of the wafer transfer device 30 are advanced, and the light projecting unit 51 and the light receiving unit 53 are caused to enter the carrier C through the gate 26 and the opening 20, It is disposed at a predetermined position in the carrier C, that is, for example, at a height between the wafer W located at the lowest stage and the bottom surface of the carrier C, and between the light projecting unit 51 and the light receiving unit 53 in plan view.
  • a part of the peripheral edge of the wafer W in the carrier C (a part not held in the slot 22 facing the opening 20) is moved to a position where it is arranged.
  • the light projecting unit 51 and the light receiving unit 53 are arranged at predetermined positions, the light projecting unit 51 and the light receiving unit 53 are integrated with the base 34 while projecting the laser beam from the light projecting unit 51. Raise the wafer W.
  • the light projecting unit 51 and the light receiving unit 53 are formed on both sides of each wafer W, that is, on the inner side of the carrier C while passing through a gap between the inner side of the carrier C and the peripheral portion on the opening 20 side of each wafer W. Along the alignment direction of the wafer W.
  • the light projecting unit 51 and the light receiving unit 53 move the same height as the gap formed between the wafers W.
  • the laser light projected from the light projecting unit 51 travels along the optical path L0 without being interrupted, and receives light.
  • the light is received by the unit 53.
  • a current corresponding to the intensity of the received laser beam is generated, and the storage state determination unit 55 detects a detection signal having a predetermined threshold value.
  • the light projecting unit 51 projects the light.
  • the emitted laser light is reflected by the peripheral edge of the wafer W on the opening 20 side, and the optical path L0 is blocked.
  • a detection signal less than a predetermined threshold value is detected.
  • the light projecting unit 51 and the light receiving unit 53 are raised until they move to predetermined positions in the carrier C, that is, for example, to the height between the wafer W located at the uppermost stage and the ceiling surface of the carrier C.
  • the as a result it is possible to check whether or not each wafer W in the carrier C is held at a predetermined height. That is, based on the amount of movement of the light receiving portion 53 and the position where the optical path LO is blocked, the height at which each wafer W is held, the thickness of each wafer W, and the gap between each wafer W The width and the like can be measured, and mapping data including such information can be detected.
  • reference mapping data that is confirmed to be reliable and should be obtained in a state where the wafer W is normally stored in the carrier C is stored.
  • the reference mapping data By comparing the reference mapping data with the detected mapping data, it is determined whether or not the detected mapping data is normal, that is, whether or not the wafer W in the carrier C is correctly stored. be able to.
  • the wafer W in the carrier C is taken out by the wafer transfer device 30 and transferred to the lower wafer transfer unit 111 as will be described later.
  • V or a misaligned wafer W is held in an inclined state in the carrier C, and no wafer W is held in any of the slots 22, while the carrier C is in an inclined state.
  • an abnormality such as being placed
  • there is a gap between the reference mapping data and the detected mapping data Therefore, there is a possibility that the wafer W is not stored properly. It can detect that there is.
  • even if there is a defect such as a peripheral edge located on the opening 20 side of any wafer W being distorted or cracked, there is a gap between the reference mapping data and the detected mapping data. May occur. That is, for example, the detected thickness of the wafer W may be detected as a value with a large normal thickness beam. Therefore, it is possible to detect that the shape of the wafer W is normal.
  • the wafer W may not be taken out by the wafer transfer device 30.
  • an alarm may be generated in the control computer 200 or the like to notify the administrator. If any of the wafers W is determined to be not normal, the wafer W is not transferred to the wafer delivery unit 111 and is not processed in the processing system 1, and is paid out from the processing system 1. Also good.
  • wafer W is unloaded from carrier C by wafer transfer device 30.
  • the transfer arm 35 of the wafer transfer device 30 is caused to enter the carrier C through the gate 41 and the opening 20 and enter below the wafer W.
  • the transfer arm 35 is slightly raised, and one wafer W positioned above the transfer arm 35 is placed on the upper surface of the transfer arm 35.
  • the transfer arm 35 is retracted, the wafer W force held by the transfer arm 35 is extracted from the slots 22 on both sides.
  • the base 34 is moved to the front side of the lower wafer transfer unit 111, the transfer port 131 of the wafer transfer unit 111 is opened, and the transfer arm 35 is moved. It is made to enter the container 121 through the loading / unloading port 131.
  • the wafer W on the transfer arm 35 is placed on and supported by the upper ends of the support members 122A, 122B, and 122C.
  • the transfer arm 35 is retracted below the wafer W and retracted from the container 121. Thereafter, the loading / unloading port 131 is closed by the shutter 132. In this way C) W is loaded into the wafer transfer unit 111.
  • a deformation inspection is performed by the deformation detection system 123 to detect whether or not the wafer W is deformed.
  • laser beams are projected from the projectors 151 and 152, respectively.
  • the laser light projected from the projector 151 is above the wafer W.
  • the light travels along the optical path L1 and is received by the light receiver 155.
  • the laser light projected from the light projector 152 travels along the optical path L2 below the wafer W and is received by the light receiver 156.
  • each of the light receivers 155 and 156 receives laser light having a predetermined intensity, and detects a detection signal having a predetermined threshold value. Therefore, the deformation determination unit 143 determines that the wafer W is normal. In this case, the processing discriminating means 165 discriminates that the wafer W is to be processed, and, as will be described later, the main wafer transfer device 71 carries out the wafer W from the wafer delivery unit 111, and the substrate cleaning unit 180A. It is carried into any of ⁇ 180D.
  • the wafer W may be warped due to the influence of thermal stress or the like. That is, the wafer W force in the horizontal posture From the center W side to the peripheral part
  • Yeha W is greatly deformed near the center W, but the deformation near the periphery is small.
  • the wafer W is a normal wafer W that is difficult to detect, and may be loaded into the wafer delivery unit 111.
  • the peripheral force of the wafer W increases to a position higher than the upper surface of the wafer W in the reference state.
  • the optical path L1 may be blocked by the vicinity of the periphery of Ueno and W.
  • the laser beam power projected from the projector 151 is reflected by the vicinity of the peripheral edge of the wafer W, and the receiver 155 detects a detection signal having an intensity lower than a predetermined threshold value. Is output.
  • the lower surface of the wafer W near the center W is positioned lower than the lower surface of the reference wafer W.
  • the optical path L2 may be blocked by the lower surface of the wafer W.
  • the laser light power projected from the projector 152 is reflected by the lower surface of the wafer W, and the light receiver 156 outputs a detection signal having an intensity lower than a predetermined threshold value.
  • the processing discriminating means 165 discriminates that the processing of the wafer W is not performed, and the wafer W is not transferred to the substrate cleaning units 180A to 180D, but is transferred by the wafer transfer device 30 via the loading / unloading port 131. The Then, the substrate cleaning units 180A to 180D are not processed! /, For example, returned to the carrier C or the like, or are discharged to the outside of the processing system 1.
  • the control computer 200 may generate an alarm to notify the administrator.
  • deformation inspection of the wafer and W is performed by the deformation detection system 123, and only the wafer W determined to be normal in the deformation determination means 143 is loaded by the transfer arm 82A of the main wafer transfer device 71. It is unloaded from the container 121 through the outlet 133 and is loaded into the substrate cleaning units 180A to 180D. In each of the substrate cleaning units 180A to 180D, the wafer W is transferred from the transfer arm 82A to the spin chuck 182 and held in a state where the contact members 184 are in contact with the peripheral edge of the wafer W.
  • treatment liquids such as a chemical liquid and a rinse liquid are sequentially supplied to the upper surface of the wafer W, and a predetermined cleaning process is performed.
  • contaminants such as particles attached to the wafer W or a natural oxide film are removed.
  • the deformation detection system 123 in the wafer delivery unit 111 it is confirmed in advance by the deformation detection system 123 in the wafer delivery unit 111 that the wafer W has not been deformed beyond the reference deformation degree. That is, even if there are deformations that are not detected by the deformation detection system 123, they are sufficiently small. Yes, it can be said that this is a safe range where there is no risk of damage even if the substrate cleaning units 180A to 180D are processed. Therefore, even if the contact member 184 is brought into contact with the peripheral edge of the wafer W, it is possible to prevent excessive stress from being generated on the wafer W and damage to the wafer W.
  • the space below the wafer W becomes negative pressure, and a downward force is generated to move the wafer W downward. It is possible to prevent the wafer W from being excessively stressed and the wafer W from being damaged.
  • wafer W held by spin chuck 182 is received by transfer arm 82B of main wafer transfer apparatus 71, and substrate cleaning units 180A to 180D are also carried out.
  • the wafer is transferred to the wafer transfer unit 112.
  • the wafer W carried into the wafer delivery unit 112 is held by the wafer transfer device 30, carried out from the wafer delivery unit 112, and returned to the carrier C again.
  • the shape of the wafer W is determined by the mapping mechanism 41 and the deformation detection system 123 of the wafer delivery unit 111. By inspecting whether the wafer is normal, the deformation of the wafer W can be found, and the deformed wafer W can be prevented from being processed in the substrate cleaning units 180A to 180D. Accordingly, it is possible to prevent the deformed wafer W from being damaged due to the holding force of the spin chuck 182 and the downward force due to the rotation of the spin chuck 182 in the containers 181 of the substrate cleaning units 180A to 180D.
  • the deformation detection system 123 by providing the optical paths Ll and L2 above and below the wafer W, the wafer W is deformed upward in the support members 122A, 122B, and 122C. In both cases, the deformation of the wafer W that can be applied can be reliably detected even when the wafer W is deformed by the downward force. Furthermore, the optical paths Ll and L2 pass through the center W of Ueno, W.
  • the presence or absence of deformation of the wafer W may be inspected only in the force deformation detection system 123 in which the presence or absence of deformation of the wafer W is inspected even in the mapping mechanism 41. Good.
  • the deformation detection system 123 is provided with two or more force light sensors including two light sensors 161 and 162, that is, two light projectors 151 and 152 and two light receivers 155 and 156. May be.
  • the optical sensors 161 and 162 are not limited to the transmission type as described above, but may be reflection type optical sensors.
  • a light projector, a reflector, and a light receiver are arranged around the wafer W supported by the support members 122A, 122B, and 122C, and the light projected from the projector is reflected by the reflector.
  • the reflected light may be received by a light receiver.
  • the two optical paths Ll and L2 are formed, but the number of optical paths may be three or more.
  • two or more optical paths may be provided above or below the reference wafer W.
  • the arrangement of the optical path can be arbitrarily set.
  • the deformation detection system 123 is provided in the lower wafer transfer unit 111, but may be provided in another location.
  • the deformation detection system 123 may be provided in the upper wafer transfer unit 112, and the deformation inspection of the wafer W may be performed on the wafer W carried into the upper wafer transfer unit 112. Further, it may be provided at a location different from the wafer delivery units 111 and 112.
  • a dedicated inspection unit for inspecting whether there is an abnormality such as deformation of the wafer W may be installed in the processing system 1, and the deformation detection system 123 may be provided in the powerful inspection unit.
  • the processing in the processing unit 3 is not yet performed.
  • the timing of performing the deformation inspection of the force Ueno and W by the deformation detection system 123 is not limited to the strong one.
  • the deformation detection of the wafer W by the deformation detection system 123 may be performed while the wafer W is being transferred from the main wafer transfer device 71 to the wafer transfer device 30.
  • the deformation detection system 123 provided in the upper wafer transfer unit 112 is used. Therefore, deformation inspection may be performed.
  • the substrate cleaning units 180A to 180D are not limited to those that are configured to supply the processing liquid from the supply nozzle 1183 to clean the wafer W.
  • a scrubber cleaning tool
  • the wafer detection unit 123 is inspected in advance to determine whether or not the wafer W is normal, and only the wafer W determined to be normal is processed in the substrate cleaning units 180A to 180D. Even if the scrubber is brought into contact with the wafer W, excessive stress can be prevented from being generated on the wafer W. Therefore, damage to the wafer W can be prevented.
  • the spin chuck 182 is a mechanical chuck, it may be configured to suck and hold the lower surface of the wafer W. Also in this case, since the wafer W determined to be normal by the inspection of the deformation detection system 123 does not have a deformation on the lower surface of the wafer W or is sufficiently small, the spin chuck can reliably hold the wafer W by suction. .
  • the processing system 1 is not limited to a force-powered configuration having a plurality of substrate cleaning units 180A to 180D. That is, the substrate processing apparatus is the substrate cleaning unit 180A to 180D that supplies the processing liquid to the wafer W to perform the cleaning process, but other processes other than the cleaning, such as an etching process and a resist removal process, are performed. It may be a device for performing.
  • the substrate is not limited to a silicon wafer, and may be another semiconductor wafer.
  • it may be a glass substrate for LCD, a CD substrate, a printed substrate, a ceramic substrate, or the like. .

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention concerne un système de détection de déformation pour inspection et détection de déformations d'une plaque basale avec des surfaces plates avant et arrière qui sont parallèles l'une à l'autre à l'état non déformé. Le système est pourvu d'éléments supports (122A-122C) pour supporter une plaque basale (W) dans une position standard sensiblement horizontale, de même que de premiers capteurs optiques et de seconds capteurs optiques. Les premiers capteurs (161) définissent un premier trajet optique (L1) passant immédiatement au-dessus de la surface avant de la plaque basale lorsque la plaque basale n'est pas déformée et est supportée par les éléments supports. Les seconds capteurs (162) définissent un second trajet optique (L2) passant immédiatement au-dessous de la surface arrière de la plaque basale lorsque la plaque basale n'est pas déformée et est supportée par les éléments supports. Les premiers capteurs et les seconds capteurs détectent des interruptions des premier et second trajets optiques dues à la plaque basale objet supportée par les éléments supports, respectivement. Le système est pourvu d'un moyen de jugement de déformation (143) permettant de juger les déformations de plaque basale pour déterminer si lesdites déformations dépassent ou non le degré standard de déformations selon les informations de détection des capteurs optiques (161, 162).
PCT/JP2007/060453 2006-05-22 2007-05-22 systÈme de dÉtection de dÉformation de plaque basale et procÉdÉ de dÉtection de dÉformation WO2007136066A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-141377 2006-05-22
JP2006141377A JP2009200063A (ja) 2006-05-22 2006-05-22 基板の変形検出機構，処理システム，基板の変形検出方法及び記録媒体

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WO2007136066A1 true WO2007136066A1 (fr) 2007-11-29

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TW (1) TW200807598A (fr)
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CN103278103A (zh) * 2013-05-18 2013-09-04 大连理工大学 一种薄基片变形的测量方法与装置
CN108573902A (zh) * 2017-03-14 2018-09-25 东京毅力科创株式会社 纵式热处理装置和纵式热处理装置的运转方法

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WO2009114230A2 (fr) * 2008-03-07 2009-09-17 Carl Zeiss Smt, Inc. Réduction de l’implantation de particules
JP5917165B2 (ja) * 2012-01-25 2016-05-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置及びこれに用いられる液供給装置
WO2013111569A1 (fr) * 2012-01-25 2013-08-01 大日本スクリーン製造株式会社 Appareil de traitement de substrat, dispositif d'alimentation en liquide mis en œuvre dans celui-ci, et procédé de traitement de substrat
JP5838520B2 (ja) * 2012-02-28 2016-01-06 株式会社ダイフク 物品搬送設備
JP6090035B2 (ja) * 2013-07-25 2017-03-08 東京エレクトロン株式会社 液処理装置
JP6394220B2 (ja) * 2014-09-17 2018-09-26 東京エレクトロン株式会社 アライメント装置及び基板処理装置
JP6408349B2 (ja) * 2014-11-10 2018-10-17 株式会社アルバック 基板搬送方法
JP6440757B2 (ja) * 2017-03-16 2018-12-19 キヤノン株式会社 基板搬送システム、リソグラフィ装置、および物品の製造方法
CN108766915A (zh) * 2018-08-06 2018-11-06 江阴佳泰电子科技有限公司 一种用于晶圆防破片报警***
CN108987296B (zh) * 2018-08-14 2024-04-02 长江存储科技有限责任公司 晶圆弹性应变测量装置、测量方法及晶圆键合方法
JP2023045820A (ja) * 2021-09-22 2023-04-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN116798891A (zh) * 2022-03-15 2023-09-22 长鑫存储技术有限公司 晶圆的弯曲程度确定装置和控温***

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CN108573902A (zh) * 2017-03-14 2018-09-25 东京毅力科创株式会社 纵式热处理装置和纵式热处理装置的运转方法

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