TW200514870A - Surface roughening agent of copper and copper alloy - Google Patents

Surface roughening agent of copper and copper alloy

Info

Publication number
TW200514870A
TW200514870A TW092130404A TW92130404A TW200514870A TW 200514870 A TW200514870 A TW 200514870A TW 092130404 A TW092130404 A TW 092130404A TW 92130404 A TW92130404 A TW 92130404A TW 200514870 A TW200514870 A TW 200514870A
Authority
TW
Taiwan
Prior art keywords
copper
roughening agent
copper alloy
surface roughening
alloy
Prior art date
Application number
TW092130404A
Other languages
Chinese (zh)
Inventor
Shu-Ding Hu
Original Assignee
Best Ginning Entpr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Best Ginning Entpr Co Ltd filed Critical Best Ginning Entpr Co Ltd
Priority to TW092130404A priority Critical patent/TW200514870A/en
Publication of TW200514870A publication Critical patent/TW200514870A/en

Links

Abstract

This invention discloses a surface roughening agent of copper and copper alloy, which contains a non-ionic type group polymer compound. The roughening agent can create a rough surface on copper and copper alloy to form excellent fit with solder resist so that the surface of copper and copper alloy achieves a state suitable for soldering.
TW092130404A 2003-10-31 2003-10-31 Surface roughening agent of copper and copper alloy TW200514870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW092130404A TW200514870A (en) 2003-10-31 2003-10-31 Surface roughening agent of copper and copper alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW092130404A TW200514870A (en) 2003-10-31 2003-10-31 Surface roughening agent of copper and copper alloy

Publications (1)

Publication Number Publication Date
TW200514870A true TW200514870A (en) 2005-05-01

Family

ID=57798844

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092130404A TW200514870A (en) 2003-10-31 2003-10-31 Surface roughening agent of copper and copper alloy

Country Status (1)

Country Link
TW (1) TW200514870A (en)

Similar Documents

Publication Publication Date Title
MY151333A (en) Silver plating in electronics manufacture.
TW200607598A (en) Composition of a solder, and method of manufacturing a solder connection
MY123567A (en) Improvements in or relating to solders
MX259572B (en) Plane metal component.
MXPA03009147A (en) Alloy based laser welding.
IL174114A0 (en) Functional transition metal silicates (ftms)
MX2007005622A (en) Lead-free solder alloy.
WO2009016840A1 (en) Multi-layered sintered slide member
SG166794A1 (en) Layer arrangement for the formation of a coating on a surface of a substrate,coating method,and substrate with a layer arrangement
MY143219A (en) Copper alloy
HK1088932A1 (en) Copper-based alloy
HK1105668A1 (en) Improvements in or relating to solders
TW200746359A (en) Capacitor attachment method
EP1302569A3 (en) Stripping solution
WO2003064102A8 (en) Solder metal, soldering flux and solder paste
DE60300669D1 (en) Lead-free soldering alloy
WO2002040746A3 (en) Preventing corrosion with beneficial biofilms
WO2005001934A3 (en) High-frequency package
TW200606513A (en) A wiring substrate and method using the same
TW200514870A (en) Surface roughening agent of copper and copper alloy
MXPA03009729A (en) Metal blocks suitable for machining applications.
WO2007045191A3 (en) Lead-free solder alloy
DE60319581D1 (en) HARD SOLDERING PRODUCT AND METHOD FOR THE PRODUCTION THEREOF
TW200616749A (en) Welding wire
WO2002025698A3 (en) Cooling body, especially for cooling electronic components