WO2005096367A1 - 加熱装置及びリフロー装置,はんだバンプ形成方法及び装置 - Google Patents
加熱装置及びリフロー装置,はんだバンプ形成方法及び装置 Download PDFInfo
- Publication number
- WO2005096367A1 WO2005096367A1 PCT/JP2005/005909 JP2005005909W WO2005096367A1 WO 2005096367 A1 WO2005096367 A1 WO 2005096367A1 JP 2005005909 W JP2005005909 W JP 2005005909W WO 2005096367 A1 WO2005096367 A1 WO 2005096367A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- solder
- heating
- reflow
- jig
- Prior art date
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/02—Supplying steam, vapour, gases, or liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/05099—Material
- H01L2224/051—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/05138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H05K3/3494—Heating methods for reflowing of solder
Definitions
- the present invention relates to a heating device optimal for heating, for example, solder, and a reflow device using the heating device. Furthermore, the present invention relates to a method and an apparatus for forming a solder bump used for producing a FC (flip chip) or a BGA (ball grid array) by forming a projecting solder bump on a semiconductor substrate or an interposer substrate, for example.
- a solder bump used for producing a FC (flip chip) or a BGA (ball grid array) by forming a projecting solder bump on a semiconductor substrate or an interposer substrate, for example.
- a conventional general method of forming a solder bump is to apply a solder paste on a pad electrode of a substrate using a screen printing method or a dispensing method, and then reflow the solder paste by heating the solder paste. there were.
- the solder paste is also called “cream solder”.
- solder paste An example of the solder paste is disclosed in Patent Document 1!
- the solder paste described in Patent Document 1 has an oxide film formed on the surface of solder particles by flowing the solder particles in the air. It is said that the forcedly formed oxide film resists the action of the flux during the reflow and suppresses the coalescence of the solder particles. Therefore, if this solder paste is applied over the board by solid coating and reflowed, solder bridges will be generated between the pad electrodes, which is suitable for high density and miniaturization of the node / node electrodes. is there. It should be noted that the solder bridge between the node / node electrodes is a phenomenon that occurs because the solder particles unite with each other to form a large lump and come into contact with both adjacent pad electrodes.
- a reflow device In the reflow step, a reflow device is used.
- this reflow device there is known a device in which a substrate is directly mounted on a panel heater and the substrate is heated by heat conduction from a panel heater (first conventional example).
- this reflow apparatus has a disadvantage that the heat distribution of the substrate becomes non-uniform due to slight warpage or unevenness of the substrate.
- a reflow apparatus in which a gap is provided between a panel heater and a substrate and the substrate is heated by heat radiation from a panel heater (second conventional example).
- this reflow device has a drawback that the heating power is insufficient.
- a reflow device that overcomes the drawbacks of the first and second conventional examples
- a substrate has been developed in which the substrate is heated by applying hot air thereto (third conventional example, for example, Patent Document 2 below).
- this reflow apparatus by providing a gap between the hot air outlet and the substrate and heating the substrate by applying the vertical force of the hot air, the substrate can be uniformly heated, and a sufficient force can be obtained.
- Patent Document 1 JP-A-2000-94179
- Patent Document 2 JP-A-5-92257
- the screen printing method and the dispensing method have become unable to cope with further increasing the number of electrodes, increasing the density, and reducing the size. That is, in the screen printing method, it is necessary to make the opening of the metal mask finer, so that there are problems that the mechanical strength of the metal mask is reduced and that the solder paste hardly comes out of the opening of the metal mask. Was. In the dispense method, the solder paste is applied one by one on a large number of pad electrodes, so that the more pad electrodes, the less suitable for mass production.
- the thickness of the oxide film of the solder particles must be accurately formed. This is because if it is too thick, the solder will not wet the pad electrode, and if it is too thin, the solder particles will coalesce. Since the action of the flux also changes depending on the state and type of flux, it was necessary to control the thickness of the oxide film accurately in accordance with these. On the other hand, if an oxide film having an appropriate thickness cannot be formed, it is not possible to achieve high-density and miniaturization of the node electrode. Therefore, although the solder paste of Patent Document 1 enables solid coating without the need for a precise mask, it has been difficult to respond to recent demands for higher density and finer design.
- the solder paste on the substrate is sometimes oxidized, so that the solder bumps cannot be formed in some cases. This is thought to be because many heated oxygen molecules come into contact with the solder paste surface due to the use of hot air.
- hot air when hot air is blown directly to form solder bumps on fine electrodes, the quality of solder bumps is not stable due to the effect of the hot air. Particles are also generated by hot air In some cases, it was sprayed on the substrate and attached to the solder bumps. This problem also occurs when hot air is blown only under the substrate. The reason is that the hot air goes over the lower substrate of the substrate.
- An object of the present invention is to provide a solder bump forming method and apparatus capable of meeting recent demands for higher density and finer solder bumps. It is a further object of the present invention to provide a heating device, a reflow device, and the like, which can suppress oxidation of a solder paste even when heated using hot air, stabilize the quality, and reduce the influence of particles. It is in. A second object of the present invention is to provide a heating device, a reflow device, and the like which can form a solder bump made of a liquid solder composition even when heated using hot air.
- a method for forming a solder bump according to the present invention includes a coating step of depositing a solder composition in a layer on a substrate provided with a plurality of pad electrodes separated from each other; And a reflow step of heating and reflowing the composition. Then, as the solder composition, a solder composition comprising a mixture of solder particles and a liquid material containing a flux component and having a property of being liquid at room temperature or during heating is used. In the reflow step, the solder composition on the substrate side is heated.
- the solder composition is liquid at room temperature or becomes liquid during heating. To obtain such properties (fluidity), it is required that the viscosity of the liquid material be low, the mixing ratio of the solder particles be small, and the particle size of the solder particles be small. During heating, the solder particles are floating or settling in the liquid material.
- the solder composition also includes a conventional solder paste as long as it becomes liquid during heating.
- solder composition on the substrate is heated from the substrate side, the temperature of the solder composition becomes lower on the surface and lower on the substrate side. Then, the lower solder particles near the node electrode begin to melt first, and when melted, spread on the pad electrode. At that time, the solder particles above the nod electrode force are not sufficiently melted yet. Therefore, since the chances of the solder particles coalescing can be reduced, the occurrence of solder bridges is also suppressed.
- the entire surface including the plurality of bump electrodes and the gaps between them is entirely covered. May be deposited in layers. That is, so-called “solid coating” can be performed using screen printing or a dispenser (discharger). Even if the solder composition is placed between the node / node electrodes, coalescence of the solder particles during reflow is suppressed, so that the occurrence of solder bridges between the bump electrodes is also suppressed. Therefore, solder bumps can be formed with high density and fineness even with a solid coating that does not require the precision required by using a precisely processed metal mask.
- solder particles coming into contact with the node electrode are melted to form a wet-spread solder film on the pad electrode.
- solder particles may be further combined with the solder film.
- Such a heat state is realized by controlling the temperature profile and the temperature distribution.
- the solder composition may be provided with a temperature difference such that the surface side is low and the substrate side is high, so that the solder particle force close to the substrate side is first settled. If a temperature difference is provided such that the surface side of the solder composition is low and the substrate side of the solder composition is high, the viscosity of the liquid material decreases as the temperature increases. It begins to settle and melt on the surface, and when it comes into contact with the pad electrode, it spreads out. At that time, the upper solder particles, which are far from the node / node electrode force, have not yet sufficiently settled and melted. Therefore, since the chances of the solder particles coalescing can be further reduced, the occurrence of solder bridges is further suppressed. Further, such a heating state is realized by controlling the temperature profile and the temperature distribution and adjusting the relationship between the temperature dependence of the viscosity of the liquid material and the melting point of the solder particles.
- the solder particles may be supplied to the pad electrode using convection of the liquid material.
- convection occurs in the liquid material, which causes the solder particles to move through the liquid material. Therefore, the solder particles not deposited on the pad electrode also move to the pad electrode and become a part of the solder bump. Therefore, solder particles are used effectively.
- the substrate may be placed in a container and heated in a state where the substrate is immersed in the solder composition in the container. During the heating, the gap between the substrate and the container is also filled with the liquid solder composition. Therefore, heat conduction from the container to the substrate becomes uniform .
- the size (height) of the solder bump is changed by adjusting the printing thickness and the content of the solder particles.
- the thickness (height) of the solder bump can be easily changed because the thickness of the solder composition on the substrate can be arbitrarily changed by adjusting the amount of the solder composition deposited. be changed.
- the solder bump forming apparatus forms a solder bump by heating and reflowing a solder composition on a substrate on which a plurality of pad electrodes are separately provided.
- the solder composition used at this time is composed of a mixture of solder particles and a liquid material having a flux action, and has a property of becoming liquid at room temperature or during heating.
- the solder bump forming apparatus according to the present invention includes heating means for heating the solder composition from the substrate side. Further, the apparatus may further include a temperature control means for controlling the temperature of the solder composition on the substrate. In this case, a desired temperature difference can be realized in which the surface side of the solder composition is low and the substrate side is high.
- the apparatus may further include a container for housing the substrate and the solder composition on the substrate, and the heating means may heat the solder composition from the substrate side through the container.
- the substrate may be a flat plate
- the container may have a flat bottom surface on which the substrate is placed and a peripheral wall for preventing the liquid solder composition from overflowing.
- the solder bump forming apparatus according to the present invention also has the same operation as the above-described solder bump forming method according to the present invention.
- the liquid material of the solder composition is, for example, a liquid.
- the liquid material contains a flux component whose reaction temperature is near the melting point of the solder particles, and has a viscosity that flows at room temperature and deposits in a layer on the base material.
- the solder particles are granules that have a mixing ratio and a particle size that allow the liquid to settle toward the base material and be uniformly dispersed in the liquid.
- this solder yarn composition When this solder yarn composition is dropped on a flat surface at room temperature, it spreads by its own weight and has a uniform thickness, and is completely different from a solder paste in this point.
- the mixing ratio of the solder particles is small, and the particle size of the solder particles is small.
- the mixing ratio of the solder particles is preferably 30 wt% or less, more preferably 20 wt% or less, and most preferably 10 wt% or less. It is.
- the size of the solder particles is preferably 35 ⁇ m or less, more preferably 20 ⁇ m or less, and most preferably 10 ⁇ m or less.
- This solder composition may have the following configuration.
- the surface oxide film of the solder particles has only a natural oxide film.
- the flux component of the liquid material promotes soldering between the solder particles and the base material while suppressing the coalescence of the solder particles with the reaction product while being heated above the melting point of the solder particles. It promotes coalescence between the solder film and the solder particles formed on the base material. Such a component of the flux action was discovered by the present inventors through repeated experiments and considerations.
- Examples of such a component include an acid.
- Acids can be broadly classified into inorganic acids (for example, hydrochloric acid) and organic acids (for example, fatty acids).
- organic acids for example, fatty acids.
- an organic acid will be described as an example.
- the organic acid has a small effect of coalescing solder particles, but has a large effect of causing solder wetting on the pad electrode”.
- the reasons for this effect are as follows (1) and (2).
- the organic acid has a function of spreading the solder particles on the base material to alloy the interface, and a function of uniting the solder particles with the solder film formed on the base material.
- the solder particles hardly coalesce, the mechanism by which solder wetting occurs on the base metal is unclear. It is presumed that some reaction between the solder particles and the base material has occurred to break down a slight oxide film. For example, in the case of a gold-plated base material, due to the diffusion effect of gold into the solder, solder wetting occurs even if the solder particles have a thin oxide film.
- solder particles coalesce with the solder film thus formed may be, for example, surface tension.
- the liquid mixed with the solder particles may be fats and oils, and the component contained in the liquids may be free fatty acids contained in the fats and oils.
- Oils and fats are widely available for a variety of uses, so they are easily available, inexpensive, and harmless, and they originally contain organic acids called free fatty acids.
- fatty acid esters eg, neopentyl polyol ester
- the acid value of the fat or oil is 1 or more. Acid value refers to the number of milligrams of potassium hydroxide required to neutralize free fatty acids contained in fats and oils.
- trimethylpropane trioleate a kinematic viscosity at 40 ° C of 3 mm 2 Zs, a kinematic viscosity at 100 ° C of 9.2 mm Vs, and an acid value of 2.4.
- the fats and oils used in the solder composition used in the present invention are present until the bump formation is completed, and during that time, the solder is prevented from coming into direct contact with air, thereby suppressing the oxidation of the solder.
- the organic acid contained in the fat or oil contributes to the removal of the oxide film on the solder surface, its content is controlled so that the oxide film on the solder surface is not completely removed. This makes it possible to realize a state in which soldering can be performed on the surface of the base material while suppressing coalescence of the solder particles.
- the organic acid needs to have an amount sufficient to remove the oxidized film on the surface of the base material. Therefore, the acid value of the fat is preferably 1 or more.
- the solder composition used in the present invention may contain an organic acid in fats and oils.
- This organic acid may be one originally contained in fats and oils, or one added later.
- the organic acid has an effect of reducing the solder particles and the oxide film of the base material.
- the present inventor has found that by appropriately controlling the amount of organic acid in the fat or oil and leaving a slight oxidation film on the surface of the solder particles, it is possible to suppress the coalescence of the solder particles and to form the solder on the base material. Found that it is possible to attach them.
- an organic acid tin salt is obtained as a by-product in a process in which the organic acid reduces the acid film on the solder surface.
- the present inventor has also found that the value of (1) is significantly reduced. By controlling these phenomena, it is possible to prevent solder particles from coalescing, A solder bump free from short-circuit can be formed on the upper surface.
- the "solder” is not limited to solder bump formation, but also includes a so-called “soft solder” used for semiconductor chip die bonding or, for example, copper tube bonding. Not only that, but of course lead-free solder is also included.
- solder bumps are not limited to hemispherical or protruding ones, but include film-shaped ones.
- the “solder film” is not limited to a film-like film, but also includes a hemispherical or projecting film.
- the “substrate” includes a semiconductor wafer, a wiring board, and the like.
- the "liquid material” may be a fluid or the like in addition to a liquid, and may be a fluorine-based high-boiling solvent or a fluorine-based oil in addition to oils and fats.
- a pad is formed by using a solder composition having a property of becoming liquid at normal temperature or during heating, and heating the solder composition on the substrate from the substrate side. It is possible to create a state in which the lower solder particles close to the electrode are first melted and spread to the pad electrode, while the upper solder particles far from the pad electrode are not sufficiently melted. Therefore, it is possible to reduce the chance that the solder particles coalesce, thereby suppressing the occurrence of solder bridges. Therefore, high-density and fine solder bumps can be formed.
- solder composition Even when the solder composition is placed on the substrate by solid coating, the coalescence of solder particles during reflow is suppressed, so that the occurrence of solder bridges can be suppressed. Bumps can be formed with high density and fineness.
- solder particle force close to the substrate side by lowering the solder particle force close to the substrate side first, the lower solder particles close to the pad electrode are first settled and melted to spread and spread on the pad electrode. A state can be created in which the far upper solder particles are not sufficiently settled and melted. Therefore, the chance that the solder particles coalesce can be further reduced, whereby the occurrence of solder bridges can be further suppressed.
- solder particles can be effectively used without waste.
- the substrate is placed in a container, and the substrate is heated in a state where the substrate is immersed in the solder composition, so that the liquid solder composition is also applied to the gap between the substrate and the container. Because it can be filled and heated, heat conduction from the container to the substrate can be made uniform. Therefore, since a large number of solder bumps can be formed simultaneously under the same conditions, it is possible to reduce variations in the production of solder bumps.
- the size (height) of the solder bump can be easily changed by adjusting the amount of the solder composition and the amount of the solder composition placed on the substrate.
- the heating device includes a mounting table for mounting a substrate or a jig on which the substrate is mounted (hereinafter, the substrate or the jig is referred to as a “substrate or the like”), a substrate formed on the mounting table, And a heating means for blowing hot air to the lower side of the opening force substrate or the like.
- a substrate or the like is placed on the mounting table, the opening is closed by the substrate or the like. Therefore, the hot air only blows on the lower side of the substrate or the like in the opening and does not blow out from the opening. Therefore, since hot air does not flow over the substrate, the solder paste on the substrate can be prevented from oxidizing.
- the heating device of the present invention it is possible to form a solder bump with a liquid solder composition while heating using hot air.
- the first reason is that, like the case of the solder paste, the solder composition can be prevented from oxidizing.
- the second reason is the force that causes the temperature distribution to be low on the surface side of the solder composition and high on the substrate side. It is believed that for at least one of these reasons, solder bumps can be formed from the liquid solder composition. The second reason will be described later.
- a hot air circulation path for returning the hot air applied to the lower side of the substrate or the like to the heating means again may be further provided.
- the hot air flowing onto the substrate can be further reduced. Since the heat can also be used effectively, energy can be saved.
- a temperature adjusting means for adjusting the temperature of the substrate may be further provided!
- the temperature control means includes, for example, a heat absorbing plate positioned above and separated from the substrate, and a heat absorbing portion for cooling the heat absorbing plate.
- the heat-absorbing section is, for example, an air-cooling mechanism or a water-cooling mechanism.
- the temperature control means may be configured to include a radiation plate for heating the substrate with radiant heat and a heating unit for heating the radiation plate.
- a holding mechanism for fixing a substrate or the like to the mounting table may be further provided. Depending on the weight of the substrate or the like and the pressure of the hot air, the substrate or the like may be blown off or displaced by the hot air. In such a case, a holding mechanism is provided to fix the substrate and the like.
- the jig may be a container that holds the substrate immersed in the liquid solder composition.
- the container may have a flat bottom surface on which the substrate is placed, and a peripheral wall for preventing the overflow of the solder composition.
- the gap between the substrate and the container is also filled with the liquid solder composition. Therefore, heat conduction from the container to the substrate becomes more uniform.
- the size (height) of the solder bump is changed by adjusting the printing thickness and the content of the solder particles.
- the thickness of the solder composition on the substrate can be arbitrarily changed only by adjusting the mounting amount of the solder composition. . Therefore, the size (height) of the solder bump can be easily changed.
- the solder composition is not liquid at room temperature, but may be liquid when heated.
- a preheating unit, a reflow unit, and a cooling unit provided at least one each are arranged in this order, a substrate or the like is transported in this order by a transport mechanism, and a preliminary unit is controlled by a control unit. It controls each operation of the heating section, reflow section, cooling section and transport mechanism. And the preheating part and the reflow part also become the heating device power according to the present invention.
- the heating device according to the present invention for the preliminary heating section and the reflow section, oxidization of solder paste on the substrate can be suppressed.
- the cooling unit may be omitted.
- the heating means provided in the heating means may be a means for heating by hot air or a means for heating by heat conduction.
- the preheating section, the reflow section, and the cooling section may be arranged concentrically.
- the entrance and the exit for the transfer of the substrate and the like are in the same place. Therefore, for example, as compared with the case where these are arranged in a straight line, the transfer processing of the substrate and the like becomes easier, and the entire configuration is simpler and smaller.
- the transfer mechanism may include a vertical movement mechanism that moves the substrate and the like up and down with respect to the mounting table. Yes. In this case, the substrate or the like can be moved up and down and placed on the mounting table or lifted. Note that the transport mechanism may transport the substrate or the like horizontally without moving the substrate up and down.
- the control means may stop the operation of the hot air generator when the opening is not closed by the substrate or the like. In this case, it is possible to prevent the hot air from blowing out the opening force when the opening is not closed by the substrate or the like.
- the method of using the reflow device according to the present invention is to use a reflow device according to the present invention to continuously flow a plurality of substrates and the like, before, after or during a plurality of substrates and the like.
- a substrate or the like is allowed to flow.
- the dummy substrate or the like suppresses the blowing of hot air from the opening when the opening is not closed by the substrate or the like, and also suppresses fluctuations in the heat capacity seen from the heating device.
- the dummy substrate or the like may have the same shape as the substrate or the like. In this case, the fluctuation of the heat capacity seen from the heating device can be further suppressed.
- the liquid solder composition is a mixture of solder particles and a liquid material (base agent) having a flux action, and has the property of becoming liquid at room temperature or during heating. That is, the solder composition is liquid at room temperature or becomes liquid during heating. In order to obtain such properties (fluidity), it is required that the viscosity of the liquid material is low, the mixing ratio of the solder particles is small, and the particle size of the solder particles is small. During heating, the solder particles are floating or settling in the liquid material.
- the solder composition includes a conventional solder paste as long as it becomes liquid during heating.
- the solder composition is heated from the substrate side.
- the temperature of the solder yarn composition becomes lower on the surface and becomes higher on the substrate side. Then, the lower solder particles near the pad electrode begin to melt first, and if melted, spread on the pad electrode. At that time, the upper solder particles, which are far from the pad electrode force, have not yet sufficiently melted. Therefore, the chance of the solder particles coalescing can be reduced, so that the occurrence of solder bridges is also suppressed.
- the pad electrode is heated to a temperature equal to or higher than the melting point of the solder particles, and the pad electrode is heated.
- the solder particles may be melted to form a solder coating that spreads over the pad electrodes, and the solder particles may be further combined with the solder coating.
- Such a heating state is realized by controlling the temperature profile and the temperature distribution. For example, it is effective to heat the solder composition on the substrate from the substrate side and to control the temperature from the surface side of the solder composition.
- a temperature difference is provided in the solder composition such that the surface side is low and the substrate side is high, so that the solder composition is settled on the solder particles near the substrate side. If a temperature difference is set so that the surface side of the solder composition is low and the substrate side of the solder composition is high, the viscosity of the liquid material decreases as the temperature increases, so that the solder particles below the pad electrode settle down first. It begins to melt and spreads when it comes into contact with the pad electrode. At that time, the upper solder particles, far from the pad electrode force, have not yet sufficiently settled and melted.
- Such a heating state is realized by controlling the temperature profile and the temperature distribution, and adjusting the relationship between the temperature dependence of the viscosity of the liquid material and the melting point of the solder particles.
- the mounting table on which the substrate and the like are mounted the opening formed on the mounting table and closed by the mounting of the substrate and the like, and the opening force
- the hot air only hits the lower side of the substrate or the like and does not blow out from the opening, so that it is possible to prevent the hot air from flowing onto the substrate. Therefore, even if the substrate or the like is heated using hot air, it is possible to prevent the solder paste or the like on the substrate from being oxidized.
- a solder bump can be formed with a liquid solder composition while heating using hot air and heating. This is because the hot air can be prevented from wrapping around on the substrate, so that the solder composition does not oxidize, or the solder composition has a low surface side and a high temperature distribution on the substrate side.
- the hot air flowing onto the substrate can be further reduced, and the heat can be effectively used. Energy saving can be achieved.
- the temperature of the substrate can be adjusted. And the formation state of the solder bump can be easily controlled. In addition, it is possible to further suppress iridescence on the solder surface.
- the substrate or the like can be prevented from being blown off by hot air or displaced.
- the gap between the substrate and the container can be filled with the liquid solder composition and heated. Force The heat conduction to the substrate can be made more uniform. Therefore, since a large number of solder bumps can be formed simultaneously under the same conditions, it is possible to reduce variations in manufacturing solder bumps. In addition, the size (height) of the solder bump can be changed by adjusting the amount of the solder composition placed on the substrate.
- solder bumps can be formed with a liquid solder composition while heating using hot air.
- the opening can be performed when the opening is not closed by the substrates or the like.
- the blowing of hot air from the section can be suppressed.
- the fluctuation of the heat capacity seen from the heating device is reduced, the temperature fluctuation of the hot air can be suppressed.
- the heating device 50 is used for heating the solder composition 10 on the substrate 20, as shown in FIG. As shown in FIG. 1, the heating device 50 has a heating means 40 for heating the solder composition 10 from the substrate 20 side. The substrate 20 heated by the heating means 40 is immersed in the liquid solder composition 10 in the container 30. It is.
- the heating means 40 has a main heating source 42, a sub-heating source 43, a blower 44, a heat storage member 45, a hot air circulation datum 46, and an opening 47.
- the opening 47 is an opening formed to blow the hot air 41 onto the container 30.
- an electric heater is used as the main heating source 42 and the sub-heating source 43.
- the heat storage member 45 is made of, for example, aluminum material, and has a large number of through holes 48 through which the hot air 41 passes. Hot air 41 is circulated by blower 44.
- the hot air 41 passes through the circulation path of the main heating source 42 ⁇ heat storage member 45 ⁇ opening 47 (bottom of vessel 30) ⁇ circulation duct 46 ⁇ sub-heating source 43 ⁇ hot air circulation duct 46 ⁇ blower 44 ⁇ main heating source 42. Circulates. Since the heating means 40 heats the container 30 by applying the hot air 41 thereto, the entire substrate 20 can be more uniformly heated as compared with a means utilizing heat conduction.
- a mounting table 51 for supporting the container 30 is formed in a region surrounding the opening 47.
- the heating means 40 other than the mounting table 51 and the opening 47 constitutes a hot air generator 52.
- the opening 47 is covered by the bottom of the container 30, and the opening 47 is closed.
- the hot air generator 52 blows the hot air 41 from the opening 47 to the bottom of the container 30.
- the heating device 50 shown in FIG. 1 may be provided with a temperature control means 60 for controlling the temperature of the substrate 20 from the front surface side as necessary.
- the temperature control means 60 shown in FIG. 1 includes a main temperature control source 62, a sub-temperature control source 63, a blower 64, a cold storage (or heat storage) member 65, a circulation duct 66, an opening 67, a heat absorbing plate (or radiation plate) 68 It is also equal.
- the cold storage member 65 is made of, for example, an aluminum material, and has a large number of through holes 69 through which the temperature control medium 61 passes.
- the heat absorbing plate 68 is also made of, for example, aluminum material, and it is desirable that the solder composition 10 side be close to a black body.
- the temperature control medium 61 is circulated by the blower 64. That is, the temperature control medium 61 is composed of the main temperature control source 62 ⁇ the cold storage member 65 ⁇ the opening 67 (cooling the heat absorbing plate 68) ⁇ the circulation duct 66 ⁇ the sub temperature control source 63 ⁇ the circulation duct 66 ⁇ the blower 64 ⁇ the main temperature control Cycle with source 62. Further, the temperature control medium 61 may be any medium as long as it has a temperature at which the surface side of the solder composition 10 can be controlled.
- the heat absorbing plate 68 has a function of absorbing the heat of the substrate 20, and the structure of the temperature control means 60 other than the heat absorbing plate 68 absorbs the heat of the heat absorbing plate 68, thereby forming the heat absorbing plate 68. It constitutes a heat-absorbing part that continuously exerts the heat-absorbing function of 68.
- the main temperature control source 62 and the sub temperature control source 63 It functions as a function of cooling the temperature control medium 61.
- the temperature control means 60 has been described as having a configuration in which the heat of the substrate 20 is removed so as to have a temperature difference between the surface side of the solder composition and the substrate side, but is not limited thereto. Absent.
- the temperature control means 60 may be configured to heat the substrate 20 by radiant heat.
- the heat absorbing plate 68 functions as a radiating plate that heats the substrate 20 by radiant heat, and the configuration other than the radiating plate 68 continuously heats the radiating plate 68 by heating the radiating plate 68. It constitutes a heating section to be used.
- the main temperature control source 62 and the sub-temperature control source 63 exhibit a function of heating the temperature control medium 61.
- the heating temperature may be equal to or higher than the heating temperature of the heating means 40.
- Each of the temperature control means 60 does not directly contact the cold or hot air temperature control medium 61 with the solder composition 10 on the substrate 20, so that the solder composition 10 deposited in a layered manner has an adverse effect. Don't give.
- the heating device 50 When the heating device 50 is normally used, it is used for heating the solder composition 10 on the substrate 20 by the heating means 40. That is, the substrate 20 is immersed in the solder composition 10 filled in the container 30. Then, the container 30 is mounted on the mounting table 51, and the opening 47 is closed at the bottom of the container 30. Thus, a circulation path for the hot air 41 is formed.
- the hot air 41 When hot air 41 is generated by the heating means 40, the hot air 41 circulates through the circulation path, and the bottom of the container 30 is heated by the circulating hot air 41, and the substrate 20 is heated by receiving the heat. Since the hot air 41 does not flow over the container 30, the solder composition 10 on the substrate 20 is prevented from oxidizing.
- the heat from the heating means 40 does not flow to the solder composition 10 side, a temperature difference occurs as compared with the substrate 20 side.
- a state in which the temperature of the substrate 20 is higher and the temperature of the solder composition 10 is lower is generated.
- the melting of the solder particles 11 contained in the solder composition 10 is controlled as described later. That is, the solder particles 11 mixed in the liquid material 12 of the solder composition 10 settle in the liquid material 12 and are soldered to the electrodes of the substrate 20.
- the temperature of the solder composition 10 is low, the coalescence of the solder particles 11 settling in the liquid material 12 can be suppressed. Since the temperature on the substrate 20 side is high, the solder particles 12 And the solder particles 11 are soldered to the electrodes of the substrate 20.
- the temperature control means 60 may be used. That is, in the above description, since only the heating means 40 is used, the temperature of the solder composition 10 cannot be adjusted.However, by using the temperature adjusting means 60, the temperature of the solder composition 10 can be controlled. Accordingly, coalescence of the solder particles 11 settling in the liquid material 12 can be suppressed, and soldering to the electrode of the substrate 20 can be performed reliably.
- FIG. 2 is a cross-sectional view illustrating an example of a method of forming a solder bump using the heating device of FIG.
- FIG. 1 shows a state in which the solder composition is applied on the substrate, and the vertical direction is larger than the horizontal direction.
- the solder composition 10 used in the present embodiment also has a mixed power of a large number of solder particles 11 and a liquid material 12 that also includes fatty acid ester, and is used for forming a solder bump on the pad electrode 22.
- the liquid material 12 When the liquid material 12 is dropped onto the substrate 20 at room temperature, the liquid material 12 spreads under its own weight and becomes uniform in thickness, and the solder wetting by the solder particles 11 while being heated to the melting point of the solder particles 11 or more causes the pad electrode 22 It has a flux action that causes bowing.
- the solder particles 11 have a mixing ratio and a particle size such that when dropped onto the substrate 20 together with the liquid material 12, the solder particles 11 are uniformly dispersed with the liquid material 12 by a wide force S.
- the solder particles 11 have only a natural oxide film (not shown) on the surface. Since the liquid 12 is a fatty acid ester, it originally contains a free fatty acid which is a kind of organic acid. The free fatty acid promotes the soldering between the solder particles 11 and the pad electrodes 22 while suppressing the coalescence of the solder particles 11 while being heated to a temperature equal to or higher than the melting point of the solder particles 11. It has an effect of promoting coalescence between the solder film formed on the substrate and the solder particles 11.
- the organic acid contained in the liquid material 12 may be added as necessary. That is, the organic acid content of the liquid 12 is adjusted according to the degree of oxidation and the amount of the solder particles 11. For example, when forming a large amount of solder bumps, the amount of solder particles 11 is also large, so all It is necessary to contain an organic acid sufficient to reduce the oxide film of the solder particles 11. On the other hand, when an excessive amount of solder particles 11 more than used for bump formation is added, the content of organic acid is reduced to lower the activating force of the liquid material 12 so that the particle size distribution of the solder powder is reduced. However, it is also possible to form an optimum bump only with relatively large solder particles 11 without dissolving the solder particles 11 on the fine side. At this time, the fine solder particles 11 remaining without melting also have an effect of reducing the shortage of the nod electrode 22 by preventing the coalescence of the solder particles 11.
- solder particles 11 need to be uniformly dispersed in the liquid material 12, it is desirable that the solder composition 10 be stirred immediately before use.
- the material of the solder particles 11 is tin-lead solder or lead-free solder.
- the diameter b of the solder particles 11 may be smaller than the shortest distance a between the peripheral ends of the adjacent pad electrodes 22.
- the solder composition 10 is dropped on the substrate 20 having the node / node electrode 22 by natural fall at room temperature. With this alone, the solder composition 10 having a uniform thickness can be applied onto the substrate 20. That is, a coating film of the solder composition 10 having a uniform film thickness can be formed on the substrate 20 without using a screen printing dispenser. Since the uniformity of the coating affects the variation of the solder bump, the coating should be as uniform as possible. Thereafter, the entire substrate 20 is uniformly heated, so that solder bumps can be formed. Heating increases the temperature above the solder melting point in a short time. By raising the temperature in a short time, a decrease in the activity of the organic acid during the process can be suppressed.
- Substrate 20 is a silicon wafer.
- a pad electrode 22 is formed on the surface 21 of the substrate 20, a pad electrode 22 is formed.
- a solder bump is formed by the forming method of the present embodiment.
- the board 20 is electrically and mechanically connected to other semiconductor chips and wiring boards via solder bumps.
- the pad electrode 22 has, for example, a circular shape and a diameter c of, for example, 40 / zm.
- the distance d between the centers of the adjacent pad electrodes 22 is, for example, 80 / zm.
- the diameter b of the solder particles 14 is, for example, 3 to 15 ⁇ .
- the pad electrode 22 also acts as an aluminum electrode 24 formed on the substrate 20, a nickel layer 25 formed on the aluminum electrode 24, and a gold layer 26 formed on the nickel layer 25. .
- the underlayer 25 and the gold layer 26 are UBM (under barrier metal or under bump metallurgy) layers.
- the portion other than the pad electrode 22 on the substrate 20 is covered with a protective film 27.
- an aluminum electrode 24 is formed on the substrate 20, and a protective film 27 is formed on a portion other than the aluminum electrode 24 with a polyimide resin or a silicon nitride film. These are formed by using, for example, a photolithography technique and an etching technique. Subsequently, after performing a zincate treatment on the surface of the aluminum electrode 24, a nickel layer 25 and a gold layer 26 are formed on the aluminum electrode 24 using an electroless plating method. The reason for providing this UBM layer is to impart solder wettability to the aluminum electrode 24.
- Examples of the material of the solder particles 11 include Sn—Pb (melting point: 183 ° C.), Sn—Ag—Cu (melting point: 218 ° C.), Sn—Ag (melting point: 221 ° C.), and Sn—Cu (melting point: 227 ° C) and use other lead-free solder.
- the heating means 40 also serves as a blower, an electric heater or the like as described above, and heats the solder composition 10 from the substrate 20 side (lower side) by applying hot air 41.
- FIGS. 3 and 4 are cross-sectional views showing one example of a method of forming a solder bump using the heating device of FIG.
- FIG. 3 shows a dropping process, and the process proceeds in the order of FIG. 3 [1] to FIG. 3 [3].
- FIG. 4 shows a reflow process, and the process proceeds in the order of FIG. 4 [1] to FIG. 4 [3].
- the following is a description based on these drawings. However, the description of the same parts as those in FIG. 2 will be omitted by retaining the same reference numerals.
- the above-described “container 30” will be referred to as “receiving container 30”.
- FIG. 3 does not show the pad electrode 22 on the substrate 20.
- the substrate 20 is placed in the receiving container 30.
- the solder composition 10 is agitated in the pouring container 31 as necessary, the solder composition 10 is dropped onto the substrate 20 from the pouring port 32.
- the solder composition 10 spreads by its own weight and has a uniform thickness.
- the natural force of the solder composition 10 can also be used at room temperature.
- the solder composition 10 may be applied onto the substrate 20 using a printing machine or a discharging machine.
- the receiving container 30 Since the receiving container 30 is heated together with the substrate 20 in the reflow process, the receiving container 30 is heat-resistant, has good heat conduction, and does not cause solder wetting by the solder particles 11. It is made of nimu. Further, the receiving container 30 has a flat bottom surface 33 on which the flat substrate 20 is placed, and a peripheral wall 34 for preventing the solder composition 10 from overflowing. In this case, since the substrate 20 is in close contact with the bottom surface 33 of the receiving container 30, heat conduction is improved. 2 and 4, the illustration of the receiving container 30 is omitted.
- the solder composition 10 on the substrate 20 may be made to have a uniform thickness by rotating the substrate 10 horizontally. To rotate board 10 horizontally
- a spin coater commercially available may be used.
- FIG. 3 [2] shows a case where the substrate 20 is not immersed in the solder composition 10.
- the thickness tl of the solder composition 10 on the substrate 20 is a value mainly determined by the surface tension and the viscosity of the solder composition 10.
- FIG. 3 [3] shows a case where the substrate 20 is immersed in the solder composition 10.
- the thickness t2 of the solder composition 10 on the substrate 20 can be set to a desired value according to the amount of the solder composition 10 to be dropped.
- the solder composition 10 is placed by solid coating on the substrate 20 on which the plurality of pad electrodes 22 are separately provided. At this time, the solder composition 10 is entirely placed on the surface including the plurality of bump electrodes 22 and the protective film 27 in the gap therebetween.
- the solder composition 10 is just like an ink.
- the solder composition 10 is heated to a temperature equal to or higher than the melting point of the solder particles 11.
- the temperature of the solder composition 10 becomes lower toward the surface and lower at the substrate 20 side.
- the lower solder particles 11 near the pad electrode 22 begin to melt first, and if melted, spread on the pad electrode 22.
- the upper solder particles 11 far from the pad electrode 22 have not yet sufficiently melted. Therefore, the opportunity for the solder particles 11 to coalesce is reduced. Since it can be reduced, the occurrence of solder bridges is also suppressed.
- the node / node electrode 22 is heated to a temperature equal to or higher than the melting point of the solder particles 11, and the solder particles 11 in contact with the pad electrodes 22 are melted and spread on the pad electrodes 22.
- a solder coating 23 ' is formed, and the solder particles 11 are further united with the solder coating 23'.
- the following state is caused by the action of the organic acid contained in the liquid material 12.
- coalescence of the solder particles 11 is suppressed.
- some of the solder particles 11 coalesce and become larger. That is, there is no problem if the solder particles 11 coalesce with each other as long as they are equal to or smaller than a certain size.
- the solder particles 11 spread on the pad electrode 20 to form an alloy layer at the interface.
- a solder film 23 ' is formed on the pad electrode 20, and the solder particles 11 are further united with the solder film 23'. That is, the solder film 23 'grows to become the solder bump 23 as shown in FIG. 8 [3].
- solder particles 11 not used for forming the solder bumps 23 are washed away together with the remaining liquid material 12 in a later step.
- the solder composition 10 may be settled first from the solder particles 11 near the substrate 20 side by providing a temperature difference such that the surface side is low and the substrate 20 side is high. If a temperature difference is provided such that the surface side of the solder composition 10 is low and the substrate 20 side of the solder composition 10 is high, the viscosity of the liquid material 12 decreases as the temperature increases, so that the solder particles 11 below the pad electrode 22 First settles and begins to melt, and when it comes into contact with the pad electrode 22, it spreads out. At that time, the upper solder particles 11 far from the nod electrode 22 have not yet settled and melted sufficiently.
- such a heating state may be such that, for example, the solder composition 10 on the substrate 20 is heated from the substrate 20 side, the surface-side force of the solder composition 10 is also controlled, and the temperature dependency of the viscosity of the liquid material 12 is increased. This is achieved by adjusting the relationship between the melting point of the solder particles 11 and the like.
- the solder particles 11 may be supplied to the pad electrode 22 using the convection of the liquid material 12.
- the solder composition 10 is heated from the substrate 20 side, convection is generated in the liquid material 12, whereby the solder particles 11 move in the liquid material 12.
- the solder particles 11 that have not been placed on the pad electrode 22 and move to the become part of amplifier 23. Therefore, the solder particles 11 are effectively used.
- the force described in the case where the cooling function of the temperature control means 60 is exerted on the solder composition to form the solder bumps is not limited to this.
- the heating function of the temperature control means 60 may be exerted on the solder yarn composition to form the solder bumps! / ⁇ .
- the cooling function and the heating function of the temperature control means 60 may be switched and used to form a solder bump.
- FIG. 5 shows a second embodiment of the heating device according to the present invention
- FIG. 5 [1] is a partial plan view
- FIG. 5 [1] is a partial plan view
- FIG. 5 [2] is a sectional view taken along line VV in FIG. 5 [1].
- description will be made based on this drawing. However, the description of the same parts as in FIG. 1 will be omitted by giving the same reference numerals or not showing them.
- a pressing mechanism 55 for fixing the substrate 20 to the mounting table 51 is provided.
- the holding mechanism 55 has the same force as the plunger type solenoids 56a and 56b, and the top holding cams 57a and 57b.
- the solenoid 56a has one end 561 rotatably mounted on the mounting table 51 and the other end 562 rotatably mounted near the outer periphery of the holding cam 57a.
- the holding cam 57a is rotatably attached to the mounting table 51 via a center shaft 571.
- the solenoid 56b and the holding cam 57b have the same configuration.
- the solenoids 56a and 56b are in a contracted state, and the holding cams 57a and 57b are rotated at an angle for holding the substrate 20.
- the holding cams 57a, 57b rotate at an angle to loosen the substrate 20.
- the substrate 20 may be blown off or displaced by the hot air 41.
- the holding mechanism 55 is provided to fix the substrate 20.
- the holding mechanism 55 holds the substrate 20.
- the holding mechanism 55 may hold the container 30 (FIG. 1).
- FIG. 6 shows a state during heating
- FIG. 7 shows a state during transportation.
- the reflow device 70 of the present embodiment is provided with a preheating section 71, a reflow section 72, and a cooling section 73 arranged concentrically in this order, and includes a transfer mechanism 80 for transferring the containers 30 in this order. I have.
- An inlet / outlet section 74 is provided between the preheating section 71 and the cooling section 73.
- the heating device 10 described above is used for the preheating unit 71 and the reflow unit 72.
- the reflow device 70 shown in FIG. 8 is not limited to the force using the heating device 10 without the temperature control means 60.
- the heating device 10 having the temperature control means 60 shown in FIG. 1 may be used for the preheating section 71 and the reflow section 72.
- the cooling unit 73 the configuration of the heating means 40 of the heating device 10 in FIG. 1 is used. In this case, a cooling medium 61 is used instead of the medium 61 supplied by the heating means 40. Then, the substrate is gradually cooled by applying the cooling medium 61 through the opening 67 and contacting the container 30 from below.
- FIG. 8 and FIG. 9 show a transport mechanism in the reflow device in FIG. 6, FIG. 8 is a schematic cross-sectional view of the whole, and FIG. 9 is a perspective view of a container holding portion.
- FIGS. 3 and FIG. 4 the same parts as those in FIG.
- the transport mechanism 80 includes a central driving unit 81, four arms 82 attached to the driving unit 81, and a container holding unit 83 formed at the tip of the arm 82. Consists of The driving unit 81 also has a force with a center plate 84 that supports the four arms 82, an air cylinder 85 that moves the center plate 84 up and down, and a ring-shaped motor 86 that rotates the center plate 84 and the air cylinder 85 together.
- the container holding portion 83 has an annular shape, and has three convex portions 831 to 833 formed on the upper surface.
- the convex portions 831 to 833 engage with concave portions (not shown) formed on the bottom surface of the container 30.
- the container 30 is detachably fixed to the container holder 83 by the engagement of the convex portions 831 to 833 with the concave portions.
- FIG. 10 is a block diagram showing a control system in the reflow device of FIG. The following is a description based on this drawing. However, the same parts as those in FIG. 6 are denoted by the same reference numerals, and description thereof will be omitted.
- the reflow device 70 further includes a control unit 75 for controlling the operations of the preheating unit 71, the reflow unit 72, the cooling unit 73, and the transport mechanism 80.
- the control means 75 is, for example, a microcontroller. Computers and their programing skills.
- the control target of the control means 75 is the temperature and air volume of the preheating section 71, the reflow section 72 and the cooling section 73, the transport operation of the transport mechanism 80, and the like.
- the substrate 20 is placed in the container 30, and the solder composition 10 is dripped using a dispenser with a force.
- the container 30 is placed on the container holding portion 83 at the entrance / exit portion 74.
- the operation up to this point may be automated or performed by an operator.
- the container 30 is transported to the next preheating unit 71 by rotating the ring-shaped motor 86.
- the containers 30 located in the preheating section 71, the reflow section 72, and the cooling section 73 are also transported to the reflow section 72, the cooling section 73, and the inlet / outlet section 74, respectively.
- the air cylinder 85 is operated via an electromagnetic valve (not shown), and the container 30 is moved up and down together with the container holder 83.
- preheating section 71 container 30 is heated to a certain temperature by being heated for a certain time. Subsequently, the container 30 is transported to the next reflow section 72 by rotating the ring-shaped motor 86. In the reflow section 72, the container 30 is heated for a certain period of time, so that the solder composition 10 is reflowed. Subsequently, the container 30 is transported to the next cooling section 73 by rotating the ring-shaped motor 86. In the cooling section 73, the container 30 is cooled to a certain temperature by being heated for a certain time. Subsequently, the container 30 is transported to the next entrance 74 by rotating the ring-shaped motor 86. Here, by removing the container 30 from the container holding portion 83, the reflow step is completed.
- the reflow device 70 by using the heating means 40 for the preheating portion 71 and the reflow portion 72, it is possible to form a solder bump with the solder composition 10 while heating using the hot air 41. .
- the first reason is that since the hot air 41 does not flow around, the solder composition 10 is prevented from oxidizing.
- the second reason is that the temperature distribution on the surface side of the solder composition 10 is low and the temperature distribution on the substrate 20 side is high.
- the preheating unit 71 and the reflow unit 72 when the opening 47 is not closed by the container 30, as shown in FIG.
- the supply of the hot air may be stopped.
- the operation of the blower 44 It is stopped or the blowing of the hot air 41 is suppressed by using a shielding plate (not shown). This prevents the hot air 41 from blowing out from the opening 47 when the opening 47 is not closed by the container 30.
- a dummy container (not shown) is flowed before, after, or in the middle of the plurality of containers 30.
- the dummy container suppresses the blowing of hot air 41 from the opening portion 47 when the opening portion 47 is not closed by the container 30, and also suppresses the fluctuation of the heat capacity viewed from the heating means 40.
- the cooling unit 73 may be omitted.
- the present invention is not limited to the above embodiment.
- a silicon wafer FC
- a fine-pitch substrate or interposer or a wiring board (BGA) may be used.
- the electrode material is not limited to aluminum, but may be A1-Si, Al-Si-Cu, Al-Cu, Cu, or the like.
- FIG. 11 is a cross-sectional view illustrating a method for forming a solder bump according to an embodiment of the present invention.
- FIG. 11 shows a state in which the solder composition is applied on the substrate, and the vertical direction is larger than the horizontal direction.
- the solder composition 10 used in the present embodiment is composed of a mixture of a large number of solder particles 11 and a liquid (liquid material) 12 composed of a fatty acid ester, and forms a solder bump on the pad electrode 22.
- a liquid (liquid material) 12 composed of a fatty acid ester
- the liquid material 12 spreads under its own weight and spreads to a uniform thickness, and the solder wetting by the solder particles 11 while being heated to the melting point of the solder particles 11 or more is used as a pad. And a flux action to be caused on the electrode 22.
- the solder particles 11 have a mixing ratio and a particle size that, when dropped onto the substrate 20 together with the liquid material 12, spread and uniformly disperse with the liquid material 12.
- the surface oxide film of the solder particles 11 has only a natural oxide film (not shown). Since the liquid 12 is a fatty acid ester, it originally contains a free fatty acid, which is a kind of organic acid. The free fatty acid promotes the soldering between the solder particles 11 and the pad electrodes 22 while suppressing the coalescence of the solder particles 11 with the reaction product while being heated to the melting point of the solder particles 11 or higher. What is the solder film formed on the pad electrode 22? It has an effect of promoting coalescence with the solder particles 11.
- the organic acid contained in the liquid material 12 may be added as necessary. That is, the organic acid content of the liquid 12 is adjusted according to the degree of oxidation and the amount of the solder particles 11. For example, when a large amount of solder bumps are formed, the amount of the solder particles 11 becomes large, so that it is necessary to contain an organic acid sufficient to reduce the oxide film of all the solder particles 11. On the other hand, when an excessive amount of solder particles 11 more than used for bump formation is added, the content of organic acid is reduced to lower the activating force of the liquid material 12 so that the particle size distribution of the solder powder is reduced. However, it is also possible to form an optimum bump with only the relatively large solder particles 11 without dissolving the solder particles 11 on the fine side. At this time, the fine solder particles 11 remaining without melting also have an effect of reducing the short-circuit of the node electrode 22 by preventing coalescence of the solder particles 11.
- solder particles 11 need to be uniformly dispersed in the liquid material 12, it is desirable that the solder composition 10 be stirred immediately before use.
- the material of the solder particles 11 is tin-lead solder or lead-free solder.
- the diameter b of the solder particles 11 may be smaller than the shortest distance a between the peripheral ends of the adjacent pad electrodes 22.
- the solder composition 10 is dropped on the substrate 20 having the node / node electrode 22 by natural fall at room temperature. With this alone, the solder composition 10 having a uniform thickness can be applied onto the substrate 20. That is, a coating film of the solder composition 10 having a uniform film thickness can be formed on the substrate 20 without using a screen printing dispenser. Since the uniformity of the coating affects the variation of the solder bump, the coating should be as uniform as possible. Thereafter, the entire substrate 20 is uniformly heated, so that solder bumps can be formed. Heating increases the temperature above the solder melting point in a short time. By raising the temperature in a short time, a decrease in the activity of the organic acid during the process can be suppressed.
- Substrate 20 is a silicon wafer.
- a pad electrode 22 is formed on the surface 21 of the substrate 20, a pad electrode 22 is formed.
- a solder bump is formed by the forming method of the present embodiment.
- the board 20 is electrically and mechanically connected to other semiconductor chips and wiring boards via solder bumps.
- the pad electrode 22 has, for example, a circular shape and a diameter c of, for example, 40 / zm. Adjacent pack The distance d between the centers of the gate electrodes 22 is, for example, 80 / zm.
- the diameter b of the solder particles 14 is, for example, 3 to 15 ⁇ .
- the pad electrode 22 also acts as an aluminum electrode 24 formed on the substrate 20, a nickel layer 25 formed on the aluminum electrode 24, and a gold layer 26 formed on the nickel layer 25.
- the underlayer 25 and the gold layer 26 are UBM (under barrier metal or under bump metallurgy) layers.
- the portion other than the pad electrode 22 on the substrate 20 is covered with a protective film 27.
- an aluminum electrode 24 is formed on the substrate 20, and a protective film 27 is formed on a portion other than the aluminum electrode 24 with a polyimide resin or a silicon nitride film. These are formed by using, for example, a photolithography technique and an etching technique. Subsequently, after performing a zincate treatment on the surface of the aluminum electrode 24, a nickel layer 25 and a gold layer 26 are formed on the aluminum electrode 24 using an electroless plating method. The reason for providing this UBM layer is to impart solder wettability to the aluminum electrode 24.
- Examples of the material of the solder particles 11 include Sn-Pb (melting point 183 ° C), Sn-Ag-Cu (melting point 218 ° C), Sn-Ag (melting point 221 ° C), and Sn-Cu (melting point 221 ° C). 227 ° C).
- the heating means 40 includes, for example, a blower and an electric heater, and heats the solder composition 10 from the substrate 20 side (lower side) by applying hot air 41.
- FIG. 12 and FIG. 13 are cross-sectional views showing a first embodiment of the solder bump forming method according to the present invention.
- FIG. 12 shows a dropping step as an example of a coating step, and the steps proceed in the order of FIG. 12 [1] to FIG. 12 [3].
- FIG. 13 shows a reflow process, which proceeds in the order of FIG. 13 [1] to FIG. 13 [3].
- description will be made based on these drawings. However, the same parts as those in FIG.
- FIG. 12 does not show the pad electrode 22 on the substrate 20.
- the substrate 20 is put in the receiving container 30.
- the solder composition 10 is agitated in the pour container 31 as necessary, the solder composition 10 is dropped onto the substrate 20 from the pouring port 32.
- the solder composition 10 spreads by its own weight and has a uniform thickness.
- the loosening force at room temperature can also utilize the natural fall of the solder composition 10.
- the solder composition 10 may be applied onto the substrate 20.
- the receiving container 30 Since the receiving container 30 is heated together with the substrate 20 in the reflow step, the receiving container 30 is made of a metal such as aluminum, which has heat resistance, good heat conduction, and does not cause solder wetting by the solder particles 11. Further, the receiving container 30 has a flat bottom surface 33 on which the flat substrate 20 is placed, and a peripheral wall 34 for preventing the solder composition 10 from overflowing. In this case, since the substrate 20 is in close contact with the bottom surface 33 of the receiving container 30, heat conduction is improved. 1 and 3, the illustration of the receiving container 30 is omitted.
- the solder composition 10 on the substrate 20 may have a uniform thickness by rotating the substrate 10 horizontally during or after the dropping process. To rotate board 10 horizontally
- a spin coater commercially available may be used.
- FIG. 12 [2] shows a case where the substrate 20 is not immersed in the solder composition 10.
- the thickness tl of the solder composition 10 on the substrate 20 is a value mainly determined by the surface tension and the viscosity of the solder composition 10.
- FIG. 12 [3] shows a case where the substrate 20 is immersed in the solder composition 10.
- the thickness t2 of the solder composition 10 on the substrate 20 can be set to a desired value according to the amount of the solder composition 10 to be dropped.
- the solder composition 10 is placed by solid coating on the substrate 20 on which the plurality of pad electrodes 22 are separately provided. At this time, the solder composition 10 is entirely placed on the surface including the plurality of bump electrodes 22 and the gap between them on the protective film 27.
- the solder composition 10 is just like an ink.
- the solder composition 10 is heated to the melting point of the solder particles 11 or higher.
- the temperature of the solder composition 10 becomes lower toward the surface and becomes higher toward the substrate 20 side.
- the solder particles 11 below the nod electrode 22 begin to melt first, and if melted, spread on the pad electrode 22.
- the upper solder particles 11 far from the pad electrode 22 are not yet sufficiently melted. Therefore, the chance of the solder particles 11 coalescing can be reduced, so that the occurrence of solder bridges is also suppressed.
- the node / node electrode 22 is heated to the melting point of the solder particles 11 or higher, and the solder particles 11 in contact with the pad electrode 22 are melted and spread on the nod electrode 22.
- a solder film 23 ' is formed, and the solder particles 11 are further united with the solder film 23'.
- the following state is caused by the action of the organic acid contained in the liquid material 12.
- coalescence of the solder particles 11 is suppressed.
- some of the solder particles 11 coalesce and become large. That is, there is no problem if the solder particles 11 coalesce with each other as long as they are equal to or smaller than a certain size.
- the solder particles 11 spread on the pad electrode 20 to form an alloy layer at the interface.
- a solder film 23 ' is formed on the pad electrode 20, and the solder particles 11 are further united with the solder film 23'. That is, the solder film 23 'grows to become the solder bump 23 as shown in FIG. 12 [3].
- solder particles 11 not used for forming the solder bumps 23 are washed off together with the remaining liquid material 12 in a later step.
- the solder composition 10 may be settled first from the solder particles 11 near the substrate 20 side by providing a temperature difference such that the surface side is low and the substrate 20 side is high. If a temperature difference is provided such that the surface side of the solder composition 10 is low and the substrate 20 side of the solder composition 10 is high, the viscosity of the liquid material 12 decreases as the temperature increases, so that the solder particles 11 below the pad electrode 22 First settles and begins to melt, and when it comes into contact with the pad electrode 22, it spreads out. At that time, the upper solder particles 11 far from the nod electrode 22 have not yet settled and melted sufficiently.
- such a heating state may be such that, for example, the solder composition 10 on the substrate 20 is heated from the substrate 20 side, the surface-side force of the solder composition 10 is also controlled, and the temperature dependency of the viscosity of the liquid material 12 is increased. This is achieved by adjusting the relationship between the melting point of the solder particles 11 and the like.
- the solder particles 11 may be supplied to the pad electrode 22 using the convection of the liquid material 12. When the solder composition 10 is heated from the substrate 20 side, convection is generated in the liquid material 12, whereby the solder particles 11 move in the liquid material 12. For this reason, the solder particles 11 that have not been placed on the pad electrode 22 and move are also moved onto the pad electrode 22 and become a part of the solder bump 23. Therefore, the solder particles 11 are effectively used.
- FIG. 14 is a schematic sectional view showing a solder bump forming apparatus according to an embodiment of the present invention.
- receiving container 30 is abbreviated as “container 30”.
- the solder bump forming apparatus 50A of the present embodiment is for heating and reflowing the solder composition 10 on the substrate 20 to form solder bumps, and heating the solder composition 10 from the substrate 20 side.
- Means 40 and temperature control means 60 for adjusting the temperature of the solder composition 10.
- the heating means 40 also has a main heating source 42, a sub-heating source 43, a blower 44, a heat storage member 45, a hot air circulation datum 46, and an opening 47.
- the main heating source 42 and the sub-heating source 43 are, for example, electric heaters.
- the heat storage member 45 has, for example, an aluminum force, and has a large number of through holes 48 through which the hot air 41 passes.
- Hot air 41 is circulated by blower 44. That is, the hot air 41 is supplied from the main heating source 42 ⁇ heat storage member 45 ⁇ opening 47 (heating the vessel 30) ⁇ circulation duct 46 ⁇ sub-heating source 43 ⁇ hot air circulation duct 46 ⁇ blower 44 ⁇ circulation path of the main heating source 42 Circulate. Since the heating means 40 heats the container 30 by applying the hot air 41 thereto, the entire substrate 20 can be more uniformly heated as compared with a means utilizing heat conduction.
- the temperature control means 60 includes a main temperature control source 62, a sub-temperature control source 63, a blower 64, a cold storage (or heat storage) member 65, a circulation duct 66, an opening 67, a heat absorption plate (or radiation plate) 68, and the like. Power.
- the temperature control means 60 uses cold air as the temperature control medium 61.
- the main temperature control source 62 and the sub-temperature control source 63 are, for example, cooling water coolers.
- the cold storage member 65 is made of, for example, aluminum material, and has a large number of through holes 69 through which the cool air 61 passes.
- the heat absorbing plate 68 is made of, for example, an aluminum material, and it is desirable that the solder composition 10 side is in a state close to a black body.
- the cool air 61 is circulated by the blower 64. That is, the cool air 61 is supplied from the main temperature control source 62 ⁇ the cold storage (or heat storage) member 65 ⁇ the opening 67 (cooling the heat absorbing plate 68) ⁇ the circulation duct 66 ⁇ the sub temperature control source 63 ⁇ the cool air circulation.
- Circular duct 66 ⁇ Blower 64 Circulation route of main temperature control source 62.
- the heat absorbing plate 68 has a function of absorbing the heat of the solder composition 10, and the configuration of the temperature control means 60 other than the heat absorbing plate 68 absorbs the heat of the heat absorbing plate 68, thereby It constitutes a heat absorbing section for continuously performing the heat absorbing function of the absorbing plate 68.
- the main temperature control source 62 and the sub temperature control source 63 function as a function of cooling the temperature control medium 61.
- the temperature control means 60 has been described as having a configuration in which the surface of the solder composition and the substrate have a temperature difference by removing the heat of the solder composition 10, but is not limited thereto. is not. That is, the temperature control means 60 may be configured to heat the solder composition 10 by radiant heat.
- the heat absorbing plate 68 functions as a radiating plate that heats the solder composition 10 by radiant heat, and the configuration other than the radiating plate 68 heats the radiating plate 68 to provide the heating function of the radiating plate 68. It constitutes a heating section that can be used continuously.
- the heating temperature may be equal to or higher than the heating temperature of the heating means 40. Since any of the temperature control means 60 is a method in which the temperature control medium 61 of cold air or hot air is not directly contacted with the solder composition 10, there is no adverse effect on the solder composition 10 deposited in layers.
- solder bump forming apparatus 50A Next, the operation of the solder bump forming apparatus 50A will be described.
- the solder composition 10 is heated from the substrate 20 side by the heating means 40, and the temperature of the surface of the solder composition 10 is also adjusted by the temperature adjusting means 60. Then, the temperature distribution of the solder composition 10 is higher on the substrate 20 side and lower on the surface side. At this time, as described above, since the chances of the solder particles coalescing can be reduced, the occurrence of solder bridges is also suppressed. Therefore, high-density and fine solder bumps can be easily formed.
- FIG. 15 is a schematic sectional view showing a second embodiment of the solder bump forming apparatus according to the present invention.
- description will be made based on this drawing. However, the same parts as those in FIG.
- a heating means 71 using heat conduction is used instead of the heating means 40 using hot air 41 in FIG.
- the heating means 71 is, for example, an electric heater such as a panel heater, and has a simple configuration in which the container 30 is directly mounted and the container 30 is heated by heat conduction.
- the bump forming apparatus 70 the first embodiment The configuration can be simplified as compared with the state.
- the present invention is not limited to the above embodiment.
- a wiring board (BGA) may be used instead of a silicon wafer (FC).
- the electrode material is not limited to aluminum, and may be Al-Si, Al-Si-Cu, Al-Cu, Cu, or the like.
- Example 1 which is a more specific example of this embodiment will be described.
- the solder particles have a composition of 96.5wt% Sn-3.Owt% Ag—0.5wt% Cu (melting point: 218 ° C) and an average diameter of 6 m (particle size distribution 2 to: L 1 m) was used.
- One type of fatty acid ester trimethyl propane trioleate
- the main properties of this fatty acid ester are a kinematic viscosity at 40 ° C of 48.3 mmVs, a kinematic viscosity at 100 ° C of 9.2 mmVs, and an acid value of 2.4.
- the free fatty acid originally contained in the fatty acid ester was used without adding the organic acid.
- vacuum defoaming was performed at a vapor pressure lower than the water pressure of the water to minimize the effect of moisture.
- a silicon chip having a 10 mm opening was used as a substrate for forming a solder bump.
- Pad electrodes of 80 m pitch were formed in a two-dimensional array on the silicon chip.
- the shape of the pad electrode was 40 m.
- the material of the surface of the pad electrode was a gold plating with a thickness of a few microns on the electroless nickel plating.
- the material of the protective film was silicon nitride.
- FIG. 1 is a schematic sectional view showing a first embodiment of a heating device according to the present invention.
- FIG. 2 is a cross-sectional view showing one example of a method for forming solder bumps using the heating device of FIG. 1.
- FIG. 3 is a cross-sectional view (dropping step) showing an example of a method of forming a solder bump using the heating device of FIG. 1, and the steps proceed in the order of FIG. 3 [1] to FIG. 3 [3].
- FIG. 4 is a cross-sectional view (reflow process) showing an example of a solder bump forming method using the heating device of FIG. 1, and the process proceeds in the order of FIGS. 4 [1] to 4 [3].
- FIG. 5 shows a second embodiment of the heating device according to the present invention, wherein FIG. 5 [1] is a partial plan view, and FIG. 5 [2] is a sectional view taken along line VV in FIG. 5 [1].
- FIG. 6 is a plan view showing the first embodiment (during heating) of the reflow device according to the present invention.
- FIG. 7 is a plan view showing the first embodiment (during transportation) of the reflow device according to the present invention. ⁇ 1—
- FIG. 8 is a schematic sectional view showing the entire transfer mechanism in the reflow device in FIG.
- FIG. 9 is a perspective view showing a container holding portion of the transport mechanism in the reflow device in FIG.
- FIG. 10 is a block diagram showing a control system in the reflow device in FIG. 5.
- FIG. 11 is a cross-sectional view showing a first embodiment of a solder bump forming method according to the present invention.
- FIG. 12 is a cross-sectional view (dropping process) showing the first embodiment of the solder bump forming method according to the present invention, and the process proceeds in the order of FIG. 12 [1] to FIG. 12 [3].
- FIG. 13 is a cross-sectional view (reflow process) showing the first embodiment of the solder bump forming method according to the present invention, and the process proceeds in the order of FIG. 13 [1] to FIG. 13 [3].
- FIG. 14 is a schematic sectional view showing a first embodiment of a solder bump forming apparatus according to the present invention.
- FIG. 15 is a schematic sectional view showing a second embodiment of the solder bump forming apparatus according to the present invention.
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Description
Claims
Priority Applications (3)
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JP2006511680A JP4759509B2 (ja) | 2004-03-30 | 2005-03-29 | はんだバンプ形成方法及び装置 |
US10/598,142 US8042727B2 (en) | 2004-03-30 | 2005-03-29 | Heater, reflow apparatus, and solder bump forming method and apparatus |
EP05727854A EP1732118B1 (en) | 2004-03-30 | 2005-03-29 | Heater, reflow apparatus with such heater |
Applications Claiming Priority (4)
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JP2004-099888 | 2004-03-30 | ||
JP2004099888 | 2004-03-30 | ||
JP2004-102407 | 2004-03-31 | ||
JP2004102407 | 2004-03-31 |
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PCT/JP2005/005909 WO2005096367A1 (ja) | 2004-03-30 | 2005-03-29 | 加熱装置及びリフロー装置,はんだバンプ形成方法及び装置 |
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US (1) | US8042727B2 (ja) |
EP (1) | EP1732118B1 (ja) |
JP (1) | JP4759509B2 (ja) |
KR (1) | KR100772306B1 (ja) |
TW (1) | TWI258197B (ja) |
WO (1) | WO2005096367A1 (ja) |
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- 2005-03-29 WO PCT/JP2005/005909 patent/WO2005096367A1/ja not_active Application Discontinuation
- 2005-03-29 JP JP2006511680A patent/JP4759509B2/ja not_active Expired - Fee Related
- 2005-03-29 KR KR1020067019271A patent/KR100772306B1/ko not_active IP Right Cessation
- 2005-03-29 EP EP05727854A patent/EP1732118B1/en not_active Expired - Fee Related
- 2005-03-29 US US10/598,142 patent/US8042727B2/en not_active Expired - Fee Related
- 2005-03-30 TW TW094109921A patent/TWI258197B/zh not_active IP Right Cessation
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007055149A1 (ja) * | 2005-11-09 | 2007-05-18 | Tamura Corporation | リフロー装置用ワーク保持容器およびワーク取り出し方法 |
JPWO2007055149A1 (ja) * | 2005-11-09 | 2009-04-30 | 株式会社タムラ製作所 | リフロー装置用ワーク保持容器およびワーク取り出し方法 |
JP2007208108A (ja) * | 2006-02-03 | 2007-08-16 | Tamura Seisakusho Co Ltd | 材料供給装置及び方法 |
JP2008300808A (ja) * | 2007-06-04 | 2008-12-11 | Tamura Seisakusho Co Ltd | はんだバンプ形成装置およびはんだバンプの形成方法 |
JP2009123846A (ja) * | 2007-11-13 | 2009-06-04 | Tamura Seisakusho Co Ltd | はんだバンプ形成装置 |
JP2009200188A (ja) * | 2008-02-21 | 2009-09-03 | Fuji Mach Mfg Co Ltd | リフロー加熱方法及びリフロー加熱装置 |
JP2010075934A (ja) * | 2008-09-24 | 2010-04-08 | Tamura Seisakusho Co Ltd | はんだ組成物 |
Also Published As
Publication number | Publication date |
---|---|
US8042727B2 (en) | 2011-10-25 |
JPWO2005096367A1 (ja) | 2008-02-21 |
TWI258197B (en) | 2006-07-11 |
KR20070006785A (ko) | 2007-01-11 |
US20070158387A1 (en) | 2007-07-12 |
EP1732118A4 (en) | 2009-04-15 |
WO2005096367A8 (ja) | 2005-11-17 |
TW200605245A (en) | 2006-02-01 |
KR100772306B1 (ko) | 2007-11-02 |
EP1732118B1 (en) | 2011-05-11 |
EP1732118A1 (en) | 2006-12-13 |
JP4759509B2 (ja) | 2011-08-31 |
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