WO2007029791A1 - 導電性接触子および導電性接触子の製造方法 - Google Patents
導電性接触子および導電性接触子の製造方法 Download PDFInfo
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- WO2007029791A1 WO2007029791A1 PCT/JP2006/317789 JP2006317789W WO2007029791A1 WO 2007029791 A1 WO2007029791 A1 WO 2007029791A1 JP 2006317789 W JP2006317789 W JP 2006317789W WO 2007029791 A1 WO2007029791 A1 WO 2007029791A1
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- Prior art keywords
- conductive contact
- main body
- longitudinal direction
- conductive
- cross
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
Definitions
- the present invention relates to a conductive contact that establishes an electrical connection by physically contacting the connection terminal with respect to a circuit structure including a plurality of connection terminals, and the conductive contact.
- the present invention relates to a method for manufacturing a conductive contact to be manufactured.
- FIG. 24 is a diagram showing another example of attachment of the conventional conductive contact to the conductive contact unit
- FIG. 25 shows a configuration in the vicinity of the conductive contact that contacts the inspection device side.
- an insulating layer 512 is formed on a portion excluding both ends in the longitudinal direction of the main body 511 having a circular cross-sectional shape.
- the conductive contact unit that accommodates and holds the conductive contact 501 having the above-described configuration has two upper plate 601 and lower plate 602 on the circuit structure connection side (the upper side in FIG. 24) to be inspected.
- a first plate 600 comprising layers is provided.
- a second plate 700 having a three-layer force of an upper layer plate 701, an intermediate layer plate 702, and a lower layer plate 703 is provided on the circuit board 801 side (lower side in FIG. 24) of the inspection apparatus.
- the bottom surface of the lower layer plate 703 is in contact with the electrode 802 of the circuit board 801 of the inspection device, and one end of the attached conductive contact 501 comes into contact with the electrode 802.
- the upper layer plate 601 of the first plate 600 is larger than the diameter of the main body 511 and has an insulating layer 512. It has a hole smaller than the diameter of the covered part.
- the lower plate 602 of the first plate 600 has a hole through which the portion covered with the insulating layer 512 can be passed, and these two holes are stacked so as to be coaxial with each other vertically.
- the hole 711 of the upper layer plate 701 and the hole 712 of the intermediate layer plate 702 have the same diameter (R), and these holes 711 and 712 include Main unit 511
- the portion (diameter r) covered with the insulating layer 512 (diameter r) can be passed through.
- the hole 713 of the plate 703 has a smaller diameter (R) than the hole of the upper plate 701,
- the three plates constituting the second plate 700 are arranged such that the central axes of the holes are shifted by a minute distance from each other, and the attached conductive contact 501 is forcibly pushed in a predetermined direction. I can do it.
- Patent Document 1 Japanese Patent Laid-Open No. 2001-337109
- Patent Document 2 JP-A-11-248747
- Patent Document 3 Japanese Patent Laid-Open No. 2001-50982
- the conventional conductive contact has a circular cross-sectional shape, for example, as shown in FIG. 6 of Patent Document 3, the upper plate and the lower plate are shifted. In this way, the center axis of the hole was shifted to align the stagnation direction of the conductive contact, but in reality it was still insufficient, so the two plates where both ends were inserted as described above were used. Forcibly controlling the stagnation direction of the conductive contact by shifting the hole of the contact (see Fig. 24). However, the structure shown in FIG. 24 has a problem in that the hole drilling position design becomes complicated and time-consuming because the center axis of the hole provided in each plate is shifted.
- each plate hole cover had a manufacturing error, and it was uncertain whether the holes would actually shift stepwise when stacked. For this reason, in the conventional conductive contact unit, it is difficult to equalize the load on each circuit board electrode of each conductive contact and to uniform the contact resistance at each contact portion. Spirit There was a risk of problems every time.
- the present invention has been made in view of the above, and can easily control the direction of squeezing when an external force is applied, thereby realizing more accurate and highly reliable electrical property inspection. It is an object of the present invention to provide a conductive contact and a method for manufacturing the conductive contact. Means for solving the problem
- the invention according to claim 1 is directed to a circuit structure including a plurality of connection terminals and physically connected to any one of the plurality of connection terminals.
- a conductive contact which establishes an electrical connection by contact, wherein the shape of a cross section perpendicular to the longitudinal direction of the main body of the conductive contact is anisotropic.
- the cross section perpendicular to the longitudinal direction of the main body is symmetrical with respect to each of two axes passing through the cross section and orthogonal to each other. It is characterized by having a shape.
- the invention of claim 3 is characterized in that, in the invention of claim 1, further comprising a laminated portion laminated on the main body portion and having a material force different from that of the main body portion.
- the invention according to claim 4 is the invention according to any one of claims 1 to 3, wherein the region includes the vicinity of the center in the longitudinal direction of the main body, and does not include both ends of the main body.
- the method further comprises an insulating layer covering the surface of the region.
- the invention according to claim 5 is the invention according to any one of claims 1 to 3, wherein the main body portion is provided with one or a plurality of through-hole portions.
- the invention according to claim 6 is the invention according to any one of claims 1 to 3, wherein at least one of the longitudinal ends of the main body is sharpened.
- the invention according to claim 7 is the invention according to any one of claims 1 to 3, characterized in that it has a constricted portion in which a part of a side surface in the longitudinal direction of the main body portion is cut out. Let's say.
- the invention according to claim 8 is the invention according to claim 7, wherein the constricted portion is provided in the vicinity of the center in the longitudinal direction of the main body portion.
- the invention according to claim 9 is directed to a circuit structure including a plurality of connection terminals.
- An insulating layer forming step for forming an insulating layer on the surface of a region that does not include both ends of each main body portion, and the main body portions of the plurality of conductive contacts formed in the forming step Each of them has an anisotropy in the shape of a cross section perpendicular to the longitudinal direction, and has a constricted portion formed by cutting out a part of the side surface in the longitudinal direction, and the constricted portions of the adjacent main body portions are connected to each other It is characterized by That.
- the invention according to claim 10 is the invention according to claim 9, wherein the cross-sectional area perpendicular to the longitudinal direction of the connecting portion connecting the constricted portions adjacent to each other is the main body portion of the constricted portion. It is smaller than the area of the cross section perpendicular to the longitudinal direction.
- the invention according to claim 11 is the invention according to claim 10, wherein a plurality of conductive contacts each having an insulating layer formed in the insulating layer forming step are connected to each conductive contact.
- the method further includes a removing step of removing each of the conductive contacts by rotating the connecting portion.
- the conductive contact and the method of manufacturing the conductive contact according to the present invention by giving anisotropy to the shape of the cross section perpendicular to the longitudinal direction of the main body of the conductive contact, It is possible to easily control the direction of squeezing when an external force is applied, and it is possible to realize highly accurate and reliable electrical property inspection.
- FIG. 1 is a perspective view showing a configuration of a conductive contact according to Embodiment 1 of the present invention.
- FIG. 2 is a top view in the direction of arrow A in FIG.
- FIG. 3 is a cross-sectional view taken along the line BB in FIG.
- Fig. 4 is a conductive contact accommodating the conductive contact according to Embodiment 1 of the present invention. It is a perspective view which shows the structure of a unit.
- FIG. 5 is a diagram showing a state before the conductive contact according to Embodiment 1 of the present invention is attached to the conductive contact unit and offset.
- FIG. 6 is a view showing a state after the conductive contact according to Embodiment 1 of the present invention is attached to the conductive contact unit and offset.
- Fig. 7 is a view showing a form of each tip portion of the conductive contact group before and after the offset.
- FIG. 8 is a perspective view showing a configuration of a conductive contact according to a first modification of the first embodiment of the present invention.
- FIG. 9 is a perspective view showing a configuration of a conductive contact according to a second modification of the first embodiment of the present invention.
- FIG. 10 is a perspective view showing a configuration of a conductive contact according to a third modification of the first embodiment of the present invention.
- FIG. 11 is a perspective view showing a configuration of a conductive contact according to a fourth modified example of the first embodiment of the present invention.
- FIG. 12 is a perspective view showing a modification (first example) of the shape of the tip of the conductive contact according to Embodiment 1 of the present invention.
- FIG. 13 is a perspective view showing a modification (second example) of the shape of the tip of the conductive contact according to Embodiment 1 of the present invention.
- FIG. 14 is a perspective view showing a modification (third example) of the shape of the tip of the conductive contact according to the first embodiment of the present invention.
- FIG. 15 is a perspective view showing a configuration of a conductive contact according to Embodiment 2 of the present invention.
- FIG. 16 is a perspective view showing a configuration of a conductive contact according to a first modification of the second embodiment of the present invention.
- FIG. 17 is a perspective view showing a configuration of a conductive contact according to a second modification of the second embodiment of the present invention.
- FIG. 18 is a cross-sectional view showing a configuration of a conductive contact according to a third modification of the second embodiment of the present invention.
- FIG. 19 is a diagram showing a configuration of a main body group formed by a forming step of a method for manufacturing a conductive contact according to Embodiment 3 of the present invention.
- FIG. 20 is a partially enlarged perspective view showing an enlarged main body portion in the main body portion group.
- FIG. 21 is a diagram showing a configuration of a main body group after an insulating layer forming step of the method for manufacturing a conductive contact according to the third embodiment of the present invention.
- FIG. 22 is a cross-sectional view taken along line CC of FIG.
- FIG. 23 is a diagram showing another configuration example of the main body unit group.
- FIG. 24 is a diagram showing an example of attachment of a conventional conductive contact to a conductive contact unit.
- FIG. 25 is a partially enlarged view showing the mounting structure of the conductive contact that contacts the inspection device side.
- FIG. 1 is a perspective view showing a configuration of a conductive contact according to Embodiment 1 of the present invention.
- FIG. 2 is a top view in the direction of arrow A in FIG.
- FIG. 3 is a cross-sectional view taken along line BB in FIG.
- the conductive contact 1 shown in these drawings is of a type called a wire probe, and has a main body 11 having a flat plate shape and sharpened in a V shape at both ends, and both ends of the main body 11 are connected to each other. And an insulating layer 12 formed so as to cover the surface of the main body 11 near the center.
- the cross section (transverse section) in the direction perpendicular to the longitudinal direction of the main body 11 is rectangular as shown in FIG.
- FIG. 4 is a diagram showing a schematic configuration of a conductive contact unit that accommodates the conductive contact 1 having the above-described configuration.
- the conductive contact unit 200 shown in the figure accommodates a plurality of conductive contacts 1 and establishes an electrical connection between a circuit structure such as a semiconductor integrated circuit to be inspected for electrical characteristic inspection and an inspection device. Is.
- the conductive contact unit 200 includes a first plate 201 and a second plate 202 that are provided near both ends of each conductive contact 1 and receive and hold each conductive contact 1.
- a plurality of conductive contacts 1 are regularly arranged between them.
- the conductive contact group G is a force formed by arranging a plurality of conductive contacts 1 in a row. This is merely an example, and the conductive contact group G This arrangement pattern is determined according to the arrangement pattern of the connection electrodes (connection terminals) of the circuit structure to be inspected.
- FIG. 5 is a diagram showing a state in the middle of mounting and mounting the conductive contact 1 according to the first embodiment in the conductive contact unit 200 (compared to FIG. 4 for convenience of drawing).
- the length of the longitudinal direction of the conductive contact 1 is described as short).
- the conductive contact unit 200 is usually upside down as shown in FIG. The same vertical position relationship as in Fig. 4 should be used.
- the hole 211 of the first plate 201 and the hole 212 of the second plate 202 have a cylindrical shape into which the conductive contact 1 can be inserted and have the same diameter.
- one of the first plate 201 and the second plate 202 is attached to the other plate.
- this operation is referred to as “offset”), the center axes of the holes 211 and 212 having the same axis in FIG. 5 are shifted. As a result, the conductive contact 1 starts to stagnate under external force.
- the conductive contact 1 has a shape having anisotropy in the longitudinal section as described above, and therefore has a small section coefficient! It begins to stagnate in the direction perpendicular to the long side of the rectangle, which is the cross-sectional shape (the direction in which the thickness is small).
- FIG. 6 is a diagram showing an attached state of the conductive contact 1 after offset.
- the conductive contact 1 is in a state of being pinched so that the surface of the main body 11 on the long side contacts the ends of the holes 211 and 212.
- the front end portion of the main body 11 protruding from the hole 211 of the first plate 201 is in contact with the connection electrode 402 of the semiconductor integrated circuit 401 to be inspected.
- the front end portion of the main body portion 11 accommodated in the hole portion 212 of the second plate 202 is in contact with the electrode 302 of the circuit board 301.
- FIG. 7 is a diagram showing the state of the front end portion of the conductive contact 1 before and after the offset in the first embodiment, and the conductive contact group G is formed from the upper surface of the conductive contact unit 200. This corresponds to a top view when a part (a part) of the hole 211 is formed.
- the tip of each conductive contact 1 is oriented in a random direction. ing.
- the conductive contacts 1 are held in the same manner, so that the tips of the conductive contacts 1 protruding from the holes 211 are aligned. Oriented to the other direction.
- the cross section perpendicular to the longitudinal direction of the main body is isotropic. It was difficult to make the condition uniform.
- the conductive contact according to the first embodiment has anisotropy in which the cross section perpendicular to the longitudinal direction of the main body is anisotropic and has anisotropy. It is possible to make the condition uniform.
- Conductive contact 1 is a processing technology such as plating, etching (including wet etching and dry etching), electrical plating, lithography (including X-ray lithography and ultraviolet lithography), and electrical discharge machining (including wire electrical discharge machining).
- etching including wet etching and dry etching
- electrical plating including lithography (including X-ray lithography and ultraviolet lithography)
- lithography including X-ray lithography and ultraviolet lithography
- electrical discharge machining including wire electrical discharge machining.
- insulating layer 12 may be formed using a processing technique such as chemical vapor deposition (CVD), sputtering, or plating.
- a metal having excellent wear resistance such as iron (Fe), nickel (Ni), tungsten (W), and the like can be used.
- an insulating member such as polyurethane or polyparaxylylene can be applied.
- an insulating film formed of an acid film such as alumite may be used as the insulating layer 12.
- the insulating layer covering the surface of the region including the vicinity of the center in the longitudinal direction of the main body portion and not including the both end portions of the main body portion is formed. Therefore, when multiple conductive contacts are attached to the conductive contact unit, prevent electrical short circuit between adjacent conductive contacts and prevent damage due to contact of the conductive contacts. Can do.
- the conductive that holds the conductive contact is provided.
- the plate structure of the sexual contact unit may be simple (see Figures 5 and 6). Therefore, the design is easy and the cost can be reduced.
- FIG. 8 is a perspective view showing the configuration of the main body portion of the conductive contact according to the first modification of the first embodiment.
- the conductive contact 2 shown in the figure has a flat plate-like body portion 21 sharpened at both ends, and three through-hole portions 22 having the same shape are formed.
- the through holes 22 are for adjusting the spring constant of the conductive contact 2, and the number, shape, and installation position are not limited to those shown in FIG.
- FIG. 9 is a perspective view showing the configuration of the main body portion of the conductive contact according to the second modification of the first embodiment.
- the conductive contact 3 shown in the figure has two end portions 31 having a V-shaped sharp end and a body portion 32 interposed between the two end portions 31.
- This shape The conductive contact 3 is obtained by cutting out the vicinity of the central portion of the main body 11 of the conductive contact 1 described above. In this case, by making the body portion 32 narrower than the other portions, it is possible to have a spring constant different from that of the main body portion 11 of the conductive contact 1 described above. It should be noted that the shape (width, length, etc.) of the body portion 32 can be changed as appropriate.
- FIG. 10 is a perspective view showing a configuration of the conductive contact according to the third modification of the first embodiment.
- the end portion 41 has a substantially elliptic frustum shape, while the body portion 42 has a flat plate shape.
- the conductive contact 4 having such a shape can be formed by applying a pressing force to a conventional wire probe (see the conductive contact 501 in FIG. 24). Cost can be kept particularly low.
- FIG. 11 is a perspective view showing the configuration of the conductive contact according to the fourth modification example of the first embodiment.
- the conductive contact 5 shown in the figure has a plate-shaped body portion 52 formed by pressing a central portion excluding both ends of a conventional wire probe.
- the end portions 51 on both sides have sharp ends, while the body portion 52 has anisotropy, so that the stagnation direction is controlled.
- the manufacturing cost can be kept low as with the conductive contact 4 described above.
- an insulating layer may be formed in the same manner as the conductive contact 1 near the center of the conductive contacts 2 to 5 described above.
- FIGS. 12 to 14 are partial perspective views showing modifications of the shape of the tip of the conductive contact according to the first embodiment.
- the tip of the main body 11 of the conductive contact 1 is shown in FIG. It corresponds to the processed one.
- the tip 111 shown in FIG. 12 is obtained by further sharpening the tip of the main body 11.
- a tip 112 shown in FIG. 13 is obtained by chamfering a V-shaped curved surface of the tip of the main body of the conductive contact 1.
- the tip 113 shown in FIG. 14 is sharpened like a needle.
- the shape of the tip shown in these figures should be selected in accordance with the circuit structure to be inspected and the structure of the circuit board of the inspection device. May be formed.
- the tip portions 111 to 113 described above can be formed by applying techniques such as electric discharge machining (including wire electric discharge machining), cutting ij, turning IJ, and grinding. [0045] (Embodiment 2)
- FIG. 15 is a perspective view showing the configuration of the conductive contact according to Embodiment 2 of the present invention.
- the conductive contact 6 shown in the figure is flat and has a main body 61 sharpened in a shape of force at both ends, and is laminated in the vicinity of the center of the main body 61, and has a volume larger than that of the main body 61. And a laminated portion 62 having a small rectangular parallelepiped shape.
- This conductive contact 6 also has anisotropy in the cross section perpendicular to the longitudinal direction of the main body 61. Therefore, if the plurality of conductive contacts 6 are attached to the conductive contact unit 200 and offset in the same manner as in the first embodiment, the direction in which the plurality of conductive contacts 6 are gathered is made uniform. be able to.
- the body portion 61 and the laminated portion 62 are made of different metals.
- the main body 61 is made of iron (Fe), nickel (Ni), or tungsten (W), which has excellent wear resistance
- the laminated portion 62 is made of copper with low electrical resistance.
- (Cu) -based, silver (Ag) -based, gold (Au) -based, or palladium (Pd) -based metals realizes conductive contacts with excellent wear resistance and electrical resistance characteristics. be able to. This is an effect that cannot be obtained when the conductive contact is formed of one kind of metal, and is an effect unique to the second embodiment.
- the conductive contacts 6 may be laminated by combining metals that can realize the characteristics to be imparted to the conductive contact 6. In this sense, the number of metals laminated to form the conductive contact need not be two, but may be three or more.
- the part 62 may be laminated.
- an insulating layer can be formed so as to cover the periphery of the main body 61 and the laminated portion 62 of the conductive contact 6.
- a method similar to that described in the first embodiment is applied.
- the longitudinal direction of the main body of the conductive contactor By imparting anisotropy to the shape of the cross section perpendicular to the direction, the direction in which it is trapped when an external force is applied can be easily controlled.
- the conductive contact according to the second embodiment is attached to the conductive contact unit and the electrical characteristic inspection is performed, the load on the electrode of each conductive contact is made uniform, and the contact at each contact portion is uniformed. Contact resistance can be made uniform, and it becomes possible to realize highly accurate and reliable electrical property inspection.
- the insulating layer that covers the surface of the region that includes the vicinity of the center in the longitudinal direction of the main body and does not include the both ends of the main body is formed.
- the conductive contact unit when a plurality of conductive contacts are attached to the conductive contact unit, it is possible to prevent an electrical short circuit between adjacent conductive contacts and to prevent damage due to contact of the conductive contacts. .
- FIG. 16 is a perspective view showing a configuration of a conductive contact according to a first modification of the second embodiment.
- the conductive contact 7 shown in the figure has a shape in which the longitudinal end is sharpened on the main body 71 having the same shape as the main body 61 of the conductive contact 6 described above, unlike the laminated portion 62.
- Laminating portions 72 forming the following are laminated. In this way, by changing the shape of the laminated portion, it is possible to make the characteristics of the conductive contact 7 different from the characteristics of the conductive contact 6.
- FIG. 17 is a perspective view showing a configuration of a conductive contact according to a second modification of the second embodiment.
- the main body 81 has a larger thickness (plate thickness) in the laminating direction than the main body 81 and the laminated portion 82 having the same surface area.
- the characteristics of the conductive contact 8 can be adjusted also by changing the ratio between the plate thickness of the main body 81 and the plate thickness of the laminated portion 82.
- FIG. 18 is a cross-sectional view showing the configuration of the conductive contact according to the third modification of the second embodiment.
- the conductive contact 9 shown in the figure has three through-hole portions 92 formed in a flat plate-like main body portion 91, and three laminated portions so as to cover the opening surface on one side of each through-hole portion 92. 93 is laminated.
- the laminated portion 93 may be further laminated on the other opening surface, or the laminated portion 93 may be laminated only on a part of the through-hole portion 92.
- FIG. 17 the vicinity of the center of the main body of the conductive contact is constricted (see FIG. 9) or the shape of the tip is changed. (See Figure 12 to Figure 14).
- the same effect as the coating of the insulating layer can be obtained by laminating a resin coating on one or both sides. Among these, even when the resin is laminated on only one side, the conductive contact 8 has anisotropy, so that the stagnation direction is uniform and the adjacent conductive contact 8 There is no short circuit between them.
- Embodiment 3 of the present invention a large number of conductive contacts including a main body having a cross section orthogonal to the longitudinal direction and an insulating layer covering the central portion of the main body are simultaneously and in large quantities.
- a method for manufacturing a conductive contact suitable for manufacturing is provided.
- etching including wet etching and dry etching
- electrical plating lithography (X-ray lithography, ultraviolet lithography)
- lithography X-ray lithography, ultraviolet lithography
- a main body part group including a plurality of main body parts of a conductive contact is formed by applying a processing technique such as electric discharge machining (including wire electric discharge machining) (molding process).
- FIG. 19 is a diagram showing a configuration of the main body group formed by this molding process.
- FIG. 20 is a partially enlarged perspective view showing an enlarged main body portion adjacent to the main body portion group.
- the main body portion group 100 is formed by connecting a plurality of main body portions 101 which are flat and whose both ends are sharpened in a V shape.
- a constricted portion 102 is formed by cutting out in a direction orthogonal to the longitudinal direction of the main body 101.
- a connecting portion 103 that connects the adjacent main body portions 101 is formed.
- the main body portion 101 formed at the end is connected to a holding frame portion 104 that holds a series of main body portions 101 via a connecting portion 103. As shown in FIG.
- the main body portions 101 are held in such a manner that the longitudinal directions of the main body portions 101 are parallel to each other and the tip positions of the corresponding end portions of the main body portions 101 are in a straight line. In this sense, it can be said that each main body 101 has a translational symmetrical positional relationship with respect to a direction (vertical direction in FIG. 19) connected to the adjacent main body 101.
- the area of the cross section (cross section) perpendicular to the longitudinal direction of the connecting portion 103 that connects the constricted portions 102 adjacent to each other is larger than the area of the cross section perpendicular to the longitudinal direction of the main body 101 at the constricted portion 102.
- FIG. 21 is a diagram showing a configuration of the main body portion group after the insulating layer forming step is performed.
- FIG. 22 is a cross-sectional view taken along the line CC in FIG. As shown in FIGS. 21 and 22, the gap between the constricted portion 102 and the connecting portion 103 is filled with the insulating layer 105! /
- the conductive contacts 10 each having the insulating layer 105 formed thereon are removed from the main body group 100 (removal step).
- the conductive contact 10 is rotated about the central axis in the longitudinal direction of the connecting portion 103 as a center of rotation, and the detachment from the main body portion group 100 is performed.
- the connecting portion 103 has a smaller cross-sectional area than the main body portion 101. Therefore, when the conductive contact 10 is rotated as described above, the connecting portion 103 is more effective in rotating. As a result, the constricted part 102 is detached from the side surface 102a. Therefore, the conductive contact 10 can be detached from the holding frame portion 104 alone.
- the connecting portion 103 is bent near the boundary with the constricted portion 102, the surface force of the insulating layer 105 can be easily pulled out and disposed of.
- the insulating layers formed on the main body portions are formed by uniformly arranging and molding the main body portions of the plurality of conductive contacts via the connecting portions. Unevenness does not occur. Therefore, a plurality of conductive contacts having a uniform shape can be manufactured simultaneously and in large quantities, and productivity can be improved.
- the connecting portion by connecting the connecting portion to the constricted portion of the main body portion, the portion where the connecting portion is removed from the insulating layer becomes a cavity, and the surface having conductivity is the surface of the insulating layer. Because it is located inside the insulation layer far enough than that, there is no risk of short-circuiting between the conductive contacts attached to the conductive contact unit.
- the conductive contact manufactured by the method for manufacturing a conductive contact according to the third embodiment differs from the first and second embodiments in the shape of a cross section perpendicular to the longitudinal direction of the main body. Since it has directionality, it is possible to easily control the direction of squeezing when an external force is applied. As a result, even when the conductive contact according to Embodiment 3 is attached to the conductive contact unit and the electrical characteristic inspection is performed, the load on the electrode of each conductive contact is made uniform, The contact resistance at the contact portion can be made uniform, and it is possible to realize a highly accurate and reliable high-performance electrical property inspection.
- an insulating layer that covers the surface of a region that includes the vicinity of the center in the longitudinal direction of the main body and does not include both ends of the main body is formed. Therefore, when multiple conductive contacts are attached to the conductive contact unit, prevent electrical short circuit between adjacent conductive contacts and prevent damage due to contact of the conductive contacts. Can do.
- FIG. 23 is a diagram showing another configuration example of the main body group.
- a main body portion 151 connected to the main body portion group 150 shown in the figure includes two constricted portions 152 along the longitudinal direction.
- Each constricted portion 152 is connected with a connecting portion 153 as in the case of the constricted portion 102 described above, and a plurality of main body portions 151 are held by the holding frame portion 1 54 in a translationally symmetrical positional relationship! RU
- adjacent main body parts 151 are connected to each other via two connecting parts 153. Are connected.
- the connecting portion 153 is rotated with respect to the body portion 151 to thereby rotate the body portion 151. And the connecting part 153 are separated. As a result, the main body 151 is likely to be removed from the main body group 150 when all of the four connecting parts 153 connected thereto are disconnected.
- Embodiments 1 to 3 So far, the best mode for carrying out the present invention has been described in Embodiments 1 to 3.
- the present invention should not be limited only by these three embodiments. That is, the present invention can include various embodiments and the like not described in this specification, and does not depart from the technical idea specified by the claims! Various design changes and the like can be made.
- the present invention is suitable as means for establishing an electrical connection between a circuit structure and an inspection apparatus when performing an electrical characteristic test on a circuit structure having a plurality of connection terminals.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2006800328537A CN101258409B (zh) | 2005-09-09 | 2006-09-07 | 导电性触头以及导电性触头的制造方法 |
US11/991,560 US7956288B2 (en) | 2005-09-09 | 2006-09-07 | Conductive contact and method of manufacturing conductive contact |
EP06797646A EP1923708A4 (en) | 2005-09-09 | 2006-09-07 | CONDUCTIVE CONTACT AND METHOD FOR PRODUCING CONDUCTIVE CONTACT |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-263036 | 2005-09-09 | ||
JP2005263036A JP4823617B2 (ja) | 2005-09-09 | 2005-09-09 | 導電性接触子および導電性接触子の製造方法 |
Publications (1)
Publication Number | Publication Date |
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WO2007029791A1 true WO2007029791A1 (ja) | 2007-03-15 |
Family
ID=37835906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/317789 WO2007029791A1 (ja) | 2005-09-09 | 2006-09-07 | 導電性接触子および導電性接触子の製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7956288B2 (ja) |
EP (1) | EP1923708A4 (ja) |
JP (1) | JP4823617B2 (ja) |
KR (1) | KR101012083B1 (ja) |
CN (1) | CN101258409B (ja) |
TW (1) | TWI315791B (ja) |
WO (1) | WO2007029791A1 (ja) |
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EP2060921A1 (en) * | 2007-11-16 | 2009-05-20 | Technoprobe S.p.A | Contact probe for testing head having vertical probes and related testing head for testing microstructure electric performance |
CN108333394A (zh) * | 2012-12-04 | 2018-07-27 | 日本电子材料株式会社 | 接触探针 |
EP2117081B1 (de) * | 2008-05-09 | 2018-11-07 | Feinmetall GmbH | Elektrisches Kontaktelement |
WO2024062560A1 (ja) * | 2022-09-21 | 2024-03-28 | 日本電子材料株式会社 | プローブカード用プローブ |
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Also Published As
Publication number | Publication date |
---|---|
TW200716988A (en) | 2007-05-01 |
EP1923708A4 (en) | 2012-05-09 |
JP4823617B2 (ja) | 2011-11-24 |
US7956288B2 (en) | 2011-06-07 |
KR20080044332A (ko) | 2008-05-20 |
US20090183898A1 (en) | 2009-07-23 |
CN101258409A (zh) | 2008-09-03 |
CN101258409B (zh) | 2012-10-10 |
TWI315791B (en) | 2009-10-11 |
KR101012083B1 (ko) | 2011-02-07 |
EP1923708A1 (en) | 2008-05-21 |
JP2007078371A (ja) | 2007-03-29 |
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