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Application filed by Best Ginning Entpr Co LtdfiledCriticalBest Ginning Entpr Co Ltd
Priority to TW092130404ApriorityCriticalpatent/TW200514870A/en
Publication of TW200514870ApublicationCriticalpatent/TW200514870A/en
This invention discloses a surface roughening agent of copper and copper alloy, which contains a non-ionic type group polymer compound. The roughening agent can create a rough surface on copper and copper alloy to form excellent fit with solder resist so that the surface of copper and copper alloy achieves a state suitable for soldering.
TW092130404A2003-10-312003-10-31Surface roughening agent of copper and copper alloy
TW200514870A
(en)