SE0300049L - Pb-free Sn-Co-Cu solder - Google Patents

Pb-free Sn-Co-Cu solder

Info

Publication number
SE0300049L
SE0300049L SE0300049A SE0300049A SE0300049L SE 0300049 L SE0300049 L SE 0300049L SE 0300049 A SE0300049 A SE 0300049A SE 0300049 A SE0300049 A SE 0300049A SE 0300049 L SE0300049 L SE 0300049L
Authority
SE
Sweden
Prior art keywords
tin
cobalt
free
beta
copper
Prior art date
Application number
SE0300049A
Other languages
Swedish (sv)
Other versions
SE0300049D0 (en
Inventor
Johan Liu
Libin Liu
Original Assignee
Johan Liu
Libin Liu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johan Liu, Libin Liu filed Critical Johan Liu
Priority to SE0300049A priority Critical patent/SE0300049L/en
Publication of SE0300049D0 publication Critical patent/SE0300049D0/en
Publication of SE0300049L publication Critical patent/SE0300049L/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Abstract

At least two intermetallic compounds are distributed in a beta- tin matrix, one compound containing copper and tin, the other containing cobalt and tin. - A lead-free, electrically conductive solder alloy with a ternary eutectic composition comprises ca. 98.95 wt.% tin, ca. 0.37 wt.% cobalt and 0.68 wt.% copper. The eutectic melting point is ca. 224.4 deg. C. The alloy contains at least two intermetallic compounds distributed in a beta-tin matrix, one compound containing copper and tin, whilst the other contains cobalt and tin.
SE0300049A 2003-01-09 2003-01-09 Pb-free Sn-Co-Cu solder SE0300049L (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SE0300049A SE0300049L (en) 2003-01-09 2003-01-09 Pb-free Sn-Co-Cu solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0300049A SE0300049L (en) 2003-01-09 2003-01-09 Pb-free Sn-Co-Cu solder

Publications (2)

Publication Number Publication Date
SE0300049D0 SE0300049D0 (en) 2003-01-09
SE0300049L true SE0300049L (en) 2004-07-10

Family

ID=20290095

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0300049A SE0300049L (en) 2003-01-09 2003-01-09 Pb-free Sn-Co-Cu solder

Country Status (1)

Country Link
SE (1) SE0300049L (en)

Also Published As

Publication number Publication date
SE0300049D0 (en) 2003-01-09

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Legal Events

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