WO2006057376A1 - 脆質部材の処理装置 - Google Patents
脆質部材の処理装置 Download PDFInfo
- Publication number
- WO2006057376A1 WO2006057376A1 PCT/JP2005/021755 JP2005021755W WO2006057376A1 WO 2006057376 A1 WO2006057376 A1 WO 2006057376A1 JP 2005021755 W JP2005021755 W JP 2005021755W WO 2006057376 A1 WO2006057376 A1 WO 2006057376A1
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- WIPO (PCT)
- Prior art keywords
- peeling
- brittle
- support plate
- brittle member
- holding member
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
Definitions
- the present invention relates to a brittle member processing apparatus, and more particularly to a brittle member processing apparatus having a function of transferring a semiconductor wafer subjected to back grinding to a ring frame.
- a semiconductor wafer (hereinafter simply referred to as “wafer”) having a circuit surface formed is subjected to back surface grinding with a protective sheet applied to the circuit surface, and then to a ring frame.
- a mounting process for integrating the wafer and a peeling process for peeling the protective sheet from the wafer are performed.
- Patent Document 1 discloses a wafer processing apparatus that performs the mounting process and the peeling process.
- a wafer is placed on the inner peripheral side of the ring frame, and a mounting device for attaching a mount tape to the wafer and the ring frame to integrate them together, and a circuit surface side of the wafer.
- a peeling device for adhering the peeling tape to the protective sheet, and peeling the protective sheet from the wafer while pulling the peeling tape obliquely upward.
- Patent Document 1 JP 2000-68293 A
- the wafer and the ring frame can be integrated, that is, the mounting and the protective sheet peeling process can be performed in a series of steps.
- the rigidity is sufficient to support the wafer during grinding when a protective sheet is simply applied to the circuit surface.
- the protective sheet cannot be secured, and ultra-thin grinding with surface smoothness cannot be achieved.
- surface protection such as sputtering or metal vapor deposition is performed on the backside of the wafer, so the protective sheet is required to have heat resistance and corrosion resistance.
- the reality is that you can't. Therefore, by attaching a support plate such as a glass plate having a certain rigidity or plate thickness to the circuit surface via a double-sided adhesive sheet, the wafer is damaged by using the rigidity or plate thickness of the support plate.
- the back grinding is performed very thinly.
- Patent Document 1 cannot peel the support plate from the wafer, so in a separate work process, It is necessary to peel off the support plate and the wafer, resulting in a disadvantage that the processing sequence is hindered and work efficiency is greatly reduced.
- the present invention has been devised by paying attention to such inconveniences, and its purpose is to provide a mounting step for integrating a brittle member such as a wafer with a holding member, and a support plate for supporting the brittle member.
- a brittle member processing apparatus capable of executing a process of peeling and transferring a brittle member to a holding member and a step of peeling the double-sided pressure-sensitive adhesive sheet on the brittle member as a series of processes. It is to provide.
- Another object of the present invention is to treat a brittle member that can be treated by the same apparatus even if it is a treatment object in which only the protective sheet is attached to the brittle member without using a support plate. To provide an apparatus.
- the present invention uses a plate-like body in which a brittle member is integrated with a support plate via a double-sided pressure-sensitive adhesive sheet as an object to be treated, and peels the brittle member from the support plate.
- a brittle member processing apparatus for transferring the brittle member to the predetermined holding member,
- a mounting table that supports the holding member and supports the object to be treated inside the holding member so that the surface of the brittle member is exposed, and an adhesive tape is applied to the surfaces of the holding member and the brittle member.
- a mounting device comprising a sticking unit to be
- a transfer device including a peeling trigger part forming device for forming a peeling trigger part, and a driving means for performing the peeling trigger part force peeling by relatively moving the first and second support members; And a peeling device for peeling the double-sided pressure-sensitive adhesive sheet on the brittle member transferred to the holding member.
- the first support member is configured by a suction table that supports the plate-like body
- the second support member is located on the outer peripheral side of the suction table and on the surface of the suction table. It is preferable to adopt a configuration in which a pair of arms having a position along the initial position as a starting position is provided, and the arms are provided so as to be rotatable in a direction that is displaced from the initial position by a predetermined angle.
- the suction table is provided so as to be movable up and down, and is provided so as to be lowered when the arm returns from the standing position to the initial position to prevent re-adhesion between the plate-like body and the brittle member. be able to.
- the present invention provides a processing object with a support plate integrated with a double-sided pressure-sensitive adhesive sheet interposed between one surface of the brittle member and the support plate, or one surface of the brittle member.
- a brittle member processing apparatus that uses a processing target with a protective sheet provided with a protective sheet, and transfers the brittle member to a holding member to perform a predetermined treatment.
- the processing object is disposed inside the holding member supported on the mount table in a state where the other surface of the brittle member is exposed, and an adhesive tape is applied to the surfaces of the brittle member and the holding member.
- the function of peeling the brittle member to the holding member by peeling the brittle member between the brittle member of the processing target with the support plate and the support plate, or the protective sheet A transfer device having a function of temporarily supporting the attached processing object, and a peeling device for peeling the double-sided pressure-sensitive adhesive sheet or the protective sheet on the brittle member transferred to the holding member. Can be taken.
- the present invention is particularly applicable to the case where the brittle member is a semiconductor wafer and the support plate is a glass plate as a processing object.
- it may be configured to include a detecting means for discriminating between a support plate and a protective sheet attached to the processing object.
- the transfer device is incorporated into a processing device including a device for mounting the brittle member on the holding member and a peeling device for the double-sided pressure-sensitive adhesive sheet or protective sheet attached to the brittle member.
- the transfer device can function as an intermediate table for transferring the processing object to the peeling device, so that the brittle member Even when the member is supported by the support, application can be prevented even in this case, so that versatility can be imparted.
- the apparatus determines whether the object to be treated is provided with a support plate or a protection sheet. If the object is provided with a protection sheet, the transfer device is not driven and the transfer device is not driven.
- the landing device can be used as an intermediate table for transfer.
- FIG. 1 is a schematic perspective view showing an overall configuration of a wafer processing apparatus.
- FIG. 2 is a cross-sectional view showing a series of steps in which an object to be treated is transferred to a ring frame.
- FIG. 3 is a schematic perspective view showing an alignment device and its peripheral devices.
- FIG. 5 is a schematic perspective view of a transfer device.
- FIG. 6 is a schematic perspective view showing a state in which a wafer is transferred to the ring frame side by a transfer device.
- FIG. 7 is a schematic perspective view of a tape peeling device.
- FIG. 8 (A) to (C) are operation explanation diagrams until the peeling tape is sandwiched between chucks.
- FIG. 9] (A) to (C) are operations subsequent to FIG. 8 (C), illustrating the operation until the double-sided PSA sheet is peeled from the wafer.
- FIG. 1 shows a schematic perspective view in which a brittle member processing apparatus according to the present invention is applied to a wafer processing apparatus
- FIG. 2 illustrates a wafer processing process over time.
- a cross-sectional view for this purpose is shown.
- the processing object A according to the present embodiment has an UV curable adhesive on the side of the circuit surface (lower surface in the figure) of Weno as a brittle member.
- a glass plate P as a support plate is temporarily attached through a double-sided pressure-sensitive adhesive sheet S by an adhesive.
- the double-sided pressure-sensitive adhesive sheet S in this embodiment has a three-layer structure having an ultraviolet curable adhesive on one surface of the base sheet and a weakly viscous adhesive on the other surface.
- this processing object A is passed through a dicing tape DT constituting an adhesive tape in a state where the wafer W is disposed on the inner peripheral side of the ring frame RF as a holding member. All together.
- a dicing tape DT constituting an adhesive tape in a state where the wafer W is disposed on the inner peripheral side of the ring frame RF as a holding member. All together.
- FIG. 2 (C) after the glass plate P is peeled off at the interface between the double-sided pressure-sensitive adhesive sheet S and the glass plate P, as shown in FIG.
- the double-sided adhesive sheet s left on the circuit side of w is peeled off from the wafer w, and finally, only the wafer W is left inside the ring frame RF (Fig. 2 (E See)).
- the wafer processing apparatus 10 takes out the processing objects A stored in the magazine 11 one by one via the robot arm 12, and at the same time, the ultraviolet ray curable adhesive layer of the double-sided adhesive sheet S.
- UV irradiation device 13 that cures
- alignment device 16 that transfers and positions the processing object A irradiated with ultraviolet rays with this UV irradiation device 13, and a mount that integrates processing object A into the ring frame RF Peeling device 17, glass plate P from processing object A, transfer device 20 for transferring wafer W onto ring frame RF, and double-sided adhesive sheet S left on the circuit side of wafer W
- the peeling device 21 is provided with a Ueno after the double-sided adhesive sheet S has been peeled off, and a stock force 23 for receiving W while being supported by the ring frame RF.
- the magazine 11 accommodates a large number of processing objects A in a substantially horizontal posture, and is accommodated in multiple stages with the back side of the wafer W being the top side.
- the robot arm 12 that takes out the processing object A from the magazine 11 includes a multi-joint arm portion 12A and a lifting body 12B that supports the multi-joint arm portion 12A.
- the tip of the articulated arm 12A has a bifurcated shape, and is configured to include a suction part (not shown) at the tip of the branch, thereby sucking the back side (upper side) of the processing object A.
- the processing object A positioned by the alignment device 16 is attracted and transferred to the mounting device 17 side.
- the ultraviolet irradiation device 13 includes a slide table 27 movable along a pair of guide rails 25, 25 arranged substantially parallel to each other, and an ultraviolet irradiation unit 28 positioned above the slide table 27. It consists of.
- the slide table 27 moves along the guide rail 25 with the processing object A placed thereon, thereby curing the ultraviolet curable adhesive layer side of the double-sided adhesive sheet S for peeling described later. Get ready! /
- the alignment device 16 includes a plate member 30 having a substantially rectangular outer shape in plan view, a central table 31 provided at the center of the plate member 30, and a flat surface supported by the plate member 30. Are provided so that they can be spaced apart from each other and are substantially semicircular in plan view. A pair of convex portions 32, 32 are formed.
- the central table 31 is provided so as to be rotatable in a substantially horizontal plane, and performs positioning to identify the crystal direction of the wafer W by rotating the processing object A and using a camera or the like (not shown), while the convex portions 32, By approaching 32, wafer W can be centered.
- a slider 36 that can be moved via a rodless cylinder 35 and a slider 36 that can be moved up and down, and a bifurcated branch at the tip side.
- a suction arm 37 having a portion is provided. The suction arm 37 sucks the processing object A and transfers the processing object A from the ultraviolet irradiation device 13 to the alignment device 16 side.
- the mounting device 17 integrates the ring frame RF and the processing object A with the mounting table 40 that supports the ring frame RF and the processing object A. It comprises a pasting unit 41 for pasting the dicing tape DT.
- the ring frame RF is stocked in a stacked state on a stock table 42 arranged on the side of the mount table 40, and the mount table 40 is mounted by the transfer arm 43 having the uppermost ring frame RF force adsorption portion 43A. Reprinted on top.
- the transfer arm 43 is supported by a slide block 45 that can move via a single-axis robot 44.
- the stock table 42 is supported by the lifting robot 46 so as to be able to move up and down, and each time the adsorption part 43 A carrying frame RF of the transfer arm 43 is sucked and transferred, the thickness of the ring frame RF is increased. Get up! / Speak.
- the mount table 40 is provided so as to be movable up and down on a slide base 48 provided to be movable along a pair of guide rails 47, 47, and the transfer arm 43 is positioned on the mount table 40.
- the ring frame RF is provided so that it can be raised to a height position.
- the affixing unit 41 includes a dicing tape DT, a ring frame RF, and a back surface of the wafer W.
- the dicing tape DT in the present embodiment is used as a raw fabric L in which a strip-shaped release sheet is attached to one surface of a strip-shaped resinous tape. By forming a closed loop incision in the surface, dicing tape DT having a substantially circular shape in plan view is formed at predetermined intervals. Yes.
- the affixing unit 41 has a plate-like frame F oriented in a substantially vertical plane, is rotatably supported in the plane of the frame F, and is not shown on the rear side of the frame F!
- a feeding roll 50 that supports the original fabric L so that the original fabric L can be fed out while applying a predetermined tension by a motor; and a peel plate 51 that peels off the dicing tape DT by rapidly reversing the feeding direction of the fed original fabric L ,
- a press roll 52 arranged along the edge of the peel plate 51, a drive roll 55 for applying a scraping force to the original fabric L, a nip roll 55A for sandwiching the original fabric L in the drive roll 55, and a dicing tape It consists of a take-up roll 53 for fixing and winding up the lead end of the original L from which the DT has been peeled off, and a guide roll 54 arranged in the middle of the feed path.
- the take-up roll 53 is connected to the output shaft of a motor (not shown) of the drive roll 55 provided on the back side of the frame F by a pulley, and the raw roll L from which the dicing tape DT has been peeled off via a sliding belt is removed. It is constructed so that it can be wound up without slack.
- the transfer device 20 includes a suction table 60 as a first support member that supports the glass plate P of the processing object A, and the glass plate P. Do not interfere with! The separation of the pair of arms 61, 61 as a second supporting member for supporting the ring frame RF at the position, and the boundary between the glass plate P and the ultraviolet curable adhesive layer of the double-sided adhesive sheet S.
- the driving means 64 for moving the arms 61 and 61 relative to each other is provided.
- the suction table 60 has a top surface with a substantially U-shaped recess 60A in plan view at the center thereof.
- the arcuate part of the U-shaped part is provided approximately in the same shape as the outer periphery of the glass plate P, and the ring frame RF is placed on the arm 61 so that the glass plate P is pressed in the arc-shaped direction of the U-shaped part.
- the object to be processed A can be positioned in the X direction when it is slid to.
- a large number of suction holes 60B are provided on the bottom surface of the recess 60A.
- the concave portion 60 is set to a depth corresponding to the thickness of the glass plate P, whereby the upper surface position of the glass plate P, that is, the interface outer peripheral portion of the double-sided pressure-sensitive adhesive sheet S is peeled off.
- the part 62 is configured to be formed.
- the suction table 60 is provided so that it can be raised and lowered via a lifting device (not shown). By temporarily lowering the suction table 60, after the wafer W and the glass plate P are peeled off, the double-sided adhesive sheet S and the glass plate P of the wafer W are kept from adhering again.
- Steps 61A and 61A are formed on the pair of arms 61 and 61, respectively, to restrict displacement in the Y direction when the ring frame RF is placed.
- a connecting bar 66 is provided between one end side of the arms 61, 61, that is, one end portion on the left front side in FIG. 5. The connecting bar 66 can be held so as to restrict the movement of the ring frame RF.
- Two chuck members 68, 68 are provided.
- the peeling tacking portion forming device 63 includes a single-axis robot 70, an upright block 71 movable along the single-axis robot 70, and an upper end portion of the upright block 71.
- the blade member 72 is attached to the blade member 72.
- the leading end side of the blade member 72 is provided so as to advance and retreat along the upper surface of the suction table 60 when the upright block 71 moves along the single-axis robot 70. Therefore, when the leading edge 72A of the blade member 72 moves forward toward the center of the suction table 60, the leading edge 72A enters from the outer peripheral side of the glass plate P and double-sided adhesive tape S, and the glass plate P and double-sided adhesive tape S.
- a gap is formed at the interface with the ultraviolet curable pressure-sensitive adhesive layer, and the gap is formed as a peeling tacking portion 62.
- the drive means 64 extends through the blocks 74, 74 provided at the ends of the pair of arms 61, 61, and has a rotating shaft 75 supported by a support frame (not shown).
- the motor 61 is configured to rotate the rotating shaft 75 in the circumferential direction.
- the arms 61 and 61 have the rotating shaft 75 as the center of rotation and the side on which the connecting bar 66 is provided.
- One end can be rotated as a free end. That is, the arms 61 and 61 are rotatably provided between an initial position where the arms 61 and 61 are kept substantially horizontal and a position where the free end rises and the entire arm 61 stands.
- a transfer arm 78 that is movable via a single-axis robot 77 is provided at a lateral position between the transfer device 20 and the mount device 17, and the transfer arm 78 is provided with the dicing table 78.
- the processing object A integrated with the ring frame RF is adsorbed via the DT and transferred to the transfer device 20.
- a glass plate removing device 80 is provided in the right side region in Fig. 6 of the transfer device 20.
- the glass plate removing device 80 includes a slider 82 that can move along a cylinder 81 that extends in the Y-axis direction, a suction arm 85 that is supported via a Z-axis cylinder 83 provided on the slider 82, and It consists of an elevating type collection table 86 that can collect and collect glass plates P in multiple stages.
- This inversion transfer device 88 includes a single-axis robot 89 disposed along the Y-axis direction, a single-axis robot 91 for lifting supported by a slider 90 moving along the single-axis robot 89, The lifting / lowering slider 92 moves along the lifting / lowering single-axis robot 91, and the reverse suction arm 93 rotatably supported by the lifting / lowering slider 92.
- the reverse suction arm 93 sucks the upper surface portion of the ring frame RF, rotates about 180 degrees so that the wafer W appears on the upper surface side, and transfers the wafer W to the adjacent receiving device 94 shown in FIG. It is composed of
- the receiving device 94 includes a Z-axis single-axis robot 96, a slider 97 supported by the Z-axis single-axis robot 96, and a slider 97.
- the lifting / lowering suction arm 98 sucks and receives the RF portion of the ring frame after the vertical surface position is reversed from the reverse suction arm 93 and constitutes the peeling device 21. It is designed to be transferred to the peeling suction table 100.
- the peeling device 21 includes a pair of guide rails 101 and 101 for supporting the peeling suction table 100 movably along the X-axis direction, and these guides.
- a feed screw shaft 102 disposed between the rails 101 and extending through a nut member (not shown) located on the lower surface side of the peeling suction table 100, and a double-sided adhesive sheet S left on the upper surface side of the wafer W And a peeling unit 105 that peels off.
- the peeling unit 105 includes a peeling tape supply unit 106, a peeling tape bonding unit 107, and a peeling tape pulling unit 108.
- the peeling tape supply unit 106 includes a first lifting plate 11 supported so as to be movable up and down along a first cylinder 110 extending in the Z-axis direction. 1, a support roll 112 that is disposed in the plane of the first lifting plate 111 and supports the peeling tape PT wound in a roll, a peeling tape PT guide roll 113, and a peeling tape
- the guide member 115 guides the tape PT in a substantially horizontal posture. As shown in FIG.
- the guide member 115 includes a substantially L-shaped bracket 120 connected to the piston rod 118 of the horizontal cylinder 117, and the long side of the bracket 120 is positioned in a substantially horizontal plane.
- the peeling tape PT is provided so as to be guided on the upper surface side.
- the peeling tape bonding portion 107 includes a second cylinder 121 extending in the Z-axis direction, a second lifting plate 122 supported by the second cylinder 121 so as to be lifted and lowered, and the second lifting and lowering plate.
- the cutter blade 123 is disposed in the plane of the plate 122, the cutter receiver 124 is located below the cutter blade 123, and the welding unit 125 is provided adjacent to the cutter blade 123.
- the cutter receiver 124 is supported by a cylinder (not shown) provided on the back surface of the second lifting plate 122 so as to be able to protrude and retract with respect to the surface of the second lifting plate 122, and the cutter blade 123 has a cutter blade 123.
- the welding unit 125 includes a heat block 129 at the lower end of the piston rod 129 extending downward from the lower end of the cylinder body 127.
- the heat block 129 attaches the peeling tape PT to the double-sided adhesive sheet S on the wafer W. Configured to weld! RU
- the peeling tape pulling portion 108 moves along the cylinder 130 along the guide rail 101 and the cylinder 130 at a position facing the peeling tape supply portion 106 and the peeling tape bonding portion 107.
- a chuck 136 provided at the tip of the arm 134 supported by the slider 132.
- the chuck 136 also has a force with the lower jaw 136A and the upper jaw 136B, and is provided so as to sandwich and hold the peeling tape PT by closing the space between the lower jaw 136A and the upper jaw 136B. Therefore, after the chuck 136 sandwiches the peeling tape PT and a part of the peeling tape PT is welded to the double-sided adhesive sheet S, the chuck 136 is moved to the right side in FIG. When the sheet S is pulled, the surface force of the wafer W is gradually peeled off. The peeled double-sided pressure-sensitive adhesive sheet S is discarded in a disposal box, not shown.
- a final transfer device 140 is disposed on the side of the peeling tape bonding portion 107.
- This final transfer device 140 includes a cylinder 141 extending in the X-axis direction, and this cylinder.
- the slider 142 is supported by the Linda 141, and the suction arm 144 is supported by the slider 142 so as to be movable up and down.
- the adsorbing arm 144 adsorbs the ring frame RF on the peeling adsorbing table 100 that has moved downward, and between the pair of passage forming bodies 145, 145 having an L-shaped cross section located on the extension line of the guide rail 101.
- the wafer W integrated with the ring frame RF is transferred.
- the ring frame RF transferred between the passage forming bodies 145 is configured to be accommodated in the stocker 23 via the kicker 146 arranged between the passage forming bodies 145! RU
- the processing objects A stored in the magazine 11 are taken out one by one by the robot arm 12 and transferred to the ultraviolet irradiation device 13.
- ultraviolet rays are irradiated through the glass plate P of the processing object A to cure the ultraviolet curable pressure-sensitive adhesive layer of the double-sided pressure-sensitive adhesive sheet S, and are prepared for peeling in a subsequent process.
- the processing object A that has been irradiated with ultraviolet rays is transferred to the alignment device 16 by the suction arm 37, and the alignment device 16 identifies and centers the crystal orientation. Then, the aligned processing object A is transferred to the mount table 40 of the mounting device 17 via the robot arm 12. At this time, the ring frame RF is previously transferred to the mount table 40 by the operation of the transfer arm 43.
- the processing object A and the ring frame RF integrated in this way are adsorbed to the transfer arm 78 waiting above the mount table 40. It is held and transferred to the transfer device 20.
- the glass plate P is received and held in the recess 60A provided in the central portion of the suction table 60 of the transfer device 20, while the ring frame RF is supported by the arm 61. , 61 steps formed inside each In this state, the outer peripheral portion of the chuck member 68 force S-ring frame RF provided on the connecting bar 65 side is sandwiched.
- the peeling tacking portion forming device 63 is operated, and the blade member 72 is moved forward along the upper surface of the suction table 60 toward the center of the object A to be processed.
- a gap is formed, and the peeling tack 62 is formed by the gap.
- the motor M of the driving means 64 is driven, and the free end side of the pair of arms 61, 61 rotates so as to be spaced upward from the suction table 60. Displace. As the displacement angle increases, the adhesion area between the glass plate P and the double-sided adhesive sheet S gradually decreases, and when the arm 61 rotates to a certain standing angle, for example, approximately 45 degrees, the adhesion area between the two becomes smaller. The wafer W becomes zero, and the double-sided adhesive sheet S and the glass plate P force are completely peeled off and transferred to the wafer W holding frame RF.
- the arms 61 and 61 return to the initial horizontal posture.
- the adsorption table 60 is lowered in a direction to slightly lower the upper surface position, and the double-sided pressure-sensitive adhesive sheet S existing on the lower surface side of Ueno and W is kept so as not to adhere to the glass plate P again. It is.
- the ring frame RF returned to the initial horizontal posture and the wafer W transferred to and integrated with the ring frame RF are sucked and held by the reverse suction arm 93 of the reverse transfer device 88, and are positioned on the upper and lower surfaces.
- the wafer W on the peeling table 100 is in a state where the double-sided pressure-sensitive adhesive sheet S appears on the upper surface side.
- the glass plate P remains in the suction table 60 of the transfer device 20, but the glass plate P is a glass plate removing device 80. It is adsorbed by the adsorbing arm 85 and accommodated in the collection table 86.
- the double-sided pressure-sensitive adhesive sheet S of the wafer W transferred to the ring frame RF is peeled when the peeling tape 100 passes under the peeling device 21. That is, as shown in FIG. 8 (A), when the peeling table 100 is moved below the peeling unit 105, the peeling tape supply unit 106 is lowered and the chuck 136 is operated by the cylinder 130 to release the peeling tape. P Move to the lead end side of T and pinch the lead end side from the top and bottom (see Fig. 8 (B))
- the second lifting plate 122 moves so as to protrude forward from the surface of the second lifting plate 122 by driving a cylinder (not shown). Therefore, there is no positional interference with the peeling tape PT.
- the heat block 129 of the welding unit 125 is lowered, a part of the peeling tape PT is welded to the outer peripheral portion of the double-sided pressure-sensitive adhesive sheet S, and the tip of the cutter blade 123 enters the cutter receiver 1 24 and peels off. Cut the tape PT (see Fig. 9 (B)). Then, after the peeling tape supply unit 106 and the peeling tape bonding unit 107 are lifted to form a moving space for the chuck 136, the chuck 136 holds the peeling tape PT and the right side in FIG. 9C. The double-sided PSA sheet S is peeled from the wafer W by moving to.
- the wafer W from which the double-sided pressure-sensitive adhesive sheet S has been peeled is adsorbed together with the ring frame RF and stored in the stock force 23, and after reaching a predetermined stock amount, post-processing such as dicing and die bonding. Is done.
- the processing object with the support plate in which the glass plate P is pasted on the circuit surface side of the wafer W through the double-sided adhesive sheet S as the processing object A is shown.
- the processing object which does not have the glass plate P can also be applied. That is, it may be an object to be processed with a protective sheet in which the protective sheet is only attached to the circuit surface side of the wafer W.
- the transfer device 20 can be used as an intermediate table when the wafer W integrated with the ring frame RF is transferred to the peeling table 100.
- Examples of the detection means include a limited reflection sensor, a mass meter, a mark detection sensor, and the like. These include the slide table 27 of the ultraviolet irradiation unit 28, the central table 31 of the alignment device 16, or the mount table 40 of the mounting device 17. Can be provided.
- the limited reflection sensor is set to a reflection distance from the wafer W on which the glass plate P is provided, an NG signal is output to the object to be processed having a reflection distance other than that. In this case, it is sufficient to program so as to pass without driving the driving means 64 of the transfer device 20.
- the mark detection sensor only needs to detect the mark on the glass plate P.
- the brittle member is the semiconductor wafer W
- the present invention can also be applied to a case where another brittle plate is transferred.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/791,481 US20080044258A1 (en) | 2004-11-29 | 2005-11-28 | Fragile Member Processing System |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-343736 | 2004-11-29 | ||
JP2004343736A JP2006156633A (ja) | 2004-11-29 | 2004-11-29 | 脆質部材の処理装置 |
Publications (1)
Publication Number | Publication Date |
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WO2006057376A1 true WO2006057376A1 (ja) | 2006-06-01 |
Family
ID=36498109
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/021755 WO2006057376A1 (ja) | 2004-11-29 | 2005-11-28 | 脆質部材の処理装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20080044258A1 (ja) |
JP (1) | JP2006156633A (ja) |
CN (1) | CN101065839A (ja) |
TW (1) | TW200633113A (ja) |
WO (1) | WO2006057376A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114678305A (zh) * | 2022-05-26 | 2022-06-28 | 四川上特科技有限公司 | 一种晶圆片覆膜装置及晶圆裂片装置 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4746003B2 (ja) * | 2007-05-07 | 2011-08-10 | リンテック株式会社 | 移載装置及び移載方法 |
JP4746002B2 (ja) * | 2007-05-07 | 2011-08-10 | リンテック株式会社 | 移載装置及び移載方法 |
JP4964107B2 (ja) | 2007-12-03 | 2012-06-27 | 東京応化工業株式会社 | 剥離装置 |
JP4976320B2 (ja) * | 2008-02-25 | 2012-07-18 | 日東電工株式会社 | 粘着テープ貼付け装置 |
JP4740298B2 (ja) * | 2008-09-04 | 2011-08-03 | リンテック株式会社 | シート剥離装置及び剥離方法 |
JP2010073955A (ja) * | 2008-09-19 | 2010-04-02 | Lintec Corp | シート貼付装置及び貼付方法 |
JP5426884B2 (ja) * | 2009-01-16 | 2014-02-26 | リンテック株式会社 | シート剥離装置および剥離方法 |
CN101850538B (zh) * | 2009-04-01 | 2012-10-10 | 日月光半导体制造股份有限公司 | 晶圆的支撑治具与研磨、输送及切割晶圆的方法 |
JP4761088B1 (ja) * | 2010-03-29 | 2011-08-31 | 株式会社東京精密 | ダイシング装置及びダイシング方法 |
JP5639958B2 (ja) * | 2011-05-27 | 2014-12-10 | 日東電工株式会社 | 半導体ウエハマウント方法および半導体ウエハマウント装置 |
JP6076884B2 (ja) * | 2013-11-19 | 2017-02-08 | 東京エレクトロン株式会社 | 剥離システム |
JP6285305B2 (ja) * | 2014-07-22 | 2018-02-28 | 住友化学株式会社 | 半導体製造装置及び半導体の製造方法 |
US11004720B2 (en) | 2018-05-23 | 2021-05-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for ring frame cleaning and inspection |
CN109926914A (zh) * | 2019-04-24 | 2019-06-25 | 蚌埠中光电科技有限公司 | 一种浮法tft-lcd玻璃面研磨剥片装置 |
JP7464472B2 (ja) * | 2020-07-17 | 2024-04-09 | 株式会社ディスコ | 加工装置 |
JP2022128193A (ja) * | 2021-02-22 | 2022-09-01 | 株式会社ディスコ | 加工装置 |
JP2022129302A (ja) * | 2021-02-24 | 2022-09-05 | 株式会社東京精密 | テープ貼付装置及びテープマガジン |
Citations (2)
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JP2002373871A (ja) * | 2001-06-15 | 2002-12-26 | Sekisui Chem Co Ltd | Icチップの製造方法 |
JP2003077988A (ja) * | 2001-09-06 | 2003-03-14 | Nitto Denko Corp | 半導体ウエハのマウント方法およびこれに用いるカセット |
Family Cites Families (2)
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FR2823373B1 (fr) * | 2001-04-10 | 2005-02-04 | Soitec Silicon On Insulator | Dispositif de coupe de couche d'un substrat, et procede associe |
JP2004079613A (ja) * | 2002-08-12 | 2004-03-11 | Disco Abrasive Syst Ltd | 半導体ウェーハ移し替え装置 |
-
2004
- 2004-11-29 JP JP2004343736A patent/JP2006156633A/ja active Pending
-
2005
- 2005-11-28 WO PCT/JP2005/021755 patent/WO2006057376A1/ja active Application Filing
- 2005-11-28 US US11/791,481 patent/US20080044258A1/en not_active Abandoned
- 2005-11-28 TW TW094141748A patent/TW200633113A/zh unknown
- 2005-11-28 CN CNA2005800406071A patent/CN101065839A/zh active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002373871A (ja) * | 2001-06-15 | 2002-12-26 | Sekisui Chem Co Ltd | Icチップの製造方法 |
JP2003077988A (ja) * | 2001-09-06 | 2003-03-14 | Nitto Denko Corp | 半導体ウエハのマウント方法およびこれに用いるカセット |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114678305A (zh) * | 2022-05-26 | 2022-06-28 | 四川上特科技有限公司 | 一种晶圆片覆膜装置及晶圆裂片装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101065839A (zh) | 2007-10-31 |
TW200633113A (en) | 2006-09-16 |
US20080044258A1 (en) | 2008-02-21 |
JP2006156633A (ja) | 2006-06-15 |
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