KR20180084328A - Intermidiate Melting Pointed Lead-free Alloy for Soldering - Google Patents

Intermidiate Melting Pointed Lead-free Alloy for Soldering Download PDF

Info

Publication number
KR20180084328A
KR20180084328A KR1020170007268A KR20170007268A KR20180084328A KR 20180084328 A KR20180084328 A KR 20180084328A KR 1020170007268 A KR1020170007268 A KR 1020170007268A KR 20170007268 A KR20170007268 A KR 20170007268A KR 20180084328 A KR20180084328 A KR 20180084328A
Authority
KR
South Korea
Prior art keywords
soldering
lead
free alloy
alloy
intermidiate
Prior art date
Application number
KR1020170007268A
Other languages
Korean (ko)
Inventor
김택관
김태진
Original Assignee
(주)비엔에프 코퍼레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)비엔에프 코퍼레이션 filed Critical (주)비엔에프 코퍼레이션
Priority to KR1020170007268A priority Critical patent/KR20180084328A/en
Publication of KR20180084328A publication Critical patent/KR20180084328A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Abstract

The present invention relates to an intermediate melting lead-free alloy for soldering, which serves to fix parts on a substrate during electrical and electronic product manufacturing. According to the present invention, an inexpensive lead-free alloy can be provided as the bonding strength between a solder alloy and a base material, which is maintained at the same level and the amount of use of Ag and Cu and is minimized to improve the bonding strength with respect to the base material during soldering in an alloy containing no lead (Pb). The intermediate melting lead-free alloy for soldering according to the present invention contains 0.1 to 0.45 wt% of silver (Ag), 0.001 to 1.0 wt% of copper (Cu), 0.001 to 0.1 wt% of cobalt (Co), 0.001 to 0.5 wt% of phosphorus (P), and tin (Sn) for the rest.
KR1020170007268A 2017-01-16 2017-01-16 Intermidiate Melting Pointed Lead-free Alloy for Soldering KR20180084328A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020170007268A KR20180084328A (en) 2017-01-16 2017-01-16 Intermidiate Melting Pointed Lead-free Alloy for Soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170007268A KR20180084328A (en) 2017-01-16 2017-01-16 Intermidiate Melting Pointed Lead-free Alloy for Soldering

Publications (1)

Publication Number Publication Date
KR20180084328A true KR20180084328A (en) 2018-07-25

Family

ID=63058789

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170007268A KR20180084328A (en) 2017-01-16 2017-01-16 Intermidiate Melting Pointed Lead-free Alloy for Soldering

Country Status (1)

Country Link
KR (1) KR20180084328A (en)

Similar Documents

Publication Publication Date Title
KR101738841B1 (en) HIGH-TEMPERATURE SOLDER JOINT COMPRISING Bi-Sn-BASED HIGH-TEMPERATURE SOLDER ALLOY
MX2021012411A (en) Lead-free, silver-free solder alloys.
MY154361A (en) Solder alloy, solder paste, and electronic circuit board
MY175023A (en) Lead-free solder ball
KR102002675B1 (en) Lead-free solder alloy
US9764430B2 (en) Lead-free solder alloy, solder material and joined structure
WO2005048303A3 (en) Anti-tombstoning lead free alloys for surface mount reflow soldering
CN103801852A (en) High-strength silver-free and lead-free soldering tin
US10137536B2 (en) Sn-Cu-based lead-free solder alloy
MX2019002670A (en) Lead-free solder alloy comprising sn, bi and at least one of mn, sb, cu and its use for soldering an electronic component to a substrate.
KR20170094198A (en) Solder alloy, solder paste, and electronic circuit board
MX2022004241A (en) Solder alloy, soldering paste, solder ball, soldering preform, solder joint, on-vehicle electronic circuit, ecu electronic circuit, on-vehicle electronic circuit device, and ecu electronic circuit device.
MY188659A (en) Solder alloy, solder paste, and electronic circuit board
MY136217A (en) Lead-free solder ball
JP2003234433A (en) Semiconductor device, its mounting method, mounting block and its manufacturing method
CN103008919A (en) Low-silver halogen-free lead-free solder paste
PH12020550504A1 (en) Soldered joint and method for forming soldered joint
JP2003332731A (en) ARTICLE SOLDERED WITH Pb-FREE SOLDER
MX2021007954A (en) Soldering alloy, soldering paste, preform solder, soldering ball, wire solder, resin flux cored solder, solder joint, electronic circuit board, and multilayer electronic circuit board.
EP4299238A3 (en) Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications
KR20180084328A (en) Intermidiate Melting Pointed Lead-free Alloy for Soldering
CN100491054C (en) Leadless soft soldering material
CN108098185A (en) A kind of low-melting point leadless scolding tin of MPY solder machines
US20170274481A1 (en) Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component
US10189119B2 (en) Solder alloy for die bonding

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application